KR20230152620A - Illuminating device - Google Patents

Abstract

The present invention relates to a lighting device, which includes at least one light source disposed on a printed circuit board, a resin layer disposed on the printed circuit board to bury the light source, and an internal layer formed between the printed circuit board and the resin layer. A light source module including a reflection unit provided with an air area; an indirect light emitting part formed on at least one of one side and the other side of the light source module and reflecting light emitted from the light source; a diffusion plate having an upper surface formed on the light source module and a side wall that is integrally formed with the upper surface and extends downward and is in close contact with an outer surface of the indirect light emitting unit; It includes a lighting device with a structure in which a first air gap is formed between the light source module and the upper surface of the diffusion plate to ensure the flexibility of the product itself and to improve luminance while implementing indirect light emission using a flare effect. It will have an effect.

Description

Lighting device {ILLUMINATING DEVICE}

The present invention relates to the field of lighting device technology.

LED (Light Emitted Diode) devices are devices that convert electrical signals into infrared or light using compound semiconductor properties. Unlike fluorescent lights, they do not use harmful substances such as mercury, so they cause less environmental pollution and are less harmful than conventional light sources. It has the advantage of long lifespan. Additionally, compared to conventional light sources, it consumes low power, has excellent visibility due to its high color temperature, and has the advantage of reducing glare.

Therefore, current lighting devices are evolving from a form that uses traditional light sources such as conventional incandescent bulbs or fluorescent lamps to a form that uses the above-mentioned LED elements as a light source, and in particular, a light guide plate as disclosed in Patent Publication No. 10-2012-0009209. A lighting device that performs a surface light-emitting function is provided by using .

The conventional lighting device described above has a structure in which a flat light guide plate is disposed on a substrate and a plurality of side LEDs are arranged in an array on the side of the light guide plate. Here, the light guide plate is a type of plastic molded lens that performs the function of supplying uniform light to the light emitted from the LED. Therefore, this light guide plate is used as an essential part in conventional lighting devices. Due to the thickness of the light guide plate itself, there is a limit to reducing the thickness of the entire product, and since the material of the light guide plate itself is not flexible, it is difficult to apply to curved areas, which makes product design and design modification difficult. It contained.

In addition, as some light is emitted from the side of the light guide plate, light loss occurs and luminous efficiency decreases, and the characteristics of the LED (e.g., luminous intensity and wavelength change) change as the temperature of the LED increases when emitting light. It also contained problems.

Public Patent Publication No. 10-2012-0009209

The present invention was proposed to solve the above-mentioned problems, and provides a lighting device that can be thinned, improves the freedom of product design, improves heat dissipation efficiency, and suppresses wavelength shift and luminous intensity reduction. It is for that purpose.

In addition, the purpose of the present invention is to maximize the luminance improvement of the lighting device without adding a light source by improving the light reflectance by forming a reflection unit including an air area on the printed circuit board.

In addition, the purpose of the present invention is to differentiate the design of lighting devices without adding a separate light source by implementing an indirect light emitting unit using loss light.

The lighting device of the present invention for solving the above-described problem includes at least one light source disposed on a printed circuit board, a resin layer disposed on the printed circuit board to bury the light source, and the printed circuit board and the resin layer. A light source module including a reflection unit formed between the two and having an air area therein; an indirect light emitting part formed on at least one of one side and the other side of the light source module and reflecting light emitted from the light source; a diffusion plate having an upper surface formed on the light source module and a side wall that is integrally formed with the upper surface and extends downward and is in close contact with an outer surface of the indirect light emitting unit; It includes, and a first air gap may be formed between the light source module and the upper surface of the diffusion plate.

In the lighting device of the present invention, the printed circuit board may be made of a flexible printed circuit board.

In the lighting device of the present invention, the thickness of the first air gap can be formed in a range of more than 0 and less than or equal to 30 mm.

In the lighting device of the present invention, the reflection unit includes: a first reflection sheet in close contact with the surface of the printed circuit board; a second reflective sheet made of a transparent material spaced apart from the first reflective sheet to form the air area; may include.

In the lighting device of the present invention, the reflecting unit may further include a spacing member formed between the first reflecting sheet and the second reflecting sheet to space the first reflecting sheet and the second reflecting sheet. there is.

In the lighting device of the present invention, the spacing member may include at least one unit spacing member made of an adhesive material that has a cavity formed therein and forms a first air portion.

In the lighting device of the present invention, the spacing member may be formed of at least one of a heat-curing PSA, heat-curing adhesive, and UV-curing PSA type material.

In the lighting device of the present invention, a plurality of unit spaced members are arranged to be spaced apart from each other in the spaced member, and a second air portion may be formed in a space where the unit spaced members are spaced apart from each other.

In the lighting device of the present invention, the first reflective sheet may include a first substrate laminated on a base substrate and a metal layer laminated on the first substrate.

In the lighting device of the present invention, the first reflective sheet may be made of white polyethylene terephthalate (PET) or Ag film.

In the lighting device of the present invention, the reflective unit may further include a reflective pattern formed on the surface of the second reflective sheet.

In the lighting device of the present invention, the reflection pattern may include any one of TiO ₂ , CaCO ₃ , BaSO ₄ , Al ₂ O ₃ , Silicon, and PS (Polystyrene).

In the lighting device of the present invention, the indirect light emitting part includes a light reflection member formed on at least one of one side and the other side of the light source module; an indirect light emitting air gap formed between the light source module and the light reflecting member; may include.

In the lighting device of the present invention, the light reflection member may be formed on the inner surface of the side wall of the diffusion plate.

In the lighting device of the present invention, the thickness of the indirect light emitting air gap may be formed in a range of more than 0 and less than or equal to 20 mm.

In the lighting device of the present invention, the light reflection member may be formed including white pigment or metal.

In the lighting device of the present invention, the resin layer is made of urethane acrylate, epoxy acrylate, polyester acrylate, polyether acrylate, and polybutadiene acrylate. It may be made of an ultraviolet curing resin containing at least one of polybutadiene acrylate and silicon acrylate.

In the lighting device of the present invention, the resin layer may be made of a thermosetting resin containing at least one of polyester polyol resin, acryl polyol resin, and hydrocarbon-based or ester-based solvent. .

In the lighting device of the present invention, the resin layer is silicon, silica, glass bubble, PMMA, urethane, Zn, Zr, Al ₂ O ₃ , and acryl. It may further include a diffusion material for diffusing light consisting of at least one selected from among.

In the lighting device of the present invention, the refractive index of the resin layer may be in the range of 1.4 to 1.8.

In the lighting device of the present invention, the thickness of the diffusion plate may be in the range of 0.5 to 5 mm.

In the lighting device of the present invention, the light source module may further include a first optical sheet formed on the resin layer and dispersing light emitted from the resin layer.

In the lighting device of the present invention, the light source module may further include an optical pattern formed on the first optical sheet and blocking or reflecting light emitted from the resin layer.

In the lighting device of the present invention, the light source module may further include a second optical sheet disposed on the first optical sheet.

In the lighting device of the present invention, the light source module may further include an adhesive layer formed between the first optical sheet and the second optical sheet, and an air gap may be further formed in the adhesive layer.

In the lighting device of the present invention, the light source may be made of a side view type light emitting device package.

In the lighting device of the present invention, the light source includes: a package body having a cavity; a first lead frame including one end exposed to the cavity and the other end passing through the package body and exposed to one surface of the package body; a second lead frame including one end exposed to one side of the one side of the package body, the other end exposed to the other side of the one side of the package body, and a middle portion exposed to the cavity; It may be comprised of a light source package including a first semiconductor layer, an active layer, a second semiconductor layer, and at least one light-emitting chip disposed on the first lead frame.

In the lighting device of the present invention, the middle portion of the second lead frame may electrically connect the one end and the other end of the second lead frame to each other.

In the lighting device of the present invention, the first lead frame includes a first upper surface exposed to the cavity; It may include a first side portion that is bent from a first side portion of the first upper surface portion and is exposed to the one surface of the package body.

In the lighting device of the present invention, one or more first through holes may be formed in at least one of the first upper surface portion or the first side portion.

In the lighting device of the present invention, the first lead frame may include at least one first through hole formed adjacent to a boundary portion of the first upper surface portion and the first side portion.

In the lighting device of the present invention, a portion of the package body may be filled in the at least one first through hole.

In the lighting device of the present invention, the first lead frame includes connecting portions connecting the first upper surface portion and the first side portion to each other, the first through hole is located between the connecting portions, and the connecting portion The length of at least one of them may be different from the others.

In the lighting device of the present invention, the at least one light emitting chip may be disposed on the first upper surface portion.

In the lighting device of the present invention, the length of the first connection part aligned with the light emitting chip among the connection parts in the first direction is greater than the length of the second connection part misaligned with the light emitting chip in the first direction, The first direction may be the x-axis direction in the xyz coordinate system.

In the lighting device of the present invention, a second through hole having a smaller diameter than the first through hole may be formed in at least one of the connecting portions.

In the lighting device of the present invention, the second lead frame includes: a second upper surface portion disposed around at least one side of the first upper surface portion and exposed to the cavity of the package body; and a second side portion bent from the second upper surface portion and exposed to each of the one side and the other side of the one surface of the package body.

In the lighting device of the present invention, at least one groove is provided on the second side of the first upper surface, and the first side and the second side of the first upper surface may be sides facing each other.

In the lighting device of the present invention, at least one protrusion corresponding to the groove may be formed on the second upper surface portion.

In the lighting device of the present invention, the second upper surface portion may include first to third portions disposed corresponding to the remaining sides of the first upper surface portion excluding the first side.

In the lighting device of the present invention, the second side portion includes a first portion bent at the first portion of the second upper surface portion; and a second portion bent at the third portion of the second upper surface, wherein the first portion and the second portion may be symmetrical with respect to the first side portion.

In the lighting device of the present invention, the first side portion is divided into an upper portion including the connecting portions, and a lower portion located below the upper portion, and the lower portion may protrude laterally from the upper portion.

In the lighting device of the present invention, the ratio of the lengths of the second connection part and the first connection part in the first direction may be 1:1.2 to 1.8.

In the lighting device of the present invention, the ratio of the length of the first through hole in the first direction to the length of the upper end of the first side portion is 1: 3.8 to 6.3, and the first direction is in the xyz coordinate system. It may be in the x-axis direction.

In the lighting device of the present invention, the length of the first through hole in the second direction may be 0.19 mm to 0.29 mm.

In the lighting device of the present invention, the light emitting chip includes: a first electrode layer disposed on the first semiconductor layer; a reflective layer disposed below the second semiconductor layer; And it may further include a second electrode layer disposed below the reflective layer.

In the lighting device of the present invention, the light emitting chip may be a device that emits red light with a wavelength range of 600 nm to 690 nm.

In the lighting device of the present invention, the light source module is disposed on the flexible printed circuit board and may further include at least one connector for electrical connection to the outside.

In the lighting device of the present invention, the flexible printed circuit board may further include a fastening fixture for fastening to the outside.

According to the present invention, by providing an indirect light emitting unit including a light reflection member, it has the advantage of being able to implement various lighting effects using the flare phenomenon and the effect of being able to implement lighting of various designs.

In addition, according to the present invention, a lighting effect is realized using light emitted from the side of the resin layer, so it has the advantage of being able to realize a double lighting effect without adding a separate light source.

According to the present invention, a reflection unit having an air area is provided on the surface of the printed circuit board to maximize the brightness improvement along with the light reflectance improvement, and to increase the brightness without increasing the thickness of the lighting device or the number of light sources. The pattern design of the spacer that forms the area also has the effect of maximizing light control and reflection effects.

In addition, according to the present invention, by removing the light guide plate and guiding light using a resin layer, the number of light emitting device packages can be reduced and the overall thickness of the lighting device can be reduced.

According to the present invention, the resin layer can be formed of a highly heat-resistant resin, which has the effect of realizing stable luminance despite the heat generated from the light-emitting device package and providing a highly reliable lighting device.

In addition, according to the present invention, flexibility can be secured by forming a lighting device using a flexible printed circuit board and a resin layer, which has the effect of increasing the degree of freedom in product design.

And according to the present invention, by having the diffuser plate itself surround the side of the light source module, the diffuser plate itself can perform the housing function at the same time, which has the effect of improving manufacturing process efficiency by not using a separate structure and improving the quality of the product itself. It has the effect of improving durability and reliability. Additionally, according to the present invention, heat dissipation efficiency can be improved, and wavelength shift and luminous intensity reduction can be suppressed.

