KR20240058813A - Light emitting diode package, backlight unit and liquid crystal display device comprising the same - Google Patents

Abstract

The present invention provides a light emitting diode package that prevents image quality from deteriorating, a backlight unit including the same, and a liquid crystal display device. The present invention provides an encapsulation layer surrounding a light emitting diode chip, and a plurality of layers emitting at least one color included in the encapsulation layer. It includes a phosphor and a selective light absorbing material disposed on the phosphor.

Description

Light emitting diode package and backlight unit and liquid crystal display device including the same {LIGHT EMITTING DIODE PACKAGE, BACKLIGHT UNIT AND LIQUID CRYSTAL DISPLAY DEVICE COMPRISING THE SAME}

The present invention relates to a light emitting diode package, a backlight unit including the same, and a liquid crystal display device.

An active matrix type liquid crystal display device displays moving images using a thin film transistor as a switching element. This liquid crystal display device can be miniaturized compared to a cathode ray tube (CRT), so it is used as a display in portable information devices, office equipment, computers, etc., and is also applied to televisions, quickly replacing cathode ray tubes. Since such a liquid crystal display device is not a self-light emitting device, a backlight unit is provided at the bottom of the liquid crystal panel and images are displayed using light emitted from the backlight unit.

The backlight unit includes a light source, and with the advancement of technology, the light source has gone from Cold Cathode Fluorescent Lamp (CCFL) to Light Emitting Diode (LED). Light-emitting diodes are widely used as light sources for liquid crystal displays due to their advantages of long lifespan, fast response characteristics, low power consumption, and miniaturization compared to existing fluorescent lamps.

For liquid crystal display devices including a light source, research and development is in progress in terms of technology, such as image quality such as high color reproduction. However, conventional liquid crystal display devices developed to date have limitations in improving technical aspects due to the characteristics of the light source. For example, a conventional light source may have a problem in that color reproducibility is deteriorated because the half width of the peak in the light spectrum is wide.

The present invention was developed to solve the above-mentioned problems, and its technical task is to provide a light emitting diode package that prevents image quality from deteriorating, a backlight unit including the same, and a liquid crystal display device.

The present invention for achieving the above-described technical problem is a light-emitting diode package including an encapsulation layer surrounding a light-emitting diode chip, a plurality of phosphors emitting at least one color included in the encapsulation layer, and a selective light-absorbing material disposed on the phosphor. and a backlight unit and liquid crystal display device including the same.

By coating the light-absorbing layer of the light-emitting diode package according to an example of the present invention on the surface of the phosphor, the luminous flux can be improved, and the cost can be reduced because the light-absorbing material is coated only on the surface of the phosphor.

The light emitting diode package according to an example of the present invention can emit more vivid colors by reducing the half width of the peak in the light spectrum, thereby enabling high color reproduction and preventing deterioration of image quality of the backlight unit and liquid crystal display device. can do.

The effects that can be obtained from the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description below. .

1 is a perspective view of a liquid crystal display device according to an example of the present invention.
Figure 2 is an exploded perspective view to specifically explain a liquid crystal display device according to an example of the present invention.
Figure 3A is a perspective view of a light source module including a light emitting diode package according to a first example of the present invention.
Figure 3b is a cross-sectional view of a light source module including a light emitting diode package according to a first example of the present invention.
Figure 4 is a cross-sectional view of a light source module including a light emitting diode package according to a second example of the present invention.
Figure 5 is a cross-sectional view of a light source module including a light emitting diode package according to a third example of the present invention.
Figure 6 is a cross-sectional view of a light source module including a light emitting diode package according to a fourth example of the present invention.
Figure 7 is a cross-sectional view of a liquid crystal display device according to another example of the present invention.
8 to 10 are optical spectrum graphs showing the intensity by wavelength of the light emitting diode package according to the first example of the present invention.

The meaning of terms described in this specification should be understood as follows.

