KR20240060978A - Apparatus for processing substrate - Google Patents

Abstract

The present invention relates to a substrate processing device, and is provided with a function for cooling a lid that seals an upper opening of a process chamber.
A substrate processing apparatus according to an embodiment of the present invention includes a process chamber that provides a processing space for a substrate, and a process lead that seals an upper opening of the process chamber, wherein the process lead is in close contact with the process chamber. A lid body that seals the upper opening of the process chamber, a lid cover that covers the lid body and forms a lead space between the lid body and the lid body, and is provided on an upper wall of the lid cover and faces the lid body. It includes an air injection unit that sprays air to cool the lid space.

Description

Substrate processing device {Apparatus for processing substrate}

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus equipped with a function of cooling a lid that seals an upper opening of a process chamber.

To deposit a thin film on a substrate, chemical vapor deposition (CVD) or atomic layer deposition (ALD) may be used. In the case of chemical vapor deposition or atomic layer thin film deposition, the source gas may cause a chemical reaction on the surface of the substrate to form a thin film. In particular, in the case of atomic layer thin film deposition, it is possible to form a thin film with a thickness similar to the diameter of an atom because one layer of the raw material gas attached to the surface of the substrate forms a thin film.

To expand the range of process temperature, plasma enhanced chemical vapor deposition (PECVD) or plasma enhanced atomic layer deposition (PEALD) may be used. Since plasma chemical vapor deposition and plasma atomic layer thin film deposition can be processed at a lower temperature than chemical vapor deposition and atomic layer thin film deposition, the physical properties of the thin film can be improved.

The upper opening of the process chamber where the process for the substrate is performed may be sealed by a lid. The lid includes a heater for heating the process chamber, and the interior of the lid may be heated by the heat of the heater. If the heat generated inside the reed continues, the components included in the reed may be thermally deformed.

Therefore, there is a need for an invention that can effectively cool the inside of the lid.

Republic of Korea Patent Publication No. 10-2017-0064352 (2017.06.09)

The problem to be solved by the present invention is to provide a substrate processing device equipped with a function of cooling a lid that seals the upper opening of a process chamber.

The problems of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

A substrate processing apparatus according to an embodiment of the present invention includes a process chamber that provides a processing space for a substrate, and a process lead that seals an upper opening of the process chamber, wherein the process lead is in close contact with the process chamber. A lid body that seals the upper opening of the process chamber, a lid cover that covers the lid body and forms a lead space between the lid body and the lid body, and is provided on an upper wall of the lid cover and faces the lid body. It includes an air injection unit that sprays air to cool the lid space.

The process chamber includes a showerhead that sprays process gas for processing the substrate, the process lead is disposed in the lead space, and includes a heater that heats the showerhead.

The air injection unit includes an air injection surface having a preset area of a certain size, and a plurality of air nozzles that are distributed over the entire area of the air injection surface and spray air.

The plurality of air nozzles are arranged to spray air in a uniform amount over the entire area of the air injection surface, or are arranged to spray air in a concentrated or sparse manner in at least a portion of the air injection surface.

The plurality of air nozzles have the same size and are arranged at uniform intervals over the entire area of the air injection surface, have the same size and are arranged to be concentrated in at least a portion of the air injection surface, or at least some of the air nozzles are different from each other. It has a size and is arranged at uniform intervals over the entire area of the air injection surface, or at least some of it has a different size and is arranged to be concentrated in at least a partial area of the air injection surface.

The substrate processing apparatus further includes a cooling unit that cools the air of the air injection unit with cold air generated by circulating a refrigerant.

The cooling unit is provided on the upper wall of the lid cover, and the air injection unit is disposed in close contact with the upper part of the cooling unit.

The cooling unit includes an air hole through which air from the air injection unit passes.

The air injection unit includes a plurality of air nozzles that spray air, and each of the plurality of air nozzles is inserted into the air hole.

The cooling unit is arranged to surround the air injection unit and transmits cold air through a contact surface with the air injection unit.