Figure 1 shows a lighting device according to an embodiment of the present invention.
FIG. 2 shows a first embodiment of the light source module shown in FIG. 1.
FIGS. 3 and 4 show an example of a spacing member constituting the reflection unit described above in FIG. 2.
Figures 5 to 19 show second to sixteenth embodiments of the light source module shown in Figure 1.
FIG. 20 shows an example of the reflection pattern shown in FIG. 1.
FIG. 21 shows a plan view of the 17th embodiment of the light source module shown in FIG. 1.
FIG. 22 shows a cross-sectional view taken in the direction AA' of the light source module shown in FIG. 21.
FIG. 23 shows a cross-sectional view in the BB' direction of the light source module shown in FIG. 21.
FIG. 24 shows a cross-sectional view in the CC' direction of the light source module shown in FIG. 21.
Figure 25 shows a head lamp for a vehicle according to an embodiment of the present invention.
Figure 26 shows a perspective view of a light emitting device package according to an embodiment of the present invention.
Figure 27 shows a top view of a light emitting device package according to an embodiment of the present invention.
Figure 28 shows a front view of a light emitting device package according to an embodiment of the present invention.
Figure 29 shows a side view of a light emitting device package according to an embodiment of the present invention.
FIG. 30 shows a perspective view of the first lead frame and the second lead frame shown in FIG. 26.
FIG. 31 is a diagram for explaining the dimensions of each part of the first lead frame and the second lead frame shown in FIG. 30.
FIG. 32 shows an enlarged view of the connecting portions shown in FIG. 31.
33 to 38 show modified examples of the first lead frame and the second lead frame.
Figure 39 shows a perspective view of a light emitting device package according to another embodiment of the present invention.
FIG. 40 shows a top view of the light emitting device package shown in FIG. 39.
FIG. 41 shows a front view of the light emitting device package shown in FIG. 39.
FIG. 42 shows a cross-sectional view in the cd direction of the light emitting device package shown in FIG. 39.
FIG. 43 shows the first lead frame and the second lead frame shown in FIG. 39.
Figure 44 shows the measured temperature of a light emitting device package according to an embodiment of the present invention.
Figure 45 shows an example of the light emitting chip shown in Figure 26.
Figure 46 shows a lighting device according to another embodiment.
Figure 47 shows a typical head lamp for a vehicle that is a point light source.
Figure 48 shows a rear light for a vehicle according to an embodiment of the present invention.
Figure 49 shows a typical vehicle taillight.
Figures 50a and 50b show the light emitting device package spacing of the light source module used in a vehicle taillight according to an embodiment of the present invention.

Hereinafter, with reference to the attached drawings, preferred embodiments that allow those skilled in the art to easily practice the present invention will be described in detail. However, it should be understood that the embodiments described in this specification and the configurations shown in the drawings are only preferred embodiments of the present invention, and that there may be various equivalents and modifications that can replace them at the time of filing the present application. Additionally, when explaining in detail the operating principle of a preferred embodiment of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. The terms described below are terms defined in consideration of their functions in the present invention, and the meaning of each term should be interpreted based on the content throughout the present specification. The same reference numerals are used for parts with similar functions and actions throughout the drawings.

The present invention relates to a lighting device. By removing the light guide plate and replacing it with a resin layer, and forming an indirect light emitting part on the side of the resin layer, various lighting effects are realized using the light leakage effect, and the overall thickness of the lighting device is reduced. The goal is to provide a lighting device structure that can innovatively reduce the number of light sources while ensuring flexibility and reducing the number of light sources.

In addition, the lighting device according to the present invention can be applied to various lamp devices that require lighting, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, when applied to vehicle lamps, it can also be applied to headlights, vehicle interior lighting, door scarves, and rear lights. Additionally, the lighting device of the present invention can be applied to the field of backlight units applied to liquid crystal display devices, and in addition, it can be applied to all lighting-related fields that have been developed and commercialized or can be implemented in the future according to technological development.

Hereinafter, the light source module refers to the components excluding the diffusion plate and the indirect light emitting unit.

Figure 1 shows a lighting device 1 according to an embodiment of the present invention. Referring to FIG. 1, the lighting device 1 includes a light source module 100, which is a surface light source, and may further include a housing 150 that accommodates the light source module 100.

The light source module 100 includes at least one light source 20 that generates light, and the light source 20 may be made of a light-emitting device package including a light-emitting chip. This light source module 100 can implement a surface light source by diffusing and dispersing light generated from the light source 20, which is a point light source, and is flexible and can be bent.

The housing 150 protects the light source module 100 from impact and may be made of a material (eg, acrylic) that allows light emitted from the light source module 100 to pass through. Additionally, the housing 150 may include a curved portion in terms of design, and because the light source module 100 is flexible, it can be easily stored in the curved housing 150. Of course, since the housing 150 itself has a certain flexibility, it is also possible for the entire assembly structure of the lighting device 1 to have a certain flexibility.

FIG. 2 shows a first embodiment (100-1) of the light source module shown in FIG. 1, and more specifically, shows a cross-sectional view in the AB direction of the lighting device shown in FIG. 1. Referring to FIG. 2, the light source module 100-1 includes a flexible printed circuit board (10), a light source (20), and a resin layer (40) that functions as a light guide plate. It includes a reflection unit 30 formed between the printed circuit board 10 and the resin layer 40 and penetrated by the light source 20. Additionally, an indirect light emitting portion (P) is formed on at least one of one side and the other side of the resin layer 40, and a diffusion plate 70 is formed on the above-described light source module 100-1.

The printed circuit board 10 may be a printed circuit board using a flexible insulating board, that is, a flexible printed circuit board (Flexible Printed Circuit Board, 10).

For example, the flexible printed circuit board 10 may include a base member (e.g., 5) and a circuit pattern (e.g., 6, 7) disposed on at least one surface of the base member (e.g., 5), and a base member (e.g., 5). , 5), the material may be a film with flexibility and insulating properties, for example, polyimide or epoxy (for example, FR-4).

More specifically, the flexible printed circuit board 10 includes an insulating film 5 (e.g., polyimide or FR-4), a first copper foil pattern 6, a second copper foil pattern 7, and a via contact (8). ) may include. The first copper foil pattern 6 is formed on one side (e.g., the upper surface) of the insulating film 5, and the second copper foil pattern 7 is formed on the other side (e.g., the lower side) of the insulating film 5, and has an insulating properties. The first copper foil pattern 6 and the second copper foil pattern 7 may be connected through the via contact 8 formed through the film 5.

Hereinafter, the case where the printed circuit board 10 is made of a flexible printed circuit board as described above will be described as an example, and the terms printed circuit board and flexible printed circuit board are used interchangeably, but this is only an example, and various types of printed circuit boards are used interchangeably. It will be said that the substrate can be used as the printed circuit board 10 of the present invention.

The light source 20 is arranged in one or more numbers on the flexible printed circuit board 10 and emits light. For example, the light source 20 may be a side view type light emitting device package arranged so that the emitted light travels in the direction 3 toward the side of the resin layer 40. At this time, the light emitting chip mounted on the light emitting device package may be a vertical light emitting chip, for example, the red light emitting chip shown in FIG. 45, but the embodiment is not limited thereto.

The resin layer 40 is disposed on the flexible printed circuit board 10 and the light source 20 to bury the light source 20, and emits from the light source 20 in the side direction 3 of the resin layer 40. Light may be diffused and guided in a direction toward one surface (eg, top surface) of the resin layer 40.

The resin layer 40 may be made of a material that can diffuse light, and its refractive index may be in the range of 1.4 to 1.8, but is not limited thereto.

For example, the resin layer 40 may be made of a highly heat-resistant ultraviolet curable resin containing oligomers. At this time, the content of the oligomer may be 40 to 50 parts by weight. In addition, the ultraviolet curing resin may be urethane acrylate, but is not limited thereto, and may include epoxy acrylate, polyester acrylate, polyether acrylate, At least one material selected from polybutadiene acrylate and silicon acrylate may be used.

In particular, when using urethane acrylate as an oligomer, different physical properties can be achieved simultaneously by mixing two types of urethane acrylate.

For example, isocyanate is used in the process of synthesizing urethane acrylate, and the physical properties (yellowing, weather resistance, chemical resistance, etc.) of urethane acrylate are determined by isocyanate. At this time, one type of urethane acrylate is implemented as Urethane Acrylate type-Isocyanate, and the NCO% of PDI (isophorone diisocyanate) or IPDI (isophorone diisocyanate) is implemented to be 37% (hereinafter referred to as 'first oligomer'). ), another type of urethane acrylate is implemented as Urethane Acrylate type-Isocyanate, but the NCO% of PDI (isophorone diisocyanate) or IPDI (isophorone diisocyanate) is implemented to be 30 to 50% or 25 to 35%. Thus, an oligomer according to an embodiment (hereinafter referred to as 'second oligomer') can be formed. According to this, it is possible to obtain a first oligomer and a second oligomer with different physical properties depending on the NCO% control, and by mixing them, the oligomer forming the resin layer 40 can be implemented. At this time, the weight ratio of the first oligomer in the oligomer may be in the range of 15 to 20, and the weight ratio of the second oligomer may be in the range of 25 to 35.

Meanwhile, the resin layer 40 may additionally include at least one of a monomer and a photo initiator. At this time, the content of the monomer may be 65 to 90 parts by weight, and more specifically, 35 to 45 parts by weight of IBOA (isobornyl acrylate), 10 to 15 parts by weight of 2-HEMA (2-Hydroxyethyl Methacrylate), and 2-HBA (2-Hydroxybutyl Acrylate) may be composed of a mixture containing 15 to 20 parts by weight. In addition, photoinitiators (such as 1-hydroxycyclohexyl phenyl-ketone, Diphenyl), Diphwnyl (2,4,6-trimethylbenzoyl phosphine oxide, etc.) may be comprised of 0.5 to 1 part by weight.

Additionally, the resin layer 40 may be made of a thermosetting resin with high heat resistance. Specifically, the resin layer 40 may be made of a thermosetting resin containing at least one of polyester polyol resin, acryl polyol resin, hydrocarbon-based and/or ester-based solvent. These thermosetting resins may further contain a thermosetting agent to improve the strength of the coating film.

In the case of polyester polyol resin, the content of polyester polyol resin may be 9 to 30% of the total weight of the thermosetting resin. Additionally, in the case of acryl polyol resin, the content of acrylic polyol may be 20 to 40% of the total weight of the thermosetting resin.

In the case of hydrocarbon-based or ester-based solvents, the content may be 30 to 70% of the total weight of the thermosetting resin. In the case of a thermosetting agent, the content of the thermosetting resin may be 1 to 10% of the total weight. When the resin layer 40 is formed with the above-mentioned material, heat resistance is strengthened, and even when used in a lighting device that emits high-temperature heat, the decrease in luminance due to heat can be minimized, making it possible to provide a highly reliable lighting device. there is.

In addition, according to the present invention, by using the above-described materials to implement a surface light source, the thickness of the resin layer 40 can be innovatively reduced, making it possible to realize a thinner overall product. According to the present invention, a lighting device is formed using a flexible printed circuit board and a resin layer made of a flexible material, so it can be easily applied to curved surfaces, improving the freedom of design, and can also be used in other flexible displays. It has the advantage of being applicable and adaptable.

The resin layer 40 may include a diffusion material 41 with a hollow (or void) formed therein, and the diffusion material 41 may be mixed or diffused with the resin forming the resin layer 40, It can play a role in improving the reflection and diffusion characteristics of light.

For example, the light emitted from the light source 20 inward to the resin layer 40 is reflected and transmitted by the hollow of the diffusion material 41, so that the light is diffused and concentrated within the resin layer 40. Light may be emitted to one surface (eg, top surface) of the resin layer 40. At this time, the reflectance and diffusion rate of light are increased by the diffusion material 41, thereby improving the amount and uniformity of the emitted light supplied to the upper surface of the resin layer 40, and as a result, improving the luminance of the light source module 100-1. You can.

The content of the diffusion material 41 can be appropriately adjusted to obtain the desired light diffusion effect. Specifically, it can be adjusted in the range of 0.01 to 0.3% of the total weight of the resin layer 40, but is not limited to this. The diffusion material 41 may be composed of any one selected from silicon, silica, glass bubble, PMMA, urethane, Zn, Zr, Al2O3, and acryl, The particle diameter of the diffusion material 41 may be 1㎛ to 20㎛, but is not limited thereto.

A reflective unit 30 is formed between the flexible printed circuit board 10 and the resin layer 40, and a reflective pattern 31 may be further formed on the reflective unit 30. These reflection units 30 and reflection patterns 31 serve to improve the reflectance of light emitted from the light source 20, and more detailed information will be described later in the description of FIGS. 3 and 4.

An indirect light emitting portion (P) may be formed on at least one of one side and the other side of the resin layer 40. The indirect light emitting unit (P) is a part that implements an additional light emitting unit by using loss light emitted from the side of the resin layer 40 among the light components emitted from the light source 20. As shown in FIG. 2, the configuration of this indirect light-emitting portion (P) includes a light reflection member 90 formed on the side of the resin layer 40 and a light reflection member 90 formed between the side of the resin layer 40 and the light reflection member 90. It includes an indirect light emitting air gap (91).

