KR20240065528A - Electronic device of in-mold type having touch sensor and manufacturing method thereof - Google Patents

Abstract

An in-mold type electronic device having a touch sensor disclosed in an embodiment of the invention includes a support layer; A decoration layer including transparent or opaque paste or ink on the support layer; a protective layer on the decoration layer; an adhesive layer on the protective layer; A resin layer on the adhesive layer; a sensor electrode pattern disposed on the surface of at least one of the adhesive layer and the protective layer; a device electrode pattern disposed on a surface of at least one of the adhesive layer and the protective layer; and a plurality of electronic devices disposed on the device electrode pattern and sealed between the resin layer and the protective layer, wherein the film from the support layer to the resin layer forms a convex portion or a concave portion, and the convex portion Alternatively, at least one of the plurality of electronic devices may be disposed inside the concave portion.

Description

In-mold type electronic device having a touch sensor and method of manufacturing the same {ELECTRONIC DEVICE OF IN-MOLD TYPE HAVING TOUCH SENSOR AND MANUFACTURING METHOD THEREOF}

Embodiments of the invention relate to an in-mold type electronic device having a touch sensor and a method of manufacturing the same. Preferably, it relates to an in-mold electronic device having a touch sensor, at least one electronic element, and an electrode pattern integrated, and a method of manufacturing the same.

As inter-industry convergence accelerates in the 4th industrial era, the need for a new manufacturing industry is emerging, and accordingly, mounting and hard coating of electronic circuits and optical elements at the same time as injection molding without going through the multiple steps of existing technology. In-mold electronics (IME) technology that allows stacking is attracting attention.

In addition, methods such as injection molding and press molding are widely used to manufacture various products, including cases for various information devices such as vehicles or mobile phones. And, the surface of these products may have a three-dimensional curved surface or double curved surface. Due to the shape of a three-dimensional curved or double-curved surface, it is difficult to print a metal pattern directly on the surface, and in-mold electronic devices are used to solve this problem.

Therefore, in order to miniaturize and lighten electronic devices, technologies are being developed to embed electronic functions into molded and thermoformed plastic parts using in-mold electronic devices.

Embodiments of the invention can provide an electronic device with built-in electronic devices such as a touch sensor, a semiconductor chip, and an LED, and a method of manufacturing the same.

Embodiments of the invention can provide an in-mold type electronic device in which a touch sensor and various electronic elements are integrally molded, and a method of manufacturing the same.

An in-mold type electronic device having a touch sensor according to an embodiment of the invention includes a support layer; A decoration layer having transparent or opaque paste or ink on the support layer; a protective layer on the decoration layer; an adhesive layer on the protective layer; A resin layer on the adhesive layer; a sensor electrode pattern disposed on the surface of at least one of the adhesive layer and the protective layer; a device electrode pattern disposed on the surface of at least one of the adhesive layer and the protective layer; and a plurality of electronic devices disposed on the device electrode pattern and sealed between the resin layer and the protective layer, wherein the film from the support layer to the resin layer forms a convex portion or a concave portion, and the convex portion Alternatively, at least one of the plurality of electronic devices may be disposed inside the concave portion.

According to an embodiment of the invention, the sensor electrode pattern and the device electrode pattern are disposed on the adhesive layer, and the plurality of electronic devices may have a touch sensor sealed between the adhesive layer and the resin layer.

According to an embodiment of the invention, the protective layer includes a first protective layer on the decoration layer; and a second protective layer on the first protective layer, wherein the sensor electrode pattern and the device electrode pattern are disposed on the first protective layer, and the plurality of electronic devices are formed on the first protective layer and the first protective layer. It can be sealed between two protective layers.

According to an embodiment of the invention, at least a portion of the sensor electrode pattern and the device electrode pattern may be disposed within the convex portion.

According to an embodiment of the invention, the sensor electrode pattern includes: a sensor pattern having a plurality of opening holes; And it may include a connection pattern connected to one or both ends of the sensor pattern.

According to an embodiment of the invention, the resin layer has an opening on the convex part corresponding to the size of the convex part, and the surface of the adhesive layer may be exposed through the opening.

A method of manufacturing an in-mold type electronic device having a touch sensor according to an embodiment of the invention includes forming a decoration layer having a transparent or opaque paste or ink on a support layer; forming a first protective layer on the decoration layer; forming a sensor electrode pattern and a device electrode pattern on the first protective layer; Mounting an electronic device having a semiconductor chip and a light emitting device on the device electrode pattern; sealing the electronic device by forming a second protective layer on the first protective layer; forming an adhesive layer on the second protective layer; Forming a convex portion by thermoforming the film from the support layer to the adhesive layer; Forming a resin layer on the surface of the adhesive layer using a mold for molding the film having the convex portion, wherein the light emitting element is disposed within the convex portion, and the sensor electrode pattern is a sensor having a plurality of opening holes. Can contain patterns.

According to an embodiment of the invention, the reliability of an electronic device that has a touch sensor and various electronic devices integrated into it can be improved through thermoforming, printing, and injection processes performed at high temperatures.

In addition, embodiments of the invention can suppress wear, scratches, and corrosion on the surface of parts by using an in-mold type electronic device, and provide colors and textures requested by customers.

