KR20240036363A - Horizontal type demagnetizer - Google Patents

Abstract

A horizontal demagnetizer is disclosed. The horizontal demagnetizer of the present invention includes a hopper installed on the device base and into which electronic chips are inserted; a transfer chute installed below the hopper and transferring electronic chips dropped from the hopper in one direction; and a demagnetizer installed at a lower portion of the transfer chute and configured to apply alternating current magnetism for demagnetizing the electronic chip to the transfer chute, wherein the demagnetizer includes a bobbin installed at a lower portion of the transfer chute. and a first coil and a second coil wound on both sides of the bobbin to correspond to each other; The first coil is disposed at the bottom of the hopper to first demagnetize the contact chips dropped from the hopper, and the second coil is disposed horizontally in one direction to be spaced apart from the first coil at the bottom of the transfer chute by the first coil. It is characterized by continuously demagnetizing the electronic chip that was first demagnetized for the second time.

Description

Horizontal type demagnetizer

The present invention relates to a horizontal demagnetizer, and more specifically, to a horizontal demagnetizer capable of removing minute current magnetism generated during the manufacturing or transport of electronic chips.

In general, fine residual magnetism exists in various electronic chips, such as passive devices such as capacitors and inductors, power devices such as transistors, and chipsets equipped with signal processing functions.

This fine residual magnetism is generated when metal parts provided in the electronic chip, such as lead frames, molded frames, connection terminals, or heat dissipation frames, are magnetized by friction. Friction is known to occur mainly during manufacturing processes or transportation.

Therefore, residual magnetism in electronic chips being manufactured or completed attracts foreign substances, resulting in contamination, corrosion, and appearance damage. In particular, small magnetic electronic chips make it difficult to supply them smoothly from chip feeders.

Accordingly, conventionally, a demagnetizer was used to remove residual magnetism from an electronic chip.

However, the demagnetizer according to the prior art has a structural problem in that when the number of electronic chips supplied from the chip supply feeder is large, the demagnetizer ability is significantly reduced due to the large number of electronic chips with high current magnetism in a limited demagnetizer space.

On the other hand, when the demagnetizer operates for a long time, alternating current magnetism is generated in the coil of the demagnetizer, thereby generating heat. At this time, if heat is not released, the magnetic flux density decreases due to the increase in temperature, which causes the problem of demagnetization power being lowered.

Therefore, even when a large number of electronic chips for demagnetization are supplied, the development of technology for a demagnetization device that can accurately proceed with the demagnetization of electronic chips and maintain uniform demagnetization performance even when heat is generated due to long-term operation of the demagnetizer is required. do.

Republic of Korea Patent No. 10-0872953 Republic of Korea Patent No. 10-0379559

The technical problem of the present invention is to allow the first and second demagnetization of the fine current generated during the production or transfer of electronic chips to be carried out in the transfer chute that transfers the electronic chips inserted from the hopper, so that a large number of electronic chips are inserted through the hopper. The aim is to provide a horizontal demagnetizer that can improve the demagnetizer ability even in this case.

Another technical object of the present invention is to provide a horizontal demagnetizer that can maintain uniform demagnetization performance even when heat is generated due to long-term operation of the demagnetizer.

The technical problem to be achieved by the present invention is not limited to the technical problem mentioned above, and other technical problems not mentioned can be clearly understood by those skilled in the art from the description below. There will be.

The technical problem includes a hopper installed on the device base and into which electronic chips are placed; a transfer chute installed below the hopper and transferring electronic chips dropped from the hopper in one direction; and a demagnetizer installed at a lower portion of the transfer chute and configured to apply alternating current magnetism for demagnetizing the electronic chip to the transfer chute, wherein the demagnetizer includes: a bobbin installed at a lower portion of the transfer chute; and a first coil and a second coil wound on both sides of the bobbin to correspond to each other; The first coil is disposed at the bottom of the hopper to first demagnetize the contact chips dropped from the hopper, and the second coil is disposed horizontally in one direction to be spaced apart from the first coil at the bottom of the transfer chute by the first coil. It is characterized by continuously demagnetizing the electronic chip that was first demagnetized for the second time.