When light emitted from the light source 20 is emitted through the side of the resin layer 40, the light reflection member 90 reflects the emitted light to form reflected light (or indirect light). Accordingly, the light lost from the lighting device is re-reflected by the light reflection member 90, causing a flare phenomenon or light spreading phenomenon in which the light spreads subtly, and this can be used to illuminate indoor and outdoor interiors and vehicles without adding a separate light source. It is possible to implement various lighting effects applicable to lighting.

This light reflection member 90 may be made of a material with excellent light reflection, such as a white resist, and may additionally be made of a synthetic resin containing a dispersed white pigment or a synthetic resin in which metal particles with excellent light reflection characteristics are dispersed. It may be possible. At this time, titanium oxide, aluminum oxide, zinc oxide, lead carbonate, barium sulfate, calcium carbonate, etc. can be used as the white pigment, and when metal powder is included, Ag powder with excellent reflectance may be included. It is also possible that a separate fluorescent whitening agent may be additionally included. In other words, the light reflection member 90 of the present invention can be formed using any material with excellent light reflectivity that has been developed currently or can be implemented according to future technological developments. Meanwhile, the light reflection member 90 is directly molded and bonded to the inside of the side wall 73 of the diffusion plate 70, is attached via a separate adhesive material (e.g., adhesive tape or thermosetting PSA), or is attached to the side wall ( 73) It can also be combined with the diffusion plate 70 by printing directly on the inside.

In addition, the drawing shows that the light reflection member 90 is formed over the entire inner surface of the side wall 73 of the diffusion plate 70, but this is only an example and there is no limit to the formation range of the light reflection member 90. They will say there is none.

Meanwhile, in order to maximize the above-described flare phenomenon, an indirect light-emitting air gap 91 may be formed between the light reflection member 90 and the resin layer 40, and thus the light emitted from the side of the resin layer 40 Due to the difference in refractive index, the indirect light is scattered in the air gap 91, and the scattered light is re-reflected by the light reflection member 90, thereby maximizing the flare phenomenon. The width of the indirect light emitting air gap 91 may be formed in a range of 0 to 20 mm or less, but is not limited thereto and may be appropriately designed depending on the specifications of the lighting device and the degree of indirect light to be implemented.

The diffusion plate 70 may be disposed on the upper part of the light source module 100-1, more specifically on the resin layer 40, and serves to uniformly diffuse the light emitted through the resin layer 40 over the entire surface. Do it. The thickness of the diffusion plate 70 can be basically in the range of 0.5 to 5 mm, but it is not limited to this and the design can be appropriately changed depending on the specifications of the lighting device. In particular, the diffusion plate 70 of the present invention has a structure including an upper surface 71 and a side wall 73 formed integrally with the upper surface 71, as shown in Figure 2. In this case, the side wall 73 is It surrounds the outer surface of the indirect light emitting part (P). This diffusion plate 70 may generally be formed of acrylic resin, but is not limited thereto, and may include polystyrene (PS), polymethyl methacrylate (PMMA), cyclic olefin copoly (COC), and polyethylene terephthalate (PET). ), it may be made of a material that can perform a light diffusion function, such as a high-transparency plastic such as resin.

A first air gap 80 may exist between the upper surface 71 of the diffusion plate 70 and the resin layer 40. Due to the presence of the first air gap 80, it is possible to generate a difference in refractive index with the resin layer 40, thereby increasing the uniformity of light supplied to the diffusion plate 70, and as a result, the diffusion plate ( 70), the uniformity of light diffused and emitted can be improved. At this time, in order to minimize the deviation of the light transmitted through the resin layer 40, the thickness of the first air gap 80 may be within a range of 0 to 30 mm, but is not limited thereto and the design can be changed as needed.

The side wall 73 of the diffusion plate 70 surrounds the outer surface of the indirect light emitting portion P, especially the outer surface of the light reflecting member 90, and this side wall 73 is formed by the light reflecting member 90 as described above. ) and serves as a housing to protect the light source module (100-1). That is, the diffusion plate 70 according to the present invention can perform the role of the housing 150 shown in FIG. 1 when necessary. According to this, the diffusion plate 70 itself surrounds not only the top but also the side portion of the light source module 100-1, so that the diffusion plate 70 itself can simultaneously perform the housing function, without using a separate structure. This has the effect of improving manufacturing process efficiency and improving the durability and reliability of the product itself.

FIG. 3 shows an example of the configuration of the reflecting unit 30 and the spacing member constituting the reflecting unit 30 among the lighting devices of the present invention described above in the description of FIG. 2.

Referring to Figures 2 and 3 (a), the reflective unit 30 formed on the flexible printed circuit board (10 in Figure 2) has an air area 36 therein, and the air area ( 26) serves to maximize luminance by increasing the reflection efficiency of light emitted from the light source (20 in FIG. 2).

In particular, the reflection unit 30 has a first reflection sheet 33 in close contact with the surface of the flexible printed circuit board (10 in FIG. 2) and an air area 36 that is spaced apart from the first reflection sheet 33. It may be configured to include a second reflective sheet 35 made of a transparent material. The first and second reflective sheets 33 and 35 are laminated on a flexible printed circuit board (10 in FIG. 2), and the light source (20 in FIG. 2) passes through the hole formed on the reflective unit 30 to the outside. It becomes protruding.

The air area 36 can be formed by pressing the first and second reflective sheets 33 and 35 together without using a separate adhesive or other member, and as shown in the drawing, It is also possible to implement an air area 36 containing air between the first reflective sheet 33 and the second reflective sheet 35 through a spacer 37 such as a separate adhesive member.

The first reflective sheet 33 may be formed using a reflective material that reflects light, such as a film in which a metal layer such as Ag is formed on a base substrate. Alternatively, it is also possible to implement the first reflective sheet 33 with a synthetic resin containing a dispersed white pigment, such as white polyethylene terephthalate (PET), in order to implement characteristics that promote light reflection and dispersion. At this time, titanium oxide, aluminum oxide, zinc oxide, lead carbonate, barium sulfate, calcium carbonate, etc. can be used as white pigments, and as synthetic resins, polyethylene terephthalate, polyethylene naphthalate, acrylic resin, collicarbonate, polystyrene, and polyolefin. , cellulose acetate, weather-resistant vinyl chloride, etc. may be used, but are not limited thereto.

The second reflective sheet 35 may be made of a transparent film, such as PET, so that the light emitted from the light source (20 in FIG. 2) is transmitted to the surface of the first reflective sheet 33 and reflected again.

Meanwhile, a reflective pattern 31 may be further formed on the second reflective sheet 33 to further promote dispersion of light and improve luminance. The reflection pattern 31 is a component that plays a role in scattering and dispersing incident light, and is formed by applying reflective ink containing any one of TiO2, CaCo3, BaSo4, Al2O3, Silicon, and PS (Polystyrene) to the second reflection sheet 35. The above-described reflective pattern 31 can be formed by printing on the surface, but is not limited thereto.

The structure of the reflective pattern 31 may be a plurality of protruding patterns and may be regular or irregular. The reflection pattern 31 may have a prism shape, a lenticular shape, a lens shape, or a combination thereof to increase the light scattering effect, but is not limited thereto. In addition, in Figures 2 and 3 (a), the cross-sectional shape of the reflective pattern 31 is shown to be square, but this is only an example. In addition, the cross-sectional shape of the reflective pattern 31 is triangular, pentagonal, etc. It may be made of a structure having various shapes, such as a polygon, a semicircle, or a sine wave shape, and the shape of the reflection pattern 31 when viewed from above may be a polygon (eg, hexagon), circle, oval, or semicircle.

FIG. 20 shows an example of the reflection pattern 31 shown in (a) of FIGS. 2 and 3. Referring to FIG. 20, the reflective patterns 31 may have different diameters depending on the distance from the light source 20. For example, the reflective pattern 31 may have a larger diameter the closer it is to the light source 20. Specifically, the first reflective pattern 71, the second reflective pattern 72, the third reflective pattern 73, and the fourth reflective pattern 74 may have larger diameters in that order. However, the embodiment is not limited to this, and the reflective pattern 31 of the present invention can be formed in various configurations, such as a configuration that changes density depending on the distance from the light source and a configuration that changes both size and density. .

Figure 3(b) shows an embodiment of the spacing member constituting the reflection unit 30 described above in Figure 3(a). The spacing member 37 according to the present invention performs only a general spacing function, such as a spacer member that simply separates the first reflective sheet 33 and the second reflective sheet 35 or a spacer member with adhesive properties, thereby maintaining the air area 36. It is possible to implement, but more preferably, in order to streamline the arrangement of the air area and improve adhesion efficiency, the patterning structure shown in (b) of FIG. 3 is uniformly and randomly formed when implementing the spacing member. can do.

The spacing member 37 shown in (b) of FIG. 3 has a plurality of unit spacing members 37a arranged with a cavity inside, and the inside of the unit spacing member 37a is empty. 1 It can be implemented as a two-dimensional or three-dimensional structure in which the air part (37b) is implemented. At this time, the cross section of the unit spacing member 37a may be implemented in various shapes such as polygon, circle, and ellipse. In particular, as shown, in addition to the structure in which a plurality of each unit spacing member (37a) is arranged in close contact with each other, they are arranged in an irregular structure to form a first air portion (37b) inside the unit spacing member (37a). In addition, it is also possible to further form a second air portion (37c) consisting of an empty space between each unit spacer member (37a). According to this, the lighting device of the present invention including the above-described reflection unit 30 is provided with the reflection unit 30 having an air area to maximize the luminance improvement along with the improvement of light reflectance, and the thickness of the lighting device and the number of light sources are improved. It has the effect of increasing brightness without increasing it and has the effect of maximizing light control and reflection effects due to the pattern design of the spacer that forms the air area.

Figure 4 shows a specific implementation example of the reflection unit described above in Figure 3.

As described above, the reflection unit 30 according to the present invention includes a first reflection sheet 33 in close contact with the surface of the flexible printed circuit board, and a second reflection sheet spaced apart from the first reflection sheet 33 ( 35).

In particular, the second reflective sheet 35 can be made of a transparent film such as PET, and is provided with a spacer 37 that separates the first and second reflective sheets 33 and 35 by patterning an adhesive material. This forms an air area.

In particular, in order to maximize reflection efficiency, the first reflection sheet 33 is provided with a film 331 to which a metal reflection layer 38 is bonded using an adhesive (primer), and the film 331 is also formed on the release film 335. It can be implemented as a structure that is laminated using an adhesive material (PSA; 333). However, this is only an example, and as described above in the description of FIG. 3, the first reflective sheet 33 of the present invention can also be implemented with white PET, etc.

FIG. 5 shows a second embodiment 100-2 of the light source module shown in FIG. 1. The same reference numerals as in FIG. 2 indicate the same configuration, and content that overlaps with the content described above will be omitted or briefly described.

Referring to FIG. 5 , in order to improve heat dissipation efficiency, the second embodiment may have a structure that further includes a heat dissipation member 110 in addition to the first embodiment 100-1.

The heat dissipation member 110 is disposed on the lower surface of the flexible printed circuit board 10 and serves to radiate heat generated from the light source 20 to the outside. That is, the heat dissipation member 110 can improve the efficiency of discharging heat generated from the light source 20, which is a heat source, to the outside.

For example, the heat dissipation member 110 may be disposed on a portion of the lower surface of the flexible printed circuit board 10. The heat dissipation member 110 may include a plurality of spaced apart heat dissipation layers (eg, 110-1 and 110-2). At least a portion of the heat dissipation layers 110 - 1 and 110 - 2 may overlap the light source 20 in the vertical direction to improve the heat dissipation effect. Here, the vertical direction may be a direction from the flexible printed circuit board 10 to the resin layer 40.

The heat dissipation member 110 may be made of a material with high thermal conductivity, such as aluminum, aluminum alloy, copper, or copper alloy. Alternatively, the heat dissipation member 110 may be a Metal Core Printed Circuit Board (MCPCB). The heat dissipation member 110 may be attached to the lower surface of the flexible printed circuit board 10 using an acrylic adhesive (not shown).

In general, when the temperature of a light-emitting device increases due to heat generated from the light-emitting device, the luminous intensity of the light-emitting device decreases and a wavelength shift of the generated light may occur. In particular, when the light emitting device is a red light emitting diode, the degree of wavelength shift and luminous intensity reduction is severe.

However, the light source module 100-2 is provided with a heat dissipation member 110 on the lower surface of the flexible printed circuit board 10 to efficiently dissipate heat generated from the light source 20 to the outside, thereby suppressing the temperature rise of the light source. , This can prevent the luminous intensity of the light source module 100-2 from decreasing or the wavelength shift of the light source module 100-2 from occurring.

