KR20240050195A - Electronic device including rotatable damper - Google Patents

Abstract

The electronic device includes a first substrate including a first hole, a second substrate including a second hole, a shield can attached to one side of the first substrate opposite to the second substrate, and It may include an interposer interposed between the first substrate and the second substrate, and a damper assembly penetrating the first hole and the second hole. The damper assembly includes a damper case rotatable along inner surfaces of the first hole and the second hole, a first opening connected to a space between the first substrate and the second substrate, and a space between the first substrate and the shield can. It may include a second opening connected to the space, a first backflow prevention film aligned with the first substrate, and a second backflow prevention film aligned with the second substrate. Other embodiments are possible.

Description

Electronic device including rotatable damper {ELECTRONIC DEVICE INCLUDING ROTATABLE DAMPER}

Embodiments of the present disclosure relate to an electronic device including a rotatable damper.

A printed circuit board can arrange a plurality of components for driving an electronic device. While the electronic device is running, the plurality of components may generate heat. Printed circuit boards containing major electronic components can generate a lot of heat.

As the density of electronic components in electronic products increases, heat generation increases, so electronic devices may include heat transfer members and/or fans for cooling.

According to one embodiment, an electronic device may include a first substrate including a first hole. The electronic device may include a second substrate. The second substrate may include a second hole that is spaced apart from the first substrate and aligned with the first hole. The electronic device may include a shield can. The shield can may be attached to one side of the first substrate that faces the second substrate and the other side opposite to the other side. The electronic device may include an interposer. The interposer may be interposed between the first substrate and the second substrate and connect the first substrate and the second substrate. The electronic device may include the damper assembly. According to one embodiment, the damper assembly may pass through the first hole and the second hole. According to one embodiment, the damper assembly may include a damper case rotatable along inner surfaces of the first hole and the second hole. The damper assembly may include a first opening connecting the space between the first substrate and the second substrate and the interior of the damper case. The damper assembly may further include a second opening connecting the space between the first substrate and the interposer and the interior of the damper case. The damper assembly may further include a first backflow prevention film aligned with the first substrate and a second backflow prevention film aligned with the second substrate.

According to one embodiment, an electronic device may include a first electronic component disposed on one side and a first substrate including a first hole. The electronic device may include a second electronic component disposed on one side facing the first substrate, and may include a second substrate spaced apart from the first substrate. The electronic device may include a viscous material that spreads along one side of the first printed circuit board from a position corresponding to the first hole and covers the first electronic component. The electronic device may include an interposer disposed between the first substrate and the second substrate. The electronic device may include a damper assembly penetrating the second hole. The damper assembly may include a damper case rotatable along an inner surface of the second hole. The damper assembly may include a first opening connecting the space between the first substrate and the second substrate and the interior of the damper case. The damper assembly may include a first backflow prevention film disposed on the second substrate.

1 is a block diagram of an electronic device in a network environment according to various embodiments.
FIG. 2 is a diagram illustrating an electronic device according to an embodiment.
Figure 3 is an exploded perspective view of an electronic device according to an embodiment.
4 is an exploded perspective view of an example printed circuit board assembly including an interposer, printed circuit boards, and a shield can, according to one embodiment.
5A is a perspective view of an exemplary damper assembly, according to one embodiment.
5B is a cross-sectional view of a printed circuit board assembly coupled with an exemplary damper assembly, according to one embodiment.
6 is a perspective view of an exemplary damper assembly for injecting liquid into a space between printed circuit boards, according to one embodiment.
Figure 7 is a cross-sectional view showing an exemplary modification of the damper case of the damper assembly, according to one embodiment.
8 is a cross-sectional view of an exemplary damper case including an energizing structure, according to one embodiment.
9 is a cross-sectional view of an example damper structure inserted into a plurality of printed circuit boards, according to one embodiment.

1 is a block diagram of an electronic device in a network environment, according to various embodiments.

Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or operations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes a main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device 101 includes a main processor 121 and a auxiliary processor 123, the auxiliary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, co-processor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself, where artificial intelligence is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 to communicate within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support a high frequency band (eg, mmWave band), for example, to achieve a high data rate. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is, for example, connected to the plurality of antennas by the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 does not execute the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

FIG. 2 is a diagram illustrating an electronic device according to an embodiment.

Referring to FIG. 2 , the electronic device 200 according to one embodiment may include a housing 210 that forms the exterior of the electronic device 200. For example, housing 210 surrounds a first side (or front) 200A, a second side (or back) 200B, and a space between the first side 200A and the second side 200B. may include a third side (or side) 200C. In one embodiment, housing 210 has a structure (e.g., the frame structure of FIG. 3 ) that forms at least a portion of first side 200A, second side 200B, and/or third side 200C. 240)).

The electronic device 200 according to one embodiment may include a substantially transparent front plate 202. In one embodiment, front plate 202 may form at least a portion of first side 200A. In one embodiment, the front plate 202 may include, but is not limited to, a glass plate including various coating layers, or a polymer plate, for example.

The electronic device 200 according to one embodiment may include a substantially opaque rear plate 211. In one embodiment, the rear plate 211 may form at least a portion of the second surface 200B. In one embodiment, back plate 211 may be formed by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. You can.

The electronic device 200 according to one embodiment may include a side bezel structure (or side member) 218 (eg, the side wall 241 of the frame structure 240 of FIG. 3). In one embodiment, side bezel structure 218 may be combined with front plate 202 and/or back plate 211 to form at least a portion of third side 200C of electronic device 200. For example, the side bezel structure 218 may entirely form the third side 200C of the electronic device 200, or in another example, the side bezel structure 218 may form the front plate 202 and/or Together with the back plate 211, the third side 200C of the electronic device 200 may be formed.

Unlike the illustrated embodiment, when the third side 200C of the electronic device 200 is partially formed by the front plate 202 and/or the rear plate 211, the front plate 202 and/or the rear plate 211 The plate 211 may include a region that is curved and extends seamlessly from its edge toward the rear plate 211 and/or the front plate 202 . The extended area of the front plate 202 and/or the rear plate 211 may be, for example, located at both ends of a long edge of the electronic device 200, but according to the above-described example, It is not limited.

In one embodiment, side bezel structure 218 may include metal and/or polymer. In one embodiment, the back plate 211 and the side bezel structure 218 may be formed integrally and may include the same material (eg, a metal material such as aluminum), but are not limited thereto. For example, the back plate 211 and the side bezel structures 218 may be formed of separate construction and/or may include different materials.

In one embodiment, the electronic device 200 includes a display 201, an audio module 203, 204, and 207, a sensor module (not shown), a camera module 205, 212, and 213, a key input device 217, It may include at least one of a light emitting device (not shown) and/or a connector hole 208. In another embodiment, the electronic device 200 may omit at least one of the above components (e.g., key input device 217 or a light emitting device (not shown)) or may additionally include other components.

In one embodiment, display 201 (e.g., display module 160 of Figure 2) may be visually exposed through a significant portion of front plate 202. For example, at least a portion of display 201 may be In one embodiment, the display 201 may be disposed on the back of the front plate 202, which forms the first side 200A.

In one embodiment, the outer shape of the display 201 may be substantially the same as the outer shape of the front plate 202 adjacent to the display 201. In one embodiment, in order to expand the area to which the display 201 is visually exposed, the distance between the outer edge of the display 201 and the outer edge of the front plate 202 may be formed to be substantially the same.

In one embodiment, the display 201 (or the first side 200A of the electronic device 200) may include a screen display area 201A. In one embodiment, the display 201 may provide visual information to the user through the screen display area 201A. In the illustrated embodiment, when the first side 200A is viewed from the front, the screen display area 201A is shown to be located inside the first side 200A and spaced apart from the outer edge of the first side 200A. However, it is not limited to this. In another embodiment, when the first side 200A is viewed head on, at least a portion of an edge of the screen display area 201A substantially coincides with an edge of the first side 200A (or the front plate 202). It could be.

In one embodiment, the screen display area 201A may include a sensing area 201B configured to obtain biometric information of the user. Here, the meaning of “the screen display area 201A includes the sensing area 201B” can be understood as at least a portion of the sensing area 201B being overlapped with the screen display area 201A. there is. For example, the sensing area 201B can display visual information by the display 201 like other areas of the screen display area 201A, and can additionally acquire the user's biometric information (e.g., fingerprint). It can mean area. In another embodiment, the sensing area 201B may be formed in the key input device 217.

In one embodiment, the display 201 may include an area where the first camera module 205 (eg, the camera module 180 of FIG. 2) is located. In one embodiment, an opening is formed in the area of the display 201, and a first camera module 205 (e.g., a punch hole camera) is at least partially disposed within the opening to face the first side 200A. You can. In this case, the screen display area 201A may surround at least a portion of the edge of the opening. In another embodiment, the first camera module 205 (e.g., an under display camera (UDC)) may be placed below the display 201 to overlap the area of the display 201. In this case, the display 201 can provide visual information to the user through the area, and additionally, the first camera module 205 is positioned in a direction toward the first side 200A through the area of the display 201. A corresponding image can be obtained.

In one embodiment, the display 201 may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer that detects a magnetic field-type stylus pen. .

In one embodiment, the audio modules 203, 204, and 207 (e.g., audio module 170 in FIG. 2) may include microphone holes 203 and 204 and speaker holes 207.

In one embodiment, the microphone holes 203 and 204 include a first microphone hole 203 formed in a portion of the third side 200C and a second microphone hole 204 formed in a portion of the second side 200B. may include. Microphones (not shown) may be placed inside the microphone holes 203 and 204 to acquire external sounds. The microphone may include a plurality of microphones to detect the direction of sound.

In one embodiment, the second microphone hole 204 formed in a partial area of the second surface 200B may be disposed adjacent to the camera modules 205, 212, and 213. For example, the second microphone hole 204 may acquire sound according to the operation of the camera modules 205, 212, and 213. However, it is not limited to this.

In one embodiment, the speaker hole 207 may include an external speaker hole 207 and a receiver hole (not shown) for a call. The external speaker hole 207 may be formed in a portion of the third side 200C of the electronic device 200. In another embodiment, the external speaker hole 207 may be implemented as one hole with the microphone hole 203. Although not shown, a receiver hole (not shown) for a call may be formed in another part of the third side 200C. For example, the receiver hole for a call may be formed on the third side 200C opposite the external speaker hole 207. For example, based on the illustration in FIG. 2, the external speaker hole 207 is formed on the third side 200C corresponding to the lower part of the electronic device 200, and the receiver hole for a call is formed on the electronic device 200. It may be formed on the third side 200C corresponding to the upper end. However, it is not limited to this, and in another embodiment, the call receiver hole may be formed in a location other than the third surface 200C. For example, a receiver hole for a call may be formed by a spaced space between the front plate 202 (or display 201) and the side bezel structure 218.

In one embodiment, the electronic device 200 includes at least one speaker (not shown) configured to output sound to the outside of the housing 210 through the external speaker hole 207 and/or the call receiver hole (not shown). ) may include.

In one embodiment, a sensor module (not shown) (e.g., sensor module 176 in FIG. 2) generates an electrical signal or data value corresponding to the internal operating state of the electronic device 200 or the external environmental state. can be created. For example, the sensor module may include a proximity sensor, HRM sensor, fingerprint sensor, gesture sensor, gyro sensor, barometric pressure sensor, magnetic sensor, acceleration sensor, grip sensor, color sensor, IR (infrared) sensor, biometric sensor, temperature sensor, It may include at least one of a humidity sensor or an illuminance sensor.

In one embodiment, the camera modules 205, 212, and 213 (e.g., the camera module 180 in FIG. 2) are arranged to face the first side 200A of the electronic device 200. 205), a second camera module 212 arranged to face the second surface 200B, and a flash 213.

In one embodiment, the second camera module 212 may include a plurality of cameras (eg, a dual camera, a triple camera, or a quad camera). However, the second camera module 212 is not necessarily limited to including a plurality of cameras and may include one camera.

In one embodiment, the first camera module 205 and the second camera module 212 may include one or more lenses, an image sensor, and/or an image signal processor.

In one embodiment, flash 213 may include, for example, a light emitting diode or a xenon lamp. In another embodiment, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be placed on one side of the electronic device 200.

In one embodiment, the key input device 217 (eg, input module 150 in FIG. 2) may be disposed on the third side 200C of the electronic device 200. In other embodiments, the electronic device 200 may not include some or all of the key input devices 217, and the key input devices 217 that do not include other types of key input devices 217 may be displayed on the display 201, such as soft keys. It can be implemented as:

In one embodiment, the connector hole 208 may be formed on the third side 200C of the electronic device 200 to accommodate a connector of an external device. A connection terminal (eg, connection terminal 178 in FIG. 2) that is electrically connected to a connector of an external device may be disposed in the connector hole 208. The electronic device 200 according to one embodiment may include an interface module (eg, interface 177 of FIG. 2) for processing electrical signals transmitted and received through the connection terminal.

In one embodiment, the electronic device 200 may include a light emitting device (not shown). For example, the light emitting device (not shown) may be disposed on the first surface 200A of the housing 210. The light emitting device (not shown) may provide status information of the electronic device 200 in the form of light. In another embodiment, the light emitting device (not shown) may provide a light source linked to the operation of the first camera module 205. For example, the light emitting device (not shown) may include an LED, an IR LED, and/or a xenon lamp.

Figure 3 is an exploded perspective view of an electronic device according to an embodiment.

Hereinafter, overlapping descriptions of components having the same reference numerals as the above-described components will be omitted.

Referring to FIG. 3, the electronic device 200 according to one embodiment includes a frame structure 240, a first printed circuit board 250, a second printed circuit board 252, a cover plate 260, and a battery. It may include (270).

In one embodiment, the frame structure 240 includes a side wall 241 that forms the exterior of the electronic device 200 (e.g., the third side 200C of FIG. 2) and extending inward from the side wall 241. It may include a support portion 243. In one embodiment, frame structure 240 may be disposed between display 201 and back plate 211. In one embodiment, sidewalls 241 of frame structure 240 may surround the space between back plate 211 and front plate 202 (and/or display 201), and frame structure 240 The support portion 243 may extend from the side wall 241 within the space. According to one embodiment, the side wall 241 forming the side of the electronic device 200 (e.g., the side 200C in FIG. 2) is a speaker hole 207 connecting the inside and outside of the electronic device 200. may include. The speaker hole 207 may penetrate the side wall 241. An audio signal output from a speaker disposed inside the electronic device 200 may be transmitted to the outside of the electronic device 200 through the speaker hole 207.

In one embodiment, frame structure 240 may support or accommodate other components included in electronic device 200. For example, the display 201 may be disposed on one side of the frame structure 240 facing in one direction (e.g., +z direction), and the display 201 may be disposed on the support portion 243 of the frame structure 240. It can be supported by . For another example, a first printed circuit board 250, a second printed circuit board 252, and a battery 270 are provided on the other side of the frame structure 240 facing in a direction opposite to the one direction (e.g., -z direction). ), and the second camera module 212 may be disposed. The first printed circuit board 250, the second printed circuit board 252, the battery 270, and the second camera module 212 are attached to the side wall 241 and/or the support portion 243 of the frame structure 240. Each can be seated in a recess defined by

In one embodiment, the first printed circuit board 250, the second printed circuit board 252, and the battery 270 may each be combined with the frame structure 240. For example, the first printed circuit board 250 and the second printed circuit board 252 may be fixed to the frame structure 240 through a coupling member such as a screw. For example, the battery 270 may be fixed to the frame structure 240 through an adhesive member (eg, double-sided tape). However, it is not limited to the above-described example.

In one embodiment, the cover plate 260 may be disposed between the first printed circuit board 250 and the back plate 211. In one embodiment, a cover plate 260 may be disposed on the first printed circuit board 250. For example, the cover plate 260 may be disposed on a side of the first printed circuit board 250 facing the -z direction.

In one embodiment, the cover plate 260 may at least partially overlap the first printed circuit board 250 with respect to the z-axis. In one embodiment, the cover plate 260 may cover at least a partial area of the first printed circuit board 250. Through this, the cover plate 260 can protect the first printed circuit board 250 from physical shock or prevent the connector coupled to the first printed circuit board 250 from being separated.

In one embodiment, the cover plate 260 is fixedly disposed on the first printed circuit board 250 through a coupling member (e.g., a screw), or is coupled with the first printed circuit board 250 through the coupling member. Can be coupled to frame structure 240.

In one embodiment, display 201 may be disposed between frame structure 240 and front plate 202. For example, the front plate 202 may be disposed on one side (e.g., +z direction) of the display 201, and the frame structure 240 may be disposed on the other side (e.g., -z direction).

In one embodiment, front plate 202 may be coupled with display 201. For example, the front plate 202 and the display 201 may be adhered to each other through an optical adhesive member (eg, optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

In one embodiment, front plate 202 may be coupled with frame structure 240. For example, the front plate 202 may include an outer portion extending outside the display 201 when viewed in the z-axis direction, and the outer portion of the front plate 202 and the frame structure 240 ( For example, it may be adhered to the frame structure 240 through an adhesive member (eg, double-sided tape) disposed between the side walls 241). However, it is not limited to the above-mentioned example.

In one embodiment, the first printed circuit board 250 and/or the second printed circuit board 252 include a processor (e.g., processor 120 of FIG. 2) and a memory (e.g., memory 130 of FIG. 2). ), and/or an interface (e.g., interface 177 of FIG. 2) may be installed. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. Memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device 200 to an external electronic device and may include a USB connector, SD card/MMC connector, or audio connector. In one embodiment, the first printed circuit board 250 and the second printed circuit board 252 may be operatively or electrically connected to each other through a connecting member (eg, a flexible printed circuit board).

In one embodiment, battery 270 (eg, battery 189 in FIG. 2 ) may supply power to at least one component of electronic device 200 . For example, the battery 270 may include a rechargeable secondary battery or fuel cell. At least a portion of the battery 270 may be disposed on substantially the same plane as the first printed circuit board 250 and/or the second printed circuit board 252.

The electronic device 200 according to one embodiment may include an antenna module (not shown) (eg, the antenna module 197 of FIG. 2). In one embodiment, the antenna module may be disposed between the rear plate 211 and the battery 270. The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. For example, the antenna module can perform short-distance communication with an external device or wirelessly transmit and receive power to and from an external device.

In one embodiment, the first camera module 205 (e.g., front camera) is framed so that the lens can receive external light through some area of the front plate 202 (e.g., front side 200A in FIG. 2). It may be disposed on at least a portion of structure 240 (eg, support portion 243).

In one embodiment, the second camera module 212 (e.g., a rear camera) may be disposed between the frame structure 240 and the rear plate 211. In one embodiment, the second camera module 212 may be electrically connected to the first printed circuit board 250 through a connection member (eg, connector). In one embodiment, the second camera module 212 may be positioned so that the lens can receive external light through the camera area 284 of the rear plate 211 of the electronic device 200.

In one embodiment, the camera area 284 may be formed on the surface of the back plate 211 (eg, the back side 200B in FIG. 2). In one embodiment, the camera area 284 may be formed to be at least partially transparent to allow external light to enter the lens of the second camera module 212. In one embodiment, at least a portion of the camera area 284 may protrude from the surface of the back plate 211 at a predetermined height. However, it is not limited to this, and in another embodiment, the camera area 284 may form substantially the same plane as the surface of the rear plate 211.

In one embodiment, the housing 210 of the electronic device 200 may refer to a configuration or structure that forms at least part of the exterior of the electronic device 200. In this respect, at least some of the front plate 202, frame structure 240, and/or back plate 211 that form the exterior of the electronic device 200 are referred to as the housing 210 of the electronic device 200. It can be.

4 is an exploded perspective view of an example printed circuit board assembly including an interposer, printed circuit boards, and a shield can, according to one embodiment.

Referring to FIG. 4, the printed circuit board assembly 400 includes a first substrate 250 (e.g., the first printed circuit board 250 of FIG. 3), a second substrate 450, a shield can 460, and an interposer 450.

According to one embodiment, the first substrate 250 may include a first hole 491. First electronic components 401 may be disposed on the first substrate 250 . The first hole 491 can accommodate a damper assembly (not shown) that guides a nozzle (not shown) that provides liquid material surrounding the first electronic components 401 on the first substrate 250. . For example, the damper assembly may pass through the first hole 491. The first electronic components 401 may be disposed on one side of the first substrate 250 . For example, the first electronic components 401 may be disposed on a side facing the second substrate 450 or the first electronic components 401 may be disposed on a side facing the shield can 460 .

According to one embodiment, the second substrate 450 may be spaced apart from the first substrate 250. For example, the second substrate 450 may be spaced apart from one surface of the first substrate 250 in a vertical direction. The second substrate 450 may include a second hole 492. The second hole 492 may be aligned with the first hole 491. When the printed circuit board assembly 400 is viewed from above, the center of the second hole 492 may coincide with the center of the first hole 491. Second electronic components 402 may be disposed on the second substrate 450 . The second electronic components 402 may be disposed on one side of the second substrate 450 . For example, the second electronic components 402 are disposed on one side of the second substrate 450 facing the first substrate 250, or the second electronic components 402 are disposed on one side of the second substrate 450. It may be disposed on the other side of the second substrate 450, which is opposite to the one side.

According to one embodiment, the interposer 420 may be disposed between the first substrate 250 and the second substrate 450. The interposer 420 may be interposed between the first substrate 250 and the second substrate 450. For example, a portion of the interposer 420 may be in contact with the first substrate 250, and another portion facing the portion of the interposer 420 may be in contact with the second substrate 450. The interposer 420 may electrically connect the first substrate 250 and the second substrate 450. For example, a processor disposed on the first substrate 250 (e.g., processor 120 of FIG. 1) may be electrically connected to the second electronic components 402 disposed on the second substrate 450. . The processor 120 may exchange signals and data with the second electronic components 402 .

According to one embodiment, the shield can 460 may be disposed on the first substrate 250. For example, the shield can 460 may be attached to one side of the first substrate 250 that faces the second substrate 450 and the other side opposite to the other side. The shield can 460 may surround at least a portion of the first electronic components 401 disposed on the first substrate 250 on the other side. The shield can 460 prevents the noise signal emitted from the at least some of the first electronic components 401 from being transmitted to the outside, or prevents the noise signal from being transmitted from the outside to the at least some of the first electronic components 401. can be prevented from being transmitted. The shield can 460 may be bonded to the first substrate 250 . For example, the shield can 460 may be soldered to the first substrate 250. The shield can 460 may be electrically connected to the ground line in the first substrate 250.

According to one embodiment, the damper assembly inserted into the first through hole 491 and the second through hole 492 uses liquid (e.g., thermal interface material (TIM) or resin for shock prevention). It can be sprayed in the first direction (d1). The first substrate 250 may include a region P2 where the liquid is not applied. The liquid sprayed in the first direction d1 may be disposed in the area P1. The liquid sprayed in the first direction d1 may be disposed in a region P1 extending in the first direction d1 with the first hole 491 or the second hole 492 as the center. The liquid sprayed in the first direction d1 may not be disposed in the area P2 at an angle different from the first direction d1. The liquid sprayed from the nozzle in the first direction d1 may not be evenly applied on the first substrate 250.

The printed circuit board assembly 400 according to the above-described embodiment may include a region P2 where the liquid is not applied. The printed circuit board assembly 400 may include a damper assembly structure for applying liquid to the area P2. The structure of the specific damper assembly is explained through FIGS. 5 to 9.

5A is a perspective view of an exemplary damper assembly, according to one embodiment. 5B is a cross-sectional view of a printed circuit board assembly coupled with an exemplary damper assembly, according to one embodiment.

5A and 5B, the damper assembly 501 may include a damper case 510, a first backflow prevention film 511, a second backflow prevention film 516, a holder 530, and a handle 550. You can. The damper assembly 501 may provide a liquid or flowable material for the electronic components 401 and 402 disposed on the first substrate 250 and the second substrate 450. For example, the damper assembly 501 supplies liquid (e.g., thermal interface material (TIM) or resin for shock prevention) to the first substrate through a nozzle 599 inserted into the damper assembly 501. It may be sprayed into the space S1 between the 250 and the second substrate 450 or the space S2 between the first substrate 250 and the shield can 460.

According to one embodiment, the damper case 510 may be rotatable along the inner surfaces of the first hole 491 and the second hole 492. The damper case 510 may have a hollow space and have a cylindrical shape. When inserted into the first hole 491 and the second hole 492 formed in a circular shape, the cylindrical damper case 510 can rotate. The outer diameter of the cylindrical damper case 510 may be substantially the same as the diameter of the first hole 491 and the diameter of the second hole 492. For example, the outer diameter of the damper case 510 in the area contacting the first hole 491 may be substantially the same as the diameter of the first hole 491. The area in contact with the second hole 492 may be substantially the same as the outer diameter of the damper case 510. The first hole 491 and the second hole 492 are formed in a circular shape with a radius greater than or equal to the radius of the damper case 510, and can guide the rotation of the damper case 510.

According to one embodiment, the damper case 510 may include a first opening 571 and a second opening 572. The first opening 571 may connect the space S1 and the internal space of the damper case 510. The first opening 571 may be aligned in the space S1 between the first substrate 250 and the second substrate 450. For example, the first opening 571 includes the first backflow prevention film 511 and the space S1 between the first substrate 250 and the second substrate 450 and the internal space of the damper case 510. The space between the second backflow prevention films 516 can be connected.

According to one embodiment, the second opening 572 may connect the space S2 and the internal space of the damper case 510. The second opening 572 may be aligned in the space S2 between the first substrate 250 and the shield can 460. For example, the second opening 572 is connected to the space S2 between the first substrate 250 and the shield can 460 and the second backflow prevention film 516 and the damper in the inner space of the damper case 510. The space between the bottom surfaces of the case 510 can be connected.

According to one embodiment, the first backflow prevention film 511 is formed so that the nozzle 599 is connected to the first backflow prevention film 511 and the damper case ( 510) may have a structure to be inserted into the space between the bottom surfaces. The second backflow prevention film 516 may have a structure in which the nozzle 599 is inserted into the space between the first backflow prevention film 511 and the second backflow prevention film 516 from the outside of the damper assembly 501.

According to one embodiment, the first backflow prevention film 511 and the second backflow prevention film 516 may be formed of an elastic material. For example, the first backflow prevention film 511 and the second backflow prevention film 516 may be formed of a polymer material, a urethane material, a rubber material, or a foam material. According to one embodiment, the first backflow prevention film 511 and the second backflow prevention film 516 formed of an elastic material may be deformed as the nozzle 599 is inserted into the damper case 510, and the nozzle ( As 599) leaves the damper case 510, it may be restored to its initial shape.

According to one embodiment, the first backflow prevention film 511 may include a first slit 512. The second backflow prevention film 516 may include a second slit 517 . The first backflow prevention film 511 may have the same or similar shape and structure as the second backflow prevention film 516. For example, the first slit 512 of the first backflow prevention film 511 may be formed substantially the same as the second slit 517 of the second backflow prevention film 516.

According to one embodiment, the first slit 512 may be deformed by the nozzle 599 while the nozzle 599 is inserted into the second backflow prevention film 516. The first slit 512 may be transformed into a first shape to surround the nozzle 599 along the side surface while the nozzle 599 is inserted into the space S2. The first slit 512 may include at least one slit penetrating the first backflow prevention film 511 . For example, the first slit 512 may penetrate from one side of the first backflow prevention film 511 to the other side. By the nozzle 599 inserted through a slit formed in one direction in the first backflow prevention film 511 made of an elastic material, the shape of the slit may be transformed into an oval shape. According to one embodiment, the first slit 512 may include a plurality of slits. The first slit 512 may include a slit extending in a first direction and a slit extending in a second direction perpendicular to the first direction to increase ease of deformation upon insertion of the nozzle 599. . As the nozzle 599 is inserted, the plurality of slits may change into a first shape corresponding to the side surface of the nozzle 599.

According to one embodiment, the first slit 512 changes from the first shape to the second shape, which is the initial shape of the first slit, when the nozzle 599 is separated from the first backflow prevention film 511. It can be restored.

According to one embodiment, the second backflow prevention film 516 may include a second slit 517 into which the nozzle 599 can be inserted. The second slit 517 may be transformed into a third shape corresponding to the first shape to wrap along the side of the nozzle 599 while the nozzle 599 is inserted into the second slit 517. . The first slit 512 and the second slit 517 may have the same shape. For example, when the second backflow prevention film 516 including the second slit 517 is viewed from above, the second slit 517 may overlap the first slit 512. When the second backflow prevention film 516 including the second slit 517 is viewed from above, the edge of the second slit 517 may be the same as the edge of the first slit 512. When the nozzle 599 is separated from the second backflow prevention film 516 and the damper assembly 501, the second slit 517 will be restored from the third shape to the fourth shape, which is the original shape of the second slit. You can. The second slit 517, like the first slit 512, may include slits extending in two directions perpendicular to each other.

According to one embodiment, the nozzle 599 surrounds the first electronic component (e.g., the first electronic component 401 of FIG. 4) and is disposed in the space between the first substrate 250 and the shield can 460. The first heat transfer material may be provided by the nozzle 599 penetrating the second slit 517 and the first slit 512 and the space between the first backflow prevention film 511 and the bottom surface of the damper case 510. The first heat transfer material may be transferred through the nozzle 599 from the space between the first backflow prevention film 511 and the bottom surface of the damper case 510 through the second opening 572. It can be transmitted to space (S2) through .

The nozzle 599 surrounds the second electronic component (e.g., the second electronic component 402 in FIG. 4) and is a second heat transfer material disposed in the space between the first substrate 250 and the second substrate 450. can be provided. The nozzle 599 may pass through the second slit 517 and deliver the second heat transfer material to the space between the first backflow prevention film 511 and the second backflow prevention film 516. The second heat transfer material delivered through the nozzle 599 will be transferred from the space between the first backflow prevention film 511 and the second backflow prevention film 516 to the space S1 through the first opening 571. You can.

The first heat transfer material and the second heat transfer material may be the same heat transfer material. For example, the nozzle 599 may transfer the heat transfer material to the space S2 through the second opening 572 and then transfer the heat transfer material to the space S1 through the first opening 571.

According to one embodiment, the material transferred to the space S1 and S2 through the nozzle 599 is described as a heat transfer material, but the material is not limited thereto. For example, the nozzle 599 may deliver an impact prevention material to the space S1 and space S2. For example, the impact-resistant material may be foam or resin.

According to one embodiment, the liquid material flowing from the nozzle 599 inserted into the second backflow prevention film 516 passes through the first opening 571 from the inner space of the damper case 510 to the first substrate 250. ) and the second substrate 450 may flow into the space. The liquid material flowing from the nozzle 599 inserted into the first backflow prevention film 511 flows from the inner space of the damper case 510 through the second opening 572 to the first substrate 250 and the shield can 460. It can flow into the space between (S2).

According to one embodiment, the first heat transfer material transferred to the space S2 through the nozzle 599 is spread along one side of the first substrate 250 from the first hole 491 toward the shield can. You can. The first heat transfer material may surround a first electronic component (eg, the first electronic component 401 of FIG. 4) disposed on one surface of the first substrate 250. The second heat transfer material may be spread along one side of the second substrate 450 from the second hole 492 toward the first substrate 250. The second heat transfer material may surround a second electronic component (eg, the second electronic component 402 of FIG. 4) disposed on one surface of the second substrate 450.

According to one embodiment, the second substrate 450 may include a conductive pad 580 disposed on the other side opposite to one side. The conductive pad 580 may be disposed between the second substrate 450 and the holder 530. The conductive pad 580 may be bonded to the holder 530. For example, the holder 530 may be soldered to the conductive pad 580. The holder 530 may be bonded to the conductive pad 580 using a surface mounted device (SMD) process.

According to one embodiment, the damper case 510 may be rotatably coupled to the holder 530. The holder 530 may guide the rotation of the damper case 510. According to one embodiment, the damper case 510 may further include a flange 513 inserted into the holder 530. The flange 513 may extend from the second backflow prevention film 516 toward the holder 530 . The flange 513 may protrude from the side of the damper case 510 in a direction perpendicular to the side.

According to one embodiment, the holder 530 may accommodate the flange 513 and further include a guide groove 531 that guides the rotation of the damper case 510. The guide groove 531 may have a shape corresponding to the shape of the flange 513.

According to one embodiment, the damper assembly 501 may further include a handle 550 that protrudes parallel to the second substrate 450 from the second backflow prevention film 516 of the damper case 510. The handle 550 can rotate within a specified range (m). For example, the handle 550 may be attached to the edge of the second backflow prevention film 516 and rotate based on the center of the second backflow prevention film 516. According to one embodiment, the damper case 510 may rotate along the inner surfaces of the first hole 491 and the second hole 492 through the handle 550. The handle 550 may be removed after transferring the liquid to the first substrate 250 and the second substrate 450 through the nozzle 599.

