KR20240043621A - Electronic device including resonance space of speaker - Google Patents

Abstract

According to one embodiment, the electronic device includes a housing including a first side, a second side opposite the first side, and a side between the first side and the second side, the first side and the second side. A second speaker comprising a frame structure disposed between two sides and forming a side surface, one side (a) partially in contact with a portion of the frame structure, and another side opposite the one side, a second speaker comprising: It may include a bracket in contact with a portion of the housing forming the surface, and a spacer disposed between the other surface and the bracket. The first space between the bracket and the spacer may be connected to a second space between the other surface and the spacer.

Description

Electronic device including the resonance space of the speaker {ELECTRONIC DEVICE INCLUDING RESONANCE SPACE OF SPEAKER}

Embodiments of the present disclosure relate to an electronic device including a resonant space of a speaker.

The electronic device may include a speaker to provide an auditory signal (eg, an audio signal) to the user. Audio signals may be transmitted to the outside of the housing through speakers placed inside the electronic device.

An electronic device including a speaker may include a resonance space for a low-pitched audio signal with a relatively low frequency. To ensure the audio performance of a speaker, a relatively large resonance space may be required for the electronic device.

According to one embodiment, the electronic device includes a housing including a first side, a second side opposite the first side, and a side between the first side and the second side, the first side and the second side. A speaker disposed between two sides and including a frame structure forming a side surface, one side (a) partially in contact with a portion of the frame structure, and another side opposite to the one side, the speaker comprising: It may include a spacer disposed between the other side and the second side. According to one embodiment, the spacer includes a first part in contact with the other surface of the speaker and spaced apart from the second surface, and a second part in contact with the second surface and spaced apart from the other surface of the speaker. It may include a portion and a step between the first portion and the second portion. When the second surface is viewed from above, the first part may face the second part based on the step portion. The first space between the second side and the first part is formed from the one side of the speaker, through the through hole of the frame structure arranged with respect to the one side of the speaker, toward the speaker hole on the side. (towards) It may be connected to a second space between the other side and the second part for a resonance space for the transmitted audio signal.

According to one embodiment, the electronic device includes a first plate forming a first side, a second plate forming a second side opposite to the first side, and disposed between the first side and the second side. A speaker comprising a housing including a frame structure forming a side surface, one side (a) partially in contact with a portion of the frame structure, and another side opposite to the one side, the other side and a spacer disposed between the second surface and a metal plate disposed on the spacer and in contact with the second plate. According to one embodiment, the spacer includes a first part in contact with the other side of the speaker and spaced apart from the metal plate, a second part in contact with the metal plate and spaced apart from the other side of the speaker, and , may include a step between the first part and the second part. According to one embodiment, when the second surface is viewed from above, the first part may face the second part based on the step portion. According to one embodiment, the first space between the second side and the first part is formed from the one side of the speaker through the through hole of the frame structure arranged with respect to the one side of the speaker. It may be connected to a second space between the other side and the second part for a resonance space for an audio signal transmitted toward the speaker hole on the side.

1 is a block diagram of an electronic device in a network environment according to various embodiments.
FIG. 2 is a diagram illustrating an electronic device according to an embodiment.
Figure 3 is an exploded perspective view of an electronic device according to an embodiment.
Figure 4 is an exploded perspective view of a region of an electronic device including a speaker, according to one embodiment.
Figure 5 is a schematic cross-sectional view of a region including a speaker, according to one embodiment.
Figure 6 is a perspective view of a spacer, according to one embodiment.
FIG. 7A is a cross-sectional view of a region including spacers of an exemplary speaker, according to one embodiment.
FIG. 7B is a cross-sectional view of a region including an exemplary extended spacer, according to an embodiment.
8 is a cross-sectional view of an area including an exemplary bracket disposed between a spacer and a back plate, according to one embodiment.
Figure 9 is a perspective view showing an exemplary coupling structure of a bracket and a spacer according to an embodiment.
Figure 10 is a graph showing the sound pressure level according to the volume of the resonance space of the speaker, according to one embodiment.

1 is a block diagram of an electronic device in a network environment, according to various embodiments.

Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes a main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device 101 includes a main processor 121 and a secondary processor 123, the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, co-processor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself, where artificial intelligence is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 to communicate within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for the communication method used in the communication network, such as the first network 198 or the second network 199, is connected to the plurality of antennas by, for example, the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

FIG. 2 is a diagram illustrating an electronic device according to an embodiment.

Referring to FIG. 2 , the electronic device 200 according to one embodiment may include a housing 210 that forms the exterior of the electronic device 200. For example, housing 210 surrounds a first side (or front) 200A, a second side (or back) 200B, and a space between the first side 200A and the second side 200B. may include a third side (or side) 200C. In one embodiment, housing 210 has a structure (e.g., the frame structure of FIG. 3 ) that forms at least a portion of first side 200A, second side 200B, and/or third side 200C. 240)).

The electronic device 200 according to one embodiment may include a substantially transparent front plate 202. In one embodiment, front plate 202 may form at least a portion of first side 200A. In one embodiment, the front plate 202 may include, but is not limited to, a glass plate including various coating layers, or a polymer plate, for example.

The electronic device 200 according to one embodiment may include a substantially opaque rear plate 211. In one embodiment, the rear plate 211 may form at least a portion of the second surface 200B. In one embodiment, back plate 211 may be formed by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. You can.

The electronic device 200 according to one embodiment may include a side bezel structure (or side member) 218 (eg, the side wall 241 of the frame structure 240 in FIG. 3). In one embodiment, side bezel structure 218 may be combined with front plate 202 and/or back plate 211 to form at least a portion of third side 200C of electronic device 200. For example, the side bezel structure 218 may form all of the third side 200C of the electronic device 200, or in another example, the side bezel structure 218 may form the front plate 202 and/or Together with the back plate 211, the third side 200C of the electronic device 200 may be formed.

Unlike the illustrated embodiment, when the third side 200C of the electronic device 200 is partially formed by the front plate 202 and/or the rear plate 211, the front plate 202 and/or the rear plate 211 The plate 211 may include a region that is curved and extends seamlessly from its edge toward the rear plate 211 and/or the front plate 202 . The extended area of the front plate 202 and/or the rear plate 211 may be, for example, located at both ends of a long edge of the electronic device 200, but according to the above-described example, It is not limited.

In one embodiment, side bezel structure 218 may include metal and/or polymer. In one embodiment, the back plate 211 and the side bezel structure 218 may be formed integrally and may include the same material (eg, a metal material such as aluminum), but are not limited thereto. For example, the back plate 211 and the side bezel structures 218 may be formed of separate construction and/or may include different materials.

In one embodiment, the electronic device 200 includes a display 201, an audio module 203, 204, and 207, a sensor module (not shown), a camera module 205, 212, and 213, a key input device 217, It may include at least one of a light emitting device (not shown) and/or a connector hole 208. In another embodiment, the electronic device 200 may omit at least one of the above components (e.g., key input device 217 or a light emitting device (not shown)) or may additionally include other components.

In one embodiment, display 201 (e.g., display module 160 of Figure 2) may be visually exposed through a significant portion of front plate 202. For example, at least a portion of display 201 may be It may be visible through the front plate 202 forming the first side 200A. In one embodiment, the display 201 may be disposed on the back of the front plate 202.

In one embodiment, the outer shape of the display 201 may be substantially the same as the outer shape of the front plate 202 adjacent to the display 201. In one embodiment, in order to expand the area to which the display 201 is visually exposed, the distance between the outer edge of the display 201 and the outer edge of the front plate 202 may be formed to be substantially the same.

In one embodiment, the display 201 (or the first side 200A of the electronic device 200) may include a screen display area 201A. In one embodiment, the display 201 may provide visual information to the user through the screen display area 201A. In the illustrated embodiment, when the first surface 200A is viewed from the front, the screen display area 201A is shown to be located inside the first surface 200A, spaced apart from the outer edge of the first surface 200A. However, it is not limited to this. In another embodiment, when the first side 200A is viewed head on, at least a portion of an edge of the screen display area 201A substantially coincides with an edge of the first side 200A (or the front plate 202). It could be.

