KR890001382B1 - Manufacture method for record element of sensing heat - Google Patents

Abstract

A method comprises (i) vapor-depositing Cr, Pd, Au onto ceramic CB (40) under vacuum and photolithograph to form metal layer (41) connected with heat-generating resistor, (ii) screen printing of matrix wiring parts with polyamide (43) as insulator with exception of the connector for dual wiring from (i), (iii) vapordepositing of thin metal layer (42) connected with input terminal (4) and photolithographing and (iv) full-printing with polyamide (44) for protection of the insulation between wirings and upper wiring.

Description

Method of manufacturing the thermal recording element

1 is a wiring diagram of a thermal recording head formed by a matrix wiring method.

FIG. 2 is a longitudinal cross-sectional view of the dual wiring portion 5 of FIG. 1 when using a conventional flexible PCB as viewed from the direction of A-A '.

Figure 3 is a partial cutaway perspective view of the matrix double wiring of the present invention.

4 is a longitudinal cross-sectional view of the matrix double interconnection portion A of FIG. 3 viewed from the direction of AA ′ shown in FIG.

5 is a cross-sectional view showing the forming portion of FIG. 4 by manufacturing process.

* Explanation of symbols for main parts of the drawings

1 common electrode 2 diode

3: heat generating resistor 4: input terminal part

5: dual wiring part 10: wiring and heating resistance part

20: matrix wiring portion 30, 40: ceramic substrate

31 metal thin film conductive layer 32 gold plated layer

33: flexible copper thin film 34: flexible PCB polymer material

41: metal layer 42: metal thin film conductive layer

43,44: polyamide layer 45: photoresist

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a thermosensitive recording element for use in a reception recording apparatus of a facsimile, and more particularly, to a method of manufacturing a matrix wiring portion of the thermosensitive recording element.

The thermosensitive recording element of the reception recording apparatus used for the facsimile machine is composed of a wiring and a heat generating resistor unit 10 and a matrix wiring unit 20 as shown in FIG. 1. It is connected in series with the heat generating resistors 3 and the heat generating resistors 3 arranged in series, and has a diode 2 for preventing the reverse flow of current, and the matrix wiring section 20 is a double layer wiring for enabling matrix driving. do.

That is, the heat generating resistors 3 are divided into a plurality of blocks, and the preheating resistors constituting each block are connected with individual diodes 2 and metal conductors to prevent reverse flow of current. It is embedded in one diode array chip and bonded to the common electrode 1 with a conductive adhesive. The other wire of each of the heating resistors 3 connects the heating resistor through the double wiring part 5 of the matrix wiring part 20. It is connected in the form of a matrix with an input terminal 4 which provides a driving signal.

The wiring formation method of the matrix wiring portion 20 of the diode matrix type thermosensitive recording element as described above is a wiring formed on a ceramic substrate, and coated with a polymer material (polyester, polyamide, etc.) on a copper thin plate to produce wiring after etching. Flexible PCB has been manufactured by thermocompression method using melting point of metal.

That is, the diagram of the matrix wiring part 20 of the element by the thermocompression method using the melting point of the metal of the conventional matrix wiring part 20 is as shown in FIG.

FIG. 2 is a longitudinal sectional view of the double wiring part 1 of FIG. 1 in the case of using a conventional flexible PCB as viewed from the direction of A-A '.

30 is a ceramic substrate, 31 is a metal thin film conductive layer connected to a heating resistor formed on the substrate, 32 is a gold (Au) plated layer, 33 is a copper thin film (35μm, 70μm) of PCB (print circuit board) flexible, 34 is Flexible PCB polymer material, 35, is a tin (Sn) layer.

Therefore, in the conventional method of manufacturing a thermal recording element, a matrix 35 is formed by plating tin 35 on a copper thin film 33 of a flexible PCB and plating gold 32 on a metal thin film conductive layer 31 of a ceramic substrate 30 wiring. It has been produced by thermocompression using the eutectic point of gold (Au) and tin (Sn). However, the conventional method of manufacturing the thermal recording element described above requires a process of plating a separate flexible PCB and tin, a process of plating gold on the wiring of the substrate, and a process of depositing a common electrode for gold plating. Since it must go through the pressing process, there are problems of complicated process management, lower yield of the product, and a cost increase factor.

