KR850001902Y1 - A supplying device of chip conponents - Google Patents

Abstract

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Description

Chip mounting device

The drawings are all related to the present invention.

1 is a schematic side view showing the entire mounting device of a chip component.

2 is a schematic top view thereof.

3 (a) and 3 (b) are explanatory diagrams showing the operation of the chip component mounting apparatus.

4 is a perspective view of a chip component.

5 is a sectional view of the main portion of the hopper.

6 is the bottom view.

7 is an exploded perspective view of the main portion thereof.

8 (a) and 8 (b) are explanatory diagrams showing the operation of the hopper.

9 to 12 are main cross-sectional and side views showing an embodiment of the alignment roller.

The present invention relates to a chip component mounting apparatus for mounting an electrical component (chip component) having no lead wire among electrical components such as a resistor or a capacitor, in particular. An object of the present invention is to provide a device capable of automatically and efficiently mounting a chip component at a predetermined position on a printed board.

The invention is described according to the embodiment shown in the drawings. FIG. 1 is a schematic side view showing the entire chip mounting device, FIG. 2 is a schematic top view thereof, and FIG. 3 is an explanatory view showing the operation of the chip mounting device. 1 is a hopper in which a plurality of hoppers are disposed above the apparatus, and as shown in FIG. 4, the hopper has a columnar without lead wires having electrode portions Cb formed at both ends of the insulating portion Ca. I) The chip parts C are housed and prepared in accordance with the number of chip parts C to be mounted on the printed board P. FIG. In the figure, six hoppers are provided in two rows, indicating that twelve hoppers 1 are prepared. 2 is a hopper stand positioned above the apparatus to support the hopper 1 freely, 3 is a support member for fixing the positioning plate 4 to the hopper stand 2, and 5 is a chip component formed of plastic ( C) A hollow pipe for supply, the pipe being formed to connect between the hopper stand 2 and the positioning plate 4, so that the chip part C sent out from the hopper 1 is the two pipe 5. It falls so that it may fall to the positioning plate 4 side through the said. 6 is a supporting member for fixing the hopper stand 2 to the base stand 7, 8 is a movable conveying belt, 9 is a large member mounted on the conveying belt 8, and 10 is The lower plate placed on the base member 9, 11 is an upper plate placed on the lower plate 10, and the upper and lower plates 11, 10 are printed like the positioning plate 4, Holes 11a and 10a are provided at positions coinciding with the arrangement of the chip components C on the substrate P. The upper plate 11 is formed of a plate thicker than the lower plate 10, and thus the lower plate. It is formed to be able to move on (10). 12 is a power source which moves the upper side, the lower side plates 11, 10, and the counter member 9 to the positioning plate 4 side. Next, the operation of the apparatus of the present invention will be described with reference to FIGS. 1 and 3, in which the desired chip component C is housed in the hopper 1, and the chip component C is provided from each hopper 1. Each of these is sent out one by one (the delivery mechanism will be described later).

As shown in FIG. 1, the base member 9, the lower and upper side plates 10, 11 are in a polymerized state and lifted by the power source 12 as shown in FIG. It superposes on (4). Next, when one chip part C is sent out from each hopper 1 by a delivery mechanism, the chip part C is guided to the pipe 5, and the hole 11a of the upper side, lower side plates 11, 10 is carried out. ) And (10a). (See also section 3 (a)). Then, the power source 12 is returned to its original position, and the upper side, the lower plate 11, 10 and the counter member 9 are placed on the transfer belt 8, and the transfer belt 8 is moved to apply vibration. After the chip component C is guided to the holes 11a and 10a of the upper and lower plates 11 and 10 and knocked down to the side, that is, the chip component C is turned over sideways, The upper plate 11 is removed from the lower plate 10 (see also third (b)).

Then, as shown in FIG. 3 (b), the chip part C is positioned by the hole 10a of the lower plate 10 and at the same time, a part of the chip part C is protruded from the lower plate 10, which is a thin plate. When the printed circuit board P having the adhesive S coated thereon is polymerized in a position corresponding to the position of the chip component C in advance above the state, the chip component C is attached to the printed circuit board P by the adhesive S. The chip component C is attached and brought into the printed board P. When the printed board P is deposited in the solder bath, the work of attaching the chip component C to the printed board P is completed. And if this process is repeated, the chip component C can be automatically attached to the printed circuit board P. FIG.