It may further include a cooling module installed on the device base to cool the heat generated from the first and second coils when the demagnetizer is operated.

The cooling module is installed on the device base so as to be placed below the demagnetizer.

The cooling module includes a thermoelectric element formed to absorb heat generated from the first and second coils; and a thermoelectric element cooler configured to cool the heat absorbed by the thermoelectric element.

The transfer chute may further include a component detection sensor capable of detecting electronic chips falling from the hopper.

The component detection sensor generates an operation signal for the demagnetizer when an electronic chip is detected in the transfer chute or a stop signal for the demagnetizer when an electronic chip is not detected in the transfer chute, and the device base Characterized by comprising a control unit that controls the operation or stop of the demagnetizer according to the signal from the component detection sensor.

According to the present invention, when transferring electronic chips inserted from a hopper through a transfer chute, the current magnetism of the electronic chip on the transfer chute is removed by horizontal arrangement of the first and second coils of the demagnetizer installed at the bottom of the transfer chute. , by allowing the secondary de-capturing to occur continuously, there is an effect that de-capturing of electronic chips can be performed accurately and stably even when a large number of electronic chips are input through the hopper.

Figure 1 is a perspective view showing a horizontal demagnetizer according to the present invention.
Figure 2 is a front view showing a horizontal demagnetizer according to the present invention.
Figure 3 is a cross-sectional view showing the configuration of the transfer chute and demagnetizer of the horizontal demagnetizer according to the present invention.
FIG. 4 is a diagram for explaining the operating principle of the demagnetizer shown in FIG. 3.
Figure 5 is a cross-sectional view showing the configuration of the cooling module of the horizontal demagnetizer according to the present invention.
Figure 6 is a cross-sectional view showing the state of demagnetizing an electronic chip using a horizontal demagnetizing device according to the present invention.
Figures 7 and 8 are diagrams showing the non-demagnetized and demagnetized states of an electronic chip using the horizontal demagnetizer according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. However, in describing the present invention, descriptions of already known functions or configurations will be omitted to make the gist of the present invention clear.

Referring to Figures 1 to 3, the horizontal demagnetizer according to the present invention includes a hopper 20 into which electronic chips are input, and a transfer chute 30 for transferring electronic chips (EC) dropped from the hopper 20 in one direction. ) and a demagnetizer 40 that removes residual magnetism generated in the electronic chip (EC) by applying alternating current magnetism for demagnetization to the transfer chute 30.

In addition, the present invention includes a device base 10 on which a hopper 20 is installed as an additional device component. The hopper 20 is installed to vibrate through the device base 10. The transfer chute 30 is installed at an angle on the device base 10 to transfer the electronic chips (EC) dropped from the hopper 20 in one direction.

Here, electronic chips (EC) include various chips such as passive devices such as capacitors and inductors, power devices such as transistors, and chipsets (or semiconductor packages) equipped with signal or data processing functions.

Electronic chips (EC) include those that have been manufactured as well as those that are in the process of being manufactured. Therefore, the hopper 20 inputs the electronic chips (EC) that have been manufactured for subsequent inspection, alignment, and packaging processes. Furthermore, electronic chips (EC) before manufacturing is completed may be input into a subsequent manufacturing process.

The hopper 20 is installed on the top of the device base 10. The hopper 20 is provided with a passage through which the electronic chips EC move downward so that the electronic chips EC are fed into the transfer chute 30 disposed below the hopper 20. Accordingly, the transfer chute 30 transfers the electronic chip EC dropped from the hopper 20 in one direction.

This hopper 20 typically includes a hopper body 22 and an outlet 24. The hopper body 22 includes a slope portion whose passage becomes narrower from the top to the bottom. That is, the hopper body 22 has a shape in which the passage becomes narrower toward the bottom for collection and smooth discharge of electronic chips (EC).

