KR20230118007A - Display appartus having display module and manufacturing method thereof - Google Patents

Abstract

According to the spirit of the present invention, the display module is electrically connected to a substrate including a mounting surface on which a plurality of inorganic light emitting elements are mounted and a TFT layer is formed, four side surfaces and a rear surface disposed on the opposite side of the mounting surface, and the TFT layer, A side wiring extending along one pair of side surfaces among four sides, a front cover attached to the mounting surface and covering the mounting surface in a first direction, a metal plate attached to the rear surface, and a side surface covering the side wiring and the side surface. It includes a cover and a side end member disposed at a side end of the side cover and grounded with the metal plate, and the side end member is disposed on only one side of a pair of side surfaces to which the side wiring extends among the four side surfaces.

Description

Display device including display module and manufacturing method thereof {DISPLAY APPARTUS HAVING DISPLAY MODULE AND MANUFACTURING METHOD THEREOF}

The present invention relates to a display device displaying an image by combining modules in which a self-luminous inorganic light emitting device is mounted on a substrate.

The display device is a type of output device that visually displays data information such as text and figures, and images.

In general, as a display device, a liquid crystal panel requiring a backlight or an organic light-emitting diode (OLED) panel made of a film of an organic compound that emits light by itself in response to current has been mainly used. However, the liquid crystal panel has problems in that it has a slow response time, high power consumption, and is difficult to compact because it does not emit light itself and requires a backlight. In addition, OLED panels do not need a backlight because they emit light themselves, and the thickness can be made thin. Vulnerable to burn-in, deterioration) phenomenon. Accordingly, as a new panel to replace them, a micro light emitting diode (microLED or μLED) panel in which an inorganic light emitting device is mounted on a substrate and the inorganic light emitting device itself is used as a pixel is being researched.

A micro light emitting diode display panel (hereinafter referred to as a micro LED panel) is one of flat panel display panels and is composed of a plurality of inorganic light emitting diodes each having a size of 100 micrometers or less.

This LED panel is also a self-light emitting device, but as an inorganic light emitting device, the burn-in phenomenon of OLED does not occur, and brightness, resolution, power consumption, and durability are excellent.

Compared to liquid crystal display (LCD) panels that require a backlight, microLED display panels offer better contrast, response time and energy efficiency. Both organic light-emitting diodes (organic LEDs) and inorganic light-emitting devices, microLEDs, have good energy efficiency, but microLEDs have higher brightness, luminous efficiency, and longer lifespan than OLEDs.

In addition, by arranging the LEDs on the circuit board in pixel units, it is possible to manufacture display modules in units of substrates, and it is easy to manufacture in various resolutions and screen sizes according to customer orders.

The present invention relates to a display device and a method for manufacturing the same, and in particular, to provide a display module suitable for large size and technical features for protection against static electricity of a display module in a display device including the same.

According to the spirit of the present invention, a display module includes a substrate including a mounting surface on which a plurality of inorganic light emitting elements are mounted and a TFT layer is formed, four side surfaces, and a rear surface disposed on the opposite side of the mounting surface, and electrically connected to the TFT layer. A side wiring connected to and extending along one pair of side surfaces among the four side surfaces, a front cover bonded to the mounting surface and covering the mounting surface in the first direction, and a metal plate bonded to the rear surface; A side cover covering the side wiring and the side surface, and a side end member disposed at a side end of the side cover and grounded with the metal plate, wherein the side end member is one pair of the four side surfaces to which the side wiring extends. It is placed only on one of the sides.

The side end member includes a first side end member disposed only on one side of a pair of side surfaces on which the side wire extends among the four side surfaces, and one of a pair of side surfaces on which the side wire does not extend among the four sides. It includes a second side end member additionally disposed on the side of the.

The first side end member and the second side end member are integrally formed, and one side of a pair of side surfaces to which the side wiring extends among the four side surfaces and one of a pair of side surfaces to which the side wiring does not extend. extends along the side.

The side wiring is provided to extend along both of one pair of side surfaces and the other pair of side surfaces among the four side surfaces, and the side end member is provided on one side surface of the pair of side surfaces and one of the other pair of side surfaces. additionally placed on the side.

A side end member disposed on one side of the pair of side surfaces and a side end member additionally disposed on one side surface of the other pair of side surfaces are integrally formed.

The side end member is provided to have greater conductivity than the side cover.

The side end member is provided to have a black-based color.

The side end member is made of a metal material.

According to the spirit of the present invention, in a display device including a display module array in which a plurality of display modules are horizontally arranged in an M*N matrix form and a frame supporting the plurality of display modules, the plurality of display modules, respectively A substrate including a mounting surface on which a plurality of inorganic light emitting elements are mounted and a TFT layer is formed, four side surfaces, and a rear surface disposed opposite to the mounting surface, and a pair of side surfaces electrically connected to the TFT layer A side wiring extending along a side surface of the , a front cover attached to the mounting surface and covering the mounting surface in the first direction, a metal plate attached to the back surface, and a side surface covering the side wiring and the side surface. A cover and a side end member disposed at a side end of the side cover and grounded with the metal plate, wherein the side end member is disposed on only one side of a pair of side surfaces on which the side wiring extends among the four side surfaces .

The plurality of display modules include a first display module and a second display module arranged adjacently in a direction in which side wires of the first display module are disposed, and the first display module is a side end member of the first display module. is arranged to come into contact with a side surface on which the side end member is not disposed among a pair of side surfaces of the second display module to which the side wiring extends.

The first display module is disposed so that a side on which the side end member is not disposed is adjacent to an edge of the frame among a pair of side surfaces along which the side wiring extends, and the frame has the side wiring in the first display module. A frame side end member provided to surround a side surface on which the side end member is not disposed among a pair of extending side members is included.

The frame side end member is provided to extend along the edge of the frame.

The side end member includes a first side end member disposed only on one side of a pair of side surfaces on which the side wire extends among the four side surfaces, and one of a pair of side surfaces on which the side wire does not extend among the four sides. It includes a second side end member additionally disposed on the side of the.

The first side end member and the second side end member are integrally formed, and one side of a pair of side surfaces to which the side wiring extends among the four side surfaces and one of a pair of side surfaces to which the side wiring does not extend. extends along the side.

The first display module is disposed so that the side on which the first side end member and the second side end member are not disposed among the four sides are adjacent to the edges of the frame, respectively, and the frame is in the first display module and a frame side end member provided to surround a side surface on which the first side end member and the second side end member are not disposed.

The side wiring is provided to extend along both of one pair of side surfaces and the other pair of side surfaces among the four side surfaces, and the side end member is provided on one side surface of the pair of side surfaces and one of the other pair of side surfaces. additionally placed on the side.

A side end member disposed on one side of the pair of side surfaces and a side end member additionally disposed on one side surface of the other pair of side surfaces are integrally formed.

The first display module is disposed such that, among the four side surfaces, side surfaces on which the side end member is not disposed are adjacent to edges of the frame, respectively, and the frame is a side surface on which the side end member is not disposed in the first display module. It includes a frame side end member provided to surround them.

The frame is made of a metal material.

According to the spirit of the present invention, in a display device including a display module array in which a plurality of display modules are horizontally arranged in an M*N matrix form and a frame supporting the plurality of display modules, the plurality of display modules, respectively A substrate including a mounting surface on which a plurality of inorganic light emitting elements are mounted and a TFT layer is formed, four side surfaces, and a rear surface disposed opposite to the mounting surface, and a pair of side surfaces electrically connected to the TFT layer A side wiring extending along a side surface of the , a front cover attached to the mounting surface and covering the mounting surface in the first direction, a metal plate attached to the back surface, and a side surface covering the side wiring and the side surface. a cover and a side end member that is grounded with the metal plate and disposed on only one side of a pair of side surfaces on which the side wiring extends among the four side surfaces; and includes at least one display module among the plurality of display modules. Among a pair of side surfaces on which the side wiring extends, a side on which the side end member is not disposed is disposed adjacent to an edge of the frame, and the frame is the side wiring in at least one display module among the plurality of display modules. Of the pair of extended sides, a side end member of the frame is provided to surround the side on which the side end member is not disposed.

The display device according to an embodiment of the present invention is sealed by a front cover and a side cover to the front of each display module, and the bowel is sealed by a metal plate, and is additionally disposed on the side and displayed by a side end member grounded with the metal plate. The ESD withstand voltage can be improved from the discharge of static electricity that may be generated in the display module after manufacturing and transporting the module and assembling the display device.

The display device according to an embodiment of the present invention has a seamless effect in which a seam between display modules is visually invisible by improving the arrangement of side end members of a display module to minimize a gap between adjacent display modules. can

1 is a diagram illustrating a display device according to an embodiment of the present invention;
FIG. 2 is an exploded view illustrating major components of the display device of FIG. 1;
3 is an enlarged cross-sectional view of a part of a display module shown in FIG. 1;
4 is a rear perspective view of one display module of the display device shown in FIG. 1;
5 is a perspective view of some components of one display module shown in FIG. 1;
6 is a cross-sectional view of a portion of the display device of FIG. 1 in a third direction;
Figure 7 is an enlarged cross-sectional view of some components shown in Figure 6;
8 schematically shows a front view of some components of the display device of FIG. 1;
9 is a perspective view of a part of a display module according to another embodiment of the present invention;
10 is a cross-sectional view in a second direction of some components of a display device according to another embodiment of the present invention.
11 is an enlarged cross-sectional view of some components shown in FIG. 10;
12 is a diagram schematically illustrating a front view of some components of a display device according to another embodiment of the present invention;

Since the embodiments described in this specification are only the most preferred embodiments of the present invention and do not represent all of the technical spirit of the present invention, various equivalents or modifications that can replace them at the time of this application are also present in the present invention. It should be understood that it is included in the scope of the rights of

Singular expressions used in the description may include plural expressions unless the context clearly dictates otherwise. It may be exaggerated for a clear description of the shape and size of elements in the drawings.

In this specification, terms such as 'include' or 'have' are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features or It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.

In addition, the meaning of 'identical' in this specification includes properties similar to each other or similar within a certain range. Also, the same means 'substantially the same'. It should be understood that the meaning of substantially the same means that a numerical value corresponding to a manufacturing error range or a numerical value corresponding to a difference within a range that does not have a meaning with respect to a reference value is included in the range of 'the same'.

Hereinafter, a preferred embodiment according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a view showing a display device according to an embodiment of the present invention, FIG. 2 is an exploded view showing the main components of the display device of FIG. 1, and FIG. 3 is a view of one display module shown in FIG. An enlarged cross-sectional view of some components, FIG. 4 is a rear perspective view of one display module of the display device shown in FIG. 1, and FIG. 5 is a perspective view of some components of one display module shown in FIG.

Some components of the display device 1 including the plurality of inorganic light emitting elements 50 shown in the drawing are micro-unit configurations having a size of several μm to hundreds of μm, and for convenience of explanation, some components (a plurality of inorganic light emitting elements) (50), the black matrix 48, etc.) are shown exaggeratedly.

The display device 1 is a device that displays information, data, data, etc. as characters, figures, graphs, images, etc., and TV, PC, mobile, digital signage, etc. will be implemented as the display device 1. can

According to an embodiment of the present invention, as shown in FIGS. 1 and 2, the display device 1 includes a display panel 20 displaying an image and a power supply device (not shown) supplying power to the display panel 20. ), the main board 25 for controlling the overall operation of the display panel 20, the frame 15 supporting the display panel 20, and the rear cover 10 covering the rear surface of the frame 15 can include

The display panel 20 includes a plurality of display modules 30A-30P, a driving board (not shown) for driving each of the display modules 30A-30P, and control of each of the display modules 30A-30P. It may include a TOCN board (Timing controller board) that generates a timing signal required for the.

The rear cover 10 may support the display panel 20 . The rear cover 10 may be installed on the floor through a stand (not shown) or installed on a wall through a hanger (not shown).

The plurality of display modules 30A to 30P may be arranged vertically and horizontally so as to be adjacent to each other. The plurality of display modules 30A-30P may be arranged in an M*N matrix form. In this embodiment, 16 display modules 30A-30P are provided and arranged in a 4*4 matrix, but the number and arrangement of the plurality of display modules 30A-30P are not limited. .

For example, the plurality of display modules 30A to 30P according to an embodiment of the present invention may include a first display module 30A disposed on the uppermost and leftmost sides. A plurality of display modules 30B-30P may be arrayed in a rightward direction or a downward direction with respect to the first display module 30A.

A plurality of display modules 30A-30P may be installed in the frame 15 . The plurality of display modules 30A-30P may be installed in the frame 15 through various known methods such as magnetic force using a magnet or a mechanical fitting structure. A rear cover 10 is coupled to the rear of the frame 15 , and the rear cover 10 may form a rear appearance of the display device 1 .

