KR890013729A - 반응성 이온 에칭장치 - Google Patents
반응성 이온 에칭장치 Download PDFInfo
- Publication number
- KR890013729A KR890013729A KR1019890001465A KR890001465A KR890013729A KR 890013729 A KR890013729 A KR 890013729A KR 1019890001465 A KR1019890001465 A KR 1019890001465A KR 890001465 A KR890001465 A KR 890001465A KR 890013729 A KR890013729 A KR 890013729A
- Authority
- KR
- South Korea
- Prior art keywords
- reactive ion
- ion etching
- etching equipment
- etching apparatus
- cathode
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
- H01J2237/3341—Reactive etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Drying Of Semiconductors (AREA)
- ing And Chemical Polishing (AREA)
Abstract
내용 없음.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도, 제2도 및 제3도는 각각 본 발명의 반응성 이온 에칭 장치의 음극의 일예를 도시하는 사시도, 단면도 및 평면도.
Claims (1)
- 피 에칭제의 표면에 대해서 평행한 자장을 형성하는 수단을 갖는 반응성 이온 에칭 장치에 있어서, 음극과, 상기 음극에 배설되어, 상기 피 에칭재를 지지하는 지지수단과, 상기 음극을 0℃ 이하로 냉각하는 수단과를 구비한 것을 특징으로 하는 반응성 이온 에칭장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2765788 | 1988-02-10 | ||
JP63-27657 | 1988-02-10 | ||
JP63-292518 | 1988-11-21 | ||
JP63292518A JPH01302726A (ja) | 1988-02-10 | 1988-11-21 | 反応性イオンエッチング装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR890013729A true KR890013729A (ko) | 1989-09-25 |
Family
ID=26365613
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890001465A KR890013729A (ko) | 1988-02-10 | 1989-02-09 | 반응성 이온 에칭장치 |
Country Status (4)
Country | Link |
---|---|
US (1) | US4886565A (ko) |
EP (1) | EP0328078A3 (ko) |
JP (1) | JPH01302726A (ko) |
KR (1) | KR890013729A (ko) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5223113A (en) * | 1990-07-20 | 1993-06-29 | Tokyo Electron Limited | Apparatus for forming reduced pressure and for processing object |
EP0491503A3 (en) * | 1990-12-19 | 1992-07-22 | AT&T Corp. | Method for depositing metal |
FR2677043B1 (fr) * | 1991-05-29 | 1993-12-24 | Solems | Procede, dispositif et appareil pour traiter un substrat par un plasma basse pression. |
US5221425A (en) * | 1991-08-21 | 1993-06-22 | International Business Machines Corporation | Method for reducing foreign matter on a wafer etched in a reactive ion etching process |
EP0533254A3 (en) * | 1991-09-19 | 1993-06-23 | N.V. Philips' Gloeilampenfabrieken | Method of manufacturing a semiconductor device whereby a layer comprising aluminium is deposited on a surface for a semiconductor body |
US5539609A (en) * | 1992-12-02 | 1996-07-23 | Applied Materials, Inc. | Electrostatic chuck usable in high density plasma |
US5346601A (en) * | 1993-05-11 | 1994-09-13 | Andrew Barada | Sputter coating collimator with integral reactive gas distribution |
US5433786A (en) * | 1993-08-27 | 1995-07-18 | The Dow Chemical Company | Apparatus for plasma enhanced chemical vapor deposition comprising shower head electrode with magnet disposed therein |
US5605603A (en) * | 1995-03-29 | 1997-02-25 | International Business Machines Corporation | Deep trench process |
US5993598A (en) * | 1996-07-30 | 1999-11-30 | The Dow Chemical Company | Magnetron |
US5900284A (en) * | 1996-07-30 | 1999-05-04 | The Dow Chemical Company | Plasma generating device and method |
US6303045B1 (en) * | 1997-03-20 | 2001-10-16 | Lam Research Corporation | Methods and apparatus for etching a nitride layer in a variable-gap plasma processing chamber |
US6110395A (en) * | 1997-08-26 | 2000-08-29 | Trikon Technologies, Inc. | Method and structure for controlling plasma uniformity |
US6055929A (en) * | 1997-09-24 | 2000-05-02 | The Dow Chemical Company | Magnetron |
US6540928B1 (en) | 1999-09-10 | 2003-04-01 | Unaxis Usa Inc. | Magnetic pole fabrication process and device |
US6547975B1 (en) | 1999-10-29 | 2003-04-15 | Unaxis Usa Inc. | Magnetic pole fabrication process and device |
US7013834B2 (en) * | 2002-04-19 | 2006-03-21 | Nordson Corporation | Plasma treatment system |
US20040069227A1 (en) * | 2002-10-09 | 2004-04-15 | Applied Materials, Inc. | Processing chamber configured for uniform gas flow |
US20040110388A1 (en) * | 2002-12-06 | 2004-06-10 | International Business Machines Corporation | Apparatus and method for shielding a wafer from charged particles during plasma etching |
US20070204957A1 (en) * | 2006-03-01 | 2007-09-06 | Braymen Steven D | Plasma processing of large workpieces |
US20100209623A1 (en) * | 2009-02-18 | 2010-08-19 | Electronics And Telecommunications Research Institute | Apparatus for growing large area vanadium dioxide thin film and method of growing large area oxide thin film in the apparatus |
KR101275805B1 (ko) * | 2009-02-18 | 2013-06-18 | 한국전자통신연구원 | 대면적 바나듐 산화물 박막 성장장치 및 그 성장장치에서의 대면적 산화물 박막 성장방법 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0054201B1 (en) * | 1980-12-11 | 1986-11-05 | Kabushiki Kaisha Toshiba | Dry etching device and method |
US4422896A (en) * | 1982-01-26 | 1983-12-27 | Materials Research Corporation | Magnetically enhanced plasma process and apparatus |
JPS58170016A (ja) * | 1982-03-31 | 1983-10-06 | Tokuda Seisakusho Ltd | プラズマエツチング装置 |
JPS5940375A (ja) * | 1982-08-31 | 1984-03-06 | Toshiba Corp | デイスクレコ−ド再生装置 |
US4581118A (en) * | 1983-01-26 | 1986-04-08 | Materials Research Corporation | Shaped field magnetron electrode |
JPS6060060A (ja) * | 1983-09-12 | 1985-04-06 | 株式会社日立製作所 | 鉄道車両の扉開閉装置 |
GB8427149D0 (en) * | 1984-10-26 | 1984-12-05 | Ucb Sa | Resist materials |
US4572759A (en) * | 1984-12-26 | 1986-02-25 | Benzing Technology, Inc. | Troide plasma reactor with magnetic enhancement |
JPS6372877A (ja) * | 1986-09-12 | 1988-04-02 | Tokuda Seisakusho Ltd | 真空処理装置 |
-
1988
- 1988-11-21 JP JP63292518A patent/JPH01302726A/ja active Pending
-
1989
- 1989-02-07 US US07/307,280 patent/US4886565A/en not_active Expired - Fee Related
- 1989-02-08 EP EP89102166A patent/EP0328078A3/en not_active Withdrawn
- 1989-02-09 KR KR1019890001465A patent/KR890013729A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP0328078A2 (en) | 1989-08-16 |
JPH01302726A (ja) | 1989-12-06 |
EP0328078A3 (en) | 1990-08-22 |
US4886565A (en) | 1989-12-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |