KR20230060801A - Display appartus having display module and manufacturing method thereof - Google Patents

Abstract

According to the idea of the present invention, a display module includes: a substrate including a mounting surface and a side surface on which a TFT layer (Thin Film Transistor) is formed; a plurality of inorganic light emitting elements mounted on the mounting surface; an anisotropic conductive layer electrically connecting the TFT layer and the plurality of inorganic light emitting elements and disposed on an upper surface of the TFT layer; an adhesive layer prepared to be applied by an ink-jet method on the anisotropic conductive layer; a front cover which adheres to the adhesive layer and covers the mounting surface; and side covers that cover sides, wherein a side end of the anisotropic conductive layer and a side end of the adhesive layer are arranged on the same line in the direction toward which the mounting surface faces. Accordingly, the thickness of the adhesive layer which bonds the front cover and the substrate can be minimized.

Description

Display device including display module and manufacturing method thereof {DISPLAY APPARTUS HAVING DISPLAY MODULE AND MANUFACTURING METHOD THEREOF}

The present invention relates to a display device displaying an image by combining modules in which a self-luminous inorganic light emitting device is mounted on a substrate.

The display device is a type of output device that visually displays data information such as text and figures, and images.

In general, as a display device, a liquid crystal panel requiring a backlight or an organic light-emitting diode (OLED) panel made of a film of an organic compound that emits light by itself in response to current has been mainly used. However, the liquid crystal panel has problems in that it has a slow response time, high power consumption, and is difficult to compact because it does not emit light itself and requires a backlight. In addition, OLED panels do not need a backlight because they emit light themselves, and the thickness can be made thin. Therefore, as a new panel to replace them, a micro light emitting diode (microLED or μLED) panel that mounts an inorganic light emitting element on a substrate and uses the inorganic light emitting element itself as a pixel is being researched. there is.

A micro light emitting diode display panel (hereinafter referred to as a micro LED panel) is one of flat panel display panels and is composed of a plurality of inorganic light emitting diodes each having a size of 100 micrometers or less.

This LED panel is also a self-light emitting device, but as an inorganic light emitting device, the burn-in phenomenon of OLED does not occur, and brightness, resolution, power consumption, and durability are excellent.

Compared to liquid crystal display (LCD) panels that require a backlight, microLED display panels offer better contrast, response time and energy efficiency. Both organic light-emitting diodes (organic LEDs) and inorganic light-emitting devices, microLEDs, have good energy efficiency, but microLEDs have higher brightness, luminous efficiency, and longer lifespan than OLEDs.

In addition, by arranging the LEDs on the circuit board in pixel units, it is possible to manufacture display modules in units of substrates, and it is easy to manufacture in various resolutions and screen sizes according to customer orders.

The present invention relates to a display device and a method for manufacturing the same, and in particular, to provide a display module suitable for large size and technical characteristics for adhesion to the front cover of each display module in a display device including the same.

According to the spirit of the present invention, a display module includes a substrate including a mounting surface and a side surface on which a TFT layer (Thin Film Transistor) is formed, a plurality of inorganic light emitting elements mounted on the mounting surface, the TFT layer and the plurality of inorganic light emitting elements. An anisotropic conductive layer electrically connecting the light emitting element and disposed on the upper surface of the TFT layer, an adhesive layer provided to be applied on the anisotropic conductive layer by an ink-jet method, and adhered to the adhesive layer to the mounting surface It includes a front cover covering the side surface and a side cover covering the side surface, and a side end of the anisotropic conductive layer and a side end of the adhesive layer are arranged on the same line in a direction toward which the mounting surface faces.

In addition, a side end of the front cover extends to an area outside the mounting surface, and the side cover is provided to adhere to a lower surface of the front cover corresponding to the outside of the mounting surface and a side surface of the substrate.

In addition, the side cover is provided to cover the side end of the anisotropic conductive layer and the side end of the adhesive layer.

In addition, the side surface is provided to correspond to the four edges of the mounting surface, the front cover is provided to extend to an area outside the four edges of the mounting surface, and the side cover is provided to correspond to the four edges of the mounting surface. In the side surface and the front cover along the circumference, the lower surface of the front cover corresponding to the outer side of the mounting surface, the side end of the anisotropic conductive layer, and the side end of the adhesive layer are all surrounded.

In addition, the side end of the anisotropic conductive layer and the side end of the adhesive layer are disposed inside the side end of the front cover.

In addition, the side end of the anisotropic conductive layer and the side end of the adhesive layer are disposed between the side end of the substrate and the side end of the front cover.

According to the spirit of the present invention, a display device includes a display module array in which a plurality of display modules are horizontally arranged in an M*N matrix form, and each of the plurality of display modules is a room in which a TFT layer (Thin Film Transistor) is formed. A substrate including a front surface and a side surface, a plurality of inorganic light emitting elements mounted on the mounting surface, an anisotropic conductive layer electrically connecting the TFT layer and the plurality of inorganic light emitting elements, and disposed on the upper surface of the TFT layer; An adhesive layer provided to be applied on the anisotropic conductive layer by an ink-jet method, a front cover adhered to the adhesive layer to cover the mounting surface, and a side cover covering the side surface, wherein the anisotropic conductive A side end of the layer and a side end of the adhesive layer are disposed on the same line in a direction toward which the mounting surface faces.

In addition, a side end of the front cover extends to an area outside the mounting surface, and the side cover is provided to adhere to a lower surface of the front cover corresponding to the outside of the mounting surface and a side surface of the substrate.

In addition, the side cover is provided to cover the side end of the anisotropic conductive layer and the side end of the adhesive layer.

In addition, the side surface is provided to correspond to the four edges of the mounting surface,

The front cover is provided to extend to an area outside the four rims of the mounting surface, and the side cover extends along the circumference of the four rims of the mounting surface to the outside of the mounting surface in the side surface and the front cover. Correspondingly, the lower surface of the front cover, the side end of the anisotropic conductive layer, and the side end of the adhesive layer are all surrounded.

In addition, the plurality of display modules include a first display module and a second display module disposed adjacent to the first display module in a direction orthogonal to a direction in which the mounting direction is directed with respect to the first display module, The side end of the front cover of the first display module in a direction adjacent to the second display module is the side end of the first display module in a direction adjacent to the second display module and the first display module in a direction adjacent to the first display module. 2 It is disposed between the sides of the display module.

In addition, the side cover of the first display module in a direction adjacent to the second display module may cover the side surface of the first display module in a direction adjacent to the second display module and the side cover in a direction adjacent to the first display module. It is disposed between the sides of the second display module.

In addition, the side end of the anisotropic conductive layer and the side end of the adhesive layer of the first display module in a direction adjacent to the second display module are the side end of the first display module in a direction adjacent to the second display module and the first It is disposed between the side of the second display module in a direction adjacent to the display module.

In addition, the side end of the front cover and the side end of the side cover are disposed on the same line.

In addition, the side surface is provided to correspond to the four edges of the mounting surface,

The front cover is provided to extend to an area outside the four rims of the mounting surface, and the side cover extends along the circumference of the four rims of the mounting surface to the outside of the mounting surface in the side surface and the front cover. It is provided to surround all of the lower surface of the corresponding front cover, and the side end member is provided to surround at least a portion of the side cover along the circumference of the four edges of the mounting surface.

The display device according to an embodiment of the present invention may have a seamless effect in which a seam is not visually visible by absorbing light incident to a gap between adjacent display modules.

In the display device according to the embodiment of the present invention, the thickness of the adhesive layer bonding the front cover and the substrate may be minimized by applying the adhesive layer on the anisotropic conductive layer of each display module using an inkjet method and then attaching the front cover.

1 is a diagram illustrating a display device according to an embodiment of the present invention;
FIG. 2 is an exploded view illustrating major components of the display device of FIG. 1;
3 is an enlarged cross-sectional view of some components of the display module shown in FIG. 1;
4 is a rear perspective view of one display module of the display device shown in FIG. 1;
5 is a perspective view of some components of one display module shown in FIG. 1;
6 is a cross-sectional view of a part of the display device of FIG. 1 in a second direction;
Figure 7 is an enlarged cross-sectional view of some components shown in Figure 6;
8 is a cross-sectional view of a portion of the display device of FIG. 1 in a third direction;
Figure 9 is an enlarged cross-sectional view of some of the components shown in Figure 8;
10 is a flowchart illustrating a method of manufacturing a display device according to an embodiment of the present invention.
11 is a diagram illustrating a manufacturing process of a display device according to an embodiment of the present invention.
FIG. 12 is a diagram showing a manufacturing process of a display device after FIG. 11;
13 is a view showing a manufacturing process of a display device after FIG. 12 of the present invention.
14 is a diagram showing a manufacturing process of a display device after FIG. 13 of the present invention.
15 is a view showing a manufacturing process of a display device after FIG. 14 of the present invention.

Since the embodiments described in this specification are only the most preferred embodiments of the present invention and do not represent all of the technical spirit of the present invention, various equivalents or modifications that can replace them at the time of this application are also present in the present invention. It should be understood that it is included in the scope of the rights of

Singular expressions used in the description may include plural expressions unless the context clearly dictates otherwise. It may be exaggerated for a clear description of the shape and size of elements in the drawings.

In this specification, terms such as 'include' or 'have' are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features or It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.

In addition, the meaning of 'identical' in this specification includes properties similar to each other or similar within a certain range. Also, the same means 'substantially the same'. It should be understood that the meaning of substantially the same means that a numerical value corresponding to a manufacturing error range or a numerical value corresponding to a difference within a range that does not have a meaning with respect to a reference value is included in the range of 'the same'.

Hereinafter, a preferred embodiment according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a view showing a display device according to an embodiment of the present invention, FIG. 2 is an exploded view showing the main components of the display device of FIG. 1, and FIG. 3 is a view of one display module shown in FIG. An enlarged cross-sectional view of some components, FIG. 4 is a rear perspective view of one display module of the display device shown in FIG. 1, and FIG. 5 is a perspective view of some components of one display module shown in FIG.

Some components of the display device 1 including the plurality of inorganic light emitting elements 50 shown in the drawing are micro-unit configurations having a size of several μm to hundreds of μm, and for convenience of explanation, some components (a plurality of inorganic light emitting elements) (50), the black matrix 48, etc.) are shown exaggeratedly.

The display device 1 is a device that displays information, data, data, etc. as characters, figures, graphs, images, etc., and TV, PC, mobile, digital signage, etc. will be implemented as the display device 1. can

According to an embodiment of the present invention, as shown in FIGS. 1 and 2, the display device 1 includes a display panel 20 displaying an image and a power supply device (not shown) supplying power to the display panel 20. ), the main board 25 for controlling the overall operation of the display panel 20, the frame 21 supporting the display panel 20, and the rear cover 10 covering the rear surface of the frame 21 can include

The display panel 20 includes a plurality of display modules 30A-30P, a driving board (not shown) for driving each of the display modules 30A-30P, and control of each of the display modules 30A-30P. It may include a TOCN board (Timing controller board) that generates a timing signal required for the.

