KR20240044274A - Electronic device including sound module - Google Patents

Abstract

Disclosed is an electronic device according to an embodiment. An electronic device according to an embodiment includes a front, a back opposite to the front, and a side surrounding an internal space between the front and the rear, and an acoustic hole is formed to transmit sound from the outside to the internal space. a housing, a display visually exposed to the outside through the front, a front frame disposed in the interior space, communicating with the sound hole and forming an acoustic duct through which the sound can move, disposed in the interior space, A printed circuit board including one substrate surface, a second substrate surface opposite to the first substrate surface and facing the front frame, and an opening formed through the first substrate surface to overlap the acoustic duct when viewed from the first substrate surface, An acoustic module disposed on the first substrate surface and including a microphone positioned to overlap the opening when looking at the first substrate surface, and the printing to overlap the opening when looking at the first substrate surface. It is disposed between the circuit board and the front frame and may include a waterproof assembly for transmitting sound from the microphone through the opening from the acoustic pipe. In one embodiment, the waterproof assembly includes a vibrating membrane for transmitting sound through vibration, a first sealing member disposed on the vibrating membrane to face the printed circuit board and formed of a compressible material, and the vibrating membrane. and a second sealing member disposed between the first sealing members and made of a compressible material. In one embodiment, the first sealing member and the second sealing member may have different physical properties.

Description

Electronic device including an acoustic module {ELECTRONIC DEVICE INCLUDING SOUND MODULE}

The disclosure below relates to an electronic device including an acoustic module.

Electronic devices, including smartphones, wearable devices, tablet PCs, etc., may include an acoustic module for generating sound or receiving sound generated outside the electronic device. The acoustic module is mounted on a housing of an electronic device and can emit or receive sound through an acoustic hole formed in the housing. The acoustic module may include a waterproof structure to prevent foreign substances from entering through the acoustic hole while mounted in the housing.

An electronic device according to an embodiment includes a front, a back opposite to the front, and a side surrounding an internal space between the front and the rear, and an acoustic hole is formed to transmit sound from the outside to the internal space. a housing, a display visually exposed to the outside through the front, a front frame disposed in the interior space, communicating with the sound hole and forming an acoustic duct through which the sound can move, disposed in the interior space, A printed circuit board including one substrate surface, a second substrate surface opposite to the first substrate surface and facing the front frame, and an opening formed through the first substrate surface to overlap the acoustic duct when viewed from the first substrate surface, An acoustic module disposed on the first substrate surface and including a microphone positioned to overlap the opening when looking at the first substrate surface, and the printing to overlap the opening when looking at the first substrate surface. It is disposed between the circuit board and the front frame and may include a waterproof assembly for transmitting sound from the microphone through the opening from the acoustic pipe. In one embodiment, the waterproof assembly includes a vibrating membrane for transmitting sound through vibration, a first sealing member disposed on the vibrating membrane to face the printed circuit board and formed of a compressible material, and the vibrating membrane. and a second sealing member disposed between the first sealing members and made of a compressible material. In one embodiment, the first sealing member and the second sealing member may have different physical properties.

A waterproof assembly for transmitting sound according to an embodiment includes a first sealing member including a first sealing surface and a second sealing surface opposite to the first sealing surface and comprising a first compressible material, A second sealing member including a third sealing surface facing the second sealing surface, a fourth sealing surface opposing the third sealing surface, and comprising a second compressible material, and a second sealing member facing the fourth sealing surface. It may include one vibrating surface and a second vibrating surface opposite to the first vibrating surface, and may include a vibrating membrane that vibrates by sound waves and transmits sound. In one embodiment, a first through hole formed in the thickness direction is formed in the first sealing member, and a second through hole is formed in the thickness direction in the second sealing member and has a shape substantially the same as the first through hole. A through hole may be formed. In one embodiment, the first material and the second material may be different.

An electronic device according to an embodiment includes a housing that forms the exterior of the electronic device and includes a sound hole for transmitting sound, a display that is visually exposed to the outside through the front of the electronic device, and an internal space of the housing. a front frame disposed in, communicating with the sound hole and forming an acoustic duct through which the sound can move, disposed in the interior space, having a first substrate surface, opposite to the first substrate surface and facing the front frame A printed circuit board including a second substrate surface and an opening formed through the acoustic pipe to overlap the acoustic duct when viewed from the first substrate surface, disposed on the first substrate surface, when viewed from the first substrate surface. An acoustic module including a microphone positioned to overlap the opening, and disposed between the printed circuit board and the front frame to overlap the opening when looking at the first substrate surface, and separating the opening from the acoustic pipe. It may include a waterproof assembly for transmitting sound through the microphone. In one embodiment, the waterproof assembly includes a vibrating membrane for transmitting sound through vibration, a first sealing member disposed on the vibrating membrane facing the printed circuit board and made of a rubber material, the vibrating membrane, and the A second sealing member disposed between the first sealing members and made of a sponge material, a second sealing member disposed between the first sealing member and the second sealing member, and connecting the first sealing member and the second sealing member. 1 adhesive layer, disposed between the second sealing member and the vibrating membrane, a second adhesive layer connecting the second sealing member and the vibrating membrane, and disposed on the surface of the vibrating membrane opposite to the first sealing member, , and may include a third adhesive layer for attaching the waterproof assembly to the front frame. In one embodiment, the first sealing member and the second sealing member may differ in at least one of density and thickness.

1 is a block diagram of an electronic device in a network environment according to an embodiment.
Figure 2 is a block diagram of an audio module of an electronic device according to an embodiment.
3A is a front perspective view of an electronic device according to an embodiment.
3B is a rear perspective view of an electronic device according to an embodiment.
Figure 4 is an exploded perspective view of an electronic device according to an embodiment.
Figure 5 is a partially exploded perspective view of an electronic device illustrating an audio module according to an embodiment.
Figure 6 is a cross-sectional view showing a front frame, a waterproof assembly, a printed circuit board, and an audio module in an assembled state of an electronic device according to an embodiment.
7A is a perspective view of a waterproof assembly according to one embodiment.
Figure 7b is an exploded perspective view of the waterproofing assembly according to Figure 7a.
FIG. 7C is a cross-sectional view of the waterproofing assembly along line AA in FIG. 7A.
8A is a perspective view of a waterproof assembly according to one embodiment.
Figure 8b is a cross-sectional view of the waterproofing assembly along line BB in Figure 8a.

Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the accompanying drawings, identical components will be assigned the same reference numerals regardless of the reference numerals, and overlapping descriptions thereof will be omitted.

1 is a block diagram of an electronic device in a network environment according to an embodiment.

Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes the main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device 101 includes a main processor 121 and a secondary processor 123, the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, coprocessor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing device) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 to communicate within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit signals or power to or receive signals or power from the outside (e.g., an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for the communication method used in the communication network, such as the first network 198 or the second network 199, is connected to the plurality of antennas by, for example, the communication module 190. can be selected Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band), And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second surface (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

Electronic devices according to various embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-mentioned devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one element from another and may be used to distinguish such elements in other respects, such as importance or order) is not limited. One (e.g. first ) component is said to be “coupled” or “connected” to another (e.g. second ) component, with or without the terms “functionally” or “communicatively.” Where mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. can be used A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document are stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., foldable electronic device 101). It may be implemented as software (e.g., program 140) including the above instructions. For example, a processor (e.g., processor 120) of a device (e.g., foldable electronic device 101) may call at least one command among one or more commands stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play StoreTM) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to various embodiments, each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. . According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or , or one or more other operations may be added.

Figure 2 is a block diagram of an audio module of an electronic device according to an embodiment.

Referring to FIG. 2, the audio module 170 includes, for example, an audio input interface 210, an audio input mixer 220, an analog to digital converter (ADC) 230, an audio signal processor 240, and a DAC. (digital to analog converter) 250, an audio output mixer 260, or an audio output interface 270.

The audio input interface 210 is a part of the input module 150 or is configured separately from the electronic device 101 to obtain audio from the outside of the electronic device 101 through a microphone (e.g., dynamic microphone, condenser microphone, or piezo microphone). An audio signal corresponding to sound can be received. For example, when an audio signal is acquired from an external electronic device 102 (e.g., a headset or microphone), the audio input interface 210 is directly connected to the external electronic device 102 through the connection terminal 178. , or the audio signal can be received by connecting wirelessly (e.g., Bluetooth communication) through the wireless communication module 192. According to one embodiment, the audio input interface 210 may receive a control signal (eg, a volume adjustment signal received through an input button) related to the audio signal obtained from the external electronic device 102. The audio input interface 210 includes a plurality of audio input channels and can receive different audio signals for each corresponding audio input channel among the plurality of audio input channels. According to one embodiment, additionally or alternatively, the audio input interface 210 may receive an audio signal from another component of the electronic device 101 (e.g., the processor 120 or the memory 130 of FIG. 1). there is.