In one embodiment, the screen display area 201A may include a sensing area 201B configured to obtain biometric information of the user. Here, the meaning of “the screen display area 201A includes the sensing area 201B” can be understood as at least a portion of the sensing area 201B being overlapped with the screen display area 201A. there is. For example, the sensing area 201B, like other areas of the screen display area 201A, can display visual information by the display 201 and can additionally acquire the user's biometric information (e.g., fingerprint). It can mean area. In another embodiment, the sensing area 201B may be formed in the key input device 217.

In one embodiment, the display 201 may include an area where the first camera module 205 (eg, the camera module 180 of FIG. 2) is located. In one embodiment, an opening is formed in the area of the display 201, and a first camera module 205 (e.g., a punch hole camera) is at least partially disposed within the opening to face the first side 200A. You can. In this case, the screen display area 201A may surround at least a portion of the edge of the opening. In another embodiment, the first camera module 205 (e.g., an under display camera (UDC)) may be placed below the display 201 to overlap the area of the display 201. In this case, the display 201 can provide visual information to the user through the area, and additionally, the first camera module 205 is positioned in a direction toward the first side 200A through the area of the display 201. A corresponding image can be obtained.

In one embodiment, the display 201 may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer that detects a magnetic field-type stylus pen. .

In one embodiment, the audio modules 203, 204, and 207 (e.g., audio module 170 in FIG. 2) may include microphone holes 203 and 204 and speaker holes 207.

In one embodiment, the microphone holes 203 and 204 include a first microphone hole 203 formed in a portion of the third side 200C and a second microphone hole 204 formed in a portion of the second side 200B. may include. Microphones (not shown) may be placed inside the microphone holes 203 and 204 to acquire external sounds. The microphone may include a plurality of microphones to detect the direction of sound.

In one embodiment, the second microphone hole 204 formed in a partial area of the second surface 200B may be disposed adjacent to the camera modules 205, 212, and 213. For example, the second microphone hole 204 may acquire sound according to the operation of the camera modules 205, 212, and 213. However, it is not limited to this.

In one embodiment, the speaker hole 207 may include an external speaker hole 207 and a receiver hole (not shown) for a call. The external speaker hole 207 may be formed in a portion of the third side 200C of the electronic device 200. In another embodiment, the external speaker hole 207 may be implemented as one hole with the microphone hole 203. Although not shown, a receiver hole (not shown) for a call may be formed in another part of the third side 200C. For example, the receiver hole for a call may be formed on the third side 200C opposite the external speaker hole 207. For example, based on the illustration in FIG. 2, the external speaker hole 207 is formed on the third side 200C corresponding to the lower part of the electronic device 200, and the receiver hole for a call is formed on the electronic device 200. It may be formed on the third side 200C corresponding to the upper end. However, it is not limited to this, and in another embodiment, the call receiver hole may be formed in a location other than the third surface 200C. For example, a receiver hole for a call may be formed by a spaced space between the front plate 202 (or display 201) and the side bezel structure 218.

In one embodiment, the electronic device 200 includes at least one speaker (not shown) configured to output sound to the outside of the housing 210 through the external speaker hole 207 and/or the call receiver hole (not shown). ) may include.

In one embodiment, a sensor module (not shown) (e.g., sensor module 176 in FIG. 2) generates an electrical signal or data value corresponding to the internal operating state of the electronic device 200 or the external environmental state. can be created. For example, the sensor module may include a proximity sensor, HRM sensor, fingerprint sensor, gesture sensor, gyro sensor, barometric pressure sensor, magnetic sensor, acceleration sensor, grip sensor, color sensor, IR (infrared) sensor, biometric sensor, temperature sensor, It may include at least one of a humidity sensor or an illuminance sensor.

In one embodiment, the camera modules 205, 212, and 213 (e.g., the camera module 180 in FIG. 2) are a first camera module disposed to face the first side 200A of the electronic device 200. 205), a second camera module 212 arranged to face the second surface 200B, and a flash 213.

In one embodiment, the second camera module 212 may include a plurality of cameras (eg, a dual camera, a triple camera, or a quad camera). However, the second camera module 212 is not necessarily limited to including a plurality of cameras and may include one camera.

In one embodiment, the first camera module 205 and the second camera module 212 may include one or more lenses, an image sensor, and/or an image signal processor.

In one embodiment, flash 213 may include, for example, a light emitting diode or a xenon lamp. In another embodiment, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be placed on one side of the electronic device 200.

In one embodiment, the key input device 217 (eg, input module 150 in FIG. 2) may be disposed on the third side 200C of the electronic device 200. In other embodiments, the electronic device 200 may not include some or all of the key input devices 217, and the key input devices 217 that do not include other forms such as soft keys on the display 201. It can be implemented as:

In one embodiment, the connector hole 208 may be formed on the third side 200C of the electronic device 200 to accommodate a connector of an external device. A connection terminal (eg, connection terminal 178 in FIG. 2) that is electrically connected to a connector of an external device may be disposed in the connector hole 208. The electronic device 200 according to one embodiment may include an interface module (eg, interface 177 in FIG. 2) for processing electrical signals transmitted and received through the connection terminal.

In one embodiment, the electronic device 200 may include a light emitting device (not shown). For example, the light emitting device (not shown) may be disposed on the first surface 200A of the housing 210. The light emitting device (not shown) may provide status information of the electronic device 200 in the form of light. In another embodiment, the light emitting device (not shown) may provide a light source linked to the operation of the first camera module 205. For example, the light emitting device (not shown) may include an LED, an IR LED, and/or a xenon lamp.

Figure 3 is an exploded perspective view of an electronic device according to an embodiment.

Hereinafter, overlapping descriptions of components having the same reference numerals as the above-described components will be omitted.

Referring to FIG. 3, the electronic device 200 according to one embodiment includes a frame structure 240, a first printed circuit board 250, a second printed circuit board 252, a cover plate 260, and a battery. It may include (270).

In one embodiment, the frame structure 240 includes a side wall 241 that forms the exterior of the electronic device 200 (e.g., the third side 200C of FIG. 2) and extending inward from the side wall 241. It may include a support portion 243. In one embodiment, frame structure 240 may be disposed between display 201 and back plate 211. In one embodiment, sidewalls 241 of frame structure 240 may surround the space between back plate 211 and front plate 202 (and/or display 201), and frame structure 240 The support portion 243 may extend from the side wall 241 within the space. According to one embodiment, the side wall 241 forming the side of the electronic device 200 (e.g., the side 200C in FIG. 2) is a speaker hole 207 connecting the inside and outside of the electronic device 200. may include. The speaker hole 207 may penetrate the side wall 241. An audio signal output from a speaker disposed inside the electronic device 200 (e.g., speaker 410 in FIG. 4) may be transmitted to the outside of the electronic device 200 through the speaker hole 207.

In one embodiment, frame structure 240 may support or accommodate other components included in electronic device 200. For example, the display 201 may be disposed on one side of the frame structure 240 facing in one direction (e.g., +z direction), and the display 201 may be disposed on the support portion 243 of the frame structure 240. It can be supported by . For another example, a first printed circuit board 250, a second printed circuit board 252, and a battery 270 are provided on the other side of the frame structure 240 facing in a direction opposite to the one direction (e.g., -z direction). ), and the second camera module 212 may be disposed. The first printed circuit board 250, the second printed circuit board 252, the battery 270, and the second camera module 212 are attached to the side wall 241 and/or the support portion 243 of the frame structure 240. Each can be seated in a recess defined by

In one embodiment, the first printed circuit board 250, the second printed circuit board 252, and the battery 270 may each be combined with the frame structure 240. For example, the first printed circuit board 250 and the second printed circuit board 252 may be fixed to the frame structure 240 through a coupling member such as a screw. For example, the battery 270 may be fixed to the frame structure 240 through an adhesive member (eg, double-sided tape). However, it is not limited to the above-described examples.

In one embodiment, the cover plate 260 may be disposed between the first printed circuit board 250 and the back plate 211. In one embodiment, a cover plate 260 may be disposed on the first printed circuit board 250. For example, the cover plate 260 may be disposed on a side of the first printed circuit board 250 facing the -z direction.

In one embodiment, the cover plate 260 may at least partially overlap the first printed circuit board 250 about the z-axis. In one embodiment, the cover plate 260 may cover at least a portion of the first printed circuit board 250 . Through this, the cover plate 260 protects the first printed circuit board 250 from physical shock or the connector coupled to the first printed circuit board 250 (e.g., connector 34 in FIG. 3) is separated. can be prevented.