The rear cover 10 may include a metal material. Accordingly, heat generated from the plurality of display modules 30A-30P and the frame 15 is easily conducted to the rear cover 10 to increase heat dissipation efficiency of the display device 1 .

As such, the display device 1 according to the embodiment of the present invention may implement a large screen by tiling the plurality of display modules 30A to 30P.

Unlike the embodiment of the present invention, each single display module in the plurality of display modules 30A-30P may be applied to a display device. That is, the display modules 30A-30P can be installed and applied to electronic products or electric vehicles that require wearable devices, portable devices, handheld devices, and various displays as a single unit, and can be assembled into a plurality of matrix types as in the embodiment of the present invention. Through arrangement, it can be applied to display devices such as monitors for personal computers (PCs), high-definition TVs and signage, electronic displays, and the like.

The plurality of display modules 30A-30P may have the same configuration as each other. Therefore, the description of any one display module described below can be equally applied to all other display modules.

Hereinafter, since all of the plurality of display modules 30A to 30P are formed identically, the first display module 30A will be described for each of the plurality of display modules 30A to 30P.

That is, in order to avoid overlapping descriptions, the configuration of the plurality of display modules 30A to 30P will be described by representing the display module 30, the substrate 40, and the front cover 70.

Also, if necessary, a first display module 30A among a plurality of display modules 30A-30P and a third display module 30E disposed adjacent to the first display module 30A in the second direction Y. Alternatively, the second display module 30B disposed adjacently in the third direction (Z) will be described.

Also, if necessary, a fifth display module 30I disposed adjacent to the third display module 30E in the second direction Y and disposed opposite to the first display module 30A with respect to the third display module 30E. ), the seventh display module 30M disposed adjacent to the fifth display module 30I and disposed opposite to the third display module 30E with respect to the fifth display module 30I, and in the third direction Z. A fourth display module (30C) disposed adjacent to the second display module (30B) and disposed opposite to the first display module (30A) with respect to the second display module (30B), a fourth display module (30C) in the third direction (Z). The sixth display module 30D disposed adjacent to the display module 30C and disposed opposite the second display module 30B with respect to the fourth display module 30C will also be described.

As an example, the first display module 30A among the plurality of display modules 30A-30P may be formed in a quadrangle type. The first display module 30A may be provided in a rectangular type shape or a square type shape.

Accordingly, the first display module 30A may include edges 31, 32, 33, and 34 formed in up, down, left, and right directions with respect to the first direction X, which is the front.

As shown in FIG. 3 , each of the plurality of display modules 30A to 30P may include a substrate 40 and a plurality of inorganic light emitting elements 50 mounted on the substrate 40 . The plurality of inorganic light emitting devices 50 may be mounted on the mounting surface 41 of the substrate 40 facing the first direction (X). In FIG. 3 , the thickness of the substrate 40 in the first direction (X) is exaggeratedly thick for convenience of description.

The substrate 40 may be formed in a quadrangle type. As described above, each of the plurality of display modules 30A to 30P may be provided in a rectangular shape, and the substrate 40 may be formed in a rectangular shape to correspond thereto.

The substrate 40 may be provided in a rectangular type shape or a square type shape.

Therefore, taking the first display module 30A as an example, the substrate 40 has borders 31, 32, 33, 34) and corresponding four edges E. (See Figure 5)

The first display module 30A has a right rim 31, an upper rim 32, a left rim 33, and a lower rim ( 34) may be included. The right rim 31 and the left rim 33 are disposed to face each other in a left and right second direction Y, and the upper rim 32 and the lower rim 34 face each other in a third direction Z, which is a vertical direction. can be placed.

The substrate 40 has a substrate body 42, a mounting surface 41 forming one surface of the substrate body 42, and a rear surface forming the other surface of the substrate body 42 and disposed on the opposite side of the mounting surface 41 ( 43) and a side surface 45 disposed between the mounting surface 41 and the rear surface 43.

The side surfaces 45 may form side ends of the substrate 40 in the second direction Y and the third direction Z, which are orthogonal to the first direction X.

The substrate 40 may include a chamfer portion 49 formed between the mounting surface 41 and the side surface 45 and between the rear surface 43 and the side surface 45 .

The chamfer portion 49 may prevent each substrate from colliding and being damaged when the plurality of display modules 30A to 30P are arranged.

The edge E of the substrate 40 is a concept including a side surface 45 and a chamfer portion 49 .

The substrate 40 may include a thin film transistor (TFT) layer 44 formed on the substrate body 42 to drive the inorganic light emitting elements 50 . The substrate body 42 may include a glass substrate. That is, the substrate 40 may include a COG (Chip on Glass) type substrate. The substrate 40 may have first and second pad electrodes 44a and 44b provided to electrically connect the inorganic light emitting devices 50 to the TFT layer 44 .

A TFT (Thin Film Transistor) constituting the TFT layer 44 is not limited to a specific structure or type, and may be configured in various embodiments. That is, the TFT of the TFT layer 44 according to an embodiment of the present invention includes not only a low temperature poly silicon (LTPS) TFT, an oxide TFT, and a poly silicon or a-silicon (Si) TFT, but also an organic TFT and a graphene TFT. etc. can also be implemented.

In addition, the TFT layer 44 may be replaced with a CMOS (Complementary Metal-Oxide Semiconductor) type, n-type MOSFET or p-type MOSFET transistor when the substrate body 42 of the substrate 40 is formed of a silicon wafer.

The plurality of inorganic light emitting elements 50 may include inorganic light emitting elements formed of an inorganic material and having a width, length, and height of several μm to several tens of μm, respectively. The micro-inorganic light emitting device may have a short side length of 100 μm or less among width, length, and height. That is, the inorganic light emitting device 50 may be picked up from a sapphire or silicon wafer and directly transferred onto the substrate 40 . The plurality of inorganic light emitting devices 50 may be picked up and transferred through an electrostatic method using an electrostatic head or a stamp method using an elastic polymer material such as PDMS or silicon as a head.

The plurality of inorganic light emitting elements 50 may be a light emitting structure including an n-type semiconductor 58a, an active layer 58c, a p-type semiconductor 58b, a first contact electrode 57a, and a second contact electrode 57b. can

Although not shown in the drawings, one of the first contact electrodes 57a is electrically connected to the second contact electrode 57b and the n-type semiconductor 58a and the other is electrically connected to the p-type semiconductor 58b. can

The first contact electrode 57a and the second contact electrode 57b may be disposed horizontally and may have a flip chip shape disposed in the same direction (a direction opposite to a light emitting direction).

When the inorganic light emitting element 50 is mounted on the mounting surface 41, the light emitting surface 54 disposed toward the first direction X, the side surface 55, and the bottom surface disposed opposite to the light emitting surface 54 ( 56), the first contact electrode 57a and the second contact electrode 57b may be formed on the bottom surface 56.

That is, the contact electrodes 57a and 57b of the inorganic light emitting device 50 are disposed on the opposite side of the light emitting surface 54 and thus may be disposed on the opposite side of the direction in which light is irradiated.

The contact electrodes 57a and 57b are disposed to face the mounting surface 41, are provided to be electrically connected to the TFT layer 43, and emit light in a direction opposite to the direction in which the contact electrodes 57a and 57b are disposed. A light emitting surface 54 may be disposed.

Therefore, when the light generated in the active layer 58c is irradiated in the first direction (X) through the light emitting surface 54, the light is emitted in the first direction without interference of the first contact electrode 57a or the second contact electrode 57b. It may be irradiated toward the direction (X).

That is, the first direction X may be defined as a direction in which the light emitting surface 54 is arranged to emit light.

The first contact electrode 57a and the second contact electrode 57b may be electrically connected to the first pad electrode 44a and the second pad electrode 44b formed on the mounting surface 41 side of the substrate 40, respectively. there is.

The inorganic light emitting device 50 may be directly connected to the pad electrodes 44a and 44b through an anisotropic conductive layer 47 or a bonding structure such as solder.

An anisotropic conductive layer 47 may be formed on the substrate 40 to mediate electrical bonding between the contact electrodes 57a and 57b and the pad electrodes 44a and 44b. The anisotropic conductive layer 47 is formed by attaching an anisotropic conductive adhesive on a protective film, and may have a structure in which conductive balls 47a are spread on an adhesive resin. The conductive ball 47a is a conductive sphere surrounded by a thin insulating film and can electrically connect conductors to each other while the insulating film is broken by pressure.

The anisotropic conductive layer 47 may include an anisotropic conductive film (ACF) in a film form and an anisotropic conductive paste (ACP) in a paste form.

In an embodiment according to the present invention, the anisotropic conductive layer 47 may be formed of an anisotropic conductive film.

Therefore, when a plurality of inorganic light emitting elements 50 are mounted on the substrate 40, when pressure is applied to the anisotropic conductive layer 47, the insulating film of the conductive balls 47a is broken, thereby forming contact electrodes of the inorganic light emitting elements 50. 57a and 57b may be electrically connected to the pad electrodes 44a and 44b of the substrate 40 .

However, although not shown in the drawing, the plurality of inorganic light emitting devices 50 may be mounted on the substrate 40 through solder (not shown) instead of the anisotropic conductive layer 47 . After the inorganic light emitting device 50 is aligned on the substrate 40 , the inorganic light emitting device 50 may be bonded to the substrate 40 through a reflow process.

The plurality of inorganic light emitting elements 50 may include a red light emitting element 51, a green light emitting element 52, and a blue light emitting element 53, and the light emitting elements 50 is a mounting surface of the substrate 40 with a series of red light emitting elements 51, green light emitting elements 52, and blue light emitting elements 53 as a unit It can be mounted on (41). A series of red light emitting elements 51, green light emitting elements 52, and blue light emitting elements 53 may form one pixel. In this case, each of the red light emitting element 51, green light emitting element 52, and blue light emitting element 53 may form a subpixel.

The red light emitting element 51, the green light emitting element 52, and the blue light emitting element 53 may be arranged in a line at predetermined intervals as in the embodiment of the present invention, or may be arranged in a triangle. It may also be arranged in other forms, such as shapes.

The substrate 40 may include a light absorbing layer 44c to improve contrast by absorbing external light. The light absorption layer 44c may be formed on the entire mounting surface 41 side of the substrate 40 . The light absorption layer 44c may be formed between the TFT layer 43 and the anisotropic conductive layer 47 .

The plurality of display modules 30A to 30P may further include a black matrix 48 formed between the plurality of inorganic light emitting elements 50 .

The black matrix 48 may perform a function of supplementing the light absorption layer 44c entirely formed on the mounting surface 41 side of the substrate 40 . That is, the black matrix 48 absorbs external light to make the substrate 40 appear black, thereby improving the contrast of the screen.

The black matrix 48 may preferably have a black color.

In this embodiment, the black matrix 48 is a pixel formed by a series of red light emitting elements 51, green light emitting elements 52, and blue light emitting elements 53. It is formed to be disposed between the pixels. However, unlike the present embodiment, the light emitting elements 51, 52, and 53, which are sub-pixels, may be formed more precisely to partition each other.

The black matrix 48 may be formed in a lattice shape having a horizontal pattern and a vertical pattern to be disposed between pixels.

The black matrix 48 may be formed by applying a light absorbing ink on the anisotropic conductive layer 47 through an ink-jet process and then curing it, or by coating a light absorbing film on the anisotropic conductive layer 47. can

That is, in the anisotropic conductive layer 47 entirely formed on the mounting surface 41, a black matrix 48 is formed between the plurality of inorganic light emitting elements 50 on which the plurality of inorganic light emitting elements 50 are not mounted. can be formed.

The plurality of display modules 30A-30P are front covers disposed on the mounting surface 41 in the first direction X to cover the mounting surface 41 of the plurality of display modules 30A-30P, respectively ( 70) may be included.

The front cover 70 may be provided in plurality so as to be respectively formed on the plurality of display modules 30A to 30P in the first direction (X). (See FIGS. 6 and 7)

The plurality of display modules 30A-30P may be assembled after each separate front cover 70 is formed. That is, as an example, the first display module 30A and the second display module 30B among the plurality of display modules 30A-30P are on the mounting surface 41 of the first display module 30A, the first front cover 70A. ) may be formed and a second front cover 70B may be formed on the mounting surface 41 of the second display module 30B.

The front cover 70 is provided to cover the substrate 40 and can protect the substrate 40 from external force or external moisture.

A plurality of layers (not shown) of the front cover 70 may be provided with a functional film having optical performance. This will be described later in detail.

Some of the plurality of layers (not shown) of the front cover 70 may include a base layer (not shown) formed of Optical Clear Resin (OCR). A base layer (not shown) may be provided to support a plurality of other layers (not shown). The optically clear resin (OCR) may be in a very transparent state having a transmittance of 90% or more.