The substrate processing apparatus further includes an air path switching unit that guides the air sprayed from the air injection unit in a specific direction.

Specific details of other embodiments are included in the detailed description and drawings.

According to the substrate processing apparatus according to the embodiment of the present invention as described above, air is sprayed in the form of a shower from the top of the lead, so there is an advantage that the entire inside of the lead is uniformly cooled.

1 is a diagram showing a substrate processing apparatus according to an embodiment of the present invention.
Figure 2 is a diagram showing air being sprayed from the air injection unit.
Figure 3 is a diagram showing air nozzles having the same size arranged at uniform intervals over the entire area of the air injection surface.
Figure 4 is a diagram showing that air nozzles having the same size are arranged to be concentrated on a partial area of the air injection surface.
Figure 5 is a diagram showing air nozzles having different sizes arranged at uniform intervals over the entire area of the air injection surface.
Figure 6 is a diagram showing air nozzles having different sizes arranged to be concentrated in some areas of the air injection surface.
FIG. 7 is a diagram showing that a substrate processing apparatus is equipped with an air path switching unit.
Figure 8 is a diagram showing a substrate processing apparatus according to another embodiment of the present invention.
Figure 9 is a diagram showing that the air nozzle of the air injection unit is inserted into the air hole of the cooling unit.
Figure 10 is a diagram showing a substrate processing device according to another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various different forms. The present embodiments are merely intended to ensure that the disclosure of the present invention is complete and to provide common knowledge in the technical field to which the present invention pertains. It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

Unless otherwise defined, all terms (including technical and scientific terms) used in this specification may be used with meanings that can be commonly understood by those skilled in the art to which the present invention pertains. Additionally, terms defined in commonly used dictionaries are not interpreted ideally or excessively unless clearly specifically defined.

1 is a diagram showing a substrate processing apparatus according to an embodiment of the present invention.

Referring to FIG. 1, the substrate processing apparatus 10 according to an embodiment of the present invention includes a process chamber 100, a substrate supporter 200, a showerhead 300, a power supply unit 400, and a process lead 500. It consists of:

The process chamber 100 provides a processing space for processing the substrate W. The process chamber 100 may be provided with a substrate support unit 200. The substrate supporter 200 may support the substrate (W). The substrate support 200 may have a seating surface on which the substrate W can be seated. A process may be performed on the substrate W seated on the seating surface of the substrate support 200.

The substrate support 200 may heat the substrate W. For this purpose. A heater (not shown) may be provided inside the substrate support unit 200. Heat emitted from the heater may be transferred to the substrate W through the body of the substrate supporter 200.

The substrate support 200 may include a grounded electrode (not shown). As will be described later, when RF power is supplied to the showerhead 300, an electric field may be formed between the showerhead 300 and the substrate supporter 200.

The showerhead 300 serves to spray process gas for processing the substrate W. The showerhead 300 may be placed at the top of the process chamber 100. The process gas sprayed from the showerhead 300 moves downward and reaches the substrate W.

In the present invention, the process gas may include a source gas and a reaction gas. The source gas and the reaction gas may be injected sequentially or simultaneously from the showerhead 300. After the source gas and the reaction gas are sprayed from the showerhead 300, they may collide with each other and react. Then, the source gas activated by the reaction gas may contact the substrate W to perform processing on the substrate W. For example, the activated source gas may be deposited as a thin film on the substrate W.

The power supply unit 400 may supply RF power for generating plasma to the process chamber 100 . Specifically, the power supply unit 400 may supply RF power to the showerhead 300 provided in the process chamber 100. An electrode plate (not shown) that receives RF power may be provided on the ceiling of the showerhead 300. As described above, the substrate support 200 may include a grounded electrode. When RF power is supplied to the electrode plate, an electric field may be formed between the electrode plate and the electrode of the substrate support unit 200. The process gas flowing into the process chamber 100 is converted into particles in a plasma state by the electric field formed by the supply of RF power, and the plasma particles react with each other or with the surface of the substrate W to form particles on the substrate W. Processing may be performed.

