KR20240039567A - Display appartus having display module and manufacturing method thereof - Google Patents

Abstract

According to an example of the present disclosure, the display module is
The display module includes a substrate including a mounting surface on which a TFT layer (Thin Film Transistor) is formed, a side surface, and a back surface disposed on the opposite side of the mounting surface, a plurality of inorganic light-emitting elements mounted on the mounting surface, a TFT layer, and the plurality of An anisotropic conductive layer that electrically connects the inorganic light emitting element and is disposed on the upper surface of the TFT layer, a front cover that covers the entire surface of the anisotropic conductive layer, a side cover that surrounds the side, and a side end member that seals the outer end of the side cover. Includes. The side end of the front cover extends to an area outside the mounting surface, the side end of the anisotropic conductive layer extends to an area outside the mounting surface so as to be disposed at a position corresponding to the side end of the front cover, and the side cover extends to an area outside the mounting surface. It is provided to contact the lower surface of the anisotropic conductive layer corresponding to the area, and the side end member is provided to seal between the side end of the front cover and the side end of the anisotropic conductive layer.

Description

Display device including display module and manufacturing method thereof {DISPLAY APPARTUS HAVING DISPLAY MODULE AND MANUFACTURING METHOD THEREOF}

The present invention relates to a display device that displays images by combining modules in which self-emitting inorganic light-emitting devices are mounted on a substrate.

A display device is a type of output device that visually displays data information such as characters and figures and images.

In general, liquid crystal panels that require a backlight or OLED (Organic Light-Emitting Diode) panels, which are made of a film of organic compounds that emit light on their own in response to current, were mainly used as display devices. However, the liquid crystal panel has a slow response time, high power consumption, does not emit light on its own, and requires a backlight, making it difficult to compact. In addition, because OLED panels emit light on their own, they do not require a backlight and can be made thinner, but if the same screen is displayed for a long time, burn-in occurs (burn-in), in which certain parts of the previous screen remain the same even when the screen is changed as the life of the subpixel expires. Vulnerable to burn-in (deterioration) phenomenon. Accordingly, micro light-emitting diode (microLED or μLED) panels, which mount inorganic light-emitting devices on a substrate and use the inorganic light-emitting devices themselves as pixels, are being studied as a new panel to replace them.

A micro light emitting diode display panel (hereinafter referred to as micro LED panel) is one of the flat display panels and is composed of a plurality of inorganic light emitting diodes (inorganic LEDs) each measuring less than 100 micrometers.

These LED panels are also self-light-emitting devices, but as they are inorganic light-emitting devices, the burn-in phenomenon of OLED does not occur, and they have excellent brightness, resolution, power consumption, and durability.

Compared to liquid crystal display (LCD) panels that require a backlight, MicroLED display panels offer better contrast, response time, and energy efficiency. Both organic light-emitting diodes (organic LEDs) and microLEDs, which are inorganic light-emitting devices, have good energy efficiency, but microLEDs have better brightness, luminous efficiency, and longer lifespan than OLEDs.

In addition, by arranging the LEDs in pixel units on a circuit board, it is possible to manufacture a display module on a per-board basis, and it is easy to manufacture in various resolutions and screen sizes according to consumer orders.

The present disclosure relates to a display device and a manufacturing method thereof according to an example, and aims to provide a display module suitable for enlargement and technical features for protecting the display module from penetration of external solutions in a display device including the same.

In addition, it is intended to provide technical features for protecting the display module against static electricity in the display module and a display device including the same.

The technical problem to be achieved in this document is not limited to the technical problem mentioned above, and other technical problems not mentioned can be clearly understood by those skilled in the art from the description below. There will be.

According to an example of the present disclosure, a display module includes a substrate including a mounting surface on which a TFT layer (Thin Film Transistor) is formed, a side surface, and a back surface disposed on an opposite side of the mounting surface, and a plurality of inorganic light emitting devices mounted on the mounting surface. An anisotropic conductive layer that electrically connects the device, the TFT layer, and the plurality of inorganic light emitting devices and is disposed on an upper surface of the TFT layer, a front cover covering the entire surface of the anisotropic conductive layer, and a side cover surrounding the side surface. and a side end member sealing the outer end of the side cover.

A side edge of the front cover extends to an area outside the mounting surface.

A side end of the anisotropic conductive layer extends to an area outside the mounting surface so as to be disposed at a position corresponding to a side end of the front cover.

The side cover is provided to contact the lower surface of the anisotropic conductive layer corresponding to the outer area of the mounting surface.

The side end member is provided to seal between the side end of the front cover and the side end of the anisotropic conductive layer.

The front end of the side end member is arranged at a position corresponding to the front end of the front cover in the direction toward which the mounting surface faces.

It further includes a metal plate attached to the rear surface.

The side end member is provided to extend from a position corresponding to the front end of the front cover to at least a portion of the side of the metal plate.

The side cover is provided to extend from a lower surface of the anisotropic conductive layer corresponding to an area outside the mounting surface to at least a portion of a side surface of the metal plate.

The side end member is made of a moisture-proof material that prevents moisture from penetrating.

The side end member is made of a water-repellent material.

The side end member has a black color.

The side cover has a black color.

The side end member is made of a moisture-proof material that prevents moisture from penetrating.

The side cover is made of a water-repellent material.

The side end member is provided to seal between the front cover and the anisotropic conductive layer, between the anisotropic conductive layer and the side cover, and between the metal plate and the side cover.

According to an example of the present disclosure, in a display device including a display module array in which a plurality of display modules are horizontally arranged in an M*N matrix form and a frame supporting the plurality of display modules, the plurality of display modules include: A substrate including a mounting surface and a side surface on which a TFT layer (Thin Film Transistor) is formed, and a back surface disposed on an opposite side of the mounting surface, a plurality of inorganic light emitting elements mounted on the mounting surface, and the TFT layer and the plurality of inorganic light emitting devices. It electrically connects the device and includes an anisotropic conductive layer disposed on the upper surface of the TFT layer, a front cover covering the entire surface of the anisotropic conductive layer, a side cover surrounding the side, and a side end member sealing the outer end of the side cover. do.

A side edge of the front cover extends to an area outside the mounting surface.

A side end of the anisotropic conductive layer extends to an area outside the mounting surface so as to be disposed at a position corresponding to a side end of the front cover.

The side cover is provided to contact the lower surface of the anisotropic conductive layer corresponding to the outer area of the mounting surface.

The side end member is provided to seal between the side end of the front cover and the side end of the anisotropic conductive layer.

The front end of the side end member is arranged at a position corresponding to the front end of the front cover in the direction toward which the mounting surface faces.

It further includes a metal plate attached to the rear surface.

The side end member is provided to extend from a position corresponding to the front end of the front cover to at least a portion of the side of the metal plate.

The side cover is provided to extend from a lower surface of the anisotropic conductive layer corresponding to an area outside the mounting surface to at least a portion of a side surface of the metal plate.

The side end member is made of a moisture-proof material that prevents moisture from penetrating.

The side end member has a black color.

The side end member is provided to seal between the front cover and the anisotropic conductive layer, between the anisotropic conductive layer and the side cover, and between the metal plate and the side cover.

According to an example of the present disclosure, a display module includes a substrate including a mounting surface on which a TFT layer (Thin Film Transistor) is formed, a side surface, and a back surface disposed on an opposite side of the mounting surface, and a plurality of inorganic light emitting devices mounted on the mounting surface. electrically connecting the device, the TFT layer, and the plurality of inorganic light emitting devices, an anisotropic conductive layer disposed on the top surface of the TFT layer, a metal plate adhered to the back surface, and covering the entire surface of the anisotropic conductive layer. It includes a front cover, a side cover that surrounds a side of the substrate and extends from a lower surface of the anisotropic conductive layer to at least a portion of a side of the metal plate, and a side end member disposed on an outer end of the side cover.

The side end member is provided to seal between the front cover and the anisotropic conductive layer, between the anisotropic conductive layer and the side cover, and between the metal plate and the side cover.

The side end member is provided to extend from a position corresponding to the front end of the front cover to at least a portion of the side of the metal plate.

The display device according to an example of the present disclosure is sealed by a front cover in front of each display module and a side cover on the side, thereby improving reliability from penetration of external solutions.

In the display device according to an example of the present disclosure, ESD withstand voltage can be improved from discharge of static electricity that may be generated in the display module by each display module having a side end cover that covers the side end of the anisotropic conductive layer.

The effects according to the spirit of the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description below. .

1 is a diagram illustrating a display device according to an embodiment of the present disclosure.
FIG. 2 is an exploded view showing the main components of the display device of FIG. 1.
FIG. 3 is an enlarged cross-sectional view of a portion of a display module of the display device shown in FIG. 1.
FIG. 4 is a rear perspective view of one display module of the display device shown in FIG. 1.
FIG. 5 is a perspective view of a portion of a display module of the display device shown in FIG. 1.
FIG. 6 is a cross-sectional view in a third direction of a portion of the display device of FIG. 1;
Figure 7 is an enlarged cross-sectional view of some of the configurations shown in Figure 6.
Figure 8 is a diagram showing the manufacturing process of a display device according to an embodiment of the present invention.
FIG. 9 is a diagram showing the manufacturing process of the display device after FIG. 8.
FIG. 10 is a diagram showing the manufacturing process of the display device after FIG. 9.
FIG. 11 is a diagram showing the manufacturing process of the display device after FIG. 10.
FIG. 12 is a diagram showing the manufacturing process of the display device after FIG. 11.

Since the embodiments described in this specification are only the most preferred embodiments of the present invention and do not represent the entire technical idea of the present invention, various equivalents or modifications that can replace them at the time of filing the present invention are also available. It should be understood as included within the scope of rights.

Singular expressions used in the description may include plural expressions unless clearly implied by the context. The shapes and sizes of elements in the drawings may be exaggerated for clarity.

In connection with the description of the drawings, similar reference numbers may be used for similar or related components.

The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise.

As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof.

The term “and/or” includes any element of a plurality of related described elements or a combination of a plurality of related described elements.

Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one element from another, and may be used to distinguish such elements in other respects, such as importance or order) is not limited.

One (e.g. first) component is said to be "coupled" or "connected" to another (e.g. second) component, with or without the terms "functionally" or "communicatively". Where mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

Terms such as “include” or “have” are intended to designate the existence of features, numbers, steps, operations, components, parts, or combinations thereof described in this document, but do not include one or more other features, numbers, or steps. , does not exclude in advance the possibility of the existence or addition of operations, components, parts, or combinations thereof.

When a component is said to be “connected,” “coupled,” “supported,” or “in contact” with another component, this means not only when the components are directly connected, coupled, supported, or in contact, but also when a third component This includes cases where it is indirectly connected, coupled, supported, or contacted through.

When a component is said to be located “on” another component, this includes not only cases where a component is in contact with another component, but also cases where another component exists between the two components.

In addition, in this specification, the meaning of 'identical' includes properties that are similar to each other or are similar within a certain range. Also, identical means ‘substantial identical’. Substantially the same means that values that fall within the margin of error in manufacturing or values that fall within a range that has no meaning compared to the standard value should be understood to be included in the scope of 'the same.'

Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the attached drawings.

FIG. 1 is a diagram showing a display device according to an embodiment of the present invention, FIG. 2 is an exploded view showing the main configuration of the display device of FIG. 1, and FIG. 3 is a diagram of a display module shown in FIG. 1. It is an enlarged cross-sectional view of some configurations, FIG. 4 is a rear perspective view of a display module of the display device shown in FIG. 1, and FIG. 5 is a perspective view of a partial configuration of a display module shown in FIG. 1.

Some components of the display device 1, including the plurality of inorganic light-emitting devices 50 shown in the drawing, are micro-scale configurations having a size of several μm to hundreds of μm, and for convenience of explanation, some components (a plurality of inorganic light-emitting devices (50), black matrix (48), etc.) is shown with an exaggerated scale.

