KR20240058005A - Separating apparatus, separating system, and separating method - Google Patents

Abstract

Remove foreign substances attached to the peeling attractor. The peeling device according to the present disclosure includes a first holding portion, a second holding portion, a peeling inducing portion, and a suction portion. The first holding portion holds the first substrate among the polymerized substrates in which the first substrate and the second substrate are bonded, and moves the first substrate in a direction away from the second substrate. The second holding portion holds the second substrate among the polymerization substrates. The peeling attraction portion is formed on the side surface of one end of the polymerization substrate at a portion that causes the first substrate to peel off from the second substrate. The suction portion absorbs the atmosphere surrounding the peeling attraction portion.

Description

peeling device, peeling system and peeling method {SEPARATING APPARATUS, SEPARATING SYSTEM, AND SEPARATING METHOD}

The present disclosure relates to stripping devices, stripping systems and stripping methods.

Recently, for example, in the manufacturing process of semiconductor devices, semiconductor substrates such as silicon wafers and compound semiconductor wafers are being reduced in diameter and thinner. Large-diameter, thin semiconductor substrates may be warped or cracked during transportation or polishing. For this reason, after attaching a support substrate to a semiconductor substrate to reinforce it, conveyance and polishing are performed, and then the support substrate is peeled from the semiconductor substrate.

Patent Document 1 discloses a peeling device provided with a peeling attraction portion that is formed on the side surface of one end of a polymerized substrate as a trigger for peeling the support substrate from the substrate to be processed.

Japanese Patent Publication No. 2015-207776

The present disclosure provides a technique for removing foreign substances attached to a peeling attraction portion.

A peeling device according to one aspect of the present disclosure includes a first holding portion, a second holding portion, a peeling attraction portion, and a suction portion. The first holding portion holds the first substrate among the polymerized substrates in which the first substrate and the second substrate are bonded, and moves the first substrate in a direction away from the second substrate. The second holding portion holds the second substrate among the polymerization substrates. The peeling attraction portion is formed on the side surface of one end of the polymerization substrate at a portion that causes the first substrate to peel off from the second substrate. The suction portion absorbs the atmosphere surrounding the peeling attraction portion.

According to the present disclosure, foreign substances attached to the peeling attraction portion can be removed.

1 is a schematic plan view showing the configuration of a peeling system according to the first embodiment.
Fig. 2 is a schematic side view showing the configuration of a transfer station according to the first embodiment.
Figure 3 is a schematic cross-sectional view of the polymerization substrate according to the first embodiment.
Fig. 4 is a schematic side view showing the configuration of a peeling device according to the first embodiment.
Fig. 5 is a schematic plan view of the first holding portion according to the first embodiment.
Fig. 6 is a schematic side view of the third holding portion according to the first embodiment.
Fig. 7 is a schematic bottom view of the third holding portion according to the first embodiment.
Fig. 8 is a schematic plan view showing an example of the positional relationship between the suction pad of the first holding portion, the suction pad of the third holding portion, and the image wafer.
Fig. 9 is a schematic plan view showing an example of the configuration of the upper holding portion of the second transport device.
Fig. 10 is a flowchart showing the sequence of processing performed by the peeling system according to the first embodiment.
Fig. 11 is a schematic diagram showing an example of operation of the peeling system according to the first embodiment.
Fig. 12 is a schematic diagram showing an example of operation of the peeling system according to the first embodiment.
Fig. 13 is a schematic diagram showing an example of operation of the peeling system according to the first embodiment.
Fig. 14 is a schematic diagram showing an example of operation of the peeling system according to the first embodiment.
Fig. 15 is a schematic diagram showing an example of operation of the peeling system according to the first embodiment.
Fig. 16 is a schematic diagram showing an example of operation of the peeling system according to the first embodiment.
Fig. 17 is a schematic diagram showing an example of operation of the peeling system according to the first embodiment.
Fig. 18 is a schematic diagram showing an example of operation of the peeling system according to the first embodiment.
Fig. 19 is a schematic diagram showing an example of operation of the peeling system according to the first embodiment.
Fig. 20 is a schematic diagram showing an example of operation of the peeling system according to the first embodiment.
Fig. 21 is a schematic diagram showing an example of operation of the peeling system according to the first embodiment.
Fig. 22 is a schematic diagram showing an example of operation of the peeling system according to the first embodiment.
Fig. 23 is a schematic side view showing a configuration example of a peeling device according to the second embodiment.
Fig. 24 is a schematic plan view showing the positional relationship between the suction pad, the contact portion, and the image wafer of the third holding portion according to the second embodiment.
Fig. 25 is a schematic plan view showing the positional relationship between the image wafer, the adsorption portion of the first holding portion, the blade portion of the peeling inducing portion, and a plurality of detection portions according to the third embodiment.
Fig. 26 is a schematic side view showing the positional relationship of the upper wafer after peeling, the lower wafer after peeling, the adsorption portion of the first holding portion, the blade portion of the peeling inducing portion, and a plurality of detection portions according to the third embodiment.
Figure 27 is a schematic plan view showing an example of the relationship between a cracked image wafer and a detection unit.
Figure 28 is a schematic plan view showing an example of the relationship between a cracked image wafer and a detection unit.
Fig. 29 is a schematic plan view showing the positional relationship between the image wafer, the adsorption portion of the first holding portion, the blade portion of the peeling inducing portion, and the detection portion according to the fourth embodiment.
Fig. 30 is a schematic side view showing the positional relationship between the polymerization substrate, the adsorption portion of the first holding portion, and the detection portion according to the fourth embodiment.
Figure 31 is a schematic side view showing an example of the relationship between the image wafer and the detection unit during normal operation.
Figure 32 is a schematic side view showing an example of the relationship between the image wafer and the detection unit during normal operation.
Figure 33 is a schematic side view showing an example of the relationship between the image wafer and the detection unit when the image wafer is broken during the peeling operation.
Fig. 34 is a diagram showing an operational example of recovery processing according to the fifth embodiment.
Fig. 35 is a diagram showing an operational example of recovery processing according to the fifth embodiment.
Fig. 36 is a diagram showing an operational example of recovery processing according to the fifth embodiment.
Fig. 37 is a diagram showing an operational example of recovery processing according to the fifth embodiment.
Fig. 38 is a schematic side view showing a configuration example of a peeling device according to the sixth embodiment.
Fig. 39 is a schematic plan view of a receiving portion according to the sixth embodiment.
Fig. 40 is a schematic side view showing a configuration example of a peeling device according to the seventh embodiment.
Fig. 41 is a schematic perspective view showing a configuration example of a peeling device according to the seventh embodiment.
Fig. 42 is a flowchart showing the procedure of adhesion suction processing of the peeling device according to the seventh embodiment.
Fig. 43 is a diagram showing an example of operation of the peeling device according to the seventh embodiment.
Fig. 44 is a diagram showing an example of operation of the peeling device according to the seventh embodiment.
Fig. 45 is a schematic plan view showing a configuration example of a peeling device according to the eighth embodiment.
Fig. 46 is a schematic plan view showing a configuration example of a peeling device according to the ninth embodiment.
Fig. 47 is a schematic perspective view showing a configuration example of a peeling device according to the tenth embodiment.
Fig. 48 is a schematic perspective view showing a configuration example of a peeling device according to the tenth embodiment.
Fig. 49 is a schematic side view showing a configuration example of a peeling device according to the 11th embodiment.
Fig. 50 is a schematic side view showing a configuration example of a peeling device according to the 11th embodiment.

EMBODIMENT OF THE INVENTION Below, the form (hereinafter referred to as 'embodiment') for implementing the peeling device, peeling system, and peeling method according to the present disclosure will be described in detail with reference to the drawings. Additionally, the present disclosure is not limited to this embodiment. Additionally, each embodiment can be appropriately combined within the range that does not conflict with the processing content. In addition, in each of the following embodiments, the same parts are given the same reference numerals, and overlapping descriptions are omitted.

Additionally, in the embodiments shown below, expressions such as 'constant', 'orthogonal', 'perpendicular', or 'parallel' may be used, but these expressions are strictly defined as 'constant', 'orthogonal', and 'perpendicular'. ' or 'parallel' is not required. That is, each of the above expressions allows for errors in, for example, manufacturing precision and installation precision.

In addition, in each drawing referred to below, in order to make the explanation easier to understand, the . Additionally, the rotation direction with the vertical axis as the rotation center may be called the θ direction.

Recently, for example, in the manufacturing process of semiconductor devices, semiconductor substrates such as silicon wafers and compound semiconductor wafers are being reduced in diameter and thinner. Large-diameter, thin semiconductor substrates may be warped or cracked during transportation or polishing. For this reason, after attaching a support substrate to a semiconductor substrate to reinforce it, conveyance and polishing are performed, and then the support substrate is peeled from the semiconductor substrate.

Patent Document 1 discloses a peeling device provided with a peeling attraction portion that forms a peeling start site on one end side of a polymerized substrate, which serves as a trigger for peeling the support substrate from the processing target substrate. The peeling attraction portion is provided with a sharpening member (blade), and a peeling start site is formed on the side surface of one end of the polymerization substrate by causing this sharpening member to hit the side surface of one end of the polymerization substrate.

However, when forming a peeling start site on a polymerized substrate using a peeling attraction portion, for example, if foreign matter adheres to the sharp member of the peeling attracting portion, this foreign matter may adhere to the support substrate or the substrate to be processed, resulting in the peeling process. There are concerns that it may have an impact.

Accordingly, technology that can remove foreign substances attached to the peeling attraction portion is expected.

(First Embodiment)

＜Configuration of peeling system＞

First, the configuration of the peeling system 100 according to the first embodiment will be described with reference to FIGS. 1 to 3. Fig. 1 is a schematic plan view showing the configuration of the peeling system 100 according to the first embodiment. Fig. 2 is a schematic side view showing the configuration of the transfer station 2 according to the first embodiment. Fig. 3 is a schematic cross-sectional view of the polymerization substrate T according to the first embodiment.

For example, the peeling system 100 shown in FIG. 1 peels the first substrate W1 from the polymerized substrate T shown in FIG. 3 where the first substrate W1 and the second substrate W2 are bonded. do.

Hereinafter, the first substrate W1 will be referred to as the 'upper wafer W1', and the second substrate W2 will be referred to as the 'lower wafer W2'. That is, the upper wafer W1 is an example of the first substrate, and the lower wafer W2 is an example of the second substrate.