In one embodiment, the cover plate 260 is fixedly disposed on the first printed circuit board 250 through a coupling member (e.g., a screw), or is coupled with the first printed circuit board 250 through the coupling member. Can be coupled to frame structure 240.

In one embodiment, display 201 may be disposed between frame structure 240 and front plate 202. For example, the front plate 202 may be disposed on one side (e.g., +z direction) of the display 201, and the frame structure 240 may be disposed on the other side (e.g., -z direction).

In one embodiment, front plate 202 may be coupled with display 201. For example, the front plate 202 and the display 201 may be adhered to each other through an optical adhesive member (eg, optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

In one embodiment, front plate 202 may be coupled with frame structure 240. For example, the front plate 202 may include an outer portion extending outside the display 201 when viewed in the z-axis direction, and the outer portion of the front plate 202 and the frame structure 240 ( For example, it may be adhered to the frame structure 240 through an adhesive member (eg, double-sided tape) disposed between the side walls 241). However, it is not limited to the above-mentioned examples.

In one embodiment, the first printed circuit board 250 and/or the second printed circuit board 252 include a processor (e.g., processor 120 of FIG. 2) and a memory (e.g., memory 130 of FIG. 2). ), and/or an interface (e.g., interface 177 of FIG. 2) may be installed. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. Memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device 200 to an external electronic device and may include a USB connector, SD card/MMC connector, or audio connector. In one embodiment, the first printed circuit board 250 and the second printed circuit board 252 may be operatively or electrically connected to each other through a connecting member (eg, a flexible printed circuit board).

In one embodiment, battery 270 (eg, battery 189 in FIG. 2 ) may supply power to at least one component of electronic device 200 . For example, the battery 270 may include a rechargeable secondary battery or fuel cell. At least a portion of the battery 270 may be disposed on substantially the same plane as the first printed circuit board 250 and/or the second printed circuit board 252.

The electronic device 200 according to one embodiment may include an antenna module (not shown) (eg, the antenna module 197 of FIG. 2). In one embodiment, the antenna module may be disposed between the rear plate 211 and the battery 270. The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. For example, the antenna module may perform short-distance communication with an external device or wirelessly transmit and receive power to and from an external device.

In one embodiment, the first camera module 205 (e.g., front camera) is framed so that the lens can receive external light through some area of the front plate 202 (e.g., front side 200A in FIG. 2). It may be disposed on at least a portion of structure 240 (eg, support portion 243).

In one embodiment, the second camera module 212 (e.g., a rear camera) may be disposed between the frame structure 240 and the rear plate 211. In one embodiment, the second camera module 212 may be electrically connected to the first printed circuit board 250 through a connection member (eg, connector). In one embodiment, the second camera module 212 may be positioned so that the lens can receive external light through the camera area 284 of the rear plate 211 of the electronic device 200.

In one embodiment, the camera area 284 may be formed on the surface of the back plate 211 (eg, the back side 200B in FIG. 2). In one embodiment, the camera area 284 may be formed to be at least partially transparent to allow external light to enter the lens of the second camera module 212. In one embodiment, at least a portion of the camera area 284 may protrude from the surface of the back plate 211 at a predetermined height. However, it is not limited to this, and in another embodiment, the camera area 284 may form substantially the same plane as the surface of the rear plate 211.

In one embodiment, the housing 210 of the electronic device 200 may refer to a configuration or structure that forms at least part of the exterior of the electronic device 200. In this regard, at least some of the front plate 202, frame structure 240, and/or back plate 211 that form the exterior of the electronic device 200 are referred to as the housing 210 of the electronic device 200. It can be.

Figure 4 is an exploded perspective view of a region of an electronic device including a speaker, according to one embodiment.

Referring to FIG. 4 , the electronic device 200 includes a side bezel structure 218, a speaker 410, a printed circuit board 420 (e.g., the second printed circuit board 252 of FIG. 3), and a bracket 430. ) may include.

According to one embodiment, it may include a side bezel structure (or side member) 218 (e.g., the side wall 241 of the frame structure 240 of FIG. 3). The side bezel structure 218 or frame structure 240 is disposed between a first side (e.g., first side 200A and second side 200B in FIG. 2) of housing 210 and has a side ( 400a) (e.g., the third side 200C of FIG. 2) may be formed. The side surface 400a may be a surface disposed between the first surface 200A and the second surface 200B. In one embodiment, the side bezel structure 218 includes a front plate 202 (e.g., front plate 202 in FIG. 2) and/or a back plate 211 (e.g., back plate 211 in FIG. 2). Combined, they may form at least a portion of the side 400a of the electronic device 200. The side bezel structure 218 may include a seating groove 401 and a speaker hole 207.

According to one embodiment, the speaker 410 may be configured to provide an audio signal to the outside of the electronic device 200. For example, the speaker 410 may include a diaphragm, a voice coil, and/or a magnet. The voice coil may provide kinetic energy to generate physical vibration (e.g., vibration) of the diaphragm. For example, a voice coil can generate kinetic energy based on its interaction with the magnet and current associated with the audio signal. The diaphragm can generate vibration and provide sound waves based on the kinetic energy.

According to one embodiment, the side bezel structure 218 may include a seating groove 401 in which the speaker 410 is seated. The speaker 410 may be placed in the seating groove 401. The speaker 410 may be supported by the seating groove 401. For example, the speaker 410 may be inserted into the seating groove 401 or may be fixed to the seating groove 401 through an adhesive member. An elastic member (not shown) may be disposed between the speaker 410 and the seating groove 401. For example, the elastic member may include an adhesive material. The elastic member can reduce damage to the speaker 410 due to external shock. The side bezel structure 218 can connect the inner space of the seating groove 401 and the speaker hole 207.

According to one embodiment, the spacer 411 may be placed on the speaker 410. The spacer 411 may be disposed between the speaker 410 and the second surface 200B of the housing 210. The spacer 411 can pressurize a part of the speaker 410. For example, when the electronic device 200 is assembled, the spacer 411 is attached to the second side 200B of the housing 210 or the rear plate 211 constituting the second side 200B (e.g., FIG. 2 It can be pressed by the rear plate 211). As the pressed spacer 411 presses the speaker 410, the speaker 410 can be placed between the spacer 411 and the seating groove 401. The speaker 410 may be substantially fixed to a designated position (eg, within the seating groove 401) within the housing 210 by applying pressure to the spacer 411 and the seating groove 401. The substantially fixed may include slightly moving due to an external impact or flowing within a specified range. When providing an audio signal from the speaker 410, the spacer 411 fixes the speaker 410 to the seating groove 401 to prevent shaking of the speaker 410 or collision between the speaker 410 and the internal structure. noise can be reduced. The spacer 411 has been described as being in direct contact with the rear plate 211 constituting the second surface 200B of the housing 210, but the spacer 411 is not limited thereto. The electronic device 200 may further include a mechanism for pressing the spacer 411. For example, the electronic device 200 may include a speaker 410 and a bracket 430 surrounding the printed circuit board 420. The bracket 430 can press the speaker 410 and the spacer 411 by being assembled with the side bezel structure 218.

According to one embodiment, when the bracket 430 is assembled to the side bezel structure 218, the bracket 430 may contact the spacer 411 disposed on the speaker 410. For example, upon assembly of the bracket 430 and the side bezel structure 218, the bracket 430 may press the spacer 411. As the pressed spacer 411 presses the speaker 410, the speaker 410 can be placed between the spacer 411 and the seating groove 401. The spacer 411 can reduce the generation of noise caused by the movement of the speaker 410 by fixing the speaker 410 to the seating groove 401.

According to one embodiment, the printed circuit board 420 may be placed on one side of the electronic device 200. The printed circuit board 420 may be distinguished from a printed circuit board (eg, the first printed circuit board 250 of FIG. 3) on which a processor (eg, the processor 120 of FIG. 1) is disposed. The printed circuit board 420 may be connected to an interface for connection to an external electronic device or to an electronic component (eg, speaker 410) disposed on the side of the electronic device 200. The printed circuit board 420 may be electrically connected to the printed circuit board on which the processor 120 is disposed through a flexible printed circuit board or cable. The speaker 410 may receive electrical signals related to audio signals through the printed circuit board 420.

