KR870010932A - Heat-resistant, pressure-resistant release layer of rubber products in mold - Google Patents

Heat-resistant, pressure-resistant release layer of rubber products in mold Download PDF

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Publication number
KR870010932A
KR870010932A KR1019860004366A KR860004366A KR870010932A KR 870010932 A KR870010932 A KR 870010932A KR 1019860004366 A KR1019860004366 A KR 1019860004366A KR 860004366 A KR860004366 A KR 860004366A KR 870010932 A KR870010932 A KR 870010932A
Authority
KR
South Korea
Prior art keywords
resistant
release layer
rubber products
mold
heat
Prior art date
Application number
KR1019860004366A
Other languages
Korean (ko)
Other versions
KR890004906B1 (en
Inventor
서진걸
Original Assignee
서진걸
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 서진걸 filed Critical 서진걸
Priority to KR1019860004366A priority Critical patent/KR890004906B1/en
Publication of KR870010932A publication Critical patent/KR870010932A/en
Application granted granted Critical
Publication of KR890004906B1 publication Critical patent/KR890004906B1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/58—Applying the releasing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/60—Releasing, lubricating or separating agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)

Abstract

내용 없음No content

Description

고무제품을 금형에 내열, 내압성 이형층(離型層)의 형성법Heat-resistant, pressure-resistant release layer of rubber products in mold

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제 1도는 본 발명을 실시한 단면 설명도.1 is an explanatory cross-sectional view of the present invention.

제 2도는 제 1도의 A부의 확대 단면 설명도.2 is an enlarged cross-sectional explanatory diagram of part A of FIG.

Claims (1)

고무제품용 금형면(1)에 샌드브러스트(SAND BLAST) 공법을 실시하여 무수한 미세요철면(2)(2')등을 형성하는 제 1공정과 전기 제 1공정의 미세요철면(2)(2')에 불소 수지성분 상품명 GP2 300g에 상품명 앨시드 150g을 혼합한 접착제를 분무한 후 섭씨 280도 가열로에 약 5분간 가열하여 1차 이형층(3)을 형성한 후 냉각하는 제 2공정 및 전기 1차 이형층(3)위에 다시 불소수시 성분 상품명 GP1 500g에 유액 불소 색소 수지 300g을 혼합한 액체를 분사하여 섭씨 380도 가열로에 7∼10분간 가열하여 2차 이형층(4)을 형성한 후 대기 중에서 냉각하는 제 3공정을 결합 실시함을 특징으로 하는 고무제품용 금형에 내열, 내압성 이형층의 형성법.Sandblasting method (2) (2) of the first step and the first step of forming sand count (SAND BLAST) method on rubber mold surface (1) for rubber products A second process of spraying an adhesive containing a mixture of 150 g of fluoride resin component GP2 in 300 g of a fluorine resin component brand name and heating it in a 280 degree Celsius heating furnace for about 5 minutes to form a primary release layer 3 and then cooling it. The second release layer 4 was formed by injecting a liquid of 300 g of fluorine dye resin mixed with 500 g of fluorine-containing constituent GP1 on the first primary release layer 3 and heating it in a 380 degree Celsius heating furnace for 7 to 10 minutes. And then forming a heat-resistant and pressure-resistant release layer on the mold for rubber products, characterized in that the third step of cooling in the air is performed. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019860004366A 1986-05-31 1986-05-31 Method for the coating of releasing agent on the rubber mould KR890004906B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019860004366A KR890004906B1 (en) 1986-05-31 1986-05-31 Method for the coating of releasing agent on the rubber mould

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019860004366A KR890004906B1 (en) 1986-05-31 1986-05-31 Method for the coating of releasing agent on the rubber mould

Publications (2)

Publication Number Publication Date
KR870010932A true KR870010932A (en) 1987-12-18
KR890004906B1 KR890004906B1 (en) 1989-11-30

Family

ID=19250277

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860004366A KR890004906B1 (en) 1986-05-31 1986-05-31 Method for the coating of releasing agent on the rubber mould

Country Status (1)

Country Link
KR (1) KR890004906B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101049934B1 (en) * 2008-11-03 2011-07-15 (주)상아프론테크 Method for producing release film used to mold semiconductor package with resin and release film made by this method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101049934B1 (en) * 2008-11-03 2011-07-15 (주)상아프론테크 Method for producing release film used to mold semiconductor package with resin and release film made by this method

Also Published As

Publication number Publication date
KR890004906B1 (en) 1989-11-30

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