In addition, hereinafter, as shown in FIG. 3, among the surfaces of the upper wafer W1, the surface on the side that is bonded to the lower wafer W2 is referred to as 'bonding surface W1j', and the bonding surface W1j and The plate surface on the opposite side is described as 'non-bonded surface (W1n)'. In addition, among the surfaces of the lower wafer W2, the surface on the side bonded to the upper wafer W1 is referred to as the 'bonded surface W2j', and the surface on the opposite side to the bonded surface W2j is referred to as the 'non-bonded surface ( Write ‘W2n)’.

The upper wafer W1 is a semiconductor substrate, such as a silicon wafer or a compound semiconductor wafer, on which a plurality of electronic circuits are formed. In addition, the lower wafer W2 is, for example, a bare wafer on which no electronic circuit is formed. The upper wafer W1 and the lower wafer W2 have approximately the same diameter. Additionally, an electronic circuit may be formed on the second substrate W2.

The upper wafer W1 and the lower wafer W2 may be chemically bonded, for example. In this case, the surfaces of the upper wafer W1 and the lower wafer W2 (joint surfaces W1j, W2j) are modified by plasma treatment, and the modified surfaces are made hydrophilic by pure water, followed by van der Waals They are joined by hydrogen bonding and hydrogen bonding (intermolecular forces). Additionally, the upper wafer W1 and the lower wafer W2 may be bonded together with an adhesive.

As shown in FIG. 1 , the peeling system 100 includes a loading/unloading station 1, a transfer station 2, and a processing station 3. The carrying-out station (1), the transfer station (2), and the processing station (3) are arranged in the following order along the Y-axis positive direction: the carrying-out station (1), the transfer station (2), and the processing station (3). and is placed.

At the loading/unloading station 1, the polymerization substrate T is loaded, the peeled upper wafer W1 and the lower wafer W2 are loaded, etc. This loading/unloading station (1) is provided with a placement unit (4) and a first transport device (5).

The placement unit 4 is provided with a plurality of cassette placement tables, and each cassette placement table includes a cassette Ct in which the polymerized substrate T is accommodated, a cassette C1 in which the peeled image wafer W1 is accommodated, and a peeled A cassette C2 in which the later lower wafer W2 is accommodated is disposed.

The first transport device 5 is disposed adjacent to the Y-axis positive direction side of the placement unit 4. The first transfer device 5 transfers the polymerization substrate T, the peeled upper wafer W1, and the peeled lower wafer W2. The first transfer device 5 includes a transfer arm capable of moving in the horizontal direction, raising and lowering in the vertical direction, and rotating around the vertical direction, and a substrate holding part mounted on the tip of the transfer arm. The first transport device 5 is an example of a substrate transport device.

At the loading/unloading station 1, a process of transferring the polymerized substrate T from the placement unit 4 to the transfer station 2 by this first transfer device 5, and the image wafer W1 after peeling and A process of transporting the lower wafer W2 from the transfer station 2 to the placement unit 4 is performed.

At the transfer station 2, a transfer process is performed to transfer the polymerization substrate T, the peeled upper wafer W1, and the peeled lower wafer W2. As shown in FIG. 2, the delivery station 2 includes, for example, a first delivery unit 25, a second delivery unit 26, a delivery unit with an inversion mechanism 27, and an aligner 28. ) is provided. The first delivery unit 25, the second delivery unit 26, the delivery unit with a reversal mechanism 27, and the aligner 28 are, for example, first along vertically upward (Z-axis positive direction). The delivery unit 25, the second delivery unit 26, the delivery unit with a reversal mechanism 27, and the aligner 28 are arranged in that order.

The polymerized substrate T transported from the loading/unloading station 1 is placed in the first delivery unit 25 . The polymerized substrate T placed in the first transfer unit 25 is transferred to the processing station 3 by the second transfer device 6, which will be described later.

The peeled lower wafer W2 is placed in the second transfer unit 26 . The peeled lower wafer W2 disposed in the second transfer unit 26 is transferred to the loading/unloading station 1 by the first transfer device 5 .

The delivery unit 27 with the inversion mechanism is provided with a inversion mechanism that inverts the front and back of the peeled image wafer W1. The peeled image wafer W1 is placed in the transfer unit 27 with the inversion mechanism. The peeled image wafer W1 disposed on the transfer unit 27 with the inversion mechanism is flipped on its front and back by the inversion mechanism, and is then transported to the loading/unloading station 1 by the first conveying device 5 .

The aligner 28 performs an alignment process on the polymerization substrate T, the peeled upper wafer W1, and the peeled lower wafer W2. For example, the aligner 28 includes a holding portion that adsorbs and rotates the polymerization substrate T, the peeled upper wafer W1 and the peeled lower wafer W2, and the polymerization substrate T and the peeled lower wafer W2. It is provided with a detection unit that detects the positions of the notches of the upper wafer W1 and the peeled lower wafer W2.

The aligner 28 detects the position of the notch portion of the polymerized substrate T with a detector while rotating the polymerized substrate T held by adsorption in the holding portion, thereby adjusting the position of the notch portion to level the polymerized substrate T. The direction of direction can be adjusted. In addition, the aligner 28 detects the position of the notch portion of the peeled image wafer W1 with the detection unit while rotating the peeled image wafer W1 adsorbed and held by the holding unit, thereby adjusting the position of the notch portion to remove the peeled image wafer W1. The horizontal direction of the later image wafer W1 can be adjusted. In addition, the aligner 28 detects the position of the notch portion of the peeled lower wafer W2 with the detection unit while rotating the peeled lower wafer W2 adsorbed and held by the holding unit, thereby adjusting the position of the notch portion to remove the peeled lower wafer W2. The horizontal direction of the later lower wafer W2 can be adjusted.

At the processing station 3, a process of peeling the polymerized substrate T is mainly performed. This processing station 3 is provided with a second transfer device 6 and a peeling device 7. The second conveying device 6 and the peeling device 7 are arranged in the order of the second conveying device 6 and the peeling device 7 along the positive X-axis direction.

The second transfer device 6 transfers the polymerized substrate T, the peeled upper wafer W1, and the peeled lower wafer W2 between the transfer station 2 and the peeling device 7. The second transfer device 6 includes a transfer arm (not shown) capable of lifting and lowering in the vertical direction and rotating about the vertical direction, and is mounted on the tip of the transfer arm to adsorb the peeled image wafer W1. It is provided with an upper holding portion 61 (see FIGS. 9 and 21) that holds it. The second transfer device 6 further includes a lower holding part 62 (see FIG. 18) which is mounted on the tip of the transfer arm and holds the polymerized substrate T and the peeled lower wafer W2. The specific configuration of the upper holding portion 61 included in the second conveying device 6 will be described later. Additionally, the second transfer device 6 is an example of a substrate transfer device.

At the processing station 3, the polymerized substrate T is transferred from the transfer station 2 to the peeling device 7 by this second transfer device 6, and the upper and lower wafers W1 after peeling are processed. A process of transporting the wafer W2 from the peeling device 7 to the transfer station 2 is performed.

The peeling device 7 performs a peeling process to separate the polymerized substrate T into the upper wafer W1 and the lower wafer W2. The specific configuration and operation of the peeling device 7 will be described later.

Additionally, the peeling system 100 includes a control device 8. The control device 8 controls the operation of the peeling system 100. This control device 8 is, for example, a computer and includes a control unit 81 and a storage unit 82. The storage unit 82 stores a program that controls various processes such as peeling process. The control unit 81 controls the operation of the peeling system 100 by reading and executing the program stored in the storage unit 82.

Additionally, such a program may be recorded on a recording medium readable by a computer and may be installed from the recording medium into the storage unit 82 of the control device 8. Examples of computer-readable recording media include hard disks (HD), flexible disks (FD), compact disks (CD), magnet optical disks (MO), and memory cards.

In the peeling system 100 configured as described above, first, the first transfer device 5 of the loading/unloading station 1 takes out the polymerized substrate T from the cassette Ct disposed in the placing section 4, , the taken-out polymerized substrate T is brought into the transfer station 2 and placed in the first transfer unit 25.

Next, the polymerization substrate T placed in the first transfer unit 25 is taken out from the first transfer unit 25 by the second transfer device 6 of the processing station 3, and placed in the aligner 28. is imported into After the polymerized substrate T brought into the aligner 28 has its horizontal direction adjusted by the aligner 28, it is taken out from the aligner 28 by the second transfer device 6 and placed in the peeling device. It is imported into (7). Then, the polymerization substrate T is separated into an upper wafer W1 and a lower wafer W2 by the peeling device 7.

The peeled lower wafer W2 is taken out from the peeling device 7 by the second transfer device 6 and loaded into the aligner 28 . The lower wafer W2 loaded into the aligner 28 is placed in the second transfer unit 26 by the second transfer device 6 after the horizontal direction is adjusted by the aligner 28. .

The lower wafer W2 placed in the second transfer unit 26 is taken out from the second transfer unit 26 by the first transfer device 5 and the cassette C2 placed in the loading/unloading station 1. is accepted in Additionally, the first transfer device 5 holds and transfers the lower wafer W2, that is, the non-bonded surface W2n side. After this, the cassette C2 is taken out from the loading/unloading station 1 and recovered. In this way, the processing for the lower wafer W2 ends.

On the other hand, the image wafer W1 after peeling is taken out from the peeling device 7 by the second transfer device 6 and loaded into the aligner 28 . Here, the image wafer W1 after peeling is held on its upper surface side, that is, on the non-bonded surface W1n side, by the third holding portion 30 (see Fig. 4) described later of the peeling device 7. . The second transfer device 6 adsorbs and holds the non-bonded surface W1n side of the peeled image wafer W1 held by the third holding portion 30 from above. The image wafer W1 loaded into the aligner 28 is placed on the transfer unit 27 with a reversal mechanism by the second transfer device 6 after the horizontal direction is adjusted by the aligner 28. do.

The image wafer W1 placed on the transfer unit 27 with the inversion mechanism is flipped front and back by the inversion mechanism. As a result, the upper wafer W1 is in a state with the bonding surface W1j facing upward. The image wafer W1 with the front and back reversed is taken out from the transfer unit 27 with the inversion mechanism by the first transfer device 5 and stored in the cassette C1 disposed at the loading/unloading station 1 . Additionally, the first transfer device 5 holds and transfers the lower surface side, that is, the non-bonded surface W1n side, of the image wafer W1. After this, the cassette C1 is taken out from the loading/unloading station 1 and recovered. In this way, the processing on the upper wafer W1 also ends. Additionally, the alignment process of the polymerized substrate T, the peeled upper wafer W1, and the peeled lower wafer W2 by the aligner 28 may be omitted.