FIG. 6 shows a third embodiment 100-3 of the light source module shown in FIG. 1. The same reference numerals as in FIG. 5 indicate the same configuration, and content that overlaps with the content described above will be omitted or briefly described.

Referring to FIG. 6, the light source module 100-3 may have a structure in which a first optical sheet 52 is added to the second embodiment.

The first optical sheet 52 is disposed on the resin layer 40 and transmits light emitted from one surface (eg, top surface) of the resin layer 40. The first optical sheet 52 can be formed using a material with excellent light transmittance, for example, PET (Polyethylene Telephthalate).

Meanwhile, when the first optical sheet 52 is formed, the first air gap 80 described above in the description of FIG. 2 is formed between the upper surface 71 of the diffusion plate 70 and the first optical sheet 52. ) can be formed between. Due to the presence of the first air gap 80, the uniformity of light supplied to the diffusion plate 70 can be increased, and as a result, the uniformity of light diffused and emitted through the diffusion plate 70 can be improved. Existence is as described above in the description of FIG. 2.

In addition, the drawing shows that the light reflection member 90 is formed over the entire inner surface of the side wall 73 of the diffusion plate 70, but this is only an example and there is no limit to the formation range of the light reflection member 90. None is as described above in the description of FIG. 2.

FIG. 7 shows a fourth embodiment 100-4 of the light source module shown in FIG. 1.

Referring to FIG. 7, the light source module 100-4 may have a structure in which an adhesive layer 56, a light-shielding pattern 60, and a second optical sheet 54 are added to the third embodiment 100-3. .

The second optical sheet 54 is disposed on the first optical sheet 52 . The second optical sheet 54 can be formed using a material with excellent light transmittance, and for example, PET can be used.

And the adhesive layer 56 is disposed between the first optical sheet 52 and the second optical sheet 54 to attach the first optical sheet 52 and the second optical sheet 54.

The optical pattern 60 may be disposed on at least one of the upper surface of the first optical sheet 52 or the lower surface of the second optical sheet 54. The optical pattern 60 may be attached to at least one of the upper surface of the first optical sheet 52 or the lower surface of the second optical sheet 54 by an adhesive layer 56. Another embodiment may further include one or more optical sheets (not shown) on the second optical sheet 56. At this time, the structure including the first optical sheet 52, the second optical sheet 54, the adhesive layer 56, and the optical pattern 60 can be defined as the optical pattern layer 50.

The optical pattern 60 may be a light blocking pattern to prevent concentration of light emitted from the light source 20. The optical pattern 60 is aligned with the light source 20 and may be formed in such a way that it is adhered to the first optical sheet 52 and the second optical sheet 54 by an adhesive layer 56, or It may be formed by directly printing on the surface of at least one of the first optical sheet 52 and the second optical sheet 54.

The first optical sheet 52 and the second optical sheet 54 can be formed using a material with excellent light transmittance, and for example, PET can be used.

The optical pattern 60 basically functions to prevent the light emitted from the light source 20 from being concentrated. That is, the optical pattern 60 along with the above-described reflection pattern 31 serves to implement uniform surface light emission.

The optical pattern 60 may be a blocking pattern that blocks a portion of the light emitted from the light source 20, and can prevent optical characteristics from deteriorating or yellowish light from being generated due to excessive light intensity. For example, the optical pattern 60 may serve to prevent light from being concentrated in an area adjacent to the light source 20 and to disperse the light.

The optical pattern 60 may be formed by performing a printing process on the upper surface of the first optical sheet 52 or the lower surface of the second optical sheet 54 using light-shielding ink. The optical pattern 60 can control the degree of light blocking or diffusion by adjusting the density and/or size of the optical pattern so that it can perform the function of partially blocking and diffusing light, rather than completely blocking light. For example, in order to improve light efficiency, the optical pattern 60 may be adjusted so that the density of the optical pattern decreases as the distance from the light source 20 increases, but the present invention is not limited to this.

Specifically, the optical pattern 60 can be implemented as an overlapping printing structure of a complex pattern. The structure of overlapping printing refers to a structure that is implemented by forming one pattern and printing another pattern shape on top of it.

For example, the optical pattern 60 includes a diffusion pattern and a light-shielding pattern, and may have a structure in which the diffusion pattern and the light-shielding pattern overlap. For example, a polymer film ₍ e.g. _, a second optical sheet ₍ e.g. _, a _second optical sheet ( A diffusion pattern may be formed on the lower surface of 54)). Additionally, a light-shielding pattern can be formed on the surface of the polymer film using a light-shielding ink containing Al or a mixture of Al and TiO ₂ .

In other words, it is possible to form a diffusion pattern by printing white on the surface of the polymer film and then form a light-shielding pattern on it, or to form a double structure in the opposite order. Of course, it is obvious that the design of this pattern can be modified in various ways by considering the efficiency, intensity, and light blocking rate of light.

Alternatively, in another embodiment, the optical pattern 60 may have a triple structure including a first diffusion pattern, a second diffusion pattern, and a light-shielding pattern disposed between them. In this triple structure, it is possible to implement it by selecting the above-mentioned materials. As an example, the first diffusion pattern may include TiO ₂ with excellent refractive index, the second diffusion pattern may include CaCO ₃ and TiO ₂ with excellent photostability and color, and the light-shielding pattern may include Al with excellent hiding properties. can do. Through this triple-structured optical pattern, the embodiment can secure light efficiency and uniformity. In particular, CaCO ₃ has the function of reducing exposure to yellow light to ultimately produce white light, thereby realizing light with more stable efficiency. In addition to CaCO ₃ , diffusion materials used in diffusion patterns include BaSO ₄ and Al ₂ Inorganic materials with large particle sizes and similar structures, such as O ₃ and Silicon, can be used.

The adhesive layer 56 may surround the peripheral portion of the optical pattern 60 and fix the optical pattern 60 to at least one of the first optical sheet 52 and the second optical sheet 54. At this time, the adhesive layer 56 may use a heat-curing PSA, heat-curing adhesive, or UV-curing PSA type material, but is not limited thereto.

Meanwhile, when the second optical sheet 54 is formed on the first optical sheet 52, the first air gap 80 described above in the description of FIG. 2 is formed on the upper surface of the diffusion plate 70 ( 71) and the first optical sheet 52. At this time, the description of the thickness and function of the first air gap 80 is omitted as it is the same as described above in the description of FIG. 2.

In addition, as described above in the description of FIG. 2, there is no limit to the formation range of the light reflection member 90 as long as it includes the side surface of the resin layer 40.

FIG. 8 shows a fifth embodiment 100-5 of the light source module shown in FIG. 1.

Referring to FIG. 8, the light source module 100-5 may have a structure in which a second air gap 81 is added to the fourth embodiment 100-4. That is, the fifth embodiment 100-5 may include a second air gap 81 between the first optical sheet 52 and the second optical sheet 54.

For example, a second air gap 81 may be formed in the adhesive layer 56. The adhesive layer 56 forms a space (second air gap 81) spaced around the optical pattern 60, and an adhesive material is applied to the other portion to form the first optical sheet 52 and the second optical sheet ( 54) can be implemented in a structure that bonds them together.

The adhesive layer 56 may have a structure in which a second air gap 81 is located around the optical pattern 60. Alternatively, the adhesive layer 56 may surround the peripheral portion of the optical pattern 60, and the second air gap 81 may be located outside the peripheral portion. The adhesive structure of the first optical sheet 52 and the second optical sheet 54 can also implement the function of fixing the printed optical pattern 60. The structure including the first optical sheet 52, the second optical sheet 54, the second air gap 81, the adhesive layer 56, and the optical pattern 60 can be defined as the optical pattern layer 50. there is.

Since the second air gap 81 and the adhesive layer 56 have different refractive indexes, the second air gap 81 diffuses the light traveling from the first optical sheet 52 to the second optical sheet 56 and Dispersion can be improved. And because of this, the embodiment can implement a uniform surface light source.

FIG. 9 shows a sixth embodiment 100-6 of the light source module shown in FIG. 1. Referring to FIG. 9, the light source module 100-6 may have a structure in which via holes 212 and 214 for improving heat dissipation are provided on the flexible printed circuit board 10 of the first embodiment.

The via holes 212 and 214 may penetrate the flexible printed circuit board 110 and expose a portion of the light source 20 or a portion of the resin layer 40. For example, the via holes 212 and 214 may include a first via hole 212 exposing a portion of the light source 20 and a second via hole 214 exposing a portion of the lower surface of the resin layer 40 .

Heat generated from the light source 20, which is a heat source, may be directly emitted to the outside through the first via hole 212, and heat conducted from the light source 20 to the resin layer 40 may be emitted through the second via hole 214. It can be released directly to the outside. The sixth embodiment can improve heat dissipation efficiency because heat generated from the light source 20 is discharged to the outside through the via holes 212 and 214. The first via hole 212 and the second via hole 214 may have various shapes, such as polygonal, circular, or oval.

FIG. 10 shows a seventh embodiment 100-7 of the light source module shown in FIG. 1. Referring to FIG. 10, the light source module 100-7 may have a structure in which a first optical sheet 52 is added to the sixth embodiment. The seventh embodiment 100-7 can improve heat dissipation efficiency by using the first and second via holes 212 and 214. The description of the components 30, 31, and 52 added in this embodiment is the same as that described above with reference to FIG. 6 and is therefore omitted.

FIG. 11 shows an eighth embodiment 100-8 of the light source module shown in FIG. 1. Referring to FIG. 11, the light source module 100-8 has a structure in which a second optical sheet 52, an adhesive layer 56, a light blocking pattern 60, and a second optical sheet 54 are added to the seventh embodiment. You can have The components 52, 54, 56, and 60 added in this embodiment are the same as those described above in FIG. 7 and are therefore omitted.

FIG. 12 shows a ninth embodiment 100-9 of the light source module shown in FIG. 1. Referring to FIG. 12, the light source module 100-9 includes a second optical sheet 52, an adhesive layer 56, a light blocking pattern 60, a second optical sheet 54, and a second air in the seventh embodiment. It may have a structure with a gap 81 added. A second air gap 81 may exist between the first optical sheet 52 and the second optical sheet 54 of the tenth embodiment (100-10), and the second air gap 81 is shown in FIG. 8. It may be the same as described.

FIG. 13 shows a tenth embodiment (100-10) of the light source module shown in FIG. 1. The same reference numerals as in FIG. 1 indicate the same configuration, and content that overlaps with the content described above will be omitted or briefly described.

Referring to FIG. 13, unlike the heat dissipation member 110 of the second embodiment (100-2), the heat dissipation member 310 of the light source module 100-10 is disposed on the lower surface of the flexible printed circuit board 10. The lower heat dissipation layer 310-1 and a portion of the lower heat dissipation layer 310-1 may have a penetration portion 310-2 that penetrates the flexible printed circuit board 10 and contacts the light source 20.

For example, the penetrating portion 310-2 may contact the first side portion 714 of the first lead frames 620 and 620' of the light emitting device packages 200-1 and 200-2, which will be described later.

According to the tenth embodiment, heat generated from the light source 20 is directly transferred to the heat dissipation member 310 by the penetrating portion 310-2 and is emitted to the outside, thereby improving heat dissipation efficiency.

FIG. 14 shows an 11th embodiment 100-11 of the light source module shown in FIG. 1. Referring to FIG. 14, the light source module 100-11 may have a structure in which the first optical sheet 52 is added to the tenth embodiment, and the added components 30, 31, and 52 are those described in FIG. 6. It may be the same as the bar.

FIG. 15 shows a twelfth embodiment 100-12 of the light source module shown in FIG. 1. Referring to FIG. 13, the light source module 100-12 includes a second optical sheet 52, an adhesive layer 56, a light blocking pattern 60, and a second optical sheet 54 in the eleventh embodiment (100-11). ) may be an added structure. The added components 52, 54, 56, and 60 may be the same as those described in FIG. 7.

FIG. 16 shows a thirteenth embodiment 100-13 of the light source module shown in FIG. 1. Referring to FIG. 16, the light source module 100-13 may have a structure in which a second air gap 81 is added to the twelfth embodiment 100-12. That is, a second air gap 81 may exist between the first optical sheet 52 and the second optical sheet 54 of the thirteenth embodiment (100-13), and the second air gap 81 is shown in FIG. 8 It may be the same as described above.

FIG. 17 shows a 14th embodiment of the light source module shown in FIG. 1, FIG. 18 shows a 15th embodiment of the light source module shown in FIG. 1, and FIG. 19 shows a 16th embodiment of the light source module shown in FIG. 1. Shows an example.

The reflection unit 30-1, the second optical sheet 54-1, and the diffusion plate 70-1 shown in FIGS. 17 to 19 are the reflection units shown in FIGS. 8, 12, and 16 ( 30), the second optical sheet 54, and the diffusion plate 70 may be modified examples.