Singular expressions should be understood to include plural expressions unless the context clearly defines otherwise, and terms such as “first” and “second” are used to distinguish one element from another element. The scope of rights should not be limited by these terms. Terms such as “include” or “have” should be understood as not precluding the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. The term “at least one” should be understood to include all possible combinations from one or more related items. For example, “at least one of the first, second, and third items” means each of the first, second, or third items, as well as two of the first, second, and third items. It means a combination of all items that can be presented from more than one. The term “on” means not only the case where a component is formed directly on top of another component, but also the case where a third component is interposed between these components.

Hereinafter, a preferred example of a light emitting diode package according to the present invention, a backlight unit including the same, and a liquid crystal display device will be described in detail with reference to the attached drawings. In adding reference numerals to components in each drawing, identical components may have the same reference numerals as much as possible even if they are shown in different drawings. Additionally, when describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description may be omitted.

FIG. 1 is a perspective view of a liquid crystal display device according to an example of the present invention, and FIG. 2 is an exploded perspective view for specifically explaining the liquid crystal display device according to an example of the present invention.

1 and 2, the liquid crystal display device according to an example of the present invention includes a liquid crystal panel 110, a panel driver 120, a panel supporter 130, a backlight unit 140, an exterior case 150, and a front portion cover 160.

The liquid crystal panel 110 displays an image by adjusting the light transmittance of the liquid crystal layer, and includes a lower substrate, an upper substrate, a lower polarizing member, and an upper polarizing member bonded in opposition with a liquid crystal layer (not shown) in between. can do. In this way, the liquid crystal panel 110 displays a predetermined color image according to the light transmittance of the liquid crystal layer by driving the liquid crystal layer according to the electric field formed for each pixel by the data voltage and common voltage applied to each pixel.

The panel driver 120 is connected to a pad provided on the lower substrate and drives each pixel of the liquid crystal panel 110 to display a predetermined color image on the liquid crystal panel 110. The panel driver 120 according to an example includes a plurality of circuit films 122 connected to the pad portion of the liquid crystal panel 110, a data driving integrated circuit 126 mounted on each of the plurality of circuit films 122, and a plurality of circuits. It is configured to include a printed circuit board for display 124 coupled to each of the films 122, and a timing control unit 128 mounted on the printed circuit board 124 for display.

Each of the circuit films 122 is attached between the pad portion of the lower substrate and the display printed circuit board 124 through a film attachment process, and is called a Tape Carrier Package (TCP) or Chip On Flexible Board (COF) or Chip On Film. ) can be achieved. Each of these plurality of circuit films 122 may be bent along one side, that is, the lower side, of the liquid crystal panel 110 and disposed on the rear side of the guide frame 132.

The data driving integrated circuit 126 is mounted on each of the plurality of circuit films 122 and connected to the pad portion through the circuit films 122. This data driving integrated circuit 126 receives pixel data and data control signals for each pixel supplied from the timing control unit 128, converts the pixel data for each pixel into an analog data signal according to the data control signal, and transmits the data signal through the pad unit. Supply to the corresponding data line.

The display printed circuit board 124 is connected to a plurality of circuit films 122. The display printed circuit board 124 serves to provide the data driving integrated circuit 126 and the gate driving circuit with signals necessary to display an image in each pixel of the liquid crystal panel 110. For this purpose, various signal wires, various power circuits (not shown), and memory elements (not shown) are mounted on the display printed circuit board 124.

The timing control unit 128 is mounted on the display printed circuit board 124 and transmits digital image data input from the driving system in response to a timing synchronization signal supplied from an external driving system (not shown) to the liquid crystal panel 110. Pixel data for each pixel is generated by aligning it appropriately with the pixel arrangement structure, and the generated pixel data for each pixel is provided to the data driving integrated circuit 126. Additionally, the timing control unit 128 controls the driving timing of each of the data driving integrated circuit 126 and the gate driving circuit by generating a data control signal and a gate control signal based on the timing synchronization signal.