The display device (1) is a device that displays information, materials, data, etc. in the form of text, figures, graphs, images, etc., and TV, PC, mobile, digital signage, etc. can be implemented as the display device (1). You can.

According to an embodiment of the present invention, as shown in FIGS. 1 and 2, the display device 1 includes a display panel 20 that displays an image, and a power supply device (not shown) that supplies power to the display panel 20. ), a main board 25 that controls the overall operation of the display panel 20, a frame 15 that supports the display panel 20, and a rear cover 10 that covers the rear of the frame 15. It can be included.

The display panel 20 includes a plurality of display modules 30A-30P, a driving board (not shown) that drives each display module 30A-30P, and controls each display module 30A-30P. It may include a TOCN board (Timing controller board) that generates the necessary timing signals.

The rear cover 10 may support the display panel 20. The rear cover 10 may be installed on the floor through a stand (not shown), or may be installed on a wall through a hanger (not shown).

The plurality of display modules 30A-30P may be arranged up, down, left and right so as to be adjacent to each other. A plurality of display modules 30A-30P may be arranged in an M * N matrix form. In this embodiment, 16 display modules (30A-30P) are provided and arranged in a 4 * 4 matrix, but there is no limit to the number and arrangement of the plurality of display modules (30A-30P). .

A plurality of display modules 30A-30P may be installed on the frame 15. The plurality of display modules 30A-30P may be installed on the frame 15 through various known methods, such as magnetic force using a magnet or a mechanical fitting structure. A rear cover 10 is coupled to the rear of the frame 15, and the rear cover 10 can form the rear exterior of the display device 1.

The rear cover 10 may include a metal material. Accordingly, heat generated from the plurality of display modules 30A-30P and the frame 15 can be easily conducted to the rear cover 10, thereby increasing the heat dissipation efficiency of the display device 1.

In this way, the display device 1 according to an embodiment of the present invention can implement a large screen by tiling a plurality of display modules 30A-30P.

Unlike the embodiment of the present invention, each of the plurality of display modules 30A-30P may be applied to a single display device. In other words, the display module (30A-30P) is a single unit that can be installed and applied to electronic products or battlefields that require wearable devices, portable devices, handheld devices, and various displays, and can be assembled in a plurality of matrix types as in the embodiment of the present invention. Through placement, it can be applied to display devices such as personal computer (PC) monitors, high-resolution TVs, signage, and electronic displays.

The plurality of display modules 30A-30P may have the same configuration. Accordingly, the description of one display module described below can be equally applied to all other display modules.

Hereinafter, since the plurality of display modules 30A-30P are all formed identically, each of the plurality of display modules 30A-30P will be described based on the first display module 30A.

That is, to avoid redundant explanation, the configuration of the plurality of display modules 30A-30P will be described by representing the display module 30, the substrate 40, and the front cover 70.

Additionally, if necessary, a first display module 30A among the plurality of display modules 30A-30P and a third display module 30E disposed adjacent to the first display module 30A in the second direction (Y). Alternatively, the second display module 30B disposed adjacent to the third direction (Z) will be described.

Taking the first display module 30A among the plurality of display modules 30A-30P as an example, the first display module 30A may be formed in a quadrangular shape. The first display module 30A may be provided in a rectangular (Rectangle type) shape or a square (Square type) shape.

Accordingly, the first display module 30A may include edges 31, 32, 33, and 34 formed in the up, down, left, and right directions based on the front first direction (X).

As shown in FIG. 3, the plurality of display modules 30A-30P may each include a substrate 40 and a plurality of inorganic light emitting elements 50 mounted on the substrate 40. The plurality of inorganic light emitting devices 50 may be mounted on the mounting surface 41 of the substrate 40 facing in the first direction (X). In FIG. 3 , the thickness of the substrate 40 in the first direction (X) is shown to be exaggeratedly thick for convenience of explanation.

The substrate 40 may be formed in a quadrangle type. As described above, the plurality of display modules 30A-30P may each be provided in a rectangular shape, and the substrate 40 may be formed in a rectangular shape to correspond thereto.

The substrate 40 may be prepared in a rectangular (Rectangle type) shape or a square (Square type) shape.

Therefore, taking the first display module 30A as an example, the substrate 40 is formed on the edges 31, 32, and 33 of the first display module 30A, which are formed in the up, down, left, and right directions with respect to the front first direction (X). 34) and may include four borders (E) corresponding to this. (See Figure 5)

The first display module 30A has a right border 31, an upper border 32, a left border 33, and a lower border centered on the first direction (X) in front where the screen of the display module 30A is displayed ( 34) may be included. The right border 31 and the left border 33 are arranged to face each other in the second direction (Y), which is the left-right direction, and the upper border 32 and the lower border 34 are arranged to face each other in the third direction (Z), which is the vertical direction. can be placed.

The substrate 40 includes a substrate body 42, a mounting surface 41 that forms one side of the substrate body 42, and a rear surface that forms the other side of the substrate body 42 and is disposed on the opposite side to the mounting surface 41. 43) and a side surface 45 disposed between the mounting surface 41 and the rear surface 43.

The side surface 45 may form a side edge of the substrate 40 in the second direction (Y) and the third direction (Z) perpendicular to the first direction (X).

The substrate 40 may include a chamfer portion 49 formed between the mounting surface 41 and the side surface 45 and between the rear surface 43 and the side surface 45.

The chamfer portion 49 can prevent each substrate from colliding and being damaged when a plurality of display modules 30A-30P are arranged.

The edge E of the substrate 40 includes a side surface 45 and a chamfer portion 49.

The substrate 40 may include a thin film transistor (TFT) layer 44 formed on the substrate body 42 to drive the inorganic light emitting devices 50 . The substrate body 42 may include a glass substrate. That is, the substrate 40 may include a COG (Chip on Glass) type substrate. The substrate 40 may be formed with first and second pad electrodes 44a and 44b provided to electrically connect the inorganic light emitting devices 50 to the TFT layer 44.

The TFT (Thin Film Transistor) constituting the TFT layer 44 is not limited to a specific structure or type and may be configured in various embodiments. That is, the TFT of the TFT layer 44 according to an embodiment of the present invention is not only a low temperature poly silicon (LTPS) TFT, an oxide TFT, and a polysilicon (Si) TFT, but also an organic TFT and a graphene TFT. It can also be implemented as follows.

Additionally, the TFT layer 44 can be replaced with a CMOS (Complementary Metal-Oxide Semiconductor) type, n-type MOSFET, or p-type MOSFET transistor when the substrate body 42 of the substrate 40 is prepared with a silicon wafer.

The plurality of inorganic light-emitting devices 50 are formed of an inorganic material and may include inorganic light-emitting devices each having a width, length, and height ranging from several μm to several tens of μm. The micro inorganic light emitting device may have a short side length of 100 μm or less among the width, length, and height. That is, the inorganic light emitting device 50 can be picked up from a sapphire or silicon wafer and directly transferred onto the substrate 40. The plurality of inorganic light emitting devices 50 may be picked up and transferred through an electrostatic method using an electrostatic head or a stamp method using an elastic polymer material such as PDMS or silicon as the head.

The plurality of inorganic light emitting elements 50 may be a light emitting structure including an n-type semiconductor 58a, an active layer 58c, a p-type semiconductor 58b, a first contact electrode 57a, and a second contact electrode 57b. You can.

Although not shown in the drawing, one of the first contact electrodes 57a is electrically connected to the n-type semiconductor 58a of the second contact electrode 57b, and the other is electrically connected to the p-type semiconductor 58b. You can.

The first contact electrode 57a and the second contact electrode 57b may be in the form of a flip chip arranged horizontally and facing the same direction (opposite the direction of light emission).

When the inorganic light emitting element 50 is mounted on the mounting surface 41, the light emitting surface 54, the side 55, and the bottom surface disposed on the opposite side of the light emitting surface 54 are disposed toward the first direction (X) ( 56), and the first contact electrode 57a and the second contact electrode 57b may be formed on the bottom surface 56.

That is, the contact electrodes 57a and 57b of the inorganic light emitting device 50 may be disposed on the opposite side of the light emitting surface 54 and thus on the opposite side of the direction in which light is irradiated.

The contact electrodes 57a and 57b are arranged to face the mounting surface 41, are provided to be electrically connected to the TFT layer 43, and irradiate light in a direction opposite to the direction in which the contact electrodes 57a and 57b are arranged. A light emitting surface 54 may be disposed.

Therefore, when the light generated in the active layer 58c is irradiated in the first direction (X) through the light emitting surface 54, the light is transmitted to the first contact electrode 57a or the second contact electrode 57b without interference. It can be irradiated towards direction (X).

That is, the first direction (X) can be defined as the direction in which the light emitting surface 54 is arranged to irradiate light.

The first contact electrode 57a and the second contact electrode 57b may be electrically connected to the first pad electrode 44a and the second pad electrode 44b formed on the mounting surface 41 side of the substrate 40, respectively. there is.

The inorganic light emitting device 50 may be directly connected to the pad electrodes 44a and 44b through a bonding structure such as an anisotropic conductive layer 47 or solder.

An anisotropic conductive layer 47 may be formed on the substrate 40 to mediate electrical connection between the contact electrodes 57a and 57b and the pad electrodes 44a and 44b. The anisotropic conductive layer 47 is formed by attaching an anisotropic conductive adhesive onto a protective film, and may have a structure in which conductive balls 47a are dispersed in adhesive resin. The conductive ball 47a is a conductive sphere surrounded by a thin insulating film, and when the insulating film is broken by pressure, the conductors can be electrically connected to each other.

The anisotropic conductive layer 47 may include an anisotropic conductive film (ACF) in the form of a film and an anisotropic conductive paste (ACP) in the form of a paste.

In an embodiment according to the present invention, the anisotropic conductive layer 47 may be prepared as an anisotropic conductive film.

Therefore, when pressure is applied to the anisotropic conductive layer 47 when mounting a plurality of inorganic light-emitting devices 50 on the substrate 40, the insulating film of the conductive ball 47a is broken and the contact electrode of the inorganic light-emitting device 50 is broken. (57a, 57b) and the pad electrodes (44a, 44b) of the substrate 40 may be electrically connected.

However, although not shown in the drawing, the plurality of inorganic light emitting devices 50 may be mounted on the substrate 40 through solder (not shown) instead of the anisotropic conductive layer 47. After the inorganic light emitting device 50 is aligned on the substrate 40, the inorganic light emitting device 50 may be bonded to the substrate 40 through a reflow process.

The plurality of inorganic light-emitting devices 50 may include a red light-emitting device 51, a green light-emitting device 52, and a blue light-emitting device 53. (50) is a mounting surface of the substrate 40 with a series of red light-emitting elements 51, green light-emitting elements 52, and blue light-emitting elements 53 as one unit. It can be mounted on (41). A series of red light emitting devices 51, green light emitting devices 52, and blue light emitting devices 53 may form one pixel. At this time, the red light emitting device 51, green light emitting device 52, and blue light emitting device 53 may each form a sub pixel.

The red light emitting device 51, green light emitting device 52, and blue light emitting device 53 may be arranged in a row at predetermined intervals as in the embodiment of the present invention, or in a triangle. It can also be arranged in other forms, such as shapes.

The substrate 40 may include a light absorbing layer 44c to improve contrast by absorbing external light. The light absorption layer 44c may be formed on the entire mounting surface 41 of the substrate 40. The light absorption layer 44c may be formed between the TFT layer 43 and the anisotropic conductive layer 47.

The plurality of display modules 30A-30P may further include a black matrix 48 formed between the plurality of inorganic light emitting elements 50.

The black matrix 48 may perform a function of supplementing the light absorption layer 44c formed entirely on the mounting surface 41 side of the substrate 40. That is, the black matrix 48 absorbs external light and makes the substrate 40 appear black, thereby improving the contrast of the screen.