The electronic device 200 may include a resonance space. The resonant space may generate vibrations that generate the audio signal of the speaker 410. The resonance space may be a space for vibration of the audio signal. The speaker 410 may require a large resonance space to provide audio signals in a low frequency band. As the electronic device 200 is assembled, the space between the rear of the speaker 410 (e.g., the surface on which the spacer 411 is placed) and the bracket 430 or the rear of the speaker 410 and the housing 210 The space between the two sides (200B) can be used as a resonance space. The resonance space can be reduced by the volume of the spacer 411 disposed to fix the speaker 410. In order to provide a low-pitched audio signal, it is necessary to compensate for the resonance space reduced by the volume of the spacer 411.

The structure for compensating the resonance space will be described below in FIG. 5.

Figure 5 is a schematic cross-sectional view of a region including a speaker, according to one embodiment. Figure 6 is a perspective view of a spacer, according to one embodiment.

Referring to FIG. 5 , the electronic device 200 may include a housing 210, a frame structure 240, a speaker 410, and a spacer 510. The housing 210 has a first side 200A, a second side 200B opposite the first side 200A, and a third side between the first side 200A and the second side 200B ( 200C) (or side) may be included. The housing 210 may provide an internal space for electronic components for the electronic device 200. The housing 210 may include a rear plate 211 and a front plate (e.g., the front plate 202 of FIG. 2) that supports the display 201 (e.g., the display 201 of FIG. 2). The rear plate 211 may form the second surface 200B, and the front plate 202 may form the first surface 200A. The front plate 202 may be spaced apart from the rear plate 211 to allow for the internal space.

According to one embodiment, the frame structure 240 may be disposed between the first side 200A and the second side 200B. For example, frame structure 240 may be disposed between front plate 202 and back plate 211. The frame structure 240 may provide an internal space together with the front plate 202 and the rear plate 211. The frame structure 240 may form a third surface 200C. The frame structure 240 may extend from the third side 200C into the interior space. The extended portion may be formed as a separate structure and may be attached or joined to the frame structure 240 constituting the third surface 200C. The extended portion may be formed integrally with the frame structure 240.

According to one embodiment, the frame structure 240 may include a structure for seating electronic components. For example, the frame structure 240 may include a seating groove 401 to support the speaker 410. The seating groove 401 may be formed in an extending portion of the frame structure 240 within the internal space of the housing 210.

According to one embodiment, the speaker 410 may include one side 410a that is partially in contact with a portion of the frame structure 240 and another side 410b opposite the one side 410a. . The one surface 410a of the speaker 410 may be a radiation surface through which audio signals are radiated. The other side 410b of the speaker 410 may be a side opposite to the radiation side. For example, one side 410a of the speaker 410 may face the sound duct 501 through which audio signals are transmitted. The sound duct 501 may be connected to the speaker hole 207 (eg, the speaker hole 207 in FIG. 2). The speaker 410 can transmit an audio signal to the sound duct 501 and transmit the audio signal to the outside through the speaker hole 207.

According to one embodiment, the other side 410b of the speaker 410 may face the resonance space. The resonance space may be a space surrounded by the other side 410b of the speaker 410, the side of the speaker 410, and a portion of the housing 210. The resonance space may include a first space 503 and a second space 502. The first space 503 and the second space 502 may be partitioned by a spacer 510 (eg, spacer 411 in FIG. 4).

According to one embodiment, the spacer 510 may include a first part 511 and a second part 512. The spacer 510 may be formed of a metal material. The spacer 510 may be formed of a thin plate and include a curved portion. The spacer 510 may include a first part 511, a second part 512, and a step 513.

The first part 511 may be in contact with the other surface 410b of the speaker 410. The above-mentioned meaning of contacting may include not only the case where A is directly attached to B, but also the case where an elastic member or adhesive member is embedded between A and B for the protection of B or the connection between B and A. For example, the first portion 511 may directly contact the other side 410b of the speaker 410. For example, an elastic member 599 may be interposed between the first portion 511 and the other surface 410b. The elastic member 599 can prevent the other surface 410b of the speaker 410 from being damaged by the spacer 510. The elastic member 599 may include poron, rubber, foam, or silicon. The elastic member 599 may further include an adhesive material to secure the spacer 510 to a designated position on the speaker 410. The first part 511 may be a part of the spacer 510 that presses the speaker 410.

According to one embodiment, the second part 512 may be in contact with the inner surface of the housing 210 facing the second surface 200B and may be spaced apart from the other surface 410b of the speaker 410. The second portion 512 may be in contact with a portion of the housing 210 forming the second surface 200B. For example, the second part 512 may be in contact with the rear plate 211. The second part 512 may be fixed to the rear plate 211. For example, the second part 512 and the back plate 211 may be formed through a double injection process. The rear plate 211 may be formed of a polymer material. According to one embodiment, the second part 512 may be inserted into a groove formed in the rear plate 211 and fixed to the rear plate 211. The spacer 510 is fixed to the rear plate 211 and can press the speaker 410 through the first part 511 when assembling the electronic device 200. The pressurized speaker 410 may be secured to a designated location within the housing 210 .

According to one embodiment, the step portion 513 may connect the first part 511 and the second part 512. The first part 511 is disposed on the other side 410b of the speaker 410, and the second part 512 is a rear plate spaced apart from the first part 511 to form the second side 200B. Since it is disposed at 211, a step may be formed between the first part 511 and the second part 512. Since the step portion 513 connects the first part 511 and the second part 512, the first part 511 and the second part 512 can be formed as one body.

According to one embodiment, the electronic device provides a resonance space surrounded by the surface of the speaker 410 and the internal mechanism of the electronic device 200, excluding the surface connected to the front 410a radiation area of the speaker 410. can do. The resonance space may be a space around the speaker 410, excluding the sound duct 501. For example, the resonance space may include a first space 503 and a second space 502 between the speaker 410 and the fixture inside the electronic device 200.

According to one embodiment, the first space 503 may be a space between the first portion 511 and a portion of the rear plate 211 corresponding to the second surface 200B. For example, the first space 503 may be surrounded by a portion of the second surface 200B, the first portion 511, and the step portion 513. The first space 503 may be an empty space.

According to one embodiment, the second space 502 may refer to the remaining space excluding the sound duct 501 among the spaces in contact with the speaker 410. For example, the second space 502 may be a space surrounding the other surface 410b and the side surface of the speaker 410. The second space 502 may be a space between the other side 410b of the speaker 410 and the spacer 510 and a space between the side of the speaker 410 and another device in the electronic device 200.

According to one embodiment, the first space 503 is formed from the side surface 410a of the speaker 410 through the acoustic duct 501 formed in the frame structure arranged with respect to the side surface of the speaker 410a. It may be connected to the second space 502 between the other side 401b and the second part 512 for a resonance space for the audio signal transmitted toward the speaker hole 207 formed in . The first space 503 may be connected to the second space through an opening formed in the step portion 513. According to one embodiment, the first space 503 may be connected to the second space 502 through a gap between a plurality of stepped portions.

According to one embodiment, when the spacer 510 fills the first space 503 with another material, the resonance space may be the second space 502. According to one embodiment, the spacer 510 including the first part 511, the second part 512, and the step portion 513 is formed as a plate and is bent at the step portion 513 to form the first space ( 503) can be provided. According to one embodiment, the spacer 510 may increase the resonance space of the speaker 410 by connecting the first space 503 and the second space 502. Based on the increase in the resonance space of the speaker 410, resonance in the low-pitched range can be provided, thereby improving the performance of the speaker 410. When an elastic member made of urethane or poron is used instead of the spacer 510, the resonance space disposed on the other side 410b of the speaker 410 may be reduced. . The spacer 510 can buffer external shock applied to the speaker 410. The spacer 510 can expand the resonance space by connecting the space between the other side 410b of the speaker 410 and the rear plate 211 facing the other side 410b with the resonance space. The electronic device 200 including the spacer 510 can improve low-band audio performance by expanding the resonance space while having robustness against external shock.

Referring to FIG. 6 , the spacer 510 may include a first part 511 and a second part 512 . The first part 511 may be in contact with the other surface 410b of the speaker 410. The first part 511 can expand the contact area with the other surface 410b of the speaker 410, thereby widening the pressure area of the speaker 410. For example, the first part 511 may include a core part 601 and extension parts 603 extending from an edge of the core part 601. The core portion 601 and the extension portions 603 may be substantially planar. The spacer 510 including extended portions 603 can expand the contact area with the speaker 410. The spacer 510, which has a large contact area with the speaker 410, may provide increased coupling force with the speaker 410 according to the assembly of the electronic device 200 (e.g., the electronic device 200 of FIG. 2). . Based on the increased coupling force, the speaker 410 can be fixed to a designated location inside the electronic device 200.

