KR880001082A - 레이저 기록 과정에서의 시스템 동작 정밀도 증진 방법 및 장치 - Google Patents

레이저 기록 과정에서의 시스템 동작 정밀도 증진 방법 및 장치 Download PDF

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Publication number
KR880001082A
KR880001082A KR1019870006250A KR870006250A KR880001082A KR 880001082 A KR880001082 A KR 880001082A KR 1019870006250 A KR1019870006250 A KR 1019870006250A KR 870006250 A KR870006250 A KR 870006250A KR 880001082 A KR880001082 A KR 880001082A
Authority
KR
South Korea
Prior art keywords
laser beam
control logic
output
scanning laser
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019870006250A
Other languages
English (en)
Korean (ko)
Inventor
마인라드 캠프레르
파울 그리우즈
Original Assignee
에른스트 우훌만
라자레이 홀딩 악티엔 게젤샤후트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에른스트 우훌만, 라자레이 홀딩 악티엔 게젤샤후트 filed Critical 에른스트 우훌만
Publication of KR880001082A publication Critical patent/KR880001082A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/007—Marks, e.g. trade marks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Lasers (AREA)
  • Image Input (AREA)
  • Optical Recording Or Reproduction (AREA)
  • Laser Beam Processing (AREA)
  • Exposure Or Original Feeding In Electrophotography (AREA)
  • Optical Communication System (AREA)
  • Facsimile Heads (AREA)
KR1019870006250A 1986-06-25 1987-06-19 레이저 기록 과정에서의 시스템 동작 정밀도 증진 방법 및 장치 Withdrawn KR880001082A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH02565/86-6 1986-06-25
CH2565/86A CH670211A5 (enExample) 1986-06-25 1986-06-25

Publications (1)

Publication Number Publication Date
KR880001082A true KR880001082A (ko) 1988-03-31

Family

ID=4236665

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870006250A Withdrawn KR880001082A (ko) 1986-06-25 1987-06-19 레이저 기록 과정에서의 시스템 동작 정밀도 증진 방법 및 장치

Country Status (10)

Country Link
US (1) US4871896A (enExample)
EP (1) EP0253764B1 (enExample)
JP (1) JPS6313687A (enExample)
KR (1) KR880001082A (enExample)
AT (1) ATE61264T1 (enExample)
CH (1) CH670211A5 (enExample)
DE (1) DE3768358D1 (enExample)
ES (1) ES2020580B3 (enExample)
IL (1) IL82761A (enExample)
ZA (1) ZA873900B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5793052A (en) * 1997-03-18 1998-08-11 Nikon Corporation Dual stage following method and apparatus
DE10105794A1 (de) * 2001-02-07 2002-08-08 Philips Corp Intellectual Pty Kommunikationssystem, Verfahren und Signal für zeitlagencodierte Datenübertragung
US7638731B2 (en) * 2005-10-18 2009-12-29 Electro Scientific Industries, Inc. Real time target topography tracking during laser processing
JP5620669B2 (ja) * 2009-10-26 2014-11-05 東芝機械株式会社 レーザダイシング方法およびレーザダイシング装置
ES2546735T3 (es) * 2009-11-30 2015-09-28 Ykk Corporation Cierre de cremallera estanco a los líquidos y procedimiento para su fabricación
JP5452247B2 (ja) * 2010-01-21 2014-03-26 東芝機械株式会社 レーザダイシング装置
US20130200053A1 (en) * 2010-04-13 2013-08-08 National Research Council Of Canada Laser processing control method
JP5981094B2 (ja) 2010-06-24 2016-08-31 東芝機械株式会社 ダイシング方法
JP5140198B1 (ja) 2011-07-27 2013-02-06 東芝機械株式会社 レーザダイシング方法
JP2014011358A (ja) 2012-06-29 2014-01-20 Toshiba Mach Co Ltd レーザダイシング方法
TWI619445B (zh) 2017-08-07 2018-04-01 冠宇拉鍊股份有限公司 防水拉鍊布及其防水拉鍊

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4213117A (en) * 1977-11-28 1980-07-15 Hitachi, Ltd. Method and apparatus for detecting positions of chips on a semiconductor wafer
US4691434A (en) * 1982-02-19 1987-09-08 Lasarray Holding Ag Method of making electrically conductive regions in monolithic semiconductor devices as applied to a semiconductor device
JPH0722166B2 (ja) * 1982-09-22 1995-03-08 株式会社東芝 ダイボンダ等におけるペレツト認識方法
EP0128993B1 (de) * 1983-06-17 1987-06-03 Lasarray Holding Ag Verfahren zum Feststellen von Referenzdaten zum Zwecke der Korrektur von mechanischen Bewegungen beim Schreiben von Linien mit einem Schreiblaserstrahl in einem metallisierten Raster und Vorrichtung zur Durchführung des Verfahrens
US4695698A (en) * 1984-07-10 1987-09-22 Larassay Holding Ag Method of, and apparatus for, generating a predetermined pattern using laser radiation

Also Published As

Publication number Publication date
US4871896A (en) 1989-10-03
IL82761A (en) 1991-09-16
DE3768358D1 (de) 1991-04-11
EP0253764A1 (de) 1988-01-20
EP0253764B1 (de) 1991-03-06
CH670211A5 (enExample) 1989-05-31
ATE61264T1 (de) 1991-03-15
JPS6313687A (ja) 1988-01-20
ES2020580B3 (es) 1991-08-16
ZA873900B (en) 1987-12-10
IL82761A0 (en) 1987-12-20

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19870619

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid