KR880700620A - 금속 도금 전에 플라스틱 기판 표면을 컨디셔닝하는 방법 - Google Patents

금속 도금 전에 플라스틱 기판 표면을 컨디셔닝하는 방법

Info

Publication number
KR880700620A
KR880700620A KR870700155A KR870700155A KR880700620A KR 880700620 A KR880700620 A KR 880700620A KR 870700155 A KR870700155 A KR 870700155A KR 870700155 A KR870700155 A KR 870700155A KR 880700620 A KR880700620 A KR 880700620A
Authority
KR
South Korea
Prior art keywords
resin
organic solvent
polar material
contacting
time sufficient
Prior art date
Application number
KR870700155A
Other languages
English (en)
Inventor
아이.쿠르두벨리스 콘스탄틴
이.스톤 데이비드
Original Assignee
주안 헤이두
엔톤, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주안 헤이두, 엔톤, 인코포레이티드 filed Critical 주안 헤이두
Publication of KR880700620A publication Critical patent/KR880700620A/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

내용 없음

Description

금속 도금 전에 플라스틱 기판 표면을 컨디셔닝하는 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (8)

  1. (a)에칭공정으로 폴리에테르이미드수지를 부식시키기에 충분한 시간동안 상승온도에서 유전상수 약 15 이상 및 쌍극자 모멘트 약 3데바이 단위를 갖는 극성 물질과 유기 용매의 용액을 함유하는 팽윤제 조성물로 상기 수지를 접촉시켜서 컨디셔닝하고 ; (b)플라스틱상에서 금속도금의 접착력을 증진시키기에 충분한 시간동안 약 70。C이상의 상승온도에서 크로뮴 이온을 함유하는 부식제 조성물로 상기 컨디셔닝된 수지를 접촉시킴을 포함하는 폴리에테르이미드 수지의 접착 특성을 개선하는 방법.
  2. 제 1 항에 있어서, 플라스틱이 유리-충진된 폴리에테르이미드인 방법.
  3. 제 2 항에 있어서, 팽윤제 조성물이 데미틸설폭사이드, 디메틸포름아미드, N-메틸피롤리돈 및 이의 혼합물로 이루어진 그룹중에서 선택된 극성물질을 포함하며 유기 용매가 다가 화합물인 방법.
  4. 제 3 항에 있어서, 부식제 조성물이 CrO3또는 Cr2O7이온 및 H2SO4를 함유하는 방법.
  5. 제 3 항에 있어서, 극성 물질이 N-메틸피롤리돈이고 유기 용매가 프로필렌 글리콜 모노메틸 에테르인 방법.
  6. 제 3 항에 있어서, 극성물질이 디메틸설폭사이드이고 유기 용매가 프로필렌 글리콜 모노메틸 에테르인 방법.
  7. 제 1 항의 방법에 의해 제조된 폴리에테르이미드 수지 생성물.
  8. 폴리에테르이미드 수지의 표면을 감광 및 활성화시키고 이 수지상에 금속을 무전해 피복시킨 다음, 경우에 따라 전기 도금시킴을 포함하는 폴리에테르이미드 수지 기판상에 금속피복물을 형성시키는 방법에서, (a)에칭 공정으로 상기 수지를 부식시키기에 충분한 시간동안 상승온도에서 유전상수 약 15이상 및 쌍극자 모멘트 약 3데바이 단위를 갖는 극성물질과 유기 용매의 혼합물을 함유하는 팽윤제 조성물로 상기 수지를 접촉시켜서 컨디셔닝하고 ; (b) 상기 수지상에서 금속 도금의 접착력을 증진시키기에 충분한 시간동안 약 70℃이상의 상승온도에서 크로뮴이온을 함유하는 부식제 조성물로 상기 컨디셔닝된 수지를 접촉시키는 단계를 포함하여 상기 수지 기판상에서 금속 피복물의 접착력을 증진시킴을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR870700155A 1985-06-24 1986-05-28 금속 도금 전에 플라스틱 기판 표면을 컨디셔닝하는 방법 KR880700620A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US74811985A 1985-06-24 1985-06-24
US748119 1985-06-24
PCT/US1986/001199 WO1987000391A1 (en) 1985-06-24 1986-05-28 Process for conditioning the surface of plastic substrates prior to metal plating