The outlet 24 is connected to the lower end of the hopper body 22. For example, the outlet 24 may be formed in the shape of a straight pipe with a circular cross section. However, the outlet 24 may also be a polygonal shaped tube. Additionally, a bent shape on one side can be applied depending on the discharge direction.

Since the electronic chip (EC) put into the hopper 20 configured in this way is before being demagnetized by the demagnetizer, in response to the phenomenon in which the electronic chip (EC) with magnetic force due to residual magnetism sticks to the hopper made of metal, the hopper is It is desirable to apply vibration.

The transfer chute 30 is installed at the lower part of the hopper 20 to transfer the electronic chips (EC) dropped from the hopper 20 in one direction. Here, the direction of one side of the electronic chip (EC) refers to the direction in which the electronic chip (EC) is transferred via the transfer chute 30 for the subsequent inspection process, alignment process, packaging process, etc.

This transfer chute 30 is installed at a downward angle so that the electronic chip (EC) can move naturally. For example, the transfer chute 30 is mounted on the device base through a suspension, so that there is no or almost no vibration.

Therefore, the electronic chips (EC) fall in small quantities through a hopper subject to vibration greater than the magnetic force of the electronic chips (EC), and the electronic chips (EC) that fall and are inserted into the transfer chute 30 are demagnetized along the transfer chute 20. It moves and the decapitation takes place for a sufficient period of time.

The transfer chute 30 is disposed at an angle below the hopper 20 and transfers the electronic chips (EC) dropped from the hopper 20 in one direction. In addition, the transfer chute 30 is made of a material that allows alternating current (AC) magnetism to pass through.

Here, the material through which alternating current magnetism passes is aluminum, and the aluminum transfer chute allows alternating current magnetism to pass through, so that alternating current magnetism for demagnetization reaches the electronic chip (EC) transferred from the transfer chute 30, and the transfer chute ( 30) It is prevented from becoming magnetized.

Therefore, the electronic chip (EC) input from the hopper 20 is transferred along the transfer chute 30, and the alternating current magnetism for demagnetization applied from the demagnetizer 40 passes through the transfer chute 30 and is transferred to the electronic chip (EC). It is delivered until. Accordingly, the remaining magnetism of the electronic chip (EC) is demagnetized.

The transfer chute 30 configured in this way is used as a line feeder, for example. The transfer chute 30 transfers the electronic chips (EC) discharged through the lower part of the hopper 20 to a subsequent process. Subsequent processes may include the above-described inspection process, alignment process, packaging process, and manufacturing process.

Here, the transfer chute 30 is not particularly limited in type or transfer line shape as long as it can transfer the electronic chip (EC) dropped from the hopper 20 to one side, but can be used in a straight direction, also called a line feeder. A conveying chute is preferred.

Of course, in addition to the straight chute described above, the transfer chute 30 may also be a curved feeder whose transfer line is bent in a curved shape. In this case, the demagnetizer has a plurality of continuous demagnetizers along the shape (transfer line) of the transfer chute, such as a straight line or a curve. It can be placed like this.

The demagnetizer 40 applies alternating current magnetism for demagnetization to the transfer chute 30 to prevent friction of metal parts (e.g., lead frame, molded frame, etc.) during the manufacturing process or transfer of the electronic chip (EC). It is designed to remove residual magnetism. For this purpose, the demagnetizer 40 includes a bobbin 42 installed at the lower part of the transfer chute 30, and a first coil 44 and a second coil 46 wound to correspond to each other on both sides of the bobbin 42. Includes.

That is, the demagnetizer 40 of the present invention has various types, but it is easy to apply alternating current magnetism to the transfer chute 30 and includes a bobbin 42 and It includes a first coil (44) and a second coil (46).

The bobbin 42 includes a center and side portions disposed on both left and right sides with respect to the center, and has an annular shape such that the first coil 44 and the second coil 46 correspond to each other in the space of the center and the left and right sides, respectively. It is wound into a shape. As is known, the first coil 44 and the second coil 46 of this annular shape have the strongest magnetic force at their center.