<Configuration of peeling device>

Next, the configuration of the peeling device 7 provided in the processing station 3 will be described with reference to FIG. 4 . Fig. 4 is a schematic side view showing the configuration of the peeling device 7 according to the first embodiment.

The peeling device 7 includes a first holding portion 10, a second holding portion 20, a third holding portion 30, a peeling inducing portion 40, and a plurality of (here, two) lifting and lowering mechanisms. It is provided with a mechanism (50) and a support body (60).

The peeling device 7 suction-holds the upper wafer W1 side of the polymerization substrate T from above by the first holding portion 10, and holds the lower wafer W2 side of the polymerization substrate T by the second holding portion 10. It is adsorbed and held from below by the holding portion 20. Then, the peeling device 7 moves the upper wafer W1 in a direction (here, the positive Z-axis direction) away from the plate surface of the lower wafer W2 by the lifting mechanism 50 .

As a result, the upper wafer W1 held by the first holding portion 10 is continuously peeled from the lower wafer W2 from one end to the other end. Hereinafter, each component will be described in detail.

The first holding portion 10 adsorbs and holds the non-bonded surface W1n of the upper wafer W1 of the polymerization substrate T. The first holding portion 10 includes an elastic member 11 and a plurality of suction portions 12. The elastic member 11 is a thin plate-shaped member, and is formed of metal such as a metal plate, for example. The elastic member 11 has an opening 115 in the center for allowing the third holding portion 30 to penetrate. This elastic member 11 is disposed above the image wafer W1 to face the image wafer W1.

The plurality of adsorption portions 12 are provided on the surface (here, lower surface) of the elastic member 11 opposite to the upper wafer W1. Each suction portion 12 includes a main body portion 121 fixed to the elastic member 11 and a suction pad 122 provided at a lower portion of the main body portion 121.

Each adsorption unit 12 is connected to an intake device 124 such as a vacuum pump via an intake pipe 123. The first holding portion 10 attracts the non-bonded surface W1n (see FIG. 3) of the upper wafer W1 to the plurality of suction portions 12 by the suction force generated by the suction device 124. As a result, the image wafer W1 is adsorbed and held by the first holding portion 10 .

Additionally, the suction pad 122 included in the suction section 12 is preferably of a type that has a small amount of deformation. This means that if the suction pad 122 is greatly deformed when the lifting mechanism 50, which will be described later, pulls the first holding portion 10, the adsorbed portion of the upper wafer W1 is greatly deformed along with this deformation. This is because there is a risk that the upper wafer (W1) or the lower wafer (W2) may be damaged. Specifically, as the suction pad 122, it is preferable to use, for example, a pad with ribs on the suction surface or a flat pad with a space height of 0.5 mm or less.

Here, the configuration of the first holding portion 10 will be described in more detail with reference to FIG. 5 . Fig. 5 is a schematic plan view of the first holding portion 10 according to the first embodiment.

The elastic member 11 includes a main body portion 111 and a plurality of (here, two) extension portions 112. The main body 111 has an opening 115 in the center for allowing the third holding part 30 to penetrate. Here, the central part of the main body 111 is an area including the center of the main body 111. The plurality of adsorption units 12 are disposed on the lower surface of the main body 111, that is, on the surface opposite to the polymerization substrate T.

The plurality of extension parts 112 (here, two) are parts of the outer peripheral part of the main body 111 extended. Specifically, one of the two extension parts 112 has a part of the outer peripheral part of the main body 111 located on the most starting point side of peeling (outer peripheral part on the Y-axis negative direction side) in a direction different from the progress direction of peeling. This is a part that extends toward the opposite side (Y-axis negative direction side). In addition, the other of the two extension parts 112 is a part of the outer peripheral part of the main body 111 located on the most end point side of peeling (outer peripheral part on the positive Y-axis direction side) on the side of the peeling progress direction (Y-axis). This is a part that extends toward the forward direction. A support member 51 of the lifting mechanism 50 is connected to the tip of each of these plurality of extension parts 112 .

A plurality of adsorption units 12 (here, 6) are arranged on the lower surface of the main body 111. As shown in Fig. 5, three of the six adsorption portions 12 are disposed on the periphery of the outer peripheral portion of the main body portion 111 located at the furthest starting point of peeling (outer peripheral portion in the negative Y-axis direction). . Two of the six adsorption units 12 are arranged around the opening 115 of the main body 111 in a direction (X-axis direction) perpendicular to the peeling progress direction (Y-axis positive direction). . The remaining one of the six adsorption portions 12 is disposed on the outer peripheral portion of the main body portion 111 located at the extreme end point of peeling (outer peripheral portion in the positive Y-axis direction). The six adsorption units 12 are arranged in the order of three adsorption units 12, two adsorption units 12, and one adsorption unit 12 along the peeling progress direction (Y-axis direction). In this way, by arranging the plurality of adsorption units 12 in accordance with the direction in which the peeling progresses, the upper wafer W1 can be efficiently peeled from the lower wafer W2.

Among the plurality of adsorption units 12, the adsorption unit 12 disposed on the most starting point side of peeling (here, the Y-axis negative direction side) is the blade portion (see FIG. 4) of the peeling attraction unit 40 (see FIG. 4) described later. 41) (see FIG. 3) is placed in a position close to the contact area. In other words, the blade portion 41 of the peeling attraction portion 40 contacts the side surface of the polymerization substrate T in the vicinity of the adsorption portion 12 disposed on the negative Y-axis direction side. As a result, peeling of the upper wafer W1 can be reliably started from the peeling start site that serves as a trigger for peeling of the upper wafer W1 from the lower wafer W2. Here, an example in which six suction portions 12 are provided on the elastic member 11 is shown, but the number of suction portions 12 provided on the elastic member 11 is not limited to six.

Returning to Fig. 4, other configurations of the peeling device 7 will be described. The second holding portion 20 is disposed below the first holding portion 10 and adsorbs and holds the lower wafer W2 of the polymerization substrate T. This second holding portion 20 includes a disc-shaped main body 21 and a support member 22 that supports the main body 21.

The main body 21 is formed of a metal member such as aluminum, for example. An adsorption surface 201 is provided on the upper surface of this main body portion 21. The adsorption surface 201 is formed to have approximately the same diameter as the lower wafer W2. The adsorption surface 201 is a porous material and is formed of a resin member such as, for example, PCTFE (polychlorotrifluoroethylene).

Inside the main body 21, a suction space 202 is formed that communicates with the outside through the suction surface 201. The suction space 202 is connected to an intake device 204 such as a vacuum pump via an intake pipe 203. This second holding portion 20 uses the negative pressure generated by the intake of the intake device 204 to attach the non-bonded surface W2n (see FIG. 3) of the lower wafer W2 to the adsorption surface 201. By adsorbing, the polymerized substrate (T) is adsorbed and held.

Additionally, if a non-adsorption portion such as a groove is formed on the adsorption surface of the lower wafer W2, there is a risk of cracks occurring in the lower wafer W2 in this non-adsorption portion. Accordingly, the adsorption surface 201 of the main body 21 was a flat surface without non-adsorption portions such as grooves. Thereby, it is possible to prevent cracks from occurring in the lower wafer W2.

Additionally, since the adsorption surface 201 is formed of a resin member such as PCTFE, damage to the lower wafer W2 can be further suppressed.

The second holding portion 20 is supported by the support member 22 and the rotary lifting mechanism 23 (an example of the rotating portion). The rotary lifting mechanism 23 rotates the second holding portion 20 by rotating the support member 22 around the vertical axis. Additionally, the rotary lifting mechanism 23 raises and lowers the second holding portion 20 by moving the support member 22 in the vertical direction.

The third holding portion 30 is disposed above the first holding portion 10 to adsorb and hold the non-bonded surface W1n of the peeled image wafer W1 held by the first holding portion 10. do. This third holding portion 30 includes a main body portion 31 (an example of the base portion), a plurality of suction pads 32, a plurality of contact portions 33 (see FIG. 6), and a lifting mechanism 34. Equipped with

The main body portion 31 is, for example, a cylindrical member and is inserted into the opening 115 of the elastic member 11. The main body portion 31 supports a plurality of suction pads 32 and a plurality of contact portions 33. The main body portion 31 is an example of the base portion. A plurality of suction pads 32 and a plurality of contact portions 33 are provided in the lower part of the main body portion 31. The specific configuration of the plurality of suction pads 32 and the plurality of contact portions 33 will be described later. The lifting mechanism 34 moves the main body 31 in the vertical direction to raise and lower the plurality of suction pads 32 and the plurality of contact portions 33 supported by the third holding portion 30. Specifically, the lifting mechanism 34 has a standby position, an adsorption position for adsorbing the peeled image wafer W1 held by the first holding part 10, and an adsorbing position for the image held by the third holding part 30. The plurality of suction pads 32 and the plurality of contact portions 33 are raised and lowered between the transfer positions where the wafer W1 is delivered to the second transfer device 6. The lifting mechanism 34 is supported on a support body 60, for example. The support body 60 is a plate-shaped member extending in the horizontal direction and is disposed above the first holding portion 10 . The lifting mechanism 34 is fixed to the upper part of the support body 60, for example.

According to this third holding unit 30, the peeled image wafer W1 can be received from the first holding unit 10, and the received image wafer W1 can be stably transferred to the second transfer device 6. there is.

The peeling attracting portion 40 is disposed on the outside of the second holding portion 20 and marks a peeling start site in the polymerization substrate T that causes the upper wafer W1 to peel off from the lower wafer W2. It is formed on the side of one side.

The peeling attraction portion 40 includes a blade portion 41, a moving mechanism 42 (an example of the second moving mechanism), and a lifting mechanism 43. The blade portion 41 has a sharpening member 41a and a support portion 41b. The sharpening member 41a is, for example, a flat blade, and is supported on the support portion 41b so that the edge of the blade protrudes horizontally toward the polymerization substrate T.

The moving mechanism 42 moves the blade portion 41 along a rail extending in the Y-axis direction. The lifting mechanism 43 is fixed to the support body 60, for example, and moves the moving mechanism 42 in the vertical direction. As a result, the height position of the blade portion 41, that is, the contact position with respect to the side surface of the polymerization substrate T, is adjusted.

This peeling attraction portion 40 adjusts the height position of the blade portion 41 using the lifting mechanism 43, and then uses the moving mechanism 42 to move the blade portion 41 in the horizontal direction (here, Y (axis forward direction) Additionally, the peeling attracting portion 40 brings the sharpening member 41a of the blade portion 41 into contact with the joint between the upper wafer W1 and the lower wafer W2 exposed on the side surface of the polymerization substrate T. As a result, a peeling start site that serves as a trigger for peeling the upper wafer W1 from the lower wafer W2 is formed in the polymerization substrate T.

