KR20240157734A - 수지 조성물, 경화물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 프린트 배선판, 및, 반도체 장치 - Google Patents
수지 조성물, 경화물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 프린트 배선판, 및, 반도체 장치 Download PDFInfo
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- KR20240157734A KR20240157734A KR1020247033053A KR20247033053A KR20240157734A KR 20240157734 A KR20240157734 A KR 20240157734A KR 1020247033053 A KR1020247033053 A KR 1020247033053A KR 20247033053 A KR20247033053 A KR 20247033053A KR 20240157734 A KR20240157734 A KR 20240157734A
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- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- XAEWLETZEZXLHR-UHFFFAOYSA-N zinc;dioxido(dioxo)molybdenum Chemical compound [Zn+2].[O-][Mo]([O-])(=O)=O XAEWLETZEZXLHR-UHFFFAOYSA-N 0.000 description 1
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/36—Amides or imides
- C08F222/40—Imides, e.g. cyclic imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L39/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Reinforced Plastic Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022038646 | 2022-03-11 | ||
| JPJP-P-2022-038646 | 2022-03-11 | ||
| PCT/JP2023/007986 WO2023171554A1 (ja) | 2022-03-11 | 2023-03-03 | 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20240157734A true KR20240157734A (ko) | 2024-11-01 |
Family
ID=87935374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247033053A Pending KR20240157734A (ko) | 2022-03-11 | 2023-03-03 | 수지 조성물, 경화물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 프린트 배선판, 및, 반도체 장치 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2023171554A1 (enrdf_load_stackoverflow) |
| KR (1) | KR20240157734A (enrdf_load_stackoverflow) |
| CN (1) | CN118891299A (enrdf_load_stackoverflow) |
| TW (1) | TW202348646A (enrdf_load_stackoverflow) |
| WO (1) | WO2023171554A1 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2024090410A1 (enrdf_load_stackoverflow) * | 2022-10-26 | 2024-05-02 | ||
| KR20250096750A (ko) * | 2022-10-26 | 2025-06-27 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 경화물, 프리프레그, 금속박 피복 적층판, 수지 복합 시트, 및, 프린트 배선판 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020054601A1 (ja) | 2018-09-12 | 2020-03-19 | 日本化薬株式会社 | マレイミド樹脂、硬化性樹脂組成物およびその硬化物 |
| WO2021182360A1 (ja) | 2020-03-11 | 2021-09-16 | 日本化薬株式会社 | マレイミド樹脂およびその製造方法、マレイミド溶液、並びに、硬化性樹脂組成物およびその硬化物 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113490715A (zh) * | 2019-02-28 | 2021-10-08 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料、覆金属箔层叠板、树脂复合片及印刷电路板 |
| JP7513587B2 (ja) * | 2019-02-28 | 2024-07-09 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板 |
| CN113121999B (zh) * | 2019-12-31 | 2023-04-07 | 广东生益科技股份有限公司 | 一种树脂组合物及使用它的预浸料、层压板和印制电路板 |
| WO2022054867A1 (ja) * | 2020-09-11 | 2022-03-17 | パナソニックＩｐマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
| US20240190112A1 (en) * | 2021-03-24 | 2024-06-13 | Panasonic Intellectual Property Management Co., Ltd. | Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board |
-
2023
- 2023-03-02 TW TW112107453A patent/TW202348646A/zh unknown
- 2023-03-03 KR KR1020247033053A patent/KR20240157734A/ko active Pending
- 2023-03-03 JP JP2024506132A patent/JPWO2023171554A1/ja active Pending
- 2023-03-03 WO PCT/JP2023/007986 patent/WO2023171554A1/ja active Application Filing
- 2023-03-03 CN CN202380025733.8A patent/CN118891299A/zh active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020054601A1 (ja) | 2018-09-12 | 2020-03-19 | 日本化薬株式会社 | マレイミド樹脂、硬化性樹脂組成物およびその硬化物 |
| WO2021182360A1 (ja) | 2020-03-11 | 2021-09-16 | 日本化薬株式会社 | マレイミド樹脂およびその製造方法、マレイミド溶液、並びに、硬化性樹脂組成物およびその硬化物 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023171554A1 (ja) | 2023-09-14 |
| JPWO2023171554A1 (enrdf_load_stackoverflow) | 2023-09-14 |
| CN118891299A (zh) | 2024-11-01 |
| TW202348646A (zh) | 2023-12-16 |
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