The black matrix 48 may have a black color.

In this embodiment, the black matrix 48 is a pixel formed by a series of red light-emitting elements 51, green light-emitting elements 52, and blue light-emitting elements 53. It is formed to be placed between pixels. However, unlike the present embodiment, the light emitting elements 51, 52, and 53, which are subpixels, may be formed more precisely to partition each light emitting element 51, 52, and 53.

The black matrix 48 may be formed in a grid shape with horizontal and vertical patterns to be disposed between pixels.

The black matrix 48 can be formed by applying a light-absorbing ink onto the anisotropic conductive layer 47 through an ink-jet process and then curing it, or by coating a light-absorbing film on the anisotropic conductive layer 47. You can.

That is, the black matrix 48 is formed between the plurality of inorganic light-emitting devices 50 in which the plurality of inorganic light-emitting devices 50 are not mounted in the anisotropic conductive layer 47 formed entirely on the mounting surface 41. can be formed.

The plurality of display modules 30A-30P each have a front cover disposed on the mounting surface 41 in the first direction (X) to cover the mounting surface 41 of the plurality of display modules 30A-30P. 70) may be included.

The front cover 70 may be provided in plurality so that each of the front covers 70 is formed on the plurality of display modules 30A-30P in the first direction (X). (See Figures 6 and 7)

A plurality of display modules 30A-30P may be assembled after each separate front cover 70 is formed. That is, taking the first display module 30A and the second display module 30B among the plurality of display modules 30A-30P as an example, the first front cover 70A is placed on the mounting surface 41 of the first display module 30A. ) may be formed, and a second front cover 70B may be formed on the mounting surface 41 of the second display module 30B.

The front cover 70 is provided to cover the substrate 40 and can protect the substrate 40 from external force or external moisture.

A plurality of layers (not shown) of the front cover 70 may be made of a functional film having optical performance. This will be described in detail later.

Some of the plurality of layers (not shown) of the front cover 70 may include a base layer (not shown) made of optical clear resin (OCR). A base layer (not shown) may be provided to support a plurality of other layers (not shown). Optically clear resin (OCR) can be highly transparent with a transmittance of over 90%.

All optically transparent resins (OCR) can improve visibility and image quality by increasing transmittance through low-reflection properties. In other words, in a structure with an air gap, light loss occurs due to the difference in refractive index between the film layer and the air layer, but in a structure using optically transparent resin (OCR), the difference in refractive index is reduced, which reduces light loss and results in visibility and visibility. Image quality can be improved.

In other words, optically transparent resin (OCR) can have advantages in terms of not only protecting the substrate 40 but also improving image quality.

Among the plurality of layers (not shown) of the front cover 70, some may include an adhesive layer (not shown) provided to adhere the front cover 70 to the mounting surface 41 of the substrate 40.

Typically, the front cover 70 may be provided to have a height greater than a predetermined height in the first direction (X) toward which the mounting surface 41 or the light emitting surface 54 faces.

When the front cover 70 is formed on the substrate 40, the gap that may be formed between the front cover 70 and the plurality of inorganic light emitting elements 50 is sufficiently filled.

Each of the plurality of display modules 30A-30P may include a metal plate 60 disposed on the rear surface 43 of the substrate 40.

In addition, the plurality of display modules 30A-30P each have a rear adhesive tape disposed between the back 43 and the metal plate 60 to adhere the back 43 of the substrate 40 to the metal plate 60. 61) may be included.

The rear adhesive tape 61 may be provided as a double-sided adhesive tape, but is not limited to this and may be provided in the shape of an adhesive layer rather than a tape. In other words, the rear adhesive tape 61 is an example of a medium for adhering the metal plate 60 to the rear 43 of the substrate 40, and is not limited to a tape and may be provided in various shapes.

The plurality of inorganic light emitting devices 50 extend through the pixel driving wiring (not shown) formed on the mounting surface 41 and the side 45 of the substrate 40 and the front surface formed by the pixel driving wiring (not shown). It may be electrically connected to a wiring layer (not shown).

A front wiring layer (not shown) may be formed below the anisotropic conductive layer 47. The front wiring layer (not shown) may be electrically connected to the side wiring 46 formed on the side 45 of the substrate 40. The side wiring 46 may be provided in a thin film form. The side wiring 46 may include a coating member 46e surrounding the side wiring 46 to prevent damage that may occur when the side wiring 46 is exposed to the outside. (See Figure 7)

The side wiring 46 extends along the third direction Z to the rear surface 43 of the substrate 40 along the chamfered portion 49 and the side surface 45 of the substrate 40 in the third direction Z. It can be. That is, the side wiring 46 may extend from the upper edge 32 and the lower edge 34 to the rear surface 43 of the substrate 40 along the chamfered portion 49 and the side 45 of the substrate 40. there is.

However, it is not limited to this, and the side wiring 46 is connected to the chamfer portion 49 and the side surface 45 of the substrate 40 in the second direction (Y) rather than the third direction (Z). ) may extend to the rear surface 43 of the substrate 40.

In addition, the side wiring 46 is not limited to this, and is located along the edge E of the substrate 40 corresponding to at least two of the four edges 31, 32, 33, and 34 of the first display module 30A. It can be extended. The front wiring layer (not shown) can be connected to the side wiring 46 by a front pad (not shown) formed on the edge E side of the mounting surface 41.

The side wiring 46 extends along the side 45 of the substrate 40 and may be connected to the rear wiring layer 43b formed on the back surface 43. In detail, the side wiring 46 may be connected to a rear pad 43e provided to electrically connect the rear wiring layer 43c and the side wiring 46. The rear pad 43e may be formed on the edge E side of the rear surface 43 of the substrate 41.

An insulating layer 43c covering the back wiring layer 43b may be formed on the back wiring layer 43b in the direction where the back of the substrate 40 faces.

That is, the plurality of inorganic light emitting devices 50 may be sequentially electrically connected to the front wiring layer (not shown), the side wiring 46, and the rear wiring layer 43b.

Additionally, as shown in FIG. 4 , the display module 30A may include a driving circuit board 80 provided to electrically control the plurality of inorganic light emitting devices 50 mounted on the mounting surface 41. The driving circuit board 80 may be formed of a printed circuit board. The driving circuit board 80 may be disposed on the back surface 43 of the board 40 in the first direction (X). It may be placed on a metal plate 60 adhered to the rear surface 43 of the substrate 40.

The display module 30A may include a flexible film 81 connecting the driving circuit board 80 and the rear wiring layer 43b so that the driving circuit board 80 is electrically connected to the plurality of inorganic light emitting devices 50. there is.

In detail, one end of the flexible film 81 may be connected to a connection pad 43d disposed on the back surface 43 of the substrate 40 and electrically connected to the plurality of inorganic light emitting devices 50.

The connection pad 43d may be electrically connected to the rear wiring layer 43b. Accordingly, the connection pad 43d can electrically connect the rear wiring layer 43b and the flexible film 81.

As the flexible film 81 is electrically connected to the connection pad 43d, it can transmit power and vibration signals from the driving circuit board 80 to the plurality of inorganic light-emitting devices 50.

The flexible film 81 may be formed of flexible flat cable (FFC) or chip on film (COF).

The flexible film 81 may include a first flexible film 81a and a second flexible film 81b, respectively disposed in the vertical direction with respect to the forward first direction (X).

The first and second flexible films 81a and 81b are not limited to this and may be disposed in left and right directions with respect to the first direction (X), or may be disposed in at least two directions from the top, bottom, left, and right directions.

A plurality of second flexible films 81b may be provided. However, the present invention is not limited to this, and the second flexible film 81b may be provided as a single piece, and the first flexible film 81a may also be provided as a plurality.

The first flexible film 81a can transmit a data signal from the driving circuit board 80 to the substrate 40. The first flexible film 81a may be prepared as COF.

The second flexible film 81b can transmit power from the driving circuit board 80 to the board 40. The second flexible film 81b may be made of FFC.

However, the present invention is not limited to this and the first and second flexible films 81a and 81b may be formed opposite to each other.

Although not shown in the drawing, the driving circuit board 80 may be electrically connected to the main board 25 (see FIG. 2). The main board 25 may be placed on the rear side of the frame 15, and the main board 25 may be connected to the driving circuit board 80 through a cable (not shown) at the rear of the frame 15.

A fixing member 82 provided to adhere the display modules 30A-30P to the frame 15 may be disposed on the rear of the metal plate 60. The fixing member 82 may preferably be made of double-sided tape. The metal plate 60 forming the rear of the display module 30A-30P is directly attached to the frame 15 by the fixing member 82 so that the display module 30A-30P can be supported by the frame 15. there is.

As described above, the metal plate 60 may be provided to contact the substrate 40. The metal plate 60 and the substrate 40 may be adhered to each other by a rear adhesive tape 61 disposed between the rear surface 43 of the substrate 40 and the metal plate 60 .

FIG. 5 illustrates the substrate 40 without components such as the anisotropic conductive layer 47 for convenience of explanation. Additionally, the side wiring 46 includes a coating member 46e that protects the side wiring 46 from the outside. For convenience of explanation, the coating member 46e is shown deleted.

The metal plate 60 may be formed of a metal material with high thermal conductivity. For example, the metal plate 60 may be made of aluminum.

Heat generated from the plurality of inorganic light emitting devices 50 and the TFT layer 44 mounted on the substrate 40 is transmitted through the rear adhesive tape 61 along the rear surface 43 of the substrate 40 to the metal plate 60. It can be transmitted as .

Accordingly, the heat generated in the substrate 40 can be easily transferred to the metal plate 60 and the substrate 40 can be prevented from rising above a certain temperature.

The plurality of display modules 30A-30P may be arranged in various positions in an M * N matrix. Each display module (30A-30P) is provided to be individually movable. At this time, each display module (30A-30P) individually includes a metal plate 60 to maintain a constant level of heat dissipation performance regardless of where each display module (30A-30P) is placed. You can.

A plurality of display modules 30A-30P may form screens of various sizes of the display device 1 in the form of various M * N matrices. Accordingly, rather than dissipating heat through a single metal plate provided for heat dissipation, each display module (30A-30P) includes an independent metal plate 60, as in one embodiment of the present invention, so that each display module Individual heat dissipation by the elements 30A-30P can improve the heat dissipation performance of the display device 1 as a whole.

When a single metal plate is placed inside the display device 1, a part of the metal plate may not be placed in a position corresponding to the position where some display modules are placed based on the front-to-back direction, and if the display module is not placed, A metal plate may be disposed in this location, which may reduce the heat dissipation efficiency of the display device 1.

That is, regardless of where each display module (30A-30P) is placed, all display modules (30A-30P) are connected to each other through the metal plate 60 disposed on each display module (30A-30P). The metal plate 60 enables self-heat dissipation, thereby improving the heat dissipation performance of the display device 1 as a whole.

The metal plate 60 may be provided in a rectangular shape that approximately corresponds to the shape of the substrate 40.

The area of the substrate 40 may be at least equal to or larger than the area of the metal plate 60. When the substrate 40 and the metal plate 60 are arranged side by side in the first direction (X), four edges of the rectangular substrate 40 are formed based on the center of the substrate 40 and the metal plate 60. may be formed to correspond to the four edges of the metal plate 60 or may be arranged to be located further outward than the four edges of the metal plate 60 based on the center of the substrate 40 and the metal plate 60.

Preferably, the four edges E of the substrate 40 may be arranged outside the four edges E of the metal plate 60. That is, the area of the substrate 40 may be prepared to be larger than the area of the metal plate 60.

When heat is transferred to each display module (30A-30P), the substrate 40 and the metal plate 60 may thermally expand. The metal plate 60 has a higher coefficient of thermal expansion than the substrate 40, so the metal plate ( The expansion value of 60 is higher than the expansion value of the substrate 40.

