KR20240047335A - 병렬 산란계 오버레이 계측 - Google Patents

병렬 산란계 오버레이 계측 Download PDF

Info

Publication number
KR20240047335A
KR20240047335A KR1020237042491A KR20237042491A KR20240047335A KR 20240047335 A KR20240047335 A KR 20240047335A KR 1020237042491 A KR1020237042491 A KR 1020237042491A KR 20237042491 A KR20237042491 A KR 20237042491A KR 20240047335 A KR20240047335 A KR 20240047335A
Authority
KR
South Korea
Prior art keywords
illumination
cell
beam distribution
illumination beam
channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237042491A
Other languages
English (en)
Korean (ko)
Inventor
앤드류 브이 힐
암논 마나쎈
드미트리 고렐릭
Original Assignee
케이엘에이 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 케이엘에이 코포레이션 filed Critical 케이엘에이 코포레이션
Publication of KR20240047335A publication Critical patent/KR20240047335A/ko
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020237042491A 2021-08-25 2022-08-19 병렬 산란계 오버레이 계측 Pending KR20240047335A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/411,539 2021-08-25
US17/411,539 US11531275B1 (en) 2021-08-25 2021-08-25 Parallel scatterometry overlay metrology
PCT/US2022/040824 WO2023027947A1 (en) 2021-08-25 2022-08-19 Parallel scatterometry overlay metrology

Publications (1)

Publication Number Publication Date
KR20240047335A true KR20240047335A (ko) 2024-04-12

Family

ID=84492602

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237042491A Pending KR20240047335A (ko) 2021-08-25 2022-08-19 병렬 산란계 오버레이 계측

Country Status (7)

Country Link
US (1) US11531275B1 (https=)
EP (1) EP4323751A4 (https=)
JP (1) JP7705482B2 (https=)
KR (1) KR20240047335A (https=)
CN (1) CN117480377B (https=)
TW (1) TW202309599A (https=)
WO (1) WO2023027947A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12111580B2 (en) * 2021-03-11 2024-10-08 Kla Corporation Optical metrology utilizing short-wave infrared wavelengths
US11841621B2 (en) * 2021-10-29 2023-12-12 KLA Corporation CA Moiré scatterometry overlay
JP2024098435A (ja) * 2023-01-10 2024-07-23 キオクシア株式会社 計測装置、及び、計測方法
US20240302751A1 (en) * 2023-03-09 2024-09-12 Kla Corporation Multi-overlay stacked grating metrology target
US12411420B2 (en) * 2023-09-29 2025-09-09 Kla Corporation Small in-die target design for overlay measurement
US12373936B2 (en) 2023-12-08 2025-07-29 Kla Corporation System and method for overlay metrology using a phase mask

