KR870001045A - Pattern Forming Device Using Laser - Google Patents

Pattern Forming Device Using Laser Download PDF

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Publication number
KR870001045A
KR870001045A KR1019860003730A KR860003730A KR870001045A KR 870001045 A KR870001045 A KR 870001045A KR 1019860003730 A KR1019860003730 A KR 1019860003730A KR 860003730 A KR860003730 A KR 860003730A KR 870001045 A KR870001045 A KR 870001045A
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South Korea
Prior art keywords
beams
rotating mirror
pattern forming
forming apparatus
workpiece
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KR1019860003730A
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Korean (ko)
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KR940008359B1 (en
Inventor
씨. 알렌 폴
씩. 알렌 폴
에이. 워켄틴 폴
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아테큐 코포레이숀
케니쓰 유
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0734—Shaping the laser spot into an annular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Abstract

내용 없음.No content.

Description

레이저를 이용한 패턴 형성장치Pattern Forming Device Using Laser

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명에 따른 장치의 전체광경로를 나타내는 실명도.1 is a blindness diagram showing the entire light path of a device according to the invention.

제2도는 광경로내에 위치하는 렌즈의 위치와 부품호울더 사이의 관계를 설명하기 위한 정면도.2 is a front view for explaining the relationship between the position of the lens located in the optical path and the component holder;

제3도는 본 발명에 이용되는 비임분할기의 구성도.3 is a block diagram of a beam splitter used in the present invention.

Claims (38)