Accordingly, an object of the present invention is to provide a method for simplifying a manufacturing process and manufacturing a highly thermally sensitive thermal recording element by a general electrodeposition, etching, and screen printing process to solve the conventional problems. have.

Another object of the present invention is to provide a diode matrix type thermal recording element in which a hole is formed by a polyamide insulating layer to form an input terminal portion for driving a heating resistor and a double wiring.

Hereinafter, with reference to the drawings of the present invention will be described in detail.

FIG. 3 is a perspective view of the cutaway portion of the matrix double wiring according to the present invention. In FIG. 3, 40 corresponds to a dual wiring metal layer connected to a ceramic substrate, 41 to a heat generating resistor of FIG. 3, and 42 is an input terminal of FIG. 4. 43 and 44 are polyimide layers for insulation and external protection, 45 are photoresists, and a cutout portion C is a double wiring matrix wiring forming portion.

4 is a longitudinal cross-sectional view of the matrix double wiring forming portion A of FIG. 3 according to the present invention in the direction of A-A 'of FIG. 1, and the same reference numerals as shown in FIG. As shown in FIG. 5, in order to fabricate a matrix forming point on the ceramic substrate 40, the 41 layer of FIG. 3 corresponds to a vacuum vapor deposition machine, so that chromium (Cr) is 1000-1400 kPa, palladium (Pd) 800-1200 kPa Vacuum deposition was performed continuously so that 1 micrometer-1.5 micrometers, and chromium (Cr) have 800-1200 micrometers of layers, respectively. Next, the photolithography process is performed leaving only the matrix forming point, that is, the double wiring part. The implantation angle process is generally performed by the photolithograph method. Therefore, first, spin-coating a photoresist layer having a certain thickness on the metal layer to be etched cleanly with a photoresist, and heating it in a predetermined temperature atmosphere, and then a photomask for the double wiring matrix formation point. After exposure to UV and (Light) for a predetermined time using (Photomask), develop into developer, rinse with DI water, and then bake to improve adhesion between the metal layer and the resist When the metal layer is inserted, a matrix double layer interconnection pattern is formed, and since the photoresistor still remains on the sample on which the pattern is formed, stripping it completes the metal layer 41 shown in FIG. 5 (a).

Here, 43 layers are polyamides, and the process of screen-printing the wiring portions with polyamide except for the connection portion for double wiring on the substrate 40 to form a multi-layer wiring using an intermediate insulator. The second layer is polyamide at 80 ° C. What is necessary is just to cure for 30 minutes, 30 minutes at 150 degreeC, and 30 minutes at 350 degreeC, and the part shown in FIG. 5 (a) is completed. Subsequently, the process of forming the gold thin film conductive layer 42 of FIG. 4 in order to be connected to the input terminal part 4 of FIG. 1 is a process of FIG. 5 (b) using a metal (Al or Cu) different from the metal layer 41. When the deposition by the vacuum evaporator is connected only in the region where the polyamide 43 is not. Therefore, if the nickname is etched by the above-described photolithography method to form the wiring along the input terminal part 4 of FIG. 1, FIG. 5 (b) also becomes a view when viewed from the same direction in the drawing of FIG. As seen from the direction B of FIG. 1, FIG. 5C is also a view. Subsequently, when the photoresist 45 shown in FIG. 5C is removed, the matrix double wiring portion described in FIG. 1 is completed.

When the polyamide 44 is screen-printed on the completed metal thin film conductive layer 42 again, the insulation between the wirings and the upper surface of the wirings are protected from the outside. The drawing for this is the fifth (d).

As described above, there is an advantage in that a thermally sensitive recording element having high reliability and low cost can be manufactured by manufacturing a matrix double wiring part by a general photolithography method.

Claims (1)

In the method of manufacturing a thermal recording element of a reception recording apparatus, a first process of vacuum-depositing a predetermined element on the ceramic substrate 40 to form a metal layer 41 connected to a heating resistor, and then etching the photo, and in the first process The second step of screen-printing the matrix wiring part with the polyamide 43, which is an intermediate insulator, except for the connection part formed for the double wiring, and vacuum-depositing the metal thin film layer 42 connected to the input terminal part 4 after vacuum deposition Forming a matrix double wiring part by a third step and a fourth step of printing the entire surface with polyamide 44 to protect the insulation and the upper surface of the wiring from the outside after the third step is completed. A method of manufacturing a thermal recording element, characterized by the above-mentioned.

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