The audio input mixer 220 may synthesize a plurality of input audio signals into at least one audio signal. For example, according to one embodiment, the audio input mixer 220 may synthesize a plurality of analog audio signals input through the audio input interface 210 into at least one analog audio signal.

The ADC 230 can convert analog audio signals into digital audio signals. For example, according to one embodiment, the ADC 230 converts an analog audio signal received through the audio input interface 210, or additionally or alternatively, an analog audio signal synthesized through the audio input mixer 220 into a digital audio signal. It can be converted into a signal.

The audio signal processor 240 may perform various processing on a digital audio signal input through the ADC 230 or a digital audio signal received from another component of the electronic device 101. For example, according to one embodiment, the audio signal processor 240 changes the sampling rate of one or more digital audio signals, applies one or more filters, performs interpolation, amplifies or attenuates all or part of the frequency band, You can perform noise processing (e.g., noise or echo attenuation), change channels (e.g., switch between mono and stereo), mix, or extract specified signals. According to one embodiment, one or more functions of the audio signal processor 240 may be implemented in the form of an equalizer.

The DAC 250 can convert digital audio signals into analog audio signals. For example, according to one embodiment, the DAC 250 may process a digital audio signal processed by the audio signal processor 240, or another component of the electronic device 101 (e.g., the processor 120 or the memory 130). The digital audio signal obtained from )) can be converted to an analog audio signal.

The audio output mixer 260 may synthesize a plurality of audio signals to be output into at least one audio signal. For example, according to one embodiment, the audio output mixer 260 may output an audio signal converted to analog through the DAC 250 and another analog audio signal (e.g., an analog audio signal received through the audio input interface 210). ) can be synthesized into at least one analog audio signal.

The audio output interface 270 transmits the analog audio signal converted through the DAC 250, or additionally or alternatively, the analog audio signal synthesized by the audio output mixer 260 to the electronic device 101 through the audio output module 155. ) can be output outside of. The sound output module 155 may include, for example, a speaker such as a dynamic driver or balanced armature driver, or a receiver. According to one embodiment, the sound output module 155 may include a plurality of speakers. In this case, the audio output interface 270 may output audio signals having a plurality of different channels (eg, stereo or 5.1 channels) through at least some of the speakers. According to one embodiment, the audio output interface 270 is connected to the external electronic device 102 (e.g., external speaker or headset) directly through the connection terminal 178 or wirelessly through the wireless communication module 192. and can output audio signals.

According to one embodiment, the audio module 170 does not have a separate audio input mixer 220 or an audio output mixer 260, but uses at least one function of the audio signal processor 240 to generate a plurality of digital audio signals. At least one digital audio signal can be generated by synthesizing them.

According to one embodiment, the audio module 170 is an audio amplifier (not shown) capable of amplifying an analog audio signal input through the audio input interface 210 or an audio signal to be output through the audio output interface 270. (e.g., speaker amplification circuit) may be included. According to one embodiment, the audio amplifier may be composed of a module separate from the audio module 170.

FIG. 3A is a front perspective view of an electronic device according to an embodiment, FIG. 3B is a rear perspective view of an electronic device according to an embodiment, and FIG. 4 is an exploded perspective view of an electronic device according to an embodiment.

Referring to FIGS. 3A, 3B, and 4, the electronic device 301 (e.g., the electronic device 101 of FIG. 1) according to an embodiment has a front side 310a (e.g., the first side) and a rear side 310b. ) (e.g., second side), and a side (311c) (e.g., third side) surrounding the internal space between the front (310a) and the rear (310b).

In one embodiment, the front surface 310a may be formed at least in part by the first plate 311a, which is substantially transparent. For example, the first plate 311a may include a glass plate or a polymer plate including at least one coating layer. In one embodiment, the rear surface 310b may be formed by a substantially opaque second plate 311b. For example, the second plate 311b may be formed of coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel, or magnesium), or a combination thereof. The side surface 311c is combined with the first plate 311a and the second plate 311b and may be formed by a frame 320 including metal and/or polymer. In one embodiment, the second plate 311b and the frame 320 may be formed seamlessly. In one embodiment, the second plate 311b and the frame 320 may be formed of substantially the same material (eg, aluminum).

In one embodiment, the first plate 311a is rounded in a direction from at least a portion of the front surface 310a toward the second plate 311b and extends in one direction (e.g., +/-Y axis direction). A plurality of first edge regions 312a-1, rounded in a direction from at least a portion of the front surface 310a toward the second plate 311b, and extending in another direction (e.g., +/- X axis direction) a plurality of second edge regions 312a-2 and a plurality of first edge regions 312a-1 rounded in a direction from at least a portion of the front surface 310a toward the second plate 311b, and It may include a plurality of third edge areas 312a-3 between the plurality of second edge areas 312a-2.

In one embodiment, the second plate 311b is rounded in a direction from at least a portion of the rear surface 310b toward the first plate 311a and extends in one direction (eg, +/- Y axis direction). A plurality of fourth edge regions 312b-1, rounded in a direction from at least a portion of the rear surface 310b toward the first plate 311a and extending in other directions (e.g., +/- X axis direction) five fifth edge regions 312b-2, and a plurality of fourth edge regions 312b-1 rounded in a direction from at least a portion of the rear surface 310b toward the first plate 311a. It may include a plurality of sixth edge areas 312b-3 between the fifth edge areas 312b-2.

In one embodiment, the frame 320 may surround at least a portion of the internal space between the front side 310a and the back side 310b. The frame 320 includes a first support structure 441 disposed on at least a portion of the side 311c, and a second support structure connected to the first support structure 441 and forming an arrangement space for components of the electronic device 301. It may include structure 442.

In one embodiment, the first support structure 441 connects the edges of the first plate 311a and the second plate 311b and surrounds the space between the first plate 311a and the second plate 311b. The side 311c of the housing 310 can be formed by wrapping.

In one embodiment, the second support structure 442 may be disposed inside (or a body portion) of the electronic device 301. The second support structure 442 may be formed integrally with the first support structure 441 or may be formed separately and connected to the first support structure 441. In one embodiment, printed circuit boards 431 and 432, such as a PCB, may be disposed on the second support structure 442. The second support structure 442 may be connected to the ground of the printed circuit boards 431 and 432, for example.

In one embodiment, the display 361 is located on one side of the second support structure 442 (e.g., the lower surface (+Z-axis direction side) in FIG. 4), and the display 361 is located on the other side of the second support structure 442 (e.g., the lower surface in FIG. 4 (+Z-axis direction side)). A second plate 311b may be disposed on the upper surface of 4 (-Z-axis direction surface).

In one embodiment, at least a portion of the frame 320 may be formed of a conductive material. For example, the first support structure 441 may be formed of metal and/or a conductive polymer material. In one embodiment, the second support structure 442, like the first support structure 441, may be formed of metal and/or a conductive polymer material.

In one embodiment, an acoustic pipe (eg, acoustic pipe 521 in FIG. 5) may be formed in the frame 320 to transmit sound between the outside and inside of the housing 310. In one embodiment, the acoustic duct formed in the frame 320 may communicate with the external acoustic holes 313, 315, and 355 of the electronic device 301. In one embodiment, sound outside the electronic device 301 is transmitted through the sound hole 313 and the sound pipe to the internal space, for example, the microphone of the sound module 440 (e.g., the microphone 541 in FIG. 6). It can be delivered.

In one embodiment, the electronic device 301 may include a display 361 (eg, the display module 160 of FIG. 1). In one embodiment, the display 361 may be located on the front surface 310a. In one embodiment, the display 361 includes at least a portion of the first plate 311a (e.g., a plurality of first edge regions 312a-1, a plurality of second edge regions 312a-2, and a plurality of It may be exposed through third edge areas 312a-3.

In one embodiment, the edge of the display 361 may substantially coincide with the outer edge of the first plate 311a. In one embodiment, the display 361 may include a touch detection circuit, a pressure sensor capable of sensing the strength (pressure) of a touch, and/or a digitizer that detects a magnetic field-type stylus pen.

In one embodiment, the display 361 may include a screen display area 361a that is visually exposed and displays content through pixels or a plurality of cells. In one embodiment, the screen display area 361a may include a sensing area 361a-1 and a camera area 361a-2. In this case, the sensing area 361a-1 may overlap with at least a portion of the screen display area 361a. Sensing area 361a-1 may allow transmission of an input signal related to sensor module 376 (eg, sensor module 176 in FIG. 1). The sensing area 361a-1 can display content like the screen display area 361a that does not overlap the sensing area 361a-1. For example, the sensing area 361a-1 may display content while the sensor module 376 is not operating. The camera area 361a-2 may overlap at least a portion of the screen display area 361a.

