KR20240000850A - Defect inspection system for apparatus - Google Patents

Abstract

A main device unit on which a plurality of electronic devices are mounted, a module panel unit connected to one side of the main device unit to supply power to the main device unit, and a display device that displays the external appearance of the electronic device to check for abnormalities in the electronic device. A device defect inspection system including a first check unit and a second check unit capable of checking for abnormalities in wiring of the electronic device by applying a check signal in one direction to the electronic device is disclosed.

Description

Device defect inspection system {DEFECT INSPECTION SYSTEM FOR APPARATUS}

The present invention relates to a device defect inspection system.

In particular, it relates to a device defect inspection system that can finally inspect devices in which various electronic devices are placed and determine whether they are defective.

In addition to production, defect inspection is very important for products. In particular, in devices in which electronic devices such as various sensors and semiconductors are mounted, if there is a problem with one electronic device, the device may malfunction, so defect inspection can be one of the important processes.

Inspection of a device requires a variety of inconsistent tasks, such as the mounted electronic device itself, the connection relationship of the wiring of the electronic device, the connection relationship of the grounding of the electronic device, and the temperature during operation of the electronic device, so the operator must manually perform this. There is a situation.

However, since the manual inspection of the worker must depend on the worker's skills, the inspection is often not performed properly due to the worker's fatigue and reduced concentration. Additionally, workers inspect the device for defects and manually record the results of this inspection, which can increase the worker's fatigue, and the recorded results are often inaccurate.

Therefore, although the device was judged normal when inspected for defects, defects occurred very frequently after shipment.

Accordingly, the demand for a system or method that can accurately determine device defects is increasing.

The present invention according to one embodiment is intended to solve the above-described problem, and its purpose is to provide a device defect inspection system that can accurately determine device defects without being affected by the operator's condition.

A device defect inspection system according to an embodiment includes a main device unit on which a plurality of electronic devices are mounted, a module panel unit connected to one side of the main device unit to supply power to the main device unit, and an external appearance of the electronic device. It may include a first check unit capable of checking for abnormalities in the electronic device and a second check unit capable of checking for abnormalities in wiring of the electronic device by applying a check signal in one direction to the electronic device.

The first check unit may display image information captured from one direction of a reference electronic device on the display in order.

The second check unit applies a check signal to one of the plurality of wires in a preset order, generates and receives a confirmation signal in response to the check signal, and determines whether reference information is generated in response to the confirmation signal. It can be characterized by checking.

The second check unit may be capable of checking wiring abnormalities in electronic devices to which at least three or more wirings among the plurality of electronic devices are connected.

The second check unit may be capable of checking abnormalities in wiring connected to the ground.

The module panel unit may include a plurality of connection terminals to which a plurality of cables can be connected, and a fixing part that can be connected to and fixed to one surface of the main device unit.

A main guide block is disposed in the main device portion, and a module guide block is disposed in the module panel portion. When the module panel portion is aligned with the main device portion, one side of the main guide block and one side of the module guide block are aligned. It can be characterized as being arranged in contact with each other.

According to one embodiment of the present invention, an operator can check whether a device is defective according to a set sequence, and defect check work that requires excessive labor of the worker can be automatically performed to accurately determine whether the device is defective.

1 is a schematic diagram of the present invention's device defect inspection system according to one embodiment.
Figure 2 is a flowchart of the operation of the device defect inspection system of the present invention according to an embodiment.
Figure 3 shows the main guide block and module guide block of the present inventor's device defect inspection system according to one embodiment.
Figure 4 shows the main guide block and module guide block of the present inventor's device defect inspection system according to another embodiment.
Figure 5 shows the first module panel portion and the second module panel portion of the present inventor's device defect inspection system according to one embodiment.
Figure 6 shows the operating state of the first check unit of the present inventor's device defect inspection system according to one embodiment.
Figure 7 shows the second check unit of the device defect inspection system according to the present invention operating to check the wiring status according to one embodiment.
Figure 8 shows the second check unit of the device defect inspection system of the present invention according to one embodiment of the present invention operating to check the grounding state.
Figure 9 shows the operating state of the confirmation unit of the present inventor's device defect inspection system according to an embodiment.