Additionally, an embodiment of the invention can protect the electrode pattern and the device by forming at least one of a protective layer, an adhesive layer, or a resin layer on the electrode pattern and the device in an in-mold electronic device.

According to an embodiment of the invention, the electrical reliability of an in-mold electronic device can be improved.

1 is an example of a side cross section of an in-mold electronic device according to an embodiment of the invention.
Figure 2 is a partial enlarged view of Figure 1.
Figure 3 is a plan view of an in-mold electronic device having a touch sensor and electronic elements according to an example of the invention.
Figure 4 is a diagram showing the manufacturing process of an in-mold electronic device according to an embodiment of the invention.
FIG. 5 is a diagram illustrating an example of manufacturing a three-dimensional shape having a touch sensor and an electronic device in the process of FIG. 4.
Figure 6 is a diagram showing electrode patterns of touch sensors of the invention and comparative examples.
Figure 7 is another example of an in-mold electronic device according to an embodiment of the invention.
Figure 8 is another example of an in-mold electronic device according to an embodiment of the invention.
Figure 9 is a diagram showing an electrode pattern of a touch sensor of an in-mold electronic device according to an embodiment of the invention.
FIG. 10 is a diagram showing an example of connection of electrode patterns of the touch sensor of FIG. 9.
Figure 11 is an example of a vehicle component to which an in-mold electronic device with a touch sensor according to an embodiment of the invention is applied.

The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various different forms. These embodiments only serve to ensure that the disclosure of the present invention is complete and that common knowledge in the technical field to which the present invention pertains is not limited. It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are illustrative, and the present invention is not limited to the matters shown. Like reference numerals refer to like elements throughout the specification. Additionally, in describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. When 'includes', 'has', 'consists of', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the plural is included unless specifically stated otherwise. When interpreting a component, it is interpreted to include the margin of error even if there is no separate explicit description. In the case of a description of a positional relationship, for example, if the positional relationship of two parts is described as 'on top', 'on the top', 'on the bottom', 'next to', etc., 'immediately' Alternatively, there may be one or more other parts placed between the two parts, unless 'directly' is used.

In the case of a description of a temporal relationship, for example, if a temporal relationship is described as 'after', 'successfully after', 'after', 'before', etc., 'immediately' or 'directly' Unless used, non-consecutive cases may also be included. Although first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are merely used to distinguish one component from another. Accordingly, the first component mentioned below may also be the second component within the technical spirit of the present invention.

Each feature of the various embodiments of the present invention can be combined or combined with each other partially or entirely, and various technical interconnections and operations are possible, and each embodiment can be implemented independently of each other or together in a related relationship. It may be possible.

FIG. 1 is an example of a side cross-section of an in-mold electronic device according to an embodiment of the invention, FIG. 2 is a partial enlarged view of FIG. 1, and FIG. 3 is an in-mold electronic device having a touch sensor and electronic elements according to an example of the invention. It is a plan view of the device, and FIG. 4 is a diagram showing the manufacturing process of an in-mold electronic device according to an embodiment of the invention, and FIG. 5 is a diagram showing an example of manufacturing a three-dimensional shape with a touch sensor and electronic devices in the process of FIG. 4. , and FIG. 6 is a diagram showing electrode patterns of touch sensors of the invention and comparative examples.

Referring to FIGS. 1 to 3 , the in-mold electronic device 40 according to an embodiment of the present invention includes an electromagnetic sensor member, and may include, for example, a touch sensor or a pressure sensor. The in-mold electronic device 40 may include a thermoformed substrate or a decorative film substrate.

The in-mold electronic device 40 may include a sensor electrode pattern 11 and electronic elements 21 and 32 molded therein. The electronic devices 21 and 32 may be mounted on the device electrode patterns 12 and 13, as shown in FIG. 2, and may include a semiconductor chip 32 and a light emitting device 21 such as an LED. The semiconductor chip 32 is equipped with various control functions and may be, for example, an LED driver IC or a sensor control IC. A plurality of the light emitting devices 21 may be disposed in areas to be illuminated. The LED may be a side view type package or a top view type package.

Since the plurality of light emitting elements 21 are disposed on the three-dimensional convex part 52, the entire area of the hemispherical convex part 52 can be illuminated.

At least one or both of the sensor electrode pattern 11 and the electronic elements 21 and 32 may be disposed on the convex portion 52 or/and the concave portion that is a three-dimensional shape of the electronic device 40. The convex portion 52 or the concave portion may be a structure having a three-dimensional shape and may be in close contact with the surface shape of a component, such as a touch component of a moving body. The convex portion 52 or/and the concave portion may be disposed in one or multiple convex portions in the electronic device 40 . The moving object may include a car, drone, airplane, ship, manned or unmanned mobility, etc. The parts include components such as decorations, logos, emblems, button icons or sensors that show the operation or function of the item.

A concave recess 51 may be disposed in an area opposite the convex portion 52. The side cross-sectional shape of the convex portion 52 may be a hemispherical shape or a polygonal shape. At least one light emitting device 21 may be disposed inside the convex portion 52. By mounting the light emitting element 21 on the convex part 52 or the concave part, the three-dimensional lighting image of the electronic device 40 can be improved.

The area of the electronic device 40 excluding the convex portion 52 or the concave portion (or recess) may be defined as a flat portion.

The electronic device 40 may include a support layer 41, a decorative layer 42, a protective layer 43, an adhesive layer 44, and a resin layer 45.

The support layer 41 may be a support substrate, such as polycarbonate (PC), polymethyl methacrylate (PMMA), polyvinyl chloride (PVC), polyethylene terephthalate (PET), polypropylene (PP), or polyethylene (PE). , polystyrene (PS), acryl (Acryl), polyethylene naphthalate (PEN), triacetate cellulose (TAC), and polyethersulfone (PES). As another example, the support layer 41 may be a translucent or opaque material. The support layer 41 may be made of an insulating material.

The decoration layer 42 may include transparent or opaque paste or ink. As another example, the decoration layer 42 includes ink of an opaque material, and for example, a layer with black ink may be printed or deposited. The decoration layer 42 may be selectively formed in a partial area between the support layer 41 and the protective layer 43. The decoration layer 42 may be formed in an outer area or a center area between the support layer 41 and the protective layer 43.

The decoration layer 42 may be formed as a single layer or multiple layers on the surface of the support layer 41, and may be printed with colored ink having black, white, blue, red, or other colors. Since the decoration layer 42 is printed with colored ink within the electronic device, the external image can be improved with images of logos, characters, or various shapes. As another example, the decoration layer 42 may be formed as a conductive layer using conductive ink or a conductive material. The decoration layer 42 may be formed to have a thickness of 5 ㎛ or less, for example, in the range of 5 ㎛ to 80 ㎛ or 10 ㎛ to 30 ㎛.

When the decoration layer 42 is transparent, opaque paste or ink, or is treated with black ink, the decoration layer 42 allows the light illuminated by the light-emitting device 21 to directly illuminate the user, that is, the driver. You can adjust or block the optical path to prevent it from happening.

The protective layer 43 may be formed of at least one of fluorine-based resin, acrylic resin, polyimide, or a mixed material. The protective layer 43 can prevent UV stability and weather resistance from being reduced. The protective layer 43 may include an antioxidant or a dispersant. The adhesive layer 44 may provide adhesion between the protective layer 43 and the resin layer 45. The adhesive layer 44 may be made of acrylic or resin, or may be formed by combining various ink binders therein.

The sensor electrode pattern 11 and the device electrode patterns 12 and 13 for device mounting may be formed on the adhesive layer 44 . The sensor electrode pattern 11 may be formed in a partial area or a touch area of the electronic device 40, and may be formed with a thickness of 100 nm or more, for example, in the range of 100 nm to 400 nm. If the thickness of the sensor electrode pattern 11 is less than the above range, problems may occur such as deterioration in conductivity or boiling of the electrode pattern, and if it is thicker than the above range, the improvement in conductivity may be minimal compared to the increase in thickness or the electrode pattern may be manufactured when manufactured. A defect in which the pattern is open may occur. The device electrode patterns 12 and 13 for device mounting may be formed to have a thickness of 100 nm or more, for example, in the range of 300 nm to 500 nm. For example, the device electrode patterns 12 and 13 are pads on which LEDs or semiconductor chips are mounted. If they are thinner than the above range, the electrical conductivity and heat dissipation characteristics may be reduced, and if they are thicker than the above range, the stretching characteristics may be reduced or the When expanding during the process, a defect in which the electrode pattern is opened may occur.

The thickness of the device electrode patterns 12 and 13 and the sensor electrode pattern 11 may be the same or different from each other. For example, the thickness of the device electrode patterns 12 and 13 may be thicker than the thickness of the sensor electrode pattern 11. The material of the device electrode patterns 12 and 13 and the sensor electrode pattern 11 may be the same or different from each other. For example, the device electrode patterns 12 and 13 may be made of a non-transparent conductive material, and the sensor electrode pattern 11 may be made of a transparent conductive material.

The sensor electrode pattern 11 is made of metal oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), IZO nitride (IZON), indium zinc tin oxide (IZTO), indium aluminum zinc oxide (IAZO), and IGZO ( It may include at least one selected from indium gallium zinc oxide (IGTO), indium gallium tin oxide (IGTO), aluminum zinc oxide (AZO), antimony tin oxide (ATO), gallium zinc oxide (GZO), IrOx, and RuOx. Preferably, the sensor electrode pattern 11 is formed by printing or depositing a light-transmitting and conductive material such as ITO or IZO. Accordingly, the sensor electrode pattern 11 may not be recognized from the outside and may not affect the external design.

The device electrode patterns 12 and 13 are selected from metals such as Ag, Al, Au, Cr, Co, Cu, Fe, Hf, In, Mo, Ni, Si, Sn, Ta, Ti, W and selective alloys of these metals. It can be formed as either a single layer or a multi-layer. The device electrode patterns 12 and 13 are made of a conductive material with a high elongation rate, such as a metal such as silver (Ag) or its alloy, titanium (Ti) or its alloy, copper (Cu) or its alloy, a metal-resin bonding material, It may be formed of at least one of graphene, conductive polymer, or carbon nanotubes.