Additionally, the timing control unit 128 may individually control the luminance of each region of the liquid crystal panel 110 by controlling the backlight unit 140 through edge-type local dimming technology.

The panel support 130 includes a guide frame 132 and a storage case 134.

The guide frame 132 supports the liquid crystal panel 110 at a lower portion of the liquid crystal panel 110.

The storage case 134 accommodates the backlight unit 140 and supports the guide frame 132.

The backlight unit 140 is disposed below the liquid crystal panel 110 and irradiates light to the lower surface. Accordingly, the backlight unit 140 is disposed below the liquid crystal panel 110. At this time, the backlight unit 140 is stored in the storage case 134. The backlight unit 140 according to one example may include a reflective sheet 142, a light guide plate 144, an optical sheet unit 146, and a light source module 148.

The reflective sheet 142 is disposed on the lower surface of the light guide plate 144 and reflects light incident from the light guide plate 144 toward the light guide plate 144, thereby minimizing loss of light traveling to the back of the light guide plate 144.

The light guide plate 144 is formed in a flat (or wedge) shape to have a light incident surface provided on the first side, and allows light incident from the light source module 148 through the light incident surface to proceed toward the liquid crystal panel 110.

The optical sheet portion 146 is disposed on the light guide plate 144 and may include, but is not limited to, a lower diffusion sheet, a prism sheet, and an upper diffusion sheet, and may include a diffusion sheet, a prism sheet, and a dual luminance enhancement sheet. It may be composed of a laminated combination of two or more selected from a film (dual brightness en-hancement film) and a lenticular sheet.

The light source module 148 is arranged to face the first side of the light guide plate 144 and irradiates light to a light incident surface provided on one side of the light guide plate 144. The light source module 148 according to an example includes a plurality of light emitting diode packages (LPK) mounted on a printed circuit board (PCB) for a light source and emitting white light by emitting light according to a light source drive signal supplied from a backlight driver (not shown). Includes. A detailed description of the light source module 148 will be provided in detail in FIGS. 3A to 10, which will be described later.

The exterior case 150 accommodates the storage case 134 and forms an exterior appearance by wrapping the side of the guide frame 132.

The front cover 160 is coupled to the guide frame 132 to cover one edge of the liquid crystal panel 110. This front partial cover 160 hides the panel driver 120 connected to one edge of the liquid crystal panel 110.

FIG. 3A is a perspective view of a light source module including a light emitting diode package according to a first example of the present invention, and FIG. 3B is a cross-sectional view of a light source module including a light emitting diode package according to a first example of the present invention, line II-I of FIG. 3A. It is a cross section of a line.

3A and 3B, the light source module 148 including the light emitting diode package according to the first example of the present invention includes a printed circuit board (PCB) and a light emitting diode package (LPK).

The printed circuit board (PCB) includes a driving power line through which driving power is supplied from the outside. This printed circuit board (PCB) supplies driving power supplied from the outside through a driving power line to the light emitting diode chip 10 of the light emitting diode package (LPK), thereby causing the light emitting diode chip 10 to emit light. .

At least one light emitting diode package (LPK) is disposed on a printed circuit board (PCB). The light emitting diode package (LPK) according to the first example of the present invention includes a light emitting diode chip 10, an encapsulation layer 20, and a glass cover 30.

The light emitting diode chip 10 is mounted on a printed circuit board (PCB). This light emitting diode chip 10 is electrically connected to a driving power line formed on a printed circuit board (PCB) and emits light by driving power supplied from the driving power line. The light emitting diode chip 10 emits first color light according to the driving power. As an example, the light emitting diode chip 10 may be a blue light emitting diode chip 10 that emits blue light. Additionally, the light emitting diode chip 10 may have a lateral chip structure, a flip chip structure, a vertical chip structure, and a chip scale package structure.

The encapsulation layer 20 is filled in the encapsulation space provided between the light emitting diode chip 10 and the glass cover 30, which will be described later, to seal the light emitting diode chip 10. This encapsulation layer 20 may be made of a mixed material of an encapsulation material and phosphor (PP).