In one embodiment, the electronic device 301 may include an audio module 440 (eg, the audio module 170 of FIG. 1). The sound module 440 may acquire sound from outside the electronic device 301. For example, the sound module 440 may be located in the inner space of the housing 310. In one embodiment, the sound module 440 may acquire sound through at least one hole 313.

In one embodiment, the electronic device 301 may include a sensor module 376. The sensor module 376 can sense a signal applied to the electronic device 301. The sensor module 376 may be located on the front 310a of the electronic device 301, for example. The sensor module 376 may form a sensing area 361a-1 in at least a portion of the screen display area 361a. The sensor module 376 may receive an input signal passing through the sensing area 361a-1 and generate an electrical signal based on the received input signal. For example, the input signal may have a specified physical quantity (e.g., heat, light, temperature, sound, pressure, ultrasound). As another example, the input signal may include a signal related to the user's biometric information (eg, the user's fingerprint, voice, etc.).

In one embodiment, the electronic device 301 may include camera modules 380a and 380b (eg, camera module 180 in FIG. 1). In one embodiment, the camera modules 380a and 380b may include a first camera module 380a, a second camera module 380b, and a flash 380c. In one embodiment, the first camera module 380a is disposed to be exposed through the front 310a of the housing 310, and the second camera module 380b and the flash 380c are exposed through the rear 310b of the housing 310. ) can be arranged to be exposed through. In one embodiment, at least a portion of the first camera module 380a may be disposed in the housing 310 to be covered by the display 361. In one embodiment, the first camera module 380a may receive an optical signal passing through the camera area 361a-2. In one embodiment, the second camera module 380b may include a plurality of cameras (eg, dual cameras, triple cameras, or quad cameras). In one embodiment, the flash 380c may include a light emitting diode or a xenon lamp.

In one embodiment, the electronic device 301 may include external sound holes 315 and 355. The external sound holes 315 and 355 may output sound to the outside of the electronic device 301, and the electronic device 301 may include a plurality of external sound holes 315 and 355. In one embodiment, the electronic device 301 may include a sound hole 313 through which sound from outside the electronic device 301 can be input into the inside.

For example, the first external sound hole 315 may be formed adjacent to the side 311c in one direction (e.g., +Y direction) of the housing 310, and specifically, the front camera module 380a or It may be formed adjacent to the camera area 361a-2 of the display 361. The second external sound hole 355 may be at least one hole formed on the side surface 311c of the housing 310 in one direction (eg, -Y direction). The electronic device 301 may output three-dimensional sound to the outside of the electronic device 301 through the first external sound hole 315 and the second external sound hole 355.

In one embodiment, an engraved area of the first external sound hole 315 may be provided on the outer edge of the first plate 311a, and the first plate 311a and the display 361 are combined and the engraved area is formed. 1 It can be implemented as an external sound hall 315.

According to one embodiment, the electronic device 301 may output sound directly to the outside through the sound hole 362 without including the first external sound hole 315. The display 361 of one embodiment may include a notch structure where the sound hole 362 and the camera module 380a are located.

In one embodiment, the electronic device 301 may include an input module 350 (eg, input module 150 of FIG. 1). The input module 350 can receive a user's manipulation signal. For example, the input module 350 may include at least one key input device disposed to be exposed on the side 311c of the housing 310.

In one embodiment, the electronic device 301 may include a connection terminal 378 (eg, connection terminal 178 in FIG. 1). In one embodiment, the connection terminal 378 may be disposed on the side 311c. For example, when the electronic device 301 is viewed in one direction (e.g., the +Y axis direction in FIG. 3A), the connection terminal is disposed in the center of the side 311c, and is located at one side relative to the connection terminal 378. The external sound hole 355 may be disposed in a direction (e.g., right direction).

In one embodiment, the electronic device 301 may include one or more printed circuit boards 431 and 432 and a battery 489 (e.g., battery 189 in Figure 1. In one embodiment, the printed circuit board (431, 432) may include a first printed circuit board 431 and a second printed circuit board 432. In this case, the first printed circuit board 431 is the second support structure 442. 1 may be received in the substrate slot 442a, and the second printed circuit board 432 may be received in the second substrate slot 442b of the second support structure 442. In one embodiment, the battery 489 It can be accommodated in the battery slot 445 of the second support structure 442 formed between the first substrate slot 442a and the second substrate slot 442b.

In one embodiment, an electrical circuit for transmitting an electrical signal may be formed on the printed circuit boards 431 and 432. In one embodiment, one or more electrical components may be disposed (eg, mounted) on the surfaces of the printed circuit boards 431 and 432 to achieve the function of the electronic device 301. For example, electrical elements may be components for performing functions within the electronic device 301, such as an application processor (AP), graphics processing unit (GPU), or power management IC (PMIC). In one embodiment, an opening 433 partially open to penetrate the surface of the second printed circuit board 432 may be formed. In one embodiment, an acoustic module 440 to perform an acoustic function may be disposed on the printed circuit boards 431 and 432.

In one embodiment, a processor (eg, processor 120 of FIG. 1) may be disposed on the printed circuit boards 431 and 432. The processor may include, for example, one or more of a central processing unit (CPU), an application processor (AP), an image signal processor, a sensor hub processor, or a communication processor. In one embodiment, a wireless communication circuit (eg, the wireless communication module 192 of FIG. 1) may be disposed on the printed circuit boards 431 and 432. The wireless communication circuit may, for example, communicate with an external device (e.g., the electronic device 104 of FIG. 1). The electronic device 301 includes an antenna structure (eg, the antenna module 197 in FIG. 1), and a wireless communication circuit may be electrically connected to the antenna structure. In one embodiment, a wireless communication circuit may generate a signal to be transmitted via an antenna structure or detect a signal received via an antenna structure. In one embodiment, the printed circuit boards 431 and 432 include a ground, and the ground of the printed circuit boards 431 and 432 may function as a ground for an antenna structure implemented using a wireless communication circuit.

In one embodiment, the electronic device 301 may include an audio module 440 that includes one or more microphones. In one embodiment, the sound module 440 may generate an electrical signal according to sound transmitted from the outside. In another embodiment, the sound module 440 includes a speaker and may generate sound according to an electrical signal. In one embodiment, an audio module 440 including a microphone and an audio module 440 including a speaker may be individually provided in the electronic device 301. In one embodiment, one sound module 440 may include a microphone and a speaker simultaneously. Hereinafter, the description will be made assuming that the sound module 440 includes a microphone, but the disclosed embodiments are not limited thereto. In one embodiment, the sound module 440 is electrically connected directly or indirectly to the printed circuit board 432 and may generate an electrical signal according to sound received through a microphone. The printed circuit board 432 has an opening 433 that is open through at least a portion of the surface to move sound between the microphone of the sound module 440 and the sound pipe (e.g., the sound pipe 521 in FIG. 5). can be formed. In one embodiment, the sound module 440 may be disposed on the second printed circuit board 432 so that the microphone is located in the opening 433 of the second printed circuit board 432. In one embodiment, sound waves entering the acoustic pipe from the outside of the electronic device 301 through the acoustic hole 313 may pass through the opening 433 of the printed circuit board 432 and be input into the microphone of the acoustic module 440. .

FIG. 5 is a partially exploded perspective view of an electronic device showing an acoustic module according to an embodiment, and FIG. 6 shows a front frame, a waterproof assembly, a printed circuit board, and an acoustic module in an assembled state of the electronic device according to an embodiment. This is a cross-sectional view showing the cross section of.

Referring to FIGS. 5 and 6 , the electronic device 501 (e.g., the electronic device 301 in FIG. 3a) according to an embodiment includes a housing 510 (e.g., the housing 310 in FIG. 3a) and a display ( Example: display 361 in FIG. 4), front frame 520 (e.g. frame 320 in FIG. 4), printed circuit board 530 (e.g. printed circuit board 432 in FIG. 4), sound module It may include 540 (e.g., the acoustic module 440 of FIG. 4) and a waterproof assembly 550.

In one embodiment, the housing 510 may form the exterior of the electronic device 501. In one embodiment, the housing 510 may form an internal space 511. In one embodiment, an acoustic hole 513 (eg, acoustic hole 313 in FIG. 3A) may be formed on the outer surface of the housing 510. For example, the sound hole 513 may be formed on the side 510c of the housing 510. In one embodiment, the display may be disposed on the front of the housing 510 (eg, a side of the housing 510 facing the +Z direction).