Next, according to FIG. 2, a feeding mechanism for discharging the chip parts C stored in the hopper 1 one by one will be described with reference to FIG. 2, and 13 and 13 are drive rollers installed opposite to the hopper 1 in two rows. The two-drive rollers are mounted to be freely rotated by the shafts 14 and 14, and the gears 15 and 16 meshed with one end of each of the driving rollers 13 and 13, respectively. The gears 15, 16 and the drive rollers 13, 13 are always rotated from the drive source 17, such as a motor, via the gear 18, and are fixed. Moreover, each hopper 1 is equipped with the alignment roller 34 and the shutter 41 which are mentioned later, The alignment roller 34 of each hopper 1 always rotates in contact with the driving rollers 13 and 13, And the chip component C in the hopper 1. Moreover, the shutter 41 of each hopper 1 is formed so that it may be interlocked with the shutter drive member 19,19. That is, 20, 20 is a shutter drive cylinder, 21 is connected to the drive member (19), 19, and at the same time as a piston disposed in the cylinder (20), (20) air or in the cylinder (20), (20) When the piston 21 reciprocates by introducing and discharging oil, the cylinders 20 and 20 are operated to move the piston 21 in the direction of arrow X in FIG. 19), 19 move. Then, the shutter 41 of each hopper 1 operates, and one of the chip parts C accommodated in each hopper 1 falls through the pipe 5. Then, by operating the cylinders 20 and 20 to return the piston 21 to its original position, each shutter 41 also returns to its original position. When the above operation is repeated, one chip component C is sent out from each hopper 1.

Next, the detailed configuration and operation of the hopper 1 will be described with reference to FIGS. 5 to 8. Denoted at 30 is a main body formed of metal. A funnel 30a is provided above the main body, and a cutout 30b extending to the center is provided at the side. An air hole 30c is provided inside. 31 denotes an outer cylinder portion fixed to the upper portion of the main body portion 30 with a screw 32, and 33 is a lid for blocking the upper portion of the outer cylinder portion 31, and formed of the outer cylinder portion 31 and the funnel portion 30a of the main body portion 30. The chip part C is accommodated in the hollow part which becomes. 34 is an alignment roller having a convex portion 34a provided at the center of the outer circumference and a friction member 34b provided at the outer circumference, the alignment roller being located within the cutout portion 30b of the main body portion 34. While being mounted so as to be freely rotated downward by the support shaft 35 to the main body portion 30, a part of the alignment roller 34 protrudes out from the cutout portion 30b, and the driving roller 13 It is intended to be in contact with. 36 is a sealing member which is located in the cutout part 30b of the main-body part 30, and is fixed to the outer cylinder part 31 with the screw 32, This sealing member is the upper part of the alignment roller 34. The cutout portion 30b is sealed to prevent the chip component C from falling off and to expose a part of the alignment roller 34 in the funnel portion 30a. 37 has a hole 37c for air and has a shutter (top plate, which has an alignment pipe 38 mounted at the center thereof, and a lower portion of the shutter top plate has a yaw portion 37d crossing the center portion. 39 is a groove portion. A shutter lower plate having a chip part (C) insertion hole 39b and an air hole 39e provided in the bottom portion of the groove portion 39a and 9a. 39 is polymerized below the main body portion 30, and the screw 40 is inserted into the holes 37a and 39c to be screwed into the main body portion 30. At this time, the alignment is performed as shown in FIG. The tip of the pipe 38 is opposed to the groove 34a of the alignment roller 34. 41 is housed in the groove 39a of the shutter lower plate 39, between the shutter upper plate 37 and the lower plate 39. The shutter is movably mounted, and the shutter has a hole 41a and a chip part (C) insertion hole 41b, and the hole 41a of the shutter 41 has a hole 37b of the shutter upper plate 37. Stopper fixed to the main body 30 through A 42 is inserted to limit the moving range of the shutter 41. 43 is a spring fixed to the shutter upper plate 37 with a screw 44, which is the groove 39a of the shutter lower plate 39. Located in the inside, the shutter 41 is always pushed in one direction so that a part of the shutter 41 protrudes from the groove 39a, and the shutter drive member 19 is brought into contact with the shutter 41.

In order to attach the hopper 1 comprised in this way to the hopper stand 2, as shown in FIG. 7, the protrusions 39d and 39d provided in the shutter lower plate 39 are made into the projections of the hopper stand 2 ( 2a) and (2a), the main body portion 30, the shutter upper plate 37, 39 is made of metal, so that when mounted in a heavy and stable state and at the same time, the shutter lower plate 39 Chip part insertion hole 39b and the chip part insertion hole 2b of the hopper stand 2 and the air hole 39e of the shutter lower plate 39 and the air hole 2c of the hopper stand 2. Becomes a matched state. And when removing the hopper 1 from the hopper stand 2, only the hopper 1 needs to be lifted.

Next, the operation of the hopper 1 will be described. First, a plurality of chip parts C are stored in the hollow portion formed by the outer cylinder portion 31 and the funnel portion 30a, and then the alignment roller 34 is shown in FIG. In the Y direction (counterclockwise). The alignment roller 34 is rotated by the driving roller 13, but when the alignment roller 34 rotates, the chip component C is moved upward by the friction member 34b installed on the alignment roller 34. The chip component C is scraped up so that the chip component C is not concentrated at the distal end of the pipe 38 for alignment, and the chip component C is inserted into the groove 34a of the alignment roller 34 to be aligned. The chip parts C, which are in the aligned state, fall sequentially into the alignment pipe 38.

