KR830010223A - Electroless plating bath regeneration method and regeneration device - Google Patents

Abstract

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Description

Electroless plating bath regeneration method and regeneration device

Since this is an open matter, no full text was included.

1 is an explanatory diagram of the present invention. 2 is a graph showing the recovery rate of EDTA (ethylene diamine tetra acetic acid). 3 is a graph showing the relationship between current density and anode dissolution efficiency. 4 is a graph showing the relationship between the concentration of copper ions (R) and anode dissolution efficiency for EDTA. 5 is a graph showing the relationship between anode electrolyte temperature and anode efficiency.

Claims (16)

Continuously or intermittently removing part or all of the chelating agent containing the copper electroless plating bath from the electroless plating tank and removing the copper ions content from the plating bath: acidifying the solution thus obtained to precipitate the chelating agent. The process of recovering the precipitated chelating agent: When the neutral or alkaline electrolyte solution is supplied to the cathode container, the distribution membrane is an anion and an exchange membrane or a cation exchange membrane. Supplying the above-mentioned recovery chelating agent to the anode vessel having the copper anode separated by the exchange membrane from the cathode vessel that used a direct current in between, followed by recycling the solution into the electroless plating tank in the aforementioned anode vessel. How to regenerate the plating bath. The method for regenerating an electroless plating bath according to claim 1, wherein the copper ions contained in the electroless copper plating bath are precipitated in the form of metal copper or copper oxide and removed out of the plating. The electroless plating bath regeneration method according to claim 2, wherein the aforementioned copper ions are precipitated by adding metal copper to the electroless plating bath. The method for regenerating an electroless plating bath according to claim 2, wherein the precipitation of copper ions is made by alkalizing the electroless plating bath and adding metal copper. The method for regenerating an electroless plating bath according to claim 1, wherein the electroless plating jade is electrolytically deposited on the cathode to remove copper ions from the electroless plating jade. The method for regenerating an electroless plating bath according to claim 1, wherein the chelating agent described above is ethylenediamine tetraacetic acid, tartaric acid, potassium sodium, ethylenediamine, tetramintriethanol amine or diethanolamine. The electroless plating bath regeneration method according to claim 1, wherein the chelating agent is ethylenediaminetetraacetic acid. The method for regenerating an electroless plating bath according to claim 7, wherein the above-mentioned ethylenediamine tetraacetic acid is precipitated by acidifying the above-mentioned solution to pH 4.0 or below after copper ions are removed. The electroless plating bath regeneration method according to claim 8, wherein the aforementioned pH is 2.0 or less. The electroless plating bath regeneration method according to claim 8, wherein the pH described above is 1.0 or less. The electroless plating bath regeneration method according to claim 1, wherein the ion exchange membrane is an anion exchange membrane and an alkaline electrolyte solution is supplied to the negative electrode container. The method for regenerating an electroless plating bath according to claim 1, wherein the ion exchange membrane is a cation exchange membrane. The anode container according to claim 1, wherein the chelating agent is ethylenediamine tetraacetic acid, and after the copper ions are removed, the plating bath is acidified to pH 2.0 or below so that ethylenediamine tetraacetic acid is recovered by precipitation, and copper is used as the anode. And a negative electrode container having a negative electrode and a negative electrode is partitioned by an anion exchange membrane, an alkaline solution is supplied to the negative electrode container, and the recovered ethylene diamine tetraacetic acid is supplied to the positive electrode container. The electroless plating bath regeneration method according to claim 13, wherein the pH of the electrolyte solution contained in the positive electrode container is 7.0 or higher. The method for regenerating an electroless plating bath according to claim 13, wherein the ethylenediamine tetraacetic acid is recovered by acidifying to pH 1.0 or lower after removing copper ions from the plating bath. (A) copper precipitation means for decomposing copper chelate contained in the electroless copper plating bath to precipitate copper ions; (B) recovering means of the chelating agent for changing the pH of the solution to precipitate and recover the chelating agent; (C) An electroless plating bath regeneration apparatus in which a positive electrode container and a negative electrode container are separated by an ion exchange membrane, the positive electrode container has a copper positive electrode, and the negative electrode container is composed of an electrolytic means having a negative electrode. ※ Note: The disclosure is based on the initial application.