According to one embodiment, the damper assembly 501 rotating through the handle 550 can evenly apply a heat transfer material or liquid to the first substrate 250 or the second substrate 450.

According to one embodiment, the handle 550 is shown as a rectangular shape, but the present invention is not limited thereto. The handle 550 may be circular, or may have a shape whose width becomes wider as it moves away from the second backflow prevention film 516 . In order to increase the ease of separation of the handle 550, the width of the connection portion between the handle 550 and the second backflow prevention film 516 may be made thin.

According to one embodiment, the position and shape of the handle 550 can be formed in various ways as long as it can provide rotation of the damper case 510.

Referring again to FIG. 4, the damper assembly 501 inserted into the first hole 491 and the second hole 492 is applied to the handle 550 after applying the liquid or heat transfer material in the first direction d1. Through this, the first opening 471 or the second opening 472 may be rotated to face a direction different from the first direction d1. The rotated damper assembly 501 may apply a liquid or heat transfer material in a direction different from the first direction d1. For example, the damper assembly 501 rotated clockwise from the first direction d1 may apply a liquid or heat transfer material to the left area of the area P2 in FIG. 4 . The damper assembly 501 rotated counterclockwise from the first direction d1 may apply a liquid or heat transfer material to the right area of the area P2 in FIG. 4 .

Referring again to FIG. 5A, the holder 530 may further include stoppers 531 and 532 that limit the movement range of the handle 550. The holder 530 may include a space 539 in which a portion of the holder 530 is removed within the range (m) in which the handle moves. The holder 530 may include stoppers 531 and 532 disposed at the boundary of the space 539. The stoppers 531 and 532 may be aligned on one of the radial lines with the center of the second backflow prevention film 516. The stoppers 531 and 532 may be arranged in a radial direction from the center of the second backflow prevention film 516 for movement of the handle. The stoppers 531 and 532 limit the movement range of the handle 550 and may have side walls formed to contact the handle 550.

According to one embodiment, the first hole 491 may be disposed in an area including one edge of the first substrate 250. The second hole 492 may be disposed in an area including one edge of the second substrate 450 aligned with the one edge of the first substrate 250. However, it is not limited to this, and the first hole 491 is formed according to the arrangement of the first electronic components 410, the second electronic components 402, and the first substrate 250 and the conductive lines on the second substrate 450. ) and the location of the second hole 492 may be changed. According to one embodiment, the case 510 may have a cylindrical shape. The first hole 491 and the second hole 492 may be formed in a circular shape with a radius greater than or equal to the radius of the damper case 510. The printed circuit board assembly 400 including the first hole 491 and the second hole 492 formed in a circular shape can guide the rotation of the damper case 510.

According to one embodiment, the first hole 491 disposed in an area including one edge of the first substrate 250 is the handle 550 of the damper assembly 501 inserted into the first hole 491. ) can facilitate the movement of. The handle 550 disposed at one edge of the first substrate 250 can be easily removed after transferring the liquid material or heat transfer material to the space S1 or S2 through the nozzle.

6 is a perspective view of an exemplary damper assembly for injecting liquid into a space between printed circuit boards, according to one embodiment.

Referring to FIG. 6 , the printed circuit board assembly 400 may include a first substrate 250, a second substrate 450, and a damper assembly 501. The damper assembly 501 may include a damper case 510, a backflow prevention film 616, and a holder 530. The damper assembly 501 may provide a liquid or flowable material for the electronic components 401 disposed between the first substrate 250 and the second substrate 450. For example, the damper assembly 501 supplies liquid (e.g., thermal interface material (TIM) or resin for shock prevention) to the first substrate through a nozzle 599 inserted into the damper assembly 501. It may be sprayed into the space (S1) between (250) and the second substrate (450).

According to one embodiment, the damper case 510 may be rotatable along the inner surface of the second hole 492 formed in the second substrate 450. The damper case 510 may be inserted into the second hole 492 and placed in the space S1 between the first substrate 250 and the second substrate 450. Damper case 510 may include an opening 671. The opening 671 may be aligned in the space S1 between the first substrate 250 and the second substrate 450. The opening 671 may be formed on the side of the damper case 510 between the backflow prevention film 616 and the bottom surface 611. The bottom surface 611 may be formed to connect the opening 671 to the space S1 between the first substrate 250 and the second substrate 450. The bottom surface 611 may be disposed on the first substrate 250 . The bottom surface 611 may be in contact with the first substrate 250 or may be spaced apart from the first substrate 250 . For another example, the first substrate 250 may have a structure such as a groove or an opening corresponding to the damper case 510, and a part of the damper case 510 may be inserted into the structure.

According to one embodiment, the backflow prevention film 616 may include a slit 617. The slit 617 may be deformed by the nozzle 599 while the nozzle 599 is inserted into the backflow prevention film 616. The slit 617 may be modified to surround the side of the nozzle 599 while the nozzle 599 is inserted into the damper case 510 . The slit 617 may have the same or similar configuration as the first slit 512 and the second slit 517 in FIG. 5A or 5B. For example, the slit 617 may be restored to its original form when the nozzle 599 is separated from the backflow prevention film 6160.

According to one embodiment, the nozzle 599 surrounds the second electronic component (e.g., the second electronic component 402 in FIG. 4) and forms a space between the first substrate 250 and the second substrate 450 ( It is possible to provide a liquid disposed in S1).

According to one embodiment, the second substrate 450 may include a conductive pad 580 disposed on the other side opposite to one side. The conductive pad 580 may be disposed between the second substrate 450 and the holder 530. The conductive pad 580 may be bonded to the holder 530. For example, the holder 530 may be soldered to the conductive pad 580. The holder 530 may be bonded to the conductive pad 580 using a surface mounted device (SMD) process.

According to one embodiment, the damper case 510 may be rotatably coupled to the holder 530. The holder 530 may guide the rotation of the damper case 510. According to one embodiment, the damper case 510 may further include a flange 513 inserted into the holder 530. The flange 513 may extend from the second backflow prevention film 516 toward the holder 530 . The flange 513 may protrude from the side of the damper case 510 in a direction perpendicular to the side.

According to one embodiment, the holder 530 may accommodate the flange 513 and further include a guide groove 531 that guides the rotation of the damper case 510. The guide groove 531 may have a shape corresponding to the shape of the flange 513.

Figure 7 is a cross-sectional view showing an exemplary modification of the damper case of the damper assembly, according to one embodiment.

Referring to FIG. 7 , the printed circuit board assembly 400 may include a damper assembly 701, a first printed circuit board 250, a second printed circuit board 450, and a shield can 460. Damper assembly 501 may include a damper case 710. The damper case 710 may include a backflow prevention film 716 and an induction film 711. The damper case 710 may be rotatably coupled to the holder 530. The holder 530 may be bonded to the pad 580 of the second substrate 450 while rotatably supporting the damper case 710 . According to one embodiment, the backflow prevention film 716 may form one side of the damper case 710. The backflow prevention film 716 may include a slit 717 . The slit 717 may surround the outer surface of the nozzle 599 when the nozzle 599 is inserted through the slit 717.

According to one embodiment, the nozzle 599 may be disposed in the space between the backflow prevention film 716 and the induction film 711 through the slit 717 of the backflow prevention film 716. The nozzle 599 disposed in the space between the backflow prevention film 716 and the induction film 711 can spray the liquid and deliver the liquid to the space S1 and S2 at the same time. The liquid sprayed through the nozzle 599 may be delivered to the space between the induction film 711 and the backflow prevention film 716. A portion of the liquid phase flows from the space between the induction film 711 and the backflow prevention film 716 through the first opening 571 to the space between the first printed circuit board 250 and the second printed circuit board 450. It can be passed to (S1). The remaining part of the liquid phase will be transferred to the space between the induction film 711 and the bottom surface of the damping case 710 through the gap 720 between the induction film 711 and the side 719 of the damping case 710. You can. The remaining part of the liquid phase flows from the space between the induction film 711 and the bottom surface of the damping case 710, through the second opening 572, between the first printed circuit board 250 and the shield can 460. It can be transmitted through space.