All optically transparent resins (OCR) can improve visibility and image quality by increasing transmittance through low reflection characteristics. That is, in the structure with an air gap, light loss occurs due to the difference in refractive index between the film layer and the air layer, but in the structure using optically transparent resin (OCR), the difference in refractive index is reduced, thereby reducing the loss of light and consequently improving visibility and Image quality can be improved.

That is, the optically transparent resin (OCR) may have advantages in terms of improving image quality as well as protecting the substrate 40 .

The front cover 70 may include an adhesive layer (not shown) provided so that some of the plurality of layers (not shown) adhere the front cover 70 to the mounting surface 41 of the substrate 40 .

In general, the front cover 70 may be provided to have a height equal to or higher than a predetermined height in the first direction X toward which the mounting surface 41 or the light emitting surface 54 faces.

This is to sufficiently fill a gap that may be formed between the front cover 70 and the plurality of inorganic light emitting elements 50 when the front cover 70 is formed on the substrate 40 .

Each of the plurality of display modules 30A to 30P may include a metal plate 60 disposed on the rear surface 43 of the substrate 40 .

In addition, the plurality of display modules (30A-30P) is a rear adhesive tape ( 61) may be included.

The rear adhesive tape 61 may be provided as a double-sided adhesive tape, but is not limited thereto and may be provided in an adhesive layer shape rather than a tape shape. That is, the rear adhesive tape 61 is an embodiment of a medium for bonding the metal plate 60 and the rear surface 43 of the substrate 40, and may be provided in various media shapes without being limited to the tape.

The plurality of inorganic light emitting devices 50 extend through the pixel driving wiring (not shown) formed on the mounting surface 41 and the side surface 45 of the substrate 40 and form the pixel driving wiring (not shown). It may be electrically connected to a wiring layer (not shown).

An upper wiring layer (not shown) may be formed below the anisotropic conduction layer 47 . The upper wiring layer (not shown) may be electrically connected to the side wiring 46 formed on the side surface 45 of the substrate 40 . The side wiring 46 may be provided in the form of a thin film. The side wiring 46 may include a coating member 46a surrounding the side wiring 46 to prevent damage that may occur when the side wiring 46 is exposed to the outside. (See Fig. 7)

The side wiring 46 extends to the back surface 43 of the substrate 40 along the chamfer portion 49 and the side surface 45 of the substrate 40 in the third direction Z along the third direction Z. It can be. That is, the side wiring 46 may extend from the upper edge 32 and the lower edge 34 to the rear surface 43 of the substrate 40 along the chamfer 49 and the side surface 45 of the substrate 40. there is.

The top wiring layer (not shown) may be connected to the side wiring 46 by a top connection pad (not shown) formed on the edge E side of the substrate 41 .

The side wiring 46 may extend along the side surface 45 of the substrate 40 and be connected to the rear wiring layer 43b formed on the rear surface 43 .

An insulating layer 43c covering the rear wiring layer 43b may be formed on the rear wiring layer 43b in a direction in which the rear surface of the substrate 40 faces.

That is, the plurality of inorganic light emitting elements 50 may be sequentially electrically connected to an upper wiring layer (not shown), a side wiring 46, and a rear wiring layer 43b.

Also, as shown in FIG. 4 , the display module 30A may include a driving circuit board 80 provided to electrically control the plurality of inorganic light emitting devices 50 mounted on the mounting surface 41 . The driving circuit board 80 may be formed of a printed circuit board. The driving circuit board 80 may be disposed on the rear surface 43 of the board 40 in the first direction (X). It may be disposed on the metal plate 60 adhered to the back surface 43 of the substrate 40 .

The display module 30A may include a flexible film 81 connecting the driving circuit board 80 and the rear wiring layer 43b so that the driving circuit board 80 is electrically connected to the plurality of inorganic light emitting elements 50. there is.

In detail, one end of the flexible film 81 may be connected to a rear surface connection pad 43d disposed on the rear surface 43 of the substrate 40 and electrically connected to the plurality of inorganic light emitting devices 50 .

The rear connection pad 43d may be electrically connected to the rear wiring layer 43b. Accordingly, the rear connection pad 43d can electrically connect the rear wiring layer 43b and the flexible film 81.

As the flexible film 81 is electrically connected to the rear connection pad 43d, power and quasi-periodic signals may be transferred from the driving circuit board 80 to the plurality of inorganic light emitting devices 50.

The flexible film 81 may be formed of a flexible flat cable (FFC) or a chip on film (COF).

The flexible film 81 may include a first flexible film 81a and a second flexible film 81b respectively disposed in the vertical direction with respect to the first direction X, which is the forward direction.

The first and second flexible films 81a and 81b are not limited thereto and may be disposed in left and right directions with respect to the first direction (X), or in at least two directions of up, down, left, and right directions.

A plurality of second flexible films 81b may be provided. However, it is not limited thereto, and the second flexible film 81b may be provided as a single piece, and the first flexible film 81a may also be provided as a plurality of pieces.

The first flexible film 81a may transfer data signals from the driving circuit board 80 to the board 40 . The first flexible film 81a may be made of COF.

The second flexible film 81b may transmit power from the driving circuit board 80 to the board 40 . The second flexible film 81b may be made of FFC.

However, it is not limited thereto, and the first and second flexible films 81a and 81b may be formed opposite to each other.

Although not shown in the drawings, the driving circuit board 80 may be electrically connected to the main board 25 (refer to FIG. 2). The main board 25 may be disposed on the rear side of the frame 15 , and the main board 25 may be connected to the driving circuit board 80 through a cable (not shown) at the rear of the frame 15 .

A fixing member 82 provided to adhere the display modules 30A to 30P to the frame 15 may be disposed on the rear surface of the metal plate 60 . The fixing member 82 may preferably be provided with double-sided tape. The metal plate 60 forming the rear of the display modules 30A-30P is directly attached to the frame 15 by the fixing member 82 so that the display modules 30A-30P can be supported by the frame 15. there is.

As described above, the metal plate 60 may be provided to contact the substrate 40 . The metal plate 60 and the substrate 40 may be bonded by the rear adhesive tape 61 disposed between the rear surface 43 of the substrate 40 and the metal plate 60 .

FIG. 5 shows the substrate 40 in a state where components such as the anisotropic conductive layer 47 are excluded from the substrate 40 for convenience of description. In addition, the side wiring 46 includes a coating member 46a that protects the side wiring 46 from the outside, and the coating member 46a is omitted for convenience of description.

The metal plate 60 may be formed of a metal material having high thermal conductivity. For example, the metal plate 60 may be made of aluminum.

Heat generated from the plurality of inorganic light emitting devices 50 and the TFT layer 44 mounted on the substrate 40 is transferred to the metal plate 60 through the rear adhesive tape 61 along the rear surface 43 of the substrate 40. can be forwarded to

Accordingly, heat generated from the substrate 40 can be easily transferred to the metal plate 60 and the substrate 40 can be prevented from rising above a certain temperature.

The plurality of display modules 30A-30P may be arranged in various positions in an M*N matrix form. Each of the display modules 30A-30P is individually movable. At this time, each of the display modules 30A-30P individually includes the metal plate 60 to maintain a constant level of heat dissipation performance regardless of where each display module 30A-30P is disposed. can

A plurality of display modules 30A to 30P may form screens of various sizes of the display device 1 in the form of various M * N matrices. Accordingly, rather than dissipating heat through a single metal plate provided for heat dissipation, each display module (30A-30P) includes an independent metal plate 60 as in one embodiment of the present invention, so that each display module When each of the 30A to 30P dissipates heat individually, the heat dissipation performance of the display device 1 as a whole can be improved.

When a single metal plate is disposed inside the display device 1, a part of the metal plate may not be disposed at a position corresponding to a position where some display modules are disposed based on the front and rear directions, and a display module may not be disposed. A metal plate may be disposed at the location, and heat dissipation efficiency of the display device 1 may be reduced.

That is, through the metal plate 60 disposed on each of the display modules 30A-30P, no matter where the display modules 30A-30P are disposed, all the display modules 30A-30P are respectively Since self heat dissipation is possible by the metal plate 60 , heat dissipation performance of the entire display apparatus 1 may be improved.

The metal plate 60 may be provided in a rectangular shape substantially corresponding to the shape of the substrate 40 .

An area of the substrate 40 may be provided at least equal to or greater than that of the metal plate 60 . When the substrate 40 and the metal plate 60 are arranged side by side in the first direction (X), four edges of the substrate 40 having a rectangular shape based on the center of the substrate 40 and the metal plate 60 may be formed to correspond to the four edges of the metal plate 60 or may be provided to be disposed outside the four edges of the metal plate 60 relative to the center of the substrate 40 and the metal plate 60 .

Preferably, the four edges E of the substrate 40 may be disposed outside the four edges of the metal plate 60 . That is, the area of the substrate 40 may be larger than that of the metal plate 60 .

When heat is transferred to each of the display modules 30A-30P, the substrate 40 and the metal plate 60 may thermally expand. The metal plate 60 has a higher thermal expansion rate than the substrate 40, and the metal plate ( 60) is higher than the expansion value of the substrate 40.

At this time, when the four edges E of the substrate 40 correspond to the four edges of the metal plate 60 or are disposed further inside. An edge of the metal plate 60 may protrude outward from the substrate 40 .

Accordingly, the separation length of the gap formed between each of the display modules 30A to 30P may be irregularly formed by thermal expansion of the metal plate 60 of each of the modules 30A to 30P. A sense of unity of the screen of the display panel 20 may decrease due to an increase in cognition.

However, when the four edges E of the substrate 40 are arranged outside the four edges of the metal plate 60, even if the substrate 40 and the metal plate 60 are thermally expanded, the substrate 40 The metal plate 60 does not protrude outside the four edges E of the display module 30A to 30P, and accordingly, the separation length of the gap formed between the respective display modules 30A to 30P may be maintained constant.

According to an embodiment of the present invention, the area of the substrate 40 and the area of the metal plate 60 may be prepared to substantially correspond to each other. Accordingly, heat generated from the substrate 40 may be uniformly dissipated in the entire area of the substrate 40 without being isolated in a partial area.

The metal plate 60 may be provided to be adhered to the rear surface 43 of the substrate 40 by a rear adhesive tape 61 .

The rear adhesive tape 61 may be provided in a size corresponding to that of the metal plate 60 . That is, the area of the rear adhesive tape 61 may be prepared to correspond to the area of the metal plate 60 . The metal plate 60 may be provided in a substantially rectangular shape, and the rear adhesive tape 61 may be provided in a rectangular shape to correspond thereto.

An edge of the rectangular metal plate 60 and an edge of the rear adhesive tape 61 may be formed to correspond to each other based on the center of the metal plate 60 and the rear adhesive tape 61 .

Accordingly, since the metal plate 60 and the rear adhesive tape 61 can be easily manufactured as a single coupling structure, the manufacturing efficiency of the entire display device 1 can be increased.

That is, when the metal plate 60 is cut into unit numbers from one plate, the rear adhesive tape 61 is pre-bonded to one plate before the metal plate 60 is cut, and the rear adhesive tape 61 and the metal The plate 60 may be simultaneously cut in unit numbers to reduce the process.

Heat generated from the substrate 40 may be transferred to the metal plate 60 through the rear adhesive tape 61 . Accordingly, the rear adhesive tape 61 may be provided to transfer heat generated from the substrate 40 to the metal plate 60 while adhering the metal plate 60 to the substrate 40 .

Accordingly, the rear adhesive tape 61 may include a material having high heat dissipation performance.

Basically, the rear adhesive tape 61 may include an adhesive material to adhere the substrate 40 and the metal plate 60 together.

Additionally, the rear adhesive tape 61 may include a material having higher heat dissipation performance than a material having general adhesiveness. Accordingly, heat can be efficiently transferred between the substrate 40 and the metal plate 60 to each component.

In addition, the adhesive material of the rear adhesive tape 61 may be formed of a material having higher heat dissipation performance than the adhesive material constituting general adhesives.

A material with high heat dissipation performance means a material that can effectively transfer heat with high thermal conductivity, high heat transferability, and low specific heat.

For example, the rear adhesive tape 61 may include a graphite material. However, it is not limited thereto, and the rear adhesive tape 61 may be generally made of a material having high heat dissipation performance.

The ductility of the rear adhesive tape 61 may be provided to be greater than that of the substrate 40 and the ductility of the metal plate 60 . Therefore, the rear adhesive tape 61 may be made of a material having adhesiveness and heat dissipation and high ductility. The rear adhesive tape 61 may be formed of an inorganic double-sided tape. As described above, the rear adhesive tape 61 is formed of an inorganic tape and is formed as a single layer between one side bonded to the substrate 40 and the other side bonded to the metal plate 60 without a substrate supporting one side and the other side. can be formed

Since the back adhesive tape 61 does not include a substrate, it does not include a material that hinders heat conduction, and thus heat dissipation performance can be improved. However, the rear adhesive tape 61 is not limited to the inorganic double-sided tape and may be provided with a heat dissipation tape having better heat dissipation performance than a general double-sided tape.