Irregularities R1, R2, and R3 may be formed on one or both surfaces of at least one of the reflection unit 30-1, the second optical sheet 54-1, and the diffusion plate 70-1. The irregularities (R1, R2, R3) serve to cause light emitted to the outside to form a geometric pattern by reflecting and diffusing incident light.

For example, first irregularities (R1) may be formed on one surface (e.g., the upper surface) of the reflection unit 30-1, and second irregularities (R2) may be formed on one surface (e.g., the upper surface) of the second optical sheet 54-1. ) may be formed, and third irregularities (R3) may be formed on one surface (e.g., lower surface) of the diffusion plate 70. These irregularities (R1, R2, R3) have a plurality of regular or irregular patterns. It may be made of a prism shape, a lenticular shape, a concave lens shape, a convex lens shape, or a combination thereof to increase the reflection and diffusion effect of light, but is not limited thereto.

Additionally, the cross-sectional shape of the irregularities (R1, R2, and R3) may have various shapes such as triangle, square, semicircle, and sine wave. Additionally, the size or density of each pattern may change depending on the distance from the light source 20.

The irregularities (R1, R2, R3) can be formed by directly processing the reflection unit 30-1, the second optical sheet 54-1, and the diffusion plate 70, but there is no limitation and a certain pattern is formed. It can be formed in any way that is currently developed and commercialized, such as attaching a film, or that can be implemented according to future technological developments.

In the embodiment, a geometric light pattern can be easily implemented through a combination of patterns of the first to third irregularities (R1, R2, and R3). In another embodiment, irregularities may be formed on one or both sides of the second optical sheet 52.

However, the embodiment in which the unevenness (R1, R2, or R3) is formed is not limited to FIGS. 17 to 19, and the reflection unit 30, the first optical sheet 52, and the second optic are included in other embodiments. Irregularities may be formed on one or both surfaces of at least one of the sheet 54 and the diffusion plate 70 to increase the effect of reflecting and diffusing light.

FIG. 21 shows a plan view of the seventeenth embodiment (100-17) of the light source module shown in FIG. 1, and FIG. 22 shows a cross-sectional view in the direction AA' of the light source module (100-17) shown in FIG. 19. 23 shows a cross-sectional view of the light source module 100-17 shown in FIG. 19 in the BB' direction, and FIG. 24 shows a cross-sectional view of the light source module 100-17 shown in FIG. 19 in the CC' direction.

21 to 24, the light source module 100-17 includes a plurality of sub-light source modules (101-1 to 101-n, natural numbers where n>1), and a plurality of sub-light source modules (101-1 to 101-n, natural numbers where n>1). The sub light source modules 101-1 to 101-n can be separated from or combined with each other. Additionally, the plurality of combined sub light source modules 101-1 to 101-n may be electrically connected to each other. At this time, the diffusion plate 70 and the light reflection member 90 are formed by combining each sub light source module (101-1 to 101-n) with each other, and then the light reflection member 90 is formed on the side wall ( 73) This can be achieved by combining the diffusion plate 70 formed on the inside.

Each of the sub light source modules 101-1 to 101-n includes at least one connector (eg, 510, 520, 530) that can be connected to the outside. For example, the first sub light source module 101-1 may include a first connector 510 including at least one terminal (eg, S1 and S2). The second sub light source module 101-2 includes a first connector 520 and a second connector 530 for connection to the outside, respectively, and the first connector 520 has at least one terminal (e.g., P1, P2), and the second connector 530 may include at least one terminal (eg, Q1, Q2). At this time, the first terminal (S1, P1, Q1) may be a positive (+) terminal, and the second terminal (S2, P2, Q2) may be a negative (-) terminal. Although FIG. 23 illustrates that each connector (eg, 510, 520, and 530) includes two terminals, the number of terminals is not limited thereto.

22 to 24 show a structure in which a connector 510, 520, or 530 is added to the fifth embodiment 100-5, but the structure is not limited thereto, and the sub light source modules 101-1 to 101- n) each includes a connector (e.g., 510, 520, or 530) and a connection fixture (e.g., 410-1, 420-1) to the light source module (100-1 to 100-20) according to any one of the above-described embodiments. , 410-2) may be an added structure.

22 and 23, each of the sub light source modules 101-1 to 101-n includes a flexible printed circuit board 10, a light source 20, a reflection unit 30, a reflection pattern 31, and resin. Layer 40, first optical sheet 52, second optical sheet 54, adhesive layer 56, optical pattern 60, heat dissipation member 110, at least one connector 510, 520, or 530), and at least one connection fixing part 410 and 420. The same reference numerals as in FIG. 1 indicate the same configuration, and content that overlaps with the content described above will be omitted or briefly described. Compared with other embodiments, each of the sub light source modules 101-1 to 101-n of the 17th embodiment may have differences in size or number of light sources, but their configuration is different except for the connector and connection fixture. may be the same.

The first sub light source module 101-1 is electrically connected to the light source 20 and may include a first connector 510 provided on the flexible printed circuit board 10 for electrical connection to the outside. For example, the first connector 510 may be implemented in a patterned form on the flexible printed circuit board 10.

Additionally, the second sub light source module 101-2 may include a first connector 520 and a second connector 530 that are electrically connected to the light source 20. The first connector 520 is provided on one side of the flexible printed circuit board 10 to electrically connect to the outside (e.g., the first connector 510 of the first sub light source module 101-1). 2 The connector 530 may be provided on the other side of the flexible printed circuit board 10 to electrically connect to another external device (for example, a connector (not shown) of the third sub light source module 101-3).

The connection fixing part (eg, 410-1, 420-1, 410-2) combines with another external sub light source module and serves to fix the two combined sub light source modules to each other. The connection fixing portion (e.g., 410-1, 420-1, 410-2) is a protrusion in which a part of the side of the resin layer 40 protrudes, or a groove in which a part of the side of the resin layer 40 is depressed. It could be wealth.

Referring to FIG. 24, the first sub light source module 101-1 may include a first connection fixing part 410-1 having a structure in which a portion of a side surface of the resin layer 40 protrudes. In addition, the second sub light source module 101-2 has a first connection fixing part 420-1 having a structure in which a part of the side of the resin layer 40 is recessed and a structure in which another part of the side of the resin layer 40 is protruding. It may include a second connection fixture 410-2.

The first connection fixing part 410-1 of the first sub light source module 101-1 and the first connection fixing part 420-1 of the second sub light source module 101-2 are fixed by male and female coupling to each other. You can.

The embodiment shows that the connection fixture (e.g., 410-1, 420-1, 410-2) is implemented as part of the resin layer 40, but it is not limited to this, and a separate connection fixture may be provided. And the connection fixture can be transformed into other connectable forms.

The shape of the sub light source modules (101-1 to 101-n, natural numbers where n>1) may have a certain portion protruding, but is not limited to this and may be implemented in various forms. For example, the shape of the sub light source modules (101-1 to 101-n, natural numbers where n>1) viewed from above may be circular, oval, or polygonal, and a portion may be protruding in the side direction.

For example, one end of the first sub light source module 101-1 may include a protrusion 540 at the center, and a first connector 510 may be provided on the flexible printed circuit board 10 corresponding to the protrusion 540. , a first connection fixing part 410-1 may be provided on the resin layer 40 of the remaining portion of one end of the first sub light source module 101-1 other than the protrusion 540.

In addition, one end of the second sub light source module 101-2 has a groove 545 at the center, and a first connector 520 may be provided on the flexible printed circuit board 10 corresponding to the groove 545, and the groove portion 545 may be provided at one end of the second sub light source module 101-2. A first connection fixing part 420-1 may be provided on the resin layer 40 of the remaining portion of the second sub light source module 101-2 other than 545. And the other end of the second sub light source module 101-2 includes a protrusion 560 at the center, and a second connector 530 may be provided on the flexible printed circuit board 10 corresponding to the protrusion 560, A second connection fixing part 410-2 may be provided on the resin layer 40 of the remaining portion of the second sub light source module 101-2 other than the protrusion 560.

Each of the sub light source modules 101-1 to 101-n can be an independent light source in itself and can have various shapes, and two or more sub light source modules are assembled together by a connection fixture to form an independent light source. Because it can be used as a phosphorus light source, the embodiment can improve the degree of freedom in product design. Additionally, in the embodiment, if some of the assembled sub light source modules are damaged or damaged, only the damaged sub light source module can be replaced and used.

The above-described light source module can be used in display devices, indicating devices, and lighting systems that require a surface light source. In particular, lighting is needed, but the light source module according to the embodiment can be easily installed even in places where lighting is not easy to install because the part where the lighting is to be mounted is curved (for example, a curved ceiling or floor, etc.). There is an advantage. For example, the lighting system may include a lamp or a street light, and the lamp may be a head lamp for a vehicle, but is not limited thereto.

Figure 25 shows a head lamp 900-1 for a vehicle according to an embodiment, and Figure 47 shows a general head lamp for a vehicle that is a point light source. Referring to FIG. 25, the head lamp 900-1 for a vehicle includes a light source module 910 and a light housing (light housing, 920).

The light source module 910 may be one of the above-described embodiments 100-1 to 100-17. The light housing 920 accommodates the light source module 910 and may be made of a light-transmitting material. The vehicle light housing 920 may include curves depending on the part of the vehicle to which it is mounted and its design. Meanwhile, as described above, the diffusion plate itself may function as the vehicle light housing 920, and a separate vehicle light housing 920 may be provided in addition to the diffusion plate. Since the light source module 910 uses the flexible printed circuit board 10 and the resin layer 40, it has flexibility and can be easily mounted on a curved vehicle housing 920. In addition, since the light source modules 100-1 to 100-21 have a structure that improves heat dissipation efficiency, the head lamp 900-1 for a vehicle according to an embodiment can prevent the occurrence of wavelength shift and a decrease in luminous intensity. In addition, as described above, a separate light reflection member is formed on the side of the resin layer, which has the effect of reducing light loss and improving luminance compared to the same power.

Since the general vehicle head lamp shown in FIG. 47 is a point light source, a partial spot 930 may appear on the light emitting surface when emitting light, but since the vehicle head lamp 900-1 according to the embodiment is a surface light source, Uniform luminance and illuminance can be achieved across the entire light-emitting surface without generating spots.

FIG. 26 shows a perspective view of the light-emitting device package 200-1 according to the first embodiment, FIG. 27 shows a top view of the light-emitting device package 200-1 according to the first embodiment, and FIG. 28 shows the first embodiment. Shows a front view of the light-emitting device package 200-1 according to the embodiment, and Figure 29 shows a side view of the light-emitting device package 200-1 according to the first embodiment.

The light emitting device package 200-1 shown in FIG. 26 may be a light emitting device package included in the light source modules 100-1 to 100-17 according to the above-described embodiments, but is not limited thereto.

26 to 29, the light emitting device package 200-1 includes a package body 610, a first lead frame 620, a second lead frame 630, a light emitting chip 640, and a Zener diode 645. ), and wire 650-1.

The package body 610 may be formed of a substrate with good insulation or thermal conductivity, such as a silicon-based wafer level package, a silicon substrate, silicon carbide (SiC), or aluminum nitride (AlN). It may be a structure in which a plurality of substrates are stacked. However, the embodiment is not limited to the material, structure, and shape of the body described above.

For example, the length (X1) of the package body 610 in the first direction (eg, X-axis direction) is 5.95 mm to 6.05 mm, and the length (Y1) in the second direction (eg, Y-axis direction) is 1.35 mm to 1.35 mm. It may be 1.45mm. The length Y2 of the package body 610 in the third direction (eg, Z-axis direction) may be 1.6 mm to 1.7 mm. For example, the first direction may be parallel to the long side of the package body 610.

The package body 610 may have an open top and a cavity 601 consisting of a side wall 602 and a bottom 603. The cavity 601 may be formed in a cup shape, a concave container shape, etc., and the side wall 602 of the cavity 601 may be vertical or inclined with respect to the bottom 603. The shape of the cavity 601 when viewed from above may be circular, oval, or polygonal (eg, square). Edges of the polygonal cavity 601 may be curved. For example, the length (X3) of the cavity 601 in the first direction (eg, X-axis direction) is 4.15 mm to 4.25 mm, and the length (X4) in the second direction (eg, Y-axis direction) is 0.64 mm to 0.9 mm. mm, and the depth of the cavity 601 (eg, the length in the Z-axis direction, Y3) may be 0.33 mm to 0.53 mm.

The first lead frame 620 and the second lead frame 630 may be disposed on the surface of the package body 610 so as to be electrically separated from each other in consideration of heat dissipation or mounting of the light emitting chip 640. The light emitting chip 640 is electrically connected to the first lead frame 620 and the second lead frame 630. The number of light emitting chips 640 may be one or more.