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6710876B1 (en) * 2000-08-14 2004-03-23 Kla-Tencor Technologies Corporation Metrology system using optical phase
US7440105B2 (en) 2002-12-05 2008-10-21 Kla-Tencor Technologies Corporation Continuously varying offset mark and methods of determining overlay
US7349105B2 (en) 2004-09-01 2008-03-25 Intel Corporation Method and apparatus for measuring alignment of layers in photolithographic processes
US9223227B2 (en) * 2011-02-11 2015-12-29 Asml Netherlands B.V. Inspection apparatus and method, lithographic apparatus, lithographic processing cell and device manufacturing method
US9429856B1 (en) 2013-01-21 2016-08-30 Kla-Tencor Corporation Detectable overlay targets with strong definition of center locations
US10048132B2 (en) * 2016-07-28 2018-08-14 Kla-Tencor Corporation Simultaneous capturing of overlay signals from multiple targets
US10371626B2 (en) 2016-08-17 2019-08-06 Kla-Tencor Corporation System and method for generating multi-channel tunable illumination from a broadband source
US10551749B2 (en) 2017-01-04 2020-02-04 Kla-Tencor Corporation Metrology targets with supplementary structures in an intermediate layer
US10444161B2 (en) * 2017-04-05 2019-10-15 Kla-Tencor Corporation Systems and methods for metrology with layer-specific illumination spectra
KR20200004381A (ko) * 2017-05-08 2020-01-13 에이에스엠엘 네델란즈 비.브이. 구조체를 측정하는 방법, 검사 장치, 리소그래피 시스템 및 디바이스 제조 방법
US10401738B2 (en) * 2017-08-02 2019-09-03 Kla-Tencor Corporation Overlay metrology using multiple parameter configurations
US10510623B2 (en) * 2017-12-27 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Overlay error and process window metrology
US11175593B2 (en) * 2018-04-26 2021-11-16 Asml Netherlands B.V. Alignment sensor apparatus for process sensitivity compensation
US11281111B2 (en) * 2018-08-28 2022-03-22 Kla-Tencor Corporation Off-axis illumination overlay measurement using two-diffracted orders imaging
JP7124205B2 (ja) * 2018-08-29 2022-08-23 エーエスエムエル ホールディング エヌ．ブイ． コンパクトなアライメントセンサ配置
US11118903B2 (en) 2018-10-17 2021-09-14 Kla Corporation Efficient illumination shaping for scatterometry overlay
US11073768B2 (en) 2019-06-26 2021-07-27 Kla Corporation Metrology target for scanning metrology
US11256177B2 (en) 2019-09-11 2022-02-22 Kla Corporation Imaging overlay targets using Moiré elements and rotational symmetry arrangements
US10969697B1 (en) * 2019-10-18 2021-04-06 Taiwan Semiconductor Manufacturing Company, Ltd. Overlay metrology tool and methods of performing overlay measurements
CN115004113B (zh) 2020-01-29 2026-03-24 Asml荷兰有限公司 量测方法和用于测量衬底上的周期性结构的装置
US11662562B2 (en) 2020-02-09 2023-05-30 Kla Corporation Broadband illumination tuning
US11300405B2 (en) * 2020-08-03 2022-04-12 Kla Corporation Grey-mode scanning scatterometry overlay metrology
US11428642B2 (en) * 2021-01-04 2022-08-30 Kla Corporation Scanning scatterometry overlay measurement

Also Published As

Publication number Publication date
CN117480377B (zh) 2025-01-14
JP7705482B2 (ja) 2025-07-09
US11531275B1 (en) 2022-12-20
JP2024538857A (ja) 2024-10-24
WO2023027947A1 (en) 2023-03-02
EP4323751A4 (en) 2025-07-23
EP4323751A1 (en) 2024-02-21
CN117480377A (zh) 2024-01-30
TW202309599A (zh) 2023-03-01

Similar Documents

Publication Publication Date Title
US11346657B2 (en) Measurement modes for overlay
KR102347059B1 (ko) 다수의 파라미터 구성들을 사용한 오버레이 계측
US11841621B2 (en) Moiré scatterometry overlay
JP7705482B2 (ja) 並列散乱計測オーバーレイ計測
KR102812586B1 (ko) 다중 필드 스캐닝 오버레이 계측
JP7675828B2 (ja) 計測のための瞳面ビーム走査
KR102908949B1 (ko) 다수의 조명 파라미터 및 분리된 이미징을 사용한 다방향 오버레이 계측
CN116897283A (zh) 用于叠加计量的倾斜照明
TW202343146A (zh) 使用具有多個空間頻率之疊對目標之掃描疊對計量
KR20260018770A (ko) 광대역 조명을 통한 단일 그랩 동공 랜드스케이프
US20250306477A1 (en) Single grab pupil landscape via outside the objective lens broadband illumination
TW202526296A (zh) 多柱式大視野成像平台

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D16-exm-PA0302

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13 Pre-grant limitation requested

Free format text: ST27 STATUS EVENT CODE: A-2-3-E10-E13-LIM-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13 Application amended

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P13-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

B15 Application refused following examination

Free format text: ST27 STATUS EVENT CODE: N-2-6-B10-B15-EXM-PE0601 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

E12 Pre-grant re-examination requested

Free format text: ST27 STATUS EVENT CODE: A-2-3-E10-E12-REX-PX0901 (AS PROVIDED BY THE NATIONAL OFFICE)

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13 Application amended

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P13-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PX0901 Re-examination

St.27 status event code: A-2-3-E10-E12-rex-PX0901