KR20230174424A - Method for card type product decoration using UV coating - Google Patents

Abstract

The present invention relates to a card decoration method using UV coating. Specifically, a method of forming a decoration UV-layer directly on a card base made of metal or FRP using a mold, and a UV-layer formed on a card base made of metal plate, FRP, or plastic using a transfer film. It includes a method of transferring and a method of laminating a PET film with a UV layer or a decoration layer including it on a card substrate made of metal or FRP. According to the present invention, compared to the prior art, it is simple and economical, has excellent productivity, and has the effect of realizing various and luxurious designs and decorations.

Description

Method for card type product decoration using UV coating {Method for card type product decoration using UV coating}

The present invention relates to a method of forming letters, patterns, shapes, colors, and other decorations on card-shaped products such as credit cards, transportation cards, and business cards, and particularly to a decoration method using UV coating.

Recently, the importance of product design has become increasingly important regardless of the industry, and an atmosphere is being created where design is more important than function for expensive products or so-called 'luxury goods'. Among them, attempts are being made to apply three-dimensional patterns or deposition to card-type products that reflect an individual's social status or personality, such as membership cards, credit cards, transportation cards, and business cards. Additionally, the number of cases where the cards themselves are made of luxurious metal materials in addition to plastic is increasing.

However, card products have a major disadvantage because they are extremely difficult to process due to the nature of the material, which significantly reduces decoration-related productivity. Below, the conventional card decoration method and its problems will be described.

Typically, metal cards are decorated using one or more methods selected from the methods described below. First of all, there is a method of directly machining patterns on metal plates one by one using CNC machining, etc., but in this case, there is a problem that mass production is extremely low and a lot of equipment and costs are required. In contrast, there is a method of treating a metal plate with a primer and then forming a printing layer on it with a digital printer, but this method has the limitation of not being able to display a three-dimensional pattern. For example, coloring can be done using aluminum anodizing, but this method has limitations when applied to implementing a single color.

In addition, there is a method of engraving a pattern on a metal plate with a laser, but it also takes a lot of time due to direct processing and requires expensive laser equipment, which has the problem of increasing the processing cost.

Figure 1 illustrates the structure of a conventional metal card manufactured by forming a printing layer on a metal plate and processing it with CNC.

In addition, the surface of general PVC cards is very vulnerable to scratches, and metal cards also have weak top coatings, so a separate hard coating that is resistant to scratches is required. Moreover, conventional metal cards are processed through silk printing using UV ink as a top coating, which is vulnerable to scratches and is mostly matte coating, and due to the nature of silk printing, the quality of the mirror coating is significantly poor.

Recently, attempts have been made to use fiber-reinforced plastic (FRP), such as CFRP (Carbon-FRP) or GFRP (Glass-FRP), as a card material.

Meanwhile, the back of most metal cards, like regular plastic PVC cards, is implemented by laminating PVC films with a simple printing layer formed by offset or inkjet. However, new demands are continuously being raised to implement diverse and luxurious designs on the back of the card.

<Prior art literature>

Public Patent Publication No. 10-2011-0130094

Public Patent Publication No. 10-2012-0120520

Registered Patent Publication No. 10-1343625

Registered Patent Publication No. 10-1683642

The present invention proposes a decoration method that utilizes UV coating to implement decoration on card-shaped products such as credit cards, membership cards, and business cards, which is simpler, more economical, and more productive, and can also implement various and luxurious designs. This is what I want to do.

The present invention relates to a card decoration method using UV coating and presents first, second and third decoration methods.

The first decoration method of the present invention is to directly form a decoration UV-layer on a card substrate made of metal or FRP using a mold:

Applying UV resin between the card substrate and the mold;

irradiating ultraviolet rays from the outside to instantly cure the resin; and

demolding to form a UV-layer on the card substrate;

It is characterized by including.

The UV-layer can be implemented as a flat mirror surface or a three-dimensional pattern depending on the inner shape of the corresponding mold.

Here, the card substrate may have a printing layer or other decoration already formed on the upper surface;

In this case the UV-layer is formed on top of the decoration layer;

It is characterized by .

Preferably, the card substrate is a material forming a card array;

The first-decoration method is:

Each step is carried out simultaneously on the entire card array, and each card is cut into individual cards as a post-process of forming the UV layer;

It further includes.

The second-decoration method of the present invention involves transferring a UV-layer onto a card substrate made of metal, plastic, or FRP using a transfer film:

Forming a transfer layer by combining one or more of a translucent printing layer, UV-layer, metal deposition layer, and silk printing layer based on the UV-layer on the transfer film;

forming a decoration layer by transferring the transfer layer onto a card substrate;

Removing the transfer film;

It is characterized by including.