A reflective member (not shown) may be provided on the cavity side wall of the package body 610 to reflect the light emitted from the light emitting chip 640 to direct it in a predetermined direction.

The first lead frame 620 and the second lead frame 630 may be arranged to be spaced apart from each other on the upper surface of the package body 610. A part of the package body 610 (for example, the bottom 603 of the cavity 601) is located between the first lead frame 620 and the second lead frame 630, so that the two can be electrically separated.

The first lead frame 620 may include one end (e.g., 712) exposed to the cavity 601 and the other end (e.g., 714) that penetrates the package body 610 and is exposed to one surface of the package body 610. there is. In addition, the second lead frame 630 has one end (e.g., 744-1) exposed to one side of one side of the package body 610 and the other end (e.g., 744-1) exposed to the other side of one side of the package body 610. 2), and a middle portion (eg, 742-2) exposed to the cavity 601.

The separation distance (X2) between the first lead frame 620 and the second lead frame 630 may be 0.1 mm to 0.2 mm. The top surface of the first lead frame 620 and the top surface of the second lead frame 630 may be located on the same plane as the bottom 603 of the cavity 601.

FIG. 30 shows a perspective view of the first lead frame 620 and the second lead frame 630 shown in FIG. 26, and FIG. 31 shows the angles of the first lead frame 620 and the second lead frame shown in FIG. 30. It is a drawing for explaining the dimensions of the part, and FIG. 32 is a connection of the first lead frame 620 adjacent to the boundary portion 801 of the first upper surface portion 712 and the first side portion 714 shown in FIG. 31. An enlarged view of parts 732, 734, and 736 is shown.

Referring to FIGS. 30 to 32 , the first lead frame 620 includes a first upper surface portion 712 and a first side portion 714 bent from the first side of the first upper surface portion 712.

The first upper surface portion 712 is located on the same plane as the bottom of the cavity 601, is exposed by the cavity 601, and light emitting chips 642 and 644 may be disposed thereon.

As shown in FIG. 31, both ends of the first upper surface portion 712 may have portions S3 protruding in the first direction (x-axis direction) with respect to the first side portion 714. The protruding portion S3 of the first upper surface portion 712 may be a portion that supports the first lead frame in the lead frame array. The length of the protruding portion S3 of the first upper surface portion 712 in the first direction may be 0.4 mm to 0.5 mm. The length K of the first upper surface portion 712 in the first direction may be 3.45 mm to 3.55 mm, and the length J1 in the second direction may be 0.6 mm to 0.7 mm. The first direction may be the x-axis direction in the xyz coordinate system, and the second direction may be the y-axis direction.

The second side of the first upper surface portion 712 may have at least one groove portion 701. At this time, the second side of the first upper surface portion 712 may face the first side of the first upper surface portion 712. For example, the second side of the first upper surface portion 712 may have one groove 701 in the center, but the present invention is not limited to this, and the number of grooves formed on the second side may be two or more. The groove portion 701 may have a shape corresponding to the protrusion 702 provided on the second lead frame 630, which will be described later.

The groove portion 701 shown in FIG. 31 has a trapezoidal shape, but is not limited to this and may be implemented in various shapes such as circular, polygonal, and oval shapes. The length S2 of the groove 701 in the first direction may be 1.15 mm to 1.25 mm, and the length S1 of the groove 701 in the second direction may be 0.4 mm to 0.5 mm.

Additionally, the angle θ1 formed between the bottom 701-1 and the side surface 701-2 of the groove 701 may be greater than or equal to 90° and less than 180°. The light emitting chips 642 and 644 may be disposed on the first upper surface portion 712 on both sides of the groove portion 701.

The first side portion 714 may be bent at a certain angle downward from the first side of the first upper surface portion 712, and the first side portion 714 may be exposed from one side of the package body 610. . For example, the angle formed by the first upper surface portion 712 and the first side portion 714 may be greater than or equal to 90° and may be less than 180°.

The first lead frame 620 may have one or more through holes 720 in at least one of the first upper surface portion 712 and the first side portion 714. For example, the first lead frame 620 may have one or more through holes 720 adjacent to the boundary between the first upper surface portion 712 and the first side portion 714. FIG. 28 shows two through holes 722 and 724 adjacent to the boundary between the first upper surface portion 712 and the first side portion 714 and spaced apart from each other, but the embodiment is not limited thereto.

One or more through holes 720 may be formed in an area of each of the first upper surface portion 712 and the first side portion 714 adjacent to the boundary portion of the first upper surface portion 712 and the first side portion 714. there is. At this time, the through hole (e.g., 722-1) formed in one region of the first upper surface portion 712 and the through hole (e.g., 722-2) formed in one region of the first side portion 714 may be connected to each other. .

A portion of the package body 610 is filled in the through hole 720, thereby improving the degree of coupling between the first lead frame 620 and the package body. Additionally, the through hole 720 serves to easily form a bend between the first upper surface portion 712 and the first side portion 714. However, if the size of the through hole 720 is too large or the number of through holes 720 is too large, the first upper surface portion 712 and the first side portion 714 may be broken when the first lead frame 620 is bent. Therefore, the size and number of through holes 720 must be appropriately adjusted. Additionally, since the size of the through hole 720 is related to the size of the connection parts 732, 734, and 736, which will be described later, it is also related to heat dissipation of the light emitting device package.

Embodiments according to the sizes of the first lead frame 620 and the second lead frame 630 having through holes, which will be described below, can produce optimal heat dissipation efficiency considering the degree of coupling and ease of bending.

In order to improve the coupling with the package body 610, facilitate bending of the first lead frame 620, and prevent damage during bending, the embodiment includes a first through hole 722 and a second through hole 724. ) may be provided, and the length D11 of the first through hole 722 in the first direction and the length D12 of the second through hole 724 in the first direction may be 0.58 mm to 0.68 mm, The length D2 in the second direction may be 0.19 mm to 0.29 mm. The area of the first through hole 722 may be the same as the area of the second through hole 724, but the area is not limited thereto, and the two may be different from each other.

Referring to FIG. 32, the first lead frame 620 is located adjacent to the boundary portion 801 of the first upper surface portion 712 and the first side portion 714 and is spaced apart from each other by a through hole 720, It may have connecting portions 732, 734, and 736 that connect the first upper surface portion 712 and the first side portion 714 to each other. For example, the connection parts 732, 734, and 736 are each of the first part 732-1, 734-1, or 736-1 corresponding to a part of the first upper surface part 712 and the first side part 714. It may consist of a corresponding second part (732-2, 734-2, or 736-2). A through hole 720 may be located between each connection portion 732, 734, and 736.

The first lead frame 620 may have at least one connection portion that corresponds to or is aligned with the light emitting chip 642 or 644.

Specifically, the first lead frame 620 may include first to third connection parts 732, 734, and 736. The first connection portion 732 may be positioned corresponding to or aligned with the first light emitting chip 642, and the second connection portion 734 may be positioned corresponding to or aligned with the second light emitting chip 644. there is. And the third connection part 736 may be located between the first connection part 732 and the second connection part 734, and may be unaligned with the first light emitting chip 642 or the second light emitting chip 644. It may be a part. For example, the third connection portion 736 may be positioned corresponding to or aligned with the groove portion 701 of the first lead frame 620, but is not limited thereto.

The length C11 of the first connection part 732 in the first direction and the length C2 of the second connection part 734 in the first direction are the length E of the third connection part 736 in the first direction. It can be bigger than For example, the length C11 of the first connection part 732 in the first direction and the length C2 of the second connection part 734 in the first direction may be 0.45 mm to 0.55 mm, and the third connection part ( The length (E) in the first direction of 736) may be 0.3 mm to 0.4 mm. The reason for positioning the third connection portion 736 between the first through hole 722 and the second through hole 724 is to prevent breakage between the first upper surface portion 712 and the first side portion 714 during bending. It is for this purpose.

The ratio of the length E of the third connection part 736 in the first direction and the length C11 of the first connection part 732 in the first direction may be 1:1.2 to 1.8. The ratio of the length D11 or D12 of the through hole 722 in the first direction and the length B1 of the upper end 714-1 of the first side portion 714 in the first direction may be 1:3.8 to 6.3. .

Since the first connection portion 732 is aligned with the first light emitting chip 642 and the second connection portion 734 is aligned with the second light emitting chip 644, the heat generated from the first light emitting chip 642 is The heat generated from the second light emitting chip 644 may be emitted to the outside mainly through the first connection part 732, and the heat generated from the second light emitting chip 644 may be mainly emitted to the outside through the second connection part 734.

In the embodiment, the lengths (C11, C2) of each of the first connection portion 732 and the second connection portion 734 in the first direction are greater than the length (E) of the third connection portion 736 in the first direction. , the areas of the first connection part 732 and the second connection part 734 are larger than the area of the third connection part 736. Therefore, by increasing the area of the connecting portions 732 and 734 disposed adjacent to the light source 20, the embodiment increases the efficiency of discharging heat generated from the first light emitting chip 642 and the second light emitting chip 644 to the outside. It can be improved.

The first side portion 714 may be divided into an upper portion 714-1 connected to the first upper surface portion 712 and a lower portion 714-2 connected to the upper portion 714-1. That is, the upper part 714-1 includes parts of the first to third connection parts 732, 734, and 736, and the lower part 714-2 may be located below the upper part 714-1.

The length F1 of the upper part 714-1 in the third direction may be 0.6 mm to 0.7 mm, and the length F2 of the lower part 714-2 in the third direction may be 0.4 mm to 0.5 mm. The third direction may be the z-axis direction in the xyz coordinate system.

To improve coupling with the package body 620 and airtightness to prevent moisture infiltration, the sides of the upper portion 714-1 and the lower portion 714-2 may have a step. For example, both side ends of the lower part 714-2 may protrude laterally relative to the side of the upper part 714-1. The length B1 of the upper part 714-1 in the first direction may be 2.56 mm to 2.66 mm, and the length B2 of the lower part 714-2 in the first direction may be 2.7 mm to 3.7 mm. The thickness t1 of the first lead frame 620 may be 0.1 mm to 0.2 mm.

The second lead frame 630 may be arranged to surround at least one side of the first lead frame 620 . For example, the second lead frame 630 may be disposed around the remaining side parts of the first lead frame 630 except for the first side part 714 .

The second lead frame 630 may include a second top portion 742 and a second side portion 744. The second upper surface portion 742 may be arranged to surround the remaining sides of the first upper surface portion 712 except for the first side. As shown in FIGS. 26 and 30 , the second upper surface portion 742 is located on the same plane as the bottom of the cavity 601 and the first upper surface portion 712 and may be exposed by the cavity 601 . The thickness t2 of the second lead frame 630 may be 0.1 mm to 0.2 mm.

The second upper surface portion 742 is divided into a first portion 742-1, a second portion 742-2, and a third portion 742-3 depending on the position surrounding the first upper surface portion 712. It can be divided into: The second portion 742-2 of the second upper surface portion 742 may be a portion corresponding to or facing the second side of the first upper surface portion 712. The first part 742-1 of the second upper surface part 742 is connected to one end of the second part 742-2 and corresponds to or faces one of the remaining sides of the first upper surface part 712. You can. The third part 742-3 of the second upper surface part 742 is connected to the other end of the second part 742-2, and corresponds to or faces another one of the remaining sides of the first upper surface part 712. can see.

The length H1 of the first part 742-1 and the third part 742-3 in the second direction may be 0.65 mm to 0.75 mm, and the length H2 in the first direction may be 0.78 mm to 0.88 mm. It can be. The length (I) of the second portion 742-2 in the first direction may be 4.8 mm to 4.9 mm.

The second portion 742-2 of the second upper surface portion 742 may have a protrusion 702 corresponding to the groove portion 701 of the first upper surface portion 712. For example, the shape of the protrusion 702 may match the shape of the groove 701, and the protrusion 702 may be positioned to align with the groove 701. The protrusion 702 may be located within the groove 701. The number of protrusions 702 may be the same as the number of grooves 701. The protrusion 702 and the groove 701 are spaced apart from each other, and a portion of the package body 610 may be located between them. The protrusion 702 is an area for wire bonding with the first light-emitting chip 642 and the second light-emitting chip 644, and is aligned and positioned between the first light-emitting chip 642 and the second light-emitting chip 644. Wire bonding can be facilitated.

The length S5 of the protrusion 702 in the first direction may be 0.85 mm to 0.95 mm, the length S4 in the second direction may be 0.3 mm to 0.4 mm, and the protrusion 702 may be formed in the second portion ( The angle (θ2) formed by 742-2) may be greater than or equal to 90° and may be less than 180°.

The second side portion 744 may be bent from at least one side of the second upper surface portion 742. The second side portion 744 may be bent downward from the second upper surface portion 742 at a certain angle (eg, 90°).