The rear cover 10 may support the display panel 20 . The rear cover 10 may be installed on the floor through a stand (not shown) or installed on a wall through a hanger (not shown).

The plurality of display modules 30A to 30P may be arranged vertically and horizontally so as to be adjacent to each other. The plurality of display modules 30A-30P may be arranged in an M*N matrix form. In this embodiment, 16 display modules 30A-30P are provided and arranged in a 4*4 matrix, but the number and arrangement of the plurality of display modules 30A-30P are not limited. .

A plurality of display modules 30A to 30P may be installed in the frame 21 . The plurality of display modules 30A-30P may be installed in the frame 21 through various known methods such as magnetic force using a magnet or a mechanical fitting structure. A rear cover 10 is coupled to the rear of the frame 21 , and the rear cover 10 may form a rear appearance of the display device 1 .

The rear cover 10 may include a metal material. Accordingly, heat generated from the plurality of display modules 30A-30P and the frame 15 is easily conducted to the rear cover 10 to increase heat dissipation efficiency of the display device 1 .

As such, the display device 1 according to the embodiment of the present invention may implement a large screen by tiling the plurality of display modules 30A to 30P.

Unlike the embodiment of the present invention, each single display module in the plurality of display modules 30A-30P may be applied to a display device. That is, the display modules 30A-30P can be installed and applied to electronic products or electric vehicles that require wearable devices, portable devices, handheld devices, and various displays as a single unit, and can be assembled into a plurality of matrix types as in the embodiment of the present invention. Through arrangement, it can be applied to display devices such as monitors for personal computers (PCs), high-definition TVs and signage, electronic displays, and the like.

The plurality of display modules 30A-30P may have the same configuration as each other. Therefore, the description of any one display module described below can be equally applied to all other display modules.

Hereinafter, since all of the plurality of display modules 30A to 30P are formed identically, the first display module 30A will be described for each of the plurality of display modules 30A to 30P.

That is, in order to avoid overlapping descriptions, the configuration of the plurality of display modules 30A to 30P will be described by representing the display module 30, the substrate 40, and the front cover 70.

Also, if necessary, a first display module 30A among a plurality of display modules 30A-30P and a second display module 30E disposed adjacent to the first display module 30A in the second direction Y. Alternatively, the third display module 30B disposed adjacently in the third direction (Z) will be described.

As an example, the first display module 30A among the plurality of display modules 30A-30P may be formed in a quadrangle type. The first display module 30A may be provided in a rectangular type shape or a square type shape.

Accordingly, the first display module 30A may include edges 31, 32, 33, and 34 formed in up, down, left, and right directions with respect to the first direction X, which is the front.

As shown in FIG. 3 , each of the plurality of display modules 30A to 30P may include a substrate 40 and a plurality of inorganic light emitting elements 50 mounted on the substrate 40 . The plurality of inorganic light emitting devices 50 may be mounted on the mounting surface 41 of the substrate 40 facing the first direction (X). In FIG. 3 , the thickness of the substrate 40 in the first direction (X) is exaggeratedly thick for convenience of explanation.

The substrate 40 may be formed in a quadrangle type. As described above, each of the plurality of display modules 30A to 30P may be provided in a rectangular shape, and the substrate 40 may be formed in a rectangular shape to correspond thereto.

The substrate 40 may be provided in a rectangular type shape or a square type shape.

Therefore, taking the first display module 30A as an example, the substrate 40 has borders 31, 32, 33, 34) and corresponding four edges E. (See Figure 5)

The substrate 40 has a substrate body 42, a mounting surface 41 forming one surface of the substrate body 42, and a rear surface forming the other surface of the substrate body 42 and disposed on the opposite side of the mounting surface 41 ( 43) and a side surface 45 disposed between the mounting surface 41 and the rear surface 43.

The side surfaces 45 may form side ends of the substrate 40 in the second direction Y and the third direction Z, which are orthogonal to the first direction X.

The substrate 40 may include a chamfer portion 49 formed between the mounting surface 41 and the side surface 45 and between the rear surface 43 and the side surface 45 .

The chamfer portion 49 may prevent each substrate from colliding and being damaged when the plurality of display modules 30A to 30P are arranged.

The edge E of the substrate 40 is a concept including a side surface 45 and a chamfer portion 49 .

The substrate 40 may include a thin film transistor (TFT) layer 44 formed on the substrate body 42 to drive the inorganic light emitting elements 50 . The substrate body 42 may include a glass substrate. That is, the substrate 40 may include a COG (Chip on Glass) type substrate. The substrate 40 may have first and second pad electrodes 44a and 44b provided to electrically connect the inorganic light emitting devices 50 to the TFT layer 44 .

A TFT (Thin Film Transistor) constituting the TFT layer 44 is not limited to a specific structure or type, and may be configured in various embodiments. That is, the TFT of the TFT layer 44 according to an embodiment of the present invention includes not only a low temperature poly silicon (LTPS) TFT, an oxide TFT, and a poly silicon or a-silicon (Si) TFT, but also an organic TFT and a graphene TFT. etc. can also be implemented.

In addition, the TFT layer 44 may be replaced with a CMOS (Complementary Metal-Oxide Semiconductor) type, n-type MOSFET or p-type MOSFET transistor when the substrate body 42 of the substrate 40 is formed of a silicon wafer.

The plurality of inorganic light emitting elements 50 may include inorganic light emitting elements formed of an inorganic material and having a width, length, and height of several μm to several tens of μm, respectively. The micro-inorganic light emitting device may have a short side length of 100 μm or less among width, length, and height. That is, the inorganic light emitting device 50 may be picked up from a sapphire or silicon wafer and directly transferred onto the substrate 40 . The plurality of inorganic light emitting devices 50 may be picked up and transferred through an electrostatic method using an electrostatic head or a stamp method using an elastic polymer material such as PDMS or silicon as a head.

The plurality of inorganic light emitting elements 50 may be a light emitting structure including an n-type semiconductor 58a, an active layer 58c, a p-type semiconductor 58b, a first contact electrode 57a, and a second contact electrode 57b. can

Although not shown in the drawings, one of the first contact electrodes 57a is electrically connected to the second contact electrode 57b and the n-type semiconductor 58a and the other is electrically connected to the p-type semiconductor 58b. can

The first contact electrode 57a and the second contact electrode 57b may be disposed horizontally and may have a flip chip shape disposed in the same direction (a direction opposite to a light emitting direction).

When the inorganic light emitting element 50 is mounted on the mounting surface 41, the light emitting surface 54 disposed toward the first direction X, the side surface 55, and the bottom surface disposed opposite to the light emitting surface 54 ( 56), the first contact electrode 57a and the second contact electrode 57b may be formed on the bottom surface 56.

That is, the contact electrodes 57a and 57b of the inorganic light emitting device 50 are disposed on the opposite side of the light emitting surface 54 and thus may be disposed on the opposite side of the direction in which light is irradiated.

The contact electrodes 57a and 57b are disposed to face the mounting surface 41, are provided to be electrically connected to the TFT layer 43, and emit light in a direction opposite to the direction in which the contact electrodes 57a and 57b are disposed. A light emitting surface 54 may be disposed.

Therefore, when the light generated in the active layer 58c is irradiated in the first direction (X) through the light emitting surface 54, the light is emitted in the first direction without interference of the first contact electrode 57a or the second contact electrode 57b. It may be irradiated toward the direction (X).

That is, the first direction X may be defined as a direction in which the light emitting surface 54 is arranged to emit light.

The first contact electrode 57a and the second contact electrode 57b may be electrically connected to the first pad electrode 44a and the second pad electrode 44b formed on the mounting surface 41 side of the substrate 40, respectively. there is.

The inorganic light emitting device 50 may be directly connected to the pad electrodes 44a and 44b through an anisotropic conductive layer 47 or a bonding structure such as solder.

An anisotropic conductive layer 47 may be formed on the substrate 40 to mediate electrical bonding between the contact electrodes 57a and 57b and the pad electrodes 44a and 44b. The anisotropic conductive layer 47 is formed by attaching an anisotropic conductive adhesive on a protective film, and may have a structure in which conductive balls 47a are spread on an adhesive resin. The conductive ball 47a is a conductive sphere surrounded by a thin insulating film and can electrically connect conductors to each other while the insulating film is broken by pressure.

The anisotropic conductive layer 47 may include an anisotropic conductive film (ACF) in a film form and an anisotropic conductive paste (ACP) in a paste form.

In an embodiment according to the present invention, the anisotropic conductive layer 47 may be formed of an anisotropic conductive film.

Therefore, when a plurality of inorganic light emitting elements 50 are mounted on the substrate 40, when pressure is applied to the anisotropic conductive layer 47, the insulating film of the conductive balls 47a is broken, thereby forming contact electrodes of the inorganic light emitting elements 50. 57a and 57b may be electrically connected to the pad electrodes 44a and 44b of the substrate 40 .

However, although not shown in the drawing, the plurality of inorganic light emitting devices 50 may be mounted on the substrate 40 through solder (not shown) instead of the anisotropic conductive layer 47 . After the inorganic light emitting device 50 is aligned on the substrate 40 , the inorganic light emitting device 50 may be bonded to the substrate 40 through a reflow process.

The plurality of inorganic light emitting elements 50 may include a red light emitting element 51, a green light emitting element 52, and a blue light emitting element 53, and the light emitting elements 50 is a mounting surface of the substrate 40 with a series of red light emitting elements 51, green light emitting elements 52, and blue light emitting elements 53 as a unit (41) can be mounted on. A series of red light emitting elements 51, green light emitting elements 52, and blue light emitting elements 53 may form one pixel. In this case, each of the red light emitting element 51, green light emitting element 52, and blue light emitting element 53 may form a subpixel.

The red light emitting element 51, the green light emitting element 52, and the blue light emitting element 53 may be arranged in a line at predetermined intervals as in the embodiment of the present invention, or may be arranged in a triangle. It may also be arranged in other forms, such as shapes.

The substrate 40 may include a light absorbing layer 44c to improve contrast by absorbing external light. The light absorption layer 44c may be formed on the entire mounting surface 41 side of the substrate 40 . The light absorption layer 44c may be formed between the TFT layer 43 and the anisotropic conductive layer 47 .

The plurality of display modules 30A to 30P may further include a black matrix 48 formed between the plurality of inorganic light emitting elements 50 .

The black matrix 48 may perform a function of supplementing the light absorption layer 44c entirely formed on the mounting surface 41 side of the substrate 40 . That is, the black matrix 48 absorbs external light to make the substrate 40 appear black, thereby improving the contrast of the screen.

The black matrix 48 may preferably have a black color.

In this embodiment, the black matrix 48 includes pixels formed by a series of red light emitting elements 51, green light emitting elements 52, and blue light emitting elements 53. It is formed to be placed between (pixels). However, unlike the present embodiment, the light emitting elements 51, 52, and 53, which are sub-pixels, may be formed more precisely to partition each other.

The black matrix 48 may be formed in a lattice shape having a horizontal pattern and a vertical pattern to be disposed between pixels.