The process lid 500 may seal the upper opening of the process chamber 100. For example, the process lid 500 may rotate with respect to the process chamber 100 to close or open the upper opening of the process chamber 100 .

The process lid 500 includes a lid body 510, a lid cover 520, a top plate 530, a heater 540, and an air injection unit 550.

The lid body 510 is in close contact with the process chamber 100 and serves to seal the upper opening of the process chamber 100. When the upper opening of the process chamber 100 is sealed by the lid body 510, the flow of fluid through the upper opening of the process chamber 100 may be blocked. The lid body 510 may be provided with a top plate 530. For example, the top plate 530 may be disposed at the center of the lid body 510. At least a portion of the upper opening of the process chamber 100 may be sealed by the top plate 530 .

The lid cover 520 may cover the lead body 510 and form a lead space LS between the lead cover 520 and the lead body 510 . For example, one side of the lid body 510 may face the process chamber 100, and the other side of the lid body 510 that does not face the process chamber 100 may face upward. The lid cover 520 may cover the upper part of the lid body 510 to form a lid space LS.

An impedance matcher (not shown) may be provided between the aforementioned power supply unit 400 and the process chamber 100 to match the impedance of the power supply unit 400 and the impedance of the process chamber 100. If external noise is transmitted to the lead body 510, correct impedance matching may not be performed. The lead cover 520 may play a role in improving impedance matching efficiency by blocking external noise.

The lid cover 520 is provided with an air outlet 521, and an air outlet line 610 may be connected to the air outlet 521. The air discharge line 610 may provide a path for discharging air from the lid space LS. Air heated by the heater 540 may be discharged from the lid space LS through the air outlet 521 and the air discharge line 610.

Meanwhile, Figure 1 shows that one air outlet 521 is provided in the lid cover 520, but two or more air outlets 521 may be provided in the lid cover 520. Additionally, the air outlet 521 may be provided in the lid body 510 instead of the lid cover 520, or may be provided in both the lid cover 520 and the lid body 510.

The heater 540 is disposed in the lid space LS and serves to heat the showerhead 300 by generating heat. The heater 540 and the showerhead 300 may be disposed with the top plate 530 interposed therebetween. A heater 540 may be disposed on the upper side of the top plate 530, and a showerhead 300 may be disposed on the lower side of the top plate 530. Heat from the heater 540 may be transferred to the showerhead 300 through the top plate 530. The process gas supplied to the showerhead 300 is heated and then sprayed, so that conversion into plasma particles can be performed more smoothly.

The air injection unit 550 is provided on the upper wall of the lid cover 520 and serves to cool the lid space LS by spraying air toward the lid body 510. A sealed lid space LS may be formed by coupling the lid cover 520 to the lid body 510. Meanwhile, when the heater 540 operates to heat the showerhead 300, heat from the heater 540 may circulate in the lead space LS. If heat from the heater 540 is not discharged from the lead space LS, components included in the lead space LS may be damaged. The air injection unit 550 serves to reduce the internal temperature of the lead space LS by spraying cooled air into the lead space LS.

An air supply line 620 may be connected to the air injection unit 550. The air supply line 620 may provide a path for supplying air to the air injection unit 550. The air injection unit 550 may spray air transported through the air supply line 620 into the lid space LS.

Figure 2 is a diagram showing air being sprayed from the air injection unit.

Referring to FIG. 2 , air CA may be injected into the lead space LS through the air injection unit 550.

The air (CA) supplied to the air injection unit 550 may be cooled by a separate heat exchanger (not shown). While air (CA) is being sprayed through the air injection unit 550, air (HA) heated by the heater 540 is discharged from the lead space (LS) through the air outlet 521 and the air discharge line 610. It can be. The air (HA) heated by the heater 540 is replaced with cooled air (CA) sprayed from the air injection unit 550. Accordingly, while the showerhead 300 is heated by the heater 540, an increase in the internal temperature of the lead space LS can be prevented.