The rear adhesive tape 61 may be made of a highly flexible material so as to absorb external force transmitted from the substrate 40 and the metal plate 60 . In detail, the ductility of the rear adhesive tape 61 may be provided greater than that of the substrate 40 and the ductility of the metal plate 60 .

Accordingly, when heat is transferred to the substrate 40 and the metal plate 60 and the external force generated from the size change of the substrate 40 and the metal plate 60 is transferred to the rear adhesive tape 61, the rear adhesive tape 61 As it is deformed, it can prevent an external force from being transmitted to different components.

The rear adhesive tape 61 may have a predetermined thickness in the first direction (X). When heat is transferred to the metal plate 60 to expand or contract due to cooling, the metal plate 60 moves not only in the first direction (X) but also in a direction orthogonal to the first direction (X). It may expand or contract, and thus an external force may be transmitted to the substrate 40 .

As described above, the metal plate 60 is formed in a size corresponding to that of the substrate 40 and is provided to cover the entire rear surface 43 of the substrate 40, and the fixing member 82 is of the metal plate 60. It can be placed on the back side.

However, the fixing member 82 is not limited thereto and may be provided to be disposed on the rear surface 43 of the substrate 40 . At this time, the substrate 40 may be directly attached to the frame 15 through the fixing member 82 .

Unlike one embodiment of the present invention, the metal plate 60 may be provided to cover only a part of the rear surface 43 of the substrate 40, and the metal plate 60 covers the rear surface 43 of the substrate 40. A fixing member 82 may be provided to be adhered to an area that is not.

The fixing member 82 may preferably be provided with double-sided tape.

Hereinafter, the front cover 70, the side cover 90, and the side end member 100 will be described in detail.

6 is a cross-sectional view of some components of the display device of FIG. 1 in a third direction, FIG. 7 is an enlarged cross-sectional view of some components shown in FIG. 6, and FIG. 8 is a front view of some components of the display device of FIG. It is a schematic drawing.

The front cover 70 may protect the substrate 40 from an external force and reduce visibility of a seam formed by the gap G formed between the plurality of display modules 30A-30P. and color deviation between the plurality of display modules 30A-30P can be improved.

The plurality of display modules 30A-30P are side covers ( 90) may be included.

The front cover 70 of each of the display modules 30A-30P absorbs the light reflected in the gap G between the plurality of display modules 30A-30P. ) It may be formed to extend to the outside of the substrate 40. The side end 75 of the front cover 70 may be provided to extend to an area outside the mounting surface 41 .

In detail, the front cover 70 may be provided to extend outward beyond the edge (or side end, Edge, 41S) of the mounting surface 41 of the substrate 40 in the second direction (Y) and the third direction (Z). there is.

Substantially, the gap between each of the display modules 30A-30P may be generated between the side 45 of the substrate 40 of each of the display modules 30A-30P, but in one embodiment of the present invention The meaning gap (G) means a non-display area that can be generated between each of the display modules (30A-30P), the gap (G) formed between a plurality of display modules (30A-30P) This means that from the edge 41S of the mounting surface 41 of the substrate 40 of each of the display modules 30A-30P to the mounting surface 41 of the substrate 40 of the adjacent display modules 30A-30P. It can be understood as a gap formed between the rims 41S.

Therefore, the meaning of the gap G formed between the plurality of display modules 30A-30P is the mounting surface of each of the display modules 30A-30P in the second direction Y or Z. 41) refers to a gap formed between the edges 41S of the mounting surfaces 41 of adjacent display modules 30A-30P.

A front cover 70 extending from each of the display modules 30A-30P is disposed in the gap G between the plurality of display modules 30A-30P, and the light emitted into the gap G or the gap ( By absorbing the light reflected from G), perception of the core can be minimized.

In addition, as will be described later, light irradiated into the gap G is absorbed by the side cover 90 of the plurality of display modules 30A to 30P disposed between the gap G, so that perception of the core can be minimized.

As shown in FIGS. 6 and 7 , the front cover 70 may be provided to extend to the outside of the substrate 40 in the third direction (Z). In detail, the front cover 70 may be provided to extend outwardly from the side surface 45 and the chamfer portion 49 in the third direction (Z).

According to an embodiment of the present invention, only one edge side of the substrate 40 corresponding to the lower edge 34 of the first display module 30A is described, but the front cover 70 is the substrate 40 It may extend outward in the second direction (Y) or the third direction (Z) than the four edges (E) of.

That is, the side end 75 of the front cover 70 corresponding to the edge of the front cover 70 is the substrate than the four edges E of the substrate 40 in the second direction (Y) or the third direction (Z). It may extend to the outer region of 40 and the outer region of mounting surface 41 .

Although not shown in the drawings, the front cover 70 may include a plurality of layers each having different optical properties. Each of the plurality of layers may be provided in a structure in which they are stacked in the first direction (X).

Each of the plurality of layers may be bonded in the first direction (X) to form the front cover 70 .

One of the plurality of layers may be provided as an anti-glare layer. However, it is not limited thereto and may be provided as an anti-reflective layer or a layer in which an anti-glare layer and an anti-reflective layer are mixed.

One layer and another layer among the plurality of layers may be provided as a light transmittance control layer. However, it is not limited thereto and may be formed as a layer that includes other physical properties or materials or has other functions. For example, it may be provided as a circularly polarized light layer.

In addition, it is not limited to one embodiment of the present invention, and a plurality of layers may be provided as a single layer. A single layer may be provided as a layer that can functionally implement all functions of a plurality of layers.

As described above, the front cover 70 may include an adhesive layer. The adhesive layer may be disposed at the rear of the plurality of layers in the first direction (X) and adhered to the mounting surface 41 . The adhesive layer may be provided to have a height greater than or equal to a predetermined height in the first direction X toward which the mounting surface 41 or the light emitting surface 54 faces.

This is to sufficiently fill gaps that may be formed between the adhesive layer and the plurality of inorganic light emitting elements 50 when the adhesive layer is adhered to the substrate 40 .

The adhesive layer is not limited to one embodiment of the present invention and is disposed between the front cover 70 and the mounting surface 41 in a separate configuration from the front cover 70 so that the front cover 70 adheres to the mounting surface 41. can be arranged so that

Accordingly, since the front cover 70 is closely adhered to the mounting surface 41 and components mounted on the mounting surface 41 can be protected, the display module 30 is formed between the front cover 70 and the substrate 40. The front cover 70 may be directly adhered to the substrate 40 without an additional molding configuration formed on the front cover 70 .

The front cover 70 may be provided to diffusely reflect light incident from the outside so as to prevent dazzling the user's eyes due to regular reflection of light incident from the outside.

As light incident from the outside is diffusely reflected, the glare phenomenon is reduced, and thus the contrast of the screen displayed on the display panel 20 can be improved.

In addition, the front cover 70 may be provided to reduce transmittance of incident external light or external light reflected from the substrate 40 and the gap G.

The front cover 70 according to an embodiment of the present invention includes a material that reduces light transmittance so that at least some of the light is transmitted toward the substrate 40 or is reflected from the substrate 40 in the first direction (X). ) may be provided to absorb at least a portion of the reflected light toward the target.

When a plurality of substrates are produced, some substrates may have different colors due to process problems during the production process. Accordingly, substrates having different inherent colors may be tiled to form a single display panel.

As described above, the front cover 70 according to an embodiment of the present invention can absorb at least a portion of the light reflected from the substrate 40 and transmitted to the outside, thereby increasing the unity of the screen of the display panel 20 .

That is, the front cover 70 can reduce the color deviation of each display module 30A-30P by reducing the external light transmittance of the color deviation generated during the process of the plurality of display modules 30A-30P.

The front cover 70 prevents external light incident on the display panel 20 from the outside from being transmitted through the substrate 40, and additionally absorbs some light incident on the display panel 20 from the outside or prevents the substrate 40 from passing through. Contrast of a screen displayed on the display panel 20 may be improved by absorbing a portion of external light that is reflected and transmitted to the outside of the display panel 20 . Such different optical actions may be respectively implemented through the plurality of layers described above.

That is, the front cover 70 may be disposed in front of the substrate 40 in the first direction (X) to improve contrast that may be lowered by external light in a screen displayed on the display panel 20 .

As described above, in the case of the display module 30 according to an embodiment of the present invention, the front cover 70 may be provided to extend to the outside of the substrate 40 in the third direction (Z).

Accordingly, some of the light introduced into the gap G formed between the plurality of display modules 30A-30P is blocked by at least a portion of the front cover 70 disposed on the gap G, and the gap G At least a portion of the external light entering the gap or the external light reflected on the gap G is absorbed by the front cup 70 disposed on the gap G, so that it is not transmitted to the outside. Therefore, the visibility of the seam formed in the gap G may deteriorate, and as the visibility of the seam decreases, the sense of unity of the screen displayed on the display panel 20 may be improved.

In detail, the side end 75 of the front cover 70 in the third direction (Z) is disposed outside the edge 41S of the mounting surface 41 in the second direction (Z) or on the gap (G). can

In line with this, the front cover 70 is disposed outside the edge 41S of the mounting surface 41 in the third direction (Z) or on the first region 71 disposed on the gap G and the mounting surface 41. It may include a second region 72 disposed on the.

The first area 71 and the second area 72 of the front cover 70 may be partitioned in the third direction (Z) by the gap (G).

The first region 71 of the front cover 70 is disposed on the gap G so that external light irradiated into the gap G is blocked by the first region 71 of the front cover 70 or the gap G ) is blocked from being irradiated to the outside, and the visibility of the seam, which is the boundary of the plurality of display modules 30A-30P that may be formed by the gap G, is reduced, thereby improving the sense of unity of the display panel 20. do.

As described above, the front cover 70 may be provided to extend outwardly from the four edges 41S of the mounting surface 41 of the substrate 40, so that each edge of the plurality of display modules 30A-30P The visibility of the seam that can be formed may be lowered.

Taking the first display module 30A and the second display module 30B as an example, the first area 71A of the front cover 70A of the first display module 30A extending from the first display module 30A It may be disposed in the gap G formed between the first display module 30A and the second display module 30B.

On the gap G, the side end 75A of the front cover 70A of the first display module 30A and the second display module 30B adjacent to the first display module 30A in the second display module 30B A side end 75B of the front cover 70B may be disposed.

In addition, the side surfaces 45 and the chamfer portion 49 of each of the first and second display modules 30A and 30E may be disposed on the gap G.

The second area 72A of the front cover 70A of the first display module 30A may be disposed on the mounting surface 41 of the first display module 30A.

The first area 71B of the front cover 70B of the second display module 20B extending from the second display module 30B is formed between the first display module 30A and the second display module 30B. The second region 72B of the front cover 70B of the second display module 30B may be disposed on the mounting surface 41 of the second display module 30B. .

That is, in the gap G formed between the first display module 30A and the second display module 30B, the first area 71A and the second area 71A of the front cover 70A of the first display module 30A are respectively formed. The first area 71B of the front cover 70B of the display module 30B may be arranged side by side in the third direction (Z).

The length of the first areas 71A and 71B of the front covers 70A and 70B of the first and second display modules 30A and 30B extending in the third direction Z is approximately half of the gap G or less. can be provided with

Accordingly, when the first regions 71A and 71B of the front covers 70A and 70B of the first and second display modules 30A and 30B are arranged side by side in the third direction Z, each of the first The sum of the lengths of the regions 71A and 71B may correspond to or be smaller than the length of the gap G.

According to an embodiment of the present invention, the first areas 71A and 71B of the front covers 70A and 70B of the first and second display modules 30A and 30B are aligned in the third direction Z. When disposed, a predetermined distance may occur between the side end 75A of the front cover 70A of the first display module 30A and the side end 75B of the front cover 70B of the second display module 30B. This is because of the side end member 100 disposed at the side end of each of the display modules 30A to 30P, which will be described later.

As described above, the first area 71A of the front cover 70A of the first display module 30A and the second display are formed on the gap G between the first display module 30A and the second display module 30B. A first area 71B of the front cover 70B of the module 30B may be disposed.

External light incident on the display panel 20 is diffusely reflected outside the display panel 20 while passing through the first regions 71A and 71B of the front covers 70A and 70B of the first and second display modules 30A and 30B. The amount of light reaching the gap G is partially absorbed by each of the first regions 71A and 71B, and the gap G reduces the boundary between the first display module 30A and the second display module 30B. visibility may be reduced.