The phosphor (PP) is a plurality of fluorescent substances that emit at least one color included in the encapsulation layer 20. The phosphor PP may be a yellow fluorescent material, but is not limited thereto and may be one or more color fluorescent materials for generating white light according to the color light emitted from the light emitting diode chip 10. The phosphor PP according to one example may absorb a portion of the blue light emitted from the light emitting diode chip 10 and emit yellow light. In the encapsulation layer 20 according to one example, white light is generated by mixing blue light emitted from the light emitting diode chip 10 and yellow light emitted by the phosphor PP and may be emitted to the outside.

The glass cover 30 covers the light emitting diode chip 10 and is mounted on a printed circuit board (PCB). The glass cover 30 has a cap shape to cover the light emitting diode chip 10, and the light emitting diode chip 10 and the encapsulation layer 20 are provided in the groove provided in the glass cover 30. The glass cover 30 is arranged to surround the light emitting diode chip 10 except for the surface in contact with the printed circuit board (PCB). Accordingly, all light emitted from the light emitting diode chip 10 passes through the glass cover 30 and enters the light incident surface of the light guide plate 144. The glass cover 30 of the light emitting diode package (LPK) according to the first example of the present invention is doped with a selective light absorption material. The selective light absorbing material absorbs wavelengths in a specific region of the visible light region, which reduces color purity, thereby enabling the light emitted from the light emitting diode package (LPK) to reproduce high colors. The selective light absorbing material according to one example can absorb light in the range of 570 nm to 600 nm. Additionally, the selective light absorbing material according to an example of the present invention may be neodymium oxide (Nd2O3).

In the light emitting diode package (LPK) according to the first example of the present invention, the glass cover 30 is provided in the shape of a cap so that all light emitted from the light emitting diode chip 10 passes through the glass cover 30, By doping the glass cover 30 with a selective light absorbing material, the half width of the peak in the light spectrum emitted from the light emitting diode chip 10 is reduced. Therefore, the light emitting diode package (LPK) according to the first example of the present invention can emit more vivid colors by reducing the half width of the peak in the light spectrum, thereby enabling high color reproduction and displaying the backlight unit 140 and the liquid crystal display. It is possible to prevent the image quality of the device 100 from deteriorating.

Figure 4 is a cross-sectional view of a light source module including a light emitting diode package according to a second example of the present invention.

Referring to FIG. 4, the light source module 148 including a light emitting diode package (LPK) according to the second example of the present invention causes the light emitting diode chip 10 to emit light by supplying driving power to the light emitting diode chip 10. Includes printed circuit board (PCB) and light emitting diode package (LPK).

At least one light emitting diode package (LPK) is disposed on a printed circuit board (PCB). A light emitting diode package (LPK) according to a second example of the present invention includes a light emitting diode chip 10, a mold frame 15, an encapsulation layer 20, and a glass cover 30.

The light emitting diode chip 10 is mounted on the mold frame 15. The light emitting diode chip 10 emits first color light according to the driving power. As an example, the light emitting diode chip 10 may be a blue light emitting diode chip 10 that emits blue light. Additionally, the light emitting diode chip 10 may have a lateral chip structure, a flip chip structure, a vertical chip structure, and a chip scale package structure.

The mold frame 15 mounts the light emitting diode chip 10 on the bottom surface and includes a side wall disposed to be bent vertically from the bottom surface and inclined at a predetermined angle. The mold frame 15 allows light emitted from the light emitting diode chip 10 to be emitted upward by the side wall and defines a light emitting area. The mold frame 15 supports the glass cover 30, which will be described later, with a support surface provided on the side wall.

The encapsulation layer 20 fills the encapsulation space provided by the mold frame 15 to encapsulate the light emitting diode chip 10. That is, the encapsulation layer 20 fills the light emitting space provided by the side wall of the mold frame 15 and covers the light emitting diode chip 10. This encapsulation layer 20 may be made of a mixed material of an encapsulation material and phosphor (PP).

