KR900007617Y1 - 납땜 장치 - Google Patents

납땜 장치 Download PDF

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Publication number
KR900007617Y1
KR900007617Y1 KR2019900006849U KR900006849U KR900007617Y1 KR 900007617 Y1 KR900007617 Y1 KR 900007617Y1 KR 2019900006849 U KR2019900006849 U KR 2019900006849U KR 900006849 U KR900006849 U KR 900006849U KR 900007617 Y1 KR900007617 Y1 KR 900007617Y1
Authority
KR
South Korea
Prior art keywords
heat transfer
transfer liquid
printed board
soldering apparatus
heating tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR2019900006849U
Other languages
English (en)
Korean (ko)
Inventor
겐시 곤도오
Original Assignee
니혼 덴네쯔 게이기 가부시끼가이샤
겐시 곤도오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 니혼 덴네쯔 게이기 가부시끼가이샤, 겐시 곤도오 filed Critical 니혼 덴네쯔 게이기 가부시끼가이샤
Priority to KR2019900006849U priority Critical patent/KR900007617Y1/ko
Priority to KR2019900007521U priority patent/KR920005953Y1/ko
Application granted granted Critical
Publication of KR900007617Y1 publication Critical patent/KR900007617Y1/ko
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B23K1/015—Vapour-condensation soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR2019900006849U 1985-09-17 1990-05-21 납땜 장치 Expired KR900007617Y1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR2019900006849U KR900007617Y1 (ko) 1985-09-17 1990-05-21 납땜 장치
KR2019900007521U KR920005953Y1 (ko) 1985-09-17 1990-05-30 납땜장치

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP60203343A JPS6264473A (ja) 1985-09-17 1985-09-17 物品の融着接合装置
JP85-203343 1985-09-17
KR1019860004049 1986-05-23
KR2019900006849U KR900007617Y1 (ko) 1985-09-17 1990-05-21 납땜 장치

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1019860004049 Division 1985-09-17 1986-05-23

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR2019900007521U Division KR920005953Y1 (ko) 1985-09-17 1990-05-30 납땜장치

Publications (1)

Publication Number Publication Date
KR900007617Y1 true KR900007617Y1 (ko) 1990-08-23

Family

ID=16472450

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019900006849U Expired KR900007617Y1 (ko) 1985-09-17 1990-05-21 납땜 장치

Country Status (2)

Country Link
JP (1) JPS6264473A (https=)
KR (1) KR900007617Y1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12420348B2 (en) * 2023-07-24 2025-09-23 Samsung Electronics Co., Ltd. Solder reflow apparatus and method of manufacturing electronic device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2600886B2 (ja) * 1989-02-22 1997-04-16 日本電気株式会社 バッチ式ベーパーフェーズソルダリング装置
JP5769653B2 (ja) * 2012-03-12 2015-08-26 三菱電機株式会社 熱処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12420348B2 (en) * 2023-07-24 2025-09-23 Samsung Electronics Co., Ltd. Solder reflow apparatus and method of manufacturing electronic device

Also Published As

Publication number Publication date
JPS6264473A (ja) 1987-03-23
JPH0416262B2 (https=) 1992-03-23

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Legal Events

Date Code Title Description
UA0105 Converted application for utility model registration

Patent event date: 19900521

Patent event code: UA01011R05D

Comment text: Application for Conversion into Application for Utility Model Registration

A201 Request for examination
UA0201 Request for examination

Patent event date: 19900530

Patent event code: UA02012R01D

Comment text: Request for Examination of Application

Patent event date: 19900521

Patent event code: UA02011R05I

Comment text: Application for Conversion into Application for Utility Model Registration

UG1604 Publication of application

Patent event code: UG16041S01I

Comment text: Decision on Publication of Application

Patent event date: 19900724

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Patent event date: 19901105

Comment text: Decision to Grant Registration

Patent event code: UE07011S01D

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