More specifically, since the bobbin 42 has a symmetrical shape with respect to its center point, such as a circular ring or a cylinder, theoretically, the magnetic field is canceled outside the demagnetizer 40 and alternating current magnetism for demagnetization is applied only to the inner center of the demagnetizer 40.

To be more specific, the bobbin 42 is formed to have an approximately ‘U’ shaped cross section. The bobbin 42 is installed in the device base 10 so as to be located at the bottom of the transfer chute 30.

The first coil 44 is wound on one side of the bobbin 42 to be disposed below the discharge port 24 of the hopper 20. This first coil 44 performs primary demagnetization on the electronic chip (EC) dropped from the hopper 20 to the transfer chute 30.

The second coil 46 is wound on the other side of the bobbin 42 to correspond to the first coil 44. After being demagnetized by the first coil 44, the second coil 46 performs secondary demagnetization on the electronic chip EC transferred to one side of the transfer chute 30. To this end, the second coil 46 is horizontally arranged in one direction at the lower part of the transfer chute 30 to be spaced apart from the first coil 44. That is, the first coil 44 and the second coil 46 are arranged horizontally in the lower part of the transfer chute 30 in the transfer direction of the electronic chip EC.

Referring to FIG. 4, the demagnetizer 40 generates electrons by alternating current magnetism applied from the demagnetizer 40 to the transfer chute 30 during the process of transferring the electronic chip (EC) through the transfer chute 30. Removes minute residual magnetism from the chip (EC).

Therefore, by removing the magnetism or magnetic force remaining in the electronic chip (EC), it enables smooth supply of the electronic chip (EC) and prevents deterioration of chip performance. Additionally, in the process of transferring the electronic chip (EC), magnetism is removed without a sudden change in alternating current magnetism (EF).

The demagnetizer 40 configured in this way includes a first coil 44 and a second coil 46 at the bottom of the transfer chute 30 in the direction of transferring the electronic chip to apply alternating current magnetism for demagnetization toward the transfer chute 30. By arranging it horizontally, it not only applies sufficient alternating current magnetism necessary for magnetic removal, but also enables repetitive and continuous magnetic removal.

Referring to Figure 5, the horizontal demagnetizer according to the present invention further includes a cooling module 50 installed on the device base 10. The cooling module 50 includes a thermoelectric element 52 and a thermoelectric element cooler 54 to cool the heat generated from the first coil 44 and the second coil 46 when the demagnetizer 40 is operated. Includes.

The thermoelectric element 52 absorbs heat generated from the first coil 44 and the second coil 46 when the demagnetizer 40 is operated. The thermoelectric element cooler 54 cools the heat absorbed by the thermoelectric element 52.

The cooling module 50 configured in this way is capable of removing the heat generated from the first coil 44 and the second coil 46 when the demagnetizer 40 is operated due to the thermoelectric effect caused by the thermoelectric element 52 and the thermoelectric element cooler 54. Heat is absorbed and cooled. Accordingly, the demagnetizer 40 can maintain a constant demagnetization ability due to a stable heat generation structure when the electronic chip (EC) is demagnetized.

That is, when the electronic chip (EC) is demagnetized and the first coil 44 and the second coil 46 maintain high heat due to cooling, the resistance of the first coil 44 and the second coil 46 As the value increases and the magnetic field becomes weaker, sufficient alternating current magnetism necessary for demagnetizing the electronic chip (EC) is not applied, thereby deteriorating the demagnetizing ability of the demagnetizer 40.

At this time, the cooling module 50 is disposed below the demagnetizer 40 to ensure a quick and smooth cooling structure in response to overheating of the first coil 44 and the second coil 46.

Therefore, the cooling module 50 maintains a constant temperature by absorbing and cooling the first coil 44 and the second coil 46 by the thermoelectric effect to prevent the first coil 44 and the second coil 46 from overheating to a high temperature when demagnetizing the electronic chip (EC). As a result, the resistance values of the first coil 44 and the second coil 46 can be stably lowered, thereby improving the demagnetization ability of the demagnetizer.

