KR860002838A - 전기, 전자회로 피복매설 방법 - Google Patents

전기, 전자회로 피복매설 방법 Download PDF

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Publication number
KR860002838A
KR860002838A KR1019850007133A KR850007133A KR860002838A KR 860002838 A KR860002838 A KR 860002838A KR 1019850007133 A KR1019850007133 A KR 1019850007133A KR 850007133 A KR850007133 A KR 850007133A KR 860002838 A KR860002838 A KR 860002838A
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KR
South Korea
Prior art keywords
ethylene
vulcanizing agent
copolymer
circuit
composition
Prior art date
Application number
KR1019850007133A
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English (en)
Other versions
KR930002949B1 (ko
Inventor
에이. 죤슨(외 1) 콘스탄스
Original Assignee
더블유. 제이. 팔머
유니로열 인코퍼레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 더블유. 제이. 팔머, 유니로열 인코퍼레이티드 filed Critical 더블유. 제이. 팔머
Publication of KR860002838A publication Critical patent/KR860002838A/ko
Application granted granted Critical
Publication of KR930002949B1 publication Critical patent/KR930002949B1/ko

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/06Insulating conductors or cables
    • H01B13/12Insulating conductors or cables by applying loose fibres
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/14Peroxides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Paints Or Removers (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

내용 없음

Description

전기, 전자회로 피복매설 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (9)

  1. 가)(ⅰ)분자량 약 500 내지 약 20000을 가지는 에틸렌-알파-올레핀 공중합체 및 (ⅱ)가황제로서 이루어지는 조성물을 회로에 공급하고, 나)수득되는 구조물을 경화조건에 노출하는 것으로 구성되는 회로를 피복매설하는 방법 및 그 조성물.
  2. 제1항의 방법에서 상기 공중합체가 에틸렌-프로필렌-비 공액 디엔 삼중합체인 것.
  3. 제2항의 방법에서 상기 가황제가 유기과산화물 또는 하이드로퍼옥사이드 인것.
  4. 제1항의 방법에서 상기 조성물이 상기 가황제에 조제를 추가로 함유하는 것.
  5. 상기 비 공액 디엔은 1.4-핵사디엔, 디시클로펜타디엔 및 5-에틸리덴-2-노르보르넨으로 구성되는 그룹에서 선택한 것인 제2항의 방법.
  6. 가)회로 및 나) i) 약 500 내지 약 20000의 분자량을 가지는 에틸렌-알파-올래핀공중합체와 ⅱ)가항제를 함유하는 끼워묻는 조성물로 구성되는 피복매설된 구조물.
  7. 상기 공중합체는 에틸렌-프로필렌 공중합체 또는 에틸렌-프로필렌-비 공액 디엔 터폴리머인 제6항의 끼워묻힌 조성물.
  8. 상기 가황제는 유기 과산화물 또는 하이드로 퍼옥사이드인 제7항의 피복매설 구조물.
  9. 상기 조성물이 조제를 상기 가황제에 추가로 함유하는 제6항의 피복매설 구조물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019850007133A 1984-09-27 1985-09-27 전기, 전자회로 피복 매설방법 KR930002949B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/655,479 US4587140A (en) 1984-09-27 1984-09-27 Method for embedding electrical and electronic circuitry
US655479 1984-09-27

Publications (2)

Publication Number Publication Date
KR860002838A true KR860002838A (ko) 1986-04-30
KR930002949B1 KR930002949B1 (ko) 1993-04-15

Family

ID=24629047

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850007133A KR930002949B1 (ko) 1984-09-27 1985-09-27 전기, 전자회로 피복 매설방법

Country Status (10)

Country Link
US (1) US4587140A (ko)
EP (1) EP0177220B1 (ko)
JP (1) JPS61116706A (ko)
KR (1) KR930002949B1 (ko)
AU (1) AU577618B2 (ko)
BR (1) BR8504699A (ko)
CA (1) CA1242861A (ko)
DE (1) DE3574647D1 (ko)
IN (1) IN164032B (ko)
ZA (1) ZA856972B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4587140A (en) * 1984-09-27 1986-05-06 Uniroyal Chemical Company, Inc. Method for embedding electrical and electronic circuitry
US4830922A (en) * 1986-02-28 1989-05-16 Sparrowhawk Bryan L Removable controlled thickness conformal coating
US4786746A (en) * 1987-09-18 1988-11-22 Pennsylvania Research Corporation Copper electroplating solutions and methods of making and using them
US4948474A (en) * 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods
AU7146896A (en) * 1995-10-10 1997-04-30 Wilhelmus Hermanus Iding Material with radiation-shielding properties
US7902301B2 (en) * 2007-07-30 2011-03-08 Brp Manufacturing Company Encapsulant materials and associated devices
CN102361920A (zh) * 2009-01-23 2012-02-22 肖克科技有限公司 介电组合物

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US900019A (en) * 1908-05-28 1908-09-29 Bostwick Steel Lath Company Metal lathing.
GB1138732A (en) * 1965-04-19 1969-01-01 Gen Electric Crosslinked cable insulation having epr base
GB1347599A (en) * 1971-06-22 1974-02-27 Matsushita Electric Ind Co Ltd Method of making resin encapsulated electrical coil
BE793547A (fr) * 1971-12-29 1973-04-16 Southwire Co Composition murissable a base de polyethylene stabilise par un di(1-methylheptadecyl)-4-alkylphenol et son procede de production
JPS492841A (ko) * 1972-04-20 1974-01-11
US3819592A (en) * 1973-08-27 1974-06-25 Uniroyal Inc Molecular weight regulation of ethylene-alpha-olefin copolymers
US4025706A (en) * 1974-11-27 1977-05-24 Union Carbide Corporation Composition with peroxides and process for avoiding scorching of ethylene polymer composition
US3974132A (en) * 1975-05-15 1976-08-10 Borg-Warner Corporation Process for curing olefin polymers
US4220579A (en) * 1978-04-17 1980-09-02 Uniroyal, Inc. Thermoplastic elastomeric blend of monoolefin copolymer rubber, amorphous polypropylene resin and crystalline polyolefin resin
US4247661A (en) * 1979-12-26 1981-01-27 The B. F. Goodrich Company Thermoplastic polymer blends comprising EP or EPDM polymers and highly crystalline polyallomers
US4373048A (en) * 1980-04-21 1983-02-08 Amp Incorporated High voltage flame retardant EPOM insulating compositions
US4587140A (en) * 1984-09-27 1986-05-06 Uniroyal Chemical Company, Inc. Method for embedding electrical and electronic circuitry

Also Published As

Publication number Publication date
IN164032B (ko) 1988-12-31
CA1242861A (en) 1988-10-11
AU577618B2 (en) 1988-09-29
EP0177220A2 (en) 1986-04-09
DE3574647D1 (de) 1990-01-11
ZA856972B (en) 1986-04-30
BR8504699A (pt) 1986-07-22
AU4761585A (en) 1986-04-10
KR930002949B1 (ko) 1993-04-15
JPS61116706A (ja) 1986-06-04
EP0177220B1 (en) 1989-12-06
EP0177220A3 (en) 1987-05-20
US4587140A (en) 1986-05-06

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