KR860002864A - 패턴 형성 방법 - Google Patents
패턴 형성 방법Info
- Publication number
- KR860002864A KR860002864A KR1019850006265A KR850006265A KR860002864A KR 860002864 A KR860002864 A KR 860002864A KR 1019850006265 A KR1019850006265 A KR 1019850006265A KR 850006265 A KR850006265 A KR 850006265A KR 860002864 A KR860002864 A KR 860002864A
- Authority
- KR
- South Korea
- Prior art keywords
- formation method
- pattern formation
- pattern
- formation
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP191448 | 1984-09-14 | ||
JP59191448A JPS6170720A (ja) | 1984-09-14 | 1984-09-14 | パタ−ン形成方法 |
JP19920 | 1985-02-06 | ||
JP60019920A JPH0727216B2 (ja) | 1985-02-06 | 1985-02-06 | パタ−ン形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR860002864A true KR860002864A (ko) | 1986-04-30 |
KR930010248B1 KR930010248B1 (ko) | 1993-10-15 |
Family
ID=26356803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019850006265A KR930010248B1 (ko) | 1984-09-14 | 1985-08-29 | 패턴 형성 방법 |
Country Status (2)
Country | Link |
---|---|
US (1) | US4835089A (ko) |
KR (1) | KR930010248B1 (ko) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5275920A (en) * | 1989-04-24 | 1994-01-04 | Siemens Aktiengesellschaft | Method of dry development utilizing quinone diazide and basic polymer resist with latent image intensification through treatment with silicon-organic compound in water |
ES2043289T3 (es) | 1989-09-25 | 1993-12-16 | Schneider Usa Inc | La extrusion de capas multiples como procedimiento para hacer balones de angioplastia. |
US5275913A (en) * | 1990-05-08 | 1994-01-04 | Industrial Technology Research Institute | Method for preparing resist patterns utilizing solvent development with subsequent resist pattern transfer, via a photo-hardening liquid adhesive, to a receiver substrate and oxygen reactive ion etching |
US5472488A (en) * | 1990-09-14 | 1995-12-05 | Hyundai Electronics America | Coating solution for forming glassy layers |
US5100503A (en) * | 1990-09-14 | 1992-03-31 | Ncr Corporation | Silica-based anti-reflective planarizing layer |
US5527872A (en) * | 1990-09-14 | 1996-06-18 | At&T Global Information Solutions Company | Electronic device with a spin-on glass dielectric layer |
US5304453A (en) * | 1991-07-11 | 1994-04-19 | Industrial Technology Research Institute | Method for preparing resist patterns through image layer transfer to a receiver substrate, via a photo-hardening organic liquid adhesive, with subsequent oxygen reactive ion etching |
DE19623891A1 (de) * | 1996-06-06 | 1997-12-11 | Micro Resist Technology Ges Fu | Lichtempfindlicher, wäßrig-alkalisch entwickelbarer, negativ arbeitender Resist |
JP3093720B2 (ja) * | 1998-04-08 | 2000-10-03 | 松下電子工業株式会社 | パターン形成方法 |
JP4654544B2 (ja) * | 2000-07-12 | 2011-03-23 | 日産化学工業株式会社 | リソグラフィー用ギャップフィル材形成組成物 |
US20040126766A1 (en) * | 2002-12-26 | 2004-07-01 | Amorese Douglas A. | Breakaway seal for processing a subarray of an array |
EP1586945B1 (en) * | 2002-12-26 | 2015-07-29 | Nissan Chemical Industries, Ltd. | Alkali-soluble gap filling material forming composition for lithography |
JP6404757B2 (ja) | 2015-03-27 | 2018-10-17 | 信越化学工業株式会社 | レジスト下層膜材料用重合体、レジスト下層膜材料、及びパターン形成方法 |
JP2021530732A (ja) * | 2018-07-09 | 2021-11-11 | アプライド マテリアルズ インコーポレイテッドApplied Materials, Incorporated | ライン倍増のためのフォトレジスト組成物 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2937085A (en) * | 1954-01-11 | 1960-05-17 | Ditto Inc | Composite photosensitive plate, and method of making printing plate therefrom |
US2852379A (en) * | 1955-05-04 | 1958-09-16 | Eastman Kodak Co | Azide resin photolithographic composition |
US3873313A (en) * | 1973-05-21 | 1975-03-25 | Ibm | Process for forming a resist mask |
US4125650A (en) * | 1977-08-08 | 1978-11-14 | International Business Machines Corporation | Resist image hardening process |
DE2948324C2 (de) * | 1978-12-01 | 1993-01-14 | Hitachi, Ltd., Tokio/Tokyo | Lichtempfindliches Gemisch, enthaltend eine Bisazidverbindung, und Verfahren zur Bildung von Mustern |
US4554237A (en) * | 1981-12-25 | 1985-11-19 | Hitach, Ltd. | Photosensitive resin composition and method for forming fine patterns with said composition |
US4407850A (en) * | 1982-01-11 | 1983-10-04 | The Perkin-Elmer Corporation | Profile control photoresist |
US4427713A (en) * | 1983-01-17 | 1984-01-24 | Rca Corporation | Planarization technique |
US4551409A (en) * | 1983-11-07 | 1985-11-05 | Shipley Company Inc. | Photoresist composition of cocondensed naphthol and phenol with formaldehyde in admixture with positive o-quinone diazide or negative azide |
JPS60115222A (ja) * | 1983-11-28 | 1985-06-21 | Tokyo Ohka Kogyo Co Ltd | 微細パタ−ン形成方法 |
US4631249A (en) * | 1984-01-16 | 1986-12-23 | Rohm & Haas Company | Process for forming thermally stable negative images on surfaces utilizing polyglutarimide polymer in photoresist composition |
US4532005A (en) * | 1984-05-21 | 1985-07-30 | At&T Bell Laboratories | Device lithography using multi-level resist systems |
-
1985
- 1985-08-29 KR KR1019850006265A patent/KR930010248B1/ko not_active IP Right Cessation
-
1987
- 1987-06-10 US US07/060,323 patent/US4835089A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR930010248B1 (ko) | 1993-10-15 |
US4835089A (en) | 1989-05-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20011004 Year of fee payment: 9 |
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LAPS | Lapse due to unpaid annual fee |