The device electrode patterns 12 and 13 may be formed on the surface of the adhesive layer 44 through a deposition or plating process. At least one of bar coating, roll coating, spray coating, spin coating, screen printing coating, inkjet printing method, sputtering method, or laser fusion. can be formed.

The device electrode patterns 12 and 13 may include a first electrode pattern 12 and a second electrode pattern 13 having different polarities.

Electronic devices 21 and 32 may be mounted on the device electrode patterns 12 and 13. The electronic devices 21 and 32 may be buried between the adhesive layer 44 and the resin layer 45. One or more electronic devices 21 and 32 may be disposed along the area where the device electrode patterns 12 and 13 are formed.

The light emitting device 21 may be mounted on the device electrode patterns 12 and 13 disposed on the convex portion 52. The light emitting device 21 may be buried between the convex region 44a of the adhesive layer 44 and the convex region 45a of the resin layer 45.

The size of the light emitting element 21 disposed on the convex part 52 may be smaller than the maximum diameter (D1 in FIG. 8) of the convex part 52, for example, 50% or less of the maximum diameter. The diameter of the convex portion 52 may vary depending on the shape of the component with which the electronic device 40 is in close contact.

The radius of curvature of the convex portion 52 may be 5 mm or more, for example, 5 mm to 200 mm, 5 mm to 150 mm, 10 mm to 100 mm, or 10 mm to 50 mm. Here, when the convex portions 52 are plural, the radii of curvature of each of the convex portions 52 may be the same or different from each other and may be formed within the range of 5 mm to 200 mm.

As shown in FIG. 2, when mounting the lower electrodes 24 and 25 of the light emitting device 21 on the device electrode patterns 12 and 13, they can be mounted through a reflow process using a bonding material or directly bonded. You can. The gap between the first electrode pattern 12 and the second electrode pattern 13 can be arranged in consideration of the amount of expansion or contraction of the resin material. Additionally, when forming the convex portion 52 or the concave portion in the electronic device 40, the distance between the first electrode pattern 12 and the second electrode pattern 13 may be increased than the standard distance, and in this case, the distance between the first electrode pattern 12 and the second electrode pattern 13 may be increased. An open defect may occur between the first electrode pattern 12 and the first electrode 24 or/or between the second electrode pattern 13 and the second electrode 25. In an embodiment of the invention, before thermoforming, the interval between the first and second electrode patterns 12 and 13 disposed within the convex portion 52 is narrower than the reference interval, and after thermoforming, the interval between the first and second electrode patterns 12 and 13 disposed within the convex portion 52 is narrower than the reference interval. The disposed first and second electrode patterns 12 and 13 may be positioned at standard intervals. For the electronic device 40, the gap before thermoforming may be less than 100% of the standard gap, for example, in the range of 90% to 99%. Accordingly, the space between the lower electrodes 24 and 25 of the light emitting device 21 and the device electrode patterns 12 and 13 can be stably mounted on the structure after thermoforming, and a decrease in electrical reliability can be prevented.

The first and second electrode patterns 12 and 13 disposed within the convex portion 52 may be disposed on an area spaced apart from the center or vertex of the convex portion 52 or the concave portion. Since the first and second electrode patterns 12 and 13 are spaced apart from the vertices of the convex portion 52 or the concave portion, open failure of the light emitting device 21 can be suppressed.

The resin layer 45 can seal the electronic devices 21 and 32 and the sensor electrode pattern 11, and the electronic devices 21 and 32, the sensor electrode pattern 11 and the device electrode pattern 12, 13) can be protected.

The resin layer 45 may be made of a resin material such as silicone or epoxy, and may be a transparent material. The resin layer 45 may be made of a heat-curable resin or an ultraviolet (UV)-curable resin. The thermosetting resin is one containing at least one polyol having two or more alcohol groups selected from acrylates, urethane acrylates, epoxy acrylates, and amine-modified acrylates, and a curing agent. The ultraviolet curing resin is one containing at least one oligomer selected from acrylate oligomer, urethane acrylate oligomer, and epoxy acrylate oligomer, along with a photoinitiator and additives. The photoinitiator and additives are used in the art and their composition is not particularly limited. It is recommended to use isocyanate or the like as the curing agent.

The thickness of the resin layer 45 may be 1㎛ or more, for example, in the range of 1㎛ to 10㎛ or 3㎛ to 7㎛. When the thickness of the resin layer 45 is within the above range, strength and curability can be improved, and adhesion with other layers can be improved.

For example, the in-mold electronic device 40 may provide a three-dimensional interface for controlling functions in a freely curved shape on the driver's seat or passenger seat inside a car. Additionally, the in-mold electronic device 40 can provide a mechanical button type or touch type control part of the interior front control part for an automobile in a touch input method having a three-dimensional curved surface. Since this in-mold electronic device 40 has a touch sensor and electronic elements 21 and 32 integrated inside, the weight can be reduced by more than 50% compared to existing products, and manufacturing time and cost can be reduced. and can be applied to various vehicle designs or parts. For example, the in-mold electronic device 40 can be applied to an automobile instrument panel display, center fascia, console, or touch sensor interface on the front of a product. As shown in FIG. 11, the sunscreen is a part of the dashboard between the driver's seat and the passenger's seat, and can be provided as a touch panel with various control buttons or convenience functions.