For example, the second side portion 744 is a first portion 744-1 bent at one side of the first portion 742-1 of the second upper surface portion 742 and a third portion of the second upper surface portion 742. It may include a second part 744-2 bent at one side of the part 742-3.

The first portion 744-1 and the second portion 744-2 of the second side portion 744 may be bent to be located on the same side of the second lead frame 630. The first portion 744-1 of the second side portion 744 may be spaced apart from the first side portion 714 and may be located on one side (eg, left side) of the first side portion 714. The second portion 744-2 of the second side portion 744 may be spaced apart from the first side portion 714 and may be located on the other side (eg, right side) of the first side portion 714. The first side portion 714 and the second side portion 744 may be located on the same plane. Ultimately, as shown in FIG. 26 , the first side portion 714 and the second side portion 744 may be exposed to the same side of the package body 610. The length (A) of the second side portion 744 in the first direction may be 0.4 mm to 0.5 mm, and the length (G) in the third direction may be 1.05 mm to 1.15 mm.

One side of the first portion 742-1 and the third portion 742-3 of the second upper surface portion 742 may have a bent step g1. For example, the bent step g1 is a portion where one side of the first portion 742-1 of the second upper surface portion 742 and one side of the first portion 744-1 of the second side portion 744 meet. It can be located adjacent to . Since the area of the first upper surface portion 712 and the first side portion 714 positioned correspondingly to the bent step g1 can be designed to be wider, the heat generating area can be increased in the embodiment to improve heat generating efficiency. . This is because the area of the first lead frame 620 is related to heat dissipation of the light emitting chips 642 and 644.

The other side surfaces of the first portion 742-1 and the third portion 742-3 of the second upper surface portion 742 may have a bent step g2. The reason for forming the bent step g2 is to allow the bonding material (e.g., solder) to be easily observed with the naked eye when bonding the light emitting device package 200-1 to the flexible printed circuit board 10. am.

The first side portion 714 of the first lead frame 620 and the second side portion 744 of the second lead frame 630 are flexible printed circuits of the light source modules 100-1 to 100-21 according to the embodiment. It can be mounted so as to contact the substrate 10, and as a result, the light emitting chip 640 can irradiate light in the direction 3 toward the side of the resin layer 40. That is, the light emitting device package 200-1 may have a side view type structure.

The Zener diode 645 may be disposed on the second lead frame 630 to improve the withstand voltage of the light emitting device package 200-1. For example, the Zener diode 645 may be disposed on the second upper surface portion 742 of the second lead frame 630.

The first light emitting chip 642 may be electrically connected to the second lead frame 630 through the first wire 652, and the second light emitting chip 644 may be electrically connected to the second lead frame 630 through the second wire 654. It may be electrically connected to the frame 630, and the Zener diode 645 may be electrically connected to the first lead frame 620 by a third wire 656.

For example, one end of the first wire 652 may be connected to the first light emitting chip 642, and the other end may be connected to the protrusion 702. Additionally, one end of the second wire 654 may be connected to the second light emitting chip 644, and the other end may be connected to the protrusion 702.

The light emitting device package 200-1 may further include a resin layer (not shown) filled in the cavity 601 to surround the light emitting chip. The resin layer may be made of a colorless and transparent polymer resin material such as epoxy or silicone.

The light emitting device package 200-1 may implement red light using only a red light emitting chip without using a phosphor, but the embodiment is not limited thereto. The resin layer may contain a phosphor to change the wavelength of light emitted from the light emitting chip 640. For example, even if a light emitting chip of a color other than red is used, a light emitting device package that emits light of a desired color can be implemented by changing the wavelength of light using a phosphor.

Figure 33 shows a first lead frame 620-1 and a second lead frame 630 according to another embodiment. The same reference numerals as in FIG. 28 indicate the same configuration, and content that overlaps with the content described above will be omitted or briefly described.

Referring to FIG. 33, the first lead frame 620-1 is a structure in which the third connection portion 736 is removed from the first lead frame 620 shown in FIG. 30. That is, the first lead frame 620-1 may have one through hole 720-1 adjacent to the boundary between the first upper surface portion 712 and the first side portion 714'. Additionally, the first connection portion 732 may be located on one side of the through hole 720-1, and the second connection portion 734 may be located on the other side of the through hole 720-1.

Figure 34 shows a first lead frame 620-2 and a second lead frame 630-1 according to another embodiment. The same reference numerals as in FIG. 30 indicate the same configuration, and content that overlaps with the content described above will be omitted or briefly described.

Referring to FIG. 34, the first upper surface portion 712' of the first lead frame 620-2 is the groove portion 701 in the first upper surface portion 712 of the first lead frame 620 shown in FIG. 30. may be an omitted structure. And the second portion 742-2' of the second upper surface portion 742' of the second lead frame 630-1 is the second upper surface portion 742 of the second lead frame 630 shown in FIG. 32. The protrusion 702 may be omitted from the second portion 742-2. Other than that, the remaining components may be the same as those described in FIG. 28.

Figure 35 shows a first lead frame 620-3 and a second lead frame 630 according to another embodiment. The same reference numerals as in FIG. 30 indicate the same configuration, and content that overlaps with the content described above will be omitted or briefly described.

Referring to FIG. 35, the first lead frame 620-3 has at least one of the connecting portions 732, 734, and 736 of the first lead frame 620 shown in FIG. 30 with a microscopic structure penetrating the first lead frame 620. It may have a structure in which through holes (h1, h2, h3) are formed.

At least one of the connection parts 732-1,734-1,736-1 of the first lead frame 620-3 is a fine through hole formed at the boundary between the first top part 712 and the first side part 714 ( h1, h2, h3). At this time, the diameter of the fine through holes (h1, h2, h3) may be smaller than the length (D11, D12) in the first direction or the length (D2) in the second direction of the through holes (722, 724). In addition, the number of fine through holes (h1, h2) formed in the first connection part 732-1 and the second connection part 734-1 is determined by the number of fine through holes formed in the third connection part 736-1 ( It may be more than the number of h3), but is not limited to this. Additionally, the shape of the fine through holes h1, h2, and h3 may be circular, oval, or polygonal. The fine through holes h1, h2, and h3 not only facilitate bending of the first lead frame 620-3 but also improve the coupling force between the first lead frame 620-3 and the package body 610.

Figure 36 shows a first lead frame 620-4 and a second lead frame 630 according to another embodiment. The same reference numerals as in FIG. 30 indicate the same configuration, and content that overlaps with the content described above will be omitted or briefly described.

Referring to FIG. 36, the first lead frame 620-4 includes a first top portion 712" and a first side portion 714". The first upper surface portion 712" and the first side portion 714" are modified examples of the first upper surface portion 712 and first side portion 714 shown in FIG. 32. That is, the first lead frame 620-4 omits the through holes 722 and 724 in the first upper surface portion 712 and the first side portion 714 of the first lead frame 620 shown in FIG. 26, and the through holes 722 and 724 are omitted. A structure in which a plurality of fine through holes (h4) spaced apart from each other are provided in a region (Q2) of the boundary portion (Q) between the first upper surface portion (712") and the first side portion (714") where (722,724) is omitted. am.

The boundary portion (Q) of the first upper surface portion (712") and the first side portion (714") is divided into a first boundary region (Q1), a second boundary region (Q2), and a third boundary region (Q3). You can. The first border area Q1 may be an area corresponding to or aligned with the first light emitting chip 642, and the second boundary area Q2 may be an area corresponding to or aligned with the first light emitting chip 642. and the third border area Q3 may be an area between the first border area Q1 and the second border area Q2. For example, the first border area Q1 may be an area corresponding to the first connection part 732 shown in FIG. 30, and the second border area Q2 may be an area corresponding to the second connection part 734 shown in FIG. 30. It may be an area corresponding to .

The first boundary area (Q1) and the second boundary area (Q2) serve as a passage for transferring heat generated from the first light-emitting chip 642 and the second light-emitting chip 644, and have a plurality of fine through holes (h4). ) may serve to facilitate bending between the first upper surface portion 712" and the first side portion 714". In FIG. 36, the diameters of the plurality of fine through holes h4 are shown to be the same and the separation distances are the same. However, the embodiment is not limited thereto, and in other embodiments, at least one of the plurality of fine through holes h4 is The diameters may be different, or the separation distances may be different.

Figure 37 shows a first lead frame 620 and a second lead frame 630-2 according to another embodiment. The second lead frame 630-2 of FIG. 37 may be a modified example of the second lead frame 630 shown in FIG. 30. The same reference numerals as in FIG. 30 indicate the same configuration, and content that overlaps with the content described above will be omitted or briefly described.

Referring to FIG. 37, unlike the second portion 742-2 of the second upper surface portion 742 shown in FIG. 30, the second portion 742- of the second upper surface portion 742" shown in FIG. 37 2") has a broken structure and does not connect the first part 742-1 and the third part 742-3.

The second upper surface portion 742" of the second lead frame 630-2 may include a first portion 742-1, a second portion 742-2", and a third portion 742-3. You can. Each of the first to third parts (742-1,742-2", 742-3) is located around a corresponding one of the sides of the first upper surface portion 712 of the first lead frame 620. You can.

The second portion 742-2" of the second upper surface portion 742" is connected to the first region 704 connected to the first portion 742-1, and the third portion 742-3. It may consist of a second area 705 spaced apart from the first area 704. Since the space 706 between the first area 704 and the second area 705 is filled with the package body 610, the bonding force between the package body 610 and the second lead frame 630-2 is increased. It can be improved. The second lead frame 630-2 shown in FIG. 37 is divided into first subframes 744-1, 742-1, and 704, and second subframes 744-2, 742-3, and 705. The two can be electrically separated from each other.

Figure 38 shows a first lead frame 810 and a second lead frame 820 according to another embodiment.

Referring to FIG. 38, the first lead frame 810 includes a first upper surface portion 812 and a first side portion 814 and a second side portion 816 bent from the first side of the first upper surface portion 812. It can be included. Light-emitting chips 642 and 644 may be disposed on the first upper surface portion 812.

The second side of the first upper surface portion 812 may have one or more first groove portions 803 and 804 and a first protrusion portion 805. At this time, the second side of the first upper surface portion 812 may be a side facing the first side of the first upper surface portion 812. For example, the second side of the first upper surface portion 812 may have two first grooves 803 and 804 and one first protrusion 805 located between the first grooves 803 and 804, but is limited to this. It doesn't work. The first grooves 803 and 804 have a shape corresponding to the second protrusions 813 and 814 provided on the second lead frame 820, which will be described later, and the first protrusions 805 are provided on the second lead frame 820. It may have a shape corresponding to the second groove portion 815. The first grooves 803 and 804 and the first protrusion 805 shown in FIG. 38 have a square shape, but are not limited thereto and may be implemented in various shapes such as a circle, polygon, or oval. The light emitting chips 642 and 644 may be disposed on the first upper surface portion 812 on both sides of the first groove portions 803 and 804.

The first side portion 814 is connected to one region of the first side of the first upper surface portion 712, and the second side portion 816 is connected to another region of the first side of the first upper surface portion 712, The first side portion 814 and the second side portion 816 may be spaced apart from each other. The first side portion 814 and the second side portion 816 may be exposed from the same side of the package body 610.

The first lead frame 610 may have one or more through holes 820 in at least one of the first upper surface portion 812 and the first side portion 814. For example, the first lead frame 810 may have one or more through holes 840 adjacent to the boundary between the first upper surface portion 812 and the first side portion 814. The through hole 820 may have the same structure as described in FIGS. 30 and 32 and its function may also be the same.

The first lead frame 810 is located adjacent to the boundary portion 801 of the first upper surface portion 812 and the first side portion 814 and is spaced apart from each other by a through hole 720, and the first upper surface portion 712 ) and the first side portion 714 may have connection portions 852, 854, and 856 connecting them to each other. The structure and function of the connecting portions 852, 854, and 856 may be the same as those described in FIGS. 30 and 32. The first lead frame 810 may have at least one connection portion that corresponds to or is located adjacent to the light emitting chip 642 or 644.

The length in the first direction of the connection portions (e.g., 852, 854) corresponding to or adjacent to the light-emitting chips 642 and 644 is longer than the first direction of the connection portions (e.g., 856) that do not correspond to or are adjacent to the light-emitting chips 642 and 644. It can be larger than the length of the direction.

In order to improve coupling with the package body 620 and airtightness to prevent moisture infiltration, the lower side portion of the second side portion 814 may have a structure that protrudes laterally.

The second lead frame 820 may be disposed around at least one side of the first lead frame 810. The second lead frame 820 may include a second top portion 822 and a third side portion 824. The second upper surface portion 822 may be divided into a first portion 832 and a second portion 834 depending on the position disposed around the first upper surface portion 812.

The second portion 834 of the second upper surface portion 822 may be a portion corresponding to or facing the second side of the first upper surface portion 812. The first part 832 of the second upper surface part 822 is connected to one end of the second part 834 and may correspond to or face the third side of the first upper surface part 712. The third side may be a side perpendicular to the first side or the second side.