Since the present invention can be modified in various ways and can have various embodiments, specific embodiments will be exemplified and explained in detail in the detailed description. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all transformations, equivalents, and substitutes included in the spirit and technical scope of the present invention.

The terms used in the present invention are only used to describe specific embodiments and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In the present invention, terms such as 'include' or 'have' are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are not intended to indicate the presence of one or more other features. It should be understood that this does not exclude in advance the possibility of the existence or addition of elements, numbers, steps, operations, components, parts, or combinations thereof.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. At this time, note that in the attached drawings, like components are indicated by the same symbols whenever possible. Additionally, detailed descriptions of well-known functions and configurations that may obscure the gist of the present invention will be omitted. For the same reason, some components are exaggerated, omitted, or schematically shown in the accompanying drawings.

Figure 1 is a schematic diagram of the present inventor's device defect inspection system according to an embodiment, Figure 2 is an operation flow chart of the present inventor's device defect inspection system according to an embodiment, and Figure 3 is the present inventor's device defect inspection system according to an embodiment. It shows the main guide block and module guide block of the system, Figure 4 shows the main guide block and module guide block of the present invention's device defect inspection system according to another embodiment, and Figure 5 shows the main guide block and module guide block according to one embodiment. It shows the first module panel part and the second module panel part of the inventor's device defect inspection system, Figure 6 shows the operating state of the first check part of the inventor's device defect inspection system according to one embodiment, and Figure 7 It shows that the second check unit of the present inventor's device defect inspection system according to an embodiment is operated to check the wiring status, and Figure 8 shows the second check unit of the present inventor's device defect inspection system according to an embodiment operated. It shows checking the grounding status, and Figure 9 shows the operating state of the confirmation unit of the device defect inspection system according to the present invention according to an embodiment.

Referring to FIG. 1, the device defect inspection system according to an embodiment of the present invention includes a main device unit 100, a module panel unit 200, a first check unit 300, a second check unit 400, and a storage unit. Includes.

The main device unit 100 may have various electronic devices mounted inside a frame of a specific shape (for example, a hexahedron shape). A door is installed on one side of the main device unit 100, so that the inside can be checked through the door. The other side of the main device unit 100 may be formed open. On the other side of the main device unit 100, a module panel unit 200, which will be described later, may be installed. A plurality of main guide blocks 110 may be disposed on both sides of the main device unit 100.

A plurality of main guide blocks 110 may be located at corresponding positions on the other side of the main device unit 100. That is, the main guide block 110 consists of four pieces, and two blocks each can be positioned adjacent to each other on both sides of the circumference adjacent to the other side of the main device unit 100. The main guide block 110 can guide the assembly position of the module panel portion 200 together with the module guide block 210, which will be described later.

The module panel portion 200 may be formed to be assembled on the other side of the main device portion 100. The module panel unit 200 may be assembled to the main device unit 100 to operate the main device unit 100 or perform other tasks.

The module panel portion 200 may be formed with a plurality of connection terminals. Each cable may be installed correspondingly to the connection terminal of the module panel portion 200. Here, the connection terminals of the module panel unit 200 are connected to cables that supply power to various electronic devices on one side, and are aligned on the other side to connect various electronic devices of the main device unit 100 when assembled in the main device unit 100. can be connected to others. Therefore, it is very important that the module panel unit 200 is connected to the main device unit 100 at an accurate position, and this can be achieved through the module guide block 210 of the module panel unit 200.

As shown in FIG. 3, the main guide block 110 and the module guide block 210 can be arranged to correspond to each other to align the positions of the module panel portion 200. When the module guide part is aligned and located on the other side of the main device part 100, one surface of the module guide block 210 of the module panel part 200 can be arranged in such a way that it contacts one surface of the main guide block 110. That is, when viewed as a whole, the main guide block 110 may be located on the outside and the module guide block 210 may be located on the inside. Therefore, the module panel unit 200 can be aligned and positioned on the other side of the main device unit 100.

In addition, the main guide block 110 is rotatably coupled about an axis. Therefore, after aligning and positioning the module panel part 200 on the other side of the main device part 100, the main guide block 110 can be rotated and positioned in contact with the module guide block 210. By operating in this way, the main guide block 110 can guide the position of the module guide block 210 by pressing it at a symmetrical position. Therefore, the module panel unit 200 can be aligned and positioned on the other side of the main device unit 100.