As shown in FIG. 3, the in-mold electronic device 40 may have at least one pin connector 31 disposed on one side or/and the right side, and at least one semiconductor chip 32 may be disposed at an outer corner, A plurality of light-emitting devices 21, such as LEDs, may be disposed in at least one or all of the areas of the convex portion 52, the periphery of the convex portion 52, or the outer flat portion 55.

A first electrode pattern 12 and a second electrode pattern 13 are disposed in the area where the light emitting device 21 is mounted, and a plurality of light emitting devices 21 connected to the first and second electrode patterns 12 and 13 are connected to the light emitting device 21. ) can be connected in series, parallel, series-parallel with each other, or in series within individual groups for different areas or different functions.

A sensor electrode pattern 11 is arranged within the electronic device 40 and can function as a touch sensor unit. The sensor electrode pattern 11 may be placed in some areas for touch sensing. At least one of the sensor electrode patterns 11 may be connected to the pin connector 21.

4 and 5, the manufacturing process of the electronic device is as follows.

The sensor electrode pattern 11 and the device electrode patterns 12 and 13 are printed on the support film 101 (step S1). The support film 101 may have a layer structure from the support layer 41 to the adhesive layer 44 in FIG. 1.

After forming an adhesive layer 103 or a protective layer on the support film 101 (S2), device electrode patterns 12 and 13 and a sensor electrode pattern 11 are formed on the adhesive layer 103 or the protective layer. I do it.

The sensor electrode pattern 11 includes a sensor pattern 11a and a connection pattern 11c extending to one or both ends of the sensor pattern 11a, as shown in FIG. 6 (A), and the connection pattern 11c ) can connect adjacent sensor patterns 11a. The sensor pattern 11a includes a circular or polygonal pattern and has a plurality of opening holes 11b therein, and the opening holes 11b may be spaced apart from each other and may be arranged in a mesh shape. . The opening hole 11b may be 300㎛ or less, for example, in the range of 100㎛ to 300㎛. The sensor pattern 11a having the mesh-shaped opening holes 11b can prevent cracks from occurring in the sensor pattern 11a when the convex portion 52 is formed by thermoforming.

According to internal research, problems such as disconnection due to differences in elongation between the electrode pattern, sensor pattern and the substrate, or surface cracking due to thermal expansion during large-area printing, resulting in electrical openness were studied. Accordingly, by providing a plurality of opening holes 11b inside the sensor electrode pattern 11 of the embodiment, there is a technical effect of improving disconnection during a high temperature process.

On the other hand, as in the comparative example of FIG. 6 (B), when there is no opening hole inside the sensor pattern 1, when formed on the convex portion 52, cracks are generated within the sensor pattern or connected to the sensor pattern. Cracks may occur between patterns 1a. In addition, as shown in FIG. 6 (A), one or both ends of the connection pattern 11c may be connected to the sensor pattern 11a, and the width of the connection pattern 11c is greater than the width of the sensor pattern 11a. It can be placed small. The width of the connection pattern 11c is arranged to be smaller than the width of the sensor pattern 11a, so that the connection portion between the connection pattern 11c and the sensor pattern 11a can be prevented from boiling during thermoforming.

Here, if the sensor electrode pattern 11 and the device electrode patterns 12 and 13 are made of different materials, they may be printed or deposited through separate processes. For example, after forming the device electrode patterns 12 and 13, the sensor electrode pattern 11 can be formed. If the sensor electrode pattern 11 and the device electrode patterns 12 and 13 are made of the same material, they can be printed or deposited at the same time.

As shown in Figure 4, the adhesive material 12a is attached to the surface of the device electrode patterns 12 and 13 (S4), and then the light emitting device 21 and the semiconductor chip are mounted. The lower electrode of the light emitting device 21 may be bonded to the device electrode patterns 12 and 13 through a reflow process. Additionally, other semiconductor chips can be mounted on different device electrode patterns.

After mounting the device, a three-dimensional convex portion 52 is formed through a thermoforming process, and a resin layer 105 is formed on the adhesive layer 103 or the protective layer having the convex portion 52. . Accordingly, an electronic device in which at least one electronic element is disposed on the convex portion 52 and a sensor electrode pattern is sealed therein can be manufactured.

When the support film 101 on which the electronic device is mounted forms the convex portion 52 through thermoforming, the thermoforming temperature is 100 degrees or more, for example, in the range of 100 degrees to 400 degrees, and the sensor electrode pattern 11 ) or may be lower than the melting temperature point of the device electrode patterns 12 and 13. This support film 101 can prevent open defects due to a high temperature process due to the opening hole 11b of the sensor pattern 11a and prevent open defects in the pattern due to a difference in elongation between the electrode and the film.

As shown in FIG. 5 , the sensor electrode pattern 11 and the device electrode pattern may be formed on the surface of the concave portion or the convex portion 52 . Electronic devices such as the light emitting device 21 and/or the semiconductor chip 32 are mounted and the three-dimensional convex portion 52 is molded, and then the support film 40a is inserted into the molds 201 and 203. I do it.

