KR20250170581A - 전자 부품용 점착 테이프 - Google Patents

전자 부품용 점착 테이프

Info

Publication number
KR20250170581A
KR20250170581A KR1020257030908A KR20257030908A KR20250170581A KR 20250170581 A KR20250170581 A KR 20250170581A KR 1020257030908 A KR1020257030908 A KR 1020257030908A KR 20257030908 A KR20257030908 A KR 20257030908A KR 20250170581 A KR20250170581 A KR 20250170581A
Authority
KR
South Korea
Prior art keywords
adhesive
electronic components
intermediate layer
adhesive layer
adhesive tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257030908A
Other languages
English (en)
Korean (ko)
Inventor
마사나오 오까모또
Original Assignee
후루카와 덴키 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후루카와 덴키 고교 가부시키가이샤 filed Critical 후루카와 덴키 고교 가부시키가이샤
Publication of KR20250170581A publication Critical patent/KR20250170581A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H01L21/6836—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
    • H01L21/78—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/742—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • H01L2221/68318—
    • H01L2221/68336—
    • H01L2221/68381—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
KR1020257030908A 2023-03-31 2024-03-26 전자 부품용 점착 테이프 Pending KR20250170581A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023059287 2023-03-31
JPJP-P-2023-059287 2023-03-31
PCT/JP2024/011999 WO2024204222A1 (ja) 2023-03-31 2024-03-26 電子部品用粘着テープ

Publications (1)

Publication Number Publication Date
KR20250170581A true KR20250170581A (ko) 2025-12-05

Family

ID=92906624

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257030908A Pending KR20250170581A (ko) 2023-03-31 2024-03-26 전자 부품용 점착 테이프

Country Status (5)

Country Link
JP (1) JPWO2024204222A1 (https=)
KR (1) KR20250170581A (https=)
CN (1) CN120752740A (https=)
TW (1) TW202441605A (https=)
WO (1) WO2024204222A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003338467A (ja) 2002-03-12 2003-11-28 Hamamatsu Photonics Kk 半導体基板の切断方法
JP4927393B2 (ja) 2005-11-30 2012-05-09 古河電気工業株式会社 ダイシングテープ
JP5128575B2 (ja) 2009-12-04 2013-01-23 リンテック株式会社 ステルスダイシング用粘着シート及び半導体装置の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4947564B2 (ja) * 2000-01-21 2012-06-06 日東電工株式会社 半導体ウエハ加工用粘着シート
JP2018050010A (ja) * 2016-09-23 2018-03-29 株式会社ディスコ 加工方法
JP6800062B2 (ja) * 2017-03-28 2020-12-16 古河電気工業株式会社 粘着テープ
JP7010747B2 (ja) * 2018-03-30 2022-01-26 リンテック株式会社 半導体加工用シート
JP6651208B1 (ja) * 2019-05-15 2020-02-19 ハイソル株式会社 ウェハチャック及びチャックリング

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003338467A (ja) 2002-03-12 2003-11-28 Hamamatsu Photonics Kk 半導体基板の切断方法
JP4927393B2 (ja) 2005-11-30 2012-05-09 古河電気工業株式会社 ダイシングテープ
JP5128575B2 (ja) 2009-12-04 2013-01-23 リンテック株式会社 ステルスダイシング用粘着シート及び半導体装置の製造方法

Also Published As

Publication number Publication date
TW202441605A (zh) 2024-10-16
JPWO2024204222A1 (https=) 2024-10-03
WO2024204222A1 (ja) 2024-10-03
CN120752740A (zh) 2025-10-03

Similar Documents

Publication Publication Date Title
KR102762620B1 (ko) 반도체 가공용 시트
JP7326270B2 (ja) 半導体加工用粘着テープおよび半導体装置の製造方法
US7976952B2 (en) Multilayer sheet, production method thereof and pressure-sensitive adhesive sheet using the multilayer sheet
CN101070454B (zh) 用于加工半导体晶片或半导体基材的压敏粘着片
EP3007212B1 (en) Semiconductor wafer protection film and production method for semiconductor device
EP1752507A1 (en) Pressure-sensitive adhesive sheet and process for preparing it
TW202016234A (zh) 半導體加工用黏著帶及半導體裝置的製造方法
JP2011018669A (ja) 半導体ウェハダイシング用粘着シート及び該粘着シートを用いる半導体ウェハのダイシング方法
KR20100045530A (ko) 다이싱ㆍ다이 본드 필름
JP6437431B2 (ja) 半導体チップの製造方法
JP4367769B2 (ja) 半導体ウエハ保持保護用粘着シートおよび半導体ウエハの裏面研削方法
JP2008060151A (ja) 半導体ウエハ裏面加工方法、基板裏面加工方法、及び放射線硬化型粘着シート
KR102927953B1 (ko) 점착 테이프
JPWO2019181731A1 (ja) 粘着テープおよび半導体装置の製造方法
KR102929215B1 (ko) 반도체 가공용 보호 시트 및 반도체 장치의 제조 방법
KR20070027465A (ko) 점착 시트 및 이 점착 시트를 이용한 제품의 가공 방법
KR20200110207A (ko) 접착 필름을 구비하는 다이싱 테이프
KR102929214B1 (ko) 반도체 가공용 보호 시트 및 반도체 장치의 제조 방법
JP2023013023A (ja) 電子部品用粘着テープ
JP7832174B2 (ja) 半導体加工用粘着テープおよび半導体装置の製造方法
KR20200107833A (ko) 다이싱 테이프 및 접착 필름을 구비한 다이싱 테이프
JP2007221054A (ja) 半導体ウエハ加工用保護シート、及びそれを用いた半導体ウエハの加工方法
KR20250170581A (ko) 전자 부품용 점착 테이프
JP2023013022A (ja) 電子部品用粘着テープ
KR20250134639A (ko) 전자 부품용 점착 테이프

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE)

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000