KR890009599A - 낮은 유전 상수의 플루오로중합체 및 폴리아라미드의 적층물 - Google Patents

낮은 유전 상수의 플루오로중합체 및 폴리아라미드의 적층물 Download PDF

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Publication number
KR890009599A
KR890009599A KR1019880016905A KR880016905A KR890009599A KR 890009599 A KR890009599 A KR 890009599A KR 1019880016905 A KR1019880016905 A KR 1019880016905A KR 880016905 A KR880016905 A KR 880016905A KR 890009599 A KR890009599 A KR 890009599A
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KR
South Korea
Prior art keywords
polyaramid
fluoropolymer
laminate
layer
tetrafluoroethylene
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Application number
KR1019880016905A
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English (en)
Inventor
스트이븐 머큐언 크레이그
Original Assignee
제임즈 제이 플린
이 아이 듀우판 디 네모아 앤드 캄파니
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Application filed by 제임즈 제이 플린, 이 아이 듀우판 디 네모아 앤드 캄파니 filed Critical 제임즈 제이 플린
Publication of KR890009599A publication Critical patent/KR890009599A/ko

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/322Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00Metals, their alloys or their compounds
    • B32B2311/12Copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2327/00Polyvinylhalogenides
    • B32B2327/12Polyvinylhalogenides containing fluorine
    • B32B2327/18PTFE, i.e. polytetrafluoroethylene
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/015Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275Fibers and reinforcement materials
    • H05K2201/0278Polymeric fibers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275Fibers and reinforcement materials
    • H05K2201/029Woven fibrous reinforcement or textile
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275Fibers and reinforcement materials
    • H05K2201/0293Non-woven fibrous reinforcement

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

내용 없음

Description

낮은 유전 상수의 플루오로중합체 및 폴리아라미드의 적층물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (9)

  1. 하기 (1)-(3)을 차례로 포함하는 적층물 : 1) 구리층, 2) 폴리테트라플루오로에틸렌, 테트라플루오로에틸렌 및 헥사플루오로프로필렌의 공중합체, 테트라플루오로에틸렌 및 퍼플루오로(프로필 비닐 에테르)의 공중합체, 테트라플루오로에틸렌, 헥사플루오로프로필렌 및 퍼플루오로(프로필 비닐 에테르)의 삼원공중합체. 테트라플루오로에틸렌, 헥사플루오로프로필렌 및 퍼플루오로(프로필 비닐 에테르)의 삼원공중합체로 이루어진 군으로 부터 선택된 것으로 폴리아라미드+플루오로중합체를 기중으로 폴리아라미등의 부피 %가 약 40%이하가 되도록 폴리아라미드 섬유의 직물 또는 부직물로 강화된 플루오로중합체의 층, 3) 두번째 구리층.
  2. 제1항에 있어서, 플루오로중합체가 폴리테트라 플루오로에틸렌이며 폴리아라미드의 부피비가 5-25%인 적층물.
  3. 제1항에 있어서, 플루오로중합체가 테트라플루오로에틸렌 및 퍼플루오로(프로필비닐 에테르)의 공중합체이고 폴리아라미드의 부피 %가 5-25%인 적층물.
  4. 제1항에 있어서, 플루오로중합체가 테트라플루오로에틸렌 및 헥사플루오로프로필렌의 공중합체이고 폴리아라미드의 부피 % 가 5-25%인 적층물.
  5. 제1항에 있어서, 산화 구리층이 각각의 구리층(1) 및 (3)과 폴리아라미드-강화 플루오로중합체층(2)사이에 존재하는 적층물.
  6. 제1항에 있어서, 아연이나 황동층이 각각의 구리층(1) 및 (3)과 폴리아라미드-강화 플루오로중합체층(2) 사이에 존재하는 적층물.
  7. 제1항에 있어서, 폴리아라미드가 폴리(P-페닐렌 테레프탈아미드)인 적층물.
  8. 제1항에 있어서, 폴리아라미드-강화 플루오로중합체층(2)이 플루오로중합체 수지로 함침된 폴리아라미드 직물을 포함하는 적층물.
  9. 제1항에 있어서, 폴리아라미드-강화 플루오로중합체층(2)이 적어도 하나의 플루오로중합체 필름의 쉬이트와 플루오로중합체 수지로 함침된 폴리아라미드 직물을 포함하는 적층물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880016905A 1987-12-18 1988-12-18 낮은 유전 상수의 플루오로중합체 및 폴리아라미드의 적층물 KR890009599A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13471287A 1987-12-18 1987-12-18
US134,712 1987-12-18

Publications (1)

Publication Number Publication Date
KR890009599A true KR890009599A (ko) 1989-08-02

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ID=22464624

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880016905A KR890009599A (ko) 1987-12-18 1988-12-18 낮은 유전 상수의 플루오로중합체 및 폴리아라미드의 적층물

Country Status (4)

Country Link
EP (1) EP0320901A3 (ko)
KR (1) KR890009599A (ko)
AU (1) AU605660B2 (ko)
CA (1) CA1298770C (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5427831B1 (en) * 1993-11-12 1998-01-06 Du Pont Fluoropolymer laminates
US5703185A (en) * 1995-08-17 1997-12-30 E. I. Du Pont De Nemours And Company Fluoropolymer extrusion process
TW515812B (en) * 1997-04-08 2003-01-01 Sumitomo Chemical Co Composite film made from low dielectric constant resin and para-oriented aromatic polyamide
US6727197B1 (en) 1999-11-18 2004-04-27 Foster-Miller, Inc. Wearable transmission device
JP2002160316A (ja) * 2000-11-27 2002-06-04 Daikin Ind Ltd 電気絶縁板、プリプレグ積層体及びこれらの製造方法
US20030082974A1 (en) * 2001-08-30 2003-05-01 Samuels Michael R. Solid sheet material especially useful for circuit boards
WO2010049743A1 (en) * 2008-04-07 2010-05-06 Guiseppe Giovanni Bogani Multilayer material
US9211085B2 (en) 2010-05-03 2015-12-15 Foster-Miller, Inc. Respiration sensing system
US9028404B2 (en) 2010-07-28 2015-05-12 Foster-Miller, Inc. Physiological status monitoring system
US8585606B2 (en) 2010-09-23 2013-11-19 QinetiQ North America, Inc. Physiological status monitoring system
CN111171736B (zh) * 2020-01-14 2022-06-03 广东生益科技股份有限公司 一种漆布及其制备方法、包含其的覆铜板和应用
JP2024527883A (ja) * 2021-07-30 2024-07-26 ザ ケマーズ カンパニー エフシー リミテッド ライアビリティ カンパニー 可撓性積層材料
WO2024010787A1 (en) * 2022-07-06 2024-01-11 The Chemours Company Fc, Llc Flexible laminate material

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE495038A (ko) * 1949-04-09 1900-01-01
NL267988A (ko) * 1960-08-15 1900-01-01
US4513055A (en) * 1981-11-30 1985-04-23 Trw Inc. Controlled thermal expansion composite and printed circuit board embodying same
US4591659A (en) * 1983-12-22 1986-05-27 Trw Inc. Multilayer printed circuit board structure
US4729921A (en) * 1984-10-19 1988-03-08 E. I. Du Pont De Nemours And Company High density para-aramid papers
US4590539A (en) * 1985-05-15 1986-05-20 Westinghouse Electric Corp. Polyaramid laminate

Also Published As

Publication number Publication date
EP0320901A2 (en) 1989-06-21
EP0320901A3 (en) 1990-07-11
CA1298770C (en) 1992-04-14
AU605660B2 (en) 1991-01-17
AU2703088A (en) 1989-06-22

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