At this time, the four edges (E) of the substrate 40 correspond to the four edges of the metal plate 60 or are placed further inside. The edge of the metal plate 60 may protrude to the outside of the substrate 40 .

Accordingly, the spacing length of the gap formed between each display module (30A-30P) may be formed irregularly due to thermal expansion of the metal plate 60 of each module (30A-30P), and accordingly, some deliberation As perceptibility increases, the sense of unity of the screen of the display panel 20 may decrease.

However, when the four edges (E) of the substrate 40 are arranged outside the four edges of the metal plate 60, even if the substrate 40 and the metal plate 60 are thermally expanded, the substrate 40 The metal plate 60 does not protrude outside the four edges E, and thus the length of the gap formed between each display module 30A-30P can be maintained constant.

According to an embodiment of the present invention, the area of the substrate 40 and the area of the metal plate 60 may be provided to approximately correspond. Accordingly, the heat generated in the substrate 40 can be uniformly dissipated throughout the entire area of the substrate 40 rather than being isolated in some areas.

The metal plate 60 may be prepared to be adhered to the back surface 43 of the substrate 40 using a rear adhesive tape 61.

The rear adhesive tape 61 may be provided in a size corresponding to the metal plate 60. That is, the area of the rear adhesive tape 61 may be prepared to correspond to the area of the metal plate 60. The metal plate 60 may be provided in a substantially square shape, and the rear adhesive tape 61 may be provided in a square shape to correspond thereto.

The edge of the rectangular metal plate 60 and the edge of the rear adhesive tape 61 may be formed to correspond to the center of the metal plate 60 and the rear adhesive tape 61.

Accordingly, the metal plate 60 and the rear adhesive tape 61 can be easily manufactured in one combined configuration, thereby increasing the manufacturing efficiency of the entire display device 1.

That is, when the metal plate 60 is cut into unit numbers from one plate, the rear adhesive tape 61 is first attached to one plate before the metal plate 60 is cut, and the rear adhesive tape 61 and the metal The plate 60 is cut simultaneously in unit numbers, which may have the effect of reducing the process.

Heat generated from the substrate 40 may be transferred to the metal plate 60 through the rear adhesive tape 61. Accordingly, the rear adhesive tape 61 may be provided to adhere the metal plate 60 to the substrate 40 and simultaneously transfer heat generated from the substrate 40 to the metal plate 60.

Accordingly, the rear adhesive tape 61 may include a material with high heat dissipation performance.

Basically, the rear adhesive tape 61 may contain an adhesive material to bond the substrate 40 and the metal plate 60.

Additionally, the rear adhesive tape 61 may include a material with higher heat dissipation performance than a material with general adhesiveness. Accordingly, heat can be efficiently transferred to each component between the substrate 40 and the metal plate 60.

Additionally, the adhesive material of the rear adhesive tape 61 may be made of a material with higher heat dissipation performance than the adhesive material constituting a general adhesive.

A material with high heat dissipation performance refers to a material that can effectively transfer heat with high thermal conductivity, high thermal conductivity, and low specific heat.

As an example, the rear adhesive tape 61 may include a graphite material. However, the rear adhesive tape 61 is not limited to this and may generally be made of a material with high heat dissipation performance.

The ductility of the rear adhesive tape 61 may be greater than that of the substrate 40 and the metal plate 60 . Therefore, the rear adhesive tape 61 may be made of a material that has adhesiveness and heat dissipation properties and is highly ductile. The rear adhesive tape 61 may be formed of an inorganic double-sided tape. As described above, the rear adhesive tape 61 is formed of a baseless tape, and is formed as a single layer between one side bonded to the substrate 40 and the other side bonded to the metal plate 60 without a substrate supporting one side and the other side. can be formed.

Since the rear adhesive tape 61 does not contain a substrate, it does not contain a material that hinders heat conduction, and thus heat dissipation performance can be improved. However, the rear adhesive tape 61 is not limited to an inorganic double-sided tape and may be prepared as a heat-dissipating tape with better heat dissipation performance than general double-sided tape.

The rear adhesive tape 61 may be made of a highly ductile material to absorb external force transmitted from the substrate 40 and the metal plate 60. In detail, the ductility of the rear adhesive tape 61 may be greater than the ductility of the substrate 40 and the metal plate 60.

Accordingly, when heat is transferred to the substrate 40 and the metal plate 60 and the external force generated from the change in size of the substrate 40 and the metal plate 60 is transmitted to the rear adhesive tape 61, the rear adhesive tape 61 As it deforms itself, it can prevent external forces from being transmitted to different configurations.

The rear adhesive tape 61 may have a predetermined thickness in the first direction (X). When heat is transferred to the metal plate 60 and thermally expands or cools and contracts, the metal plate 60 expands not only in the first direction (X) but also in a direction perpendicular to the first direction (X). It may expand or contract, and thus external force may be transmitted to the substrate 40.

As described above, the metal plate 60 is formed to a size corresponding to the substrate 40 and is provided to cover the entire rear surface 43 of the substrate 40, and the fixing member 82 is the metal plate 60. It can be placed on the rear.

However, the present invention is not limited to this, and the fixing member 82 may be arranged to be disposed on the rear surface 43 of the substrate 40 . At this time, the substrate 40 may be directly attached to the frame 15 through the fixing member 82.

Unlike one embodiment of the present invention, the metal plate 60 may be provided to cover only a portion of the rear surface 43 of the substrate 40, and the metal plate 60 may be provided on the rear surface 43 of the substrate 40. The fixing member 82 may be provided to be adhered to the area that is not used.

The fixing member 82 may preferably be made of double-sided tape.

Hereinafter, the front cover 70, the side cover 90, and the side end member 100 will be described in detail.

FIG. 6 is a cross-sectional view in a third direction of a portion of the configuration of the display device of FIG. 1, and FIG. 7 is an enlarged cross-sectional view of a portion of the configuration shown in FIG. 6.

The term “up and down direction” used in the following description refers to the first direction (X), which is the direction in which the mounting surface 41 faces based on the cross-sectional view of the display device of FIG. 6. When the display device is installed, the first direction

The front cover 70 can protect the substrate 40 from external force and does not reduce the visibility of the seam formed by the gap G formed between the plurality of display modules 30A-30P. and color deviation between the plurality of display modules 30A-30P can be improved.

Each of the plurality of display modules 30A-30P has a side cover disposed in the gap G formed between the plurality of display modules 30A-30P when the plurality of display modules 30A-30P are arrayed. 90) may be included.

The front cover 70 of each of the display modules 30A-30P is formed so as to absorb light reflected from the gap G between the plurality of display modules 30A-30P. ) may be formed to extend outside the substrate 40. The side end 75 of the front cover 70 may be provided to extend to an area outside the mounting surface 41.

In detail, the front cover 70 may be provided to extend outward from the border (or side edge, 41S) of the mounting surface 41 of the substrate 40 in the second direction (Y) and third direction (Z). there is.

Substantially, the gap between the respective display modules 30A-30P may occur between the side surfaces 45 of the substrate 40 of the respective display modules 30A-30P, but in one embodiment of the present invention The gap (G) means a non-display area that can be generated between each display module (30A-30P), and the gap (G) formed between a plurality of display modules (30A-30P) This means that from the edge 41S of the mounting surface 41 of the substrate 40 of each display module 30A-30P to the mounting surface 41 of the substrate 40 of the adjacent display modules 30A-30P. It can be understood as the separation formed between the edges 41S.

Therefore, the gap G formed between the plurality of display modules 30A-30P means the mounting surface of each display module 30A-30P in the second direction (Y) or the third direction (Z). This refers to the gap formed between the border 41S of 41) and the border 41S of the mounting surface 41 of the adjacent display modules 30A-30P.

A front cover 70 extending from each of the display modules 30A-30P is disposed in the gap G between the plurality of display modules 30A-30P, so that the light irradiated into the gap G or the gap ( By absorbing the light reflected from G), perception of the mind can be minimized.

In addition, as will be described later, the light irradiated into the gap G is absorbed by the side covers 90 of the plurality of display modules 30A-30P disposed between the gap G, thereby minimizing the perception of the mind.

As shown in FIGS. 6 and 7 , the front cover 70 may be provided to extend to the outside of the substrate 40 in the third direction (Z). In detail, the front cover 70 may be provided to extend outward from the side surface 45 and the chamfer portion 49 in the third direction (Z).

As an example, only one edge side of the substrate 40 corresponding to the lower edge 34 of the first display module 30A will be described, but the front cover 70 is larger than the four edges E of the substrate 40. It may extend outward in the second direction (Y) or the third direction (Z).

That is, the side end 75 of the front cover 70, which corresponds to the edge of the front cover 70, is closer to the substrate than the four edges E of the substrate 40 in the second direction (Y) or third direction (Z). It may extend to the outer area of (40) and the outer area of the mounting surface (41).

As an example, the front cover 70 may include a plurality of layers, each of which has different optical properties, although not shown in the drawing. A plurality of layers may be provided in a structure in which each layer is stacked in the first direction (X). A plurality of layers may each be joined in the first direction (X) to form the front cover 70.

For example, one layer among the plurality of layers may be provided as an anti-glare layer. For example, it may be provided as an anti-reflective layer or a mixed layer of an anti-glare layer and an anti-reflective layer.

For example, one layer and another layer among the plurality of layers may be provided as a light transmittance adjustment layer. For example, it may be formed as a layer that contains different physical properties or materials or has different functions. For example, it may be provided as a circularly polarized light layer.

For example, a plurality of layers may be provided as a single layer. A single layer can be functionally prepared as a layer that can implement all the functions of a plurality of layers.

For example, the front cover 70 may include an adhesive layer. The adhesive layer may be disposed at the rearmost part of the plurality of layers in the first direction (X) and adhered to the mounting surface 41. The adhesive layer may be provided to have a predetermined height in the first direction (X) toward which the mounting surface 41 or the light emitting surface 54 faces.

When the adhesive layer is attached to the substrate 40, the gap that may be formed between the adhesive layer and the plurality of inorganic light emitting devices 50 can be sufficiently filled by the predetermined height of the adhesive layer.

For example, the adhesive layer may be separate from the front cover 70 and disposed between the front cover 70 and the mounting surface 41 so that the front cover 70 is adhered to the mounting surface 41.

Accordingly, the front cover 70 is closely adhered to the mounting surface 41 and can protect the components mounted on the mounting surface 41, so that the display module 30 is between the front cover 70 and the substrate 40. The front cover 70 can be directly adhered to the substrate 40 without an additional molding structure formed on the front cover 70.

The front cover 70 may be provided to diffusely reflect light incident from the outside to prevent light incident from the outside from being regularly reflected and dazzling the user's eyes.

By diffusely reflecting light incident from the outside, the glare phenomenon is reduced, and thus the contrast of the screen displayed on the display panel 20 can be improved.

Additionally, the front cover 70 may be provided to reduce the transmittance of incident external light or external light reflected from the substrate 40 and the gap G.

The front cover 70 includes a material that reduces the light transmittance so that at least a portion of the light is transmitted toward the substrate 40 or, conversely, is reflected from the substrate 40 and transmits at least a portion of the reflected light toward the first direction (X). It can be arranged to absorb.

When multiple substrates are produced, some substrates may have different colors due to processing problems during the production process. Accordingly, substrates each with a different unique color can be tiled to form a single display panel.

As described above, the front cover 70 according to an embodiment of the present invention can increase the sense of unity of the screen of the display panel 20 by absorbing at least a portion of the light reflected from the substrate 40 and transmitted to the outside.

That is, the front cover 70 can reduce the color deviation of each display module (30A-30P) by reducing the external light transmittance generated during the process of the plurality of display modules (30A-30P).

