KR830000737A - Hot dip plating alloy - Google Patents

Hot dip plating alloy Download PDF

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Publication number
KR830000737A
KR830000737A KR1019790001801A KR790001801A KR830000737A KR 830000737 A KR830000737 A KR 830000737A KR 1019790001801 A KR1019790001801 A KR 1019790001801A KR 790001801 A KR790001801 A KR 790001801A KR 830000737 A KR830000737 A KR 830000737A
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South Korea
Prior art keywords
phosphide
weight
phosphorus
dip plating
lead
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KR1019790001801A
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Korean (ko)
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KR830001328B1 (en
Inventor
마사노리 오오시마
데이지 나가호리
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마사노리 오오시마
데이지 나가호리
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Priority to KR1019790001801A priority Critical patent/KR830001328B1/en
Publication of KR830000737A publication Critical patent/KR830000737A/en
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Publication of KR830001328B1 publication Critical patent/KR830001328B1/en

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/10Lead or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C11/00Alloys based on lead
    • C22C11/06Alloys based on lead with tin as the next major constituent

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Coating With Molten Metal (AREA)

Abstract

내용 없음No content

Description

용융 도금용 연합금Hot dip plating alloy

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음This content is subject to disclosure, so the full text is not included.

Claims (16)

석을 0.3~30.0중량%, 인, 인화석, 인화아연, 인화안티몬, 인화비스무트 및 인화연 중의 적어도 1종 이상을 인함유량으로 0.001~0.3중량% 또 연 불가피 불순물:나머지로서 된 것을 특징으로 하는 용융도금용 연합금.0.3 to 30.0% by weight of stone, phosphorus, phosphite, zinc phosphide, antimony phosphide, bismuth phosphide and lead phosphide, 0.001 to 0.3% by weight as phosphorus content, and lead unavoidable impurities: characterized in that the remainder Alloy for hot-dip plating. 석을 0.3~8중량% 함유하는 것을 특징으로 하는, 특허청구의 범위 제1항 기재의 용융 도금용 연합금.The alloy for hot-dip plating according to claim 1, characterized in that it contains 0.3 to 8% by weight of stone. 인, 인화석, 인화아연, 인화안티몬, 인화비스무트 및 인화연 중의 적어도 1종 이상을 인 함유량으로 0.05~0.3중량% 함유하는 것을 특징으로 하는 특허청구의 범위 제1항 기재의 용융 도금용 연합금.Phosphorus, phosphite, zinc phosphide, antimony phosphide, bismuth phosphide, and lead phosphide, containing 0.05 to 0.3% by weight of phosphorus in terms of phosphorus content. . 석을 0.3~30.0중량%, 인, 인화석, 인화아연, 인화안티놈, 인화비스무트 및 인화연 중의 적어도 1종 이상을 인 함유량으로 0.001~0.3중량%, 아연을 0.1~7.0중량%, 또 연 및 불가피불순물:나머지로서된 것을 특징으로 하는 용융도금용 연합금.0.3 to 30.0% by weight of stone, phosphorus, phosphite, zinc phosphide, antinome phosphide, bismuth phosphide, and lead phosphide in terms of phosphorus content of at least one or more 0.001 to 0.3% by weight, zinc 0.1 to 7.0% by weight, and lead And inevitable impurities: the alloy for hot-dip plating, characterized in that the remainder. 석을 0.3~8중량% 함유하는 것을 특징으로 하는 특허청구의 범위 제4항 기재의 용융 도금을 연합금.The hot-dip plating according to claim 4, characterized in that it contains 0.3 to 8% by weight of stone. 