The phosphor (PP) may be a yellow fluorescent material, but is not limited thereto and may be one or more color fluorescent materials for generating white light according to the color light emitted from the light emitting diode chip 10. The phosphor PP according to one example may absorb a portion of the blue light emitted from the light emitting diode chip 10 and emit yellow light. In the encapsulation layer 20 according to one example, white light is generated by mixing blue light emitted from the light emitting diode chip 10 and yellow light emitted by the phosphor PP and may be emitted to the outside.

The glass cover 30 is placed on the side wall of the mold frame 15 to face the light emitting diode chip 10. The glass cover 30 is disposed to be larger than the area of the encapsulation layer 20 so as to cover the encapsulation layer 20 . Accordingly, all light emitted from the light emitting diode chip 10 passes through the glass cover 30 and enters the light incident surface of the light guide plate 144. The glass cover 30 of the light emitting diode package (LPK) according to the second example of the present invention is doped with a selective light absorption material. The selective light absorbing material absorbs wavelengths in a specific region of the visible light range, allowing the light emitted from the light emitting diode package (LPK) to reproduce high colors. The selective light absorbing material according to one example can absorb light in the range of 570 nm to 600 nm. Additionally, the selective light absorbing material according to an example of the present invention may be neodymium oxide (Nd2O3).

As such, the light emitting diode package (LPK) according to the second example of the present invention has a glass cover in a form that covers the upper surface of the mold frame 15 so that all light emitted from the light emitting diode chip 10 passes through the glass cover 30. (30) is provided, and the glass cover (30) is doped with a selective light absorbing material to reduce the full width at half maximum of the peak in the light spectrum emitted from the light emitting diode chip (10). Therefore, the light emitting diode package (LPK) according to the second example of the present invention can emit more vivid colors by reducing the half width of the peak in the light spectrum, thereby enabling high color reproduction and displaying the backlight unit 140 and the liquid crystal display. It is possible to prevent the image quality of the device 100 from deteriorating.

Figure 5 is a cross-sectional view of a light source module including a light emitting diode package according to a third example of the present invention. In the light emitting diode package (LPK) according to the third example shown in FIG. 4, the glass cover 30 is omitted and the light absorption layer 35 is added to the encapsulation layer 20. Accordingly, in the following description, only the encapsulation layer 20 and the light absorption layer 35 will be described, and duplicate descriptions of the same components will be omitted.

Referring to FIG. 5, the encapsulation layer 20 of the light emitting diode package (LPK) according to the third example of the present invention is filled in the encapsulation space provided by the mold frame 15 to encapsulate the light emitting diode chip 10. . That is, the encapsulation layer 20 fills the light emitting space provided by the side wall of the mold frame 15 and covers the light emitting diode chip 10. This encapsulation layer 20 may be made of a mixed material of an encapsulation material and phosphor (PP).

When the light emitting diode chip 10 according to an example of the present invention emits first color light, the phosphor PP may include a second color phosphor P1 and a third color phosphor P2. The light emitting diode package (LPK) according to an example of the present invention can emit blue light as the first color light, the second color phosphor (P1) is a green phosphor and the third color phosphor ( P2) may be a red fluorescent material, but is not limited to this and may be one or more color fluorescent materials for generating white light according to the color light emitted from the light emitting diode chip 10. The second color phosphor (P1) according to an example may emit green light by absorbing a part of the blue light emitted from the light emitting diode chip 10, and the third color phosphor (P2) may absorb a portion of the blue light emitted from the light emitting diode chip 10. Red light can be emitted by absorbing part of the emitted blue light. In the encapsulation layer 20 according to one example, white light is generated by mixing blue light emitted from the light emitting diode chip 10 and green and red light emitted by the phosphor (PP) and may be emitted to the outside.