A plurality of (here, two) lifting mechanisms 50 raise and lower the first holding portion 10 . The plurality of lifting mechanisms 50 are provided in one-to-one correspondence with the plurality (here, two) extension portions 112 of the elastic member 11. The lifting mechanism 50 includes a support member 51, a moving mechanism 52, and a load cell 53.

The support member 51 is a member extending in the vertical direction (Z-axis direction), one end of which is connected to the extension portion 112 (see FIG. 5) of the elastic member 11, and the other end of which connects the support body 60. It is connected to the moving mechanism 52 interposedly.

The moving mechanism 52 is fixed to the upper part of the support body 60 and moves the support member 51 connected to the lower part in the vertical direction. The load cell 53 detects the load applied to the support member 51.

This lifting mechanism 50 moves the holding member 51 vertically upward using the moving mechanism 52, thereby raising the first holding portion 10 connected to the holding member 51. At this time, the lifting mechanism 50 can pull the first holding portion 10 while controlling the force applied to the image wafer W1 based on the detection result by the load cell 53.

Here, as shown in Figures 4 and 5, the holding member 51, which is the point of pulling, that is, the holding member 51 disposed on the negative Y-axis direction, is the adsorption portion 12, which is the point of pulling, that is, peeling. It is disposed on the opposite side of the direction in which peeling progresses from the adsorption portion 12 disposed on the furthest starting point side.

Accordingly, a clockwise rotational force (moment) is generated on the side surface of the polymerized substrate T that serves as the point of action for pulling (the portion that becomes the starting point of peeling) as shown in FIG. 3 . As a result, the lifting mechanism 50 can pull the upper wafer W1 by tilting it from its outer edge, thereby efficiently peeling the upper wafer W1 from the lower wafer W2.

Additionally, the first holding portion 10 is supported by the lifting mechanism 50 , and the lifting mechanism 50 is supported by the support body 60 . The support body 60 is supported by a fixing member (not shown) mounted on the ceiling of the peeling device 7.

The peeling device 7 further includes a plurality of lifting pins 29 (see FIG. 18) that support the polymerization substrate T or the peeled lower wafer W2. The plurality of lifting pins 29 are inserted into through holes (not shown) formed to penetrate the second holding portion 20, and are configured to be capable of being raised and lowered by a lifting mechanism (not shown). The plurality of lifting pins 29 are used to temporarily support the polymerization substrate T or the lower wafer W2 when loading the polymerization substrate T or unloading the lower wafer W2 after peeling.

<Configuration of the 3rd maintenance section>

Next, the configuration of the third holding portion 30 will be described in more detail with reference to FIGS. 6 and 7. Fig. 6 is a schematic side view of the third holding portion 30 according to the first embodiment. Fig. 7 is a schematic bottom view of the third holding portion 30 according to the first embodiment.

As shown in FIG. 6 , a plurality of suction pads 32 (here, three) of the third holding portion 30 are provided on the lower surface of the main body portion 31 . The suction pad 32 is, for example, a rubber pad. Specifically, the suction pad 32 has a bellows shape. As a result, the suction pad 32 has elasticity in the vertical direction and flexibility in the horizontal direction. That is, the suction pad 32 can be displaced in the vertical and horizontal directions. For this reason, the suction pad 32 can follow the displacement of the image wafer W1 in the vertical and horizontal directions. The third holding portion 30 having such a suction pad 32 can stably hold the image wafer W1 after peeling.

The plurality of suction pads 32 are connected to an intake device 324 such as a vacuum pump via an intake pipe 321. The third holding portion 30 attracts the non-bonded surface W1n of the upper wafer W1 to the plurality of suction pads 32 by the suction force generated by the suction device 324. As a result, the image wafer W1 is adsorbed and held by the third holding portion 30 . Additionally, the intake pipe 321 is provided with an adsorption detection unit 322 that detects adsorption of the image wafer W1 by the third holding unit 30. The adsorption detection unit 322 detects that when the image wafer W1 is transferred from the first holding unit 10 to the third holding unit 30, the suction pad 32 of the third holding unit 30 touches the image wafer ( It is used to check whether W1) is being adsorbed normally. For example, the adsorption detection unit 322 may be a vacuum sensor. In this case, the adsorption detection unit 322 detects the intake pressure (negative pressure within the intake pipe 321).

As shown in FIG. 7 , a plurality of suction pads 32 (here, three) are arranged in a concentric circle shape when viewed from the top. According to this configuration, it is easy to hold the image wafer W1 horizontally while the image wafer W1 is being held by suction. In addition, even if one of the plurality of suction pads 32 cannot adsorb the image wafer W1, adsorption can be maintained with the other suction pads 32, so that the image wafer W1 after peeling can be maintained. It can be maintained more stably.

A plurality of (here, three) contact portions 33 are provided on the lower surface of the main body portion 31. The plurality of contact portions 33 contact the non-bonded surface W1n of the image wafer W1 adsorbed by the plurality of suction pads 32. As shown in FIG. 7 , a plurality of contact portions 33 (here, three) are arranged in a concentric circle shape when viewed from the top. According to this configuration, vibration and rattling can be prevented, and the upper wafer W1 can be maintained horizontally.

As shown in FIG. 6, the end of the contact portion 33 that contacts the non-bonded surface W1n of the image wafer W1 is hemispherical. According to this configuration, the contact area between the contact portion 33 and the upper wafer W1 can be reduced, so the load on the upper wafer W1 can be reduced.

The contact portion 33 includes an adjusting portion 331 . The adjustment unit 331 adjusts the amount of protrusion of the contact portion 33 from the main body 31 to the non-bonded surface W1n of the image wafer W1. According to this configuration, the height of the contact portion 33 can be changed depending on the position of the upper wafer W1.

Next, the arrangement of the suction pad 122 provided in the first holding portion 10 and the suction pad 32 provided in the third holding portion 30 will be described with reference to FIG. 8 . FIG. 8 is a schematic plan view showing an example of the positional relationship between the suction pad 122 of the first holding portion 10, the suction pad 32 of the third holding portion 30, and the image wafer W1.

As shown in FIG. 8 , the plurality of suction pads 122 included in the first holding portion 10 adsorb areas other than the central portion of the non-bonded surface W1n of the image wafer W1. Here, the central portion of the non-bonded surface W1n of the image wafer W1 is an area including the center of the non-bonded surface W1n of the image wafer W1. On the other hand, the plurality of suction pads 32 included in the third holding portion 30 suction the central portion of the non-bonded surface W1n of the image wafer W1. According to this configuration, the peeled image wafer W1 can be horizontally adsorbed and held by the third holding portion 30.

Moreover, as shown in FIG. 7, the suction pad 32 of the third holding part 30 is formed to have a smaller suction area than the suction pad 122 of the first holding part 10. This is to reduce the consumption of the suction device 324 connected to the suction pad 32 of the third holding portion 30 and to lengthen the suction time by the suction pad 32.

Next, the configuration of the upper holding portion 61 of the second transfer device 6 and the positional relationship between the upper holding portion 61, the third holding portion 30, and the upper wafer W1 are shown in FIG. 9 It is explained with reference to . FIG. 9 is a schematic plan view showing an example of the configuration of the upper holding portion 61 of the second conveying device 6.

The upper holding portion 61 is provided with a plurality of adsorption portions 611 on the lower side. The plurality of suction units 611 are connected by one suction pipe 612, and an suction device (not shown) is connected to the suction pipe 612. The upper holding portion 61 adsorbs and holds the upper wafer W1 from the non-bonded surface W1n (upper surface side) with a plurality of suction portions 611 by the suction force generated by the suction device. According to this configuration, the possibility of contact between the bonding surface W1j of the upper wafer W1 and the upper holding portion 61 can be reduced.

Additionally, as shown in FIG. 9 , the upper holding portion 61 is positioned so as not to overlap the third holding portion 30 when viewed from the top. According to this configuration, the non-bonded surface W1n of the image wafer W1 is adsorbed and held by the third holding part 30, and the upper holding part 61 holds the non-bonded surface W1n of the image wafer W1. Since the wafer W1 can be adsorbed and held, the upper wafer W1 can be delivered smoothly.

Next, an example of the operation of the peeling system 100 will be described in detail with reference to FIG. 10. Fig. 10 is a flowchart showing the sequence of processing performed by the peeling system 100 according to the first embodiment. 11 to 22 are schematic diagrams showing an example of operation of the peeling system 100 according to the first embodiment. Additionally, each processing sequence shown in FIG. 10 is executed under control by the control device 8.

First, the polymerization substrate T is loaded (step S101). Specifically, the control unit 81 controls the second transfer device 6 to transfer the polymerized substrate T from the first transfer unit 25 to the peeling device 7. After this, the control unit 81 controls the second transfer device 6 to lift the plurality of lifting pins 29 protruding from the suction surface 201 of the second holding unit 20 (FIG. 18). Refer to) and place the polymerization substrate (T) on top. After this, the control unit 81 lowers the plurality of lifting pins 29 to place the polymerization substrate T on the adsorption surface 201. Afterwards, the control unit 81 adsorbs and holds the polymerized substrate T by adsorbing the non-bonded surface W2n (see FIG. 3) of the lower wafer W2 to the suction surface 201 (FIG. 11 reference).

Next, peeling inducement processing is performed (step S102). Specifically, the control unit 81 raises the main body portion 21 of the second holding portion 20 to the peeling position (see Fig. 12). After this, the control unit 81 controls the peeling attracting part 40 to move the blade part 41 in the horizontal direction (Y-axis positive direction). After this, the control unit 81 controls the peeling attracting portion 40 to press the sharpening member 41a provided by the blade portion 41 on the side surface of the polymerization substrate T to The sharpening member 41a is inserted into the joint between the upper wafer W1 and the lower wafer W2. That is, the control unit 81 presses the sharpening member 41a against the side surface of the polymerization substrate T located near the adsorption unit 12 disposed on the Y-axis negative direction side. At this time, the control unit 81 lowers the main body 21 of the second holding unit 20 in parallel with the pressing process of the sharpening member 41a (see Fig. 13).