The black matrix 48 may be formed by applying a light absorbing ink on the anisotropic conductive layer 47 through an ink-jet process and then curing it, or by coating a light absorbing film on the anisotropic conductive layer 47. can

That is, in the anisotropic conductive layer 47 entirely formed on the mounting surface 41, a black matrix 48 is formed between the plurality of inorganic light emitting elements 50 on which the plurality of inorganic light emitting elements 50 are not mounted. can be formed.

The plurality of display modules 30A-30P are front covers disposed on the mounting surface 41 in the first direction X to cover the mounting surface 41 of the plurality of display modules 30A-30P, respectively ( 70) may be included.

Although described later, the front cover 70 may be applied to the anisotropic conductive layer 47 and adhered to the substrate 40 by being adhered by the cured adhesive layer 100 .

The front cover 70 may be provided in plurality so as to be respectively formed on the plurality of display modules 30A to 30P in the first direction (X). (See FIGS. 6 and 7)

The plurality of display modules 30A-30P may be assembled after each separate front cover 70 is formed. That is, as an example, the first display module 30A and the second display module 30E among the plurality of display modules 30A-30P are provided on the mounting surface 41 of the first display module 30A, the first front cover 70A. ) may be formed and a second front cover 70E may be formed on the mounting surface 41 of the second display module 30E.

The front cover 70 is provided to cover the substrate 40 and can protect the substrate 40 from external force or external moisture.

A plurality of layers (not shown) of the front cover 70 may be provided with a functional film having optical performance. This will be described later in detail.

In addition, the plurality of display modules (30A-30P) is a rear adhesive tape ( 61) may be included.

The rear adhesive tape 61 may be provided as a double-sided adhesive tape, but is not limited thereto and may be provided in an adhesive layer shape rather than a tape shape. That is, the rear adhesive tape 61 is an embodiment of a medium for bonding the metal plate 60 and the rear surface 43 of the substrate 40, and may be provided in various media shapes without being limited to the tape.

The plurality of inorganic light emitting devices 50 extend through the pixel driving wiring (not shown) formed on the mounting surface 41 and the side surface 45 of the substrate 40 and form the pixel driving wiring (not shown). It may be electrically connected to a wiring layer (not shown).

An upper wiring layer (not shown) may be formed below the anisotropic conduction layer 47 . The upper wiring layer (not shown) may be electrically connected to the side wiring 46 formed on the side surface 45 of the substrate 40 . The side wiring 46 may be provided in the form of a thin film. The side wiring 46 may include a side wiring coating 46b surrounding the side wiring 46 to prevent damage that may occur when the side wiring 46 is exposed to the outside. (See Fig. 9)

The first direction X of the display device 1 is orthogonal to the first direction X, and the left and right directions of the display device 1 are defined as the second direction Y, the first direction X, and the second direction X. When it is assumed that the two directions (Y) are orthogonal and the vertical direction of the display device 1 is the third direction (Z), the side wires 46 extend along the third direction (Z) in the third direction (Z). It may extend to the rear surface 43 of the substrate 40 along the chamfer portion 49 and the side surface 45 of the substrate 40 .

However, it is not limited to this, and the side wiring 46 is the chamfer portion 49 of the substrate 40 in the second direction (Y) along the second direction (Y) and the side surface 45 of the substrate 40 It may extend to the rear surface (43).

According to an embodiment of the present invention, the side wiring 46 connects one edge E side of the substrate 40 corresponding to the upper edge 32 and the lower edge 34 of the first display module 30A. It may be provided to extend along.

However, the side wiring 46 is not limited thereto, and along the edge E of the substrate 40 corresponding to at least two edges among the four edges 31, 32, 33, and 34 of the first display module 30A. may be extended.

The top wiring layer (not shown) may be connected to the side wiring 46 by a top connection pad (not shown) formed on the edge E side of the substrate 41 .

The side wiring 46 may extend along the side surface 45 of the substrate 40 and be connected to a rear wiring layer 43b formed on the back surface 43 .

An insulating layer 43c covering the back wiring layer 43b may be formed on the back wiring layer 43b in a direction in which the back surface of the substrate 40 faces.

That is, the plurality of inorganic light emitting elements 50 may be sequentially electrically connected to an upper wiring layer (not shown), a side wiring 46, and a rear wiring layer 43b.

Also, as shown in FIG. 4 , the display module 30A may include a driving circuit board 80 provided to electrically control the plurality of inorganic light emitting devices 50 mounted on the mounting surface 41 . The driving circuit board 80 may be formed of a printed circuit board. The driving circuit board 80 may be disposed on the rear surface 43 of the board 40 in the first direction (X). It may be disposed on the metal plate 60 adhered to the back surface 43 of the substrate 40 .

The display module 30A may include a flexible film 81 connecting the driving circuit board 80 and the rear wiring layer 43b so that the driving circuit board 80 is electrically connected to the plurality of inorganic light emitting devices 50. there is.

In detail, one end of the flexible film 81 may be connected to a rear surface connection pad 43d disposed on the rear surface 43 of the substrate 40 and electrically connected to the plurality of inorganic light emitting devices 50 .

The rear connection pad 43d may be electrically connected to the rear wiring layer 43b. Accordingly, the rear connection pad 43d may electrically connect the rear wiring layer 43b and the flexible film 81.

As the flexible film 81 is electrically connected to the rear connection pad 43d, power and quasi-periodic signals may be transferred from the driving circuit board 80 to the plurality of inorganic light emitting devices 50.

The flexible film 81 may be formed of a flexible flat cable (FFC) or a chip on film (COF).

The flexible film 81 may include a first flexible film 81a and a second flexible film 81b respectively disposed in the vertical direction with respect to the first direction X, which is the forward direction.

The first and second flexible films 81a and 81b are not limited thereto and may be disposed in left and right directions with respect to the first direction (X), or in at least two directions of up, down, left, and right directions.

A plurality of second flexible films 81b may be provided. However, it is not limited thereto, and the second flexible film 81b may be provided as a single piece, and the first flexible film 81a may also be provided as a plurality of pieces.

The first flexible film 81a may transfer data signals from the driving circuit board 80 to the board 40 . The first flexible film 81a may be made of COF.

The second flexible film 81b may transmit power from the driving circuit board 80 to the board 40 . The second flexible film 81b may be made of FFC.

However, it is not limited thereto, and the first and second flexible films 81a and 81b may be formed opposite to each other.

Although not shown in the drawings, the driving circuit board 80 may be electrically connected to the main board 25 (refer to FIG. 2). The main board 25 may be disposed on the rear side of the frame 15 , and the main board 25 may be connected to the driving circuit board 80 through a cable (not shown) at the rear of the frame 15 .

As described above, the metal plate 60 may be provided to contact the substrate 40 . The metal plate 60 and the substrate 40 may be bonded by the rear adhesive tape 61 disposed between the rear surface 43 of the substrate 40 and the metal plate 60 .

The metal plate 60 may be formed of a metal material having high thermal conductivity. For example, the metal plate 60 may be made of aluminum.

Heat generated from the plurality of inorganic light emitting devices 50 and the TFT layer 44 mounted on the substrate 40 is transferred to the metal plate 60 through the rear adhesive tape 61 along the rear surface 43 of the substrate 40. can be forwarded to

Accordingly, heat generated from the substrate 40 can be easily transferred to the metal plate 60 and the substrate 40 can be prevented from rising above a certain temperature.

The plurality of display modules 30A-30P may be arranged in various positions in an M*N matrix form. Each of the display modules 30A-30P is individually movable. At this time, each of the display modules 30A-30P individually includes the metal plate 60 to maintain a constant level of heat dissipation performance regardless of where each display module 30A-30P is disposed. can

A plurality of display modules 30A to 30P may form screens of various sizes of the display device 1 in the form of various M * N matrices. Accordingly, rather than dissipating heat through a single metal plate provided for heat dissipation, each display module (30A-30P) includes an independent metal plate 60 as in one embodiment of the present invention, so that each display module When each of the 30A to 30P dissipates heat individually, the heat dissipation performance of the display device 1 as a whole can be improved.

When a single metal plate is disposed inside the display device 1, a part of the metal plate may not be disposed at a position corresponding to a position where some display modules are disposed based on the front and rear directions, and a display module may not be disposed. A metal plate may be disposed at the location, and heat dissipation efficiency of the display device 1 may be reduced.

That is, through the metal plate 60 disposed on each of the display modules 30A-30P, no matter where the display modules 30A-30P are disposed, all the display modules 30A-30P are respectively Since self heat dissipation is possible by the metal plate 60 , heat dissipation performance of the entire display apparatus 1 may be improved.

The metal plate 60 may be provided in a rectangular shape substantially corresponding to the shape of the substrate 40 .

An area of the substrate 40 may be provided at least equal to or greater than that of the metal plate 60 . When the substrate 40 and the metal plate 60 are arranged side by side in the first direction (X), four edges of the substrate 40 having a rectangular shape based on the center of the substrate 40 and the metal plate 60 may be formed to correspond to the four edges of the metal plate 60 or may be provided to be disposed outside the four edges of the metal plate 60 relative to the center of the substrate 40 and the metal plate 60 .

Preferably, the four edges E of the substrate 40 may be disposed outside the four edges of the metal plate 60 . That is, the area of the substrate 40 may be larger than that of the metal plate 60 .

When heat is transferred to each of the display modules 30A-30P, the substrate 40 and the metal plate 60 may thermally expand. The metal plate 60 has a higher thermal expansion rate than the substrate 40, and the metal plate ( 60) is higher than the expansion value of the substrate 40.

At this time, when the four edges E of the substrate 40 correspond to the four edges of the metal plate 60 or are disposed further inside. An edge of the metal plate 60 may protrude outward from the substrate 40 .

Accordingly, the separation length of the gap formed between each of the display modules 30A to 30P may be irregularly formed by thermal expansion of the metal plate 60 of each of the modules 30A to 30P. A sense of unity of the screen of the display panel 20 may decrease due to an increase in cognition.

However, when the four edges E of the substrate 40 are arranged outside the four edges of the metal plate 60, even if the substrate 40 and the metal plate 60 are thermally expanded, the substrate 40 The metal plate 60 does not protrude outside the four edges E of the display module 30A to 30P, and accordingly, the separation length of the gap formed between the respective display modules 30A to 30P may be maintained constant.

In addition, in order to keep the distance between the display modules 30A-30P constant, the frame 15 supporting each of the display modules 30A-30P is made of a material similar to that of the substrate 40. It can include a front surface with material properties. That is, each of the display modules 30A to 30P may be attached to the front surface of the frame 15 .

According to an embodiment of the present invention, the area of the substrate 40 and the area of the metal plate 60 may be prepared to substantially correspond to each other. Accordingly, heat generated from the substrate 40 may be uniformly dissipated in the entire area of the substrate 40 without being isolated in a partial area.

The metal plate 60 may be provided to be adhered to the rear surface 43 of the substrate 40 by a rear adhesive tape 61 .

The rear adhesive tape 61 may be provided in a size corresponding to that of the metal plate 60 . That is, the area of the rear adhesive tape 61 may be prepared to correspond to the area of the metal plate 60 . The metal plate 60 may be provided in a substantially rectangular shape, and the rear adhesive tape 61 may be provided in a rectangular shape to correspond thereto.