Meanwhile, the horizontal demagnetizer according to the present invention further includes a component detection sensor 60 that can detect an electronic chip (EC) falling from the hopper 20. The component detection sensor 60 detects an electronic chip (EC) dropped from the hopper 20. For this purpose, the part detection sensor 60 is installed on the side part of the transfer chute 30. At this time, the component detection sensor 60 may be an optical sensor that detects the electronic chip (EC) falling from the hopper 20 to the transfer chute 30 using light such as infrared light, or a pressure sensor that detects the electronic chip (EC) by weight.

This component detection sensor 60 generates an operation signal for the demagnetizer 40 when an electronic chip (EC) is detected in the transfer chute 30 or when an electronic chip (EC) is not detected in the transfer chute 30. If not, a signal to stop operation of the demagnetizer (40) is generated.

The device base 10 includes a control unit, and the control unit controls the demagnetizer 40 to start or stop according to a signal from the component detection sensor 60.

Therefore, the control unit stops the operation of the demagnetizer 40 when the electronic chip (EC) does not fall from the hopper 20 to the transfer chute 30 and moves the electronic chip from the hopper 20 to the transfer chute 30. By being able to control the demagnetizer to operate only when (EC) falls, the operation time of the demagnetizer 40 can be reduced and overheating of the first coil 44 and the second coil 46 can be prevented. There will be.

Hereinafter, the operating state of the horizontal demagnetizer according to the present invention will be described.

Referring to FIG. 6, when a plurality of electronic chips (EC) requiring de-capturing are put into the hopper 20, the hopper 20 is vibrated through the device base 10 so that the electronic chips (EC) are transferred to the transfer chute ( 30) and gradually falls. After the electronic chip (EC) is dropped into the transfer chute 30, it is spread out irregularly on the transfer chute 30 as shown in FIG. 7. Figure 7 shows the state of the electronic chip (EC) before demagnetization.

Next, when the electronic chip (EC) is dropped into the transfer chute 30 and power is supplied to the demagnetizer 40, the electronic chip (EC) is demagnetized by the alternating current magnetism applied from the first coil 44. The residual magnetism is first demagnetized. The electronic chip (EC), whose residual magnetism has been first demagnetized by the first coil, is transferred in one direction by the inclined structure of the transfer chute 30 and is demagnetized secondarily by the second coil 46, so that the residual magnetism is completely removed. is removed. After the electronic chip (EC) is dropped into the transfer chute 30, as shown in FIG. 8, it is generated by the first coil 44 and the second coil 46 and applied to the transfer chute 30 by the alternating current magnetism for demagnetization. It becomes demagnetized. Figure 8 shows the demagnetization state of the electronic chip (EC).

In other words, the electronic chip (EC) is dropped from the hopper 20 and then transferred along the transfer chute 30, whereby electrons are generated by the first coil 44 and the second coil 46 of the demagnetizer 40. The minute current magnetism generated during the manufacturing or transport of the chip (EC) can be completely demagnetized and removed.

During the demagnetization process of the electronic chip (EC), the first coil 44 and the second coil 46 of the demagnetizer 40 are overheated, but the thermoelectric element 52 and the thermoelectric element cooler constituting the cooling module 50 are overheated. Due to the thermoelectric effect (54), the heat generated in the first coil 44 and the second coil 46 is absorbed and cooled. Accordingly, the demagnetizer 40 can maintain a constant demagnetization ability due to a stable heat generation structure when the electronic chip (EC) is demagnetized.

That is, the cooling module 50 sufficiently absorbs and cools the heat of the first coil 44 and the second coil 46 when the demagnetizer 40 is operated, thereby cooling the first coil 44 and the second coil 46. This overheating increases the resistance value and weakens the magnetic field, thereby resolving the existing deterioration in demagnetization ability and significantly improving the demagnetization ability.

