KR890007419A - 반도체모듈 및 그 냉각장치 - Google Patents

반도체모듈 및 그 냉각장치 Download PDF

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Publication number
KR890007419A
KR890007419A KR1019880013523A KR880013523A KR890007419A KR 890007419 A KR890007419 A KR 890007419A KR 1019880013523 A KR1019880013523 A KR 1019880013523A KR 880013523 A KR880013523 A KR 880013523A KR 890007419 A KR890007419 A KR 890007419A
Authority
KR
South Korea
Prior art keywords
housing
cooling
cooling plate
semiconductor
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019880013523A
Other languages
English (en)
Korean (ko)
Inventor
료이찌 가지와라
다까오 우나모토
미뚜오 가또
히로시 와찌
도모히꼬 시다
Original Assignee
미다가쓰시게
가부시기 가이샤 히다찌세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62263856A external-priority patent/JPH01107564A/ja
Priority claimed from JP62283318A external-priority patent/JPH0680757B2/ja
Priority claimed from JP63067436A external-priority patent/JPH01241154A/ja
Application filed by 미다가쓰시게, 가부시기 가이샤 히다찌세이사꾸쇼 filed Critical 미다가쓰시게
Publication of KR890007419A publication Critical patent/KR890007419A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/772—Bellows
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1019880013523A 1987-10-21 1988-10-17 반도체모듈 및 그 냉각장치 Withdrawn KR890007419A (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP87-263856 1987-10-21
JP62263856A JPH01107564A (ja) 1987-10-21 1987-10-21 半導体装置の冷却装置
JP87-283318 1987-11-11
JP62283318A JPH0680757B2 (ja) 1987-11-11 1987-11-11 半導体モジュール
JP63067436A JPH01241154A (ja) 1988-03-23 1988-03-23 半導体冷却装置
JP88-67436 1988-03-23

Publications (1)

Publication Number Publication Date
KR890007419A true KR890007419A (ko) 1989-06-19

Family

ID=27299439

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880013523A Withdrawn KR890007419A (ko) 1987-10-21 1988-10-17 반도체모듈 및 그 냉각장치

Country Status (3)

Country Link
US (1) US4996589A (enExample)
KR (1) KR890007419A (enExample)
DE (1) DE3835767A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100381431B1 (ko) * 1997-05-14 2003-04-23 인텔 코오퍼레이션 반도체 다이 냉각용 장치 및 방법

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5168919A (en) * 1990-06-29 1992-12-08 Digital Equipment Corporation Air cooled heat exchanger for multi-chip assemblies
US5198889A (en) * 1990-06-30 1993-03-30 Kabushiki Kaisha Toshiba Cooling apparatus
JPH04196395A (ja) * 1990-11-28 1992-07-16 Hitachi Ltd 冷却装置を備えた電子計算機
JPH04206555A (ja) * 1990-11-30 1992-07-28 Hitachi Ltd 電子機器の冷却装置
JP2927010B2 (ja) * 1991-03-01 1999-07-28 株式会社日立製作所 半導体パッケージ
US5294830A (en) * 1991-05-21 1994-03-15 International Business Machines Corporation Apparatus for indirect impingement cooling of integrated circuit chips
JP2728105B2 (ja) * 1991-10-21 1998-03-18 日本電気株式会社 集積回路用冷却装置
JPH0824222B2 (ja) * 1992-04-10 1996-03-06 インターナショナル・ビジネス・マシーンズ・コーポレイション エア・ミキサ冷却板を備えた冷却装置
US5557501A (en) * 1994-11-18 1996-09-17 Tessera, Inc. Compliant thermal connectors and assemblies incorporating the same
JP4275806B2 (ja) * 1999-06-01 2009-06-10 株式会社ルネサステクノロジ 半導体素子の実装方法
US6665187B1 (en) * 2002-07-16 2003-12-16 International Business Machines Corporation Thermally enhanced lid for multichip modules
JP3847691B2 (ja) * 2002-09-26 2006-11-22 三菱電機株式会社 電力用半導体装置
US6992382B2 (en) * 2003-12-29 2006-01-31 Intel Corporation Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon
JP2005228954A (ja) * 2004-02-13 2005-08-25 Fujitsu Ltd 熱伝導機構、放熱システムおよび通信装置
JP2006190707A (ja) * 2004-12-28 2006-07-20 Toshiba Corp 電子機器とこの電子機器が適用されるテレビジョン受像装置
US7403393B2 (en) * 2005-12-28 2008-07-22 International Business Machines Corporation Apparatus and system for cooling heat producing components
DE102007051798B3 (de) * 2007-10-26 2009-01-15 Jenoptik Laserdiode Gmbh Mikrokanalwärmesenke zur Kühlung von Halbleiterbauelementen und Verfahren zur Oberflächenbehandlung derselben
US9190341B2 (en) 2012-06-05 2015-11-17 Texas Instruments Incorporated Lidded integrated circuit package
EP3227624B1 (en) * 2014-12-03 2021-01-27 GE Intelligent Platforms, Inc. Method to provide a combined energy dissipation apparatus
GB2543549B (en) * 2015-10-21 2020-04-15 Andor Tech Limited Thermoelectric Heat pump system
CN108231653B (zh) * 2018-01-04 2020-08-04 厦门大学 一种MicroLED芯片转印方法及装置
US10976119B2 (en) * 2018-07-30 2021-04-13 The Boeing Company Heat transfer devices and methods of transfering heat
GB2615775B (en) * 2022-02-17 2025-01-15 Iceotope Group Ltd Apparatus and system for cooling electronic devices

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4138692A (en) * 1977-09-12 1979-02-06 International Business Machines Corporation Gas encapsulated cooling module
JPS60160149A (ja) * 1984-01-26 1985-08-21 Fujitsu Ltd 集積回路装置の冷却方式
CA1227886A (en) * 1984-01-26 1987-10-06 Haruhiko Yamamoto Liquid-cooling module system for electronic circuit components
JPS60253248A (ja) * 1984-05-30 1985-12-13 Hitachi Ltd 熱伝導冷却モジユ−ル装置
US4593342A (en) * 1984-11-15 1986-06-03 General Electric Company Heat sink assembly for protecting pins of electronic devices
JPS61220359A (ja) * 1985-03-26 1986-09-30 Hitachi Ltd 半導体モジユ−ル冷却構造体
JPS61222242A (ja) * 1985-03-28 1986-10-02 Fujitsu Ltd 冷却装置
EP0217676B1 (en) * 1985-10-04 1993-09-01 Fujitsu Limited Cooling system for electronic circuit device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100381431B1 (ko) * 1997-05-14 2003-04-23 인텔 코오퍼레이션 반도체 다이 냉각용 장치 및 방법

Also Published As

Publication number Publication date
DE3835767C2 (enExample) 1992-12-10
US4996589A (en) 1991-02-26
DE3835767A1 (de) 1989-05-03

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PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000