An edge of the rectangular metal plate 60 and an edge of the rear adhesive tape 61 may be formed to correspond to each other based on the center of the metal plate 60 and the rear adhesive tape 61 .

Accordingly, since the metal plate 60 and the rear adhesive tape 61 can be easily manufactured as a single coupling structure, the manufacturing efficiency of the entire display device 1 can be increased.

That is, when the metal plate 60 is cut into unit numbers from one plate, the rear adhesive tape 61 is pre-bonded to one plate before the metal plate 60 is cut, and the rear adhesive tape 61 and the metal The plate 60 may be simultaneously cut in unit numbers to reduce the process.

Heat generated from the substrate 40 may be transferred to the metal plate 60 through the rear adhesive tape 61 . Accordingly, the rear adhesive tape 61 may be provided to transfer heat generated from the substrate 40 to the metal plate 60 while adhering the metal plate 60 to the substrate 40 .

Accordingly, the rear adhesive tape 61 may include a material having high heat dissipation performance.

Basically, the rear adhesive tape 61 may include an adhesive material to adhere the substrate 40 and the metal plate 60 together.

Additionally, the rear adhesive tape 61 may include a material having higher heat dissipation performance than a material having general adhesiveness. Accordingly, heat can be efficiently transferred between the substrate 40 and the metal plate 60 to each component.

In addition, the adhesive material of the rear adhesive tape 61 may be formed of a material having higher heat dissipation performance than the adhesive material constituting general adhesives.

A material with high heat dissipation performance means a material that can effectively transfer heat with high thermal conductivity, high heat transferability, and low specific heat.

For example, the rear adhesive tape 61 may include a graphite material. However, it is not limited thereto, and the rear adhesive tape 61 may be generally made of a material having high heat dissipation performance.

The ductility of the rear adhesive tape 61 may be provided to be greater than that of the substrate 40 and the ductility of the metal plate 60 . Therefore, the rear adhesive tape 61 may be made of a material having adhesiveness and heat dissipation and high ductility. The rear adhesive tape 61 may be formed of an inorganic double-sided tape. As described above, the rear adhesive tape 61 is formed of an inorganic tape and is formed as a single layer between one side bonded to the substrate 40 and the other side bonded to the metal plate 60 without a substrate supporting one side and the other side. can be formed

Since the back adhesive tape 61 does not include a substrate, it does not include a material that hinders heat conduction, and thus heat dissipation performance can be improved. However, the rear adhesive tape 61 is not limited to the inorganic double-sided tape and may be provided with a heat dissipation tape having better heat dissipation performance than a general double-sided tape.

The rear adhesive tape 61 may be made of a highly flexible material so as to absorb external force transmitted from the substrate 40 and the metal plate 60 . In detail, the ductility of the rear adhesive tape 61 may be provided greater than that of the substrate 40 and the ductility of the metal plate 60 .

Accordingly, when heat is transferred to the substrate 40 and the metal plate 60 and the external force generated from the size change of the substrate 40 and the metal plate 60 is transferred to the rear adhesive tape 61, the rear adhesive tape 61 ) can prevent external forces from being transmitted to different components as they are deformed.

The rear adhesive tape 61 may have a predetermined thickness in the first direction (X). When heat is transferred to the metal plate 60 to expand or contract due to cooling, the metal plate 60 moves not only in the first direction (X) but also in a direction orthogonal to the first direction (X). It may expand or contract, and thus an external force may be transmitted to the substrate 40 .

As described above, the metal plate 60 is formed in a size corresponding to that of the substrate 40 and is provided to cover the entire rear surface 43 of the substrate 40, and the fixing member 82 is of the metal plate 60. It can be placed on the back side.

However, the fixing member 82 is not limited thereto and may be provided to be disposed on the rear surface 43 of the substrate 40 . At this time, the substrate 40 may be directly attached to the frame 15 through the fixing member 82 .

Unlike one embodiment of the present invention, the metal plate 60 may be provided to cover only a part of the rear surface 43 of the substrate 40, and the metal plate 60 covers the rear surface 43 of the substrate 40. A fixing member 82 may be provided to be adhered to an area that is not.

The fixing member 82 may preferably be provided with double-sided tape.

Hereinafter, the front cover 70, the side cover 90, and the adhesive layer 100 will be described in detail.

6 is a cross-sectional view of some components of the display device of FIG. 1 in a second direction, FIG. 7 is an enlarged cross-sectional view of some components shown in FIG. 6, and FIG. 8 is a cross-sectional view of some components of the display device of FIG. 1. A cross-sectional view in three directions, and FIG. 9 is an enlarged cross-sectional view of some components shown in FIG. 8 .

The front cover 70 may protect the substrate 40 from an external force and reduce visibility of a seam formed by the gap G formed between the plurality of display modules 30A-30P. and color deviation between the plurality of display modules 30A-30P can be improved.

The plurality of display modules 30A-30P are side covers ( 90) may be included.

The front cover 70 of each of the display modules 30A-30P absorbs the light reflected in the gap G between the plurality of display modules 30A-30P. ) It may be formed to extend to the outside of the substrate 40. The side end 75 of the front cover 70 may be provided to extend to an area outside the mounting surface 41 .

In detail, the front cover 70 may be provided to extend outward beyond the edge (or side end, Edge, 41S) of the mounting surface 41 of the substrate 40 in the second direction (Y) and the third direction (Z). there is. (See Figure 5)

Substantially, the gap between each of the display modules 30A-30P may be generated between the side 45 of the substrate 40 of each of the display modules 30A-30P, but in one embodiment of the present invention The meaning gap (G) means a non-display area that can be generated between each of the display modules (30A-30P), the gap (G) formed between a plurality of display modules (30A-30P) This means that from the edge 41S of the mounting surface 41 of the substrate 40 of each of the display modules 30A-30P to the mounting surface 41 of the substrate 40 of the adjacent display modules 30A-30P. It can be understood as a gap formed between the rims 41S.

Therefore, the meaning of the gap G formed between the plurality of display modules 30A-30P is the mounting surface of each of the display modules 30A-30P in the second direction Y or Z. 41) refers to a gap formed between the edges 41S of the mounting surfaces 41 of adjacent display modules 30A-30P.

A front cover 70 extending from each of the display modules 30A-30P is disposed in the gap G between the plurality of display modules 30A-30P, and the light emitted into the gap G or the gap ( By absorbing the light reflected from G), perception of the core can be minimized.

In addition, as will be described later, light irradiated into the gap G is absorbed by the side cover 90 of the plurality of display modules 30A to 30P disposed between the gap G, so that perception of the core can be minimized.

As shown in FIGS. 6 and 7 , the front cover 70 may be provided to extend to the outside of the substrate 40 in the second direction (Y). In detail, the front cover 70 may be provided to extend to an outer side than the side surface 45 and the chamfer portion 49 in the second direction (Y).

According to an embodiment of the present invention, only one edge side of the substrate 40 corresponding to the right edge 31 of the first display module 30A is described, but the front cover 70 is the substrate 40 It may extend outward in the second direction (Y) or the third direction (Z) than the four edges (E) of.

That is, the side end 75 of the front cover 70 corresponding to the edge of the front cover 70 is the substrate than the four edges E of the substrate 40 in the second direction (Y) or the third direction (Z). It may extend to the outer region of 40 and the outer region of mounting surface 41 .

Although not shown in the drawings, the front cover 70 may include a plurality of layers each having different optical properties. Each of the plurality of layers may be provided in a structure in which they are stacked in the first direction (X).

Each of the plurality of layers may be bonded in the first direction (X) to form the front cover 70 .

One of the plurality of layers may be provided as an anti-glare layer. However, it is not limited thereto and may be provided as an anti-reflective layer or a layer in which an anti-glare layer and an anti-reflective layer are mixed.

One layer and another layer among the plurality of layers may be provided as a light transmittance control layer. However, it is not limited thereto and may be formed as a layer that includes other physical properties or materials or has other functions. For example, it may be provided as a circularly polarized light layer. Also, one of the plurality of layers may be provided as a base layer supporting each layer. The base layer may be provided with Optical Clear Resin (OCR).

In addition, it is not limited to one embodiment of the present invention, and a plurality of layers may be provided as a single layer. A single layer may be provided as a layer that can functionally implement all functions of a plurality of layers.

The front cover 70 may be provided to diffusely reflect light incident from the outside so as to prevent dazzling the user's eyes due to regular reflection of light incident from the outside.

As light incident from the outside is diffusely reflected, the glare phenomenon is reduced, and thus the contrast of the screen displayed on the display panel 20 can be improved.

In addition, the front cover 70 may be provided to reduce transmittance of incident external light or external light reflected from the substrate 40 and the gap G.

The front cover 70 according to an embodiment of the present invention includes a material that reduces light transmittance so that at least some of the light is transmitted toward the substrate 40 or is reflected from the substrate 40 in the first direction (X). ) may be provided to absorb at least a portion of the reflected light toward the target.

When a plurality of substrates are produced, some substrates may have different colors due to process problems during the production process. Accordingly, substrates having different inherent colors may be tiled to form a single display panel.

As described above, the front cover 70 according to an embodiment of the present invention can absorb at least a portion of the light reflected from the substrate 40 and transmitted to the outside, thereby increasing the unity of the screen of the display panel 20 .

That is, the front cover 70 can reduce the color deviation of each display module 30A-30P by reducing the external light transmittance of the color deviation generated during the process of the plurality of display modules 30A-30P.

The front cover 70 prevents external light incident on the display panel 20 from the outside from being transmitted through the substrate 40, and additionally absorbs some light incident on the display panel 20 from the outside or prevents the substrate 40 from passing through. Contrast of a screen displayed on the display panel 20 may be improved by absorbing a portion of external light that is reflected and transmitted to the outside of the display panel 20 . Such different optical actions may be respectively implemented through the plurality of layers described above.

That is, the front cover 70 may be disposed in front of the substrate 40 in the first direction (X) to improve contrast that may be lowered by external light in a screen displayed on the display panel 20 .

As described above, in the case of the display module 30 according to an embodiment of the present invention, the front cover 70 may be provided to extend to the outside of the substrate 40 in the second direction (Y).

Accordingly, some of the light introduced into the gap G formed between the plurality of display modules 30A-30P is blocked by at least a portion of the front cover 70 disposed on the gap G, and the gap G At least a portion of the external light entering the gap or the external light reflected on the gap G is absorbed by the front cup 70 disposed on the gap G, so that it is not transmitted to the outside. Therefore, the visibility of the seam formed in the gap G may deteriorate, and as the visibility of the seam decreases, the sense of unity of the screen displayed on the display panel 20 may be improved.

In detail, the side end 75 of the front cover 70 in the second direction (Y) is disposed outside the edge 41S of the mounting surface 41 in the second direction (Y) or on the gap (G). can

In line with this, the front cover 70 is disposed outside the edge 41S of the mounting surface 41 in the second direction (Y) or on the first region 71 disposed on the gap G and the mounting surface 41. It may include a second region 72 disposed on the.