In one embodiment, the front frame 520 may surround at least a portion of the internal space 511 between the front 510a and the rear 510b of the housing 510. In one embodiment, at least a portion of the front frame 520 may be disposed adjacent to the side 510c of the housing 510. For example, the front frame 520 may be provided so that at least a portion of the front frame 520 is close to the side 510c of the housing 510 where the sound hole 513 is formed. In one embodiment, the front frame 520 may be formed separately from the housing 510, but may also be formed integrally with the housing 510. For example, the front frame 520 may form at least a portion of the side 510c of the housing 510.

In one embodiment, an acoustic conduit 521 through which sound moves may be formed in the front frame 520. In one embodiment, the acoustic conduit 521 is formed through the inside of the front frame 520 and may function as a path through which sound can travel. In one embodiment, based on the path formed by the acoustic pipe 521, one end of the acoustic pipe 521 may communicate with the sound hole 513 formed in the housing 510. In one embodiment, the acoustic duct 521 may include an open portion 521a formed in the front frame 520 to be open in the internal space 511 of the housing 510. In one embodiment, the open portion 521a may be formed open toward the microphone 541 of the sound module 540, which will be described later. For example, the open portion 521a of the sound pipe 521 may be open toward a direction opposite to the display (eg, -Z direction).

In one embodiment, a seating portion 520a may be formed in the front frame 520. In one embodiment, the seating portion 520a may be formed in a recess shape on the surface of the front frame 520 (eg, a surface facing the -Z direction). In one embodiment, the seating portion 520a may include an open portion 521a. For example, the seating portion 520a may be in communication with the acoustic pipe 521. In one embodiment, a waterproof assembly 550 may be disposed on the seating portion 520a. The seating portion 520a may fix the position of the waterproof assembly 550 within the electronic device 501 by supporting at least a portion of the waterproof assembly 550.

In one embodiment, the printed circuit board 530 may be disposed in the internal space 511 of the housing 510. In one embodiment, the printed circuit board 530 may be disposed opposite to the display with the front frame 520 interposed therebetween. In one embodiment, the printed circuit board 530 may include a first substrate surface 531 and a second substrate surface 532 opposite to the first substrate surface 531. In one embodiment, the printed circuit board 530 may be arranged such that the second substrate surface 532 of the printed circuit board 530 faces the display. In one embodiment, the printed circuit board 530 may be fixed to the front frame 520 so that the second board surface 532 contacts at least a portion of the surface of the front frame 520. In one embodiment, the printed circuit board 530 may include an opening 530a that is at least partially open to penetrate the surface of the printed circuit board 530. In one embodiment, the opening 530a of the printed circuit board 530 is connected to at least one of the acoustic conduits 521 based on the central axis C (e.g., Z-axis direction) perpendicular to the second substrate surface 532. Some parts, for example, may overlap with the open portion 521a of the acoustic pipe 521. In this case, sound input into the acoustic pipe 521 may pass through the opening 530a through the open portion 521a.

In one embodiment, the sound module 540 may include at least one microphone 541. In one embodiment, the sound module 540 may be placed on the printed circuit board 530. For example, the sound module 540 may be mounted on the surface of the printed circuit board 530 and electrically connected to an electrical circuit formed on the printed circuit board 530. In one embodiment, the microphone 541 may be placed on the first substrate surface 531 of the printed circuit board 530. In one embodiment, the sound module 540 may be disposed on the first substrate surface 531 of the printed circuit board 530. With the sound module 540 disposed on the first substrate surface 531, the microphone 541 may be located in the opening 530a. For example, the microphone 541 may overlap the opening 530a with respect to the central axis C perpendicular to the first substrate surface 531 of the printed circuit board 530. In one embodiment, while the printed circuit board 530 is connected to the front frame 520, the microphone 541 may be pointed at the front frame 520. In one embodiment, the microphone 541, the opening 530a of the printed circuit board 530, and the open portion 521a of the acoustic duct 521 are connected to the first substrate surface 531 of the printed circuit board 530. Based on the vertical central axis (C), they may overlap each other. In one embodiment, sound input from the outside of the electronic device 501 to the acoustic pipe 521 may be transmitted to the microphone 541 through the opening 530a of the printed circuit board 530. For example, sound is transmitted from the outside of the electronic device 501 to the microphone 541 of the sound module 540 through the sound hole 513, the sound pipe 521, and the opening 530a of the printed circuit board 530. A path can be formed. Accordingly, the microphone 541 can receive sound transmitted from the outside through the acoustic pipe 521.

In one embodiment, the waterproof assembly 550 is disposed between the printed circuit board 530 and the front frame 520 and can transmit sound transmitted from the acoustic pipe 521 to the microphone 541. In one embodiment, the waterproof assembly 550 may vibrate according to sound waves (i.e., sound waves) input through the acoustic pipe 521 and transmit the sound waves generated according to the vibration to the microphone 541. In one embodiment, the waterproof assembly 550 is connected to the open portion 521a of the acoustic conduit 521 and the printed circuit board 530 with respect to the central axis C perpendicular to the first substrate surface 531 of the printed circuit board 530. It may overlap the opening 530a of the circuit board 530. In one embodiment, the waterproof assembly 550 seals the gap formed between the front frame 520 and the printed circuit board 530 along the perimeter of the open portion 521a and the opening 530a of the acoustic duct 521. By sealing, it is possible to prevent or reduce the occurrence of sound leakage during the sound transmission process. The waterproof assembly 550 can prevent foreign substances, including moisture, from entering the open portion 521a and the opening 530a.

In one embodiment, the waterproof assembly 550 may be seated on the seating portion 520a of the front frame 520. In one embodiment, when the waterproof assembly 550 is seated on the seating portion 520a, at least a portion of an edge of the waterproof assembly 550 may be supported by the seating portion 520a. In one embodiment, at least a portion of the waterproof assembly 550 may include a compressible material. In one embodiment, the waterproof assembly 550 is compressed in the thickness direction (e.g., Z-axis direction) of the waterproof assembly 550 during the process of fixing the printed circuit board 530 to the front frame 520, and the front frame ( The gap between 520) and the printed circuit board 530 can be sealed. In one embodiment, the waterproof assembly 550 is located between the printed circuit board 530 and the front frame 520 adjacent to the opening 530a, based on the state in which the printed circuit board 530 is fixed to the front frame 520. By being formed to have a compressed thickness substantially corresponding to the gap, ease of assembly with the front frame 520 and the printed circuit board 530 can be ensured. In one embodiment, the waterproofing assembly 550 may include a plurality of members having different physical properties.

FIG. 7A is a perspective view of a waterproof assembly according to an embodiment, FIG. 7B is an exploded perspective view of the waterproof assembly according to FIG. 7A, and FIG. 7C is a cross-sectional view of the waterproof assembly along line A-A in FIG. 7A.

Referring to FIGS. 7A, 7B, and 7C, the waterproof assembly 550 according to one embodiment may be formed as a multi-layer structure in which a plurality of members are connected in the thickness direction (eg, Z-axis direction). In one embodiment, the waterproof assembly 550 includes a vibrating membrane 551 that transmits sound through vibration, a first sealing member 552 disposed on the vibrating membrane 551, the vibrating membrane 551 and the first sealing member. A second sealing member 553 disposed between (552), a first adhesive layer 554 connecting the first sealing member 552 and the second sealing member 553, the second sealing member 553 and a vibration membrane. It may include a second adhesive layer 555 connecting the front frame 551 and a third adhesive layer 556 connecting the front frame 520 and the vibration membrane 551.

In one embodiment, the vibrating membrane 551 may transmit sound by vibrating according to sound waves. In one embodiment, the vibrating membrane 551 may be an acoustic membrane. In one embodiment, the vibration membrane 551 can prevent malfunction of the microphone 541 (e.g., the microphone 541 in FIG. 5) due to dust and water. In one embodiment, the vibrating membrane 551 may include a material that allows gas such as air or sound to pass through, but does not allow liquid or dust to pass through. For example, the vibrating membrane 551 may include at least one of polytetrafluoroethylene (PTFE), expanded PTFE (ePTFE), and polyvinylidene fluoride (PVDF). However, this is only an example, and the material of the vibration membrane 551 may include various materials depending on the embodiment. In one embodiment, the vibrating membrane 551 may include a first vibrating surface 5511 and a second vibrating surface 5512 that is opposite to the first vibrating surface 5511.

In one embodiment, the waterproof assembly 550 is disposed between a front frame (e.g., front frame 520 of FIG. 6) and a printed circuit board (e.g., printed circuit board 530 of FIG. 6) as shown in FIG. In this state, the vibrating membrane 551 vibrates according to the sound wave transmitted through the acoustic pipe 521, and can transmit the sound wave according to the vibration to a microphone (eg, the microphone 541 in FIG. 6). Hereinafter, for convenience of explanation, the waterproof assembly 550 is configured so that the first vibration surface 5511 of the vibration membrane 551 is the second substrate surface of the printed circuit board 530 (e.g., the second substrate surface in FIG. 6 ( 532)), it is assumed to be placed in an electronic device (e.g., the electronic device 501 of FIG. 5), but the present invention is not limited thereto.

