KR20240038097A - 열전 변환 소자 - Google Patents
열전 변환 소자 Download PDFInfo
- Publication number
- KR20240038097A KR20240038097A KR1020247007341A KR20247007341A KR20240038097A KR 20240038097 A KR20240038097 A KR 20240038097A KR 1020247007341 A KR1020247007341 A KR 1020247007341A KR 20247007341 A KR20247007341 A KR 20247007341A KR 20240038097 A KR20240038097 A KR 20240038097A
- Authority
- KR
- South Korea
- Prior art keywords
- thermoelectric conversion
- conversion element
- thermoelectric
- thickness
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 215
- 238000005452 bending Methods 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims description 28
- 238000002834 transmittance Methods 0.000 claims description 9
- 239000002344 surface layer Substances 0.000 claims description 5
- 229920000620 organic polymer Polymers 0.000 claims description 4
- 230000005676 thermoelectric effect Effects 0.000 claims description 4
- 230000005291 magnetic effect Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 54
- 238000012360 testing method Methods 0.000 description 26
- 230000000052 comparative effect Effects 0.000 description 20
- 229920002799 BoPET Polymers 0.000 description 13
- 230000005422 Nernst effect Effects 0.000 description 12
- 230000004907 flux Effects 0.000 description 12
- 239000010409 thin film Substances 0.000 description 12
- 238000005259 measurement Methods 0.000 description 11
- 239000012790 adhesive layer Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000002243 precursor Substances 0.000 description 8
- 239000010949 copper Substances 0.000 description 7
- 230000005678 Seebeck effect Effects 0.000 description 6
- 230000002547 anomalous effect Effects 0.000 description 6
- 239000000696 magnetic material Substances 0.000 description 6
- 238000010248 power generation Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 229910052733 gallium Inorganic materials 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 238000009864 tensile test Methods 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 238000001039 wet etching Methods 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000004549 pulsed laser deposition Methods 0.000 description 3
- 239000013077 target material Substances 0.000 description 3
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005303 antiferromagnetism Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005307 ferromagnetism Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 230000005298 paramagnetic effect Effects 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
- H10N15/20—Thermomagnetic devices using thermal change of the magnetic permeability, e.g. working above and below the Curie point
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021130338 | 2021-08-06 | ||
| JPJP-P-2021-130338 | 2021-08-06 | ||
| PCT/JP2022/029861 WO2023013702A1 (ja) | 2021-08-06 | 2022-08-03 | 熱電変換素子 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20240038097A true KR20240038097A (ko) | 2024-03-22 |
Family
ID=85156035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247007341A Pending KR20240038097A (ko) | 2021-08-06 | 2022-08-03 | 열전 변환 소자 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240341193A1 (https=) |
| EP (1) | EP4383992A4 (https=) |
| JP (1) | JPWO2023013702A1 (https=) |
| KR (1) | KR20240038097A (https=) |
| CN (1) | CN117813944A (https=) |
| WO (1) | WO2023013702A1 (https=) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014072256A (ja) | 2012-09-28 | 2014-04-21 | Tohoku Univ | 熱電発電デバイス |
| JP2018004475A (ja) | 2016-07-04 | 2018-01-11 | 株式会社デンソー | 熱流束センサモジュールおよびその製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110494997A (zh) * | 2017-03-30 | 2019-11-22 | 琳得科株式会社 | 热电转换模块及其制造方法 |
| WO2019009308A1 (ja) * | 2017-07-03 | 2019-01-10 | 国立大学法人東京大学 | 熱電変換素子及び熱電変換デバイス |
| CN113728447B (zh) * | 2019-04-26 | 2025-07-08 | 国立大学法人东京大学 | 热电转换元件以及热电转换装置 |
-
2022
- 2022-08-03 WO PCT/JP2022/029861 patent/WO2023013702A1/ja not_active Ceased
- 2022-08-03 CN CN202280055090.7A patent/CN117813944A/zh active Pending
- 2022-08-03 KR KR1020247007341A patent/KR20240038097A/ko active Pending
- 2022-08-03 EP EP22853120.8A patent/EP4383992A4/en active Pending
- 2022-08-03 JP JP2023540398A patent/JPWO2023013702A1/ja active Pending
- 2022-08-03 US US18/681,670 patent/US20240341193A1/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014072256A (ja) | 2012-09-28 | 2014-04-21 | Tohoku Univ | 熱電発電デバイス |
| JP2018004475A (ja) | 2016-07-04 | 2018-01-11 | 株式会社デンソー | 熱流束センサモジュールおよびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2023013702A1 (https=) | 2023-02-09 |
| CN117813944A (zh) | 2024-04-02 |
| US20240341193A1 (en) | 2024-10-10 |
| EP4383992A4 (en) | 2025-07-30 |
| WO2023013702A1 (ja) | 2023-02-09 |
| EP4383992A1 (en) | 2024-06-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20240304 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application |