The first area 71 and the second area 72 of the front cover 70 may be partitioned in the second direction Y by the gap G.

The first region 71 of the front cover 70 is disposed on the gap G so that external light irradiated into the gap G is blocked by the first region 71 of the front cover 70 or the gap G ) is blocked from being irradiated to the outside, and the visibility of the seam, which is the boundary of the plurality of display modules 30A-30P that may be formed by the gap G, is reduced, thereby improving the sense of unity of the display panel 20. do.

As described above, the front cover 70 may be provided to extend outwardly from the four edges 41S of the mounting surface 41 of the substrate 40, so that each edge of the plurality of display modules 30A-30P The visibility of the seam that can be formed may be lowered.

If the first display module 30A and the second display module 30E are described as examples, the first area 71A of the first front cover 70A extending from the first display module 30A is the first display module ( 30A) and the second display module 30E.

Side ends 75A and 75E adjacent to each other of the front covers 70A and 70E of the first and second display modules 30A and 30E may be disposed on the gap G.

In addition, the side surfaces 45 of the first and second display modules 30A and 30E and the chamfer portion 49 may be disposed on the gap G.

The second area 72A of the first front cover 70A may be disposed on the mounting surface 41 of the first display module 30A.

The first area 71E of the second cover 70E extending from the second display module 30E is disposed in the gap G formed between the first display module 30A and the second display module 30E. and the second region 72E of the second front cover 70E may be disposed on the mounting surface 41 of the second display module 30E.

That is, in the gap G formed between the first display module 30A and the second display module 30E, the first regions 71A and 71E of the first and second front covers 70A and 70E, respectively, are provided. It can be arranged side by side in two directions (Y).

The lengths of the first regions 71A and 71E of the first and second front covers 70A and 70E extending in the second direction Y may be less than half of the gap G.

Accordingly, when the first regions 71A and 71E of the first and second front covers 70A and 70E are arranged side by side in the second direction Y, the sum of the lengths of the first regions 71A and 71E may correspond to or be smaller than the length of the gap G.

According to an embodiment of the present invention, when the first regions 71A and 71E of the first and second front covers 70A and 70E are arranged side by side in the second direction Y, the first cover 70A A predetermined distance may occur between the side end 75A of the second cover 70E and the side end 75E of the second cover 70E.

However, the separation can be neglected with a very small value. Therefore, the first display module 30A and the second display module 30E do not have a substantially large gap between the first area 71A of the first front cover 70A and the first area 71E of the second cover 70E. ) can be tiled.

As described above, the first area 71A of the first front cover 70A and the second front cover 70E are formed on the gap G between the first display module 30A and the second display module 30E. One region 71E may be disposed.

External light incident on the display panel 20 is diffusely reflected to the outside of the display panel 20 while passing through the first areas 71A and 71E of the first and second front covers 70A and 70E, or the first areas 71A and 71E. The amount of light that is partially absorbed and reaches the gap G is reduced, and the visibility of the boundary between the first display module 30A and the second display module 30E due to the gap G may be reduced.

In addition, the light reflected from the gap G and directed to the outside of the display panel 20 is diffusely reflected to the outside of the display panel 20 while passing through the first regions 71A and 71E of the first and second covers 70A and 70E. A boundary between the first display module 30A and the second display module 30E is revealed by the gap G as a portion of the area 71A and 71E is absorbed and the amount transmitted to the outside of the display panel 20 is reduced. sex may decrease.

That is, the amount of external light introduced into the gap G formed between the plurality of display modules 30A to 30P is reduced and at the same time, at least a portion of the external light reflected from the gap G is absorbed to improve the display panel 20. The integrity of the screen of can be improved.

In addition, even if the substrate 40A of the first display module 30A and the substrate 40E of the second display module 30E are provided to have different colors, the respective substrates 40A and 40E are affected by reflection of external light. At least a portion of the reflected light when displayed externally is absorbed by the first and second front covers 70A and 70E, respectively, so that the inherent color of each substrate 40A and 40E is not recognized externally. The display panel 20 ) can improve the integrity of the screen.

The display module 30A may include a side cover 90 disposed under the front cover 70 in a direction in which the mounting surface 41 faces and provided on the side surface 45 of the substrate 40 .

In detail, the side cover 90 is a space formed on the lower surface 76 of the first area 71 of the front cover 70 in the first direction (X) and on the side surface of the substrate 40 in the second direction (Y). can be placed in

The side cover 90 may be provided to adhere to at least a portion of the lower surface 76 and the side surface 45 of the first region 71 and the metal plate 60 . Preferably, the side cover 90 may be provided to adhere to the entire lower end 76 of the first region 71 . Also preferably, the side cover 90 may be provided to cover the entire area of the side surface 45 .

In addition, the side cover 90 may be provided to cover all of the pair of chamfer portions 49 disposed in the front and rear directions of the side surface 45 in the first direction (X).

The side cover 90 may be provided to cover not only the side surface 45 but also the entire chamfer portion 49 formed between the mounting surface 41 and the side surface 45 .

As the side cover 90 is provided to surround the chamfer portion 49 formed between the mounting surface 41 and the side surface 45, the side cover 90 is provided between the substrate 40 and the front cover 70. It can fill all possible spaces.

Accordingly, the side cover 90 can prevent foreign substances or moisture from entering the space between the substrate 40 and the front cover 70 from the outside.

In addition, as the side cover 90 is provided to surround the chamfer portion 49 formed between the rear surface 43 and the side surface 45, the side cover 90 is provided between the substrate 40 and the metal plate 60. Any space that can be formed can be filled.

Accordingly, the side cover 90 can prevent foreign substances or moisture from entering the space between the substrate 40 and the metal plate 60 from the outside.

The side cover 90 may be provided to contact the bottom surface 76 of the first region 71 and the chamfer portion 49 and side surface 45 of the substrate 40 . Accordingly, the side cover 90 may support the lower surface 76 of the first region 71 , the chamfer portion 49 and the side surface 45 of the substrate 40 .

As described above, the front cover 70 and the substrate 40 are bonded to each other by the front cover 70, and the adhesion between the front cover 70 and the substrate 40 can be strengthened by the side cover 90. there is. Accordingly, the side cover 90 can prevent the front cover 70 from being separated from the substrate 40 .

That is, reliability of the display module 30A may be increased by the side cover 90 .

In addition, the substrate 40 and the metal plate 60 are adhered to each other by the rear adhesive tape 61, and the adhesion between the metal plate 60 and the substrate 40 can be strengthened by the side cover 90. Accordingly, the side cover 90 may prevent the metal plate 60 from being separated from the substrate 40 .

As described above, the side surface 45 of the board 40 is provided to correspond to the four edges 41S of the mounting surface 41, and the first area 71 of the front cover 70 is the mounting surface 41 In the second direction (Y) and the third direction (Z) in which it extends, it may extend to an outer side than the four edges 41S of the mounting surface 41 .

The side cover 90 is along the circumference of the four edges 41S of the mounting surface 41 and the side corresponding to the lower end 76 of the first area 71 and the four edges 41S of the mounting surface 41. It may be provided to surround (45).

That is, the side cover 90 may be provided to seal the entire edge of the portion where the substrate 40 and the front cover 70 are bonded.

The side cover 45 may cover the lower surface 76 and the side surface 45 of the first region 71 in all directions orthogonal to the first direction X.

Accordingly, coupling between the front cover 70 and the substrate 40 may be improved, and the front cover 70 and the side surface 45 of the substrate 40 may be protected from external forces.

In addition, as described above, penetration of external moisture or foreign matter between the substrate 40 and the front cover 70 can be prevented. Additionally, when some gaps are formed between the substrate 40 and the front cover 70 due to an adhesive problem, it is possible to prevent external moisture or foreign matter from penetrating through the gaps.

The side cover 90 is provided to cover all four edges E of the substrate 40 along the side surface 45 of the substrate 40, and there is a gap between the substrate 40 and the front cover 70 and the metal plate 60. A sealing effect may occur.

Therefore, the side cover 90 can prevent foreign matter or moisture from penetrating between the substrate 40 and the front cover 70 even when foreign matter or moisture flows into the substrate 40 in any direction.

As described above, since the last end of the front cover 70 in the first direction (X) is provided with an adhesive layer, the lower surface 76 of the first area 71 may be provided as a rear surface of the adhesive layer.

Accordingly, when the lower surface 76 of the first region 71 is exposed to the outside, foreign substances flowing from the outside may adhere to the lower surface 76 of the first region 71 .

When a plurality of display modules 30A-30P are arrayed in a state in which foreign substances are adhered to the lower surface 76 of the first region 71, foreign substances adhered to the lower surface 76 of the first region 71 cause a plurality of display modules to be disposed. A problem in which the visibility of a seam generated between the display modules 30A to 30P may be increased may occur.

However, the display module 30A according to an embodiment of the present invention includes a side cover 90 and the side cover 90 is provided to cover the lower surface 76 of the first area 71 to prevent foreign substances from entering the first area 71. Adhesion to the lower surface 76 of (71) can be prevented.

Accordingly, when the plurality of display modules 30A to 30P are arrayed, foreign substances may be adhered to the front cover 70 to reduce visibility of seams generated between the plurality of display modules 30A to 30P.

In addition, current flows into a plurality of electrical components mounted on the substrate 40 due to discharge of static electricity that may occur on the display modules 30A-30P, and the electrical components may be damaged. In order to prevent damage to the structure, the board 40 is sealed from the outside so that charges generated by static electricity can be prevented from flowing into the board 40 .

That is, the substrate 40 is sealed by the front cover 70 and the side cover 90 so that electric charges generated by static electricity cannot pass through the front cover 70 and the side cover 90. ) is prevented from flowing, and the electric charge flowing on the front cover 70 and the side cover 90 is guided to the metal plate 60 to the metal plate 60 in contact with the side cover 90, resulting in electrostatic discharge. A path for current may be provided. Accordingly, the ESD withstand voltage of electric components mounted on the substrate 40 may be improved.

As described above, the display module 30A may be disposed under the front cover 70 in the direction in which the mounting surface 41 faces. That is, the side cover 90 is not disposed above the lower surface 76 in the first direction (X).

The front surface 92 of the side cover 90 in the first direction (X) is provided in contact with the lower surface 76 of the first area 71 and the lower surface of the first area 71 in the first direction (X). It is not disposed forward than (76).

This is to avoid disposing the side cover 90 on a movement path of light emitted from the plurality of inorganic light emitting elements 50 .

When at least a part of the side cover 90 is disposed in front of the lower surface 76 or in front of the front cover 70 in the first direction (X), it is disposed on the path of light moving forward through the front cover 70 It can be.

That is, a part of an image displayed on the display module 20 may be distorted because the side cover 90 absorbs or irregularly reflects a part of the moving light.

However, the side cover 90 according to an embodiment of the present invention is disposed behind the front cover 70 in the first direction (X) and does not restrict the movement of light irradiated by the plurality of inorganic light emitting devices 50. Therefore, the image quality of the display panel 20 can be improved.

