KR890003018A - Chip Mount Device - Google Patents

Chip Mount Device Download PDF

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Publication number
KR890003018A
KR890003018A KR1019880008217A KR880008217A KR890003018A KR 890003018 A KR890003018 A KR 890003018A KR 1019880008217 A KR1019880008217 A KR 1019880008217A KR 880008217 A KR880008217 A KR 880008217A KR 890003018 A KR890003018 A KR 890003018A
Authority
KR
South Korea
Prior art keywords
chip
pushing
stage
mount device
chip mount
Prior art date
Application number
KR1019880008217A
Other languages
Korean (ko)
Other versions
KR910006372B1 (en
Inventor
미쓰아끼 후지히라
마사노리 니시구찌
Original Assignee
나까하라 쯔네오
스미도모덴기고오교오 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 나까하라 쯔네오, 스미도모덴기고오교오 가부시기가이샤 filed Critical 나까하라 쯔네오
Publication of KR890003018A publication Critical patent/KR890003018A/en
Application granted granted Critical
Publication of KR910006372B1 publication Critical patent/KR910006372B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Abstract

내용 없음No content

Description

칩실장 장치Chip Mount Device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제 1 도는 본 발명의 실시예에 관한 칩실장 장치의 일부 파단 측면도. 제 2 도는 위치결정시의 패턴을 도시한 도면.1 is a partially broken side view of a chip mounting apparatus according to an embodiment of the present invention. 2 shows a pattern at the time of positioning;

Claims (1)

밀어올리는 스테이지에 지지되고 칩고정 테이프상의 칩을 밀어올리는 핀과, 밀어올려진 칩을 진공흡착에 의하여 픽업하는 콜리트와, 상기 칩고정테이프 상의 칩의 중심부를 상기 밀어올리는 핀의 선단부와 일치시키기 위하여 상기 밀어올리는 스테이지에 대한 칩의 위치를 패턴인식에 의해서 검지하는 모니터수단과, 상기 밀어올리는 스테이지로부터 출사되어서 상기 모니터수단에 입사하도록 광을 발생함으로써 당해 밀어올리는 스테이지에 대한 칩의 외형을 상기 모니터수단에 비추는 광원을 갖춘 것을 특징으로 하는 칩실장 장치.A pin supported on the pushing stage and pushing the chip on the chip fixing tape, a collet for picking up the pushed chip by vacuum suction, and a central portion of the chip on the chip fixing tape with the tip of the pushing pin. The monitor means for detecting the position of the chip with respect to the pushing stage by pattern recognition, and the appearance of the chip with respect to the pushing stage by generating light to be emitted from the pushing stage and incident on the monitor means. A chip mounting apparatus, comprising: a light source shining on the means. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019880008217A 1987-07-09 1988-07-02 Chip package device KR910006372B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62-171616 1987-07-09
JP62171616A JPS6415000A (en) 1987-07-09 1987-07-09 Chip packaging device

Publications (2)

Publication Number Publication Date
KR890003018A true KR890003018A (en) 1989-04-12
KR910006372B1 KR910006372B1 (en) 1991-08-21

Family

ID=15926473

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880008217A KR910006372B1 (en) 1987-07-09 1988-07-02 Chip package device

Country Status (2)

Country Link
JP (1) JPS6415000A (en)
KR (1) KR910006372B1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2800396B2 (en) * 1990-10-09 1998-09-21 松下電器産業株式会社 Chip observation device
JP2010045296A (en) * 2008-08-18 2010-02-25 Ueno Seiki Kk Upthrust stage of upthrust device
JP2012508460A (en) * 2008-11-12 2012-04-05 エセック アーゲー Method for peeling and removing a semiconductor chip from a foil
JP5596929B2 (en) * 2009-02-12 2014-09-24 富士機械製造株式会社 Method for positioning push pin and electronic component supply apparatus using the method

Also Published As

Publication number Publication date
KR910006372B1 (en) 1991-08-21
JPS6415000A (en) 1989-01-19

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