방사에너지 비임을 발생하는 레이저원(10)과, 상기 레이저원에 광학적으로 연결되어 비임을 여러개의 비임들로 분할시키는 비임분할기(13), 상기 비임분할기(13)에 광학적으로 연결되어 상기 각 비임들을 독립적으로 변조시키는 음향광학적 변조기(16), 상기 음향광학적 변조기로부터 비임들이 직접 인가되는 여러개의 절단면을 갖춘 회전거울(24) 및, 상기 회전거울로부터 비임들을 인가받아 가공물(34)상에 비임들을 집속시키기 위한 집속수단으로 이루어져서 상기 회전거울(24)에 의해 방사감지필름을 갖춘 가공물에 여러 비임들을 주사시키도록 된 레이저를 이용한 패턴형성장치.A laser source 10 generating a radiation energy beam, a beam splitter 13 optically connected to the laser source to split the beam into a plurality of beams, and optically connected to the beam splitter 13; Optical modulator 16 for independently modulating the beams, a rotating mirror 24 having a plurality of cutting planes from which the beams are directly applied from the acoustic optical modulator, and beams being applied from the rotating mirror to the beams on the workpiece 34. A pattern forming apparatus using a laser, which consists of a focusing means for focusing and scans various beams to a workpiece having a radiation sensing film by the rotating mirror 24. 제1항에 있어서, 상기 회전거울(24)과 가공물(34) 사이에는 확대영상평면이 놓여지는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.The pattern forming apparatus of claim 1, wherein an enlarged image plane is placed between the rotating mirror and the workpiece. 제2항에 있어서, 상기 확대영상평면에는 회전거울의 절단면에 일치하는 동기화신호를 제공하기 위해 회전거울로부터 절단면검파기(67)까지 비임을 반사하도록 된 분할기(28)가 갖추어져 있는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.3. The laser according to claim 2, wherein the enlarged image plane is provided with a divider (28) adapted to reflect the beam from the rotating mirror to the cut detector (67) to provide a synchronization signal corresponding to the cut surface of the rotating mirror. Pattern forming apparatus using. 제3항에 있어서, 적어도 하나 이상 여러개의 상기 비임들은 가공물로부터 반사되고, 상기 가공물의 위치표시를 제공하기 위해 비임분할기(28)에서 반사되어지는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.4. The apparatus of claim 3, wherein at least one or more of the plurality of beams are reflected from a workpiece and reflected by a beam splitter (28) to provide an indication of the location of the workpiece. 제2항에 있어서, 상기 확대영상평면은 F-Θ렌즈(26)를 갖추어 이루어진 것을 특징으로 하는 레이저를 이용한 패턴형성장치.The pattern forming apparatus of claim 2, wherein the enlarged image plane comprises an F-Θ lens. 제1항에 있어서, 상기 음향광학적변조기(16)와 회전거울(24) 사이에는 여러 비임들의 상호간섬을 방지하여 분리된 비임들을 제공하기 위한 도우브프리즘(17)과 배치되어 있는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.2. The doveprism (17) according to claim 1, characterized in that it is arranged between the acousto-optic modulator (16) and the rotating mirror (24) with a dove prism (17) for providing separate beams by preventing mutual beams of the various beams. Pattern forming apparatus using a laser. 제1항에 있어서, 상기 음향광학적변조기와 회전거울사이에는 줄렌즈(22)가 배치되어 있는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.The pattern forming apparatus of claim 1, wherein a joule lens is disposed between the acoustooptic modulator and the rotating mirror. 제1항에 있어서, 상기 음향광학적변조기와 회전거울 사이에는 조향거울(20)이 배치되어 있는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.The apparatus of claim 1, wherein a steering mirror (20) is disposed between the acoustooptic modulator and the rotating mirror. 반사에너지 비임을 제공하는 적어도 하나 이상의 레이져원(10)과, 상기 레이저원으로부터 비임을 인가받아 변조된 여러 비임들을 제공하는 변조기수단, 상기 변조기수단으로부터 비임들을 인가받는 조향거울(20), 상기 조향거울로부터 비임들이 직접 인가되는 여러개의 절단면을 갖춘 회전거울(24), 상기 회전거울로부터 비임들을 인가받아 가공물(34)상에 비임들을 집속시키기 위한 집속수단으로 이루어져서 상기 회진거울에 의해 방사감지필픔을 갖춘 가공물에 여러 비임들을 주사하도록된 레이저를 이용한 패턴형성장치.At least one laser source 10 for providing a reflected energy beam, modulator means for providing different beams modulated by the beam from the laser source, a steering mirror 20 for receiving beams from the modulator means, the steering It consists of a rotating mirror 24 having a plurality of cutting planes from which the beams are directly applied from the mirror, and a focusing means for focusing the beams on the workpiece 34 by receiving the beams from the rotating mirrors. A pattern forming apparatus using a laser to scan multiple beams on a workpiece. 제9항에 있어서, 상기 회전거울(24)과 가공물(34) 사이에는 확대영상평면이 놓여져 있는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.10. The pattern forming apparatus as claimed in claim 9, wherein an enlarged image plane is placed between the rotating mirror (24) and the workpiece (34). 