The side end 75 of the front cover 70 in the second direction (Y) and the side end 91 of the side cover 90 in the second direction (Y) are disposed on substantially the same line in the first direction (X). It can be.

That is, when the plurality of display modules 30A-30P are arrayed, the distance formed between the plurality of display modules 30A-30P can be minimized, and the distance between the plurality of display modules 30A-30P can be recognized. You can minimize the number of seams.

The side cover 90 may include a material that absorbs light. For example, the side cover 90 may be made of an opaque or translucent material.

Also, the side cover 90 may include a photosensitive material. For example, the side cover 90 may be formed of photosensitive optically transparent adhesive resin (OCR). When the photosensitive material is irradiated with external light having a wavelength other than the wavelength of visible light, such as ultraviolet (UV) light, the photosensitive material may change color to a dark color as physical properties are changed.

Accordingly, when ultraviolet rays (UV) are irradiated on the side cover 90 during the manufacturing process, the side cover 90 is colored in a dark color, and the side cover 90 is made of a material capable of absorbing light.

The side cover 90 may be provided to have a dark color. The side cover 90 may be provided to have a darker color than the front cover 70 .

The side cover 90 may preferably have a color similar to that of the black matrix 48 .

Accordingly, the light incident to the side cover 90 may be absorbed by the side cover 90 without being reflected by the light absorbing material of the side cover 90 .

The side cover 90 has a gap G formed between the plurality of display modules 30A-30P together with the first area 71 of the front cover 70 when the plurality of display modules 30A-30P are arrayed. can be placed on top.

Accordingly, it is possible to absorb the light introduced into the gap G and minimize the reflection of the light introduced into the gap G to the outside. Accordingly, visibility of a seam formed by the gap G formed between the plurality of display modules 30A to 30P may be reduced.

If the first display module 30A and the second display module 30E are described as examples, the first side cover 90A of the first display module 30A and the second side cover 90E of the second display module 30E ) is formed between the first display module 30A and the second display module 30E together with the first area 71A of the first cover 70A and the first area 71E of the second cover 70E. It may be disposed in the gap (G).

On the gap G, the side ends 91A and 91E of the side covers 90A and 90E are adjacent to each other together with the side ends 75A and 75E of the front covers 70A and 70E of the first and second display modules 30A and 30E. ) can be placed.

Side ends 75A and 75E adjacent to each other of the front covers 70A and 70E and side ends 91A and 91E adjacent to each other of the side covers 90A and 90E may be disposed to face each other. Preferably, the side ends 75A and 75E of the front covers 70A and 70E and the side ends 91A and 91E of the side covers 90A and 90E are parallel to each other.

That is, in the gap G formed between the first display module 30A and the second display module 30E, the first regions 71A and 71E of the first and second front covers 70A and 70E and the second The first and second side covers 90A and 90E may be arranged side by side in the second direction (Y).

The lengths of the first and second side covers 90A and 90E extending in the second direction (Y) correspond to the first regions 71A and 71E of the first and second front covers 70A and 70E, and approximately a gap (G). ) can be provided at less than half of

On the gap G between the first display module 30A and the second display module 30E, the first area 71A of the first front cover 70A and the first area 71E of the second front cover 70E are formed. ) may be disposed, and first and second side covers 90A and 90E may be disposed at the rear of each of the first regions 71A and 71E in the first direction (X).

As described above, the external light incident on the display panel 20 is diffusely reflected or partially absorbed to the outside of the display panel 20 while passing through the first regions 71A and 71E of the first and second front covers 70A and 70E, thereby forming a gap in the gap. The amount of light reaching (G) is reduced.

Additionally, even if some light reaches the gap G, the light introduced into the gap G is absorbed by the first and second side covers 90A and 90E disposed on the gap G, and the first display module 30A ) and the second display module 30E, the visibility of the boundary may be reduced.

That is, the amount of external light flowing into the gap G formed between the plurality of display modules 30A to 30P is reduced, and at the same time, light reaching the gap G is additionally absorbed to display the screen of the display panel 20. integrity can be improved.

In addition, light that is not absorbed by the first and second side covers 90A and 90E and is reflected on the first and second side covers 90A and 90E and directed to the outside of the display panel 20 is reflected from the first and second front covers 70A and 70E. While passing through the first regions 71A and 71E of the ), the diffuse reflection to the outside of the display panel 20 or partially absorbed by the first regions 71A and 71E reduces the amount of transmission to the outside of the display panel 20, thereby reducing the gap (G ) may reduce the visibility of the boundary between the first display module 30A and the second display module 30E.

As described above, the side cover 90 reaches the gap G as it is disposed in the gap G formed between the plurality of display modules 30A-30P when the plurality of display modules 30A-30P are arrayed. By absorbing the light that is used, the visibility of the seam that can be recognized by the gap G may be reduced.

In the above-described example, the front cover 70 is provided to reduce the amount of light reaching the substrate 40 by diffused reflection, absorption, circular polarization, or conversion of light reflection direction of a part of the light entering the display module 20.

However, the front cover 70 is not limited thereto and may be made of a transparent material through which light is transmitted without deformation. Even at this time, the visibility of the boundary between the plurality of display modules 30A-30P due to the gap G may be reduced by the side cover 90 disposed between the plurality of display modules 30A-30P. .

As described above, the side cover 90 may be made of a material that absorbs light, and when at least a portion of the side cover 90 is disposed in front of the front cover 70 in the first direction (X), a plurality of Some of the light emitted from the inorganic light emitting devices 50 may be absorbed. Accordingly, a problem that a part of the screen displayed on the display module 20 is displayed darkly may occur.

However, the side cover 90 according to an embodiment of the present invention is disposed below the front front cover 70 in the first direction (X), in detail, below the lower surface 76 of the first region 71 Light emitted from the plurality of inorganic light emitting devices 50 may not be absorbed so that brightness of an image displayed on the display module 20 may be uniform.

As shown in FIGS. 8 and 9 , the front cover 70 may be provided to extend to the outside of the substrate 40 in the third direction (Z). In detail, the front cover 70 may be provided to extend to an outer side than the side surface 45 and the chamfer portion 49 in the third direction (Z).

The side end 75 of the front cover 70 in the third direction (Z) may be disposed outside the edge 41S of the mounting surface 41 or on the gap G in the third direction (Z). .

The first area 71 and the second area 72 of the front cover 70 described above may be partitioned by the gap G also in the third direction Z.

If the first display module 30A and the third display module 30B are described as examples, the first area 71A of the first front cover 70A extending from the first display module 30A is the first display module ( 30A) and the third display module 30B.

Side ends 75A and 75B adjacent to each other of the front covers 70A and 70B of the first and third display modules 30A and 30B may be disposed on the gap G.

In addition, the side surfaces 45 and the chamfer portion 49 of the first and third display modules 30A and 30B may be disposed on the gap G.

The first area 71B of the third front cover 70B extending from the third display module 30B is disposed in the gap G formed between the first display module 30A and the third display module 30B. and the second area 72B of the third front cover 70B may be disposed on the mounting surface 41 of the third display module 30B.

That is, in the gap G formed between the first display module 30A and the third display module 30B, the first regions 71A and 71B of the first and third front covers 70A and 70B, respectively, are provided. It can be arranged side by side in three directions (Z).

External light incident on the display panel 20 is diffusely reflected to the outside of the display panel 20 while passing through the first regions 71A and 71B of the first and third front covers 70A and 70B, or the first regions 71A and 71B. The amount of light that is partially absorbed and reaches the gap G is reduced, and the visibility of the boundary between the first display module 30A and the third display module 30E due to the gap G may be reduced.

In addition, the light reflected from the gap G and directed to the outside of the display panel 20 is diffusely reflected outside the display panel 20 while passing through the first regions 71A and 71B of the first and third front covers 70A and 70B. A portion of the portion absorbed by the first regions 71A and 71B and transmitted to the outside of the display panel 20 is reduced so that the boundary between the first display module 30A and the third display module 30B by the gap G is reduced. Visibility may be reduced.

As described above, the side cover 90 may be disposed in a space formed on a side surface of the substrate 40 in not only the second direction (Y) but also the third direction (Z).

A side wiring 46 may be disposed on the side surface 45 of the substrate 40 in the third direction Z. Therefore, the side cover 90 provided on the side surface 45 disposed toward the third direction Z may be provided to cover not only the side surface 45 and the chamfer portion 49 but also the side wire 46. Therefore, it is possible to protect the side wiring 46 from an external force and prevent foreign substances or moisture from penetrating the side wiring 46 .

That is, the side cover 90 corresponds to the lower end 76 of the first area 71 and the four edges 41S of the mounting surface 41 along the circumference of the four edges 41S of the mounting surface 41. As it is provided to surround the side surface 45, it may be provided to surround the side wire 46 extending along the side surface 45 in the third direction (Z).

Accordingly, coupling between the front cover 70 and the board 40 may be improved, and the front cover 70 and the side surface 45 and the side wiring 46 of the board 40 may be protected from external forces.

The side end 75 of the front cover 70 in the third direction (Z) and the side end 91 of the side cover 90 in the third direction (Z) are disposed on the same line in the first direction (X). can Preferably, the side end 75 of the front cover 70 and the side end 91 of the side cover 90 may be disposed on the same line in a direction parallel to the first direction (X).

If the first display module 30A and the third display module 30B are described as examples, the first side cover 90A of the first display module 30A and the third side cover 90B of the third display module 30B ) is between the first display module 30A and the third display module 30B together with the first area 71A of the first front cover 70A and the third area 71B of the third front cover 70B. It may be disposed in the formed gap (G).

On the gap G, side ends 75A and 75B of the front covers 70A and 70B of the first and third display modules 30A and 30B are adjacent to each other and ends 91A and 91B of the side covers 90A and 90B are adjacent to each other. ) can be placed.

The side ends 75A and 75B of the respective front covers 70A and 70B and the side ends 91A and 91B of the side covers 90A and 90B may be disposed to face each other.

Preferably, the side ends 75A and 75B of the front covers 70A and 70B and the side ends 91A and 91B of the side covers 90A and 90B are parallel to each other.

That is, in the gap G formed between the first display module 30A and the third display module 30B, the first regions 71A and 71B of the first and third front covers 70A and 70B respectively Side covers 1 and 3 (90A, 90B) may be arranged side by side in the third direction (Z).

In the gap G formed between the first display module 30A and the third display module 30B, the first regions 71A and 71B of the first and third front covers 70A and 70B and the first and second regions 71A and 71B, respectively. The three side covers 90A and 90B may be arranged side by side in the third direction (Z).

On the gap G between the first display module 30A and the third display module 30B, the first area 71A of the first front cover 70A and the first area 71B of the third front cover 70B are formed. ) may be disposed, and first and third side covers 90A and 90B may be disposed behind each of the first regions 71A and 71B in the first direction (X).

As described above, the external light incident on the display panel 20 is diffusely reflected or partially absorbed to the outside of the display panel 20 while passing through the first regions 71A and 71B of the first and third front covers 70A and 70B, thereby forming a gap in the gap. The amount of light reaching (G) is reduced.