Here, the card substrate may have a printing layer or other decoration layer already formed on the upper surface;

In this case the UV-layer is transferred onto the decoration layer;

It is characterized by .

Preferably, scratch resistance can be improved by forming a UV hard coating layer on the top layer of the transferred decoration layer.

The third decoration method of the present invention is to form decorations on PET film and then laminate them on a card base made of metal or FRP;

On card substrate made of metal or FRP;

Laminating a PET film on which a UV layer or a decoration layer including the UV layer is formed;

It is characterized by including.

The decoration layer is formed by combining other decorations such as a translucent printing layer, metal deposition layer, and silk printing layer based on the UV-layer.

As needed,

Laminating a PVC film with magnetic lines formed on the outside of the PET film; or

Laminating a PVC film with a metal antenna line formed between the card base and the PET film;

You may.

The present invention proposes a method of implementing decorations on card-type products such as credit cards, membership cards, and business cards. According to the present invention, by using UV coating, it is simpler, more economical, and more productive, and in addition, it has the effect of realizing various and luxurious designs and decorations.

1 is a cross-sectional view illustrating the decoration structure of a conventional metal card.
Figure 2 is a cross-sectional view showing a process according to the first embodiment of the present invention.
Figure 3 is a cross-sectional view showing the decoration structure according to the first embodiment of the present invention.
Figure 4 is another cross-sectional view of Figure 3.
Figure 5 is a cross-sectional view of the transfer film for the second embodiment of the present invention.
Figure 6 is a cross-sectional view showing the decoration structure according to the second embodiment of the present invention.
Figure 7 is another cross-sectional view of Figure 6.
Figure 8 is a diagram for explaining the transfer process of the second embodiment of the present invention.
Figure 9 is a cross-sectional view showing a decoration structure according to a third embodiment of the present invention.
FIG. 10 is a diagram for explaining the decoration layer structure of FIG. 9.
Figure 11 is another cross-sectional view of Figure 9.
Figure 12 is a structural diagram in which steps on the back of a semiconductor chip for a card are filled with a decorative FRP finishing material.

The technical features and effects of the present invention 'card-type product decoration method using UV coating' (hereinafter referred to as 'card decoration method') described or not described above are explained through the examples described below with reference to the accompanying drawings. It will become clearer.

1st- Example

The decoration method according to the first embodiment of the present invention is a method of directly forming a decoration UV-layer on a card substrate made of metal or FRP using a mold.

2 to 4, this method includes applying UV resin 13 between a card base 11 made of metal or FRP and a mold 12, irradiating ultraviolet rays from the outside, and forming the resin. (13) is instantaneously cured and demolded to form a UV-layer (14) on the card substrate (11). At this time, the UV-layer 14 may be implemented as a flat mirror surface or a three-dimensional pattern depending on the inner shape of the corresponding mold 12.

In order to strengthen the adhesion between the card base 11 and the UV-layer 14, a preliminary step of treating the surface of the card base 11 with a primer layer 15 is performed so that the UV-layer 14 is formed thereon. can do. In addition, when the card base 11 is made of metal, the step of engraving 16 the surface of the metal plate from the outer surface using CNC, laser, etc. after the UV-layer 14 is formed may be further included. In this case, decoration using light reflection on the metal sculpture surface is possible.

Here, the card substrate 11 may already have a printing layer 17 or another decoration layer formed on its upper surface, in which case the UV-layer 14 will be formed on the printing layer 17 or another decoration layer. . The printing layer 17 is advantageous for implementing decorations because it can actually implement various pictures, colors, designs, etc., and in particular, by applying translucent printing, the metallic feel or fiber texture of FRP by the card base 11 is expressed. can do.

Preferably, the card substrate 11 is a material that forms a card array,

At this time, the first decoration method is:

Each step is carried out simultaneously on the entire card array, and each card is cut as a post-process of forming the UV-layer 14;

It further includes.

In other words, the first-decoration method of the present invention allows processing work at a time on a card array basis, and in an actual test, simultaneous work on 16 cards was possible using a card base 11 of about 400 × 300. In this case, even the most complex UV patterns were possible with this card array in less than 30 seconds.

2nd- Example

The decoration method according to the second embodiment of the present invention is a method of transferring a UV layer onto a card substrate made of metal, plastic, or FRP using a transfer film.

Referring to FIGS. 5 to 8, this method includes a translucent printing layer 23, a metal deposition layer 24, a silk printing layer 25, etc. based on the UV-layers 22 and 30 on the transfer film 21. Forming a transfer layer 26 by combining other decorations, forming a decoration layer 28 by transferring the transfer layer 26 to a card base 27, and removing the transfer film 21. It is characterized by including. Here, the card base material 27 may have a primer layer 20 formed on its upper surface, and in this case, the transfer layer 26 is transferred onto the primer layer 20.