인, 인화석, 인화아연, 인화안티몬, 인화비스무트 및 인화연 중 적어도 1종 이상을 인 함유량으로 0.05~0.3중량% 함유하는 것을 특징으로 하는 특허청구의 범위 제4항 기재의 용융 도금용 연합금.Phosphorus, phosphite, zinc phosphide, antimony phosphide, bismuth phosphide, and lead phosphide, containing 0.05 to 0.3% by weight of phosphorus in terms of phosphorus content. . 아연을 1~6중량% 함유하는 것을 특징으로 하는 특허청구의 범위 제4항 기재의 용유도금용 연합금.The alloy for oil plating according to claim 4, characterized in that it contains 1 to 6% by weight of zinc. 석을 0.3~30.0중량% 인, 인화석, 인화아연, 인화 안티몬, 인화비스무트 및 인화연 중의 적어도 1종 이상을 인 함유량으로 0.001~0.3중량%, 안티몬을 0.5~35.0중량%, 및 연:나머지로서 된 것을 특징으로 하는 용융도금용 연합금.At least one of 0.3 to 30.0 wt% phosphorus, phosphite, zinc phosphide, antimony phosphide, bismuth phosphide, and lead phosphide is 0.001 to 0.3% by weight, antimony 0.5 to 35.0% by weight, and lead: the rest Hot-dip plating alloy, characterized in that the 석을 0.3~8중량% 함유하는 것을 특징으로 하는 특허청구의 범위 제8항 기재의 용융도금용 연합금.The alloy for hot-dip plating according to claim 8, characterized in that it contains 0.3 to 8% by weight of stone. 인, 인화석, 인화아연, 인화안티몬, 인화비스무트 및 인화연 중의 적어도 1종 이상을 인 함유량으로 0.05~0.3중량% 함유하는 것을 특징으로 하는 특허청구의 범위 제8항 기재의 용융도금용 연합금.Phosphorus, phosphite, zinc phosphide, antimony phosphide, bismuth phosphide, and lead phosphide, containing 0.05 to 0.3% by weight of phosphorus in terms of phosphorus content. . 안티몬을 3~10중량% 함유하는 것을 특징으로 하는 특허청구의 범위 제8항 기재의 용융도금용 연합금.The alloy for hot-dip plating according to claim 8, characterized in that it contains 3 to 10% by weight of antimony. 석을 0.3~30.0중량%, 인, 인화석, 인화아연, 인화안티몬, 인화비스무트 및 인화연 중의 적어도 1종이상을 인 함유량으로 0.001~1.3중량%, 아연을 0.1~7.0중량%, 안티몬을 0.5~35.0중량% 연 및 불가피불순물:나머지로서 된 것을 특징으로 하는 용융 도금용 연합금.0.3 to 30.0% by weight of stone, phosphorus, phosphite, zinc phosphide, antimony phosphide, bismuth phosphide, and lead phosphide in terms of phosphorus content of at least one or more 0.001 to 1.3% by weight, zinc 0.1 to 7.0% by weight, antimony 0.5 -35.0% by weight lead and inevitable impurities: hot-dip plating alloy, characterized in that the remainder. 석을 0.3~8중량% 함유하는 것을 특징으로 하는 특허청구의 범위 제12항기재의 용융도금용 연합금.The alloy for hot-dip plating of the claim 12, characterized in that it contains 0.3 to 8% by weight of stone. 인, 인화석, 인화아연, 인화안티몬, 인화비스무트, 및 인화연 중의 적어도 1종 이상을 인함유량으로 0.05~0.3중량% 함유하는 것을 특징으로 하는 특허청구의 범위 제12항 기재의 용융도금용 연합금.Phosphorus, phosphite, zinc phosphide, antimony phosphide, bismuth phosphide, and lead phosphide, containing 0.05 to 0.3% by weight of at least one phosphorus content. gold. 아연을 1~6중량% 함유하는 것을 특징으로 하는 특허청구의 범위 제12항 기재의 용융도금용 연합금.The alloy for hot-dip plating according to claim 12, characterized in that it contains 1 to 6% by weight of zinc. 안티몬을 3~10중량% 함유하는 것을 특징으로 하는 특허청구의 범위 제12항 기재의 용융도금용 연합금.The alloy for hot-dip plating according to claim 12, characterized in that it contains 3 to 10% by weight of antimony. ※ 참고사항:최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed according to the contents of the first application.
KR1019790001801A 1979-06-01 1979-06-01 Hot-Plated Lead Alloys KR830001328B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019790001801A KR830001328B1 (en) 1979-06-01 1979-06-01 Hot-Plated Lead Alloys

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019790001801A KR830001328B1 (en) 1979-06-01 1979-06-01 Hot-Plated Lead Alloys

Publications (2)

Publication Number Publication Date
KR830000737A true KR830000737A (en) 1983-04-18
KR830001328B1 KR830001328B1 (en) 1983-07-09

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