When an electronic device such as the light emitting device 21 is mounted on the convex portion 52, a first molding mold 201 having a concave recess 201a and a second molding mold having a protrusion 204 ( After combining the molding film 40a between the molds 203), the first and second molds 201 and 203 are bonded, and resin is injected through the resin injection port 205 (S11, S12). At this time, the resin covers one side of the molded film 40a, and the electronic device 21 of the molded film 40a can be sealed with the resin layer 45. Thereafter, when the resin layer 45 is hardened, the first and second molds 201 and 203 can be separated to manufacture the in-mold electronic device 40 having a touch sensor.

Since the sensor electrode pattern 11 is provided with mesh-shaped opening holes 11b, it is possible to prevent the problem of the pattern being opened during molding of the convex portion 52, and it can be used to Since the electronic device is mounted before forming the convex portion 52, the influence on the light emitting device 21 disposed on the convex portion 52 can be reduced.

FIG. 7 is another example of FIG. 1 , where the electronic device 40 may stack a plurality of protective layers 43 and 46 between the decoration layer 42 and the adhesive layer 44. The protective layer may include a first protective layer 43 on the decoration layer 42 and a second protective layer 46 on the first protective layer 43.

The first protective layer 43 may be formed of a fluorine-based resin or/and acrylic resin layer, and may be the same layer as the protective layer in FIG. 1. The second protective layer 46 may be made of a resin material such as transparent polyimide or polydimethylsiloxane.

According to internal technology, the problem of light leakage from the decoration layer due to differences in elongation and thermal expansion between the decoration layer and the resin layer during thermoforming and injection processes conducted at high temperatures, for example, 100 to 400°C, was studied.

According to the embodiment, the degree of elongation and expansion of the decoration layer is alleviated by stacking a plurality of protective layers 43 and 46 between the decoration layer 42 and the adhesive layer 44, thereby performing a three-dimensional thermoforming process and injection process at high temperature. There is a technical effect of increasing the thin film stability of the decoration layer during stretching. The sensor electrode pattern 11, the device electrode patterns 12 and 13, and the electronic devices 21 and 32 are formed by the first protective layer 43. and the second protective layer 46. The sensor electrode pattern 11 and the device electrode patterns 12 and 13 are formed on the surface of the first protective layer 43, and the electronic devices 21 and 32 and pin connectors are formed on the device electrode pattern ( 12,13) can be mounted after being formed. The second protective layer 46 seals the electronic devices 21 and 32 and the sensor electrode pattern 11.

According to internal technology, the problem of open sensor electrode patterns or electronic devices due to insertion of a resin layer during 3D high-temperature injection to form concave or convex parts was studied. Accordingly, the embodiment has a technical effect of forming a protective layer 43 on the sensor electrode and the upper part of the device to prevent the occurrence of open problems in the sensor electrode pattern or device due to insertion of the resin layer during three-dimensional high temperature injection. For example, during three-dimensional injection of the second protective layer 46 in the embodiment, the sensor electrode pattern 11 or the electronic elements 21 and 32 may be damaged or pattern open defects may occur due to high-temperature resin insertion. can be suppressed. That is, the second protective layer 46 can protect the surface of the device through a pattern formed on the first protective layer 43. The second protective layer 46 is intended to provide physical and chemical stability to the stretchable electronic device, and may include, for example, a polydimethylsiloxane-based material.

An adhesive layer 44 may be formed on the second protective layer 46. The adhesive layer 44 may be disposed between the second protective layer 46 and the resin layer 45.

The convex portion 52, which has a three-dimensional shape, may have a sensor electrode pattern 11 and electronic devices 21 and 32, such as a light emitting device 21, disposed therein. The convex portion 52 may be formed by the convex area of each layer.

The sensor electrode pattern 11 and the device electrode patterns 12 and 13 may be disposed on the same layer without overlapping. As another example, the sensor electrode pattern 11 and the device electrode patterns 12 and 13 may overlap in different layers. For example, in FIGS. 7 and 8, the sensor electrode pattern 11 is formed on the first protective layer 43, and the device electrode patterns 12 and 13 and the electronic device 21 are formed on the second protective layer 46. 32) can be placed.

FIG. 8 is another example of FIG. 7 in which the second protective layer 46 seals the sensor electrode patterns 11, 12, and 13 of FIG. 2 and the electronic elements 21 and 32 of FIG. 3, thereby forming the electrode pattern 11. ,12,13) and the surfaces of electronic devices (21,32) are protected.

According to internal technology, the problem of damage to electronic devices or electrode patterns due to resin injection was studied. Accordingly, in the embodiment, the area where the electronic device or electrode pattern is mounted can be partially injection processed by designing an injection mold that prevents resin input, and accordingly, the resin layer 45 is formed on the second protective layer 46. An open opening 45A may be disposed on the convex area. The electronic devices 21 and 32 and the electrode patterns 11, 12, and 13 may not vertically overlap the resin layer 45.

The opening 45A of the resin layer 45 is opened to the size of the maximum diameter D1 of the convex portion 52, and the adhesive layer covers the electronic elements 21 and 32 and the electrode patterns 11, 12 and 13. The convex area 46A of (44) is exposed, and the electrode patterns 11, 12, 13 and the electronic elements 21, 32 are prevented from being damaged by the high-temperature thermoforming process, and the electrode patterns 11, 12, 13) and decrease in reliability of electronic devices 21 and 32 can be prevented.