Figure 3 is a diagram showing air nozzles with the same size arranged at even intervals over the entire area of the air injection surface, and Figure 4 shows air nozzles with the same size arranged to be concentrated in a partial area of the air injection surface. Figure 5 is a diagram showing that air nozzles with different sizes are arranged at uniform intervals over the entire area of the air injection surface, and Figure 6 shows air nozzles with different sizes in some areas of the air injection surface. This is a drawing showing the arrangement to be focused on.

Referring to FIGS. 3 to 6 , the air injection unit 550 may include an air injection surface 550a and an air nozzle 551.

The air injection surface 550a is one side of the air injection unit 550 facing the lid body 510 and may have an area of a predetermined size. The air injection surface 550a is provided with an air nozzle 551 through which air is sprayed. As the area of the air injection surface 550a becomes larger, it becomes possible to spray air into a wider area of the lid body 510.

The air nozzle 551 serves to spray air supplied to the air spray unit 550. In the present invention, a plurality of air nozzles 551 may be provided. The plurality of air nozzles 551 may be distributed over the entire area of the air injection surface 550a and spray air.

The plurality of air nozzles 551 may be arranged to spray air in a uniform amount over the entire area of the air injection surface 550a. In this case, air is sprayed in a uniform amount throughout the lid space LS, and the temperature can be reduced uniformly throughout the lid space LS.

Alternatively, the plurality of air nozzles 551 may be arranged to spray air in a concentrated or sparse manner in at least a portion of the air injection surface 550a. For example, a plurality of air nozzles 551 may be disposed on the air injection surface 550a so that air is sprayed in a concentrated manner at the center of the lid body 510 or sprayed sparsely. When air is concentrated at the center of the lid body 510, the temperature decrease at the center of the lid space LS may be more noticeable than the temperature decrease at the edges.

The air injection unit 550 may be provided with a width greater than or equal to that of the heater 540 in order to smoothly circulate the heat of the heater 540. For example, the horizontal width (horizontal length in FIG. 1) of the air injection unit 550 may be greater than or equal to the horizontal width of the heater 540. In detail, the gap between the air nozzles 551 located at both ends of the air injection surface 550a may be greater than or equal to the horizontal width of the heater 540. Here, the air nozzles 551 located at both ends refer to the air nozzles 551 located at the edge area of the air injection surface 550a, and the gap is the two air nozzles with the largest gap among the plurality of air nozzles 551. This refers to the gap between nozzles 551.

Preferably, in order to more effectively control the temperature of the lead space LS, the horizontal width of the air injection unit 550 may be larger than the horizontal width of the heater 540 as shown in FIG. 2, and at both ends The gap between positioned air nozzles 551 may also be larger than the horizontal width of the heater 540. Accordingly, the temperature of the entire area of the lead space LS, for example, the center and edge areas of the lead space LS, can be effectively controlled.

Referring to FIG. 3, the plurality of air nozzles 551 have the same size and may be arranged at uniform intervals over the entire area of the air injection surface 550a. In this case, temperature reduction can be performed uniformly throughout the lid space LS.

Referring to FIG. 4, the plurality of air nozzles 551 may have the same size and may be arranged to be concentrated on at least a portion of the air injection surface 550a. Figure 4 shows that the air nozzles 551 are concentrated and arranged at the center of the air injection surface 550a. For example, the distribution density of the air nozzle 551 may decrease as it progresses from the center to the edge of the air injection surface 550a. In this case, the temperature decrease at the center of the lead space LS may be more pronounced than the temperature decrease at the edges of the lead space LS.

Referring to FIG. 5 , at least some of the plurality of air nozzles 551 have different sizes and may be disposed at uniform intervals over the entire area of the air injection surface 550a. Figure 5 shows that the size of the air nozzle 551 disposed at the center of the air injection surface 550a is larger than the size of the air nozzle 551 disposed at the edge. For example, the size of the air nozzle 551 may decrease as it progresses from the center to the edge of the air injection surface 550a. In this case, the temperature decrease at the center of the lead space LS may be more pronounced than the temperature decrease at the edges of the lead space LS.