The front cover 70 prevents external light incident on the display panel 20 from the outside from being transmitted through the substrate 40, and additionally absorbs some of the light incident on the display panel 20 from the outside or removes it from the substrate 40. By absorbing some of the external light that is reflected and transmitted to the outside of the display panel 20, the contrast of the screen displayed on the display panel 20 can be improved. These different optical actions can each be implemented through the plurality of layers described above.

That is, the front cover 70 is disposed in front of the substrate 40 in the first direction (X) and can improve contrast that may be reduced by external light in the screen displayed on the display panel 20.

As described above, in the case of the display module 30 according to an embodiment of the present invention, the front cover 70 may be provided to extend to the outside of the substrate 40 in the third direction (Z).

Accordingly, a portion of the light flowing into the gap G formed between the plurality of display modules 30A-30P is blocked by at least a portion of the front cover 70 disposed on the gap G, and the gap G At least a portion of the external light flowing into or reflected from the gap G is absorbed by the front cup 70 disposed on the gap G and is prevented from being transmitted to the outside. Accordingly, the visibility of the seam formed in the gap G may be reduced, and as the visibility of the seam is reduced, the sense of unity of the screen displayed on the display panel 20 can be improved.

In detail, the side end 75 of the front cover 70 in the third direction (Z) is disposed outside the edge 41S of the mounting surface 41 in the second direction (Z), or on the gap G. You can.

Accordingly, the front cover 70 is disposed on the first area 71 and the mounting surface 41 outside the edge 41S of the mounting surface 41 in the third direction Z, or on the gap G. It may include a second area 72 disposed in .

The first area 71 and the second area 72 of the front cover 70 may be divided by a gap G in the third direction Z.

The first area 71 of the front cover 70 is disposed on the gap G, so that external light irradiating into the gap G is blocked by the first area 71 of the front cover 70, or the gap G ) is blocked from being irradiated to the outside, thereby reducing the visibility of the seam, which is the boundary between the plurality of display modules 30A-30P, which may be formed by the gap G, thereby improving the sense of unity of the display panel 20. do.

As described above, the front cover 70 may be provided to extend outward from the four edges 41S of the mounting surface 41 of the substrate 40, so that the front cover 70 is provided at each edge of the plurality of display modules 30A-30P. The visibility of the thoughts that may be formed may be reduced.

Taking the first display module 30A and the second display module 30B as an example, the first area 71A of the front cover 70A of the first display module 30A extends from the first display module 30A. It may be placed in the gap G formed between the first display module 30A and the second display module 30B.

On the gap G, the side end 75A of the front cover 70A of the first display module 30A, and the second display module 30B adjacent to the first display module 30A in the second display module 30B. The side end 75B of the front cover 70B may be disposed.

Additionally, the side surface 45 and the chamfer portion 49 of each of the first display module 30A and the second display module 30B may be disposed on the gap G.

The second area 72A of the front cover 70A of the first display module 30A may be disposed on the mounting surface 41 of the first display module 30A.

The first area 71B of the front cover 70B of the second display module 20B extending from the second display module 30B is formed between the first display module 30A and the second display module 30B. It may be disposed in the gap G, and the second area 72B of the front cover 70B of the second display module 30B may be disposed on the mounting surface 41 of the second display module 30B. .

That is, the gap G formed between the first display module 30A and the second display module 30B includes the first area 71A and the second area 71A of the front cover 70A of the first display module 30A, respectively. The first area 71B of the front cover 70B of the display module 30B may be arranged side by side in the third direction Z.

The first area 71A of the front cover 70A of the first display module 30A and the first area 71B of the front cover 70B of the second display module 30B extend in the third direction Z. The length may be approximately half of the gap (G) or less.

Accordingly, the sum of the lengths of the first area 71A of the front cover 70A of the first display module 30A and the first area 71B of the front cover 70B of the second display module 30B is approximately the gap. It can be provided to correspond to the length of (G) or to be smaller.

As described above, on the gap G between the first display module 30A and the second display module 30B, the first area 71A of the front cover 70A of the first display module 30A and the second display The first area 71B of the front cover 70B of the module 30B may be disposed.

External light incident on the display panel 20 is directed to the first area 71A of the front cover 70A of the first display module 30A and the first area 71B of the front cover 70B of the second display module 30B. ) while being diffusely reflected to the outside of the display panel 20 or the first area 71A of the front cover 70A of the first display module 30A and the first area 71A of the front cover 70B of the second display module 30B. The amount of light that is partially absorbed in the area 71B and reaches the gap G is reduced, and the visibility of the boundary between the first display module 30A and the second display module 30B due to the gap G is reduced. You can.

In addition, the light reflected from the gap G and heading to the outside of the display panel 20 is transmitted to the first area 71A of the front cover 70A of the first display module 30A and the front cover of the second display module 30B ( While passing through the first area 71B of 70B), it is diffusely reflected to the outside of the display panel 20 or is reflected in the first area 71A of the front cover 70A of the first display module 30A and the second display module 30B. A portion may be absorbed into the first area 71B of the front cover 70B, thereby reducing the amount transmitted to the outside of the display panel 20. Accordingly, visibility of the boundary between the first display module 30A and the second display module 30B due to the gap G may be reduced.

That is, the amount of external light flowing into the gap G formed between the plurality of display modules 30A-30P is reduced and at least a portion of the external light reflected from the gap G is absorbed, thereby forming the display panel 20. The integrity of the screen can be improved.

Additionally, even if the substrate 40A of the first display module 30A and the substrate 40B of the second display module 30B are provided to have different colors, the substrate 40A of the first display module 30A and the substrate 40A of the first display module 30A When the substrate 40B of the second display module 30B is displayed to the outside by reflection of external light, at least a portion of the reflected light is exposed to the front cover 70A of the first display module 30A and the second display module 30B. The display panel 20 is provided so that the unique colors of the substrate 40A of the first display module 30A and the substrate 40B of the second display module 30B are not recognized to the outside by being absorbed into the front cover 70B. The integrity of the screen can be improved.

The display module 30A may include a side cover 90 disposed below the front cover 70 in the direction toward which the mounting surface 41 faces and provided on the side 45 of the substrate 40.

For example, the side end 47S of the anisotropic conductive layer 47 of the display module 30 may be disposed on the same line as the side end 75 of the front cover 70 in the first direction (X).

The anisotropic conductive layer 47 may be provided in the shape of an anisotropic conductive film. The anisotropic conductive layer 47 may be prepared on the TFT layer 41 to be bonded to the TFT layer 41 in the form of a film. The anisotropic conductive layer 47 may be formed in a film shape so that the area of the anisotropic conductive layer 47 is larger than the area of the substrate 40.

For example, after the anisotropic conductive layer 47 is bonded to the TFT layer 41 and the front cover 70 covers the mounting surface 41 of the substrate 40, the anisotropic conductive layer 47 is attached to the front cover 70. ), the cutting process may proceed. The cutting process is performed by cutting the anisotropic conductive layer 47 such that the side end 47S of the anisotropic conductive layer 47 is disposed on the same line as the side end 75 of the front cover 70 in the first direction (X). It can be cut together with the front cover (70).

The side cover 90 may be disposed in a space formed on the lower surface 47B of the anisotropic conductive layer 47 in the first direction (X) and on the side of the substrate 40 in the third direction (Z).

The side cover 90 may be provided to extend from the lower surface 47B of the anisotropic conductive layer 47 to the side 65 of the metal plate 60 in the first direction (X).

One end 92 of the side cover 90 in the first direction (X) is provided to contact the lower surface 47B of the anisotropic conductive layer 47, and the side cover 90 in the first direction (X) The other end 92 may be provided to contact the side 65 of the metal plate 60.

The side cover 90 extends from one end 92 to the other end 93 to cover not only the side 45 but also the entire chamfer portion 49 formed between the mounting surface 41 and the side 45. It can be provided.

As the side cover 90 is provided to surround the chamfered portion 49 formed between the mounting surface 41 and the side 45 and the chamfered portion 49 formed between the side 45 and the rear 43. , the side cover 90 can cover all of the space that may be created between the lower surface 76 of the front cover 70 and the metal plate 60.

The side cover 90 can prevent foreign substances or moisture from entering the space between the substrate 40, the front cover 70, and the anisotropic conductive layer 47 from the outside.

The side cover 90 can prevent foreign substances or moisture from entering the space between the substrate 40 and the metal plate 60 from the outside.

The side wiring 46 includes a first stage 46a connected to the rear pad 43e, a second stage 46c connected to the front pad (not shown), and a side wiring (46a). In 46), it includes a first end 46b and a second end 46c, which are adjacent to the first end 46a, and a second end 46c is an area adjacent to the second end 46c in the side wiring 46. It may include an end 46d.

One end 92 of the side cover 90 is provided to contact the lower surface 76 of the front cover 90 or the lower surface 47B of the anisotropic conductive layer in the first direction (X). The other end 93 of the side cover 90 is provided to cover at least a portion of the metal plate 60 in the first direction (X). The side cover 90 has a side 45 and a side wiring 46. By sealing the whole, it is possible to prevent liquids such as moisture from entering from the outside.

For example, the side end 47S of the anisotropic conductive layer 47 of the display module 30 may be disposed inside the side end 75 of the front cover 75 in the third direction (Z).

For example, after the anisotropic conductive layer 47 is bonded to the TFT layer 41, a process of cutting the anisotropic conductive layer 47 so that the area of the anisotropic conductive layer 47 corresponds to the area of the substrate 40 may be performed. there is. In the cutting process, the anisotropic conductive layer 47 may be cut so that the area of the anisotropic conductive layer 47 corresponds to the area of the substrate 40 through laser cutting or the like.

For example, to prevent damage to the substrate 40 that may occur during the cutting process, the location where the anisotropic conductive film is cut may be an area outside the side 45 or the side end 46S of the side wiring 46. A side end 47S of the anisotropic conductive layer 47 may be formed outside the substrate 40 .

As an example, the side cover 90 is aligned with the lower surface 76 of the first area 71 of the front cover 70 and the lower surface 47B of the anisotropic conductive layer 47 and the third direction Z) can be placed in a space formed on the side of the substrate 40. The lower surface 76 of the first area 71 is at least a portion of the entire lower surface of the front cover 70 and refers to the rear of the adhesive layer (not shown) formed at the last end of the front cover 70.

The side 45 of the substrate 40 is provided to correspond to the four edges 41S of the mounting surface 41, and the first area 71 of the front cover 70 is the first area 71 where the mounting surface 41 extends. It may extend outward from the four edges 41S of the mounting surface 41 in the second direction (Y) and the third direction (Z).

As an example, the side cover 90 is located along the perimeter of the four edges 41S of the mounting surface 41, the lower part of the first area 71 in the first direction (X), and the four edges of the mounting surface 41. It may be provided to surround the side 45 corresponding to (41S). The side cover 90 may be provided to seal the entire edge of the portion where the substrate 40 and the front cover 70 are bonded.

The side cover 45 may cover the lower surface 76 and the side surface 45 of the first area 71 in all directions perpendicular to the first direction (X). Accordingly, the coupling between the front cover 70 and the substrate 40 can be improved, and the front cover 70 and the side surface 45 of the substrate 40 can be protected from external forces.

As an example, the side cover 90 has a lower portion of the first area 71 in the first direction (X) and a side surface 45 corresponding to some of the four edges 41S of the mounting surface 41. It can be arranged to surround. The side cover 90 may be provided to seal a portion of the edge of the area where the substrate 40 and the front cover 70 are bonded. The side cover 90 focuses on protecting the side wiring 46 and may be provided to cover only the side 45 from which the side wiring 46 extends on the four sides 45 .

For example, the side cover 90 may be disposed only on the side surface 45 corresponding to the upper edge 32 and lower edge 34 where the side wiring 46 extends. The side cover 90 has side wiring on four sides 45 to preferentially protect the side wiring 46 and the electrical components connected to the side wiring 46, which are vulnerable to damage when foreign substances enter from the outside or electrostatic discharge occurs. It may be arranged to cover only the side 45 from which 46 extends.