According to one embodiment, the induction film 711 may be aligned in parallel with the first printed circuit board 250 in order to transfer the liquid to the first opening 571. The side surface 719 may be formed to be inclined from a direction perpendicular to one side of the backflow prevention film 716 . The inclined side surface 719 can increase the amount of liquid transferred from the nozzle 599 to the space between the induction film 711 and the bottom surface of the damper case 710. The damper case may become narrower as it moves away from the second substrate 450 due to the inclined side surface 719 .

8 is a cross-sectional view of an exemplary damper case including an energizing structure, according to one embodiment.

Referring to FIG. 8 , the printed circuit board assembly 400 may be substantially the same as the printed circuit board assembly of FIG. 6 . Configurations that are the same or similar to the printed circuit board assembly of FIG. 6 are omitted.

According to one embodiment, the printed circuit board assembly 400 may include a damper assembly 501. The damper assembly 501 may include a conductive member 801 therein. The conductive member 801 may be disposed on the side and bottom surfaces of the first backflow prevention film 511, the second backflow prevention film 516, and the damper case 510. The conductive member 801 may be electrically connected to the first substrate 250 and the second substrate 450. For example, the conductive member 801 may be electrically connected to the ground portion 891 of the first substrate 250. According to one embodiment, the conductive member 801 may be exposed toward the side of the first substrate 250 . The conductive member 801 exposed toward the side of the first substrate 250 may be in contact with the ground portion 891 of the first substrate 250. For example, the ground portion 891 may be exposed to the side of the first substrate 250 and connected to the conductive member 801 exposed toward the side.

According to one embodiment, the conductive member 801 may be electrically connected to the ground portion 892 of the second substrate 450. The conductive member 801 may contact the conductive portion 830 exposed to the guide groove (eg, guide groove 531 in FIG. 6) of the damper assembly 501. The conductive portion 830 may be in contact with the ground portion 892. For example, the conductive portion 830 may be disposed between the ground portion 892 and the conductive member 801.

According to one embodiment, the damper case 510 is electrically connected to the ground portions 891 and 892 to expand the ground portions. The damper case 510 used as a ground portion can shield noise.

9 is a cross-sectional view of an example damper structure inserted into a plurality of printed circuit boards, according to one embodiment.

Referring to FIG. 9 , the damper assembly 501 may penetrate the first printed circuit board 250 and the second printed circuit board 450 . The first printed circuit board 250 may include a first hole 491 through which the damper assembly 501 passes. The second printed circuit board 450 may include a second hole 492 through which the damper assembly 501 passes.

According to one embodiment, the bottom surface 910a of the damper assembly 501 may contact the groove-shaped structure 911 formed on the third printed circuit board 910. For example, structure 911 can be a groove that can receive a portion of damper assembly 501. The structure 911 is not limited to a groove shape and may be formed as a through hole.

According to one embodiment, the bottom surface 910b of the damper assembly 501 may be configured to be disposed on the third printed circuit board 910. According to one embodiment, the bottom surface 910c of the damper assembly 501 may be formed to penetrate the hole-shaped structure 911 formed in the third printed circuit board 910.

According to one embodiment, the first opening 571 of the damper assembly 501 may be connected to the space S1, and the second opening 572 of the damper assembly 501 may be connected to the space S2. As long as the damper assembly 501 can maintain the positions of the first opening 571 and the second opening 572, the position of the bottom surface of the damper assembly 501 can be formed in various ways.

Above, we have looked at the structure of the damper assembly 501 and the printed circuit board assembly 400 including the damper assembly 501. Hereinafter, the operation of applying a liquid or heat transfer material to the printed circuit board assembly 400 will be described.

According to one embodiment, the nozzle (e.g., nozzle 599 in FIG. 6) connects the first backflow prevention film (e.g., first backflow prevention film 511 in FIG. 6) and the second backflow through the first slit 517. It can be inserted into the space between the prevention films (e.g., the second backflow prevention film 516 in FIG. 6). For example, the nozzle 599 may be part of a liquid injection device. According to one embodiment, the liquid injection device may include a liquid storage unit, a nozzle 599, a liquid supply passage, and a control circuit. The liquid storage unit may store liquid (eg, heat transfer material or liquid resin) to be supplied to the electronic device 200 through the nozzle 599. The liquid supply passage can deliver the liquid from the liquid storage unit to the nozzle 599. The control circuit may be configured to control the injection time of the liquid and the injection speed of the liquid.

According to one embodiment, the nozzle 599 applies liquid resin or heat transfer material based on a value specified for each model of the electronic device (e.g., the electronic device 101 in FIG. 1 or the electronic device 200 in FIG. 2). It can be injected. The control circuit can supply liquid resin and heat transfer material at a specified speed and time based on the values specified for each model. Liquid may be supplied to the space S1 between the first printed circuit board 250 and the second printed circuit board 450 through the nozzle 599.

According to one embodiment, the control circuit may rotate the handle to supply liquid toward the space S1 between the first substrate 250 and the second substrate 450 in various directions. The movement range of the handle may be approximately 0 degrees to 150 degrees. The control circuit can adjust the liquid supply speed and liquid supply time based on the setting value according to the direction. Based on the above-described operation, the liquid supplied to the space S1 between the first substrate 250 and the second substrate 450 is connected to the second electronic component disposed on the second substrate 450 (e.g., in FIG. 4). It can surround the second electronic component 402).

According to one embodiment, after the injection of liquid into the space S1 is completed, the control circuit controls the space S2 between the first substrate 250 and the bottom surface of the damper case (e.g., the damper case 510 in FIG. 5). ), the above-described operation can be repeated.

The liquid supplied to the space S2 may surround the first electronic component (eg, the first electronic component 401 in FIG. 4) disposed on the first substrate 250.

According to one embodiment, after the injection of liquid into the space S1 and S2 is completed, the nozzle 599 may be separated from the damper assembly 501. The handle 550 attached to the damper assembly 501 may be removed.

In the above description, the liquid is first injected into the space S1, but the method is not limited thereto. For example, the liquid may be first injected into the space S2 and then supplied to the space S1.

The printed circuit board assembly 400 including the damper assembly 501 according to the above-described embodiment can apply liquid to electronic components disposed on a plurality of printed circuit boards. Based on the rotation of the damper case 510 of the damper assembly 501, the liquid can be uniformly applied to the area where the first electronic components 401 disposed on the first substrate 250 are disposed, and the second electronic components 401 are disposed on the first substrate 250. The liquid may be uniformly applied to the area where the second electronic components 402 disposed on the substrate 450 are disposed.

According to the above-described embodiment, an electronic device (e.g., the electronic device 300 in FIG. 3) includes a first substrate (e.g., the first hole 491 in FIG. 4) including a first hole (e.g., the first hole 491 in FIG. 4). It may include a first substrate 250). The electronic device includes a second substrate (e.g., the second hole 492 in FIG. 4) that is spaced apart from the first substrate and includes a second hole (e.g., the second hole 492 in FIG. 4) aligned with the first hole. It may further include a substrate 450). The electronic device may further include a shield can (eg, shield can 460 in FIG. 4) attached to the other side opposite to one side of the first substrate facing the second substrate. The electronic device may further include an interposer (e.g., interposer 420 in FIG. 4) interposed between the first substrate and the second substrate and connecting the first substrate and the second substrate. there is. The electronic device may include a damper assembly (eg, damper assembly 501 in FIG. 5) penetrating the first hole and the second hole. The damper assembly 501 may include a damper case (eg, damper case 510 in FIG. 5) that can be rotated along the inner surfaces of the first hole and the second hole. The damper assembly may further include a first opening (eg, first opening 571 in FIG. 5) connecting the space between the first substrate and the second substrate and the interior of the damper case. The damper assembly may further include a second opening (eg, the second opening 572 in FIG. 5) connecting the space between the first substrate and the shield can with the interior of the damper case. The damper assembly may further include a first backflow prevention film (eg, the first backflow prevention film 511 in FIG. 6) aligned on the first substrate. The damper assembly may include a second backflow prevention film (eg, the second backflow prevention film 516 in FIG. 6) aligned on the second substrate.

According to the above-described embodiment, the electronic device may supply a liquid material or a heat transfer material to an internal space where a plurality of printed circuit boards are stacked through a damper structure. The electronic device can uniformly apply a liquid material or a heat cutting material applied on a printed circuit board through a rotatable damper casting.