Additionally, even if some light reaches the gap G, the light introduced into the gap G is absorbed by the first and third side covers 90A and 90B disposed on the gap G, and the first display module 30A ) and the visibility of the boundary between the third display module 30B may be reduced.

Light that is not absorbed by the first and third side covers 90A and 90B and is reflected on the first and third side covers 90A and 90B and directed to the outside of the display panel 20 is transmitted through the first and third front covers 70A and 70B. While passing through the first regions 71A and 71B of the display panel 20, it is diffusely reflected to the outside or partially absorbed by the first regions 71A and 71B, and the amount transmitted to the outside of the display panel 20 is reduced to form a gap (G). Therefore, the visibility of the boundary between the first display module 30A and the third display module 30B may be reduced.

As described above, the anisotropic conductive layer 47 may be provided in the shape of an anisotropic conductive film. Although described later in detail, the anisotropic conductive layer 47 may be provided on the TFT layer 41 to be bonded to the TFT layer 41 in the form of a film.

The anisotropic conductive layer 47 may be formed in a film shape so that the area of the anisotropic conductive layer v 47 is larger than that of the substrate 40 .

Accordingly, after the anisotropic conductive layer 47 is bonded to the TFT layer 41, a process of cutting the anisotropic conductive layer 47 so that the area of the anisotropic conductive layer 47 corresponds to the area of the substrate 40 may be performed. there is.

In the cutting process, the anisotropic conductive layer 47 may be cut so that the area of the anisotropic conductive layer 47 corresponds to the area of the substrate 40 through laser cutting or the like.

The anisotropic conductive layer 47 is preferably provided with an area corresponding to that of the mounting surface 41 . However, as described above, since the anisotropic conductive layer 47 is formed of an anisotropic conductive film, it is not easy to provide an area of the anisotropic conductive film corresponding to that of the mounting surface 41. When the corresponding anisotropic conductive film is bonded to the mounting surface 41, the reliability of the display module 30 may decrease because the cross section may be smaller than that of the mounting surface 41 due to manufacturing tolerance of the anisotropic conductive film.

Accordingly, an anisotropic conductive film having an area larger than that of the mounting surface 41 is bonded to the substrate 40, and then the anisotropic conductive film is cut to an area corresponding to that of the substrate 40 to form the anisotropic conductive layer 47. can form

The side surface 45 of the substrate 40 is provided to be disposed outside the mounting surface 41 by the chamfer portion 49 . At this time, preferably, when the anisotropic conductive film is cut, the side surface 45 of the substrate 40 is the reference in the second direction (Y) and the side end of the side wiring 46 in the third direction (Z) ( 46S) can be cut based on.

This is because the side surface 45 of the board 40, the chamfer portion 49, or the side wiring 46 may be damaged when the anisotropic conductive film is cut based on the mounting surface 41.

Accordingly, when the anisotropic conductive film is cut, the side end 47S of the anisotropic conductive layer 47 may be disposed on an outer region of the mounting surface 41 . In detail, as described above, the anisotropic conductive film is cut based on the side end 46S of the side surface 45 or the side wiring 46, and preferably, the side end 47S of the anisotropic conductive layer 47 is in the first direction ( X) may be disposed on the same line as the side surface 45 or the side end 46S of the side wiring 46. In addition, it may be disposed outside the side end 46S of the side surface 45 or the side wiring 46 due to a process tolerance or a burr formed on the anisotropic conductive film during cutting.

However, in order to substantially prevent damage to the substrate 40 that may occur during the cutting process, the position where the anisotropic conductive film is cut may be an area outside the side surface 45 or the side end 46S of the side wiring 46. there is.

Accordingly, the side end 47S of the anisotropic conductive layer 47 may be formed outside the substrate 40 . In particular, the side end 47S of the anisotropic conductive layer 47 may be disposed outside the side cover 90 .

When the side end 47S of the anisotropic conductive layer 47 is disposed outside the side cover 90, the side end 47S of the anisotropic conductive layer 47 is formed in the gap G between the plurality of display modules 30A-30P. ) can be placed. Accordingly, the side end 47S of the anisotropic conductive layer 47 is recognized as a seam between the plurality of display modules 30A to 30P, and the sense of unity of the screen displayed on the display panel 20 may deteriorate.

In addition, a current generated by the discharge of static electricity may flow into the display module through the side end 47S of the anisotropic conductive layer 47 and damage the electrical components mounted inside the display module.

That is, when static electricity is discharged around the display module 30, the side end 47S of the anisotropic conductive layer 47 is exposed to the outside and enters the display module 30 through the side end 47S of the anisotropic conductive layer 47. The display module 30 may be damaged due to the introduction of high-voltage electricity.

To prevent this, in the display device 1 according to an embodiment of the present invention, as shown in FIGS. 7 and 9 , the side end 47S of the anisotropic conductive layer 47 is the side end 75 of the front cover 70 It can be placed more inwardly. In detail, the side end 47S of the anisotropic conductive layer 47 may be disposed on the first region 71 .

Accordingly, in the anisotropic conductive layer 47 , a region extending to an outer region of the mounting surface 41 of the substrate 40 may be provided to extend to the first region 71 .

As described above, the display module 30 includes the side cover 90 disposed outside the substrate 40, and even if the side end 47S of the anisotropic conductive layer 47 is disposed outside the substrate 40, the anisotropic conductive layer 47 The side end 47S of the conductive layer 47 may be covered by the side cover 90 .

As the side end 47S of the anisotropic conductive layer 47 is provided not to be exposed to the outside by the side cover 90, recognition of the seam by the side end 47S of the anisotropic conductive layer 47 is prevented and current is introduced. It can be prevented.

That is, even if the side end 47S of the anisotropic conductive layer 47 is disposed outside the substrate 40, it is covered by the side cover 90 to prevent the aforementioned problem. However, when the side end 47S of the anisotropic conductive layer 47 extends to the outside of the side cover 90, the side end 47S of the anisotropic conductive layer 47 is exposed to the outside of the display module 30. It may be disposed inside the side end 91 of (90).

As described above, the side end 91 of the side cover 90 is provided on the same line as the side end 75 of the front cover 70, and the side end 47S of the anisotropic conductive layer 47 is of the front cover 70. It may be disposed inside the side end 75.

However, it is not limited thereto, and the anisotropic conductive layer 47 may be provided in a size corresponding to the mounting surface 41 and arranged on the same line as the edge 41S of the mounting surface 41 .

That is, unlike the above, the anisotropic conductive layer 47 is formed of a film having a size corresponding to the area of the mounting surface 41, and the mounting surface 41 moves in the first direction (X) without a cutting process of the anisotropic conductive layer 47. ) and can be arranged to overlap. In this case, the side end 47S of the anisotropic conductive layer 47 may be disposed inside the side surface 45 .

As described above, the front cover 70 may be provided to be adhered to the substrate 40 by the adhesive layer 100 .

The adhesive layer 100 may be provided by applying a liquid adhesive on the anisotropic conductive layer 47 through an ink-jet process.

As described above, the anisotropic conductive layer 47 is attached to the substrate 40 and then cut along the side surface 45 or the side wiring 46, or is provided in the form of a film having a size corresponding to the mounting surface 40 of the substrate. It may be provided to be attached to (40).

The adhesive layer 100 may be coated on the anisotropic conductive layer 47 in an area corresponding to that of the anisotropic conductive layer 47 and then cured.

When the liquid adhesive forming the adhesive layer 100 is applied, it is applied to the outside of the side end 47S of the anisotropic conductive layer 47 and then cured, an additional cutting process may occur, resulting in damage to the substrate 40. there is. Alternatively, when the display module 30 having the adhesive layer 100 extending outward beyond the side end 47S of the anisotropic conductive layer 47 without a cutting process is arrayed, the adhesive layer 100 is placed in the gap space between the display modules 30. A portion may be located and recognized as a shim.

To prevent this, the adhesive layer 100 may be applied on the anisotropic conductive layer 47 in an area preferably equal to that of the anisotropic conductive layer 47 through fine dispensing through an ink-jet process. there is.

In detail, a liquid adhesive is applied on the substrate 40 to which the anisotropic conductive layer 47 is bonded to an area equal to that of the anisotropic conductive layer 47 by an inkjet process. Thereafter, the adhesive layer 100 is formed on the anisotropic conductive layer 47 by curing the liquid adhesive, and lamination may be performed to adhere the front cover 70 on the adhesive layer 100 .

Thereafter, the adhesive strength of the adhesive layer 100, the front cover 70, and the anisotropic conductive layer 47 may be increased through secondary curing in some cases.

In the conventional case, the display module 30 is formed in such a way that an adhesive layer is disposed at the bottom of the front cover 70 to adhere the front cover 70 on the anisotropic conductive layer 47 .

At this time, the adhesive layer of the front cover 70 is provided to have a height equal to or greater than a predetermined height in the first direction X toward which the mounting surface 41 or the light emitting surface 54 faces. This is to sufficiently fill a gap that may be formed between the inorganic light emitting elements 50 protruding from the anisotropic conductive layer 47 in the first direction (X) while the adhesive layer is bonded to the anisotropic conductive layer 47 .

Accordingly, as the thickness of the adhesive layer of the front cover 70 increases, the problem of increasing the thickness of the front cover 70, the problem of forming a gap between the inorganic light emitting element 50 and the adhesive layer, and the thickness of the adhesive layer As the amount of light is increased, a problem of light leakage of light generated from the inorganic light emitting device 50 through the adhesive layer has occurred.

The adhesive layer 100 of the display device 1 according to an embodiment of the present invention can solve the above problem by minimizing the thickness D of the adhesive layer 100 as liquid adhesive is applied through an inkjet process.

That is, when the adhesive layer 100 is formed, the liquid adhesive 100 is applied through an inkjet process to have a thickness corresponding to the height at which the inorganic light emitting element 50 protrudes from the anisotropic conductive layer 47 in the first direction (X). According to the application, the thickness (D) of the adhesive layer 100 can be minimized.

That is, unlike the prior art, since the adhesive layer 100 is formed by curing a liquid adhesive, no gap is generated between the inorganic light emitting device 50 and the adhesive layer 100, so the adhesive layer 100 is formed in a predetermined direction in the first direction (X). It may be formed with a minimum thickness capable of covering the inorganic light emitting small intestine 50 in the first direction (X) without having a height of .

Accordingly, the thickness (D) of the adhesive layer 100 is minimized, so that the conventional problem of increasing the thickness of the display module 30 or light leakage and the gap formed between the inorganic light emitting element 50 and the adhesive layer 100 Problems that arise can be resolved.

The thickness (D) of the adhesive layer 100 may correspond to or be higher than the protruding height of the inorganic light emitting element 50 in the first direction (X) from the anisotropic conductive layer 47 . Preferably, the inorganic light emitting element 50 is formed higher than a height at which the inorganic light emitting element 50 protrudes in the first direction (X) from the anisotropic conductive layer 47 by a predetermined length in micrometers to minimize light leakage from the outside. ). Hereinafter, a method of manufacturing the display module 30 according to an embodiment of the present invention will be briefly described.

10 is a flowchart illustrating a method of manufacturing a display device according to an embodiment of the present invention.