6 shows that at least some of the plurality of air nozzles 551 have different sizes and may be arranged to be concentrated on at least a portion of the air injection surface 550a. 6 shows that the air nozzles 551 are concentrated and disposed at the center of the air injection surface 550a, and the size of the air nozzle 551 disposed at the center of the air injection surface 550a is the size of the air nozzle 551 disposed at the edge. ) is shown to be large compared to the size of . For example, as the air injection surface 550a progresses from the center to the edge, the distribution density of the air nozzle 551 may decrease and the size of the air nozzle 551 may decrease. In this case, the temperature decrease at the center of the lead space LS may be more pronounced than the temperature decrease at the edges of the lead space LS.

4 to 6 show the distribution of the temperature nozzle such that the temperature decrease at the center of the lead space LS is formed more clearly than the temperature decrease at the edge, but this is an example and according to some embodiments of the present invention. The temperature distribution of the nozzle can be determined in various ways. For example, the temperature nozzles can be distributed such that the temperature decrease at the edges of the lead space LS is more pronounced than the temperature decrease at the center, and the temperature decrease at different points in the lead space LS is greater than the temperature decrease at the remaining points. The temperature nozzle may be distributed so that the temperature decreases in .

FIG. 7 is a diagram showing that a substrate processing apparatus is equipped with an air path switching unit.

Referring to FIG. 7 , the substrate processing apparatus 10 may further include an air path switching unit 700.

The air path switching unit 700 serves to guide the air sprayed from the air injection unit 550 in a specific direction. For example, the air path switching unit 700 may guide the air sprayed from the air injection unit 550 to the edge of the lid space LS.

A heater 540 may be provided at the center of the lid body 510. When the air sprayed from the air injection unit 550 is delivered directly to the heater 540, the thermal efficiency of the heater 540 may be reduced. As air is guided to the edge of the lead space LS by the air path switching unit 700, the thermal efficiency of the heater 540 is maintained while the temperature of the lead space LS is reduced.

Figure 8 is a diagram showing a substrate processing device according to another embodiment of the present invention.

Referring to FIG. 8 , a substrate processing apparatus 20 according to another embodiment of the present invention may further include a cooling unit 800 in addition to the substrate processing apparatus 10 shown in FIG. 1 .

The cooling unit 800 can cool the air in the air injection unit 550 with cold air generated by circulating refrigerant. For example, the refrigerant may be process cooling water (PCW), but the refrigerant of the present invention is not limited to process cooling water.

A refrigerant supply line 630 may be connected to the cooling unit 800. The refrigerant supply line 630 may provide a path for supplying refrigerant to the cooling unit 800. The cooling unit 800 may generate cold air by circulating the refrigerant transferred through the refrigerant supply line 630. Meanwhile, although not shown in FIG. 8, a refrigerant discharge line (not shown) for discharging the refrigerant circulated in the cooling unit 800 may be connected to the cooling unit 800.

The cooling unit 800 is provided on the upper wall of the lid cover 520, and the air injection unit 550 may be placed in close contact with the upper part of the cooling unit 800. The cooling unit 800 may include an air hole 810 through which air from the air injection unit 550 passes. As described above, the air injection unit 550 is provided with a plurality of air nozzles 551, and the cooling unit 800 may be provided with an air hole 810 corresponding to each of the plurality of air nozzles 551. . Air sprayed from each air nozzle 551 may pass through the corresponding air hole 810.

Air may be cooled while passing through the air hole 810. Cold air may exist in the air hole 810, and air passing through the air hole 810 may be cooled by the cold air. Cooled air can be sprayed into the lid space LS by the cooling unit 800, and the temperature reduction efficiency of the lid space LS can be improved.

Figure 9 is a diagram showing that the air nozzle of the air injection unit is inserted into the air hole of the cooling unit.

Referring to FIG. 9, each of the plurality of air nozzles 551 may be inserted into the air hole 810.

The air nozzle 551 may be provided in the form of a spray hole formed on the air spray surface 550a. Meanwhile, when the air nozzle 551 is provided in the form of a spray hole, air may leak through the contact surface between the air spray unit 550 and the cooling unit 800.