In addition, the light reflected from the gap G and directed to the outside of the display panel 20 passes through the first regions 71A and 71B of the front covers 70A and 70B of the first and second display modules 30A and 30B, while displaying the light. The diffuse reflection to the outside of the panel 20 or partially absorbed by each of the first regions 71A and 71B reduces the amount of transmission to the outside of the display panel 20, thereby reducing the first display module 30A and the first display module 30A by the gap G. The visibility of the boundary between the second display modules 30B may be reduced.

That is, the amount of external light introduced into the gap G formed between the plurality of display modules 30A to 30P is reduced and at the same time, at least a portion of the external light reflected from the gap G is absorbed to improve the display panel 20. The integrity of the screen of can be improved.

In addition, even if the substrate 40A of the first display module 30A and the substrate 40B of the second display module 30B are provided to have different colors, the respective substrates 40A and 40B are affected by reflection of external light. At least a part of the reflected light when displayed externally is absorbed by the front covers 70A and 70B of the first and second display modules 30A and 30B, respectively, so that the unique color of each substrate 40A and 40B is changed to the outside. Integrity of the screen of the display panel 20 may be improved so as not to be recognized as .

The display module 30A may include a side cover 90 disposed under the front cover 70 in a direction in which the mounting surface 41 faces and provided on the side surface 45 of the substrate 40 .

In detail, the side cover 90 has the lower surface 76 of the first area 71 of the front cover 70 and the lower surface of the anisotropic conductive layer 47 in the first direction (X) and the substrate in the third direction (Z). It can be placed in the space formed on the side of (40).

In addition, although not shown in the drawing, the side end 47S of the anisotropic conductive layer 47 of the display module 30 may be disposed on the same line as the side end 75 of the front cover 70 in the first direction (X). . In this case, the side cover 90 may be disposed in a space formed on the lower surface of the anisotropic conductive layer 47 in the first direction (X) and on the side surface of the substrate 40 in the third direction (Z).

Also, although not shown in the drawing, the side end 47S of the anisotropic conductive layer 47 of the display module 30 may be disposed on the same line as the side end 41S of the mounting surface 41 in the first direction X. . At this time, the side cover 90 is formed on the lower surface 76 of the first area 71 of the front cover 70 in the first direction (X) and on the side surface of the substrate 40 in the third direction (Z). can be placed in space.

The side cover 90 may be provided to adhere to at least a portion of the lower surface 76 and the side surface 45 of the first region 71 and the metal plate 60 . Preferably, the side cover 90 may be provided to adhere to the entire lower end 76 of the first region 71 . Also preferably, the side cover 90 may be provided to cover the entire area of the side surface 45 .

Here, the lower surface 76 of the first region 71 is at least a partial region of the lower surface of the entire front cover 70, and refers to the rear surface of an adhesive layer (not shown) formed at the end of the front cover 70.

In addition, the side cover 90 may be provided to cover all of the pair of chamfer portions 49 disposed in the front and rear directions of the side surface 45 in the first direction (X).

The side cover 90 may be provided to cover not only the side surface 45 but also the entire chamfer portion 49 formed between the mounting surface 41 and the side surface 45 .

As the side cover 90 is provided to surround the chamfer portion 49 formed between the mounting surface 41 and the side surface 45, the side cover 90 is provided between the substrate 40 and the front cover 70. It can fill all possible spaces.

Accordingly, the side cover 90 can prevent foreign substances or moisture from entering the space between the substrate 40 and the front cover 70 from the outside.

In addition, as the side cover 90 is provided to surround the chamfer portion 49 formed between the rear surface 43 and the side surface 45, the side cover 90 is provided between the substrate 40 and the metal plate 60. Any space that can be formed can be filled.

Accordingly, the side cover 90 can prevent foreign substances or moisture from entering the space between the substrate 40 and the metal plate 60 from the outside.

The side cover 90 may be provided to contact the bottom surface 76 of the first region 71 and the chamfer portion 49 and side surface 45 of the substrate 40 . Accordingly, the side cover 90 may support the lower surface 76 of the first region 71 , the chamfer portion 49 and the side surface 45 of the substrate 40 .

As described above, the front cover 70 and the substrate 40 are bonded to each other by the front cover 70, and the adhesion between the front cover 70 and the substrate 40 can be strengthened by the side cover 90. there is. Accordingly, the side cover 90 can prevent the front cover 70 from being separated from the substrate 40 .

That is, reliability of the display module 30A may be increased by the side cover 90 .

In addition, the substrate 40 and the metal plate 60 are adhered to each other by the rear adhesive tape 61, and the adhesion between the metal plate 60 and the substrate 40 can be strengthened by the side cover 90. Accordingly, the side cover 90 may prevent the metal plate 60 from being separated from the substrate 40 .

As described above, the side surface 45 of the board 40 is provided to correspond to the four edges 41S of the mounting surface 41, and the first area 71 of the front cover 70 is the mounting surface 41 In the second direction (Y) and the third direction (Z) in which it extends, it may extend to an outer side than the four edges 41S of the mounting surface 41 .

The side cover 90 is along the circumference of the four edges 41S of the mounting surface 41 and the side corresponding to the lower end 76 of the first area 71 and the four edges 41S of the mounting surface 41. It may be provided to surround (45).

That is, the side cover 90 may be provided to seal the entire edge of the portion where the substrate 40 and the front cover 70 are bonded.

The side cover 45 may cover the lower surface 76 and the side surface 45 of the first region 71 in all directions orthogonal to the first direction X.

Accordingly, coupling between the front cover 70 and the substrate 40 may be improved, and the front cover 70 and the side surface 45 of the substrate 40 may be protected from external forces.

In addition, as described above, penetration of external moisture or foreign matter between the substrate 40 and the front cover 70 can be prevented. Additionally, when some gaps are formed between the substrate 40 and the front cover 70 due to an adhesive problem, it is possible to prevent external moisture or foreign matter from penetrating through the gaps.

The side cover 90 is provided to cover all four edges E of the substrate 40 along the side surface 45 of the substrate 40, and there is a gap between the substrate 40 and the front cover 70 and the metal plate 60. A sealing effect may occur.

Therefore, the side cover 90 can prevent foreign matter or moisture from penetrating between the substrate 40 and the front cover 70 even when foreign matter or moisture flows into the substrate 40 in any direction.

As described above, since the last end of the front cover 70 in the first direction (X) is provided with an adhesive layer, the lower surface 76 of the first area 71 may be provided as a rear surface of the adhesive layer.

Accordingly, when the lower surface 76 of the first region 71 is exposed to the outside, foreign substances flowing from the outside may adhere to the lower surface 76 of the first region 71 .

When a plurality of display modules 30A-30P are arrayed in a state in which foreign substances are adhered to the lower surface 76 of the first region 71, foreign substances adhered to the lower surface 76 of the first region 71 cause a plurality of display modules to be disposed. A problem in which the visibility of a seam generated between the display modules 30A to 30P may be increased may occur.

However, the display module 30A according to an embodiment of the present invention includes a side cover 90 and the side cover 90 is provided to cover the lower surface 76 of the first area 71 to prevent foreign substances from entering the first area 71. Adhesion to the lower surface 76 of (71) can be prevented.

Accordingly, when the plurality of display modules 30A to 30P are arrayed, foreign substances may be adhered to the front cover 70 to reduce visibility of seams generated between the plurality of display modules 30A to 30P.

Also, as will be described later, electrical components may be damaged by current flowing into a plurality of electrical components mounted on the substrate 40 due to discharge of static electricity that may occur on the display modules 30A-30P. ) can seal the board 40 from the outside to prevent damage to the electrical components, and block the inflow of charges generated by static electricity to the board 40 .

That is, the substrate 40 is sealed by the front cover 70 and the side cover 90 so that electric charges generated by static electricity cannot pass through the front cover 70 and the side cover 90. ) is prevented from flowing, and the electric charge flowing on the front cover 70 and the side cover 90 is guided to the metal plate 60 to the metal plate 60 in contact with the side cover 90, resulting in electrostatic discharge. A path for current may be provided. Accordingly, the ESD withstand voltage of electric components mounted on the board 40 may be improved.

As described above, the display module 30A may be disposed under the front cover 70 in the direction in which the mounting surface 41 faces. That is, the side cover 90 is not disposed above the lower surface 76 in the first direction (X).

The frontmost surface of the side cover 90 in the first direction (X) is provided in contact with the lower surface 76 of the first area 71, and the lower surface 76 of the first area 71 in the first direction (X) It is not placed further forward.

This is to avoid disposing the side cover 90 on a movement path of light emitted from the plurality of inorganic light emitting elements 50 .

When at least a part of the side cover 90 is disposed in front of the lower surface 76 or in front of the front cover 70 in the first direction (X), it is disposed on the path of light moving forward through the front cover 70 It can be.

That is, a part of an image displayed on the display module 20 may be distorted because the side cover 90 absorbs or irregularly reflects a part of the moving light.

However, the side cover 90 according to an embodiment of the present invention is disposed behind the front cover 70 in the first direction (X) and does not restrict the movement of light irradiated by the plurality of inorganic light emitting devices 50. Therefore, the image quality of the display panel 20 can be improved.

The side end 75 of the front cover 70 in the third direction (Z) and the side end 91 of the side cover 90 in the third direction (Z) are on the same line in the first direction (X). can be placed.

This is because the front cover 70 and the side cover 90 are simultaneously cut during the manufacturing process of the display module 30A. In addition, the side end member 100 may be adhered to the side end 75 of the front cover 70 and the side end 91 of the side cover 90 disposed on substantially the same line in the first direction (X).

That is, when the plurality of display modules 30A-30P are arrayed, the distance formed between the plurality of display modules 30A-30P can be minimized, and the distance between the plurality of display modules 30A-30P can be recognized. You can minimize the number of seams.

The side cover 90 may include a material that absorbs light. For example, the side cover 90 may be made of an opaque or translucent material.

Also, the side cover 90 may include a photosensitive material. For example, the side cover 90 may be formed of photosensitive optically transparent adhesive resin (OCR). When the photosensitive material is irradiated with external light having a wavelength other than the wavelength of visible light, such as ultraviolet (UV) light, the photosensitive material may change color to a dark color as physical properties are changed.

Accordingly, when ultraviolet rays (UV) are irradiated on the side cover 90 during the manufacturing process, the side cover 90 is colored in a dark color, and the side cover 90 is made of a material capable of absorbing light.

The side cover 90 may be provided to have a dark color. The side cover 90 may be provided to have a darker color than the front cover 70 .

The side cover 90 may preferably have a color similar to that of the black matrix 48 .

Accordingly, the light incident to the side cover 90 may be absorbed by the side cover 90 without being reflected by the light absorbing material of the side cover 90 .

The side cover 90 has a gap G formed between the plurality of display modules 30A-30P together with the first area 71 of the front cover 70 when the plurality of display modules 30A-30P are arrayed. can be placed on top.

Accordingly, it is possible to absorb the light introduced into the gap G and minimize the reflection of the light introduced into the gap G to the outside. Accordingly, visibility of a seam formed by the gap G formed between the plurality of display modules 30A to 30P may be reduced.

Referring to the first display module 30A and the second display module 30B as an example, the side cover 90A of the first display module 30A and the side cover 90B of the second display module 30B are The first area 71A of the front cover 70A of the display module 30A and the first area 71B of the front cover 70B of the second display module 30B together with the first display module 30A and It may be disposed in the gap G formed between the two display modules 30B.

On the gap G, side ends 75A and 75B of the front covers 70A and 70B of the first and second display modules 30A and 30B and side surfaces of the side cover 90A of the first display module 30A are adjacent to each other. The end 91S and the side end 91B of the side cover 90B of the second display module 30B may be respectively disposed.

Side ends 75A and 75B of the respective front covers 70A and 70B of the first and second display modules 30A and 30B and side covers 90A of each of the first and second display modules 30A and 30B, Side ends 91A and 91B adjacent to each other of 90B may be arranged to face each other. Preferably, the side ends 75A and 75B adjacent to each other of the front covers 70A and 70B of the first and second display modules 30A and 30B and the side covers of each of the first and second display modules 30A and 30B Side ends 91A and 91B adjacent to each other of 90A and 90B may be disposed parallel to each other.

That is, in the gap G formed between the first display module 30A and the second display module 30B, the first and second display modules 30A and 30B, respectively, of the front covers 70A and 70B, respectively. The regions 71A and 71B and the side covers 90A and 90B of the first and second display modules 30A and 30B may be disposed side by side in the third direction Z.

The length of the side covers 90A and 90B of the first and second display modules 30A and 30B extending in the third direction Z is equal to the front cover 70A and 70B of the first and second display modules 30A and 30B. In correspondence with the first regions 71A and 71B of the gap G, less than half of the gap may be provided.

On the gap G between the first display module 30A and the second display module 30B, the first area 71A of the front cover 70A of the first display module 30A and the second display module 30B are formed. The first area 71B of the front cover 70B is disposed, and the side surfaces of the first and second display modules 30A and 30B are disposed behind each of the first areas 71A and 71B in the first direction (X). Covers 90A and 90B may be disposed.