제10항에 있어서, 상기 확대영상평면에는 회진거울의 절단면에 일치하는 동기화신호를 제공하기 위해 회전거울로부터 절단면검파기(67)까지 비임을 반사하도록된 분할기(28)가 갖추어져 있는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.11. The laser according to claim 10, wherein the enlarged image plane is provided with a divider (28) adapted to reflect the beam from the rotating mirror to the cut detector (67) to provide a synchronization signal corresponding to the cut plane of the rotating mirror. Pattern forming apparatus using. 제11항에 있어서, 적어도 하나이상 여러개의 상기 비임들은 상기 가공물의 위치표시를 제공하기 위해 비임분할기(28)에서 반사되어지는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.12. The apparatus of claim 11, wherein at least one of the plurality of beams is reflected at a beam splitter (28) to provide an indication of the location of the workpiece. 제10항에 있어서, 상기 확대영상평면은 F-Θ렌즈(26)를 갖추어 이루어진 것을 특징으로 하는 레이저를 이용한 패턴형성장치.11. The pattern forming apparatus of claim 10, wherein the magnified image plane comprises an F-Θ lens. 제9항에 있어서, 상기 음향광학변조기(16)와 회전거울(24) 사이에는 여러 비임들의 상호간섬을 방지하여 분리된 비임들을 제공하기 위한 도우브프리즘(17)이 배치되어 있는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.10. A dove prism (17) according to claim 9, characterized in that a dove prism (17) is arranged between the acousto-optic modulator (16) and the rotating mirror (24) to provide separate beams by preventing mutual beams of the various beams. Pattern forming apparatus using a laser. 제9항에 있어서, 상기 음향광학적변조기와 회전거울사이에는 줄렌즈(22)가 배치되어 있는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.10. The pattern forming apparatus of claim 9, wherein a joule lens is disposed between the acoustooptic modulator and the rotating mirror. 방사에너지비임음 발생하는 적어도 하나이상의 레이저원(10)과, 상기 레이저원으로부터 비임을 인가받아 변조된 여러 비임들을 제공하는 변조기수단, 상기 변조기수단으로부터 비임들이 직접 인가되는 여러개의 절단면을 갖춘 회전거울(24), 상기 비임들이 가공물(34)에 직접 주사되도톡 회전거울로부터 비임들을 인가받아 가공물에 비임을 집속시키기 위한 집속수단, 주사방향으로 이동되는 테이블 및, 주사방향인 수직방향에 수직방향으로 이동되는 테이블상에 설치되어 가공물(34)이 수납되는 부품호울더로 이루어져서 상기 방사감지필름을 갖춘 가공물이 상기 회전거울과 부품호울더에 의해 래스터 주사형태로 조사되도록 된 레이저를 이용한 패턴형성장치.A rotating mirror having at least one laser source 10 for generating radiation energy beams, modulator means for providing different beams modulated by the beam from the laser source, and a plurality of cutting planes from which the beams are directly applied from the modulator means (24), focusing means for focusing the beam on the workpiece by receiving the beams from the rotating mirror so that the beams are directly injected into the workpiece 34, a table moved in the scanning direction, and perpendicular to the vertical direction in the scanning direction The pattern forming apparatus using a laser is installed on the table to be moved is made of a component holder for receiving the workpiece 34 so that the workpiece with the radiation sensing film is irradiated in the raster scan form by the rotating mirror and the component holder. 제l6항에 있어서, 상기 회전거울의 절단면에 일치하는 동기화신호를 제공하기 위해 회전거울(24)로부터 절단면 검파기(67)까지 비임을 반사하도록 된 비임분할기(28)가 갖추어져 이루어진 것을 특징으로 하는 레이저를 이용한 패턴형성장치.A laser according to claim 6, characterized in that a beam splitter (28) is provided which reflects the beam from the rotating mirror (24) to the cutting plane detector (67) in order to provide a synchronization signal corresponding to the cutting plane of the rotating mirror. Pattern forming apparatus using. 제16항에 있어서, 적어도 하나이상 여러개의 비임들은 상기 가공물의 위치표시를 제공하기 위해 비임분할기(28)에서 반사되어지는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.17. The apparatus of claim 16, wherein at least one of the multiple beams is reflected at the beam splitter (28) to provide an indication of the location of the workpiece. 제16항에 있어서, 상기 부품호울더에는 부품호울더내에서 이동되어지는 제1거울(88)과 주사방향에 수직방향으로 상기 부품호울더의 이동을 검지하는 제1차등간섬계(89)가 설치되어 있는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.17. The component holder according to claim 16, wherein the component holder includes a first mirror 88 which is moved in the component holder and a first differential interstitial system 89 for detecting the movement of the component holder in a direction perpendicular to the scanning direction. Pattern forming apparatus using a laser, characterized in that provided. 