According to one embodiment, the damper case has a cylindrical shape, the first hole and the second hole are formed in a circular shape with a radius greater than or equal to the radius of the damper case, and rotate the damper case. I can guide you.

According to one embodiment, the first backflow prevention film and the second backflow prevention film may have a structure for inserting a nozzle from the outside. The first backflow prevention film and the second backflow prevention film may be formed of an elastic material.

According to one embodiment, the first backflow prevention film may include a first slit into which the nozzle can be inserted while the nozzle is inserted into the second backflow prevention film. According to one embodiment, the first slit may be deformed into a first shape to surround the side of the nozzle while the nozzle is inserted. When the nozzle is separated from the first backflow prevention film, it can be restored from the first shape to the second shape, which is the original shape of the first slit.

The printed circuit board assembly according to the above-described embodiment includes a first backflow prevention film and a second backflow prevention film, thereby preventing the liquid or heat transfer material supplied under the second backflow prevention film from flowing back. The first backflow prevention film and the second backflow prevention film can control the supply of liquid or heat transfer material to spaces within the printed circuit board assembly, respectively, by providing a structure into which a nozzle can be inserted.

According to one embodiment, the second backflow prevention film may include a second slit into which the nozzle can be inserted. According to one embodiment, the second slit may be transformed into a third shape corresponding to the first shape to surround the nozzle along a side surface while the nozzle is inserted into the second slit. When the nozzle is separated from the second backflow prevention film, it can be restored from the third shape to the fourth shape, which is the original shape of the second slit.

According to one embodiment, a first electronic component disposed on the first substrate facing the shield can, a second electronic component disposed on one surface of the second substrate facing the first substrate, and the first electronic component. A first heat transfer material that surrounds the first substrate and the shield can and is disposed in the space between the first substrate and the shield can, and a second heat transfer material that surrounds the second electronic component and is disposed in the space between the first substrate and the second substrate. More may be included.

According to the above-described embodiment, the electronic device can surround electronic components on a printed circuit board by supplying a heat transfer material through a damper structure. By discharging heat from electronic components, the lifespan of the electronic device can be extended by improving the heat dissipation performance of the electronic device.

According to one embodiment, the first heat transfer material may be spread along one side of the first substrate from the first hole toward the shield can. The second heat transfer material may be spread along one side of the second substrate from the second hole toward the first substrate.

According to the above-described embodiment, the heating performance of the electronic device can be improved through the heat transfer material spread evenly on the first and second substrates.

According to one embodiment, the second substrate may include a conductive pad disposed on another side opposite to the one side. The damper assembly may include a holder bonded to the conductive pad and coupled to guide rotation of the damper case.

According to one embodiment, the damper case may further include a flange inserted into the holder. According to one embodiment, the holder may further include a guide groove that accommodates the flange and guides rotation of the damper case.

According to the above-described embodiment, the electronic device may configure the damper assembly to be rotatable. An electronic device including a rotatable damper assembly can evenly apply liquid and heat transfer material onto a substrate. Evenly applied heat transfer materials can stably reduce heat generation in electronic components of electronic devices.

According to one embodiment, the damper assembly includes a holder disposed on the second substrate and coupled to guide rotation of the damper case, from the second backflow prevention film of the damper case, parallel to the second substrate. It may further include a protruding handle. According to one embodiment, the damper case may rotate along the inner surfaces of the first hole and the second hole through the handle.

According to the above-described embodiment, the electronic device may further include a handle for rotating the damper case. The handle may provide ease of rotation of the damper case. Electronic devices can evenly apply liquid and heat transfer materials on a substrate. Evenly applied heat transfer materials can stably reduce heat generation in electronic components of electronic devices.

According to one embodiment, the holder may include a stopper that limits the movement range of the handle and has a side wall formed to contact the handle.

According to the above-described embodiment, the electronic device may limit the rotation range of the damper case based on the stopper. The damper case may rotate within the rotation range, and within the rotation range, a heat transfer material or liquid may be applied to the substrate.

According to one embodiment, the liquid material flowing from the nozzle inserted into the second backflow prevention film flows from the inner space of the damper case through the first opening to the space between the first substrate and the second substrate, and Liquid material flowing from a nozzle inserted into the first backflow prevention film may flow from the inner space of the damper case to the space between the first substrate and the shield can through the second opening.

According to one embodiment, the damper case includes a first surface forming the second backflow prevention film and a second surface opposite to the first surface, and the first opening is formed between the first surface and the first surface. It is disposed between the backflow prevention membrane, and the second opening may be disposed between the second surface and the first backflow prevention membrane.

According to one embodiment, the first hole may be disposed in an area including one edge of the first substrate. The second hole may be disposed in an area including one edge of the second substrate aligned with the one edge of the first substrate.

According to one embodiment, the damper case may include a conductive material. The damper case may be electrically connected to a ground portion of the first substrate.

According to one embodiment, the damper case may become narrower as it moves away from the second substrate.

According to the above-described embodiment, an electronic device (e.g., electronic device 300 in FIG. 3) includes a first electronic component (e.g., first electronic component 401 in FIG. 4) and a first hole disposed on one side. It may include a first substrate (e.g., the first substrate 250 of FIG. 4) including a first hole 491 of FIG. 4. The electronic device includes a second electronic component (e.g., the second electronic component 402 in FIG. 4) disposed on one side facing the first substrate, and a second substrate (e.g., the second electronic component 402 in FIG. 4) spaced apart from the first substrate. For example, it may include the second substrate 450 of FIG. 4). The electronic device includes a viscous material (e.g., a heat transfer material) that spreads along one side of the first printed circuit board from a position corresponding to the first hole and covers the first electronic component, and the first It may include an interposer (eg, interposer 420 in FIG. 4) disposed between the first substrate and the second substrate. The electronic device may include a damper assembly (eg, damper assembly 501 in FIG. 5) penetrating the second hole. The damper assembly includes a damper case (e.g., damper case 510 in FIG. 5) rotatable along the inner surface of the second hole, connecting the space between the first substrate and the second substrate and the interior of the damper case. , may include a first opening (e.g., first opening 571 in FIG. 5) and a first backflow prevention film (e.g., first backflow prevention film 511 in FIG. 5) disposed on the second substrate. .

According to the above-described embodiment, the electronic device may supply a liquid material or a heat transfer material to an internal space where a plurality of printed circuit boards are stacked through a damper structure. The electronic device can uniformly apply a liquid material or a heat cutting material applied on a printed circuit board through a rotatable damper casting.

According to one embodiment, the damper case may have a cylindrical shape. According to one embodiment, the first hole is formed in a circular shape with a radius smaller than or equal to the radius of the cylinder, and may guide rotation of the damper case.

According to one embodiment, the second substrate may include a conductive pad disposed on another side opposite to the one side. According to one embodiment, the damper assembly may include a holder bonded to the conductive pad and coupled to guide rotation of the damper case.

According to one embodiment, the damper case may further include a flange inserted into the holder. The holder may further include a guide groove that accommodates the flange and guides rotation of the damper case.

According to one embodiment, the damper assembly includes a holder disposed on the second substrate and coupled to guide rotation of the damper case, and a holder arranged in parallel with the second substrate from the second backflow prevention film of the damper case. It may further include a protruding handle.

According to the above-described embodiment, the electronic device may configure the damper assembly to be rotatable. An electronic device including a rotatable damper assembly can evenly apply liquid and heat transfer material onto a substrate. Evenly applied heat transfer materials can stably reduce heat generation in electronic components of electronic devices.

The damper case rotates along the inner surfaces of the first hole and the second hole through the handle, and the holder is formed by removing at least a portion of the holder from a side of the holder to the inside of the handle. It may include a stopper having a space for guiding movement and a wall structure that limits the range of movement of the handle and is formed to be in contact with the handle.

According to the above-described embodiment, the electronic device may limit the rotation range of the damper case based on the stopper. The damper case may rotate within the rotation range, and within the rotation range, a heat transfer material or liquid may be applied to the substrate.

Electronic devices according to various embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one component from another, and to refer to those components in other respects (e.g., importance or order) is not limited. One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.” Where mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. It can be used as A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document are one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these. For example, a processor (e.g., processor 120) of a device (e.g., electronic device 101) may call at least one command among one or more commands stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves). This term refers to cases where data is stored semi-permanently in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments disclosed in this document may be provided and included in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play Store™) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to various embodiments, each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. there is. According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, or omitted. Alternatively, one or more other operations may be added.