Meanwhile, the transfer chute 30 is further equipped with a component detection sensor 60 that can detect electronic chips (EC) falling from the hopper 20. The component detection sensor 60 generates an operation signal for the demagnetizer 40 when an electronic chip (EC) is detected in the transfer chute 30 or when the electronic chip (EC) is not detected in the transfer chute 30. In this case, a signal to stop operation of the demagnetizer 40 is generated. The control unit of the device base 10 stops the operation of the demagnetizer 40 when the electronic chip (EC) does not fall from the hopper 20 to the transfer chute 30 according to the detection signal from the component detection sensor 60. In addition, the demagnetizer 40 can be controlled to operate only when the electronic chip (EC) falls from the hopper 20 to the transfer chute 30, thereby contributing to shortening the operation time of the demagnetizer 40. , it is possible to prevent overheating of the first coil 44 and the second coil 46.

As described above, the horizontal demagnetizer according to the present invention uses a demagnetizer installed at the bottom of the transfer chute 30 when transferring the electronic chip (EC) input from the hopper 20 to the subsequent process through the transfer chute 30. By horizontally arranging the first coil 44 and the second coil 46 in (40), the first and second demagnetization are performed continuously to remove the current magnetism of the electronic chip (EC) on the transfer chute 30. Even when a large number of electronic chips (EC) are input through the hopper 20, demagnetization of the electronic chips (EC) can be performed accurately and stably.

Although specific embodiments of the present invention have been described and shown above, it is known in the art that the present invention is not limited to the described embodiments, and that various modifications and changes can be made without departing from the spirit and scope of the present invention. This is self-evident to those who have it. Accordingly, such modifications or variations should not be understood individually from the technical idea or viewpoint of the present invention, and the modified embodiments should be regarded as falling within the scope of the claims of the present invention.

10: device base
20: Hopper
22: Hopper body
24: outlet
30: transfer chute
40: Demagnetizer
42: Bobbin
44: first coil
46: second coil
50: cooling module
52: thermoelectric element
54: thermoelectric cooler
60: Part detection sensor

Claims (6)

A hopper installed on the device base and into which electronic chips are inserted;
a transfer chute installed below the hopper and transferring electronic chips dropped from the hopper in one direction; and
A demagnetizer installed at the lower part of the transfer chute and configured to apply alternating current magnetism for demagnetizing the electronic chip to the transfer chute,
The demagnetizer,
A bobbin installed at the lower part of the transfer chute; and
It includes a first coil and a second coil wound on both sides of the bobbin to correspond to each other;
The first coil is disposed at the bottom of the hopper to first demagnetize the electronic chips dropped from the hopper, and the second coil is disposed horizontally in one direction to be spaced apart from the first coil at the bottom of the transfer chute by the first coil. A horizontal demagnetizer characterized in that it continuously demagnetizes the electronic chip that was first demagnetized for the second time.
According to paragraph 1,
A horizontal demagnetizer further comprising a cooling module installed on the device base to cool the heat generated from the first and second coils when the demagnetizer is operated.
According to paragraph 2,
The cooling module is,
A horizontal demagnetizer, characterized in that it is installed on the device base so as to be placed below the demagnetizer.
According to paragraph 2,
The cooling module is,
a thermoelectric element formed to absorb heat generated from the first and second coils; and
A horizontal demagnetizer comprising a thermoelectric element cooler configured to cool the heat absorbed by the thermoelectric element.
According to any one of claims 1 to 4,
The transfer chute,
A horizontal demagnetizer further comprising a component detection sensor capable of detecting an electronic chip falling from the hopper.
According to clause 5,
The component detection sensor is,
Generating an operation signal for the demagnetizer when an electronic chip is detected in the transfer chute, or generating a stop signal for the demagnetizer when an electronic chip is not detected in the transfer chute,
The device base is,
A horizontal demagnetizer comprising a control unit that controls the operation or stop of the demagnetizer according to a signal from the component detection sensor.