In the structures of FIGS. 7 and 8, the process of forming the resin layer can be performed using an injection molding mold after the adhesive layer 44 is formed. As another example, the adhesive layer 44 and the resin layer 45 may be formed in an injection mold after the second protective layer 46 is formed. Additionally, the opening 45A of the resin layer 45 may be formed during injection molding by a protrusion corresponding to the opening of the injection mold.

Meanwhile, according to internal technology, the problem of reduced bonding strength due to heterogeneous bonding of the decoration layer, protective layer, and resin layer during high-temperature injection was studied. Accordingly, the embodiment has the technical effect of strengthening the bonding strength between the adhesive layer and the resin layer during high-temperature three-dimensional injection by printing the adhesive layer in multiple layers. The electronic device 40 has an electrode pattern electrically connected to another substrate inside the film. It may be a substrate on which (11, 12, 13) and electronic elements (21, 32) are in-molded. The substrate is a thermoformed substrate and may be made of a rigid or hard PCB material that can maintain the formed shape after thermoforming.

FIG. 9 is an example of a plan view of an in-mold electronic device having a touch sensor according to an embodiment of the present invention, and FIG. 10 is an enlarged view of area A10 of FIG. 9 .

As shown in FIGS. 9 and 10 , the in-mold electronic device 400 having a touch sensor may have sensor units 410 and 420 arranged in a matrix form or a net form. The sensor units 410 and 420 are classified according to various touch detection methods such as resistive type, capacitive type, electromagnetic resonance type (EMR), and optical type. It may be done, for example, in a capacitive manner.

A capacitive touch sensor includes a sensing capacitor made up of sensing electrodes capable of transmitting a sensing signal, and detects a change in the capacitance of the sensing capacitor that occurs when a conductive object such as a finger approaches the sensor to determine whether or not there is contact. and contact location can be found. In the capacitive method, the user must always touch the touch sensor to detect the touch, and contact with a conductive object is required.

The sensor units 410 and 420 with a touch detection function are built into the electronic device in an in-mold form, and some may be formed on the outside (on-cell type) or used with a separate touch sensor attached (add on cell type). there is. In this case, when the electronic device is a touch sensor having a thermoformed substrate therein, the sensor part included therein may include an electrode pattern, and the electrode pattern may be transparent.

The in-mold electronic device 400 according to an embodiment of the present invention may include a plurality of first sensor units 410 and a plurality of second sensor units 420 located on a substrate 404. The first sensor unit 410 and the second sensor unit 420 may be transparent electrode patterns. The substrate 404 or the formed film may be a substrate in which thermoforming layers are stacked.

The first sensor unit 410 and the second sensor unit 420 may be distributed in the touch sensing area (TA) of the touch sensor 400 in the row and column directions. The first sensor unit 410 and the second sensor unit 420 are located on the same side or layer, are located on different sides or layers, have the same structure or different structures, and have the same thickness or different thicknesses. It may be provided, but is not limited to this.

Each of the first sensor unit 410 and the second sensor unit 420 may be square, but is not limited to this and may have various shapes, such as having a protrusion to improve the sensitivity of the touch sensor. The plurality of first sensor units 410 may be connected to each other or may be separated inside or outside the sensing area TA. At least a portion of the plurality of second sensor units 420 may be connected to each other or may be separated inside or outside the sensing area TA. For example, when a plurality of first sensor units 410 arranged in the same row are connected to each other within the sensing area TA, a plurality of second sensor units 420 arranged in the same column are connected to the sensing area TA. They may be connected to each other internally. For example, a plurality of first sensor units 410 located in each row are connected to each other through a first connection part 412, and a plurality of second sensor units 420 located in each column are connected to each other through a second connection part 422. may be connected to each other through.

Additionally, it may be connected to the pad portion 450 through the first and second pad connection portions 411 and 421 arranged along the outer area of the sensing area (TA). A semiconductor chip 460 may be embedded in an outer area of the sensing area TA.

The interconnected first sensor units 410 in each row may be connected to a connector (not shown) connected to the pad unit 450 through the first pad connection unit 411, and the interconnected second sensor units 420 in each row ) may be connected to the driving unit connected to the pad unit 450 through the second pad connection unit 421. The first pad connection part 411 and the second pad connection part 421 may be located in a non-detection area outside the detection area TA, or may be located in the detection area TA.

Each end of the first pad connection part 411 and the second pad connection part 421 may be connected to the pad part 450 in the non-sensing area DA of the sensor part 400.

The first pad connection unit 411 may input a detection input signal to the first sensor unit 410 or output a detection output signal to the driving unit through the pad unit 450. The second pad connection unit 421 may input a detection input signal to the second sensor unit 420 or output a detection output signal to the touch driver through the pad unit 450.

The adjacent first sensor unit 410 and the second sensor unit 420 may form a mutual sensing capacitor that functions as a touch sensor. The mutual sensing capacitor can receive a detection input signal through one of the first sensor unit 410 and the second sensor unit 420 and output the change in charge amount due to contact with an external object as a detection output signal through the remaining touch electrode. there is.