Claims (21)

In the electronic device (101; 300),
A first substrate 250 including a first hole 491;
a second substrate 450 spaced apart from the first substrate 250 and including a second hole 492 aligned with the first hole 491;
a shield can 460 attached to one side of the first substrate 250 facing the second substrate 450 and the other side opposite to the second substrate 450;
An interposer 420 interposed between the first substrate 250 and the second substrate 450 and connecting the first substrate 250 and the second substrate 450; and
A damper assembly 501 passing through the first hole 491 and the second hole 492; Including,
The damper assembly 501 is,
A damper case 510 rotatable along inner surfaces of the first hole 491 and the second hole 492;
a first opening 571 connecting the space between the first substrate 250 and the second substrate 450 and the interior of the damper case 510;
a second opening 572 connecting the space between the first substrate 250 and the shield can 460 and the inside of the damper case 510;
a first backflow prevention layer 511 aligned on the first substrate 250; and
a second backflow prevention layer 516 aligned on the second substrate 450; Including,
Electronic devices (101; 300).
According to paragraph 1,
The damper case 510 is,
Having a cylindrical shape,
The first hole 491 and the second hole 492 are,
It is formed in a circle with a radius greater than or equal to the radius of the damper case 510, and guides the rotation of the damper case 510.
Electronic devices (101; 300).
According to claim 1 or 2,
The first backflow prevention film 511 and the second backflow prevention film 516 are,
The nozzle 599 has a structure for being inserted from the outside,
Formed from an elastic material,
Electronic devices (101; 300).
According to any one of claims 1 to 3,
The first backflow prevention film 511 is,
While the nozzle 599 is inserted into the second backflow prevention film 516, the nozzle 599 includes a first slit 512 into which the nozzle 599 can be inserted,
The first slit 512 is,
While the nozzle 599 is inserted, it is deformed into a first shape to wrap along the side of the nozzle 599,
When the nozzle 599 is separated from the first backflow prevention film 511,
Restoring from the first shape to the second shape, which is the original shape of the first slit 512,
Electronic devices (101; 300).
According to any one of claims 1 to 4,
The second backflow prevention film 516 is,
The nozzle 599 includes a second slit 517 into which the nozzle 599 can be inserted,
The second slit 517 is,
While the nozzle 599 is inserted into the second slit 517, it is transformed into a third shape corresponding to the first shape to wrap along the side of the nozzle 599,
When the nozzle 599 is separated from the second backflow prevention film 516,
Restoring from the third shape to the fourth shape, which is the original shape of the second slit 517,
Electronic devices (101; 300).
According to any one of claims 1 to 5,
a first electronic component disposed on the first substrate 250 facing the shield can 460;
a second electronic component disposed on one side of the second substrate 450 facing the first substrate 250;
a first heat transfer material surrounding the first electronic component and disposed in the space between the first substrate 250 and the shield can 460; and
a second heat transfer material surrounding the second electronic component and disposed in the space between the first substrate 250 and the second substrate 450; Containing more,
Electronic devices (101; 300).
According to any one of claims 1 to 6,
The first heat transfer material is,
Spread along one side of the first substrate 250 from the first hole 491 toward the shield can 460,
The second heat transfer material is,
Spread along one side of the second substrate 450 from the second hole 492 toward the first substrate 250,
Electronic devices (101; 300).
According to any one of claims 1 to 7,
The second substrate 450 is,
It includes a conductive pad 580 disposed on the other side opposite to the one side,
The damper assembly 501 is
A holder 530 is bonded to the conductive pad 580 and coupled to guide the rotation of the damper case 510.
Electronic devices (101; 300).
According to any one of claims 1 to 8,
The damper case 510 is,
It further includes a flange 513 inserted into the holder 530,
The holder 530 is,
Further comprising a guide groove 531 that accommodates the flange 513 and guides the rotation of the damper case 510.
Electronic devices (101; 300).
According to any one of claims 1 to 9,
The damper assembly 501 is,
a holder 530 disposed on the second substrate 450 and coupled to guide rotation of the damper case 510; and
a handle 550 protruding parallel to the second substrate 450 from the second backflow prevention film 516 of the damper case 510; It further includes,
The damper case 510 is,
Rotating along the inner surfaces of the first hole 491 and the second hole 492 through the handle 550,
Electronic devices (101; 300).
According to any one of claims 1 to 10,
The holder 530 is,
Comprising a stopper (531; 532) that limits the range of movement of the handle (550) and has a side wall formed to contact the handle (550),
Electronic devices (101; 300).
According to any one of claims 1 to 11,
The liquid material flowing from the nozzle 599 inserted into the second backflow prevention film 516 is,
flows from the internal space of the damper case 510 to the space between the first substrate 250 and the second substrate 450 through the first opening 571,
The liquid material flowing from the nozzle 599 inserted into the first backflow prevention film 511 is,
flowing from the internal space of the damper case 510 to the space between the first substrate 250 and the shield can 460 through the second opening 572,
Electronic devices (101; 300).
According to any one of claims 1 to 12,
The damper case 510 is,
It includes a first surface forming the second backflow prevention film 516 and a second surface opposite to the first surface,
The first opening 571 is,
disposed between the first surface and the first backflow prevention film 511,
The second opening 572 is,
Disposed between the second surface and the first backflow prevention film 511,
Electronic devices (101; 300).
According to any one of claims 1 to 13,
The first hole 491 is,
disposed in an area including one edge of the first substrate 250,
The second hole 492 is,
disposed in an area including one edge of the second substrate 450 aligned with the one edge of the first substrate 250,
Electronic devices (101; 300).
According to any one of claims 1 to 14,
The damper case 510 is
Contains a conductive material,
Electrically connected to the ground portion of the first substrate 250,
Electronic devices (101; 300).
According to any one of claims 1 to 15,
The damper case 510 is,
becomes narrower as it moves away from the second substrate 450,
Electronic devices (101; 300).
In the electronic device (101; 300),
A first substrate 250 including first electronic components and a first hole 491 disposed on one side;
a second substrate 450 including second electronic components disposed on one side facing the first substrate 250 and spaced apart from the first substrate 250;
a viscous material that spreads along one side of the first substrate 250 from a position corresponding to the first hole 491 and covers the first electronic component;
an interposer 420 disposed between the first substrate 250 and the second substrate 450; and
A damper assembly 501 penetrating the first hole 491; Including,
The damper assembly 501 is,
A damper case 510 rotatable along the inner surface of the first hole 491;
a first opening 571 connecting the space between the first substrate 250 and the second substrate 450 and the interior of the damper case 510; and
a first backflow prevention layer 511 disposed on the second substrate 450; Including,
Electronic devices (101; 300).
According to clause 17,
The damper case 510 is,
Having a cylindrical shape,
The first hole 491 is,
It is formed in a circle with a radius smaller than or equal to the radius of the cylinder, and guides the rotation of the damper case 510,
Electronic devices (101; 300).
According to claim 17 or 18,
The second substrate 450 is,
It includes a conductive pad 580 disposed on the other side opposite to the one side,
The damper assembly 501 is
A holder 530 is bonded to the conductive pad 580 and coupled to guide rotation of the damper case 510.
Electronic devices (101; 300).
According to any one of claims 17 to 19,
The damper case 510 is,
It further includes a flange 513 inserted into the holder 530,
The holder 530 is,
Further comprising a guide groove 531 that accommodates the flange 513 and guides the rotation of the damper case 510.
Electronic devices (101; 300).
According to any one of claims 17 to 20,
The damper assembly 501 is,
a holder 530 disposed on the second substrate 450 and coupled to guide rotation of the damper case 510; and
a handle 550 protruding parallel to the second substrate 450 from the second backflow prevention film 516 of the damper case 510; It further includes,
The damper case 510 is,
Rotates along the inner surface of the first hole 491 through the handle 550,
The holder 530 is,
From the side of the holder 530, at least a portion of the holder 530 is removed to form an interior space that guides the movement of the handle 550 and limits the range of movement of the handle 550 and the handle ( Comprising a stopper (531; 532) having a wall structure formed to be in contact with 550,
Electronic devices (101; 300).

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