Of course, after removing the transfer film 21 from above, additional decorations can be added thereon. On the other hand, the scratch resistance of the product can be improved by forming a UV-hard coating layer 30 on the top layer of the decoration layer 28.

Here, the card base 27 may already have a printing layer or other decoration layer formed on its upper surface, and in this case, the transfer layer 26 will be transferred onto the printing layer or other decoration layer.

For example, the bonding method between the transfer layer 26 and the card base 27 may be selected from thermal transfer, adhesive transfer, or UV curing transfer using a bonding material 29 such as hot melt, adhesive, or UV resin. In addition, in order to strengthen the adhesion between the decoration layer 28 and the corresponding surface of the card base 27, a primer layer 20 is first formed on the corresponding surface of the card base 27 and the transfer layer 26 is transferred thereon. You can. The translucent printing layer 23 can be formed using a conventional inkjet printer or offset printer.

In the second embodiment, as in the first embodiment, when the card base 27 is made of metal, after the decoration layer 28 is formed, the metal plate card 27 is formed from the outer surface using CNC, laser, etc. A step of engraving the surface (16) may be further included, and in this case, decoration using light reflection of the metal engraving surface is possible.

Meanwhile, when the transfer layer 26 is thermally transferred to the surface of the card base 27 using a hot melt, the surface of the decoration layer 28 may be damaged due to high temperature/high pressure. To prevent this, the transfer film 21 is applied at high temperature/high pressure. It is assumed to be removed after transcription.

In general, when decorations are formed directly on card substrates made of metal, plastic, or FRP, the process is difficult because all processes involve heavy and thick plates, and if a defect occurs in any of the processes, the expensive card material itself is discarded. Should be. In addition, since a roll process like film cannot be used, the production cost is bound to rise significantly. On the other hand, the transfer method of this embodiment is significant in that it forms the transfer layer 26 using a film, that is, the transfer film 21.

In addition, referring to FIG. 12, in the case of a smart card using a conductor such as metal or CFRP (carbon fiber reinforced plastic) as the card base 54, a semiconductor chip 50 is formed by partially penetrating and removing the card base 54. When planting, a fine step of about 0.1 mm occurs between the semiconductor chip 50 and the decorated card base 54 (53, 55). At this time, fine steps can be filled with a finishing material formed by forming a decoration layer 52 including a UV layer on a thin but strong FRP 51. This finishing material is manufactured in the same way as the first and second examples described above.

3rd- Example

The third decoration method of the present invention is to form decorations on PET film and then laminate them on a card substrate made of metal or FRP.

9 to 11, this method includes the step of laminating a PET film 34 on which a UV-layer or a decoration layer 33 including it is formed on a card substrate 31 made of metal or FRP. It is characterized by: The decoration layer 33 is formed by combining other decorations such as a translucent printing layer 36, a metal deposition layer 37, and a silk printing layer 38 based on the UV-layer 35. The top and bottom positions of the decoration layer 33 and PET film 34 may change depending on the design or construction method.

If necessary, a PVC film 42 on which a magnetic line 39 is formed can be laminated on the outer surface of the PET film 34, and a metal antenna line 41 is provided between the card base 31 and the PET film 34. ) can also be laminated with the formed PVC film 40. These additional details may be selectively adopted depending on the type of card being targeted, i.e. whether it is a credit card or a transportation card.

In addition, details regarding the decoration may refer to the first and second embodiments described above.

11. Card entry 12. Mold
13. UV resin 14. UV-layer
15. Primer layer 16. Piece
17. Print layer
20. Primer layer
21. Transfer film 22. UV-layer
23. Translucent printed layer 24. Metal deposition layer
25. Silk printing layer 26. Transfer layer
27. Card entry 28. Decoration layer
29. Bonding material
30. UV-hard coating layer
31. Card entry
33. Decoration layer 34. PET film
35. UV-layer 36. Translucent printing layer
37. Metal deposition layer 38. Silk printing layer
39. Magnetic wire 40. PVC film
41. Antenna wire
42. PVC film
50. Semiconductor chip 51. FRP
52. Decoration layer
53, 55. Card base decoration layer
54. Conductive card entry

Claims (20)