According to one embodiment, the spacer 510 may include a step portion 513 extending at an inclination from the first portion 511 from the ends of the extension portions 603 . The step portion 513 may extend substantially perpendicular to the first portion 511, but may include a portion having a curved surface. The spacer 510 may be formed by pressing a metal plate. For example, the spacer 510 may be formed on a metal plate through a press process. For example, the metal plate may be pressed by a press corresponding to the first part 511 to form the first part 511 that is recessed from the second part 512 . The curved portion of the spacer 510 may be formed through a pressing process. The second part 512 of the spacer 510 formed through a press process may be formed in a direction away from the first part.

According to one embodiment, the step portion 513 may be plural. The plurality of stepped portions may be spaced apart from each other. The gap between the stepped portions may open a portion of the first space 503 . For example, the first space 503 may be connected to the second space 502 through the gap between the stepped portions. The step portion 513 may surround a portion of the edge of the first portion 511. For example, one step 513 of the plurality of step parts may be disposed between the first part 511 and the second part 512. For example, a plurality of step portions including the step portion 513 or the second portions 512 may extend from a portion of the extension portions 603 of the first portion 511 to be spaced apart from each other. . The step portion 513 may extend from the end of the extension portions 603 spaced apart from the boundary between the core portion 601 and the extension portions 603. The volume of the first space 503 may be determined based on the length of the step portion 513.

According to the above-described embodiment, the electronic device 200 includes a first side 200A, a second side 200B opposite to the first side 200A, and the first side 200A and the second side. A housing 210 including a third face 200C between the faces 200B, a frame disposed between the first face 200A and the second face 200B, and forming the third face 200C. A speaker comprising a structure 240, one side 410a partially in contact with a portion of the frame structure 240, and another side 410b opposite the one side 410a. It may include 410 and a spacer 510 disposed between the other surface 410b and the second surface 200B. According to one embodiment, the spacer 510 includes a first part 511 that contacts the other surface 410b of the speaker 410 and is spaced apart from the second surface 200B, and the second surface A second part 512 in contact with (200B) and spaced apart from the other surface 410b of the speaker 410, and a step portion 513 between the first part 511 and the second part 512. ) may include. When the second surface 200B is viewed from above, the first part 511 may face the second part 512 based on the step portion 513. The first space 503 between the second surface 200B and the first portion 511 is formed from the one surface 410a of the speaker 410. ) for a resonant space for the audio signal transmitted towards the speaker hole 207 of the third side 200C through the acoustic duct 501 of the frame structure 240 arranged with respect to the It may be connected to the second space 502 between the other surface 410b and the second part 512.

According to the above-described embodiment, the electronic device 200 can expand the resonance space from the second space 502 to the first space 503. Based on the expanded resonance space, the speaker 410 of the electronic device 200 can provide improved performance in the low-pitched tone band. For example, an expanded resonance space can provide a wider resonance space for resonance of audio signals in the low-pitched range.

FIG. 7A is a cross-sectional view of a region including spacers of an exemplary speaker, according to one embodiment. FIG. 7B is a cross-sectional view of a region including an exemplary extended spacer, according to an embodiment.

Referring to FIG. 7A, the electronic device 200 includes a display 201 disposed toward the first side 200A, a front plate 202 disposed on the display 201, and a front plate 202 disposed on the first side 200A. It may include a rear plate 212 disposed toward the opposite second side 200B. The electronic device 200 may include a speaker 410 disposed therein. For example, the speaker 410 may be placed in the internal space between the front plate 202 and the rear plate 211. One side 410a of the speaker 410 has a first side 200A. You can head towards it.

According to one embodiment, another side 410b opposite to the one side 410a may face the second side 200B. The one surface 410a may be in contact with a portion of the frame structure 240. For example, one side 410a of the speaker 410 may be attached to the frame structure 240 and the adhesive member 789. For example, adhesive member 789 may be disposed between speaker 410 and frame structure 240. The adhesive member 789 is disposed between the speaker 410 and the frame structure 240, thereby allowing the speaker 410 to be seated on the frame structure 240. The audio signal transmitted from one side 410a of the speaker 410 may be transmitted to the speaker hole 207 (eg, the speaker hole 207 in FIG. 2) through the sound duct 501. A portion of the path extending to the speaker hole 207 through the acoustic duct 501 may be isolated from the internal space of the electronic device 200 by a sealing member 790.

According to one embodiment, the sealing member 790 may transmit an audio signal emitted from one surface 410a of the speaker 410. The sealing member 790 can prevent dust and moisture from flowing into the electronic device 200 through the speaker hole 207. The sealing member 790 may include a membrane material. For example, an audio signal may be emitted from one side 410a of the speaker 410. The audio signal emitted from one side of the speaker 410 may be transmitted to the speaker hole 207 along the acoustic path (PA). The sealing member 790 may be disposed on the acoustic path. The sealing member 790 may transmit audio signals transmitted along the acoustic path. The sealing member 790 can prevent external foreign substances introduced through the acoustic path from moving into the interior of the electronic device 200.

According to one embodiment, the other surface 410b of the speaker 410 may contact the spacer 710a. The spacer 710a may include a first portion 511 in contact with the other surface 410b. The spacer 710a may include a step 513 that separates the first portion 511 from the rear plate 211 . The spacer 710a may include a second portion 512 configured to be fixed to a fixture within the electronic device 200. The second part 512 may be inserted into the bracket 430 in contact with the rear plate 211. The bracket 430 may be formed integrally with the rear plate 211. For example, the second part 512 may be inserted into and fixed to a groove formed in the rear plate 211.

According to one embodiment, the end of the second part 512 may be fixed to the rear plate 211 or the bracket 430 at the coupling area 709a. The bracket 430 or the rear plate 211 may be made of a polymer material. The second part 512 may be coupled to the bracket 430 or the rear plate 211 through an injection process. The first space 703a may be surrounded by the first portion 511, the step portion 513, and the bracket 430. The second space 702a may be a space between the other side 410b of the speaker 410 and the fixture and a space between the side of the speaker 410 and the fixture. The second space 702a may be surrounded by the frame structure 240 and the rear plate 211 or bracket 430 to be used as a resonance space. The second space 702a is a space between the frame structure 240 and another device (e.g., the rear plate 211 or the bracket 430), and is isolated from other spaces inside the electronic device 200 by a sealing member. You can. The second space 702a may be connected to the first space 703a to expand the resonance space. To fix the speaker 410, the first part 511 of the spacer 710a and the other side 410b of the speaker 410 may contact each other. When the length l1 of the spacer 710a is shorter than the width of the speaker 410, the spacer 710a can transmit pressing force to the speaker 410. If the pressing force transmitted to the speaker 410 through the spacer 710a is insufficient, the length l1 of the spacer 710a may be made long.

Referring to FIG. 7B, the electronic device 200 includes a display 201 disposed toward the first side 200A, a front plate 202 disposed on the display 201, and a front plate 202 disposed on the first side 200A. It may include a rear plate 212 disposed toward the opposite second side 200B. The electronic device 200 may include a speaker 410 disposed therein. One side 410a of the speaker 410 may face the first side 200A. Another side 410b opposite to the one side 410a may face the second side 200B. The one surface 410a may be in contact with a portion of the frame structure 240. The audio signal transmitted from one side 410a of the speaker 410 may be transmitted to the speaker hole 207 (eg, the speaker hole 207 in FIG. 2) through the sound duct 501. A portion of the path extending through the acoustic duct 501 to the speaker hole 207 may be isolated from the internal space of the electronic device 200 by a sealing member 790.

According to one embodiment, the other side 410b of the speaker 410 may contact the spacer 710b. In the coupling area 709b including the second part 512, an end of the second part 512 may be fixed to the rear plate 211 or the bracket 430. The second part 512 may be coupled to the bracket 430 or the rear plate 211 through an injection process. The first space 703a may be surrounded by a spacer 710b and a bracket 430. The second space 702a may be a space between the side of the speaker 410 and the device. The second space 702a may be surrounded by the frame structure 240 and the rear plate 211 to be used as a resonance space. To fix the speaker 410, a portion of the spacer 710b (eg, the first portion 511) and the other surface 410b of the speaker 410 may contact each other. If the length l2 of the spacer 710b is longer than the width ls of the speaker 410, it may be difficult for the spacer 710b to transmit pressing force to the speaker 410. In order to efficiently transmit the pressing force of the spacer 710b, a protruding area 720 that protrudes from the bracket 430 toward the spacer 710b may be included.