In one embodiment, the vibration membrane 551 may be attached to the front frame 520 through a third adhesive layer 556. In one embodiment, the vibrating membrane 551 is a first vibrating surface forming an upper surface (e.g., -Z direction surface in FIG. 7b) based on the thickness direction (e.g., Z direction in FIG. 7a) of the waterproofing assembly 550. It may include (5511) and a second vibration surface (5512) that is opposite to the first vibration surface (5511) and forms the lower surface of the vibration membrane (551) (e.g., +Z direction surface in FIG. 7B).

In one embodiment, the first sealing member 552 may be disposed to face the first vibration surface 5511 of the vibration membrane 551. In one embodiment, along the thickness direction of the waterproof assembly 550, the first sealing member 552 has a first sealing surface 5521 and a second sealing surface 5522 opposite to the first sealing surface 5521. may include. In one embodiment, the first sealing surface 5521 may face the printed circuit board 530, and the second sealing surface 5522 may face the first vibrating surface 5511 of the vibrating membrane 551. In one embodiment, when the waterproof assembly 550 is disposed between the front frame 520 and the printed circuit board 530 as shown in FIG. 6, the first sealing member 552 has a first sealing surface 5521. It may be in contact with the second substrate surface 532 of the printed circuit board 530.

In one embodiment, the second sealing member 553 may be disposed between the first sealing member 552 and the vibration membrane 551. In one embodiment, along the thickness direction of the waterproof assembly 550, the second sealing member 553 has a third sealing surface 5531 and a fourth sealing surface 5532 opposite to the third sealing surface 5531. may include. In one embodiment, the third sealing surface 5531 faces the second sealing surface 5522 of the first sealing member 552, and the fourth sealing surface 5532 faces the first vibrating surface 5511 of the vibrating membrane 551. ) can be directed to.

In one embodiment, the first adhesive layer 554 is disposed between the first sealing member 552 and the second sealing member 553, and connects the second sealing surface 5522 and the third sealing surface 5531 ( Example: splicing) can be done. In one embodiment, the second adhesive layer 555 is disposed between the second sealing member 553 and the vibrating membrane 551, and connects (e.g., bonds) the fourth sealing surface 5532 and the first vibrating surface 5511. )can do.

In one embodiment, the third adhesive layer 556 may be disposed on the second vibrating surface 5512 of the vibrating membrane 551. In one embodiment, the third adhesive layer 556 connects the second vibration surface 5512 to the surface of the front frame 520 with the waterproof assembly 550 located on the seating portion 520a of the front frame 520. and/or may be attached.

In one embodiment, the first adhesive layer 554, the second adhesive layer 555, and the third adhesive layer 556 may include a tape member containing an adhesive. In one embodiment, the first adhesive layer 554, the second adhesive layer 555, and the third adhesive layer 556 each have a single adhesive layer structure in which a single side is formed with an adhesive layer and a double adhesive layer structure in which both sides are formed with an adhesive layer ( It may be one of the structures to which a double adhesive layer structure is attached. In one embodiment, each of the first adhesive layer 554, the second adhesive layer 555, and the third adhesive layer 556 is made of polyethylene to relieve compressive force and shear stress and prevent damage to the waterproof assembly 550. , acryl, silicon, rubber, epoxy, urethane, acrylic, polyolefin foam, and polyethylene terephthalate (PET) film. Any one material may be included, but this is only an example and the material of the adhesive layer is not limited. In one embodiment, the first adhesive layer 554, the second adhesive layer 555, and the third adhesive layer 556 are compressed in the thickness direction when the waterproof assembly 550 is between the front frame 520 and the printed circuit board 530. If so, it can be at least partially compressed.

In one embodiment, the first sealing member 552 and the second sealing member 553 may be compressed. For example, the first sealing member 552 and the second sealing member 553 are compressed in the thickness direction during the process of fixing the printed circuit board 530 to the front frame 520 and form the waterproof assembly 550. can change. In one embodiment, when the waterproofing assembly 550 is compressed in the thickness direction, the first sealing member 552 and the second sealing member 553 each buffer the pressing force applied to the waterproofing assembly 550, thereby vibrating the membrane. Damage to (551) can be prevented or reduced. The first sealing member 552 and the second sealing member 553 apply a restoring force according to compression so that the waterproof assembly 550 is in close contact with the printed circuit board 530 and the front frame 520, The gap between 530) and the front frame 520 can be stably sealed.

In one embodiment, the first sealing member 552 and the second sealing member 553 may have different physical properties. In one embodiment, the first sealing member 552 and the second sealing member 553 may have different densities. For example, the first sealing member 552 may have a first density, and the second sealing member 553 may have a second density that is lower than the first density. In one embodiment, the first sealing member 552 and the second sealing member 553 may have different elastic moduli. For example, the second sealing member 553 may have a lower elastic modulus than the first sealing member 552. Since the second sealing member 553 is disposed relatively adjacent to the vibration membrane 551 compared to the first sealing member 552 based on the thickness direction of the waterproofing assembly 550, the second sealing member 553 ) can be compressed relatively more easily than the first sealing member 552 and can directly cushion the pressure applied to the vibrating membrane 551.

In one embodiment, the first sealing member 552 and the second sealing member 553 have different compression resistance to pressing force when the waterproof assembly 550 is compressed, thereby compensating for processing deviation during the assembly process. However, high sealing performance can be secured. For example, because the degree of compression of the first sealing member 552 and the second sealing member 553 may vary depending on manufacturing tolerances, the front frame 520 and the printed circuit board are formed through sufficient compression of the waterproof assembly 550. While assembly performance is secured between the front frame 520 and the printed circuit board 530 due to the difference in relative compression resistance of the first sealing member 552 and the second sealing member 553, The sealing function can also be maintained.

In one embodiment, the first sealing member 552 may include a first compressible material, and the second sealing member 553 may include a second compressible material. In one embodiment, the surface of the first sealing member 522, for example, the first sealing surface 5521 and the second sealing surface 5522, is treated with velvet, matte, or sued. By doing this, the compressive force can be alleviated and adhesion to the first adhesive layer 554 can be facilitated. In one embodiment, the first material and the second material are rubber materials (e.g., liquid silicone rubber (LSR), acrylonitrile rubber (NBR), urethane rubber (EU), silicone rubber (VMQ), fluorine rubber (FKM, FPM), etc.) and sponge materials may be included, but are not limited thereto. In one embodiment, the first sealing member 552 and the second sealing member 553 may include different materials. For example, the first sealing member 552 may include a rubber material, and the second sealing member 553 may include a sponge material. In one embodiment, the first sealing member 552 and the second sealing member 553 may include the same material. In one embodiment, when the first sealing member 552 and the second sealing member 553 are formed of the same material, the first sealing member 552 and the second sealing member 553 have different physical properties, for example, , can be formed to have different densities.

In one embodiment, based on the thickness direction of the waterproof assembly 550, the first sealing member 552 has a first thickness T1, and the second sealing member 553 has a thickness different from the first thickness T1. It may have a second thickness (T2). In one embodiment, the first thickness T1 of the first sealing member 552 may be thicker than the second thickness T2 of the second sealing member 553. The thicknesses T1 and T2 of each of the first sealing member 552 and the second sealing member 553 are equal to the design value of the waterproof assembly 550 disposed between the front frame 520 and the printed circuit board 530. It may vary depending on In one embodiment, the waterproof assembly 550 is manufactured by connecting the first sealing member 552 and the second sealing member 553, so at least one of the first sealing member 552 and the second sealing member 553 The thickness of the entire waterproof assembly 550 can be easily adjusted by adjusting any one thickness (T1, T2). Accordingly, the difficulty of assembling the waterproof assembly 550 according to manufacturing tolerances can be greatly reduced.

In one embodiment, the waterproof assembly 550 is formed in the thickness direction and may include a through hole 550a through which sound travels. In one embodiment, the through hole 550a may be sealed inside the waterproof assembly 550 by a vibrating membrane 551. The vibrating membrane 551 vibrates by the transmitted sound wave to form a sound wave, and can transmit the formed sound wave to the outside of the waterproof assembly 550, for example, the microphone 541, through the through hole 550a. In one embodiment, the through-hole 550a formed in the waterproof assembly 550 is formed in the front frame 520 with respect to the central axis C perpendicular to the first sealing surface 5521 of the first sealing member 552. ) The open portion 521a of the acoustic pipe 521 formed through the inside, the seating portion 520a formed on the front frame 520, the opening 530a formed through the printed circuit board 530, and the acoustic module ( At least a portion of the microphone 541 of 540 may overlap.