Next, a peeling process is performed (step S103). Specifically, the control unit 81 lowers the suction pad 122 of the first holding unit 10 to the vicinity of the upper wafer W1. After this, the control unit 81 causes the non-bonded surface W1n of the image wafer W1 to be adsorbed to the suction pad 122 of the first holding unit 10 (see FIG. 14). After this, the control unit 81 controls the lifting mechanism 50 to hold a part of the outer peripheral part of the first holding part 10, specifically, the extension part 112 located on the Y-axis negative direction side to the second holding part. It is moved in a direction away from the part 20 (see Figure 15). As a result, the adsorption portion 12 disposed near the portion where the cutting member 41a is inserted is pulled upward, and the upper wafer W1 is moved to the polymerization substrate T using the portion where the cutting member 41 is inserted as a starting point. ) begins to peel off.

After this, the control unit 81 controls the lifting mechanism 50 to move the extension portion 112 located on the Y-axis positive direction side of the elastic member 11 of the first holding portion 10 to the second holding portion ( 20) and move it in the direction away from (see FIG. 16). As a result, peeling progresses continuously from the end on the Y-axis negative direction side of the image wafer W1 toward the end on the Y-axis positive direction side, and ultimately, the image wafer W1 is separated from the polymerization substrate T. It peels off (see Figure 17). This ends the series of peeling processes.

As described above, the control unit 81 holds the polymerization substrate T with the first holding part 10 and the second holding part 20, and controls the lifting mechanism 50 to hold the first holding part 10. ) moves the upper wafer (W1) held by it in a direction away from the lower wafer (W2). Through this treatment, the upper wafer W1 can be peeled from the polymerization substrate T.

Next, the peeled lower wafer W2 is carried out (step S104). Specifically, the control unit 81 releases the suction holding by the second holding unit 20 and raises the plurality of lifting pins 29 supporting the lower wafer W2 to the delivery position. After this, the control unit 81 controls the second transfer device 6 (see FIG. 1 ) to unload the peeled lower wafer W2 from the peeling device 7 and transfer it to the second transfer station 2. It is conveyed to the delivery unit 26 (see FIG. 2). At this time, the lower holding portion 62 of the second transfer device 6 attracts and holds the non-bonded surface W2n of the lower wafer W2. Afterwards, the lower wafer W2 is transported from the second transfer unit 26 by the first transport device 5 and stored in the cassette C2 (see FIG. 1 ) of the loading/unloading station 1 .

Next, a lifting process is performed on the peeled image wafer W1 (step S105). Specifically, the control unit 81 controls the lifting mechanism 34 to lower the suction pad 32 of the third holding unit 30 to the vicinity of the upper wafer W1. After this, the control unit 81 causes the non-bonded surface W1n of the upper wafer W1 to be adsorbed to the suction pad 32 of the third holding unit 30 (see FIG. 19).

Next, a determination process is performed as to whether the swapping has been completed (step S106). Specifically, the control unit 81 determines whether switching of the image wafer W1 from the first holding unit 10 to the third holding unit 30 is completed based on the electric signal input from the adsorption detection unit 322. Determine whether or not Specifically, the control unit 81 determines that switching is complete when the intake pressure detected by the suction detection unit 322 exceeds the threshold. When the control unit 81 determines that the replacement has been completed (step S106: Yes), the control unit 81 releases the adsorption of the upper wafer W1 by the suction pad 122 of the first holding unit 10. As a result, the image wafer W1 is held by adsorption on the suction pad 32 of the third holding portion 30. After this, the control unit 81 lowers the suction pad 32 of the third holding unit 30 to the delivery position of the second conveying device 6 (see Fig. 20). On the other hand, if the switching is not completed (step S106, No), the control unit 81 returns the process to step S105.

Next, the peeled image wafer W1 is carried out (step S107). Specifically, the control unit 81 controls the second transfer device 6 to transfer the peeled image wafer W1 from the peeling device 7 . Here, the image wafer W1 after peeling is held on the non-bonded surface W1n side by the third holding portion 30, and the upper holding portion 61 of the second transfer device 6 is , the non-bonded surface W1n of the upper wafer W1 is adsorbed and held (see FIGS. 9 and 21). In this way, the third holding unit 30 also functions as a delivery unit that transfers the peeled image wafer W1 to the second transfer device 6. In the first embodiment, the suction pad 32 of the third holding portion 30 adsorbs the vicinity of the central portion of the image wafer W1, so that the image wafer W1 after peeling can be held stably.

After this, the control unit 81 controls the second transfer device 6 to transfer the peeled image wafer W1 from the peeling device 7 to the transfer unit 27 with the inversion mechanism of the transfer station 2. send it back to After this, the control unit 81 controls the inversion mechanism to invert the front and back of the peeled image wafer W1. As a result, the bonding surface W1j of the image wafer W1 after peeling is facing upward. After this, the image wafer W1 is transported from the transfer unit 27 with a reversal mechanism by the first transport device 5 and stored in the cassette C1 (see Fig. 1) of the loading/unloading station 1. . Additionally, the control unit 81 controls the lifting mechanism 34 to raise the main body 31, thereby returning the third holding unit 30 to its initial position (FIG. 22).

As described above, the control unit 81 controls the lifting mechanisms 34 and 50 to lift the peeled image wafer W1 from the first holding unit 10 to the third holding unit 30, The second transfer device 6 is controlled to adsorb the non-bonded surface W1n of the upper wafer W1 held on the third holding unit 30 to the upper holding unit 61 of the second transfer device 6. Maintain it. Through this process, the level of the upper wafer W1 can be maintained.

(Second Embodiment)

In the above-described first embodiment, an example in which the third holding portion 30 is provided with a contact portion 33 for stably holding the image wafer W1 has been described. It is not limited to this, and the support body 60 may be provided with a contact portion 33. Fig. 23 is a schematic side view showing a configuration example of the peeling device 7 according to the second embodiment. Fig. 24 is a schematic plan view showing the positional relationship between the suction pad 32, the contact portion 33, and the image wafer W1 of the third holding portion 30 according to the second embodiment.

The suction pad 32 of the third holding part 30 is provided in the lower part of the main body part 31. As shown in FIG. 24, the suction pad 32 suctions the center of the non-bonded surface W1n of the image wafer W1.

A plurality of (here, four) contact portions 33 are provided at the lower part of the support body 60 . The plurality of contact portions 33 are arranged in a concentric circle shape in plan view, and contact the outer peripheral portion of the non-bonded surface W1n of the image wafer W1.

According to this configuration, even if the third holding portion 30 has only one suction pad 32, the plurality of contact portions 33 are disposed on the outer periphery of the image wafer W1 to prevent vibration and rattling, The horizontality of the upper wafer W1 can be maintained.

(Modifications in the first and second embodiments)

In the above-described first and second embodiments, the suction portion 12 of the first holding portion 10 and the suction pad 32 of the third holding portion 30 attach the intake pipes 123 and 321, respectively. An example of connection to the intake devices 124 and 324, such as a vacuum pump, has been described. It is not limited to this, and a vacuum buffer tank may be provided in the intake path of the suction part 12 of the first holding part 10 and the suction pad 32 of the third holding part 30. Such a vacuum buffer tank can be used, for example, when an emergency such as a power outage occurs, thereby improving the stability of the factory.

In addition, in the above-described embodiment, an example has been described in which the peeling system 100 is provided with a delivery unit 27 with a flipping mechanism, and the front and back of the peeled image wafer W1 is flipped using the flipping mechanism. It is not limited to this, and the second transfer device 6 may be provided with a reversal mechanism. The inversion mechanism of the second transfer device 6 inverts the upper holding portion 61 to invert the front and back of the peeled upper wafer W1.

In this case, in the unloading process of the peeled image wafer W1 (steps S106 and S107 in FIG. 10 ), the control unit 81 controls the second transfer device 6 to hold the third holding unit 30 ) The non-bonded surface W1n of the upper wafer W1 held is adsorbed and held by the upper holding portion 61. After this, the control unit 81 controls the inversion mechanism of the second transfer device 6 to invert the upper holding part 61, thereby inverting the front and back of the peeled image wafer W1.

(Third Embodiment)

The peeling device 7 may be provided with a detection unit that detects the image wafer W1. In addition, the peeling device 7 may detect cracks in the image wafer W1 after the peeling process using this detection unit.

Hereinafter, an example of the configuration of the above-described detection unit will be described using FIGS. 25 and 26. 25 shows the image wafer W1 according to the third embodiment, the adsorption portion 12 of the first holding portion 10, the blade portion 41 of the peeling attracting portion 40, and a plurality of detection portions 70A to 70C. This is a schematic floor plan showing the positional relationship. 26 shows the upper wafer W1 after peeling, the lower wafer W2 after peeling, the adsorption portion 12 of the first holding portion 10, and the blade portion 41 of the peeling attracting portion 40 according to the third embodiment. ) and a schematic side view showing the positional relationship of the plurality of detection units 70A to 70C.

The detection units 70A to 70C are, for example, photoelectric sensors. As shown in FIGS. 25 and 26, the detection units 70A to 70C each include a light transmitting unit 71 that transmits light and a light receiving unit 72 that receives light from the light transmitting unit 71. 25 and 26, the optical axis of the light transmitted from the light transmitting portion 71 is indicated by a dashed line. Here, an example is shown where the detection units 70A to 70C are transmissive photoelectric sensors, but the detection units 70A to 70C may be reflective photoelectric sensors. In this case, the detection units 70A to 70C need only be provided with a sensor that transmits and receives light, and a reflection unit that reflects the light emitted from the sensor.

One of the light transmitting portion 71 and the light receiving portion 72 is disposed above the upper wafer W1, and the other is disposed below the upper wafer W1. For example, as shown in FIG. 26, the light transmitting portion 71 is disposed above the upper wafer W1 and the lower wafer W2, and the light receiving portion 72 is disposed above the upper wafer W1 and the lower wafer (W2). It is placed below W2).

The light transmitting portion 71 transmits light toward the outer peripheral portion of the peeled image wafer W1 located at the end point of peeling (the Y-axis positive direction side). Specifically, the light transmitting portion 71 of the detection portion 70A transmits light toward the outer peripheral portion P1 located on the outermost peripheral portion of the peeled image wafer W1 at the end of peeling (the Y-axis positive direction side). . The outer peripheral portion P1 is located between the center of the upper wafer W1 and the portion where the blade portion 41 contacts (peeling start portion) among the outer peripheral portions of the upper wafer W1 when viewed from the plane shown in FIG. 25 . It is an area located on the exact opposite side. In other words, when viewed from the plane shown in FIG. 25, of the outer peripheral portion of the image wafer W1, the portion located most on the negative Y-axis direction side is the peeling start site, and the portion located most on the positive Y-axis direction side is the outer peripheral portion (P1). )am.