As described above, the external light incident on the display panel 20 passes through the first areas 71A and 71B of the front covers 70A and 70B of the first and second display modules 30A and 30B, while the display panel 20 The amount of light reaching the gap (G) by being diffusely reflected or partially absorbed to the outside is reduced.

Additionally, even if some light reaches the gap G, the light introduced into the gap G by the side covers 90A and 90B of the first and second display modules 30A and 30B disposed on the gap G. This absorption may reduce the visibility of the boundary between the first display module 30A and the second display module 30B.

That is, the amount of external light flowing into the gap G formed between the plurality of display modules 30A to 30P is reduced, and at the same time, light reaching the gap G is additionally absorbed to display the screen of the display panel 20. integrity can be improved.

In addition, the light that is not absorbed by the side covers 90A and 90B of the first and second display modules 30A and 30B and is reflected on the side covers 90A and 90B and directed to the outside of the display panel 20 is respectively While passing through the first regions 71A and 71B of the front covers 70A and 70B, the light diffusely reflects to the outside of the display panel 20 or is partially absorbed by each of the first regions 71A and 71B and transmitted to the outside of the display panel 20 The visibility of the boundary between the first display module 30A and the second display module 30B due to the gap G may be reduced.

As described above, the side cover 90 reaches the gap G as it is disposed in the gap G formed between the plurality of display modules 30A-30P when the plurality of display modules 30A-30P are arrayed. By absorbing the light that is used, the visibility of the seam that can be recognized by the gap G may be reduced.

In the above-described example, the front cover 70 is provided to reduce the amount of light reaching the substrate 40 by diffused reflection, absorption, circular polarization, or conversion of light reflection direction of a part of the light entering the display module 20.

However, the front cover 70 is not limited thereto and may be made of a transparent material through which light is transmitted without deformation. Even at this time, the visibility of the boundary between the plurality of display modules 30A-30P due to the gap G may be reduced by the side cover 90 disposed between the plurality of display modules 30A-30P. .

As described above, the side cover 90 may be made of a material that absorbs light, and when at least a portion of the side cover 90 is disposed in front of the front cover 70 in the first direction (X), a plurality of Some of the light emitted from the inorganic light emitting devices 50 may be absorbed. Accordingly, a problem that a part of the screen displayed on the display module 20 is displayed darkly may occur.

However, the side cover 90 according to an embodiment of the present invention is disposed below the front front cover 70 in the first direction (X), in detail, below the lower surface 76 of the first region 71 Light emitted from the plurality of inorganic light emitting devices 50 may not be absorbed so that brightness of an image displayed on the display module 20 may be uniform.

The anisotropic conductive layer 47 may be provided in the shape of an anisotropic conductive film. The anisotropic conductive layer 47 may be provided on the TFT layer 41 to be bonded to the TFT 41 layer in the form of a film.

The anisotropic conductive layer 47 may be formed in a film shape so that the area of the anisotropic conductive layer v 47 is larger than that of the substrate 40 .

Accordingly, after the anisotropic conductive layer 47 is bonded to the TFT layer 41, a process of cutting the anisotropic conductive layer 47 so that the area of the anisotropic conductive layer 47 corresponds to the area of the substrate 40 may be performed. there is.

In the cutting process, the anisotropic conductive layer 47 may be cut so that the area of the anisotropic conductive layer 47 corresponds to the area of the substrate 40 through laser cutting or the like.

The anisotropic conductive layer 47 is preferably provided with an area corresponding to that of the mounting surface 41 . However, as described above, since the anisotropic conductive layer 47 is formed of an anisotropic conductive film, it is not easy to provide an area of the anisotropic conductive film corresponding to that of the mounting surface 41. When the corresponding anisotropic conductive film is bonded to the mounting surface 41, the reliability of the display module 30 may decrease because the cross section may be smaller than that of the mounting surface 41 due to manufacturing tolerance of the anisotropic conductive film.

Accordingly, an anisotropic conductive film having an area larger than that of the mounting surface 41 is bonded to the substrate 40, and then the anisotropic conductive film is cut to an area corresponding to that of the substrate 40 to form the anisotropic conductive layer 47. can form

The side surface 45 of the substrate 40 is provided to be disposed outside the mounting surface 41 by the chamfer portion 49 . In this case, preferably, when cutting the anisotropic conductive film, the side end of the coating member 46a forming the side end of the side wiring 46 may be cut in the third direction (Z).

This is because the side surface 45 of the board 40, the chamfer portion 49, or the side wiring 46 may be damaged when the anisotropic conductive film is cut based on the mounting surface 41.

However, it is not limited thereto, and the anisotropic conductive film may be cut together with the front cover 70 to form the anisotropic conductive layer 47 . In this case, the side end 47S of the anisotropic conductive layer 47 may be disposed on the same line as the side end 75 of the front cover 70 in the first direction (X).

At this time, the side end 47S of the anisotropic conductive layer 47 is exposed to the outside, and damage due to static electricity may be concerned, but reliability of ESD can be secured by the side end member 100 described later.

Accordingly, when the anisotropic conductive film is cut, the side end 47S of the anisotropic conductive layer 47 may be disposed on an outer region of the mounting surface 41 . In detail, as described above, the anisotropic conductive film is cut based on the side end of the side surface 45 or the side wiring 46. Preferably, the side end 47S of the anisotropic conductive layer 47 is in the first direction (X). It may be disposed on the same line as the side end of the side 45 or the side wire 46 . In addition, it may be disposed outside the side end 46S of the side surface 45 or the side wiring 46 due to a process tolerance or a burr formed on the anisotropic conductive film during cutting.

However, in order to substantially prevent damage to the substrate 40 that may occur during the cutting process, the position where the anisotropic conductive film is cut may be an area outside the side surface 45 or the side end 46S of the side wiring 46. there is.

Accordingly, the side end 47S of the anisotropic conductive layer 47 may be formed outside the substrate 40 . In particular, the side end 47S of the anisotropic conductive layer 47 may be disposed outside the side cover 90 .

As shown in FIG. 7, the side cover 90 covers the outside of the side surface 45 of the substrate 40 in the third direction Z, as well as the side surface 45 in the second direction Y. It may be provided to cover all of the outside.

That is, as described above, the side cover 90 may be provided to surround all four edges E of the substrate 40 .

Accordingly, the mounting surface 41, which is the front surface of the substrate 40, is covered by the front cover 70, and the rear surface 43 of the substrate 40 is covered by the metal plate 60, and the side surface of the substrate 40 ( 45) and the chamfer portion 49 may be covered by the side cover 90.

The front cover 70 may be made of a non-conductive material through which charges cannot penetrate.

The side cover 90 may be made of a non-conductive material through which charges cannot penetrate.

Since the front cover 70 and the side cover 90 are made of non-conductive material, most of the current applied to the front cover 70 or the side cover 90 passes through the front cover 70 and the side cover 90. It can flow on the front cover 70 and the side cover 90 without being able to do so.

The metal plate 60 is made of a material with high capacitance and can serve as a ground structure. Accordingly, when a current is applied to the metal plate 60, the potential of the metal plate 60 is maintained at a constant potential, so that the current flowing into the metal plate 60 is absorbed by the metal plate 60, and the metal plate 60 absorbs the current. No current flows through 60 to substrate 40.

In addition, all of the side wirings 46 of the board 40 are provided to be covered by the side cover 90, and accordingly, the side wirings 46 are sealed so that they are not exposed to the outside, and on the side 45 side of the board 40. Even if static electricity is discharged, current may not be introduced into the side wiring 46 by the side cover 90 .

A plurality of display modules may be tiled to form a display panel in a display device process of implementing a display panel with a display module. Each display module is manufactured and transported during the process of forming a display panel. During the path of the electric current generated by the discharge of static electricity flows into the display module, a problem may occur that the electrical components mounted inside the display module are damaged.

In particular, a defect occurs during the manufacturing process of the display module 30, and the side wiring extending along the side of the substrate is exposed to the outside or the anisotropic conductive layer 47 and the front cover 70 or the substrate 40 are separated. It may be, and a gap may occur inside during the application and curing process of the side cover 90. At this time, due to a process defect due to the discharge of static electricity, a current flows into an electrical component such as a side wiring mounted on the board 40, resulting in damage to the component.

Each of the display modules 30A-30P includes a component provided to independently block current generated by the discharge of static electricity from flowing into components mounted on the substrate 40, and Ground configuration along the front cover 70 and the side cover 90 that seals the substrate 40 on each of the display modules 30A-30P without current flowing into the configuration mounted on the substrate 40 It may be provided to be easily guided to the metal plate 60 .

In the display device 1 according to an exemplary embodiment of the present invention, a side cover ( 90) and may include a side end member 100 formed of a material having higher conductivity than the side cover 90.

As described above, the side wire 46 is disposed on the side surface 45 corresponding to the upper edge 32 and the lower edge 34 disposed in the third direction (Z), so the side end member 100 is the side wire (46) may be disposed on the outside of the side cover 90 formed on the third direction (Z) is disposed.

The side end members 100 may be provided to easily guide static electricity to the metal plate 60 even if the display modules 30A to 30P are not completely sealed due to manufacturing defects.

As shown in FIG. 7 , the side end member 100 may be provided to cover the outside of the side surface 45 of the substrate 40 in the third direction Z. That is, the side end member 100 may be disposed on a pair of edges 32 and 34 among the four edges E of the substrate 40, and in detail, the side end member 100 has a side wire 46 The arrangement may be provided to be formed only on one side surface 45 of side surfaces 45 corresponding to the pair of edges 32 and 34 .

This is to minimize the width of the gap G formed between the respective display modules 30A to 30P when the display modules 30A to 30P are arrayed. This will be described later in detail.

The side end member 100 based on the first display module 30A may be disposed on the side 45 corresponding to the lower edge 34 of the first display module 30A. In addition, the side end member 100 is not disposed on the side surface 45 corresponding to the upper edge 32 of the display module 30A.

In the second display module 30B, like the first display module 30B, the side end member 100 may be disposed only on the side surface 45 corresponding to the lower edge of the second display module 30B, and the fourth The display module 30C and the sixth display module 40D may also be disposed only on the side surface 45 corresponding to the lower edge.

The side end member 100 may be preferably made of a metal material, and may be made of a material having higher conductivity than the side cover 90 . The side end member 100 may be coated on the side cover 90 and disposed on the side end 91 of the side member 90 .

Accordingly, when the display modules 30A to 30P are arrayed, the side end member 100 may be disposed on the gap G formed between the respective display modules 30A to 30P.

One end of the side end member 100 may be provided to contact the metal plate 60 and the other end of the side end member 100 may be provided to be disposed on the side end 91 of the side cover 90 . That is, the side end member 100 may be provided to cover at least a portion of the metal plate 60 and at least a portion of the side cover 90 in the third direction (Z).

The side end member 100 may be provided in a thin shape. This is because the side end member 100 is disposed between the gaps G formed between the display modules 30A to 30P when the display modules 30A to 30P are tiled. When the side end member 100 is provided thickly, the gap G formed between the display modules 30A-30P is formed large by the thickness of the side end member 100, so that the perception of the seam occurs between the display modules 30A-30P It can be.

However, even if the side end member 100 is provided in a thin shape, a predetermined distance may be generated between adjacent display modules 30A to 30P by the side end member 100 . Therefore, in order to minimize a predetermined distance between adjacent display modules 30A-30P, only one side end member 100 is disposed between the side end portions 91 of each side cover 90 of the adjacent display modules 30A-30P. can be arranged so that This will be described later in detail.

The side end member 100 may be made of a highly conductive material. For example, the side end member 100 may be made of a material that can be electrically grounded to the metal plate 60 by being made of metal, conductive polymer, conductive fabric, or the like.

The side end member 100 may be made of a material having higher conductivity than the side cover 90 . In addition, the side end member 100 may be made of a material having higher conductivity than the front cover 70 .

Accordingly, when a current is generated by the discharge of static electricity on the front cover 70 or the side cover 90, the current does not penetrate the front cover 70 or the side cover 90 and does not flow into the substrate 40. It may flow on the cover 70 and flow into the side end member 100 .

The current flowing into the side end member 100 may flow to the metal plate 60 through the side end member 100 . This is because the side end member 100 comes into contact with the metal plate 60 and is provided to be grounded to the ground configuration.

That is, the side end member 100 may provide a path for current to flow to the metal plate 60 provided in the ground configuration for current due to electrostatic discharge generated on the front cover 70 or the side cover 90 . The side end member 100 may guide charges caused by electrostatic discharge so that they flow to the ground.