In one embodiment, the through hole 550a penetrates the first sealing member 552, the second sealing member 553, the first adhesive layer 554, the second adhesive layer 555, and the third adhesive layer 556. can be formed. In one embodiment, the first sealing member 552 has a first through hole 552a formed in the thickness direction, and the second sealing member 553 has a second through hole 553a formed in the thickness direction. A first adhesive through-hole 554a formed in the thickness direction is formed in the first adhesive layer 554, and a second adhesive through-hole 555a formed in the thickness direction is formed in the second adhesive layer 555. You can. In one embodiment, a third adhesive through-hole 556a is formed in the third adhesive layer 556, with the vibration membrane 551 interposed therebetween, and opposite to the second adhesive through-hole 555a along the thickness direction. You can. In one embodiment, the first through hole 552a, the second through hole 553a, the first adhesive through hole 554a, and the second adhesive through hole 555a may communicate with each other. The vibration membrane 551 may provide water-proofing and/or dust-proofing between the second adhesive through-hole 555a and the third adhesive through-hole 556a. In one embodiment, based on the central axis C perpendicular to the cross section of the waterproof assembly 550, the first through hole 552a, the second through hole 553a, the first adhesive through hole 554a, and the first through hole 552a. The second adhesive through-hole 555a and the third adhesive through-hole 556a may substantially completely overlap.

FIG. 8A is a perspective view of a waterproof assembly according to an embodiment, and FIG. 8B is a cross-sectional view of the waterproof assembly taken along line B-B of FIG. 8A.

Referring to FIGS. 8A and 8B, the waterproof assembly 850 (e.g., the waterproof assembly 550 in FIG. 7a) according to an embodiment includes a vibrating membrane 851 (e.g., the waterproof assembly 550 in FIG. 7a) that transmits sound through vibration. A vibrating membrane 551), a first sealing member 852 disposed on the vibrating membrane 851 (e.g., the first sealing member 552 in FIG. 7A), a vibrating membrane 851 and a first sealing member 852. A second sealing member 853 disposed between them (e.g., the second sealing member 553 in FIG. 7A), and a first adhesive layer 854 connecting the first sealing member 852 and the second sealing member 853. (e.g., the first adhesive layer 554 in FIG. 7A), a second adhesive layer 855 connecting the second sealing member 853 and the vibration membrane 851 (e.g., the second adhesive layer 555 in FIG. 7a), and It may include a third adhesive layer 856 (e.g., the third adhesive layer 556 in FIG. 7A) connecting the front frame (e.g., the front frame 520 in FIG. 5) and the vibration membrane 851.

In one embodiment, the vibrating membrane 851 includes a first vibrating surface 8511 (e.g., first vibrating surface 5511 in Figure 7B) and a second vibrating surface 8512 (e.g., opposite to the first vibrating surface 8511). It may include a second vibration surface 5512 in FIG. 7B. In one embodiment, the first sealing member 852 includes a first sealing surface 8521 (e.g., the first sealing surface 5521 in Figure 7b) and a second sealing surface opposite to the first sealing surface 8521 ( 8522) (e.g., the second sealing surface 5522 in FIG. 7B). In one embodiment, the second sealing member 853 includes a third sealing surface 8531 (e.g., the third sealing surface 5531 in FIG. 7B) and a fourth sealing surface opposite to the third sealing surface 8531 ( 8532) (e.g., the fourth sealing surface 5532 in FIG. 7B).

In one embodiment, based on the thickness direction (e.g., Z-axis direction in Figure 8a) of the waterproof assembly 850, the first sealing member 852 is divided into a first part 852-1 and a second part 852-1. 2) may be included. In one embodiment, the first portion 852-1 may form the first sealing surface 8521 of the first sealing member 852. In one embodiment, the first part 852-1 is the first part of the printed circuit board 530 in a state where the printed circuit board (e.g., the printed circuit board 530 of FIG. 5) is fixed to the front frame 520. It may be placed in contact with two substrate surfaces (e.g., the second substrate surface 532 in FIG. 6). In one embodiment, the second portion 852-2 may form the second sealing surface 8522 of the first sealing member 852. In one embodiment, the second part 852-2 may be connected to the first part 852-1 to face the vibrating membrane 851.

In one embodiment, based on the thickness direction of the waterproof assembly 850 (e.g., the Z-axis direction in FIG. 8A), the second sealing member 853 is divided into a third portion 853-1 and a fourth portion 853-1. 2) may be included. In one embodiment, the third portion 853-1 may form the third sealing surface 8531 of the second sealing member 853. In one embodiment, the third part 853-1 may be arranged to face the second part 852-2 of the first sealing member 852. In one embodiment, the fourth portion 853-2 may form the fourth sealing surface 8532 of the second sealing member 853. In one embodiment, the fourth part 853-2 may be connected to the third part 853-1 based on the direction toward the vibrating membrane 851.

In one embodiment, the first part 852-1 and the second part 852-2 are made of different materials, and the third part 853-1 and the fourth part 853-2 are made of different materials. can be formed. In one embodiment, the first part 852-1 and the third part 853-1 may be formed of compressible rubber or sponge material. In one embodiment, the second part 852-2 and the fourth part 853-2 may be made of polyethylene terephthalate (PET) or polycarbonate (PC). In one embodiment, the second part 852-2 and the fourth part 853-2 each form a layer supporting the first part 852-1 and the third part 853-1, The stability of the first sealing member 852 and the second sealing member 853 can be improved.

In one embodiment, the waterproof assembly 850 is formed in the thickness direction and may include a through hole 850a through which sound moves (eg, through hole 550a in FIG. 7A). In one embodiment, the through hole 850a is formed through the inside of the front frame 520 with respect to an axis (e.g., Z axis) perpendicular to the first sealing surface 8521 of the first sealing member 852. At least a portion overlaps with the acoustic pipe 521, the seating portion 520a formed on the front frame 520, the opening 530a formed through the printed circuit board 530, and the microphone 541 of the acoustic module 540. can be formed.

In one embodiment, the through hole 850a penetrates the first sealing member 852, the second sealing member 853, the first adhesive layer 854, the second adhesive layer 855, and the third adhesive layer 856. can be formed. In one embodiment, the first sealing member 852 is formed with a first through hole 852a (e.g., the first through hole 552a in FIG. 7B) formed in the thickness direction, and the second sealing member 853 A second through hole 853a formed in the thickness direction (e.g., the second through hole 553a in FIG. 7B) is formed, and the first adhesive layer 854 is formed with a first adhesive through hole 854a formed in the thickness direction. ) (e.g., the first adhesive through-hole 554a in FIG. 7B) is formed, and a second adhesive through-hole 855a is formed in the thickness direction in the second adhesive layer 855 (e.g., the second adhesive through-hole 554a in FIG. 7b). A sphere 555a) may be formed. In one embodiment, the third adhesive layer 856 includes a third adhesive through-hole 856a (e.g., a third adhesive through-hole 856a) formed opposite to the second adhesive through-hole 855a along the thickness direction, with the vibration membrane 851 therebetween. A third adhesive through hole 556a in FIG. 7B may be formed. In one embodiment, the first through hole 852a, the second through hole 853a, the first adhesive through hole 854a, and the second adhesive through hole 855a may communicate with each other. The vibration membrane 851 may provide water-proofing and/or dust-proofing between the second adhesive through-hole 855a and the third adhesive through-hole 856a. In one embodiment, based on the central axis C perpendicular to the cross section of the waterproof assembly 850, the first through hole 852a, the second through hole 853a, the first adhesive through hole 854a, and the second through hole 852a are formed. The second adhesive through-hole 855a and the third adhesive through-hole 856a may substantially completely overlap.

The electronic devices 301 and 501 according to one embodiment surround a front surface 310a, a rear surface 310b opposite the front surface 310a, and an internal space 511 between the front surface 310a and the rear surface 310b. A housing (310,510) includes side surfaces (311c, 510c) and has sound holes (313, 315, 355, 513) for transmitting sound from the outside to the interior space (511), which is visually exposed to the outside through the front (310a). a display 361, a front frame 320,520 disposed in the internal space 511, communicating with the sound holes 313, 315, 355, 513 and forming an acoustic duct 521 through which the sound can move, the internal space 511 ), a first substrate surface 531, a second substrate surface 532 opposite to the first substrate surface 531 and facing the front frames 320,520, and a first substrate surface 531. A printed circuit board (431, 432, 530) including an opening (530a) formed through and overlapping the acoustic pipe 521 when viewed, is disposed on the first substrate surface (531), and the first substrate surface (531) sound modules 440 and 540 including a microphone 541 positioned to overlap the opening 530a when looking at the sound modules 440 and 540, and overlapping with the opening 530a when looking at the first substrate surface 531. It is disposed between the printed circuit board (431, 432, 530) and the front frame (320, 520) and includes a waterproof assembly (550, 850) for transmitting sound from the acoustic pipe 521 to the microphone 541 through the opening (530a). can do. In one embodiment, the waterproof assembly (550,850) includes a vibrating membrane (551,851) for transmitting sound through vibration,

A first sealing member (552,852) disposed on the vibrating membrane (551,851) facing the printed circuit board (431,432,530) and formed of a compressible material, and the vibrating membrane (551,851) and the first sealing member (552,852) It may include second sealing members 553 and 853 disposed between them and made of a compressible material. In one embodiment, the first sealing members 552 and 852 and the second sealing members 553 and 853 may have different physical properties.