The light transmitting portion 71 of the detection portion 70B is directed toward the outer peripheral portion P2 located on the positive Y-axis direction side than the adsorbing portion 12 located at the end point of peeling among the outer peripheral portions of the image wafer W1 after peeling. Transmits light. In addition, like the light transmitting part 71 of the detection part 70B, the light transmitting part 71 of the detection part 70C also has an adsorption part 12 located at the end point of peeling among the outer periphery of the image wafer W1 after peeling. ) Light is projected toward the outer peripheral portion (P3) located on the positive Y-axis direction side. In this way, each light transmitting portion 71 included in the detection portions 70A to 70C transmits light in a direction blocked by the peeled image wafer W1. Specifically, each light transmitting portion 71, for example, has a direction blocked by the image wafer W1 after peeling at the end of the peeling process in step S103 shown in FIG. 10 (see FIG. 17). emits light.

As shown in FIG. 26, the light receiving unit 72 is disposed below the upper wafer W1 and the lower wafer W2. When the light receiving unit 72 receives light from the light projecting unit 71, it transmits a signal indicating light reception to the control device 8. Additionally, the arrangement of the light transmitting portion 71 and the light receiving portion 72 may be reversed. That is, the light transmitting portion 71 may be disposed below the upper wafer W1 and the lower wafer W2, and the light receiving portion 72 may be disposed above the upper wafer W1 and the lower wafer W2.

The optical axis of the light heading from the light transmitting unit 71 to the light receiving unit 72 is inclined with respect to the plate surface of the image wafer W1. Thereby, as will be described later, the peeling device 7 can detect cracks in the image wafer W1 after peeling using the detection units 70A to 70C.

Next, the process by which the control unit 81 detects cracks in the peeled image wafer W1 using the above-described detection units 70A to 70C will be described with reference to FIGS. 27 and 28. 27 and 28 are schematic plan views showing the relationship between the cracked image wafer W1 and the detection units 70A to 70C. 27 and 28, the light transmitted from the light transmitting portion 71 is indicated by a solid line.

The crack detection process of the upper wafer W1 is performed after the peeling process is completed (after step S103 in FIG. 10). The control unit 81 detects cracks in the upper wafer W1 based on the detection results of the detection units 70A to 70C. Specifically, when light is received by any one of the light receiving units 72 of the plurality of detection units 70A to 70C (see FIGS. 27 and 28), the control unit 81 detects the upper wafer W1 ) is determined to have a crack. On the other hand, the control unit 81 determines that there is no crack in the image wafer W1 when light is not received by all of the light receiving units 72 of the plurality of detection units 70A to 70C. In this way, the control unit 81 detects cracks in the upper wafer W1 when the light transmitted from the light transmitting unit 71 is received by the light receiving unit 72 after the peeling operation.

For example, in the example shown in FIG. 27, the light transmitted from the light-transmitting portion 71 of the detection portion 70B and the detection portion 70C is blocked by the peeled image wafer W1. On the other hand, the light transmitted from the light transmitting part 71 of the detection part 70A is received by the light receiving part 72 of the detection part 70A. In this case, the control unit 81 determines that the outer peripheral portion P1 (see Fig. 25) of the peeled image wafer W1 is cracked.

In addition, in the example shown in FIG. 28, all of the light transmitted from the light transmitting portion 71 of the detection portions 70A to 70C is received by the corresponding light receiving portion 72. In this case, the control unit 81 determines that the outer peripheral portions P1 to P3 of the peeled image wafer W1 are cracked. In this way, the peeling device 7 is provided with a plurality of detection units 70A to 70C, so that it is possible to estimate the scale of the crack that appears in the image wafer W1 after peeling.

As described above, according to the detection units 70A to 70C according to the third embodiment, cracks in the upper wafer W1 after the peeling operation can be detected. Additionally, as shown in FIGS. 27 and 28 , when the outer peripheral portion of the image wafer W1 on the Y-axis positive direction side is cracked more than the adsorption portion 12 located on the extreme end point side of peeling (Y-axis positive direction side). Even so, cracks in the upper wafer W1 can be detected. In other words, cracks at the other end of the upper wafer W1 can be detected.

In addition, although an example of the case where three detection parts 70A to 70C are provided in the peeling device 7 is shown here, the number of detection parts provided in the peeling device 7 is not limited to three. The peeling device 7 according to the third embodiment may be provided with at least one detection unit.

(Fourth Embodiment)

In the third embodiment described above, an example of detecting cracks in the upper wafer W1 after the peeling process was explained. It is not limited to this, and cracks in the upper wafer W1 may be detected during the peeling process.

Hereinafter, an example of the configuration of the detection unit that detects the image wafer W1 during the peeling process will be described using FIGS. 29 and 30. Figure 29 shows the positional relationship between the image wafer W1, the adsorption portion 12 of the first holding portion 10, the blade portion 41 of the peeling attracting portion 40, and the detection portion 70D according to the fourth embodiment. This is a schematic floor plan. Fig. 30 is a schematic side view showing the positional relationship between the polymerization substrate T, the adsorption portion 12 of the first holding portion 10, and the detection portion 70D according to the fourth embodiment.

The detection unit 70D is, for example, a photoelectric sensor. As shown in FIGS. 29 and 30 , the detection unit 70D is provided with a transmitting/light transmitting portion 73 that transmits and transmits light, and a reflecting portion 74 that reflects light from the transmitting/light transmitting portion 73, respectively. 29 and 30, the light transmitted by the light transmitting and transmitting portion 73 is indicated by a dashed line. Here, an example is shown where the detection unit 70D is a reflective photoelectric sensor, but the detection unit 70D may be a transmissive photoelectric sensor. In this case, the detection unit 70D need only be provided with a light transmitting part that transmits light and a light receiving part that receives the light transmitted by the light projecting part.

As shown in FIG. 30, the light transmitting portion 73 and the reflecting portion 74 are held by the first holding portion 10 to hold the image wafer W1 higher than the plate surface on the polymerization substrate T on the side of the image wafer W1. ) is placed in a position that is offset from the moving direction (X-axis positive direction). The light transmitting portion 73 is disposed on one end side of the polymerization substrate T. The light transmitting section 73 transmits light in parallel to the bonding surface of the upper wafer W1 and the lower wafer W2 in the polymerization substrate T, and receives the light reflected from the reflecting section 74. . The reflection portion 74 is disposed on the other end side of the polymerization substrate T. The reflection portion 74 reflects the light transmitted from the light transmitting portion 73.

Here, an example is shown where the light transmitting portion 73 is disposed on one end of the polymerization substrate T and the reflecting portion 74 is disposed on the other end. It is not limited to this, and the reflection portion 74 may be disposed on one end of the polymerization substrate T, and the light transmitting portion 73 may be disposed on the other end.

Next, a process in which the control unit 81 detects cracks in the image wafer W1 during the peeling process using the above-described detection unit 70D will be described with reference to FIGS. 31 to 33. 31 and 32 are schematic side views showing an example of the relationship between the image wafer W1 and the detection unit 70D in a normal state. Fig. 33 is a schematic side view showing an example of the relationship between the image wafer W1 and the detection unit 70D when the image wafer W1 is broken during the peeling operation.

The crack detection process of the upper wafer W1 is performed in parallel with the peeling process (step S103 in FIG. 10). In other words, the crack detection process of the upper wafer W1 is performed during the peeling operation. The control unit 81 detects cracks in the upper wafer W1 based on the detection result of the detection unit 70D. Specifically, first, before the peeling process starts, when the light transmitted by the light transmitting and transmitting portion 73 is transmitted, the reflecting portion 74 reflects the light from the transmitting and light transmitting portion 73, and the light transmitting and light transmitting portion 73 reflects the light. Light is received, and a signal indicating light reception is transmitted to the control unit 81. After this, when the control unit 81 controls the lifting mechanism 50 and starts a peeling process in which a part of the outer peripheral part of the first holding part 10 is moved in a direction away from the second holding part 20, the peeling occurs. Light from the light transmitting and transmitting portion 73 is blocked by the image wafer W1 in the middle, and the reflecting portion 74 cannot reflect light to the transmitting and light transmitting portion 73, indicating that the transmitting and light transmitting portion 73 is not receiving light. A signal is transmitted to the control unit 81 (see FIG. 31). Afterwards, when the peeling process is completed, when the light transmitting and transmitting portion 73 transmits light, the reflecting portion 74 reflects the light from the transmitting and light transmitting portion 73 and receives the light reflected by the transmitting and light transmitting portion 73. and transmits a signal indicating light reception to the control unit 81 (see FIG. 32).

That is, the control unit 81 controls the period between when the peeling operation is started and receiving a signal indicating that light is not being received from the transmitting/light emitting unit 73, and until a predetermined timing arrives as the timing at which the peeling operation is completed. , when a signal indicating that light has been received from the transparent and light transmitting portion 73 is not received, it is determined that there is no crack in the upper wafer W1.

On the other hand, as shown in FIG. 33, it is said that a crack occurred in the upper wafer W1 during the peeling operation. Hereinafter, for convenience, the part of the broken upper wafer W1 that has been peeled off from the lower wafer W2 is called the 'upper wafer (W1a)', and the part that is still bonded to the lower wafer W2 is called the 'upper wafer (W2)'. It is called ‘W1b)’. In addition, the polymerization substrate on which the upper wafer W1b remains is called 'polymerization substrate T'.

As shown in FIG. 33, when a crack occurs in the upper wafer W1 during the peeling operation, the light emitted from the transparent and light-emitting portion 73 of the detection unit 70D reaches a predetermined timing as the timing at which the peeling operation is completed. It reaches the reflector 74 before. That is, the light-transmitting part 73 of the detection part 70D receives the light reflected by the reflecting part 74 before the predetermined timing at which the peeling operation is completed arrives.

In this way, after the peeling operation is started and the light from the light transmitting/light transmitting unit 73 is no longer received by the transmitting/light transmitting unit 73, before the predetermined timing for completion of the peeling operation arrives, the light transmitting/light transmitting unit 73 When light is received, the control unit 81 determines that a crack has occurred in the upper wafer W1. Thereby, the peeling device 7 according to the fourth embodiment can detect cracks in the upper wafer W1 during the peeling operation.

The peeling device 7 may be provided with both detection units 70A to 70C according to the third embodiment and detection units 70D according to the fourth embodiment.

(Fifth Embodiment)

In the fifth embodiment, the recovery process for the broken image wafer W1 in the third and fourth embodiments described above will be described with reference to FIGS. 34 to 37. 34 to 37 are diagrams showing operational examples of recovery processing according to the fifth embodiment.

