KR890001184A - 반도체 냉각 모듈 - Google Patents

반도체 냉각 모듈 Download PDF

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Publication number
KR890001184A
KR890001184A KR1019870006558A KR870006558A KR890001184A KR 890001184 A KR890001184 A KR 890001184A KR 1019870006558 A KR1019870006558 A KR 1019870006558A KR 870006558 A KR870006558 A KR 870006558A KR 890001184 A KR890001184 A KR 890001184A
Authority
KR
South Korea
Prior art keywords
cooling module
semiconductor cooling
piston
semiconductor
communicated
Prior art date
Application number
KR1019870006558A
Other languages
English (en)
Other versions
KR890003527B1 (ko
Inventor
송태호
방세윤
Original Assignee
이해
한국기계연구소
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이해, 한국기계연구소 filed Critical 이해
Priority to KR1019870006558A priority Critical patent/KR890003527B1/ko
Publication of KR890001184A publication Critical patent/KR890001184A/ko
Application granted granted Critical
Publication of KR890003527B1 publication Critical patent/KR890003527B1/ko

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

내용 없음

Description

반도체 냉각 모듈
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 일부를 절개한 본 발명의 사시도,
제2도는 본 발명의 입면상태의 작용 설명도,
제3도는 본 발명의 평면상태의 작용 설명도.

Claims (1)

  1. 냉각 블럭에 삽입되는 피스톤(3)에 오링(5)을 끼우고 피스톤(3)이 삽입되는 하부체(2)에 환형통로(9)를 형성하여 각기 냉각액통로(7)로서 연통하고 피스톤(3)이 삽입되는 상부체(1)에 압력광간(8)을 형성하여 환형간극(6)으로써 연통시킨 반도체 냉각 모듈.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870006558A 1987-06-27 1987-06-27 반도체 냉각 모듈 KR890003527B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019870006558A KR890003527B1 (ko) 1987-06-27 1987-06-27 반도체 냉각 모듈

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019870006558A KR890003527B1 (ko) 1987-06-27 1987-06-27 반도체 냉각 모듈

Publications (2)

Publication Number Publication Date
KR890001184A true KR890001184A (ko) 1989-03-18
KR890003527B1 KR890003527B1 (ko) 1989-09-23

Family

ID=19262391

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870006558A KR890003527B1 (ko) 1987-06-27 1987-06-27 반도체 냉각 모듈

Country Status (1)

Country Link
KR (1) KR890003527B1 (ko)

Also Published As

Publication number Publication date
KR890003527B1 (ko) 1989-09-23

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