Accordingly, as most of the current due to the discharge of static electricity on the front cover 70 or the side cover 90 flows through the metal plate 60 through the highly conductive side end member 100, some of the current flows toward the substrate 40. Even if it is fluid, the ESD withstand voltage of electric components mounted on the substrate 40 can be improved.

Additionally, the electrostatic current transferred to the metal plate 60 may be provided to escape to an external ground through components in contact with the metal plate 60, such as a bridge board and a cable.

The side end member 100 may be provided to have a dark color. It may preferably have a black color. The side end member 100 may be provided to have a darker color than the front cover 70 .

The side end member 100 may preferably have a color similar to that of the black matrix 48 or side cover 90 . Accordingly, light incident to the side end member 100 may be absorbed by the side end member 100 without being reflected.

As described above, each of the display modules 30A to 30P includes a front cover 70, a side cover 90, a metal plate 60, and a side end member 100 provided to prevent current from permeating due to electric discharge. can be included independently.

As described above, the side end member 100 may be disposed on only one side surface 45 of the pair of side surfaces 45 to which the side wire 46 extends.

When describing the first display module 30A and the second display module 30B as an example, the first display module 30A has a side surface 45 adjacent to the second display module 30B in the third direction Z. A side end member (100A) may be disposed on the top.

The side end member of the second display module 30B is not disposed on the side surface 45 adjacent to the first display module 30A in the third direction (Z). Accordingly, the side end member 100A of the first display module 30A and the side end portion 91B of the side cover 90 of the second display module 30B may face and contact each other.

Accordingly, the distance T between the side end portions 91A and 91B of the first display module 30A and the second display module 30B is formed to a length corresponding to the thickness t of the side end member 100. can

If the first and second display modules 30A and 30B have side end members 100 disposed on both of the pair of side surfaces 45 where the side wires 46 are formed, the first display module 30A and the second display The distance (T) between the respective side ends (91A, 91B) of the module (30B) is formed with a length corresponding to the thickness (2t) of the two side end members (100) so that the length of the distance (T) is larger and the first , The gap G between the 2 display modules 30A and 30B is further increased so that the perception of the sim can be raised.

However, as described above, between the side end portion 91A of the first display module 30A and the side end portion 91B of the second display module 30B according to an embodiment of the present invention, the first display module 30A Only one side end member (100A) of may be disposed. Accordingly, it is possible to minimize the distance T between the side ends 91A and 91B of the first display module 30A and the second display module 30B, respectively. The awareness of the deliberation can be minimized.

Although not limited to one embodiment of the present invention, the side end member 100 may be disposed on the side surface 45 corresponding to the upper rim 32 rather than the side 45 corresponding to the lower rim 34 . At this time, between the first display module 30A and the second display module 30B, the side end member 100 disposed on the side surface 45 corresponding to the upper edge 32 of the second display module 30B is provided. It is disposed between the first display module 30A and the second display module 30B, and the side end member 100 of the first display module 30A is disposed between the first display module 30A and the second display module 30B. It may not be.

In this way, even if only the side end member 100 of the first display module 30A is disposed between the first display module 30A and the second display module 30B, the first display module 30A and the second display module 30B A first display disposed in contact with the side end portion 91B of the side cover 90B of the second display module 30B even when current flows into the side cover 90B of the second display module 30B due to electrostatic discharge therebetween. A current is guided through the side end member 100 of the module 30A, so that reliability of the second display module 30B against ESD can be increased.

That is, even if the side end member 100A of any one display module 30A is disposed between two display modules 30A and 30B among display modules 30A to 30P adjacent in the third direction (Z), the adjacent 2 Two display modules (30A, 30B) are placed in contact with all side end members (100A), so even if current is introduced according to electrostatic discharge between the two display modules (30A, 30B), the two display modules (30A, 30B) through one side end member (100A). ESD reliability of the display modules 30A and 30B may be increased.

As described above, the first display module 30A is disposed on the uppermost side of the display panel 20 and only the side end member 100A is disposed on the side surface 45 corresponding to the lower edge 34 in the third direction (Z). Accordingly, the upper rim 32 has the side end member 100 is not disposed.

In addition, in the case of the second display module 30B, the fourth display module 30C, and the sixth display module 30D, the side end member 100 is placed on the side surface 45 corresponding to the upper edge 32 of each module. The side end members 100B, 100C, and 100D may be disposed on the side surface 45 corresponding to the lower border 34 without being disposed.

At this time, even if the side end members 100B, 100C, and 100D of the second, fourth, and sixth display modules 30B, 30C, and 30D are not disposed on the side surface 45 corresponding to each upper edge 32, On the side surface 45 corresponding to the upper edge 32 of each display module 30B, 30C, 30D, the side end member 100A of the display modules 30A, 30B, 30C adjacent in the third direction Z, 100B, 100C) may be arranged. Accordingly, even if the side members 100B, 100C, and 100D are not disposed on the side surface 45 corresponding to the upper edge 32 of each of the display modules 30B, 30C, and 30D, the adjacent display modules 100A, 100B, and 100C Reliability of ESD can be improved by the side end members 100A, 100B, and 100C.

However, on the side surface 45 corresponding to the upper edge 32 of the first display module 30A, adjacent display modules in the third direction (Z) are not disposed, so that the upper edge 32 of the first display module 30A When electrostatic discharge occurs on the side surface 45 corresponding to the side surface 45, electric current flows in and the electrical components of the side wiring 46 and the first display module 30A may be damaged.

To prevent this, the display device 1 according to an embodiment of the present invention is disposed on the frame 15, and when the first display module 30A is supported by the frame 15, the first display module 30A It may include a frame-side end member 200 provided to come into contact with the side surface 45 corresponding to the upper edge 32 and to be grounded with the frame 15 .

The frame 15 is made of a metal material and may be provided to serve as a ground circuit.

The frame side end member 200 may be formed of a material having higher conductivity than the side cover 90. For example, the side end member 100 is made of metal, conductive polymer, conductive fabric, etc. to be electrically grounded with the frame 15. It may be provided with a material that can be used.

The frame side end member 200 may be formed in an area adjacent to the upper edge of the frame 15 in the third direction (Z). The frame side end member 200 includes not only the first display module 30A but also the third display module 30E and the fifth display module 30I arranged on the same line as the first display module 30A in the second direction Y. ) and the side surface 45 corresponding to the upper edge 32 of the seventh display module 30M may be provided in a shape extending in the second direction Y.

That is, the third display module 30E in which the side end member 100 is not disposed on the side cover 90 formed on the side surface 45 corresponding to the upper edge 32 like the first display module 30A. In order to protect the side surface 45 corresponding to the upper edge 32 of the fifth display module 30I and the seventh display module 30M, the frame side end member 200 is provided for each of the display modules 30A, 30E, and 30I , 30M) may be provided to cover at least a portion of the side cover 90.

Accordingly, when a current is applied to the side surface 45 corresponding to the upper edge 32 of each of the display modules 30A, 30E, 30I, and 30M by electrostatic discharge, the current flows through the frame side end member 200 to the frame. It may be provided to flow into (15).

Therefore, as described above, even if the side end member 100 is disposed only on one side surface 45 of the pair of side surfaces 45 to which the side wiring 46 extends in the display modules 30A-30P, the side end member 100 ) is not disposed, ESD reliability can be improved by the side end member 100 of the display module or the side end member 200 of the frame adjacent to the third direction (Z).

In addition, in the display module (30A-30P), as the side end member 100 is disposed only on one side surface 45 of the pair of side surfaces 45 to which the side wiring 46 extends, it moves in the third direction (Z). The distance of the gap G between adjacent display modules may be minimized, so that perception of the seam between the display modules 30A-30P may be minimized.

When the side end member 100 in the display module 30A-30P is disposed on the side 45 corresponding to the lower rim 34 instead of the upper rim 32 in the third direction (Z) without being limited thereto. The frame side end member 200 may be provided to extend along the second direction Y at a portion adjacent to the lower edge of the frame 15 .

At this time, the frame side end member 200 is formed on the side cover 90 formed on the side surface 45 corresponding to the lower edge 34 of the sixth display module 30D and the sixth display module in the second direction (Y). It may be provided to cover the side cover 90 formed on the side surface 45 corresponding to the lower edge 34 of the display modules 30H, 30L, and 30P disposed on the same line as 30D.

Additionally, one of the pair of side surfaces 45 to which the side wiring 46 does not extend, that is, the side surface 45 corresponding to the left edge 33 or the right edge 31 facing in the second direction (Y). The side end member 100 may be additionally disposed only on the side surface.

This is because the side wiring 46 is not disposed on the side surface 45 corresponding to the left edge 33 or the right edge 31, but current flows into the side cover 90 formed on each side surface 45 to display the display. This is to prevent damage to the electrical components of the module.

At this time, the side end member 100 may be disposed on only one side surface 45 of the pair of side surfaces 45 in the second direction (Y). In the display modules 30A-30P, the side 45 on which the side end member 100 is not disposed in the second direction Y is the side end member 100 of the adjacent display module 30A-30P in the second direction Y. ) is arranged to increase the reliability of ESD.

The side end member 100 disposed in the third direction (Z) and the side end member 100 disposed in the second direction (Y) are integrally formed, respectively, and accordingly, the four sides of the display modules 30A-30P (45) It may be provided in a shape surrounding two side surfaces (45) adjacent to each other. For example, the side end member 100 may be formed to surround the side cover 90 formed on the side 45 corresponding to the right rim 31 and the lower rim 34, respectively.

In addition, at this time, the side end members 100 are additionally disposed on the side surface 45 corresponding to the right edge 31 in the second direction Y of each of the display modules 30A-30P. The city display device 1 may further include a frame-side end member 200 extending in the third direction (Z) at a portion adjacent to the left edge of the frame 15 .

Hereinafter, display modules 30A-30P according to another embodiment of the present invention will be described. All configurations other than the side wirings 46 formed on the second direction (Y) described below are the same as those of the display device 1 according to the above-described embodiment, and thus duplicate descriptions are omitted. In particular, the arrangement of the display modules 30A-30P in the third direction Z in another embodiment of the present invention is the same as that of the display device 1 disclosed in FIGS. 6 and 7 described above. Only the arrangement of the display modules 30A-30P in the direction Y will be described.

9 is a perspective view of a part of a display module according to another embodiment of the present invention, and FIG. 10 is a cross-sectional view of a part of a display device according to another embodiment of the present invention in a second direction. 11 is an enlarged cross-sectional view of some components shown in FIG. 10, and FIG. 12 is a schematic front view of some components of a display device according to another embodiment of the present invention.

FIG. 9 shows the substrate 40 in a state where components such as the anisotropic conductive layer 47 are excluded from the substrate 40 for convenience of description. In addition, the side wiring 46 includes a coating member 46a that protects the side wiring 46 from the outside, and the coating member 46a is omitted for convenience of description.

As shown in FIG. 9 , the side wires 46 may be disposed on all four side surfaces 45 corresponding to the four edges 31 , 32 , 33 , and 34 of the display module 30 .

That is, according to the above-described embodiment, the side wiring 46 is disposed only on the pair of side surfaces 45 of the display module 30, but according to another embodiment of the present invention, the side wiring 46 ) may be formed on all four side surfaces 45.

Accordingly, the side end member 100 has one side surface 45 of a pair of side surfaces 45 facing in the third direction (Z) and one of a pair of side surfaces 45 facing in the second direction (Y). It can be formed on the side 45 of.

As shown in FIGS. 10 and 11 , the side end member 100 may be provided to cover the outside of the side surface 45 of the substrate 40 in the second direction Z. In detail, the side end member 100 has one edge 34 of the two edges 32 and 34 disposed in the third direction Z among the four edges E of the substrate 40 and the second direction ( Y) may be disposed on the side 45 corresponding to one of the two rims 31 and 33 disposed in the rim 31.

This is to minimize the width of the gap G formed between the respective display modules 30A to 30P when the display modules 30A to 30P are arrayed.

The side end member 100 based on the first display module 30A may be disposed on the side 45 corresponding to the right edge 31 of the first display module 30A. In addition, the side end member 100 is not disposed on the side surface 45 corresponding to the left edge 33 of the display module 30A.

In the third display module 30E, like the first display module 30A, the side end member 100 may be disposed only on the side 45 corresponding to the right edge of the third display module 30E, and the fifth The display module 30I and the seventh display module 40M may also be disposed only on the side surface 45 corresponding to the right edge 31 .

Accordingly, when the display modules 30A to 30P are arrayed, the side end member 100 may be disposed on the gap G formed between the respective display modules 30A to 30P.

The side end member 100 may be provided to cover at least a portion of the metal plate 60 and at least a portion of the side cover 90 in the second direction (Y).

When describing the first display module 30A and the third display module 30E as an example, the first display module 30A in the Y-direction (Z) has a side surface 45 adjacent to the third display module 30E. A side end member (100A) may be disposed on the top.