11 is a view showing a manufacturing process of a display device according to an embodiment of the present invention, FIG. 12 is a view showing a manufacturing process of a display device after FIG. 12, and FIG. 13 is a view showing a display device after FIG. 14 is a diagram showing a manufacturing process of a display device after FIG. 13 of the present invention, and FIG. 15 is a view showing a manufacturing process of a display device after FIG. 14 of the present invention.

First, as shown in FIG. 11 , a substrate 40 having an anisotropic conductive layer 47 formed on a mounting surface 41 is prepared by adhering an anisotropic conductive film to the TFT layer 41 . (501)

Next, the liquid adhesive 100X is applied on the anisotropic conductive layer 47 adhered to the substrate 40 through an inkjet process (I). (502)

Next, the adhesive layer 100 is formed by curing the liquid adhesive 100X. (503)

Next, as shown in FIG. 12, the front cover 70X is adhered on the adhesive layer 100 (504).

The front cover 70X here means the front cover 70X before being cut. The front cover 70X may be provided to cover the entire area of the mounting surface 41 or the adhesive layer 100 . The front cover 70X may be formed on the adhesive layer 100 through a compression curing process.

Thereafter, adhesion between the adhesive layer 100 and the front cover 70X may be improved through an additional curing process.

Next, as shown in FIG. 13, the side cover in the space between the chamfer portion 49 formed between the rear surface of the front cover 70X and the side surface 45 of the substrate 40 in the first direction (X) Dispensing (90X). (505)

The side cover 90X here means the side cover 90X before being cut together with the front cover 90X.

A predetermined amount may be applied to the side cover 90X by the dispenser W. The applied side cover 90X may be cured through a subsequent operation. The side cover 90X may be formed of, for example, non-energized black resin.

The side cover 90X has a chamfer portion 49 formed between the rear surface of the front cover 70X and the mounting surface 41 and the side surface 45 of the side surface 45 of the substrate 40 and the side surface 45 and the rear surface ( 43) may be applied so as to cover all of the chamfer portion 49 formed between them.

In addition, in the anisotropic conductive layer 47, the side end 47S disposed outside the mounting surface 41 and the side end 100S of the adhesive layer 100 may also be covered by the applied side cover 90X.

The dispensing of the side cover 90X may be performed on all four edges E of the substrate 40 . Accordingly, the side cover 90X may be dispensed to cover all the side surfaces 45 of the substrate 40 . In addition, in the anisotropic conductive layer 47, the side end 47S disposed outside the mounting surface 41 and the entire side end 100S of the adhesive layer 100 corresponding to the side end 47S of the mounting surface 41 are side covers. (90X).

Chamfer portion formed between the rear surface of the front cover 70X and the side surface 45 of the substrate 40 and the side surface 45 and the mounting surface 41 in the first direction (X) while the side cover 90X is cured 49 and the side end 47S of the anisotropic conductive layer 47 and the side end 100S of the adhesive layer 100 may be provided to be bonded.

When the side cover 90X includes a photosensitive material, the side cover 90X may be colored in a dark color by irradiating ultraviolet rays (UX) as a subsequent operation. However, when the side cover 90X does not contain a photosensitive material and is formed of a translucent or opaque material, such a manufacturing process is unnecessary.

Next, as shown in FIG. 14 , at least a portion of the front cover 70X extends outside the substrate 40 in a second direction Y orthogonal to the first direction X toward which the mounting surface 41 faces. The front cover 70X and the side cover 90X are cut in the first direction (X) as much as possible (506).

The cutting process may be performed by laser (L) cutting or the like. Accordingly, the front cover 70X and the side cover 90X may be cut simultaneously.

In the cutting process, the front cover 70X includes the first region 71 in not only the second direction Y but also in a third direction Z orthogonal to the first and second directions X and Y, respectively. The front cover 70X and the side cover 90X may be cut so that the side cover 90X is disposed in the second direction Y and the third direction Z.

That is, the cutting process may be performed on all four edges E of the substrate 40 .

In the cutting process, the position at which the front cover 70X and the side cover 90X are cut is outside the side end 47S of the anisotropic conductive layer 47 and the side end 100S of the adhesive layer 100. The process may be performed.

When the cutting proceeds so that the cutting position of the front cover 70X and the side cover 90X is inside the side end 47S of the anisotropic conductive layer 47 and the side end 100S of the adhesive layer 100, the anisotropic conductive layer 47 ) and the adhesive layer 100 may be exposed to the outside of the side cover 90.

As shown in FIG. 14 , the side end 75 of the front cover 70 and the side end 91 of the side cover 90 may be formed on the same line in the first direction (X) by the cutting process. Preferably, the side end 75 of the front cover 70 and the end 91 of the side cover 90 may be cut to be formed in a direction parallel to the first direction (X).

The length by which the first region 71 extends to the outside of the mounting surface 41 is approximately the gap G formed between the plurality of display modules 30 (30A-30P) and the plurality of display modules 30A-30P. ) can be processed to have a length shorter than half or half the length of

Next, as shown in FIG. 15, the metal plate 60 is bonded to the rear surface 43 of the substrate 40 (507).

The rear adhesive tape 61 is disposed on the upper surface of the metal plate 60 in the first direction (X), so that when the rear adhesive tape 61 and the rear surface 43 of the substrate 40 are compressed, the rear adhesive tape 61 It may be provided to bond the substrate 40 and the metal plate 60 together.

However, it is not limited to this, and the rear adhesive tape 61 is disposed on the rear surface 43 of the substrate 40, and the metal plate 60 may be pressed to the rear adhesive tape 61 disposed on the rear surface 43. there is.

At this time, a portion of the side cover 90X dispensed on the rear surface 43 of the substrate 43 remains, but this is a negligible amount corresponding to the bar metal plate 60 and the defecation of the substrate 40 (43) can be bonded approximately horizontally.

Thereafter, a plurality of display modules 30 (30A to 30P) processed through the process may be prepared, and the plurality of display modules (30A to 30P) may be disposed adjacent to each other. At this time, the plurality of display modules 30A-30P may be fixed through a jig. The plurality of display modules 30A-30P may be arranged in an M*N matrix form.

Although the technical spirit of the present invention as described above has been described by specific embodiments, the scope of the present invention is not limited to these embodiments. Various embodiments that can be modified or modified by those skilled in the art within the scope of not departing from the gist of the technical idea of the present invention specified in the claims will also fall within the scope of the present invention.

1: display device 20: display panel
30, 30A - 30P: display module 40: substrate
41: mounting surface 42: board body
43: back 45: side
46: side wiring 47: anisotropic conductive layer
50: inorganic light emitting element 60: metal plate
70: front cover 80: driving circuit board
90: side cover 100: adhesive layer

Claims (15)

A substrate including a mounting surface and a side surface on which a thin film transistor (TFT) layer is formed;
a plurality of inorganic light emitting elements mounted on the mounting surface;
an anisotropic conductive layer electrically connecting the TFT layer and the plurality of inorganic light emitting elements and disposed on an upper surface of the TFT layer;
an adhesive layer provided to be applied on the anisotropic conductive layer by an ink-jet method;
a front cover adhered to the adhesive layer to cover the mounting surface;
Including; side cover surrounding the side surface,
A side end of the anisotropic conductive layer and a side end of the adhesive layer are arranged on the same line in a direction toward which the mounting surface faces. According to claim 1,
The side end of the front cover extends to an area outside the mounting surface,
The side cover is provided to be adhered to a lower surface of the front cover corresponding to an outer side of the mounting surface and a side surface of the substrate. According to claim 2,
The side cover is provided to cover a side end of the anisotropic conductive layer and a side end of the adhesive layer. According to claim 3,
The side surface is provided to correspond to the four edges of the mounting surface,
The front cover is provided to extend to an area outside the four edges of the mounting surface,
The side cover covers all of the lower surface of the front cover corresponding to the outer side of the mounting surface, the side end of the anisotropic conductive layer, and the side end of the adhesive layer in the side surface and the front cover along the circumference of the four edges of the mounting surface. Surrounding display module. According to claim 1,
A side end of the anisotropic conductive layer and a side end of the adhesive layer are disposed inside the side end of the front cover. According to claim 5,
The side end of the anisotropic conductive layer and the side end of the adhesive layer are disposed between the side end of the substrate and the side end of the front cover. A display device including a display module array in which a plurality of display modules are horizontally arranged in an M*N matrix form,
The plurality of display modules, respectively
A substrate including a mounting surface and a side surface on which a thin film transistor (TFT) layer is formed;
a plurality of inorganic light emitting elements mounted on the mounting surface;
an anisotropic conductive layer electrically connecting the TFT layer and the plurality of inorganic light emitting elements and disposed on an upper surface of the TFT layer;
an adhesive layer provided to be applied on the anisotropic conductive layer by an ink-jet method;
a front cover adhered to the adhesive layer to cover the mounting surface;
Including; side cover surrounding the side surface,
A side end of the anisotropic conductive layer and a side end of the adhesive layer are disposed on the same line in a direction toward which the mounting surface faces. According to claim 7,
The side end of the front cover extends to an area outside the mounting surface,
The side cover is provided to be adhered to a lower surface of the front cover corresponding to an outer side of the mounting surface and a side surface of the substrate. According to claim 8,
The side cover is provided to cover the side end of the anisotropic conductive layer and the side end of the adhesive layer. According to claim 9,
The side surface is provided to correspond to the four edges of the mounting surface,
The front cover is provided to extend to an area outside the four edges of the mounting surface,
The side cover covers all of the lower surface of the front cover corresponding to the outer side of the mounting surface, the side end of the anisotropic conductive layer, and the side end of the adhesive layer in the side surface and the front cover along the circumference of the four edges of the mounting surface. Surrounding display device. According to claim 8,
The plurality of display modules include a first display module and a second display module disposed adjacent to the first display module in a direction orthogonal to a direction in which the mounting direction is directed with respect to the first display module,
The side end of the front cover of the first display module in a direction adjacent to the second display module is the side end of the first display module in a direction adjacent to the second display module and the side end in a direction adjacent to the first display module. A display device disposed between sides of the second display module. According to claim 11,
The side cover of the first display module in a direction adjacent to the second display module is the side surface of the first display module in a direction adjacent to the second display module and the first display module in a direction adjacent to the first display module. 2 A display device disposed between the sides of the display module. According to claim 12,
The side end of the anisotropic conductive layer and the side end of the adhesive layer of the first display module in a direction adjacent to the second display module are the side end of the first display module in a direction adjacent to the second display module and the first display module. A display device disposed between a side surface of the second display module in a direction adjacent to the module. According to claim 1,
A side end of the front cover and a side end of the side cover are disposed on the same line. According to claim 1,
The side surface is provided to correspond to the four edges of the mounting surface,
The front cover is provided to extend to an area outside the four edges of the mounting surface,
The side cover is provided to surround both the lower surface of the front cover corresponding to the outer side of the mounting surface in the side surface and the front cover along the circumference of the four edges of the mounting surface,
The side end member is provided to surround at least a portion of the side cover along the circumferences of the four edges of the mounting surface.

Images