The following processing is performed when the control unit 81 detects a crack in the upper wafer W1 in the crack detection processing of the third and fourth embodiments.

First, rotation processing of the polymerization substrate T is performed. Specifically, the control unit 81 controls the rotation lifting mechanism 23 so that the side of the other end side (the Y-axis positive direction side) of the polymerization substrate T' on which the image wafer W1 remains is formed by the peeling attracting portion 40. ) is rotated to face the polymerization substrate (T') (see Figure 34).

Next, a peeling inducement treatment is performed. The control unit 81 performs the same processing as step S102 in FIG. 10 (see FIGS. 35 and 36). As a result, a peeling start site that serves as a trigger for peeling the upper wafer W1 from the lower wafer W2 is formed in the polymerization substrate T'.

Next, a peeling treatment is performed. The control unit 81 performs the same processing as step S103 in Fig. 10 (see Fig. 37). As a result, the upper wafer W1b remaining on the polymerization substrate T' is peeled off from the lower wafer W2.

As described above, when a crack in the other end of the image wafer W1 is detected, the control unit 81 controls the rotary lifting mechanism 23 to remove the remaining polymerized substrate from the other end of the image wafer W1. After rotating the polymerized substrate (T') so that the side of the other end side (Y-axis positive direction side) of (T') faces the peeling attracting portion 40, the peeling attracting portion 40 is controlled to select the peeling start site. It is formed on the side surface of the other end of the polymerization substrate T', and then the first holding portion 10 is controlled to move the other end of the upper wafer W1 in a direction away from the lower wafer W2. .

According to this process, when it is determined that the image wafer W1 is broken during or after the peeling operation, the image wafer W1b remaining in the polymerization substrate T' can be recovered from the polymerization substrate T'. there is. Additionally, since the upper wafer W1b can be removed from the lower wafer W2, it is easy to reuse the lower wafer W2.

(6th embodiment)

Fig. 38 is a schematic side view showing a configuration example of the peeling device 7 according to the sixth embodiment. Fig. 39 is a schematic plan view of the receiving portion 75 according to the sixth embodiment. As shown in FIGS. 38 and 39 , the peeling device 7 may be provided with a receiving portion 75 that receives fragments of the image wafer W1.

The receiving portion 75 is a container that receives fragments of the upper wafer W1. The receiving portion 75 is located below the first holding portion 10, for example. As shown in FIGS. 38 and 39 , the receiving portion 75 may be provided along the outer peripheral portion of the second holding portion 20 . The receiving portion 35 may receive fragments of the image wafer W1 when the image wafer W1 is broken during or after the peeling operation. The receiving portion 75 may be detachable from the second holding portion 20, for example. In this case, recovery of fragments of the upper wafer W1 is easy.

Additionally, the position where the receiving portion 75 is provided is not limited to the position shown in FIGS. 38 and 39. For example, the receiving part 75 may be provided below the second holding part 20.

(7th embodiment)

Fig. 40 is a schematic side view showing a configuration example of the peeling device 7 according to the seventh embodiment. Fig. 41 is a schematic perspective view showing a configuration example of the peeling device 7 according to the seventh embodiment. As shown in FIGS. 40 and 41 , the peeling device 7 may be provided with a suction portion 83 for sucking the adhered matter of the peeling attracting portion 40 .

The suction part 83 sucks the atmosphere surrounding the peeling attraction part 40. The suction unit 83 is provided with a suction pipe 831 and an intake device 832. The suction pipe 831 has one end connected to a receiving portion 84 to be described later, and the other end is connected to the suction device 832. The suction part 83 sucks the atmosphere surrounding the peeling attraction part 40 by the suction force generated by the suction device 832. Thereby, the suction part 83 can remove the deposit adhering to the sharp member 41a of the peeling attraction part 40.

As shown in FIG. 41, the peeling device 7 may further include a receiving portion 84, an imaging portion 85, and an irradiation portion 86. The receiving portion 84 is disposed below the peeling inducing portion 40 and receives the adhered material attached to the sharp member 41a of the peeling inducing portion 40. The receiving portion 84 has an opening 842 at the upper portion and a cover portion 843 that covers a portion of the receiving portion 84. On the side of the receiving portion 84, a connecting portion 841 for connecting to the suction pipe 831 is provided. The receiving portion 84 is connected to the suction device 832 via a suction pipe 831. The suction part 83 sucks the atmosphere around the peeling attraction part 40 via the receiving part 84 by the suction force generated by the suction device 832. As a result, the adhering matter of the sharp member 41a of the peeling attracting portion 40 is attracted. That is, the opening 842 of the receiving part 84 also functions as a suction port of the suction part 83, and the cover part 843 also functions as an adjustment part for adjusting the suction range and suction position of the suction part 83.

The imaging unit 85 is disposed below the peeling inducing part 40 and captures an image of the edge of the sharpening member 41a included in the peeling inducing part 40. The control unit 81 confirms the state of the sharpening member 41a of the peeling attraction unit 40 based on the imaging data from the imaging unit 85. The irradiation unit 86 is, for example, an LED light, and irradiates light to the imaging target of the imaging unit 85 (here, the peeling attraction unit 40). The irradiation section 86 is disposed above the peeling inducing section 40 .

Hereinafter, the specific procedure of the adhesion suction process using the suction unit 83 will be explained using FIGS. 42 to 44. Fig. 42 is a flowchart showing the procedure of adhesion suction processing of the peeling device 7 according to the seventh embodiment. 43 and 44 are diagrams showing an operation example of the peeling device 7 according to the seventh embodiment. In addition, the processing sequence shown in FIG. 42 is performed, for example, after step S107 shown in FIG. 10, that is, after the upper wafer W1 and the lower wafer W2 are unloaded from the peeling device 7. .

As shown in Fig. 43, the control unit 81 performs a blade tip confirmation process (step S201). Specifically, the control unit 81 controls the moving mechanism 42 of the peeling attracting unit 40 to set the first position where the blade tip of the sharpening member 41a is located directly above the imaging unit 85. The peeling attraction portion 40 is placed on the. After this, the control unit 81 uses the imaging unit 85 to capture an image of the blade tip of the sharpening member 41a and confirms the state of the blade tip (e.g., presence or absence of teeth, etc.) (Figure 43).

Next, the control unit 81 performs a foreign matter recovery process (step S202). Specifically, the control unit 81 controls the moving mechanism 42 of the peeling attracting part 40 to move the blade part 41 in the horizontal direction (here, the Y-axis negative direction), and the receiving part 84 The peeling attracting portion 40 is disposed at the second position where the sharpening member 41a is located directly above the opening 842 (see Fig. 44). After this, the control unit 81 controls the suction unit 83 to suction the atmosphere surrounding the peeling attraction unit 40.

As described above, the control unit 81 controls the moving mechanism 42 to place the sharpening member 41a at the first position and controls the imaging unit 85 to sharpen the cutting edge of the sharpening member 41a. The tip is captured, the moving mechanism 42 is controlled, and the sharpening member 41a is placed in the second position, and the suction part 83 is controlled to suck the atmosphere around the peeling attracting part 40. . According to this treatment, adhesion to the sharpening member 41a can be removed.

(Eighth Embodiment)

Fig. 45 is a schematic plan view showing a configuration example of a peeling device according to the eighth embodiment. As shown in FIG. 45 , the peeling device 7 may be provided with a blowing portion 87 that blows gas toward the sharpening member 41a of the peeling attracting portion 40.

The blowing part 87 blows out gas such as air and inert gas towards the peeling attracting part 40. As shown in FIG. 45 , a gas supply source 873 and a valve 872 are connected to the blowing portion 87 via a supply passage 871. When the control unit 81 ejects gas from the ejection unit 87, the adhered matter on the sharpening member 41a falls downward. The adhered matter that has fallen downward is received by the receiving portion (84) and sucked by the suction portion (83).

According to this configuration, adhesion to the peeling attraction portion 40 can be removed.

(9th embodiment)

Fig. 46 is a schematic plan view showing a configuration example of the peeling device 7 according to the ninth embodiment. As shown in FIG. 46 , the peeling device 7 may be provided with a removal portion 88 that removes adhesion to the sharpening member 41a of the peeling attracting portion 40.

The removal unit 88 removes the deposit by physically contacting the sharpening member 41a of the peeling attraction unit 40. For example, the removal unit 88 may be provided with a roller 881 and a moving mechanism 882. The roller 881 is rotatable around a rotation axis extending in a direction (Y-axis direction) perpendicular to the extension direction (X-axis direction) of the edge of the sharpening member 41a. The roller 881 is a contact portion that contacts the upper surface of the sharpening member 41a of the peeling attracting portion 40. The moving mechanism 882 moves the roller 881 along the extending direction (X-axis direction) of the cutting edge of the sharpening member 41a.

Hereinafter, the attachment removal process using the removal unit 88 will be described. The control unit 81 controls the moving mechanism 882 to move the roller 881 on the upper surface of the sharpening member 41a of the peeling attracting portion 40 in the horizontal direction (here, the X-axis direction). As a result, the adhered matter on the upper surface of the sharpening member 41a comes into contact with the roller 881, is pushed out by the roller 881, and falls downward. Adhesion that has fallen downward is received by the receiving portion (84) and sucked by the suction portion (83).

According to this configuration, adhesion to the peeling attraction portion 40 can be removed.

(10th embodiment)

47 and 48 are schematic perspective views showing a configuration example of the peeling device 7 according to the tenth embodiment. As shown in FIG. 47 , the removal portion 89 is a noreme-shaped contact portion, and is provided, for example, directly above the opening 842 of the receiving portion 84. As shown in FIG. 48, the lower part of the removal part 89 contacts the upper surface of the sharpening member 41a.

Hereinafter, the attachment removal process using the removal unit 89 will be described with reference to FIGS. 47 and 48. As shown in FIG. 47 , the adhesion removal process is started with the lower part of the removal part 89 in contact with the upper surface of the sharpening member 41a of the peeling attracting part 40.

The control unit 81 controls the moving mechanism 42 to move the blade portion 41 of the peeling attraction portion 40 in the negative Y-axis direction. As a result, the adhering matter on the upper surface of the sharpening member 41a of the blade portion 41 is collected by the removal portion 89. After this, when the blade portion 41 moves further in the negative Y-axis direction and the sharpening member 41a moves away from the removal portion 89 (see Fig. 48), the attachment blocked by the removal portion 89 moves downward. It falls. Adhesion that has fallen downward is received by the receiving portion (84) and sucked by the suction portion (83).