Due to static electricity discharge that may be generated on the display modules (30A-30P), current may flow into a plurality of electrical components mounted on the substrate 40 and damage the electrical components. The side cover 90 is an electrical component. To prevent damage, the substrate 40 can be sealed from the outside to prevent charges generated by electrostatic discharge from flowing into the substrate 40.

That is, the substrate 40 is sealed by the front cover 70 and the side cover 90 to prevent charges generated by electrostatic discharge from passing through the front cover 70 and the side cover 90, so that the substrate 40 ) is prevented from flowing, and the charges flowing on the front cover 70 and the side cover 90 are guided to the metal plate 60 in contact with the side cover 90, causing electrostatic discharge. A path for current may be provided. Accordingly, the ESD withstand voltage of the electrical components mounted on the substrate 40 can be improved.

As described above, the display module 30A may be arranged under the front cover 70 in the direction in which the mounting surface 41 faces.

One end 92 of the side cover 90 in the first direction (X) may be provided lower than the lower surface 76 of the first area 71. This is to avoid placing the side cover 90 on the path of light emitted from the plurality of inorganic light emitting devices 50.

The side end 75 of the front cover 70 in the third direction (Z) and the side end 91 of the side cover 90 in the third direction (Z) are arranged on approximately the same line in the first direction (X). It can be.

For example, during the manufacturing process of the display module 30A, the front cover 70 and the side cover 90 may be cut simultaneously. Accordingly, when a plurality of display modules (30A-30P) are arrayed, the spacing formed between the plurality of display modules (30A-30P) is minimized, and the spacing between the plurality of display modules (30A-30P) can be recognized. You can minimize the number of seams present.

The side cover 90 may include a material that absorbs light. For example, the side cover 90 may be made of an opaque or translucent material. For example, the side cover 90 may be made of a material having a black color. The side cover 90 may be provided to have a darker color than the front cover 70. For example, the side cover 90 may be provided to have a color similar to the black matrix 48. Accordingly, the light incident on the side cover 90 may be absorbed by the side cover 90 without being reflected by the light-absorbing material of the side cover 90.

As an example, the side cover 90 may include a photosensitive material. As an example, the side cover 90 may be formed of photosensitive optically transparent adhesive resin (OCR). For example, when a photosensitive material is irradiated with external light having a wavelength other than the wavelength of visible light, such as ultraviolet rays (UV), the photosensitive material may change its physical properties and change color to a dark color. When ultraviolet (UV) rays are irradiated to the side cover 90 during the manufacturing process, the side cover 90 is colored dark and the side cover 90 is made of a material that can absorb light.

The side cover 90 may be made of a moisture-proof material that prevents moisture or other solutions from penetrating.

As described above, the side cover 90 is provided to seal the edges of the display modules 30A-30P and covers the side wiring 46, the first end 46b of the side wiring 46, the side 45, and the side wiring ( It can be provided to cover the entire back pad 43e connected to 46) and prevent solutions such as moisture from penetrating from the outside.

As an example, the side cover 90 is replaced with a liquid-proof material to prevent the solution from being absorbed into the side cover 90 and flowing to the side wiring 46, the back pad 43e, or the side 45. It can be provided.

As described above, even if the side wiring 46 is exposed to the outside by the coating member 46e surrounding the side wiring 46, some external solution can be prevented from flowing into the side wiring 46. However, if the external solution has an alkaline base such as a cleaning solution, the coating member 46e may be removed by the alkaline solution and the side wiring 46 may be damaged. The side cover 90 covers the entire side wiring 46 to prevent damage to the side wiring 46.

The side cover 90 has a gap (G) formed between the plurality of display modules 30A-30P together with the first area 71 of the front cover 70 when the plurality of display modules 30A-30P are arrayed. It can be placed on top.

Accordingly, the light flowing into the gap G can be absorbed and the light flowing into the gap G can be minimized from being reflected and going out. Accordingly, the visibility of the seam formed by the gap G formed between the plurality of display modules 30A-30P may be reduced.

Taking the first display module 30A and the second display module 30B as an example, the side cover 90A of the first display module 30A and the side cover 90B of the second display module 30B are the first display module 30A and the second display module 30B. The first display module 30A and the first area 71A of the front cover 70A of the display module 30A and the first area 71B of the front cover 70B of the second display module 30B It may be placed in the gap G formed between the two display modules 30B.

On the gap G, the second display module 30B is adjacent to the side end 91A of the side cover 90A of the first display module 30A and the side end 91A of the side cover 90A of the first display module 30A. ) The side end (91B) of the side cover (90B) may be disposed.

The side end 91A of the side cover 90A of the first display module 30A and the side cover of the second display module 30B adjacent to the side end 91A of the side cover 90A of the first display module 30A ( The side ends 91B of 90B) may be arranged to face each other.

The front cover (75A) of the front cover (70A) of the first display module (30A) and the front cover ( The side ends 75B of 70B) may be arranged to face each other.

The side end 91A of the side cover 90A of the first display module 30A and the side cover of the second display module 30B adjacent to the side end 91A of the side cover 90A of the first display module 30A ( The second display adjacent to the side end 91B of 90B) and the side end 75A of the front cover 70A of the first display module 30A and the side end 75A of the front cover 70A of the first display module 30A. The side ends 75B of the front cover 70B of the module 30B may be arranged in parallel.

The gap G formed between the first display module 30A and the second display module 30B includes the first area 71A of the front cover 70A of the first display module 30A and the second display module ( The first area (71B) of the front cover (70B) of 30B), the side cover (90A) of the first display module (30A), and the side cover (90B) of the second display module (30B) are aligned in the third direction (Z). can be placed side by side.

The lengths of the side cover 90A of the first display module 30A and the side cover 90B of the second display module 30B in the third direction (Z) are respectively the lengths of the first display module 30A and the second display module 30A. The gap G formed between the display modules 30B includes the first area 71A of the front cover 70A of the first display module 30A and the first area 71A of the front cover 70B of the second display module 30B. It may be provided to be approximately half or less of the gap G, corresponding to the length of area 1 71B.

On the gap G between the first display module 30A and the second display module 30B, the first area 71A of the front cover 70A of the first display module 30A and the second display module 30B The first area 71B of the front cover 70B is disposed, and the first area 71A of the front cover 70A of the first display module 30A and the second display module ( The side cover 90A of the first display module 30A and the side cover 90B of the second display module 30B may be disposed at the rear of the first area 71B of the front cover 70B of 30B). there is.

As described above, external light incident on the display panel 20 penetrates the first area 71A of the front cover 70A of the first display module 30A and the first area 71A of the front cover 70B of the second display module 30B. While passing through area 1 71B, the amount of light reaching the gap G is reduced by being diffusely reflected or partially absorbed to the outside of the display panel 20.

Additionally, even if some light reaches the gap G, the gap is maintained by the side cover 90A of the first display module 30A and the side cover 90B of the second display module 30B, which are disposed on the gap G. The light flowing into (G) may be absorbed, thereby reducing the visibility of the boundary between the first display module 30A and the second display module 30B.

That is, the amount of external light flowing into the gap G formed between the plurality of display modules 30A-30P is reduced, and at the same time, the light reaching the gap G is additionally absorbed to display the screen of the display panel 20. The integrity of can be improved.

Additionally, it is not absorbed by the side cover 90A of the first display module 30A and the side cover 90B of the second display module 30B, but is absorbed by the side cover 90A of the first display module 30A and the second display module. The light reflected on the side cover (90B) of (30B) and directed to the outside of the display panel (20) is directed to the first area (71A) of the front cover (70A) of the first display module (30A) and the second display module (30B). It is diffusely reflected to the outside of the display panel 20 while transmitting through the first area 71B of the front cover 70B, or the first area 71A of the front cover 70A of the first display module 30A and the second display module. The amount transmitted to the outside of the display panel 20 may be reduced by being partially absorbed in the first area 71B of the front cover 70B of 30B. Accordingly, visibility of the boundary between the first display module 30A and the second display module 30B due to the gap G may be reduced.

As an example, as described above, the front cover 70 is provided to reduce the amount of light reaching the substrate 40 by diffusely reflecting, absorbing, circularly polarizing, or changing the direction of reflection of some of the light flowing into the display module 20. .

For example, the front cover 70 may be made of a transparent material that transmits light without deformation. Even at this time, visibility of the boundary between the plurality of display modules 30A-30P due to the gap G may be reduced by the side cover 90 disposed between the plurality of display modules 30A-30P.

The front cover 70 may be made of a non-conductive material that does not allow electric charges to penetrate.

The side cover 90 may be made of a non-conductive material that does not allow electric charges to penetrate.

As the front cover 70 and the side cover 90 are made of a non-conductive material, most of the current applied to the front cover 70 or the side cover 90 penetrates the front cover 70 and the side cover 90. It may not be able to flow on the front cover 70 and the side cover 90.

The metal plate 60 is made of a material with high electrostatic capacity and can serve as a ground configuration. Accordingly, when a current is applied to the metal plate 60, the potential of the metal plate 60 is maintained at a constant potential so that the current flowing into the metal plate 60 is absorbed by the metal plate 60. Current does not flow to the substrate 40 through (60).

In addition, all of the side wiring 46 of the substrate 40 is provided to be surrounded by the side cover 90, and thus the side wiring 46 is sealed so as not to be exposed to the outside, so that the side wiring 46 is not exposed to the outside. Even if static electricity is discharged, current may not flow into the side wiring 46 due to the side cover 90.

For example, in the case of the side end 47S of the anisotropic conductive layer 47, it is disposed between the side end 91 of the side cover 90 and the side end 75 of the front cover 70, so that a part of the anisotropic conductive layer 47 is outside. may be exposed. For example, a defect may occur during the manufacturing process of the display module 30, causing separation between the anisotropic conductive layer 47 and the front cover 70 or the substrate 40, and the application and curing process of the side cover 90. Separation from the anisotropic conductive layer 47 may occur.

At this time, due to discharge of static electricity, current flows into the display module (30A-30P) through the anisotropic conductive layer 47, which is located adjacent to the electric field configuration and has low hardness and low resistance to electricity, and is mounted on the substrate 40. Current may flow into electrical components such as side wiring, causing damage to the components.

Each display module (30A-30P) is independently prepared with a non-conductive material to block current generated by electrostatic discharge from flowing into the component mounted on the substrate 40, and the substrate 40 is sealed. It includes a front cover 70 and a side cover 90, and the front cover 70 and the side cover 90 are easily connected to a metal plate 60 that serves as a ground for the current formed due to discharge of static electricity. It can be arranged to guide you accordingly.

but. To prevent current from flowing into the anisotropic conductive layer 47 disposed between the front cover 70 and the side cover 90, the display device 1 has a side end that covers the anisotropic conductive layer 47 from the outside. It may include a member 100.

As an example, one end 101 of the side end member 100 may be provided to extend downward from the front end 79 of the front cover 70 in the first direction (X). The other end 102 of the side end member 100 may be provided to pass through the anisotropic conductive layer 47 from the one end 101 in the first direction (X).

For example, the other end 102 of the side end member 100 may be provided to extend from the one end 101 to at least a portion of the side 65 of the metal plate 60 in the first direction (X).

For example, the other end 102 of the side end member 100 may be provided to extend from one end 101 to at least a portion of the side cover 90 in the first direction (X).

For example, the side end member 100 may be provided to seal the side end 75 of the front cover 70 so that the side end 75 of the front cover 70 is not exposed to the outside.

For example, the side end member 100 may seal the side end 47S of the anisotropic conductive layer 47 so that the side end 47S of the anisotropic conductive layer 47 is not exposed to the outside.

For example, the side end member 100 may seal the side end 91 of the side cover 90 so that the side end 91 of the side cover 90 is not exposed to the outside.