As shown in FIG. 9, when the air nozzle 551 is provided in a form that protrudes from the air injection surface 550a by a certain length, air flows between the contact surface of the air injection unit 550 and the cooling unit 800. Leakage can be prevented.

Figure 9 shows that the end of the air nozzle 551 is provided inside the air hole 810, but this is an example. According to some embodiments of the present invention, the end of the air nozzle 551 is provided in the air hole (810). It may coincide with the end of the air hole (810) or may deviate from the end of the air hole (810). For example, the length of the air nozzle 551 may be formed to be longer than the length of the air hole 810. In this case, cold air from the cooling unit 800 may be transferred to the air through the air nozzle 551.

Figure 10 is a diagram showing a substrate processing device according to another embodiment of the present invention.

Referring to FIG. 10 , the substrate processing apparatus 30 according to another embodiment of the present invention may include a cooling unit 900 surrounding the air injection unit 550.

The cooling unit 900 may surround the upper and edge sides of the air injection unit 550 and transmit cold air through a contact surface with the air injection unit 550. The air introduced into the air injection unit 550 may be cooled by cold air delivered from the inner wall of the air injection unit 550, and the air injection unit 550 may spray the cooled air.

Although embodiments of the present invention have been described with reference to the above and the attached drawings, those skilled in the art will understand that the present invention can be implemented in other specific forms without changing its technical idea or essential features. You will understand that it exists. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive.

10: substrate processing device 100: process chamber
200: substrate support 300: showerhead
400: power supply 500: process lead
510: Lid body 520: Lid cover
530: Top plate 540: Heater
550: Air injection unit 610: Air discharge line
620: Air supply line 630: Refrigerant supply line
700: Air path switching unit 800, 900: Cooling unit
810: Air hole

Claims (11)

A process chamber providing processing space for a substrate; and
A process lid sealing the upper opening of the process chamber,
The process lead is,
a lid body that comes in close contact with the process chamber and seals the upper opening of the process chamber;
a lid cover that covers the lid body and forms a lead space between the lid body and the lid body; and
A substrate processing apparatus including an air injection unit provided on an upper wall of the lid cover and spraying air toward the lid body to cool the lead space. According to claim 1,
The process chamber includes a showerhead that sprays process gas for processing the substrate,
The process lead is disposed in the lead space and includes a heater that heats the showerhead. According to claim 1,
The air injection unit,
An air injection surface having a preset area of a certain size; and
A substrate processing apparatus comprising a plurality of air nozzles distributed over the entire area of the air injection surface and spraying air. According to clause 3,
The plurality of air nozzles are,
It is arranged to spray air in a uniform amount over the entire area of the air injection surface, or
A substrate processing device arranged to spray air in a concentrated or sparse manner from at least a portion of the air injection surface. According to clause 3,
The plurality of air nozzles are,
Has the same size and is disposed at even intervals over the entire area of the air injection surface,
It has the same size and is arranged to be concentrated on at least a portion of the air injection surface,
At least some of them have different sizes and are disposed at even intervals over the entire area of the air injection surface, or
A substrate processing device wherein at least some parts have different sizes and are arranged to be concentrated on at least some areas of the air injection surface. According to claim 1,
A substrate processing apparatus further comprising a cooling unit that cools the air of the air injection unit with cold generated by circulating a refrigerant. According to clause 6,
A substrate processing apparatus wherein the cooling unit is provided on an upper wall of the lid cover, and the air injection unit is disposed in close contact with an upper part of the cooling unit. According to clause 6,
The cooling unit is a substrate processing device including an air hole through which air from the air injection unit passes. According to clause 8,
The air injection unit includes a plurality of air nozzles that spray air,
A substrate processing device wherein each of the plurality of air nozzles is inserted into the air hole. According to clause 6,
The cooling unit is disposed to surround the air injection unit, and transmits cold air through a contact surface with the air injection unit. According to claim 1,
A substrate processing apparatus further comprising an air path switching unit that guides the air sprayed from the air injection unit in a specific direction.

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