According to this configuration, adhesion to the peeling attraction portion 40 can be removed.

(Eleventh Embodiment)

49 and 50 are schematic side views showing a configuration example of the peeling device 7 according to the 11th embodiment. As shown in FIGS. 49 and 50 , the peeling device 7 is provided with a moving mechanism 844 (an example of the first moving mechanism) that moves the receiving portion 84 in the horizontal direction (Y-axis direction). do.

In the eleventh embodiment, the second holding portion 20a may be formed to have a diameter smaller than the diameter of the lower wafer W2. In this case, the second holding portion 20a adsorbs and holds the lower surface of the lower wafer W2 excluding the outer peripheral portion.

Hereinafter, a specific procedure for moving the receiving unit using the moving mechanism 844 will be described using FIGS. 49 and 50. In addition, this processing sequence is executed simultaneously with step S102 shown in FIG. 10, that is, simultaneously with the peeling inducement process, for example.

First, the control unit 81 controls the moving mechanism 844 when controlling the moving mechanism 42 to move the sharpening member 41a in a direction (positive Y-axis direction) closer to the polymerization substrate T. The receiving portion 84 is moved below the blade tip of the sharpening member 41a. In other words, the control unit 81 controls the movement mechanism 844 to move the receiving portion 84 in the Y-axis positive direction in conjunction with the movement of the sharpening member 41a in the Y-axis positive direction by the movement mechanism 42. Let's do it. Specifically, the receiving portion 84 is moved in the positive Y-axis direction so that the opening 842 (see Fig. 41) in the receiving portion 84 is located directly below the sharpening member 41a ( Fig. 49 reference). After this, the control unit 81 controls the suction unit 83 to start suction of the atmosphere surrounding the peeling attraction unit 40.

Next, the control unit 81 controls the moving mechanism 42 to press the sharpening member 41a against the side surface of the polymerization substrate T to separate the upper and lower wafers W1 from the polymerization substrate T. The sharpening member 41a is inserted into the joint with the wafer W2. In this case as well, the control unit 81 may control the moving mechanism 844 to move the receiving unit 84 in the positive Y-axis direction in conjunction with the movement of the sharpening member 41a by the moving mechanism 42. . As described above, since the second holding portion 20a is formed to have a smaller diameter than the diameter of the lower wafer W2, even when the sharpening member 41a is inserted into the joint, the receiving portion 84 is subject to this movement. It can be linked to move in the Y-axis forward direction.

Next, the control unit 81 controls the moving mechanism 42 to start moving the sharpening member 41a in a direction away from the polymerization substrate T (negative Y-axis direction). After this, the control unit 81 controls the moving mechanism 844 to start moving the receiving unit 84 in a direction away from the polymerization substrate T (negative Y-axis direction). Specifically, the control unit 81 operates the receiving unit when a certain period of time has elapsed since the start of movement of the sharpening member 41a in the Y-axis negative direction, or when the sharpening member 41a has reached a predetermined position. (84) is started to move in the negative Y-axis direction. After this, the control unit 81 stops the movement of the sharpening member 41a and the receiving portion 84 when the sharpening member 41a and the receiving portion 84 reach the standby position away from the polymerization substrate T. . After this, the control unit 81 controls the suction unit 83 to stop suction of the atmosphere surrounding the peeling attraction unit 40.

As described above, the peeling device 7 according to the 11th embodiment is provided with a moving mechanism 844 that moves the receiving portion 84. According to this configuration, the receiving portion 84 can be moved along with the movement of the sharpening member 41a, so that particles generated when the sharpening member 41a moves can be received by the receiving portion 84. there is.

In addition, as described above, the control unit 81 controls the moving mechanism 844 when controlling the moving mechanism 42 to move the sharpening member 41a in a direction closer to the polymerization substrate T. The receiving portion 84 is moved below the blade tip of the sharpening member 41a. According to this process, the particles generated during the peeling attraction process can be received by the receiving unit 84.

In addition, as described above, after the peeling attraction treatment, the control unit 81 starts moving the sharpening member 41a in a direction away from the polymerization substrate T, and then moves the receiving portion 84 away from the polymerization substrate T. Start moving in the direction away from you. According to this process, the falling particles when the polymerization substrate T and the sharpening member 41a are separated can be received by the receiving portion 84.

As described above, the peeling device (as an example, the peeling device 7) according to the embodiment includes a first holding portion (as an example, the first holding portion 10) and a second holding portion (as an example, the first holding portion 10). 2. It is provided with a holding part 20), a peeling attraction part (as an example, a peeling attraction part 40), and a suction part (as an example, a suction part 83). The first holding portion is the first of the polymerization substrates (as an example, the polymerization substrate T) to which a first substrate (as an example, an upper wafer W1) and a second substrate (as an example, a lower wafer W2) are bonded. The substrate is held and the first substrate is moved in a direction away from the second substrate. The second holding portion holds the second substrate among the polymerization substrates. The peeling attraction portion is formed on the side surface of one end of the polymerization substrate at a portion that causes the first substrate to peel off from the second substrate. The suction portion absorbs the atmosphere surrounding the peeling attraction portion.

Therefore, according to the peeling device according to the embodiment, foreign matter adhering to the peeling attraction portion can be removed.

The embodiment disclosed this time should be considered in all respects as an example and not restrictive. Indeed, the above-described embodiments may be implemented in various forms. In addition, the above-described embodiments may be omitted, replaced, or changed in various forms without departing from the scope and spirit of the appended claims.

Claims (13)

A first holding portion that holds the first substrate among the polymerization substrates to which the first substrate and the second substrate are bonded and moves the first substrate in a direction away from the second substrate;
a second holding portion holding the second substrate among the polymerization substrates;
a peeling attraction portion formed on a side surface of one end of the polymerization substrate to provide a trigger for peeling the first substrate from the second substrate;
A suction part that absorbs the atmosphere surrounding the peeling attraction part.
A peeling device comprising: According to claim 1,
a receiving portion disposed below the peeling attracting portion and receiving the attachment of the peeling attracting portion;
A peeling device, wherein the suction part sucks the atmosphere surrounding the peeling attracting part via the receiving part. According to claim 2,
A peeling device comprising a cover portion that covers a portion of the receiving portion. According to claim 1,
A peeling device comprising a removal portion that contacts the peeling attracting portion and removes adhesion to the peeling attracting portion. According to claim 1,
A peeling device comprising a blowing portion that blows gas toward the peeling attracting portion. According to claim 2,
an imaging unit disposed below the peeling attracting portion and capturing an image of the peeling attracting portion;
A control unit for controlling the peeling attracting unit, the imaging unit, and the suction unit,
The peeling attractor,
a sharpening member whose blade tip protrudes toward the polymerization substrate;
A moving mechanism that moves the sharpening member in the horizontal direction
Equipped with
The control unit controls the moving mechanism to place the sharpening member in a first position where the tip of the cutting edge of the sharpening member is positioned above the imaging part, and controls the imaging unit to move the cutting edge of the sharpening member. The tip is captured and the moving mechanism is controlled to place the sharpening member in a second position where the blade tip of the sharpening member is located above the receiving portion, and the suction portion is controlled to move around the peeling attraction portion. A peeling device that absorbs the atmosphere. According to claim 2,
A peeling device comprising a moving mechanism that moves the receiving portion in a horizontal direction. According to claim 2,
a first moving mechanism that moves the receiving portion in a horizontal direction;
It has a control unit that controls the peeling attractor and the first moving mechanism,
The peeling attractor,
a sharpening member whose blade tip protrudes toward the polymerization substrate;
A second moving mechanism that moves the sharpening member in a horizontal direction
Equipped with
The control unit controls the first movement mechanism to move the receiving portion below the tip of the blade when the control unit controls the second movement mechanism to move the sharpening member in a direction closer to the polymerization substrate. Device. According to claim 8,
The control unit controls the second moving mechanism to insert the sharpening member into the joint between the first substrate and the second substrate in the polymerization substrate, and then controls the second moving mechanism to insert the sharpening member into the joint between the first substrate and the second substrate in the polymerization substrate. A peeling device in which the sharpening member is started to move in a direction away from the polymerization substrate, and then the first movement mechanism is controlled to start moving the receiving portion in a direction away from the polymerization substrate. A loading/unloading station where a polymerized substrate in which a first substrate and a second substrate are bonded is placed,
a substrate transport device for transporting the polymerized substrate disposed at the loading/unloading station;
A peeling device that peels the polymerized substrate transported by the substrate transfer device into the first substrate and the second substrate.
Equipped with
The peeling device is,
a first holding portion that holds the first substrate among the polymerization substrates and moves the first substrate in a direction away from the second substrate;
a second holding portion holding the second substrate among the polymerization substrates;
a peeling attraction portion formed on a side surface of one end of the polymerization substrate to provide a trigger for peeling the first substrate from the second substrate;
A suction part that absorbs the atmosphere surrounding the peeling attraction part.
A peeling system comprising: An atmosphere surrounding a peeling attraction portion formed on a side surface of one end of a polymerized substrate to which a first substrate and a second substrate are bonded, a portion that causes the first substrate to peel from the second substrate. A step of suctioning the atmosphere surrounding the peeling attraction portion using a suction portion for suction;
A step of forming the portion on a side surface of one end of the polymerization substrate using the peeling attraction portion;
A process of holding the first substrate using a first holding portion that holds the first substrate and moves the first substrate in a direction away from the second substrate;
A step of holding the second substrate among the polymerization substrates using a second holding portion that holds the second substrate,
A process of moving the first substrate away from the second substrate using the first holding unit.
Including, a peeling method. According to claim 11,
When moving the sharpening member in the horizontal direction using a second moving mechanism that moves the sharpening member whose blade tip protrudes toward the polymerization substrate in the horizontal direction, it is disposed below the peeling attracting portion, and the peeling attracting portion is disposed below the peeling attracting portion. A process of moving the receiving portion below the tip of the blade using a first moving mechanism that moves the receiving portion that receives the attachment of the blade in the horizontal direction.
Including, a peeling method. According to claim 12,
A step of inserting the sharpening member into a joint between the first substrate and the second substrate in the polymerization substrate using the second moving mechanism;
After the step of inserting the sharpening member, a step of starting to move the sharpening member in a direction away from the polymerization substrate using the second moving mechanism;
After the step of moving the sharpening member in a direction away from the polymerization substrate, a step of starting to move the receiving portion in a direction away from the polymerization substrate using the first moving mechanism.
Including, a peeling method.

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