8 (a) is an enlarged view of the main portion thereof, and since the chip parts C first dropped are aligned with the alignment pipe 38 and the chip part insertion holes 41b of the shutter 41, the shutter 41 is used. The chip part C is inserted into the hole 41b for insertion, and one end of the chip part C comes into contact with the lower shutter plate 39, and the chip part C dropped thereafter is aligned with the pipe 38 for alignment. The chip parts C are first dropped in the stack, and in the alignment pipe 38, the chip parts C are sequentially stacked in a row.

Next, the shutter 41 is moved in the arrow Z direction against the spring 43. When the shutter 41 is driven by the shutter driving member 19, it operates until one end of the hole 41a of the shutter 41 is engaged with the stopper pin 42. As shown in Fig. 2A, the chip component C inserted into the chip component insertion hole 41b is transported to a position corresponding to the chip component insertion hole 39b of the shutter lower plate 39. Then, the chip part C falls through the chip part insertion hole 39b of the shutter lower plate 39. At this time, the next chip component C is in contact with the upper portion of the shutter 41. When the shutter 42 operates again, it is in contact with the air hole 39e of the shutter lower plate 39 and the upper portion of the shutter 41. When the shutter 41 is operated again, the air hole 39e of the shutter lower plate 39 and the hole 41a of the shutter 41 coincide with each other so that the shutter upper plate 37 and the air hole 37c of the main body part 30. ) And 30c coincide with each other, and compressed air is blown out to the funnel portion 30a through the air hole 39e of the shutter lower plate 39 to disperse the chip component C. Further, when the shutter drive member 19 is released, the shutter 41 returns to the original position where the other end of the hole 41a of the shutter 41 is returned to the stopper pin 42 by the spring 43, and the shutter ( The chip part insertion hole 41b of 41 is in the state of FIG. 8 (a) in which the new chip part C is inserted.

At this time, the chip part insertion hole 39b of the shutter lower plate 39 is blocked by the shutter 41 to prevent the chip part C from falling off when the hopper 1 is removed from the hopper stand 2. At the same time, the air hole 39e of the shutter lower plate 39 is also blocked by the shutter 41 to prevent the compressed air from entering the funnel portion 30a. Therefore, by the reciprocating motion of the shutter 41, the chip parts C come out of the hopper 1 one by one, and compressed air is intermittently blown out to the funnel 30a. In addition, since the length of the chip component C may not be constant due to manufacturing errors, the height of the upper surface of the lower shutter plate 39 and the bottom of the recessed portion 37d of the shutter upper plate 37 in FIG. (T) is slightly larger than the maximum length of the chip component C, and the height t between the upper surface of the shutter 41 and the upper surface of the lower shutter plate 39 is slightly smaller than the minimum length of the chip component C. In addition, the length of the recessed portion 37d provided on the shutter top plate 37 is sufficiently larger than the moving length of the shutter 41 so that both end surfaces thereof do not come into contact with the chip component C when the shutter 41 moves. have.

Therefore, even if the shutter 41 is moved, the chip component C located in the chip component insertion hole 41b of the shutter 41 is caught by the alignment pipe 38 that is a hole for inserting the chip component of the shutter upper plate 37. The chip component C located in the alignment pipe 38 of the shutter upper plate 37 is formed of the chip part insertion hole 41b of the shutter 41 and the recessed portion 37d of the shutter upper plate 37. It is possible to smoothly move the shutter 41 without causing both edges and without causing cracking or cracking of the chip component C.

9 to 12 show an embodiment of the alignment roller 34, and FIG. 9 shows a friction member 34b formed by installing an iron part integral with the alignment roller 34 in the groove 34a. FIG. 10 is an outer periphery and grooves 34a, which are integrally formed with the alignment roller 34 and convex portions to form a friction member 34b, and FIG. 11 shows rubber or metal in the groove of the alignment roller 34. The friction member 34b is formed by providing a thin plate such as a back plate. FIG. 12 shows the friction member 34b by forming a thin wire such as the above-described thin plate and metal or plastic. When the alignment roller 34 rotates by 34b, the chip component C can be scraped upward.

In addition, of course, this friction member 34b can apply various structures and shapes other than the above-mentioned. That is, according to the present proposal, the rotary alignment roller 34 allows the chip component C to be scraped up and at the same time the compressed air is intermittently ejected into the outer cylinder portion 31 by the reciprocating motion of the shutter 41. By preventing the concentration of the chip component C at the distal end of the pipe 38 and ensuring the supply of the chip component C to the shutter 41, the automatic mounting of the chip component C is particularly effective. It is characterized by being suitable for the device.

Claims (1)

Arrangement rollers 34 rotatably installed to scrape up chip components are placed in the vicinity of a cylinder portion capable of storing a plurality of chip components, and the alignment rollers 34 are addressed and an alignment pipe 38 is arranged. In the apparatus in which the shutters 41 for discharging the chip parts C one by one are arranged at one end of the alignment pipe 38, compressed air intermittently into the tube by the reciprocating motion of the shutter 41. An apparatus for mounting chip components, characterized in that it consists of a leopard formed with air holes (30c), (37c), and (39e) for blowing air.