In one embodiment, the first sealing members 552 and 852 and the second sealing members 553 and 853 may have different elastic moduli.

In one embodiment, the first sealing members 552 and 852 and the second sealing members 553 and 853 may be formed of different materials.

In one embodiment, the first sealing members 552 and 852 may be made of a rubber material, and the second sealing members 553 and 853 may be made of a sponge material.

In one embodiment, the first sealing members 552 and 852 and the second sealing members 553 and 853 are made of the same material and may have different densities.

In one embodiment, the first sealing members 552 and 852 may have a first density, and the second sealing members 553 and 853 may have a second density that is lower than the first density.

In one embodiment, the first sealing members 552 and 852 may have a first thickness T1, and the second sealing members 553 and 853 may have a second thickness T2 that is different from the first thickness T1. there is.

In one embodiment, first through-holes 552a and 852a are formed in the first sealing members 552 and 852 in the thickness direction, and the second sealing members 553 and 853 are formed in the thickness direction, Second through-holes 553a and 853a may be formed to substantially overlap the first through-holes 552a and 852a based on the thickness direction.

In one embodiment, the waterproof assembly (550,850) is disposed between the first sealing member (552,852) and the second sealing member (553,853), and the first sealing member (552,852) and the second sealing member (553,853) ) is disposed between the first adhesive layer (554,854) connecting the second sealing members (553,853) and the vibrating membrane (551,851), and connecting the second sealing member (553,853) and the vibrating membrane (551,851) It further includes at least one of the second adhesive layers 555 and 855, and each of the first adhesive layers 554 and 855 and the second adhesive layers 555 and 855 has adhesive through holes 554a, 555a, 556a and 854a formed at overlapping positions, respectively. 855a and 856a) can be formed, respectively.

In one embodiment, the waterproofing assemblies (550,850) are disposed on the surface of the vibration membrane (551,851) so as to be opposed to the first sealing members (552,852), and the waterproofing assemblies (550,850) are attached to the front frame (320,520). It may further include a third adhesive layer (556,856) for attachment.

In one embodiment, the waterproof assemblies 550 and 850 are seated on the front frames 320 and 520, and a seating portion 520a is formed to maintain the position of the mounted waterproof assembly 550 and 850, and the seating portion 520a ) may be in communication with the acoustic pipe 521.

In one embodiment, when looking at the first substrate surface 531, the seating portion 520a supports at least a portion of the edge of the waterproof assembly 550 and 850 in a state in which the waterproof assembly 550 and 850 are seated. It can be formed into a shape.

In one embodiment, when the printed circuit boards 431, 432, and 530 are fixed to the front frames 320 and 520, the second substrate surface 532 is in contact with at least a portion of the front frames 320 and 520, and the waterproof assembly (550, 850) may be disposed between the printed circuit boards (431, 432, 530) and the front frames (320, 520) in a compressed state in the thickness direction.

In one embodiment, based on the thickness direction of the waterproof assembly 850, the first sealing member 852 is configured to operate in a state where the printed circuit boards 431, 432, and 530 are fixed to the front frames 320 and 520. 2 A first part 852-1 in contact with the substrate surface 532, and connected to the first part 852-1 to face the vibration membrane 851, and the first part 852-1 and a second part (852-2) formed of a different material, wherein the second sealing member (853) includes a third part (853-1) facing the second part (852-2), and It may include a fourth part 853-2 connected to the third part 853-1 to face the vibrating membrane 851 and made of a different material from the third part 853-1.

In one embodiment, the front frames 320 and 520 may be positioned between the display 361 and the printed circuit boards 431, 432, and 530.

A waterproof assembly (550, 850) for transmitting sound according to an embodiment includes first sealing surfaces (5521, 8521) and second sealing surfaces (5522, 8522) opposite to the first sealing surfaces (5521, 8521). It includes a first sealing member (552,852) comprising a first compressible material, a third sealing surface (5531,8531) facing the second sealing surface (5522,8522), and a third sealing surface (5531). , 8531), a second sealing member (553, 853) including a fourth sealing surface (5532, 8532) opposite the second sealing surface (5532, 8532), and a second sealing member (553, 853) comprising a second compressible material, and a first sealing member (553, 853) facing the fourth sealing surface (5532, 8532). It includes vibration surfaces (5511, 8511) and second vibration surfaces (5512, 8512) opposite to the first vibration surfaces (5511, 8511), and vibrates by sound waves and includes a vibrating membrane (551, 851) for transmitting sound. , first through-holes (552a, 852a) formed in the thickness direction are formed in the first sealing members (552, 852), and first through-holes (552a, 852a) are formed in the thickness direction in the second sealing members (553, 853), and the first through-holes ( Second through-holes 553a and 853a are formed having substantially the same shape as 552a and 852a, and the first and second materials may be different.

In one embodiment, based on the elastic modulus according to compression in the thickness direction, the first sealing members 552 and 852 and the second sealing members 553 and 853 may have different elastic modulus.

In one embodiment, the first material may include a rubber material, and the second material may include a sponge material.

In one embodiment, the waterproof assembly (550,850) is disposed between the first sealing member (552,852) and the second sealing member (553,853) to form the first sealing member (552,852) and the second sealing member (553,853). A second adhesive layer disposed between the first adhesive layer (554,854), the second sealing member (553,853), and the vibrating membrane (551,851) and connecting the second sealing member (553,853) and the vibrating membrane (551,851). (555,855), and a third adhesive layer (556;856) disposed on the surface of the vibrating membrane (551;851) so as to be opposed to the first sealing member (552;852).

The electronic devices 301 and 501 according to one embodiment include a housing 310 and 510 that forms the exterior of the electronic device 301 and 501 and includes sound holes 313, 315, 355, and 513 for transmitting sound, and a front surface of the electronic device 301 and 501. A display 361 that is visually exposed to the outside through (310a), an acoustic pipe 521 disposed in the internal space 511 of the housing 310 and 510, communicates with the acoustic holes 313, 315, 355, and 513 and through which the sound can move. ) is formed, disposed in the internal space 511, a first substrate surface 531, and a second substrate opposite to the first substrate surface 531 and facing the front frame (320,520) A printed circuit board (431, 432, 530) including a substrate surface (532) and an opening (530a) formed to penetrate and overlap the acoustic conduit (521) when viewed from the first substrate surface (531). Sound modules 440 and 540 disposed at 531 and including a microphone 541 positioned to overlap the opening 530a when looking at the first substrate surface 531, and the first substrate surface 531 ) is disposed between the printed circuit board (431, 432, 530) and the front frame (320, 520) so as to overlap the opening (530a), and the microphone ( 541), and includes a waterproof assembly (550,850) for transmitting sound through vibration, wherein the waterproof assembly (550,850) is directed toward a vibrating membrane (551,851) for transmitting sound through vibration and the printed circuit board (431,432,530). A first sealing member (552,852) disposed on the vibrating membrane (551,851) and made of a rubber material, and a second sealing member (552,852) disposed between the vibrating membrane (551,851) and the first sealing member (552,852) and made of a sponge material. A first adhesive layer disposed between the members 553 and 853, the first sealing members 552 and 852 and the second sealing members 553 and 853, and connecting the first sealing members 552 and 852 and the second sealing members 553 and 853. (554,854), a second adhesive layer (555,855) disposed between the second sealing member (553,853) and the vibrating membrane (551,851) and connecting the second sealing member (553,853) and the vibrating membrane (551,851), and A third adhesive layer (556,856) is disposed on the surface of the vibration membrane (551,851) opposite to the first sealing member (552,852) and attaches the waterproof assembly (550,850) to the front frame (320,520), The first sealing members 552 and 852 and the second sealing members 553 and 853 may differ in at least one of density and thickness.