According to one embodiment, in order to increase the pressing force transmitted to the speaker 410, the spacer 710b may be formed to be long. The protruding area 720 can increase the transmission power of the pressing force transmitted to the speaker 410 of the long spacer 710b.

The electronic device 200 according to the above-described embodiment may include spacers 710a and 710b that provide the first space 703a or 703b to secure a resonance space. The spacers 710a and 710b may have the same structure as shown in FIG. 6 to connect the second spaces 702a and 702b and the first spaces 703a and 703b. Based on the expanded resonance space, the electronic device 200 can provide the speaker 410 with improved performance.

According to one embodiment, a structure for supporting the spacer 710b may be included to increase the pressing force of the spacer 710b for fixing the speaker 410 to the speaker 410. The protruding area 720 that protrudes toward the spacer 710b can provide uniform transmission of pressing force to the speaker 410.

8 is a cross-sectional view of an area including an exemplary bracket disposed between a spacer and a back plate, according to one embodiment. Figure 9 is a perspective view showing an exemplary coupling structure of a bracket and a spacer according to an embodiment.

Referring to FIG. 8, the electronic device 200 includes a display 201 disposed toward the first side 200A, a front plate 202 disposed on the display 201, and a front plate 202 disposed on the first side 200A. It may include a rear plate 212 disposed toward the opposite second side 200B. The electronic device 200 may include a speaker 410 disposed therein. The speaker 410 may be placed in a structure formed on the frame structure 240 (eg, the seating groove 401 in FIG. 4). For example, a portion of one side 410a of the speaker 410 may be in contact with the frame structure 240. The audio signal transmitted from one side 410a of the speaker 410 may be transmitted to the speaker hole 207 (eg, the speaker hole 207 in FIG. 2) through the sound duct 501. A portion of the path extending through the acoustic duct 501 to the speaker hole 207 may be isolated from the internal space of the electronic device 200 by a sealing member 790.

According to one embodiment, the other surface 410b of the speaker 410 may contact the spacer 810. The spacer 810 may include a first part 511 in contact with the other surface 410b. The spacer 810 may include a step 513 that separates the first portion 511 from the rear plate 211 . The step portion 513 may separate the first portion 511 of the spacer 810 from the metal plate 801 . The spacer 810 may include a second portion 512 configured to be fixed to a fixture within the electronic device 200. The second part 512 may be joined to the metal plate 801 in contact with the rear plate 211. A portion of the metal plate 801 may be inserted into the bracket 430. For example, the end of the metal plate 801 may be bent to be inserted into the bracket 430. The bracket 430 may include a groove for engaging the end of the metal plate 801. The bracket 430 may be formed integrally with the rear plate 211. For example, the end of the metal plate 801 may be inserted into and fixed to a groove formed in the rear plate 211.

According to one embodiment, the end of the metal plate 801 may be fixed to the back plate 211 or the bracket 430 at the coupling area 809. The end of the metal plate 801 may be coupled to the bracket 430 or the rear plate 211 through an injection process. The second part 512 of the spacer 810 may be bonded to one surface of the metal plate 801 joined through an injection process. For example, in the joining area 809, the second portion 512 may be welded and fixed to one surface of the metal plate 801.

According to one embodiment, the first space 803 may be surrounded by the first portion 511, the step portion 513, and the metal plate 801. The second space 802 may be a space between the other side 410b of the speaker 410 and the metal plate 801 and a space between the side of the speaker 410 and the fixture. The second space 802 may be surrounded by the frame structure 240 and the rear plate 211 to be used as a resonance space. The second space 802 is a space between the frame structure 240 and other devices, and may be isolated from other spaces inside the electronic device 200 by a sealing member. The second space 802 may be connected to the first space 803 to expand the resonance space.

Referring to FIG. 9 , the metal plate 801 may be joined to the spacer 810. The spacer 810 may include a first part 511 and a second part 512. The first part 511 of the spacer 810 may include a core part 901 and extension parts 902. By including extension parts 902 extending from the core part 901, the first part 511 can expand the contact area with the other surface 410b of the speaker 410. there is. Based on the increased contact area, the first part 511 can increase the pressure area of the speaker 410. The core portion 901 and the extension portions 902 may be substantially planar. The spacer 910 including the extension portions 902 can expand the contact area with the speaker 410. The spacer 910, which has a large contact area with the speaker 410, can provide increased coupling force applied to the speaker 410 as the electronic device 200 (e.g., the electronic device 200 of FIG. 2) is assembled. You can. Based on the increased coupling force, the speaker 410 can be fixed to a designated location inside the electronic device 200.

According to one embodiment, the spacer 910 may include a step portion 513 extending at an inclination from the first portion 511 from the ends of the extension portions 902 . The step portion 513 may extend substantially perpendicular to the first portion 511, but may include a portion having a curved surface. The second part 512 of the spacer 510 may be formed in a direction away from the first part.

According to one embodiment, the first part 511 of the spacer 910 may be spaced apart from the metal plate 801. As the spacer 910 except for the second part 512 is spaced apart from the metal plate 801, the first space (e.g., the first space in FIG. 8) between the spacer 910 and the metal plate 801 (803)) and the space between the other side 410b of the speaker 410 (e.g., the speaker 410 of FIG. 8) and the metal plate 801 can be connected. For example, the first space 803 and the second space 802 may be connected to each other through the gap g between the spacer 910 and the metal plate 801. By connecting the first space 803 and the second space 802, the resonance space can be expanded.

According to one embodiment, the second part 512 of the spacer 910 may be joined to the metal plate 801 at the coupling area 809. The spacer 910 formed of a metal material may be welded to the metal plate 801. For example, the spacer 910 and the metal plate 801 may include a steel use stainless (SUS) material.

According to the above-described embodiment, the spacer 910 may be bonded to the metal plate 801 formed of the same material. The spacer 910 is formed integrally with the metal plate 801 to increase bonding strength. The spacer 910 may separate the metal plate 801 from the first portion 511 to provide space for expansion of the resonance space. The electronic device 200 having a resonance space expanded into the space between the spacer 910 and the metal plate 801 can provide improved speaker performance.

Figure 10 is a graph showing the sound pressure level according to the volume of the resonance space of the speaker, according to one embodiment.

Referring to Figure 10, the sound pressure level according to the resonance space of the speaker is shown.

The X-axis represents the frequency of the audio signal and the unit may be Hz. The Y-axis represents the sound pressure level (SPL) of the audio signal and the unit may be dB.

Graph 1001 shows the sound pressure level when the volume of the total resonance space of the speaker is 0.36 cc. Graph 1002 shows the sound pressure level when the volume of the total resonance space of the speaker is 0.26 cc. Graph 1003 represents the sound pressure level when the volume of the entire resonant space of the speaker is 0.23 cc.

Graph 1001 represents the sound pressure level of the electronic device 200, according to one embodiment. For example, the resonant space may extend from a second space 502 between the speaker and the fixture to a first space 503 between the back plate and the first portion of the spacer facing the speaker. The electronic device 200 having the expanded resonance space may have an increased sound pressure level in a low band (eg, 100 Hz to 1000 Hz).

Graph 1002 and graph 1003 may be examples of using only the second space 502 as a resonance space. Comparing graph 1002 and graph 1003 with graph 1001, in the low band, the sound pressure level may be relatively low. For example, at a frequency of 400 Hz, the graph 1001 representing an electronic device with an expanded resonant space has a sound pressure level of approximately 55 dB, and an electronic device using only the second space 502 as a resonant space has a sound pressure level of approximately 50 dB. You can have levels.

The electronic device according to the above-described embodiment can provide improved performance in the low-pitched sound band by providing an expanded resonance space.