제16항에 있어서, 상기 부품호울더에는 부품호울더내에서 이동되어지는 제2거울(92)과 주사방향으로 상기 부품 호울더의 이동을 검지하는 제2차등간섬계(94)가 설치되어 있는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.17. The component holder according to claim 16, wherein the component holder is provided with a second mirror 92 which is moved within the component holder and a second differential interstitial system 94 for detecting the movement of the component holder in the scanning direction. Pattern forming apparatus using a laser, characterized in that. 방사에너지비임을 발생하는 레이저원(10)과, 상기 레이저원에 광학적으로 연결되어 비임을 여러개의 비임들로 분할시키는 비임분할기(13), 상기 비임분할기에 광학적으로 연결되어 상기 각 비임들을 독립적으로 변조시키는 음향광학적변조기(16), 상기 음향광학적변조기로부터 비임들이 직접 인가되는 여러개의 절단면을 갖춘 회전거울(24), 상기 회전거울로부터 비임들을 인가받아 가공물(34)상에 비임,을 집속시키기 위한 집속수단 및, 주사방향에 수직방향으로 이동하고 가공물이 설치된 부품호울더로 이루어지어 상기 방사감지필름을 갖춘 가공물이 상기 회전거울과 부품호울더의 이용에 의해 래스터 주사형태로 조사되도록 된 레이저를 이용한 패턴형성장치.A laser source 10 generating a radiation energy beam, a beam splitter 13 optically connected to the laser source to split the beam into a plurality of beams, and optically connected to the beam splitter independently of the respective beams Acoustic optical modulator 16 to modulate, a rotating mirror 24 having a plurality of cutting planes from which the beam is applied directly from the acousto-optic modulator, for applying beams from the rotating mirror to focus beams on the workpiece 34. Focusing means and a component holder moved in a direction perpendicular to the scanning direction and the workpiece is installed, so that the workpiece with the radiation sensing film is irradiated in the raster scan form by the use of the rotating mirror and the component holder. Pattern Forming Device. 제21항에 있어서, 상기 부품호울더는 주사방향으로 이동되어지는 테이블상에 설치되는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.22. The pattern forming apparatus of claim 21, wherein the component holder is installed on a table which is moved in the scanning direction. 제21항에 있어서, 상기 회전거울의 절단면에 일치하는 동기화신호를 제공하기 위해 회전거울(24)로부터 절단면검파기(67)까지 비임을 반사하도록 된 비임분할기(28)가 갖추어 이루어진 것을 특징으로 한 레이저를 이용한 패턴형성장치.22. A laser as claimed in claim 21, characterized in that it comprises a beam splitter (28) adapted to reflect the beam from the rotating mirror (24) to the cut detector (67) in order to provide a synchronization signal corresponding to the cut surface of the rotating mirror. Pattern forming apparatus using. 제21항에 있어서, 적어도 하나이상 여러개의 비임들이 상기 가공물의 위치표시를 제공하기 위해 비임분할기(28)에사 반사되도록 된 것을 특징으로 하는 레이저를 이용한 패턴형성장치.22. The apparatus of claim 21, wherein at least one or more of the plurality of beams are adapted to be reflected off the beam splitter (28) to provide an indication of the location of the workpiece. 제21항에 있어서, 상기 부품호울더에는 부품호울더내에서 이동되어지는 제I거울(88)과 주사방향에 수직방향으로 상기 부품호울더의 이동을 검지하는 제1차등 간섭계(89)가 설치되어 있는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.22. The component holder according to claim 21, wherein the component holder is provided with a first mirror 88 which is moved in the component holder and a first differential interferometer 89 for detecting the movement of the component holder in a direction perpendicular to the scanning direction. Pattern forming apparatus using a laser, characterized in that. 제21항에 있어서, 상기 부품호울더에는 부품호울더내에서 이동되어지는 제2거울(92)과 주사방향으로 상기 부품호울더의 이동을 검지하는 제2차등 간섭계(94)가 설치되어 있는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.22. The component holder according to claim 21, wherein the component holder is provided with a second mirror 92 which is moved in the component holder and a second differential interferometer 94 for detecting the movement of the component holder in the scanning direction. Pattern forming apparatus using a laser. 제21항에 있어서, 상기 회전거울과 가공물 사이에는 확대영상평면이 놓여지는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.22. The pattern forming apparatus of claim 21, wherein an enlarged image plane is placed between the rotating mirror and the workpiece. 제27항에 있어서, 상기 확대영상평면에는 회전거울의 절단면에 일치하는 동기화신호를 제공하기 위해 회전거울로부터 절단면검파기(67)까지 비임을 반사하도록 된 분할기(28)가 갖추어 이루어진 것을 특징으로 하는 레이저를 이용한 패턴헝성장치.28. The laser of claim 27, wherein the enlarged image plane comprises a splitter 28 adapted to reflect the beam from the rotating mirror to the cut detector 67 to provide a synchronization signal corresponding to the cut surface of the rotating mirror. Pattern cleaning device using. 