KR890007741U - 리이드 프레임 자동 정렬장치 - Google Patents

리이드 프레임 자동 정렬장치

Info

Publication number
KR890007741U
KR890007741U KR2019870016485U KR870016485U KR890007741U KR 890007741 U KR890007741 U KR 890007741U KR 2019870016485 U KR2019870016485 U KR 2019870016485U KR 870016485 U KR870016485 U KR 870016485U KR 890007741 U KR890007741 U KR 890007741U
Authority
KR
South Korea
Prior art keywords
lead frame
alignment device
automatic alignment
frame automatic
lead
Prior art date
Application number
KR2019870016485U
Other languages
English (en)
Other versions
KR910000257Y1 (ko
Inventor
김정덕
이태영
Original Assignee
삼성항공산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성항공산업 주식회사 filed Critical 삼성항공산업 주식회사
Priority to KR2019870016485U priority Critical patent/KR910000257Y1/ko
Publication of KR890007741U publication Critical patent/KR890007741U/ko
Application granted granted Critical
Publication of KR910000257Y1 publication Critical patent/KR910000257Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR2019870016485U 1987-12-28 1987-12-28 리이드 프레임 자동 정렬장치 KR910000257Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019870016485U KR910000257Y1 (ko) 1987-12-28 1987-12-28 리이드 프레임 자동 정렬장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019870016485U KR910000257Y1 (ko) 1987-12-28 1987-12-28 리이드 프레임 자동 정렬장치

Publications (2)

Publication Number Publication Date
KR890007741U true KR890007741U (ko) 1989-05-17
KR910000257Y1 KR910000257Y1 (ko) 1991-01-18

Family

ID=19268285

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019870016485U KR910000257Y1 (ko) 1987-12-28 1987-12-28 리이드 프레임 자동 정렬장치

Country Status (1)

Country Link
KR (1) KR910000257Y1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100507037B1 (ko) * 2002-10-07 2005-08-09 엘지전자 주식회사 진공청소기용 보조흡입구어셈블리

Also Published As

Publication number Publication date
KR910000257Y1 (ko) 1991-01-18

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 19990119

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee