KR890009599A - 낮은 유전 상수의 플루오로중합체 및 폴리아라미드의 적층물 - Google Patents
낮은 유전 상수의 플루오로중합체 및 폴리아라미드의 적층물 Download PDFInfo
- Publication number
- KR890009599A KR890009599A KR1019880016905A KR880016905A KR890009599A KR 890009599 A KR890009599 A KR 890009599A KR 1019880016905 A KR1019880016905 A KR 1019880016905A KR 880016905 A KR880016905 A KR 880016905A KR 890009599 A KR890009599 A KR 890009599A
- Authority
- KR
- South Korea
- Prior art keywords
- polyaramid
- fluoropolymer
- laminate
- layer
- tetrafluoroethylene
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2327/00—Polyvinylhalogenides
- B32B2327/12—Polyvinylhalogenides containing fluorine
- B32B2327/18—PTFE, i.e. polytetrafluoroethylene
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0278—Polymeric fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (9)
- 하기 (1)-(3)을 차례로 포함하는 적층물 : 1) 구리층, 2) 폴리테트라플루오로에틸렌, 테트라플루오로에틸렌 및 헥사플루오로프로필렌의 공중합체, 테트라플루오로에틸렌 및 퍼플루오로(프로필 비닐 에테르)의 공중합체, 테트라플루오로에틸렌, 헥사플루오로프로필렌 및 퍼플루오로(프로필 비닐 에테르)의 삼원공중합체. 테트라플루오로에틸렌, 헥사플루오로프로필렌 및 퍼플루오로(프로필 비닐 에테르)의 삼원공중합체로 이루어진 군으로 부터 선택된 것으로 폴리아라미드+플루오로중합체를 기중으로 폴리아라미등의 부피 %가 약 40%이하가 되도록 폴리아라미드 섬유의 직물 또는 부직물로 강화된 플루오로중합체의 층, 3) 두번째 구리층.
- 제1항에 있어서, 플루오로중합체가 폴리테트라 플루오로에틸렌이며 폴리아라미드의 부피비가 5-25%인 적층물.
- 제1항에 있어서, 플루오로중합체가 테트라플루오로에틸렌 및 퍼플루오로(프로필비닐 에테르)의 공중합체이고 폴리아라미드의 부피 %가 5-25%인 적층물.
- 제1항에 있어서, 플루오로중합체가 테트라플루오로에틸렌 및 헥사플루오로프로필렌의 공중합체이고 폴리아라미드의 부피 % 가 5-25%인 적층물.
- 제1항에 있어서, 산화 구리층이 각각의 구리층(1) 및 (3)과 폴리아라미드-강화 플루오로중합체층(2)사이에 존재하는 적층물.
- 제1항에 있어서, 아연이나 황동층이 각각의 구리층(1) 및 (3)과 폴리아라미드-강화 플루오로중합체층(2) 사이에 존재하는 적층물.
- 제1항에 있어서, 폴리아라미드가 폴리(P-페닐렌 테레프탈아미드)인 적층물.
- 제1항에 있어서, 폴리아라미드-강화 플루오로중합체층(2)이 플루오로중합체 수지로 함침된 폴리아라미드 직물을 포함하는 적층물.
- 제1항에 있어서, 폴리아라미드-강화 플루오로중합체층(2)이 적어도 하나의 플루오로중합체 필름의 쉬이트와 플루오로중합체 수지로 함침된 폴리아라미드 직물을 포함하는 적층물.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13471287A | 1987-12-18 | 1987-12-18 | |
US134,712 | 1987-12-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR890009599A true KR890009599A (ko) | 1989-08-02 |
Family
ID=22464624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880016905A KR890009599A (ko) | 1987-12-18 | 1988-12-18 | 낮은 유전 상수의 플루오로중합체 및 폴리아라미드의 적층물 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0320901A3 (ko) |
KR (1) | KR890009599A (ko) |
AU (1) | AU605660B2 (ko) |
CA (1) | CA1298770C (ko) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5427831B1 (en) * | 1993-11-12 | 1998-01-06 | Du Pont | Fluoropolymer laminates |
US5703185A (en) * | 1995-08-17 | 1997-12-30 | E. I. Du Pont De Nemours And Company | Fluoropolymer extrusion process |
TW515812B (en) * | 1997-04-08 | 2003-01-01 | Sumitomo Chemical Co | Composite film made from low dielectric constant resin and para-oriented aromatic polyamide |
US6727197B1 (en) | 1999-11-18 | 2004-04-27 | Foster-Miller, Inc. | Wearable transmission device |
JP2002160316A (ja) * | 2000-11-27 | 2002-06-04 | Daikin Ind Ltd | 電気絶縁板、プリプレグ積層体及びこれらの製造方法 |
US20030082974A1 (en) * | 2001-08-30 | 2003-05-01 | Samuels Michael R. | Solid sheet material especially useful for circuit boards |
WO2010049743A1 (en) * | 2008-04-07 | 2010-05-06 | Guiseppe Giovanni Bogani | Multilayer material |
US9211085B2 (en) | 2010-05-03 | 2015-12-15 | Foster-Miller, Inc. | Respiration sensing system |
US9028404B2 (en) | 2010-07-28 | 2015-05-12 | Foster-Miller, Inc. | Physiological status monitoring system |
US8585606B2 (en) | 2010-09-23 | 2013-11-19 | QinetiQ North America, Inc. | Physiological status monitoring system |
CN111171736B (zh) * | 2020-01-14 | 2022-06-03 | 广东生益科技股份有限公司 | 一种漆布及其制备方法、包含其的覆铜板和应用 |
JP2024527883A (ja) * | 2021-07-30 | 2024-07-26 | ザ ケマーズ カンパニー エフシー リミテッド ライアビリティ カンパニー | 可撓性積層材料 |
WO2024010787A1 (en) * | 2022-07-06 | 2024-01-11 | The Chemours Company Fc, Llc | Flexible laminate material |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE495038A (ko) * | 1949-04-09 | 1900-01-01 | ||
NL267988A (ko) * | 1960-08-15 | 1900-01-01 | ||
US4513055A (en) * | 1981-11-30 | 1985-04-23 | Trw Inc. | Controlled thermal expansion composite and printed circuit board embodying same |
US4591659A (en) * | 1983-12-22 | 1986-05-27 | Trw Inc. | Multilayer printed circuit board structure |
US4729921A (en) * | 1984-10-19 | 1988-03-08 | E. I. Du Pont De Nemours And Company | High density para-aramid papers |
US4590539A (en) * | 1985-05-15 | 1986-05-20 | Westinghouse Electric Corp. | Polyaramid laminate |
-
1988
- 1988-12-13 CA CA000585769A patent/CA1298770C/en not_active Expired - Lifetime
- 1988-12-14 EP EP88120891A patent/EP0320901A3/en not_active Withdrawn
- 1988-12-16 AU AU27030/88A patent/AU605660B2/en not_active Ceased
- 1988-12-18 KR KR1019880016905A patent/KR890009599A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP0320901A2 (en) | 1989-06-21 |
EP0320901A3 (en) | 1990-07-11 |
CA1298770C (en) | 1992-04-14 |
AU605660B2 (en) | 1991-01-17 |
AU2703088A (en) | 1989-06-22 |
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