According to the above-described embodiment, an electronic device (e.g., electronic device 200 in FIG. 2) has a first side (e.g., first side 200A in FIG. 2) and a second side opposite to the first side. (e.g., a housing (e.g., a housing of FIG. 2) including a second side (200B) of FIG. 2, and a side between the first side and the second side (e.g., a third side (200C) of FIG. 2) 210). The electronic device includes a frame structure (e.g., frame structure 240 in FIG. 2) disposed between the first surface and the second surface and forming the side surface. The electronic device 200 has one side (a) partially in contact with a part of the frame structure (e.g., one side 410a in FIG. 5), and the other side (a) opposite to the one side (a). another) side (e.g., the other side 410b in Figure 5) and a speaker (e.g., the speaker 410 in Figure 4). According to one embodiment, the electronic device includes the other side (e.g., the other side 410b in Figure 5). It may include a spacer (e.g., spacer 510 in Figure 5) disposed between the speaker and the second side. The spacer is disposed on the other side of the speaker and is spaced apart from the second side. a first part (e.g., the first part 511 in FIG. 5), and a second part (e.g., the second part 512 in FIG. 5) that is in contact with the second surface and is spaced apart from the other side of the speaker. )). The spacer may further include a step portion (e.g., step portion 513 in Figure 5). The step portion may be disposed between the first part and the second part. According to one embodiment, when the second surface is viewed from above, the first part may face the second part based on the step. According to one embodiment, the resonance space is the first space. It may include a second space (e.g., the first space 503 in Figure 5) and a second space (e.g., the second space 502 in Figure 5). The first space is the second space and the first space. According to one embodiment, the first space is formed from the one side of the speaker through a through hole of the frame structure arranged with respect to the one side of the speaker, It may be connected to the second space between the other side and the second part to create a resonance space for an audio signal transmitted toward the speaker hole.

According to the above-described embodiment, the electronic device can expand the resonance space from the second space to the first space. Based on the expansion of the resonance space, speakers in electronic devices can provide improved performance in the low frequency range. The expanded resonance space can provide a wide resonance space for resonance of audio signals in the low-pitched range.

According to one embodiment, the second part may extend from the step along the second surface in a direction away from the first part.

According to the above-described embodiment, by including a step portion, a first space can be formed between the first part of the spacer and the speaker. The second part may increase the volume of the first space by extending outside the first space.

According to one embodiment, the housing may include a first plate forming the first surface and a second plate forming the second surface. The spacer may be fixed to the second plate.

According to one embodiment, a portion of the spacer may be disposed in a groove formed on the inner surface of the second plate facing the housing.

According to the above-described embodiment, the second plate can fix the spacer. Depending on the assembly of the electronic device, the second plate may press the speaker through the spacer. Through the pressure, the speaker can be secured to a designated location within the electronic device.

According to one embodiment, the second plate and the spacer may include a metal material. A portion of the spacer may be bonded to the inner surface of the second plate facing the housing.

According to the above-described embodiment, the second plate can fix the spacer. The second plate and the spacer may be made of a metal material and may be joined. For example, the second plate may be welded at a joint portion (eg, a contact portion) with the space. The second plate and the spacer bonded together may pressurize the speaker as the electronic device is assembled. The pressurized speaker may be secured at a designated location within the housing.

According to one embodiment, the first portion of the spacer may be interposed between the second surface of the housing and the speaker. The first part may be in contact with the other side of the speaker.

According to one embodiment, the second surface of the housing, the spacer, and the frame structure may surround the second space.

According to the above-described embodiment, the spacer includes a first part and a second part having a step from each other, thereby providing additional space for expansion of the resonance space.

According to one embodiment, it may further include a bracket (eg, bracket 430 in FIG. 4) disposed within the housing and in contact with a portion of the housing forming the second surface. A portion of the spacer may be inserted into the groove of the bracket.

According to the above-described embodiment, the spacer may be fixed to an internal structure of the electronic device. The fixed spacer may pressurize the speaker, depending on the assembly of the electronic device. The pressurized speaker can be secured to a designated location inside the electronic device.

According to one embodiment, the electronic device may further include a metal plate disposed within the housing and in contact with a portion of the housing forming the second surface. According to one embodiment, the spacer may be bonded to the metal plate.

According to one embodiment, the housing includes a bracket disposed between the first surface and the second surface, and a portion of an end of the metal plate may be fixed to the bracket by being inserted into the bracket.

By further including a metal plate, the bonding force of the spacer can be increased. The metal plate is fixed to a bracket within the housing, and the spacer bonded to the metal plate can pressurize the speaker when assembling the electronic device. The pressurized speaker can be held in a designated position. The space between the metal plate and the spacer can provide additional resonant space. The space between the metal plate and the spacer can improve the low-pitched tone performance of the speaker.

According to one embodiment, the step portion includes a plurality of step portions, and each of the plurality of step portions extends from each edge of the first portion to have an inclination with respect to the first portion and are spaced apart from each other. It can be. According to one embodiment, the spaced gaps between the plurality of stepped portions may connect the first space and the second space.

According to one embodiment, the volume of the first space may be determined based on the length of the step portion.

According to the above-described embodiment, the first part and the second surface of the spacer can be spaced apart from each other through the step portion. The spaced apart space can be used as an additional resonance space. The length of the step portion may be proportional to the volume of the additional resonance space.

According to one embodiment, when the spacer is viewed from the second surface toward the first surface, the second part may surround a portion of an edge of the first part.

According to one embodiment, the spacer may include a core portion of the first portion and a plurality of stepped portions extending from some of the edges of the core portion toward the second surface. According to one embodiment, the second part may be bent from each of the plurality of stepped parts and extend parallel to the second surface. The first space is surrounded by the first part, the plurality of steps, and a portion of the second surface, and the second space is surrounded by the second part, the plurality of steps, and the second surface. may be wrapped by another part of the speaker and another side of the speaker.

According to one embodiment, the step portions are spaced apart from each other, and the first space may be connected to the second space through a gap between the step portions.

According to the above-described embodiment, the spacer may provide an extension portion to increase the pressing force transmitted to the speaker. The spacer including the extension portion can increase the force transmitted to the speaker by increasing the contact area of the speaker. The step portions may be spaced apart from each other to connect the first space to the second space, which is a resonance space.

According to one embodiment, the frame structure includes a seating groove in which the speaker is placed, and the through hole may be connected to the speaker hole.

According to one embodiment, an electronic device (e.g., electronic device 200 in FIG. 2) includes a first plate (e.g., a front plate 202), a second plate (e.g., rear plate 211 in FIG. 2) forming a second side opposite to the first side (e.g., second side 200B in FIG. 2), and A housing (e.g., a frame structure 240 in FIG. 2) disposed between the first side and the second side and forming a side surface (e.g., the third side 200C in FIG. 2). Example: may include the housing 210 of FIG. 2). The electronic device has one side partially in contact with a portion of the frame structure (e.g., one side 410a in FIG. 5), and another side opposite to the one side (e.g., the other side 410b in FIG. 5). )) may include a speaker (e.g., speaker 410 of FIG. 4). The electronic device may include a spacer (eg, spacer 510 in FIG. 5) disposed between the other side and the second side. The electronic device may include a metal plate (eg, metal plate 801 in FIG. 8) disposed on the spacer and in contact with the second plate. According to one embodiment, the spacer is in contact with the other surface of the speaker and has a first part (e.g., first part 511 in FIG. 8) that is spaced apart from the metal plate and is in contact with the metal plate. , may include a second part (eg, second part 512 in FIG. 8) spaced apart from the other side of the speaker. The spacer may include a step (eg, step 513 in FIG. 8) between the first part and the second part. According to one embodiment, when the second surface is viewed from above, the first part may face the second part based on the step portion. The resonance space is a first space between the second surface and the first part (e.g., the first space 803 in FIG. 8) and a second space between the other surface and the second part (e.g., FIG. The second space (802) of 8 can be connected. The first space is a resonance for an audio signal transmitted from the one side of the speaker, through the through hole of the frame structure arranged with respect to the one side of the speaker, and toward the speaker hole on the side. For space, it may be connected to the second space.

According to the above-described embodiment, the electronic device can expand the resonance space from the second space to the first space. Based on the expansion of the resonance space, speakers in electronic devices can provide improved performance in the low frequency range. The expanded resonance space can provide a wide resonance space for resonance of audio signals in the low-pitched range.

According to one embodiment, the housing includes a bracket disposed between the first surface and the second surface, and a portion of an end of the metal plate may be fixed to the bracket by being inserted into the bracket.