Claims (20)

In the electronic device (301; 501),
It includes a front side (310a), a back side (310b) opposite to the front side (310a), and sides (311c; 510c) surrounding an internal space 511 between the front side (310a) and the back side (310b), and an external a housing (310;510) in which sound holes (313;315;355;513) are formed for transmitting sound from the interior space (511);
A display 361 visually exposed to the outside through the front surface 310a;
A front frame (320; 520) disposed in the internal space (511), communicating with the sound hole (313; 315; 355; 513) and forming an acoustic conduit (521) through which the sound can move;
disposed in the internal space 511, a first substrate surface 531, a second substrate surface 532 opposite to the first substrate surface 531 and facing the front frame 320; A printed circuit board (431, 432, 530) including an opening (530a) formed through and overlapping the acoustic conduit (521) when looking at the first substrate surface (531);
An audio module (440;540) disposed on the first substrate surface (531) and including a microphone (541) positioned to overlap the opening (530a) when looking at the first substrate surface (531); and
When looking at the first substrate surface 531, it is disposed between the printed circuit board (431; 432; 530) and the front frame (320; 520) so as to overlap the opening (530a), and the acoustic pipe ( It includes a waterproof assembly (550; 850) for transmitting sound from 521 to the microphone (541) through the opening (530a),
The waterproof assembly (550;850),
a vibrating membrane (551;851) for transmitting sound through vibration;
a first sealing member (552;852) disposed on the vibration membrane (551;851) to face the printed circuit board (431;432;530) and formed of a compressible material; and
It is disposed between the vibrating membrane (551; 851) and the first sealing member (552; 852) and includes a second sealing member (553; 853) made of a compressible material,
The first sealing member (552; 852) and the second sealing member (553; 853) have different physical properties.
According to paragraph 1,
The first sealing member (552; 852) and the second sealing member (553; 853) have different elastic moduli.
According to claim 1 or 2,
The first sealing member (552; 852) and the second sealing member (553; 853) are formed of different materials.
According to any one of claims 1 to 3,
The first sealing member (552; 852) is made of a rubber material,
The second sealing member (553; 853) is formed of a sponge material.
According to any one of claims 1 to 4,
The first sealing member (552; 852) and the second sealing member (553; 853) are formed of the same material and have different densities.
According to any one of claims 1 to 5,
The first sealing member (552; 852) has a first density, and the second sealing member (553; 853) has a second density lower than the first density.
According to any one of claims 1 to 6,
The first sealing member (552;852) has a first thickness (T1),
The second sealing member (553; 853) has a second thickness (T2) different from the first thickness (T1).
According to any one of claims 1 to 7,
First through holes 552a and 852a are formed in the first sealing member 552 and 852 in the thickness direction,
The second sealing member (553; 853) includes a second through hole (553a) formed through the thickness direction and substantially overlapping the first through hole (552a; 852a) with respect to the thickness direction. 853a) is formed, an electronic device.
According to any one of claims 1 to 8,
The waterproof assembly (550;850),
A second sealing member is disposed between the first sealing member (552;852) and the second sealing member (553;853) and connects the first sealing member (552;852) and the second sealing member (553;853). 1 adhesive layer (554;854); and
A second adhesive layer ( 555;855), and includes at least one of
An electronic device in which adhesive through-holes (554a; 555a; 556a; 854a; 855a; 856a) are formed in each of the first adhesive layer (554; 854) and the second adhesive layer (555; 855) at overlapping positions. .
According to any one of claims 1 to 9,
The waterproof assembly (550;850),
A third third member is disposed on the surface of the vibration membrane (551;851) opposite to the first sealing member (552;852) and attaches the waterproof assembly (550;850) to the front frame (320;520). The electronic device further comprising an adhesive layer (556;856).
According to any one of claims 1 to 10,
The waterproof assembly (550;850) is seated on the front frame (320;520), and a seating portion (520a) is formed to maintain the position of the seated waterproof assembly (550;850),
The seating portion (520a) is in communication with the acoustic pipe (521).
According to any one of claims 1 to 11,
When looking at the first substrate surface 531,
The seating portion (520a) is formed to support at least a portion of an edge of the waterproof assembly (550;850) when the waterproof assembly (550;850) is seated.
According to any one of claims 1 to 12,
With the printed circuit board (431; 432; 530) fixed to the front frame (320; 520),
The second substrate surface 532 is in contact with at least a portion of the front frame (320; 520),
The waterproof assembly (550; 850) is compressed in the thickness direction and is disposed between the printed circuit board (431; 432; 530) and the front frame (320; 520).
According to any one of claims 1 to 13,
Based on the thickness direction of the waterproof assembly 850,
The first sealing member 852 is,
a first portion (852-1) in contact with the second substrate surface (532) when the printed circuit board (431, 432, 530) is fixed to the front frame (320; 520); and
A second part (852-2) connected to the first part (852-1) facing the vibrating membrane (851) and made of a different material from the first part (852-1),
The second sealing member 853 is,
a third part (853-1) facing the second part (852-2); and
Electronic, including a fourth part (853-2) connected to the third part (853-1) to face the vibrating membrane (851) and formed of a different material from the third part (853-1) Device.
According to any one of claims 1 to 14,
The front frame (320;520) is located between the display (361) and the printed circuit board (431;432;530).
In the waterproof assembly (550; 850) for transmitting sound,
A first sealing member ( 552;852);
It includes a third sealing surface (5531;8531) facing the second sealing surface (5522;8522) and a fourth sealing surface (5532;8532) facing the third sealing surface (5531;8531), and compression. a second sealing member (553; 853), possibly comprising a second material; and
It includes a first vibration surface (5511;8511) facing the fourth sealing surface (5532;8532) and a second vibration surface (5512;8512) opposite to the first vibration surface (5511;8511), and vibrating by sound waves. and includes a vibrating membrane (551; 851) for transmitting sound,
First through holes (552a; 852a) formed in the thickness direction are formed in the first sealing member (552; 852),
Second through holes (553a; 853a) are formed in the second sealing member (553; 853) in the thickness direction and have substantially the same shape as the first through holes (552a; 852a),
The first material and the second material are different.
According to clause 16,
Based on the elastic modulus according to compression in the thickness direction,
The first sealing member (552; 852) and the second sealing member (553; 853) have different elastic moduli.
According to claim 16 or 17,
The first material includes a rubber material,
A waterproof assembly, wherein the second material includes a sponge material.
According to any one of claims 16 to 18,
A second sealing member (552;852) is disposed between the first sealing member (552;852) and the second sealing member (553;853) and connects the first sealing member (552;852) and the second sealing member (553;853). 1 adhesive layer (554;854);
A second adhesive layer 555 disposed between the second sealing member (553;853) and the vibrating membrane (551;851) and connecting the second sealing member (553;853) and the vibrating membrane (551;851). ;855); and
The waterproof assembly further comprises a third adhesive layer (556; 856) disposed on the surface of the vibrating membrane (551; 851) so as to be opposed to the first sealing member (552; 852).
In the electronic device (301; 501),
A housing (310;510) that forms the exterior of the electronic device (301;501) and includes sound holes (313;315;355;513) for transmitting sound;
a display 361 visually exposed to the outside through the front 310a of the electronic device 301;501;
A front frame 320 is disposed in the internal space 511 of the housing 310; 510, communicates with the sound hole 313; 315; 355; 513, and forms an acoustic conduit 521 through which the sound can move. ;520);
disposed in the internal space 511, a first substrate surface 531, a second substrate surface 532 opposite to the first substrate surface 531 and facing the front frame 320; A printed circuit board (431, 432, 530) including an opening (530a) formed through and overlapping the acoustic conduit (521) when looking at the first substrate surface (531);
An audio module (440;540) disposed on the first substrate surface (531) and including a microphone (541) positioned to overlap the opening (530a) when looking at the first substrate surface (531); and
When looking at the first substrate surface 531, it is disposed between the printed circuit board (431; 432; 530) and the front frame (320; 520) so as to overlap the opening (530a), and the acoustic pipe ( It includes a waterproof assembly (550; 850) for transmitting sound from 521 to the microphone (541) through the opening (530a),
The waterproof assembly (550;850),
a vibrating membrane (551;851) for transmitting sound through vibration;
a first sealing member (552;852) disposed on the vibration membrane (551;851) to face the printed circuit board (431;432;530) and made of a rubber material;
a second sealing member (553;853) disposed between the vibrating membrane (551;851) and the first sealing member (552;852) and made of a sponge material;
disposed between the first sealing member (552;852) and the second sealing member (553;853), and connecting the first sealing member (552;852) and the second sealing member (553;853). first adhesive layer (554;854);
A second adhesive layer ( 555;855); and
A third third member is disposed on the surface of the vibration membrane (551;851) opposite to the first sealing member (552;852) and attaches the waterproof assembly (550;850) to the front frame (320;520). Comprising an adhesive layer (556; 856),
The first sealing member (552; 852) and the second sealing member (553; 853) are different in at least one of density and thickness.

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