The light absorption layer 35 is coated on the surface of the second color phosphor (P1) and covers the second color phosphor (P1). Accordingly, all light incident from the light emitting diode chip 10 to the second color phosphor P1 passes through the light absorption layer 35 and enters the light incident surface of the light guide pin 144. The light absorption layer 35 may be coated on the surface of one or more types of phosphor (PP). The light absorption layer 35 of the light emitting diode package (LPK) according to the third example of the present invention is made of a selective light absorption material. The selective light absorbing material absorbs wavelengths in a specific region of the visible light region, allowing the light emitted from the light emitting diode package (LPK) to reproduce high colors. The selective light absorbing material according to one example can absorb light in the range of 570 nm to 600 nm. Additionally, the selective light absorbing material according to an example of the present invention may be neodymium oxide (Nd2O3).

In the light emitting diode package (LPK) according to the third example of the present invention, the light absorption layer 35 is coated only on the surface of the phosphor (PP). Accordingly, in the light emitting diode package (LPK) according to the third example of the present invention, some of the first color light emitted from the light emitting diode chip 10 is incident on the light absorption layer 35, but the remaining light is incident on the light absorption layer 35. It can pass through the phosphor (PP) without being incident on it. Accordingly, the light emitting diode package (LPK) according to the third example of the present invention can improve the luminous flux and reduce the cost because the light absorbing material is coated only on the surface of the phosphor (PP).

Figure 6 is a cross-sectional view of a light source module including a light emitting diode package according to a fourth example of the present invention.

Referring to FIG. 6, the light source module 148 according to an example of the present invention includes a printed circuit board (PCB), a light emitting diode package (LPK), and a light guide member (LG). The printed circuit board (PCB) and light emitting diode package (LPK) are the same as the light source module 148 according to the first example of the present invention. Accordingly, in the following description, only the light guide member LG will be described, and duplicate descriptions of the same configuration will be omitted.

Referring to FIG. 6, the light source module 148 according to the fourth example of the present invention has a light guide member (LG) disposed on the side of the light emitting diode package (LPK). The light guide member LG is disposed on a printed circuit board (PCB) and guides light emitted from the light emitting diode package (LPK) to the light guide plate 144. By arranging the light guide member (LG) on the side of the light emitting diode package (LPK), the light emitted from the light emitting diode package (LPK) is prevented from leaking to the side, and the heat generated from the light emitting diode package (LPK) is prevented from leaking to the outside. You can prevent it from going out.

Figure 7 is a cross-sectional view of a liquid crystal display device according to another example of the present invention.

Referring to FIG. 7, a liquid crystal display device according to another example of the present invention includes a lower case 135, a light source module 148, a reflective member 142, a diffusion plate 145, an optical sheet unit 146, and a liquid crystal. Includes panel 110.

The lower case 135 accommodates the light source module 148 and the reflective member 142, and supports the diffusion plate 145. This lower case 135 is preferably made of a metal material in order to dissipate heat generated from the light source module 148.

The light source modules 148 are comprised of a plurality of light source modules 148, and each of the plurality of light source modules 148 is arranged side by side and spaced apart from each other on the bottom surface of the lower case 135 and is connected to a light source driving signal line. These plurality of light source modules 148 irradiate light to the lower surface of the diffusion plate 145. At this time, each of the plurality of light source modules 148 may emit light simultaneously or individually depending on the light source driving signal supplied from the light source driving signal. Here, each of the plurality of light source modules 148 may individually emit light according to a local dimming method to partially control luminance. The light source module 148 according to one example may be any one of the light source modules 148 shown in FIGS. 3A to 6 .

The reflective member 142 is disposed on the lower case 135. This reflective member 142 is made of a reflective material and serves to reflect light emitted from the light source module 148 and moving toward the lower case 135 in the direction of the diffusion plate 145. A plurality of light source module insertion holes are formed on the lower surface of the reflective member 142. A light source module may be disposed on the reflective member through a plurality of light source module insertion holes.

The diffusion plate 145 is formed in the form of a flat plate with a certain thickness and is arranged to cover the front of the lower case 135. The diffusion plate 145 functions to diffuse the light emitted from each of the plurality of light source modules 148 and advance it toward the liquid crystal panel 110. The diffusion plate 145 is supported by the lower case 135.