By further including a metal plate, the bonding force of the spacer can be increased. The metal plate is fixed to a bracket within the housing, and the spacer bonded to the metal plate can pressurize the speaker when assembling the electronic device. The pressurized speaker can be held in a designated position. The space between the metal plate and the spacer can provide additional resonant space. The space between the metal plate and the spacer can improve the low-pitched tone performance of the speaker.

According to one embodiment, the step portion includes a plurality of step portions, and each of the plurality of step portions extends from each edge of the first portion to have an inclination with respect to the first portion and are spaced apart from each other. It can be. According to one embodiment, the spaced gaps between the plurality of stepped portions may connect the first space and the second space.

According to one embodiment, the volume of the first space may be determined based on the length of the step portion.

According to the above-described embodiment, the first part and the second surface of the spacer can be spaced apart from each other through the step portion. The spaced apart space can be used as an additional resonance space. The length of the step portion may be proportional to the volume of the additional resonance space.

Electronic devices according to various embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one component from another, and to refer to that component in other respects (e.g., importance or order) is not limited. One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.” When mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. It can be used as A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document are one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these. For example, a processor (e.g., processor 120) of a device (e.g., electronic device 101) may call at least one command among one or more commands stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments disclosed in this document may be provided and included in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play Store™) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to various embodiments, each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. there is. According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, or omitted. Alternatively, one or more other operations may be added.

Claims (20)

In the electronic device 200,
A housing including a first side 200A, a second side 200B opposite the first side 200A, and a side 200C between the first side 200A and the second side 200B. (210);
a frame structure 240 disposed between the first surface 200A and the second surface 200B and forming a side surface 200C;
a speaker (410) including one (a) side partially in contact with a portion of the frame structure (240) and another side opposite to the one side;
a bracket 430 disposed within the housing 210 and in contact with a portion of the housing 210 forming the second surface 200B; and
Includes a spacer (510; 710a; 710b; 810) disposed between the other surface and the bracket 430,
The spacers (510; 710a; 710b; 810) are,
a first part 511 in contact with the other surface of the speaker 410 and spaced apart from the second surface 200B;
a second portion 512 in contact with the bracket 430 and spaced apart from the other side of the speaker 410; and
It includes a step portion 513 between the first part 511 and the second part 512,
When the second surface 200B is viewed from above, the first part 511 faces the second part 512 with respect to the step portion 513,
The first space 503 between the bracket 430 and the first part 511 is,
Connected to the second space 502 between the other surface and the second part 512 to form a resonance space of the speaker 410,
Electronic device (200).
According to paragraph 1,
The second part 512 is,
Contacting the step portion 513 and extending in a direction away from the first portion 511 along the second surface 200B,
Electronic device (200).
According to claim 1 or 2,
The housing 210 is,
a first plate 202 forming the first surface 200A; and
a second plate 211 forming the second surface 200B;
The spacers (510; 710a; 710b; 810) are,
Fixed to the second plate 211,
Electronic device (200).
According to any one of claims 1 to 3,
Some of the spacers 510; 710a; 710b; 810,
Inserted into a groove formed on the inner surface of the second plate 211 facing the housing 210,
Electronic device (200).
According to any one of claims 1 to 4,
The second plate 211 and the spacer (510; 710a; 710b; 810) include a metal material,
Some of the spacers 510; 710a; 710b; 810,
Joined to the inner surface of the second plate 211 facing the housing 210,
Electronic device (200).
According to any one of claims 1 to 5,
The first portion 511 of the spacer 510; 710a; 710b; 810,
disposed between the second surface 200B of the housing 210 and the speaker 410, and configured to press the other surface of the speaker 410,
Electronic device (200).
According to any one of claims 1 to 6,
The second space 502 is,
Surrounded by the second side 200B of the housing 210, the spacers 510; 710a; 710b; 810, and the frame structure 240,
Electronic device (200).
According to any one of claims 1 to 7,
Some of the spacers 510; 710a; 710b; 810,
Inserted into the groove of the bracket 430,
Electronic device (200).
According to any one of claims 1 to 8,
a metal plate 801 disposed within the housing 210 and in contact with a portion of the housing 210 forming the second surface 200B; It further includes,
The spacers (510; 710a; 710b; 810) are,
Joined to the metal plate 801,
Electronic device (200).
According to any one of claims 1 to 9,
The housing 210 is,
It includes a bracket 430 disposed between the first surface 200A and the second surface 200B,
A portion of the end of the metal plate 801 is,
Fixed to the bracket 430 by being inserted into the bracket 430,
Electronic device (200).
According to any one of claims 1 to 10,
The step portion 513 is,
Includes a plurality of stepped portions 513,
Each of the plurality of step portions 513,
Extending from each edge of the first part 511 to have an inclination with respect to the first part 511, and being spaced apart from each other,
The spaced gaps between the plurality of stepped portions 513 connect the first space 503 and the second space 502.
Electronic device (200).
According to any one of claims 1 to 11,
The volume of the first space 503 is,
Determined based on the length of the step portion 513,
Electronic device (200).
According to any one of claims 1 to 12,
When looking at the spacer (510; 710a; 710b; 810) from the second surface (200B) toward the first surface (200A),
The second part 512 is,
Surrounding a portion of the edge of the first portion 511,
Electronic device (200).
According to any one of claims 1 to 13,
The first part 511 is,
core part; and
It includes an extension portion extending from an edge of the core portion,
The step portion 513 is,
a plurality of stepped portions 513 extending from some of the edges of the extension portion toward the second surface 200B; Including,
The second part 512 is,
It is bent from each of the plurality of step portions 513 and extends parallel to the second surface 200B,
The first space 503 is,
Surrounded by the first portion 511, the plurality of stepped portions 513, and a portion of the second surface 200B,
The second space 502 is,
Surrounded by the second portion 512, the plurality of stepped portions 513, another part of the second surface 200B, and the other surface of the speaker 410,
Electronic device (200).
According to any one of claims 1 to 14,
The plurality of step portions 513 are spaced apart from each other,
The first space 503 is,
Connected to the second space 502 through a gap between the stepped portions 513,
Electronic device (200).
According to any one of claims 1 to 15,
The frame structure 240 is,
It includes a seating groove in which the speaker 410 is placed,
The through hole is,
Connected to the speaker 410 hole,
Electronic device (200).
In the electronic device 200,
A first plate 202 forming a first surface 200A, a second plate 211 forming a second surface 200B opposite to the first surface 200A, and the first surface 200A and a housing 210 disposed between the second surface 200B and including a frame structure 240 forming a side surface 200C;
a speaker (410) including one side partially in contact with a portion of the frame structure (240) and another side opposite the one side;
a spacer (510; 710a; 710b; 810) disposed between the other surface and the second surface (200B); and
It includes a metal plate 801 disposed on the spacer (510; 710a; 710b; 810) and in contact with the second plate 211,
The spacers (510; 710a; 710b; 810) are,
a first part 511 that contacts the other surface of the speaker 410 and is spaced apart from the metal plate 801;
a second portion 512 in contact with the metal plate 801 and spaced apart from the other side of the speaker 410; and
It includes a step portion 513 between the first part 511 and the second part 512,
When the second surface 200B is viewed from above, the first part 511 faces the second part 512 with respect to the step portion 513,
The first space 503 between the second surface 200B and the first part 511 is,
From the one side of the speaker 410, through the through hole of the frame structure 240 arranged with respect to the one side of the speaker 410, toward the hole of the speaker 410 on the side 200C ( toward) connected to a second space 502 between the other side and the second part 512, for a resonant space for the transmitted audio signal,
Electronic device (200).
According to clause 17,
The housing 210 is,
It includes a bracket 430 disposed between the first surface 200A and the second surface 200B,
A portion of the end of the metal plate 801 is,
Fixed to the bracket 430 by being inserted into the bracket 430,
Electronic device (200).
According to any one of claims 17 and 18,
The step portion 513 is,
Includes a plurality of stepped portions 513,
Each of the plurality of step portions 513,
Extending from each edge of the first part 511 to have an inclination with respect to the first part 511, and being spaced apart from each other,
The spaced gaps between the plurality of stepped portions 513 connect the first space 503 and the second space 502.
Electronic device (200).
According to any one of claims 17 to 19,
The volume of the first space 503 is,
Determined based on the length of the step portion 513,
Electronic device (200).

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