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에폭시 수지 성형물의 제조 방법과 전기 부품의 매입 방법Manufacturing method of epoxy resin molding and purchase method of electric parts
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
Claims (5)
융점이 100℃보다 낮은 하기 일반식의 화합물 0.6 내지 1당량으로 평상시에는 액체인 에폭시 수지를 경화하는 것으로 구성된 에폭시 수지 성형물의 제조방법;A method for producing an epoxy resin molded product composed of curing an epoxy resin which is usually a liquid at a melting point of 0.6 to 1 equivalent of the compound of the following general formula lower than 100 ° C;여기서 R1및 R2는 수소, 1내지 6의 탄소원자를 갖는 알킬, 시클로알킬 또는 아릴이며, R3는 수소를 나타내고 X는 염소 또는 브롬을 나타낸다.Wherein R 1 and R 2 are hydrogen, alkyl having 1 to 6 carbon atoms, cycloalkyl or aryl, R 3 represents hydrogen and X represents chlorine or bromine.제1항에 있어서, 에폭시 수지가 2,2-비스-(4-히드록시페닐)프로판인 방법.The method of claim 1 wherein the epoxy resin is 2,2-bis- (4-hydroxyphenyl) propane.제1항 또는 제2항에 있어서, 경화가 경화 촉매의 존재하에서 실행되는 방법.The process according to claim 1 or 2, wherein the curing is carried out in the presence of a curing catalyst.제1항 내지 제3항중 어느 한 항에 있어서, 화합물이 2,2-비스(3-브로모, 4-히도록시페닐)프로판인 방법.The method of any one of claims 1 to 3, wherein the compound is 2,2-bis (3-bromo, 4-hydroxyphenyl) propane.제1항 내지 제4항중 어느 한 항에서, 정의된 경화 시스템을 전기 부품 주위에 성형하고 수지 시스템을 경화하는 것으로 구성된 전기 부품의 매입 방법.5. The method of embedding an electrical component as claimed in claim 1, wherein the defined curing system is formed around the electrical component and the resin system is cured.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR870010265A1986-09-191987-09-16
Manufacturing method of epoxy resin molding and purchase method of electric parts
KR880004005A
(en)
HEAT-CURING REACTION RESIN MIXTURE FOR IMPREGNATION OF INSULATION OF ELECTRICAL EQUIPMENT AND FOR MANUFACTURE OF MOLDED MATERIALS WITH AND WITHOUT INSERTS.
Process for the production of modified phenolic resins, molding compound based on these resins and electrical and electronic parts produced therefrom as well as sealing compounds for semiconductors