The first connection part 412 connecting adjacent first sensor parts 410 may be located on the same layer as the first sensor part 410 and may be formed in a different stack structure from the first sensor part 410. The second connection unit 422 connecting adjacent second sensor units 420 may be located on a different layer from the second sensor unit 420. The second sensor unit 420 and the first connection unit 412 may be separated from each other and may be patterned separately. The second sensor unit 420 and the second connection unit 422 may be connected to each other through direct contact.

An insulating film 430 is positioned between the first connection part 412 and the second connection part 422 to insulate the first connection part 412 and the second connection part 422 from each other. The insulating film 430 may be a plurality of independent island-shaped insulators disposed at each intersection of the first connection portion 412 and the second connection portion 422, but is not limited thereto. The insulating film 430 may expose at least a portion of the second sensor unit 420 so that the second connection unit 422 can be connected to the second sensor unit 420.

At least one convex portion 400A may be disposed within the electronic device 400, and at least one or a plurality of light emitting devices 21 may be disposed around the convex portion 400A. Device electrode patterns 12 and 13 may be printed or deposited on the lower part of the light emitting device 21 and may be electrically connected to the light emitting device 21.

Since it is mounted on the convex portion 400A having a convex curved surface of the light emitting device 21, the three-dimensional light emitting image of the convex portion 400A can be improved. The sensor electrode pattern 11 and the device electrode patterns 12 and 13 may not overlap each other.

Since electronic elements are embedded inside an in-mold electronic device with such a touch sensor and sealed through, for example, thermoforming, surface protection and moisture blocking of devices such as semiconductor chips and light emitting devices can be improved, and the convex surface of the three-dimensional shape can be improved. By embedding a light emitting element within the part, the light emitting image of the three-dimensional convex part can be improved. Alternatively, in the case of an electronic device having a convex portion or a concave portion, the light emission image of the three-dimensional convex portion or concave portion can be improved.

As described above, the present invention has been described with reference to preferred embodiments, but those skilled in the art may make various modifications and changes to the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. You will understand that you can do it.

In addition, the drawing numbers described in the claims of the present invention are only used for clarity and convenience of explanation and are not limited thereto. In the process of explaining the embodiment, the thickness of the lines shown in the drawings, the size of the components, etc. may be exaggerated for clarity and convenience of explanation, and the above-mentioned terms are terms defined in consideration of functions in the present invention, which may vary depending on the intention or custom of the user or operator, so the interpretation of these terms should be decided based on the contents throughout this specification.

40: electronic device
41: support layer
42: decoration layer
43,46: protective layer
44: adhesive layer
45: Resin layer
11,12,13: Electrode pattern
21: light emitting device
32: semiconductor chip

Claims (7)

support group;
A decoration layer including transparent or opaque paste or ink on the support layer;
a protective layer on the decoration layer;
an adhesive layer on the protective layer;
A resin layer on the adhesive layer;
a sensor electrode pattern disposed on the surface of at least one of the adhesive layer and the protective layer;
a device electrode pattern disposed on the surface of at least one of the adhesive layer and the protective layer; and
It is disposed on the device electrode pattern and includes a plurality of electronic devices sealed between the resin layer and the protective layer,
The film from the support layer to the resin layer forms a convex portion or a concave portion,
An in-mold type electronic device having a touch sensor, wherein at least one of the plurality of electronic elements is disposed inside the convex portion or the concave portion. According to claim 1,
The sensor electrode pattern and the device electrode pattern are disposed on the adhesive layer,
An in-mold type electronic device having a touch sensor, wherein the plurality of electronic devices are sealed between the adhesive layer and the resin layer. According to claim 1,
The protective layer includes a first protective layer on the decoration layer; and a second protective layer on the first protective layer,
The sensor electrode pattern and the device electrode pattern are disposed on the first protective layer,
An in-mold type electronic device having a touch sensor, wherein the plurality of electronic devices are sealed between the first protective layer and the second protective layer. According to any one of claims 1 to 3,
An in-mold type electronic device with a touch sensor, wherein the sensor electrode pattern and at least a portion of the device electrode pattern are disposed within the convex portion. According to clause 4,
The sensor electrode pattern includes a sensor pattern having a plurality of opening holes; and a connection pattern connected to one or both ends of the sensor pattern. According to clause 3,
The resin layer has an opening on the convex part corresponding to the size of the convex part, and the surface of the adhesive layer is exposed through the opening. Forming a decoration layer including transparent or opaque paste or ink on the support layer;
forming a first protective layer on the decoration layer;
forming a sensor electrode pattern and a device electrode pattern on the first protective layer;
Mounting an electronic device having a semiconductor chip and a light emitting device on the device electrode pattern;
sealing the electronic device by forming a second protective layer on the first protective layer;
forming an adhesive layer on the second protective layer;
Forming a convex portion by thermoforming the film from the support layer to the adhesive layer;
It includes forming a resin layer on the surface of the adhesive layer using the film having the convex portion using a mold,
The light emitting element is disposed within the convex portion,
A method of manufacturing an in-mold type electronic device with a touch sensor, wherein the sensor electrode pattern includes a sensor pattern having a plurality of opening holes.

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