By using the mold 12 to directly form the UV-layer 14 on the card base 11 made of metal or FRP or on the card base 11 with some decorations:
Applying UV resin (13) between the card base (11) or the card base (11) on which some decorations have been processed and the mold (12);
irradiating ultraviolet rays from the outside to instantly cure the resin 13;
demolding to form a UV-layer (14) on the card substrate (11) or on the card substrate (11) on which some decorations have been processed;
A card-type product decoration method comprising:
According to paragraph 1,
A card-type product decoration method, characterized in that the UV-layer (14) is implemented as a flat mirror surface or a three-dimensional pattern depending on the inner shape of the corresponding mold (12).
According to paragraph 1,
The card base material 11 may have some decoration layers such as a printing layer 17 formed on its upper surface, and in this case, the UV-layer 14 is formed on the decoration layer.
According to paragraph 1,
The card substrate 11 is a material that forms a card array;
At this time, the first decoration method is:
Each step is carried out simultaneously on the entire card array, and each card is cut into individual cards as a post-process of forming the UV-layer 14;
A card-type product decoration method further comprising:
According to paragraph 1,
In order to reinforce the adhesion of the UV-layer 14, the surface of the card base 11 or the decoration surface of the card base 11 on which some decorations have been treated are treated with a primer layer 15, and the primer A method for decorating a card-type product, characterized in that a UV-layer (14) is formed on the layer (15).
According to paragraph 1,
If the card substrate (11) is metal, carving (16) the surface of the card substrate (11) from the outer surface after the UV-layer (14) is formed;
A card-type product decoration method further comprising:
By transferring the transfer layer 26 containing at least one of the UV-layers 22 and 30 onto the card substrate 27 made of metal, plastic, or FRP using the transfer film 21:
forming a transfer layer (26) including at least one of the UV-layers (22 and 30) on the transfer film (21);
forming a decoration layer 28 by transferring the transfer layer 26 to the card base 27 or a card base 27 on which some decorations have been processed;
Removing the transfer film 21;
A card-type product decoration method comprising:
In clause 7,
A card-type product decoration method characterized by improving scratch resistance by forming a UV-hard coating layer (30) on the top layer of the decoration layer (28).
In clause 7,
A card product decoration method, characterized in that the bonding method between the transfer layer 26 and the card base 27 is selected from thermal transfer, adhesive transfer, and UV curing transfer using hot melt, adhesive, or UV resin bonding material 29. .
In clause 7,
In order to strengthen the adhesion between the transfer layer 26 and the card base 27 or the card base 27 on which some decorations have been processed, a primer layer 20 is first formed on the surface to be transferred, and the transfer layer 26 is formed thereon. ) A card-type product decoration method characterized by transferring.
In clause 7,
When the card base 27 is made of metal, carving (16) the surface of the card base 27 from the outer surface after the decoration layer 28 is formed;
A card-type product decoration method further comprising:
In clause 7,
Based on at least one layer of the UV-layers (22, 30) in the transfer film (21), a translucent printing layer (23), a UV-layer (22, 30), a metal deposition layer (24), and a silk printing layer ( 25) A method of decorating a card-type product, characterized in that the transfer layer 26 is formed by combining one or more of the following.
In clause 7,
When the transfer layer 26 is thermally transferred to the surface of the card base 27 using a hot melt, the surface of the decoration layer 28 may be damaged by high temperature/high pressure. To prevent this, the transfer film 21 is transferred after high temperature/high pressure transfer. A card-type product decoration method characterized by removing.
By laminating a PET film (34) on which a UV layer (35) or a decoration layer (33) including the UV layer (35) is formed, on a card substrate (31) made of metal or FRP;
forming a UV-layer 35 or a decoration layer 33 including the same on the PET film 34;
Laminating a PET film (34) with a decoration layer (33) formed on a card base (31) made of metal or FRP;
A card-type product-type product decoration method comprising:
According to clause 14,
The decoration layer 33 is formed by combining one or more of the translucent printing layer 36, UV-layer 35, metal deposition layer 37, and silk printing layer 38 based on the UV-layer 35. A method of decorating a card-type product, characterized in that:
According to clause 14,
A card-type product decoration method characterized by laminating a PVC film (42) on which a magnetic line (39) is formed on the outside of the PET film (34).
According to clause 14,
A card-type product decoration method characterized by laminating a PVC film (40) on which a metal antenna line (41) is formed between the card base (31) and the PET film (34).
In the case of a smart card that uses a conductor such as metal or CFRP (carbon fiber reinforced plastic) as the card base 54, the semiconductor chip 50 must be implanted by partially removing the card base 54. A fine step occurs between the decorated card base (54) (53, 55). In this case, the fine step is filled with a finishing material formed by forming a decoration layer (52) including a UV layer on a thin but strong FRP (51). Characterized card-type product decoration method.
According to clause 18,
The finishing material is a card-type product decoration method, characterized in that a UV-layer is formed directly on the FRP (51) or FRP (51 with some decoration) using a mold.
According to clause 18,
A card-type product decoration method, characterized in that the finishing material is manufactured by transferring a decoration layer (52) including a UV-layer onto an FRP (51) using a transfer film.