KR20240134304A - 낮은 비아 저항 인터커넥트 구조물 - Google Patents

낮은 비아 저항 인터커넥트 구조물 Download PDF

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Publication number
KR20240134304A
KR20240134304A KR1020247021909A KR20247021909A KR20240134304A KR 20240134304 A KR20240134304 A KR 20240134304A KR 1020247021909 A KR1020247021909 A KR 1020247021909A KR 20247021909 A KR20247021909 A KR 20247021909A KR 20240134304 A KR20240134304 A KR 20240134304A
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South Korea
Prior art keywords
layer
interconnect structure
metal layer
semiconductor device
tan
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Pending
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KR1020247021909A
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English (en)
Korean (ko)
Inventor
쥔징 바오
존 졘홍 주
존 ?컹? 주
기리다르 날라파티
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퀄컴 인코포레이티드
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Publication of KR20240134304A publication Critical patent/KR20240134304A/ko
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/425—Barrier, adhesion or liner layers
    • H01L23/5226—
    • H01L21/2855—
    • H01L21/28562—
    • H01L21/76807—
    • H01L21/76846—
    • H01L21/76849—
    • H01L23/5283—
    • H01L23/53238—
    • H01L23/53266—
    • H01L23/5329—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/033—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics
    • H10W20/035—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics combinations of barrier, adhesion or liner layers, e.g. multi-layered barrier layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/033—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics
    • H10W20/037—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics the barrier, adhesion or liner layers being on top of a main fill metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
    • H10W20/057—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches by selectively depositing, e.g. by using selective CVD or plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/074—Manufacture or treatment of dielectric parts thereof of dielectric parts comprising thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
    • H10W20/076—Manufacture or treatment of dielectric parts thereof of dielectric parts comprising thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers in via holes or trenches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/42—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/435—Cross-sectional shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/45—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts
    • H10W20/48—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/42—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a gas or vapour
    • H10P14/43—Chemical deposition, e.g. chemical vapour deposition [CVD]
    • H10P14/432—Chemical deposition, e.g. chemical vapour deposition [CVD] using selective deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/42—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a gas or vapour
    • H10P14/44—Physical vapour deposition [PVD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
    • H10W20/084—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts for dual-damascene structures

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1020247021909A 2022-01-11 2022-12-20 낮은 비아 저항 인터커넥트 구조물 Pending KR20240134304A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/573,461 US20230223341A1 (en) 2022-01-11 2022-01-11 Low via resistance interconnect structure
US17/573,461 2022-01-11
PCT/US2022/053521 WO2023136914A1 (en) 2022-01-11 2022-12-20 Low via resistance interconnect structure

Publications (1)

Publication Number Publication Date
KR20240134304A true KR20240134304A (ko) 2024-09-09

Family

ID=85199417

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247021909A Pending KR20240134304A (ko) 2022-01-11 2022-12-20 낮은 비아 저항 인터커넥트 구조물

Country Status (7)

Country Link
US (1) US20230223341A1 (https=)
EP (1) EP4463887A1 (https=)
JP (1) JP2025503627A (https=)
KR (1) KR20240134304A (https=)
CN (1) CN118369757A (https=)
TW (1) TW202335230A (https=)
WO (1) WO2023136914A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12308291B2 (en) 2022-06-03 2025-05-20 Nanya Technology Corporation Method for preparing semiconductor device structure with barrier portion
US12308318B2 (en) * 2022-06-03 2025-05-20 Nanya Technology Corporation Semiconductor device structure with barrier portion

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1020543A1 (en) * 1999-01-15 2000-07-19 Interuniversitair Micro-Elektronica Centrum Vzw Deposition of copper on an activated surface of a substrate
US20030148618A1 (en) * 2002-02-07 2003-08-07 Applied Materials, Inc. Selective metal passivated copper interconnect with zero etch stops
JP4647184B2 (ja) * 2002-12-27 2011-03-09 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US20070057305A1 (en) * 2005-09-13 2007-03-15 Taiwan Semiconductor Manufacturing Company, Ltd. MIM capacitor integrated into the damascene structure and method of making thereof
US20070249156A1 (en) * 2006-04-20 2007-10-25 Griselda Bonilla Method for enabling hard mask free integration of ultra low-k materials and structures produced thereby
US7651943B2 (en) * 2008-02-18 2010-01-26 Taiwan Semicondcutor Manufacturing Company, Ltd. Forming diffusion barriers by annealing copper alloy layers
US9514983B2 (en) * 2012-12-28 2016-12-06 Intel Corporation Cobalt based interconnects and methods of fabrication thereof
US9059217B2 (en) * 2013-03-28 2015-06-16 International Business Machines Corporation FET semiconductor device with low resistance and enhanced metal fill
EP3503168A1 (en) * 2014-12-23 2019-06-26 INTEL Corporation Decoupled via fill
US9842805B2 (en) * 2015-09-24 2017-12-12 International Business Machines Corporation Drive-in Mn before copper plating
US10002789B2 (en) * 2016-03-24 2018-06-19 International Business Machines Corporation High performance middle of line interconnects
US10361364B2 (en) * 2017-06-14 2019-07-23 International Business Machines Corporation Co-fabrication of magnetic device structures with electrical interconnects having reduced resistance through increased conductor grain size
TW202524711A (zh) * 2017-11-30 2025-06-16 美商英特爾股份有限公司 用於先進積體電路結構製造之異質金屬線組成
KR20250070116A (ko) * 2017-11-30 2025-05-20 인텔 코포레이션 진보된 집적 회로 구조체 제조를 위한 핀 패터닝
US10395986B1 (en) * 2018-05-30 2019-08-27 International Business Machines Corporation Fully aligned via employing selective metal deposition
US10629484B1 (en) * 2018-11-01 2020-04-21 Applied Materials, Inc. Method of forming self-aligned via
US10957579B2 (en) * 2018-11-06 2021-03-23 Samsung Electronics Co., Ltd. Integrated circuit devices including a via and methods of forming the same
US11164778B2 (en) * 2019-11-25 2021-11-02 International Business Machines Corporation Barrier-free vertical interconnect structure
US11515203B2 (en) * 2020-02-05 2022-11-29 Tokyo Electron Limited Selective deposition of conductive cap for fully-aligned-via (FAV)
US11362035B2 (en) * 2020-03-10 2022-06-14 Taiwan Semiconductor Manufacturing Company, Ltd. Diffusion barrier layer for conductive via to decrease contact resistance
US11289375B2 (en) * 2020-03-23 2022-03-29 International Business Machines Corporation Fully aligned interconnects with selective area deposition

Also Published As

Publication number Publication date
EP4463887A1 (en) 2024-11-20
WO2023136914A1 (en) 2023-07-20
TW202335230A (zh) 2023-09-01
CN118369757A (zh) 2024-07-19
US20230223341A1 (en) 2023-07-13
JP2025503627A (ja) 2025-02-04

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P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000