The side end member of the third display module 30E is not disposed on the side surface 45 adjacent to the first display module 30A in the second direction (Y). Accordingly, the side end member 100A of the first display module 30A and the side end portion 91E of the side cover 90 of the third display module 30E may face each other and contact each other.

Accordingly, the distance T between the side ends 91A and 91E of the first display module 30A and the third display module 30E is formed to a length corresponding to the thickness t of the side end member 100. can

Accordingly, it is possible to minimize the distance T between the side ends 91A and 91E of the first display module 30A and the third display module 30E, respectively. The awareness of the deliberation can be minimized.

However, it is not limited thereto, and the side end member 100 may be disposed on the side 45 corresponding to the left rim 33 rather than the side 45 corresponding to the right rim 31 . At this time, between the first display module 30A and the third display module 30E, the side end member 100 disposed on the side surface 45 corresponding to the left edge 33 of the third display module 30E is provided. It is disposed between the first display module 30A and the third display module 30E, and the side end member 100A of the first display module 30A is disposed between the first display module 30A and the third display module 30E. It may not be.

In this way, even if only the side end member 100A of the first display module 30A is disposed between the first display module 30A and the third display module 30E, the first display module 30A and the third display module 30E A first display disposed in contact with the side end portion 91E of the side cover 90E of the third display module 30E even when current flows into the side cover 90E of the third display module 30E due to electrostatic discharge in between. A current is guided through the side end member 100A of the module 30A, so that reliability of the third display module 30E against ESD may be increased.

That is, even if the side end member 100A of any one display module 30A is disposed between two display modules 30A and 30E among display modules 30A to 30P adjacent in the second direction Z, the adjacent 2 Since the two display modules 30A and 30E are disposed in contact with the side end member 100A, even if current flows in due to electrostatic discharge between the two display modules 30A and 30E, the two display modules 30A and 30E pass through one side end member 100A. ESD reliability of the display modules 30A and 30E may be increased.

As described above, the first display module 30A is disposed on the leftmost side of the display panel 20 and only the side member 100A is disposed on the side surface 45 corresponding to the right edge 31 in the second direction (Y). Accordingly, the side end member 100 is not disposed on the left edge 33.

In addition, the third display module 30E and the fifth display module 30

I) and the seventh display module 30I, the side member 100 is not disposed on the side surface 45 corresponding to the left edge 33 of each module and the side corresponding to the right border 31 ( 45), side end members 100E, 100I, and 100M may be disposed.

At this time, even if the side end members 100E, 100I, and 100M of the third, fifth, and seventh display modules 30E, 30M, and 30I are not disposed on the side 45 corresponding to the left edge 33, On the side surface 45 corresponding to the left edge 33 of each of the display modules 30E, 30M, and 30I, the side end member 100A of the display modules 30A, 30E, and 30I adjacent in the second direction Y, respectively, 100E, 100I) may be arranged. Accordingly, even if the side members 100E, 100I, and 100M are not disposed on the side surface 45 corresponding to the left edge 33 of each of the display modules 30E, 30I, and 30M, the adjacent display modules 100A, 100E, and 100I ESD reliability can be improved by the side end members 100A, 100E, and 100I.

However, on the side surface 45 corresponding to the left edge 33 of the first display module 30A, adjacent display modules in the second direction Y are not disposed, so that the left edge 33 of the first display module 30A When electrostatic discharge occurs on the side surface 45 corresponding to the side surface 45, electric current flows in and the electrical components of the side wiring 46 and the first display module 30A may be damaged.

To prevent this, the display device 1 according to an embodiment of the present invention is disposed on the frame 15, and when the first display module 30A is supported by the frame 15, the first display module 30A In contact with the side surface 45 corresponding to the upper edge 32 and in contact with the side surface 45 corresponding to the first frame side end member 210 and the left edge 33 provided to be grounded with the frame 15, the frame 15 It may include a frame side end member 200 including a second frame side end member 220 provided to be grounded.

According to the above-described embodiment, the frame side end member 200 is provided to extend in the second direction (Y) from a portion adjacent to the upper edge of the frame 15, but according to another embodiment of the present invention, the frame side end member 200 The member 200 includes a first frame side end member 210 extending in the second direction (Y) at a portion adjacent to the upper edge of the frame 15 and a third direction (Z) at a portion adjacent to the left edge of the frame 15. ) The second frame-side end members 220 provided to extend to each other may be provided to be disposed on the frame 15 .

The second frame side end member 220 includes not only the first display module 30A, but also the second display module 30B and the fourth display module arranged on the same line as the first display module 30A in the third direction (Z). 30C and the left edge 33 of the sixth display module 30D and the corresponding side surface 45 may be provided in a shape extending in the third direction (Z).

That is, the second display module 30B in which the side end member 100 is not disposed on the side cover 90 formed on the side surface 45 corresponding to the left edge 33 like the first display module 30A. In order to protect the side surface 45 corresponding to the left edge 33 of the fourth display module 30C and the sixth display module 30D, the frame side end member 200 is provided for each of the display modules 30A, 30B, and 30C , 30D) may be provided to cover at least a portion of the side cover 90.

Therefore, as described above, even if the side end member 100 is disposed only on one side surface 45 of the pair of side surfaces 45 to which the side wiring 46 extends in the display modules 30A-30P, the side end member 100 ) is not disposed, the ESD reliability can be improved by the side end member 100 of the display module or the side end member 200 of the frame adjacent to the second direction (Y).

In addition, in the display module (30A-30P), as the side end member 100 is disposed only on one side surface 45 of the pair of side surfaces 45 to which the side wiring 46 extends, it moves in the third direction (Z). The distance of the gap G between adjacent display modules may be minimized, so that perception of the seam between the display modules 30A-30P may be minimized.

When the side end member 100 in the display module 30A-30P is disposed on the side 45 corresponding to the left rim 33 instead of the right rim 31 in the second direction (Y) without being limited thereto. The frame side end member 200 may be provided to extend along the third direction (Z) at a portion adjacent to the right edge of the frame 15 .

At this time, the frame side end member 200 is formed on the side cover 90 formed on the side 45 corresponding to the right edge 31 of the seventh display module 30M and the seventh display module in the third direction (Z). It may be provided to cover the side cover 90 formed on the side surface 45 corresponding to the right edge 31 of the display modules 30N, 30O, and 30P disposed on the same line as 30M.

The side end member 100 disposed on the third direction (Z) and the side end member 100 disposed on the second direction (Y) are integrally formed, respectively, and thus the four side surfaces of the display modules 30A-30P Of (45), it may be provided in a shape surrounding two side surfaces (45) adjacent to each other.

In the first display module 30A as an example, the side end member 100 may be formed to surround the side cover 90 formed on the side 45 corresponding to the right rim 31 and the lower rim 34, respectively. there is.

Although the technical spirit of the present invention as described above has been described by specific embodiments, the scope of the present invention is not limited to these embodiments. Various embodiments that can be modified or modified by those skilled in the art within the scope of not departing from the gist of the technical idea of the present invention specified in the claims will also fall within the scope of the present invention.

1: display device 20: display panel
30, 30A - 30P: display module 40: substrate
41: mounting surface 42: board body
43: back 45: side
46: side wiring 47: anisotropic conductive layer
50: inorganic light emitting element 60: metal plate
70: front cover 80: driving circuit board
90: side cover 100: side end member

Claims (20)

A substrate including a mounting surface on which a plurality of inorganic light emitting devices are mounted and a TFT layer is formed, four side surfaces, and a rear surface disposed opposite to the mounting surface;
a side wiring electrically connected to the TFT layer and extending along one pair of side surfaces among the four side surfaces;
a front cover adhered to the mounting surface and covering the mounting surface in the first direction;
a metal plate adhered to the rear surface;
a side cover covering the side wiring and the side;
A side end member disposed at a side end of the side cover and grounded with the metal plate;
The side end member is disposed on only one side of a pair of side surfaces to which the side wiring extends among the four side surfaces. According to claim 1,
The side end member includes a first side end member disposed only on one side of a pair of side surfaces on which the side wire extends among the four side surfaces, and one of a pair of side surfaces on which the side wire does not extend among the four sides. A display module including a second side end member additionally disposed on a side surface of the display module. According to claim 2,
The first side end member and the second side end member are integrally formed, and one side of a pair of side surfaces to which the side wiring extends among the four side surfaces and one of a pair of side surfaces to which the side wiring does not extend. A display module extending along the side. According to claim 1,
The side wiring is provided to extend along both one pair of side surfaces and the other pair of side surfaces among the four side surfaces,
The side end member is additionally disposed on one side of the pair of side surfaces and on one side of the other pair of side surfaces. According to claim 4,
A side end member disposed on one of the pair of side surfaces and a side end member additionally disposed on one side of the other pair of side surfaces are integrally formed. According to claim 1,
The display module wherein the side end member is provided to have greater conductivity than the side cover. According to claim 1,
The display module wherein the side end member is provided to have a black-based color. According to claim 1,
The side end member is a display module provided with a metal material. A display device comprising a display module array in which a plurality of display modules are horizontally arranged in an M*N matrix form and a frame supporting the plurality of display modules,
The plurality of display modules, respectively
A substrate including a mounting surface on which a plurality of inorganic light emitting devices are mounted and a TFT layer is formed, four side surfaces, and a rear surface disposed opposite to the mounting surface;
a side wiring electrically connected to the TFT layer and extending along one pair of side surfaces among the four side surfaces;
a front cover adhered to the mounting surface and covering the mounting surface in the first direction;
a metal plate adhered to the rear surface;
a side cover covering the side wiring and the side;
A side end member disposed at a side end of the side cover and grounded with the metal plate;
The side end member is disposed on only one side of a pair of side surfaces to which the side wiring extends among the four side surfaces. According to claim 9,
The plurality of display modules include a first display module and a second display module arranged adjacently in a direction in which side wires of the first display module are arranged,
The display device of claim 1 , wherein a side end member of the first display module is in contact with a side surface on which the side end member is not disposed among a pair of side surfaces of the second display module along which the side wiring extends. According to claim 9,
The first display module is disposed so that a side on which the side end member is not disposed is adjacent to an edge of the frame among a pair of side surfaces along which the side wiring extends,
The frame includes a frame side end member provided to surround a side surface on which the side end member is not disposed among a pair of side surfaces along which the side wiring extends in the first display module. According to claim 11,
The frame side end member is provided to extend along an edge of the frame display device. According to claim 9,
The side end member includes a first side end member disposed only on one side of a pair of side surfaces on which the side wire extends among the four side surfaces, and one of a pair of side surfaces on which the side wire does not extend among the four sides. A display device including a second side end member additionally disposed on the side of the. According to claim 13,
The first side end member and the second side end member are integrally formed, and one side of a pair of side surfaces to which the side wiring extends among the four side surfaces and one of a pair of side surfaces to which the side wiring does not extend. A display unit extending along the side. According to claim 13,
The first display module is disposed such that, among the four sides, the side on which the first side end member and the second side end member are not disposed are adjacent to the edges of the frame, respectively;
The frame includes a frame side end member provided to surround a side surface of the first display module on which the first side end member and the second side end member are not disposed. According to claim 9,
The side wiring is provided to extend along both one pair of side surfaces and the other pair of side surfaces among the four side surfaces,
The side end member is additionally disposed on one side of the pair of side surfaces and on one side of the other pair of side surfaces. According to claim 16,
A side end member disposed on one side of the pair of side surfaces and a side end member additionally disposed on one side surface of the other pair of side surfaces are integrally formed. According to claim 16,
The first display module is disposed such that side surfaces on which the side end member is not disposed among the four side surfaces are adjacent to edges of the frame, respectively;
The frame includes a frame side end member provided to surround side surfaces on which the side end member is not disposed in the first display module. According to claim 11,
The frame is a display device provided with a metal material. A display device comprising a display module array in which a plurality of display modules are horizontally arranged in an M*N matrix form and a frame supporting the plurality of display modules,
The plurality of display modules, respectively
A substrate including a mounting surface on which a plurality of inorganic light emitting devices are mounted and a TFT layer is formed, four side surfaces, and a rear surface disposed opposite to the mounting surface;
a side wiring electrically connected to the TFT layer and extending along one pair of side surfaces among the four side surfaces;
a front cover adhered to the mounting surface and covering the mounting surface in the first direction;
a metal plate adhered to the rear surface;
a side cover covering the side wiring and the side;
A side end member grounded with the metal plate and disposed on only one side of a pair of side surfaces to which the side wiring extends among the four side surfaces;
At least one display module among the plurality of display modules is disposed such that a side on which the side end member is not disposed is adjacent to an edge of the frame among a pair of side surfaces on which the side wiring extends,
The frame includes a frame side end member provided to surround a side surface on which the side end member is not disposed among a pair of side surfaces to which the side wiring extends in at least one display module among the plurality of display modules.

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