For example, the side end member 100 may seal the outer edge between the front cover 70 and the anisotropic conductive layer 47 so that the contact surface between the front cover 70 and the anisotropic conductive layer 47 is not exposed to the outside.

For example, the side end member 100 may seal the outer edge between the front cover 70 and the anisotropic conductive layer 47 so that the contact surface between the front cover 70 and the anisotropic conductive layer 47 is not exposed to the outside.

For example, the side end member 100 may seal the outer end between the side cover 90 and the anisotropic conductive layer 47 so that the contact surface between the side cover 90 and the anisotropic conductive layer 47 is not exposed to the outside.

For example, the side end member 100 may seal the outer end between the side cover 90 and the metal plate 47 so that the portion where the side cover 90 and the metal plate 60 contact is not exposed to the outside.

For example, the side end member 100 may seal the side end 91 of the side cover 90 so that the side end 91 of the side cover 90 is not exposed to the outside.

For example, the side end member 100 may cover the side end 75 of the front cover 70 so that the side end 75 of the front cover 70 is not exposed to the outside.

For example, the side end member 100 may cover the side end 47S of the anisotropic conductive layer 47 so that the side end 47S of the anisotropic conductive layer 47 is not exposed to the outside.

For example, the side end member 100 may cover the side end 91 of the side cover 90 so that the side end 91 of the side cover 90 is not exposed to the outside.

For example, the side end member 100 may cover the outer edge between the front cover 70 and the anisotropic conductive layer 47 so that the contact surface between the front cover 70 and the anisotropic conductive layer 47 is not exposed to the outside.

For example, the side end member 100 may cover the outer edge between the front cover 70 and the anisotropic conductive layer 47 so that the contact surface between the front cover 70 and the anisotropic conductive layer 47 is not exposed to the outside.

For example, the side end member 100 may cover the outer edge between the side cover 90 and the anisotropic conductive layer 47 so that the contact surface between the side cover 90 and the anisotropic conductive layer 47 is not exposed to the outside.

For example, the side end member 100 may cover the outer edge between the side cover 90 and the metal plate 47 so that the portion where the side cover 90 and the metal plate 60 contact is not exposed to the outside.

As an example, the side end member 100 may be provided to seal the entire side 45 of the substrate 40.

For example, the side end member 100 may seal the contact surface between the front cover 70 and the anisotropic conductive layer 47 from the outside.

As an example, the side end member 100 may seal the contact surface between the side cover 90 and the anisotropic conductive layer 47 from the outside.

As an example, the side end member 100 may seal the portion where the side cover 90 and the metal plate 60 are in contact from the outside.

As an example, the side end member 100 may seal the side cover 90 from the outside.

As an example, the side end member 100 has a contact surface between the front cover 70 and the anisotropic conductive layer 47, a contact surface between the side cover 90 and the anisotropic conductive layer 47, and a contact surface between the side cover 90 and the metal plate 60. ) and the side cover 90 can all be sealed from the outside.

The side end member 100 may be arranged to be disposed at the lateralmost end of the display modules 30A-30P based on the display surface of the display modules 30A-30P. The display surface of the display module (30A-30P) is the lateralmost edge of the screen where the image is displayed by the plurality of inorganic light-emitting elements 50 in the display module (30A-30P) and the lateral edge 75 of the front cover 70. can be defined.

As an example, the side end member 100 may be made of a non-conductive material.

As an example, the side end member 100 includes the side end 75 of the front cover 70, the side end 47S of the anisotropic conductive v 47, the side end 91 of the side cover 90, and the side end of the metal plate 60. At least a portion of (65) may be prepared through a coating process.

As an example, the side end member 100 includes the side end 75 of the front cover 70, the side end 47S of the anisotropic conductive v 47, the side end 91 of the side cover 90, and the side end of the metal plate 60. It can be prepared by transcribing at least part of (65).

As an example, the side end member 100 may include a polyester material.

As an example, the side end member 100 may be made of a black-colored material.

As an example, since the side end 47S of the anisotropic conductive layer 47 is not exposed to the outside by the side end member 100, the current due to electrostatic discharge does not flow into the anisotropic conductive layer 47 and flows through the metal along the side end member 100. It can be guided by a plate 60.

For example, since the adhesive surface of the front cover 70 and the anisotropic conductive layer 47 is not exposed to the outside by the side end member 100, the current due to electrostatic discharge is not connected to the adhesive surface of the front cover 70 and the anisotropic conductive layer 47. It may be guided to the metal plate 60 along the side end member 100 without flowing into the surface.

As described above, the side end member 100 has a contact surface between the front cover 70 and the anisotropic conductive layer 47, a contact surface between the side cover 90 and the anisotropic conductive layer 47, and a contact surface between the side cover 90 and the metal plate. As both the contact portion (60) and the side cover (90) are sealed from the outside, the current due to electrostatic discharge flows between the contact surface of the front cover (70) and the anisotropic conductive layer (47) and the side cover (90). ESD performance can be improved by flowing to the metal plate 60 on the side end member 100 instead of flowing into the contact surface of the conductive layer 47 and the contact area between the side cover 90 and the metal plate 60.

For example, the side end member 100 may be disposed at the lateralmost end of the first display module 30A and the second display module 30B, respectively. The side cover 100A of the first display module 30A and the side cover 100B of the second display module 30B may be arranged parallel to each other. The side cover 100A of the first display module 30A and the side cover 100B of the second display module 30B may be placed in contact with each other.

Accordingly, the spacing (d) between the lateralmost end of the first display module 30A and the second display module 30B is the lateral end of the side cover 100A of the first display module 30A and the lateral end of the second display module 30B. It may be the same as the thickness of the cover 100B.

In the case where the side end member 100 is not present, a metal plate 60 is additionally installed to prevent the current resulting from the discharge of the rectifier from flowing into the anisotropic conductive layer 47 or the adhesive surface of the anisotropic conductive layer 47 and the front cover 70. A ground member that is grounded may be disposed at the lateralmost end of the display modules 30A-30P. The grounding member is generally made of metal and has a thickness of a predetermined size or more. The grounding member can increase the gap between the lateralmost ends of the display modules (30A-30P), and accordingly, the space between the display modules (30A-30P) can be increased. The awareness of the deliberation may increase.

However, as ESD resistance due to electrostatic discharge is improved by the side end member 100 even without a grounding member, a grounding member is not disposed at the lateralmost end of the display modules 30A-30P, and accordingly, the lateralmost end of the display modules 30A-30P The spacing (d) between the sides is minimized, which may reduce the recognition of the core.

The side end member 100 may be made of a material having a black color. The side member 100 is located in the gap (G) between the display modules (30A-30P) and absorbs the light irradiated into the gap (G) between the display modules (30A-30P) to display the light to the display module (30A-30P). This may reduce the visibility of deliberations between users.

The side end member 100 may be provided to cover the side end 75 of the front cover 70. In addition, as described above, the side end member 100 is provided to have a black color, and a portion of the light emitted by the plurality of inorganic light-emitting elements 50 is transmitted through the side end 75 of the front cover 70. This can prevent light leakage.

For example, as one end 101 of the side end member 100 is disposed at a position corresponding to the front end 79 of the front cover 70, the side end member 100 covers the entire side end 75 of the front cover 70. It is provided to cover, and accordingly, the side end member 100 absorbs the light transmitted from the inside of the front cover 70 to the side end 75, thereby blocking light leakage that may occur from the display module 30 to the side.

As an example, the side end member 100 may be made of a moisture-proof material. The side end member 100 allows a solution, such as moisture, to pass between the side end 47 of the anisotropic conductive layer 47 and the side end 75 of the front cover 70, or between the side end 47 of the anisotropic conductive layer 47 and the side cover ( It is possible to prevent inflow between the side ends 91 of the 90). As described above, the side cover 90 is provided to seal the edges of the display modules 30A-30P, so that the side wiring 46 and the side wiring 46 It covers the first end 46b, the side 45, and the back pad 43e connected to the side wiring 46 and is provided to prevent solutions such as moisture from penetrating from the outside. Additionally, a side end member 100 is provided on the side. By sealing the cover 90, solutions such as moisture can be prevented from penetrating into the side end member 100.

As an example, the side end member 100 may be made of a material that is water repellent. It may be arranged so that a solution such as moisture cannot penetrate the side end member 100 and flows on the side end member 100 .

As an example, the side end member 100 is replaced with a liquid-proof material to prevent the solution from being absorbed into the side end member 100 and flowing to the side wiring 46, the back pad 43e, or the side 45. It can be provided.

As described above, even if the side wiring 46 is exposed to the outside by the coating member 46e surrounding the side wiring 46, some external solution can be prevented from flowing into the side wiring 46. However, if the external solution has an alkaline base such as a cleaning solution, the coating member 46e may be removed by the alkaline solution and the side wiring 46 may be damaged. The side end member 100 includes not only a side cover 90 that covers the entire side wiring 46, but also a contact surface between the front cover 70 and the anisotropic conductive layer 47, and a contact surface between the side cover 90 and the anisotropic conductive layer 47. By sealing both the contact surface and the part where the side cover 90 and the metal plate 60 come into contact, the side wiring 46 and the electrical components mounted on the board 40 can be prevented from being damaged by external solutions. there is.

Below, a method of manufacturing the display module 30 according to an embodiment of the present invention will be briefly described.

FIG. 8 is a diagram showing a manufacturing process of a display device according to an embodiment of the present invention, FIG. 9 is a diagram showing a manufacturing process of a display device after FIG. 8, and FIG. 10 is a diagram showing a manufacturing process of a display device after FIG. 9. It is a drawing showing the manufacturing process, FIG. 11 is a drawing showing the manufacturing process of the display device after FIG. 10, and FIG. 12 is a drawing showing the manufacturing process of the display device after FIG. 11.

First, as shown in FIG. 8, a substrate 40 is prepared on which the TFT layer 44 is formed on the mounting surface 41, and the anisotropic conductive film 47X is adhered on the TFT layer 41. .

The anisotropic conductive film (47X) refers to the state before being cut into the anisotropic conductive layer (47) of the display module (30).

The area of the anisotropic conductive film 47X may be prepared to be larger than the area of the substrate 40.

When the side end 47S of the anisotropic conductive layer 47 is disposed outside the side cover 90, the side end 47S of the anisotropic conductive layer 47 is in the gap G between the plurality of display modules 30A-30P. ) can be placed. Accordingly, the side edge 47S of the anisotropic conductive layer 47 may be recognized as a seam between the plurality of display modules 30A-30P, thereby deteriorating the sense of unity of the screen displayed on the display panel 20.

Additionally, current generated by electrostatic discharge may flow into the display module through the side end 47S of the anisotropic conductive layer 47, causing damage to the electrical components mounted inside the display module.

That is, when static electricity is discharged around the display module 30, the side end 47S of the anisotropic conductive layer 47 is exposed to the outside and flows into the display module 30 through the side end 47S of the anisotropic conductive layer 47. The display module 30 may be damaged due to high voltage electricity flowing in.

To prevent this, as described above, the anisotropic conductive film 47

As the anisotropic conductive film (47 , ESD performance can be improved as the side end member 100 seals the side end 47S of the anisotropic conductive layer 47 after the cutting process.

Next, the front cover 70X is attached to the mounting surface 41 of the prepared display module 30. The front cover (70X) here refers to the front cover (70X) before cutting. The front cover 70X may be provided to cover the entire area of the mounting surface 41.

As an example, the front cover 70X may be formed through a compression hardening process on the mounting surface 41. For example, the front cover 70X may be bonded to the mounting surface 41 through lamination.

Next, the metal plate 60 can be attached to the back surface 43 of the substrate 40 as shown in FIG. 9.

A rear adhesive tape 61 is disposed on the upper surface of the metal plate 60 in the first direction (X), and when the rear adhesive tape 61 and the back surface 43 of the substrate 40 are pressed, the rear adhesive tape 61 is It may be provided to adhere the substrate 40 and the metal plate 60.