The optical sheet portion 146 is disposed on the diffusion plate 145. This optical sheet portion 146 functions to condense and diffuse light so that the brightness of the liquid crystal panel 110 can be increased and to advance the light in the direction of the liquid crystal panel 110. At this time, the optical sheet portion 146 may be any one of a prism sheet, a lenticular lens sheet, and a micro lens sheet. The optical sheet portion 146 may further include a protective sheet to protect the optical sheet.

The liquid crystal panel 110 includes a lower substrate and an upper substrate bonded to each other with a liquid crystal layer (not shown) in between, a lower polarizing film attached to the back of the lower substrate, and an upper polarizing film attached to the front of the upper substrate. can do.

8 to 10 are optical spectrum graphs showing the intensity by wavelength of the light emitting diode package according to the first example of the present invention.

Referring to Figures 8 to 10, the horizontal axis of the light spectrum represents the wavelength (nm) of light and the vertical axis represents the intensity (Intensity) of light. As shown in Figure 8, the horizontal axis of the graph represents the wavelength (nm) of light and the vertical axis on the right side of the graph represents the transmittance. Since the selective light absorbing material absorbs light in the 570nm to 600nm wavelength region, the light in the 570nm to 600nm region is Transmittance decreases. In this way, since the selective light absorption material absorbs light in the 570 nm to 600 nm wavelength range, which reduces color purity, as shown in FIGS. 8 to 10, the light emitting diode package (LPK) according to the first example of the present invention The half width of the peak in the optical spectrum decreases. Therefore, the light emitting diode package (LPK) according to the first example of the present invention can emit more vivid colors, thereby enabling high color reproduction and reducing the image quality of the backlight unit 140 and the liquid crystal display device 100. You can prevent it from happening.

Although embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be made without departing from the technical spirit of the present invention. . Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but are for illustrative purposes, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive. The scope of protection of the present invention should be interpreted in accordance with the claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of rights of the present invention.

10: light emitting diode chip 20: encapsulation layer
30: Glass cover 35: Light absorption layer
PP: Phosphor LG: Light guide member
PCB: Printed Circuit Board LPK: Light Emitting Diode Package
110: liquid crystal panel 120: panel driving unit
130: panel support 140: backlight unit
150: External case 160: Front partial cover

Claims (8)

light emitting diode chip;
a glass cover disposed to be spaced apart from the light emitting diode chip to form an encapsulation space;
an encapsulation layer disposed in the encapsulation space;
a plurality of phosphors emitting at least one color included in the encapsulation layer;
a selective light absorbing material disposed on the phosphor; and
It includes a light guide member disposed on a side of the glass cover,
The encapsulation layer is in contact with the glass cover by filling,
A light emitting diode package in which the selective light absorption material is coated only on the surface of a green phosphor formed of a green phosphor among the plurality of phosphors. According to claim 1,
A light emitting diode package in which the selective light absorbing material absorbs light in the range of 570 nm to 600 nm. According to claim 1,
A light emitting diode package wherein the selective light absorbing material is neodymium oxide. According to claim 3,
A light emitting diode package in which the selective light absorption material is doped into the glass cover. According to claim 4,
The glass cover has a cap shape, and the encapsulation layer and the light emitting diode chip are provided in a groove provided in the glass cover. According to claim 4,
A light emitting diode package further comprising a mold frame that mounts the light emitting diode chip on a bottom surface and has a support surface that is vertically bent from the bottom surface to support the glass cover. A light guide plate having a light receiving surface;
The light emitting diode package according to any one of claims 1 to 6 arranged to face the light incident surface of the light guide plate;
a printed circuit board on which the light emitting diode package is mounted; and
A backlight unit including a reflective sheet disposed below the light guide plate. The backlight unit according to claim 7; and
A liquid crystal display device comprising a liquid crystal panel disposed on the backlight unit.