제28항에 있어서, 적어도 하나 이상 여러개의 상기 비임들은 상기 가공물의 위치표시를 제공하기 위배 비임분할기(28)에서 반사되어지는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.29. The apparatus of claim 28, wherein at least one or more of the plurality of beams are reflected at a beam splitter (28) to provide an indication of the location of the workpiece. 제27항에 있어서, 상기 확대영상평면은 F-Θ렌즈(26)를 갖추어 이루어진 것을 특징으로 하는 레이저를 이용한 패턴형성장치.28. The pattern forming apparatus of claim 27, wherein the magnified image plane comprises an F-Θ lens. 제21항에 있어서, 상기 회전거울과 음향광학적변조기 사이에는 여러 비임들의 상호간섭을 방지하여 분리된 비임들을 제공하기 위한 도우브 프리즘(17)이 배치되어 있는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.22. The pattern forming apparatus according to claim 21, wherein a dove prism (17) is disposed between the rotating mirror and the acoustic optical modulator to provide mutually separated beams to prevent mutual interference of the beams. . 제21항에 있어서, 상기 회전거울과 음향광학적변조기 사이에는 줄렌즈(22)가 배치되어 있는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.22. The pattern forming apparatus of claim 21, wherein a joule lens is disposed between the rotating mirror and the acoustic optical modulator. 제21항에 있어서, 상기 회전거울과 음향광학적변조기 사아에는 조향거울(20)이 배치되어 있는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.22. The pattern forming apparatus according to claim 21, wherein a steering mirror (20) is disposed in the rotating mirror and the acoustic optical modulator. 방사에너지 비임을 발생하는 적어도 하나이상의 레이저원(10)과, 상기 레이저원으로부터 비임을 인가받아 변조된 여러 비임들을 제공하는 변조기수단, 상기 변조기수단으로부터 비임들을 인가받아 비임들 사이의 상호간섭을 방지하여 분리된 비임들을 제공하는 도우브프리즘(17), 상기 도우브프리즘으로부터 비임들이 직접 인가되는 여러개의 절단면을 갖춘 회전거울 및, 상기 회전거울로부터 비임들을 인가받아 가공물에 비임들을 집속시키기 위한 집속수단으로 이루어져서 회전거울에 의해 방사감지필름을 갖춘 가공물에 여러 비임들을 주사하도록 된 레이저를 이용한 패턴형성장치.At least one laser source 10 generating radiation beams, modulator means for providing multiple beams modulated by the beam from the laser source, and receiving beams from the modulator means to prevent mutual interference between the beams A dove prism 17 providing separate beams, a rotating mirror having a plurality of cutting planes to which the beams are directly applied from the dove prism, and a focusing means for focusing the beams on the workpiece by receiving the beams from the rotating mirror; The pattern forming apparatus using a laser to scan a plurality of beams to the workpiece with a radiation sensing film by a rotating mirror. 제34항에 있어서, 상기 회전거울과 가공물 사이에는 확대영상평면이 놓여지는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.35. The pattern forming apparatus of claim 34, wherein an enlarged image plane is placed between the rotating mirror and the workpiece. 제35항에 있어서, 상기 확대영상평면에는 회전거울의 절단면에 일치하는 동기화신호를 제공하기 위해 회전거울로부터 절단면 검파기까지 비임을 반사하도록 된 분할기(28)가 갖추어져 있는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.36. The pattern as recited in claim 35, wherein said enlarged image plane is provided with a divider (28) adapted to reflect the beam from the rotating mirror to the cut detector to provide a synchronization signal that matches the cut surface of the rotating mirror. Forming device. 제35항에 있어서, 적어도 하나이상 여래개의 상기 비임들은 상기 작업판의 위치표시를 제공하기 위해 비임분할기에서 반사되어지는 것을 특징으로 하는 레이저를 이용한 패턴형성장치.36. The pattern forming apparatus of claim 35, wherein at least one or more of the beams are reflected at the beam splitter to provide an indication of the position of the working plate. 제35항에 있어서, 상기 확대영상평면은 F-Θ렌즈(26)를 갖추어 이루어진 것을 특징으로 하는 레이저를 이용한 패턴형성장치.36. The pattern forming apparatus of claim 35, wherein the magnified image plane comprises an F-Θ lens. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019860003730A 1985-07-24 1986-05-13 Laser pattern generation apparatus KR940008359B1 (en)

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GB2178548A (en) 1987-02-11
JPH05297318A (en) 1993-11-12
JPH0658873B2 (en) 1994-08-03
JPS6226819A (en) 1987-02-04
GB2178548B (en) 1989-08-09
CA1243427A (en) 1988-10-18
KR940008359B1 (en) 1994-09-12
FR2585480B1 (en) 1994-01-07
FR2585480A1 (en) 1987-01-30
GB8609685D0 (en) 1986-05-29

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