Meanwhile, referring to Figure 4, the main device part 100 of the present invention according to another embodiment may additionally include a coupling ring part 130, and the module panel part 200 may additionally include a coupling bar 230. It can be included as . Additionally, the main guide block 110 of the main device unit 100 may be formed with a coupling groove 120, and the module guide block 210 of the module panel unit 200 may be formed with a coupling protrusion 220. .

According to another embodiment, the position can be more accurately aligned by combining the coupling bar 230 and the coupling ring portion 130. That is, the module panel part 200 is aligned and positioned on the main device part 100 and then the coupling bar 230 is inserted into the coupling ring part 130, that is, through this, the module panel part ( 200) can be aligned. Afterwards, the main guide block 110 can be rotated and moved in the direction of the module guide block 210 to connect the module panel part 200 to the main device part 100.

Here, the main guide block 110 is observed to have an uneven structure due to the coupling groove 120 of the main guide block 110, and the module panel portion 200 can also be observed to have an uneven structure due to the formation of coupling protrusions 220. there is. Therefore, since the coupling protrusion 220 is located in the space formed by the coupling groove 120, the module panel part 200 can be aligned and positioned more accurately with the main device part 100.

In addition, as shown in FIG. 5, the module panel portion 200 is composed of a first module panel portion 200 ((a) of FIG. 5) and a second module panel portion 200 (b) of FIG. 5. You can. The first module panel portion 200 and the second module panel portion 200 play different roles, and the assemblyable module panel portion 200 is named differently.

For example, the first module panel unit 200 may be formed with the aforementioned connection terminal to supply power, and the second module panel unit 200 may be connected to a flow pipe to drop water into the main device unit 100. It may be possible. The second module panel portion 200 will be described in detail later.

Looking at the first check unit 300 with reference to FIG. 6, the first check unit 300 displays the external appearance of the electronic device on the display according to a set order. Here, the external appearance of the electronic device displayed by the first check unit 300 may be imaging information, which is information about a normal electronic device without defects. After checking the electronic device displayed on the display by the first check unit 300 and the electronic device placed in the main device unit 100, the operator can use the input unit to input whether the electronic device is defective. The first check unit 300 can match and store the electronic device displayed on the display and the information input by the operator through the input unit. In other words, when the operator generates normal information using the input unit, the electronic device displayed on the display can be matched with the normal information and stored.

If the operator generates abnormal information using the input unit, the electronic device displayed on the display can be matched with the abnormal information and stored. Then, the present invention can determine whether the device is defective. However, since the first check unit 300 checks for abnormalities according to the operator's visual observation, this can be checked again through the confirmation unit 500 later.

Additionally, the first check unit 300 can highlight a part of the electronic device to be checked. In the case of certain electronic devices, even if the operator compares the electronic device displayed on the display with the electronic device, it is not possible to accurately detect an abnormality. Or, if a defect occurs repeatedly in an electronic device and the part is not checked in detail, it may be a part that cannot be confirmed. The first check unit 300 can display the relevant part with emphasis.

For example, when an electronic device is manufactured by injection, the injection material is filled into a mold and solidifies to form the electronic device. We assume that defects in this electronic device frequently occur because the part opposite to where the injection molding material is injected is not filled with the injection molding material. Then, the first check unit 300 can display the part opposite to the part where the injection molded product of the electronic device is injected on the display. The operator can check whether there is an abnormality in the electronic device by focusing on the part checked by the first check unit 300 on the display.

Looking at the second check unit 400 with reference to FIG. 7, the second check unit 400 can automatically determine whether the wiring is correct. What was problematic when inspecting the device for defects was the wiring connection. In the past, when a defect occurred due to a short circuit or splicing of a wire, a worker would check for abnormalities in the wire by directly connecting the pins connected to each wire one by one. Naturally, the abnormality check was not accurate.

The second check unit 400 of the present invention automatically determines whether the wiring is defective. A check signal can be applied sequentially to multiple wires. Here, if there is no problem with the wiring, current may flow through the wiring. Here, when current flows through the diode, a confirmation signal can be generated. The second check unit 400 of the present invention receives the confirmation signal and checks whether the confirmation signal corresponds to the reference information.