However, the rear adhesive tape 61 is not limited to this, and the rear adhesive tape 61 is disposed on the rear surface 43 of the substrate 40, and the metal plate 60 may be pressed to the rear adhesive tape 61 disposed on the rear surface 43. there is.

Next, as shown in FIG. 10, from the back of the front cover 70X in the first direction Dispense the side cover (90X). The side cover (90X) here refers to the side cover (90X) before being cut along with the front cover (90X).

A predetermined amount may be applied to the side cover 90X using a dispenser D. The applied side cover (90X) can be cured through subsequent operations. The side cover 90X may be formed of non-electrical black resin, for example.

The side cover (90X) is the back of the front cover (70X), the anisotropic conductive film (47X) located on the back of the front cover (70X), the side 45 and the chamfer portion 49 of the substrate 40, and the substrate 40. ) may be applied so as to completely cover the portion where the rear surface 43 of the metal plate 60 is in contact with the metal plate 60 and at least a portion of the side surface 65 of the metal plate 60.

The dispensing operation of the side cover 90X can be performed on all four edges E of the substrate 40. Accordingly, the side cover 90X can be dispensed to cover the entire side 45 of the substrate 40. Additionally, the entire area 47X of the anisotropic conductive layer 47 disposed outside the mounting surface 41 can be covered by the side cover 90X.

As the side cover (90X) is cured, the anisotropic conductive film (47X) located on the back of the front cover (70X), the side surface (45) and the chamfer portion (49) of the substrate (40), and the substrate It may be provided to be adhered to both the portion where the rear surface 43 of the metal plate 60 is in contact with the metal plate 60 and at least a portion of the side surface 65 of the metal plate 60.

If the side cover (90X) contains a photosensitive material, the side cover (90X) can be colored in a dark color by irradiating ultraviolet rays (UX) as a follow-up operation. However, when the side cover 90X does not contain a photosensitive material and is made of a translucent or opaque material, this manufacturing process is unnecessary.

Next, as shown in FIG. 11, at least a portion of the front cover 70 ) The front cover (70X), the anisotropic conductive film (47X), and the side cover (90X) are cut in the first direction (X) to extend outward.

The cutting process may be performed by laser (L) cutting, etc. Accordingly, the front cover (70X), the anisotropic conductive film (47X), and the side cover (90X) can be cut simultaneously.

As the anisotropic conductive film 47 .

The cutting process is performed not only in the second direction (Y) but also in the third direction (Z) perpendicular to the first direction (X) and the second direction (Y), and the front cover 70X includes a first area 71. The front cover (70X) and the side cover (90X) can be cut so that the side cover (90X) is arranged in the second direction (Y) and third direction (Z).

That is, the cutting process can be performed on all four edges E of the substrate 40.

Next, as shown in FIG. 12, the side member 100 can be coated on the side edge of the substrate 40.

One end 101 of the side member 100 is provided at a position corresponding to the front end 79 of the front cover 70, and the other end 102 of the side member 100 is provided on the side 65 of the metal plate 60. ) The side member 100 may be coated to be disposed on at least a portion of the surface.

As described above, the display module 30 is a substrate 40 including a mounting surface 41 on which the TFT layer 44 is formed, a side 45, and a back surface 43 disposed on the opposite side of the mounting surface 41. and a plurality of inorganic light-emitting devices 50 mounted on the mounting surface 41, and an anisotropic device that electrically connects the TFT layer 44 and the plurality of inorganic light-emitting devices 50 and is disposed on the upper surface of the TFT layer 44. A front cover 70 covering the front surface of the conductive layer 47 and the anisotropic conductive layer 47, a side cover 90 surrounding the side surface 45, and a side edge sealing the outer edge of the side cover 90. Includes member 100.

The side end 75 of the front cover 70 extends to an area outside the mounting surface 41. Accordingly, the front cover 70 can easily cover the entire mounting surface 41.

The side end 47S of the anisotropic conductive layer 47 extends to an area outside the mounting surface 41 so as to be disposed at a position corresponding to the side end 75 of the front cover 70.

The side cover 90 is provided to contact the lower surface of the anisotropic conductive layer 47 corresponding to the outer area of the mounting surface 41. Accordingly, the side cover 90 covers the side surface 45 of the substrate 40 and the space between the side surface 45 and the anisotropic conductive layer 47 to easily seal the side edge of the substrate 40.

The side end member 100 is provided to seal between the side end of the front cover 90 and the side end of the anisotropic conductive layer 47. Accordingly, it is possible to prevent light leakage of light irradiated to the side through the front cover 90, and to block current due to electrostatic discharge from flowing into the side edge of the front cover 90 and the side edge of the anisotropic conductive layer 47. there is.

The front end of the side end member 100 is arranged at a position corresponding to the front end of the front cover 70 in the direction toward which the mounting surface 41 faces. Accordingly, the side end member 100 can easily prevent light leakage that may occur in the front cover 70.

As described above, the display module 30 further includes a metal plate 60 attached to the rear surface 43. The side end member 100 is provided to seal from a position corresponding to the front end of the front cover 90 to at least a portion of the side surface of the metal plate 60. Accordingly, the side end member 100 also seals the gap that may occur between the front cover 90 and the metal plate 60 to prevent the gap between the metal plate 60 and the front cover 90 from being exposed from the outside. can do.

The side cover 90 is provided to extend from the lower surface of the anisotropic conductive layer 47 corresponding to the outer area of the mounting surface 41 to at least a portion of the side surface of the metal plate 60. Accordingly, the side cover 90 can prevent the gap between the metal plate 60 and the substrate 40 from being exposed from the outside by sealing the gap that may occur between the substrate 40 and the metal plate 60. there is.

The side end member 100 is made of a moisture-proof material that prevents moisture from penetrating. Accordingly, moisture can be prevented from penetrating from the side edge of the substrate 40.

The side end member 100 is made of a water-repellent material. Accordingly, moisture can be prevented from penetrating from the side edge of the substrate 40.

The side end member 100 has a black color. Accordingly, the recognition of deliberations between the display modules 30 may be reduced.

The side cover 90 has a black color. Accordingly, the recognition of deliberations between the display modules 30 may be reduced.

The side end member 100 is made of a moisture-proof material that prevents moisture from penetrating. Accordingly, moisture can be prevented from penetrating from the side edge of the substrate 40.

The side cover 90 is made of a water-repellent material. Accordingly, moisture can be prevented from penetrating from the side edge of the substrate 40.

Although the technical idea of the present invention has been described above through specific examples, the scope of the present invention is not limited to these examples. Various embodiments that can be modified or modified by a person skilled in the art without departing from the gist of the technical idea of the present invention as specified in the patent claims will also fall within the scope of the present invention.

1: display device 20: display panel
30, 30A - 30P: Display module 40: Substrate
41: Mounting surface 42: Board body
43: back 45: side
46: Side wiring 47: Anisotropic conductive layer
50: Inorganic light emitting element 60: Metal plate
70: Front cover 80: Driving circuit board
90: side cover 100: side cover
110: Ground member

Claims (20)

A substrate including a mounting surface and a side surface on which a TFT layer (Thin Film Transistor) is formed, and a back surface disposed on an opposite side of the mounting surface;
a plurality of inorganic light-emitting devices mounted on the mounting surface;
an anisotropic conductive layer electrically connecting the TFT layer and the plurality of inorganic light emitting devices and disposed on a top surface of the TFT layer;
a front cover covering the front surface of the anisotropic conductive layer;
A side cover surrounding the side surface;
It includes a side end member sealing the outer end of the side cover,
A side edge of the front cover extends to an area outside the mounting surface,
A side end of the anisotropic conductive layer extends to an area outside the mounting surface so as to be disposed at a position corresponding to a side end of the front cover,
The side cover is provided to contact a lower surface of the anisotropic conductive layer corresponding to an area outside the mounting surface,
The side end member is provided to seal between a side end of the front cover and a side end of the anisotropic conductive layer. According to paragraph 1,
A display module wherein the front end of the side end member is arranged at a position corresponding to the front end of the front cover in the direction toward which the mounting surface faces. According to paragraph 1,
Further comprising a metal plate adhered to the rear surface,
The side end member is provided to extend from a position corresponding to the front end of the front cover to at least a portion of the side of the metal plate. According to paragraph 3,
The side cover is provided to extend from a lower surface of the anisotropic conductive layer corresponding to an area outside the mounting surface to at least a portion of a side surface of the metal plate. According to paragraph 1,
A display module wherein the side end member is made of a moisture-proof material that prevents moisture from penetrating. According to paragraph 1,
A display module in which the side end member is made of a water-repellent material. According to paragraph 1,
A display module wherein the side end member has a black color. According to paragraph 1,
The display module has the side cover having a black color. According to paragraph 1,
A display module wherein the side end member is made of a moisture-proof material that prevents moisture from penetrating. According to paragraph 1,
A display module in which the side cover is made of a water-repellent material. According to paragraph 3,
The side end member is provided to seal between the front cover and the anisotropic conductive layer, between the anisotropic conductive layer and the side cover, and between the metal plate and the side cover. A display device comprising a display module array in which a plurality of display modules are horizontally arranged in an M*N matrix form and a frame supporting the plurality of display modules,
The plurality of display modules are each
A substrate including a mounting surface and a side surface on which a TFT layer (Thin Film Transistor) is formed, and a back surface disposed on an opposite side of the mounting surface;
a plurality of inorganic light-emitting devices mounted on the mounting surface;
an anisotropic conductive layer electrically connecting the TFT layer and the plurality of inorganic light emitting devices and disposed on a top surface of the TFT layer;
a front cover covering the front surface of the anisotropic conductive layer;
A side cover surrounding the side surface;
It includes a side end member sealing the outer end of the side cover,
A side edge of the front cover extends to an area outside the mounting surface,
A side end of the anisotropic conductive layer extends to an area outside the mounting surface so as to be disposed at a position corresponding to a side end of the front cover,
The side cover is provided to contact a lower surface of the anisotropic conductive layer corresponding to an area outside the mounting surface,
The side end member is provided to seal between a side end of the front cover and a side end of the anisotropic conductive layer. According to clause 12,
A display device wherein the front end of the side end member is arranged at a position corresponding to the front end of the front cover in the direction toward which the mounting surface faces. According to clause 13,
Further comprising a metal plate adhered to the rear surface,
The side end member is provided to extend from a position corresponding to the front end of the front cover to at least a portion of the side of the metal plate. According to clause 14,
The side cover is provided to extend from a lower surface of the anisotropic conductive layer corresponding to an area outside the mounting surface to at least a portion of a side surface of the metal plate. According to clause 12,
A display device wherein the side end member is made of a moisture-proof material that prevents moisture from penetrating. According to clause 12,
A display device wherein the side end member has a black color. According to clause 15,
The side end member is provided to seal between the front cover and the anisotropic conductive layer, between the anisotropic conductive layer and the side cover, and between the metal plate and the side cover. A substrate including a mounting surface and a side surface on which a TFT layer (Thin Film Transistor) is formed, and a back surface disposed on an opposite side of the mounting surface;
a plurality of inorganic light-emitting devices mounted on the mounting surface;
an anisotropic conductive layer electrically connecting the TFT layer and the plurality of inorganic light emitting devices and disposed on a top surface of the TFT layer;
a metal plate attached to the rear surface;
a front cover covering the front surface of the anisotropic conductive layer;
a side cover that surrounds a side of the substrate and extends from a lower surface of the anisotropic conductive layer to at least a portion of a side of the metal plate;
It includes a side end member disposed on the outer end of the side cover,
The side end member is provided to seal between the front cover and the anisotropic conductive layer, between the anisotropic conductive layer and the side cover, and between the metal plate and the side cover. According to clause 19,
The side end member is provided to extend from a position corresponding to the front end of the front cover to at least a portion of the side of the metal plate.

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