Publications (1)

Publication Number Publication Date
KR880700620A true KR880700620A (ko) 1988-03-15

Family

ID=25008108

Family Applications (1)

Application Number Title Priority Date Filing Date
KR870700155A KR880700620A (ko) 1985-06-24 1986-05-28 금속 도금 전에 플라스틱 기판 표면을 컨디셔닝하는 방법

Country Status (9)

Country Link
EP (1) EP0227746A4 (ko)
JP (1) JPS63500249A (ko)
KR (1) KR880700620A (ko)
AU (1) AU580433B2 (ko)
BR (1) BR8606709A (ko)
CA (1) CA1249188A (ko)
ES (1) ES8800992A1 (ko)
IL (1) IL79044A0 (ko)
WO (1) WO1987000391A1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4846929A (en) * 1988-07-13 1989-07-11 Ibm Corporation Wet etching of thermally or chemically cured polyimide
US4941940A (en) * 1988-11-07 1990-07-17 Jp Laboratories, Inc. Pre-swelling and etching of plastics for plating
US5015329A (en) * 1988-11-07 1991-05-14 Jp Laboratories, Inc. Pre-swelling and etching of plastics for plating
US5049230A (en) * 1988-11-07 1991-09-17 Jp Laboratories, Inc. Single step pre-swelling and etching of plastics for plating
US4999251A (en) * 1989-04-03 1991-03-12 General Electric Company Method for treating polyetherimide substrates and articles obtained therefrom
DE3922477A1 (de) * 1989-07-06 1991-01-17 Schering Ag Quellmittel zur vorbehandlung von kunstharzen vor einer stromlosen metallisierung
US5183552A (en) * 1989-09-14 1993-02-02 Schering Aktiengesellschaft Process for metallization of a nonconductor surface, especially on a circuit board having preexisting copper surfaces

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5333628B1 (ko) * 1969-09-05 1978-09-14
US3808028A (en) * 1971-08-11 1974-04-30 Western Electric Co Method of improving adhesive properties of a surface comprising a cured epoxy
US3758332A (en) * 1971-08-20 1973-09-11 Western Electric Co Method of metal coating an epoxy surface
US3790400A (en) * 1972-07-24 1974-02-05 Macdermid Inc Preparation of plastic substrates for electroless plating and solutions therefor
US4171240A (en) * 1978-04-26 1979-10-16 Western Electric Company, Inc. Method of removing a cured epoxy from a metal surface
JPS5584330A (en) * 1978-12-22 1980-06-25 Teijin Chem Ltd Plating of polycarbonate resin molded article
JPS5827963B2 (ja) * 1979-05-17 1983-06-13 日東電工株式会社 選択性透過膜の製造方法
US4424095A (en) * 1981-01-12 1984-01-03 Kollmorgen Technologies Corporation Radiation stress relieving of polymer articles
CA1162354A (en) * 1981-09-30 1984-02-21 John F. Fogarty Process for electroless metal plating of a polysulfone substrate
JPS61252691A (ja) * 1985-05-02 1986-11-10 キヤノン株式会社 プリント配線板の製造方法

Also Published As

Publication number Publication date
AU580433B2 (en) 1989-01-12
EP0227746A4 (en) 1987-10-06
IL79044A0 (en) 1986-09-30
BR8606709A (pt) 1987-08-11
AU5991486A (en) 1987-01-30
JPS63500249A (ja) 1988-01-28
CA1249188A (en) 1989-01-24
ES8800992A1 (es) 1987-12-01
ES556423A0 (es) 1987-12-01
WO1987000391A1 (en) 1987-01-15
EP0227746A1 (en) 1987-07-08

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