For example, if the wiring is in the R phase and the current flows properly, a signal must be input as the first reference information. The second check unit 400 can connect the R phase to the N phase to apply a check signal. Then, current flows through the diode corresponding to the R phase of the electronic device (generating a confirmation signal).

Here, the second check unit 400 can receive a confirmation signal when current flows through the diode. Afterwards, it is possible to check whether or not this confirmation signal is input as first reference information to check whether there is a wiring problem. Here, it is possible to check whether a confirmation signal is input or not using the first standard information. Here, if a confirmation signal is not generated or a signal is not input as first reference information corresponding to the generated confirmation signal, it is possible to check whether the second check unit 400 is abnormal.

Here, applying the check signal may mean applying the N phase.

Additionally, the second check unit 400 can be used to check an electronic device (sensor) connected to three or more phase wires.

If the second check unit 400 is checked with reference to FIG. 8, the second check unit 400 can also check whether the ground connection is made in the same manner. Each electronic device may not have a proper ground connection. In this case as well, a check signal is applied to the individual ground wiring of each electronic device. Then, if the ground is properly connected, a confirmation signal is generated in response to the check signal, and the ground connection can be confirmed by checking whether the signal is input as reference information corresponding to the confirmation signal.

Additionally, referring to the confirmation unit 500 of the present invention with reference to FIG. 9, the confirmation unit 500 of the present invention can be operated when abnormal information is input to the first check unit 300.

As described above, when abnormal information is input through the input unit while the first check unit 300 is being performed, the check unit 500 may be operated. The confirmation unit 500 may be configured to allow another worker performing the first check unit 300 to check the electronic device into which abnormal information has been input and determine whether there is an abnormality.

That is, in order to operate the inspection device of the present invention, the operator can input individually assigned ID information and then operate the first check unit 300 and the second check unit 400. If abnormal information is input, another A worker with ID information enters the ID information and then checks the electronic device where abnormal information was entered. Here, a worker with different ID information can input normal information and abnormal information using the input unit. Here, when normal information is input, the first check unit 300 checks again for abnormalities in the electronic device according to the original order, and when abnormal information is input, the device is determined to be defective and the abnormality check may be stopped.

Above, an embodiment of the present invention has been described, but those skilled in the art can add, change, delete or add components without departing from the spirit of the present invention as set forth in the patent claims. The present invention may be modified and changed in various ways, and this will also be included within the scope of rights of the present invention.

100: main device part
110: Main guide block
120: Combination groove
130: coupling ring part
200: module panel part
210: module guide block
220: combination protrusion
230: combination bar
300: 1st check unit
400: 2nd check unit
500: Confirmation unit

Claims (7)

In the device defect inspection system,
A main device unit in which a plurality of electronic devices are mounted;
a module panel unit connected to one side of the main device unit to supply power to the main device unit;
a first check unit capable of checking abnormalities in the electronic device by displaying the external appearance of the electronic device; and
A device defect inspection system including a second check unit capable of checking for abnormalities in wiring of the electronic device by applying a check signal in one direction to the electronic device. According to paragraph 1,
The first check unit
A device defect inspection system characterized by displaying image information captured from one direction of a reference electronic device on a display in order. According to paragraph 1,
The second check unit
A check signal is applied to one of a plurality of wires in a preset order, a confirmation signal is generated and received in response to the check signal, and it is checked whether reference information is generated in response to the confirmation signal. A device defect inspection system. According to paragraph 3,
The second check unit
Capable of checking wiring abnormalities in electronic devices to which at least three or more wirings are connected among the plurality of electronic devices.
A device defect inspection system characterized by a. According to paragraph 3,
The second check unit
Able to check for abnormalities in the wiring connected to the ground
A device defect inspection system characterized by a. According to paragraph 1,
The module panel part
It includes a plurality of connection terminals to which a plurality of cables can be connected, and a fixing part that can be connected to and fixed to one surface of the main device unit.
A device defect inspection system characterized by a. According to clause 6,
A main guide block is disposed in the main device part,
A module guide block is disposed in the module panel section,
When the module panel part is aligned with the main device part, one surface of the main guide block and one surface of the module guide block are placed in contact with each other.
A device defect inspection system characterized by a.

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