The second portion 834 of the second upper surface portion 822 may have second protrusions 813 and 814 corresponding to the first groove portions 803 and 804 of the first upper surface portion 812. The second protrusions 813 and 814 are areas for wire bonding with the first light-emitting chip 642 and the second light-emitting chip 644, and are located between the first light-emitting chip 642 and the second light-emitting chip 644. By being positioned, wire bonding can be facilitated.

The third side portion 824 may be bent downward from the second upper surface portion 822 at a certain angle (eg, 90°). For example, the third side portion 824 may be bent at one side of the first portion 832 of the second upper surface portion 822. With respect to the first side portion 814, the second side portion 816 and the third side portion 824 may have left-right symmetrical shapes. In order to improve coupling with the package body 620 and airtightness to prevent moisture infiltration, the lower side portion of the third side portion 824 may have a structure that protrudes laterally. The first side portion 814, the second side portion 816, and the third side portion 824 may be exposed to the same side of the package body 610.

FIG. 39 shows a perspective view of a light-emitting device package 200-2 according to another embodiment, FIG. 40 shows a top view of the light-emitting device package 200-2 shown in FIG. 39, and FIG. 41 shows a top view of the light-emitting device package 200-2 shown in FIG. 39. shows a front view of the light emitting device package 200-2, FIG. 42 shows a cross-sectional view in the cd direction of the light emitting device package 200-2 shown in FIG. 39, and FIG. 43 shows the first lead frame shown in FIG. 39. (620') and a second lead frame (630'). The same reference numerals as in FIGS. 26 to 30 indicate the same configuration, and content that overlaps with the content described above will be omitted or briefly described.

Referring to FIGS. 39 to 43 , the first lead frame 620' of the light emitting device package 200-2 may include a first top portion 932 and a first side portion 934. Unlike the first upper surface portion 712 shown in FIG. 30, the first upper surface portion 932 shown in FIG. 43 does not have a groove portion. Additionally, the second upper surface portion 942 of the second lead frame 630' may be similar to the structure shown in FIG. 34 in which the second portion 742-2 of the second upper surface portion 742 is omitted.

The first side portion 934 may have the same structure as the first side portion 714 shown in FIG. 34 . The length P1 of the first upper surface portion 932 in the first direction may be smaller than the length of the first upper surface portion 712 shown in FIG. 30, and the length of the first upper surface portion 932 in the second direction ( J2) may be greater than the length J1 of the first upper surface portion 712 in the second direction. For example, the length P1 of the first upper surface portion 932 in the first direction may be 4.8 mm to 4.9 mm, and the length J2 in the second direction may be 0.67 mm to 0.77 mm. Therefore, since the area of the first upper surface portion 932 shown in FIG. 39 is larger than the area of the first upper surface portion 712 shown in FIG. 34, the embodiment of FIG. 39 can mount a larger size light emitting chip. there is. The sizes of the first side portion 944, the through holes 722 and 724, and the connecting portions may be the same as those described in FIG. 31.

The second lead frame 630' may include a second top portion 942 and a second side portion 944. The second upper surface portion 942 may include a first portion 942-1 disposed around the third side of the first upper portion 932 and a second portion 942-2 disposed around the fourth side. You can. The third side of the first upper surface portion 932 is a side perpendicular to the first side of the first upper surface portion 932, and the fourth side of the first upper surface portion 932 is the second side of the first upper surface portion 932. 3 It may be a side facing the side.

The first portion 942-1 and the second portion 942-2 of the second upper surface portion 942 are positioned spaced apart from each other and may be electrically separated from each other.

The second side portion 944 includes a first portion 944-1 connected to the first portion 942-1 of the second upper surface portion 942 and a second portion 942-2 of the second upper surface portion 942. ) may include a second part (944-2) connected to. However, the length P2 of the first portion 942-1 and the second portion 942-2 of the second upper surface portion 942 in the first direction is the same as that of the second upper surface portion 742 shown in FIG. 34. It may be greater than the length H2 of the first part 742-1 and the third part 742-3 in the first direction.

For example, the length P2 in the first direction of the first portion 942-1 and the second portion 942-2 of the second upper surface portion 942 is 1.04 mm to 1.14 mm, and the length in the second direction ( P3) can be 0.45mm ~ 0.55mm.

The length of the protruding portion S22 of the first upper surface 932 that protrudes to support the first lead frame 620' in the lead frame array in the first direction may be 0.14 mm to 0.24 mm.

The first light emitting chip 642 may be electrically connected to the first part 942-1 of the second upper surface 942 by a first wire 653, and the second light emitting chip 644 is connected to the second wire 653. It may be electrically connected to the first part 942-2 of the second upper surface part 942 by 655.

Both the first light emitting chip 642 and the second light emitting chip 644 may emit light of the same wavelength. For example, the first light-emitting chip 642 and the second light-emitting chip 644 may be red light-emitting chips that generate red light.

Additionally, the first light emitting chip 642 may generate light of different wavelengths. For example, the first light-emitting chip 642 may be a red light-emitting chip, and the second light-emitting chip 644 may be a yellow light-emitting chip, and the first light-emitting chip mounted on the light source package 200-2 according to the second embodiment ( 642) and the second light emitting chip 644 can operate individually.

A first power source (e.g., negative (-) power) may be supplied to the first lead frame 620', and a second power source (e.g., positive (+) power) may be supplied to the second lead frame 630'. there is. Since the second lead frame 630' is divided into two electrically separated parts (942-1 and 944-1, and 942-2 and 944-2), the first lead frame 620' has a common By using it as an electrode and individually supplying the second power to the first part 942-1 and the second part 942-2 of the second upper surface part 942 of the second lead frame 630', the first The light emitting chip 642 and the second light emitting chip 644 can be operated individually.

Therefore, when the light emitting device package 200-2 shown in FIG. 39 is mounted on the light source modules 100-1 to 100-21 according to the embodiment, the light source modules 100-1 to 100-21 have various colors. A surface light source can be generated. For example, when operating only the first light emitting chip 642, the embodiment may generate a red surface light source, and when operating the second light emitting chip 644, the embodiment may generate a yellow surface light source.

Figure 44 shows the measured temperature of the light emitting device package (200-1,200-2) according to an embodiment. The measured temperature shown in FIG. 44 represents the temperature of the light emitting chip when the light emitting device package emits light.

Case 1 represents the measured temperature of the light emitting chip when the length of the first and second portions of the side portion of the first lead frame in the first direction is equal to the length of the third portion, and case 2 (case 2) ) represents the measured temperature of the light emitting chip shown in FIG. 26, and case 3 (case 3) represents the measured temperature of the light emitting chip shown in FIG. 37.

Referring to FIG. 44, the measured temperature (t1) of Case 1 is 44.54°C, the measured temperature (t2) of Case 2 is 43.66°C, and the measured temperature (t3) of Case 3 is 43.58°C.

Therefore, by changing the design of the connecting portions 732, 734, and 736 of the first side portion 714 of the first lead frame 620, the embodiment can improve the heat dissipation effect, so that the light emitting device packages 200-1, 200 when emitting light. Since the temperature rise of the light emitting chip 640 mounted in -2) can be alleviated, a decrease in luminance and occurrence of wavelength shift can be prevented.

FIG. 45 shows an example of the light emitting chip 640 shown in FIG. 26. For example, the light emitting chip 640 shown in FIG. 45 may be a vertical chip that emits red light with a wavelength range of 600 nm to 690 nm.

Referring to FIG. 45, the light emitting chip 640 includes a second electrode layer 1801, a reflective layer 1825, a light emitting structure 1840, a passivation layer 1850, and a first electrode layer 1860.

The second electrode layer 1801 provides power to the light emitting structure 1840 together with the first electrode layer 1860. The second electrode layer 1801 may include an electrode material layer 1810 for current injection, a support layer 1815 located on the electrode material layer 1810, and a bonding layer 1820 located on the support layer 1815. there is. The second electrode layer 1801 may be bonded to the first lead frame 620, for example, the first upper surface portion 712, of the light emitting device package 200-1 shown in FIG. 30.

The electrode material layer 1810 may be Ti/Au, and the support layer 1815 may be a metal or semiconductor material. Additionally, the support layer 1815 may be a material with high electrical conductivity and high thermal conductivity. For example, the support layer 1815 is a metal containing at least one of copper (Cu), copper alloy (Cu alloy), gold (Au), nickel (Ni), molybdenum (Mo), and copper-tungsten (Cu-W). It may be a material or a semiconductor containing at least one of Si, Ge, GaAs, ZnO, and SiC.

The bonding layer 1820 is disposed between the support layer 1815 and the reflective layer 1825, and the bonding layer 1820 serves to bond the support layer 1815 to the reflective layer 1825. The bonding layer 1820 may include at least one of a bonding metal material, for example, In, Sn, Ag, Nb, Pd, Ni, Au, and Cu. Since the bonding layer 1820 is formed to bond the support layer 815 using a bonding method, the bonding layer 1820 may be omitted when the support layer 1815 is formed using a plating or deposition method.

The reflective layer 1825 is disposed on the bonding layer 820. The reflective layer 1825 reflects light incident from the light emitting structure 1840, thereby improving light extraction efficiency. The reflective layer 825 may be formed of a reflective metal material, such as a metal or alloy containing at least one of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, and Hf.

Additionally, the reflective layer 1825 may include a conductive oxide layer, such as indium zinc oxide (IZO), indium zinc tin oxide (IZTO), indium aluminum zinc oxide (IAZO), indium gallium zinc oxide (IGZO), and indium gallium tin oxide (IGTO). , AZO (aluminum zinc oxide), ATO (antimony tin oxide), etc. can be used to form a single layer or multilayer. Additionally, the reflective layer 825 can be formed by using multiple layers of metal and conductive oxide, such as IZO/Ni, AZO/Ag, IZO/Ag/Ni, and AZO/Ag/Ni.

An ohmic region (1830) may be located between the reflective layer (1825) and the light emitting structure (1840). The ohmic region 1830 is an area in ohmic contact with the light emitting structure 1840 and serves to ensure that power is smoothly supplied to the light emitting structure 1840.

A material in ohmic contact with the light emitting structure 1840, for example, a material containing at least one of Be, Au, Ag, Ni, Cr, Ti, Pd, Ir, Sn, Ru, Pt, and Hf, is added to the light emitting structure 1840. An ohmic region 1830 can be formed by bringing it into ohmic contact. For example, the material forming the ohmic region 1830 may include AuBe and may be in the form of a dot.

The light emitting structure 1840 may include a window layer 1842, a second semiconductor layer 1844, an active layer 1846, and a first semiconductor layer 1848. The window layer 1842 is a semiconductor layer disposed on the reflective layer 1825, and its composition may be GaP.

The second semiconductor layer 1844 is disposed on the window layer 1842. The second semiconductor layer 1844 may be implemented as a compound semiconductor of group 3-5, group 2-6, etc., and may be doped with a second conductivity type dopant. For example, the first semiconductor layer 1844 may include any one of AlGaInP, GaInP, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, and a p-type dopant (e.g., Mg, Zn, Ca, Sr, Ba) may be doped.

The active layer 1846 is disposed between the second semiconductor layer 1844 and the first semiconductor layer 848, and receives electrons and holes provided from the second semiconductor layer 1844 and the first semiconductor layer 1848 ( Light can be generated by the energy generated during the recombination process of holes.

The active layer 1846 may be a compound semiconductor of group 3-5 or group 2-6, and may have a single-well structure, multi-well structure, quantum-wire structure, or quantum dot structure. can be formed.

For example, the active layer 1846 may have a single or multiple quantum well structure having a well layer and a barrier layer. The well layer may be a material having a lower energy band gap than the barrier layer. For example, the active layer 1846 may be AlGaInP or GaInP.

The first semiconductor layer 1848 may be formed of a semiconductor compound. The first semiconductor layer 1848 may be implemented as a compound semiconductor of group 3-5, group 2-6, etc., and may be doped with a first conductivity type dopant. For example, the first semiconductor layer 1848 may include any one of AlGaInP, GaInP, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, and an n-type dopant (e.g. Si, Ge, Sn, etc.) may be doped.

The light emitting structure 1840 may generate red light having a wavelength range of 600 nm to 690 nm, and the first semiconductor layer 1848, the active layer 1846, and the second semiconductor layer 1844 may have a composition capable of generating red light. there is. To increase light extraction efficiency, the upper surface of the first semiconductor layer 848 may be roughened (1870).

Passivation layer 1850 is disposed on the side of light emitting structure 1840. The passivation layer 1850 serves to electrically protect the light emitting structure 1840. The passivation layer 1850 is made of an insulating material, such as SiO ₂ , SiO _x , SiO _x N _y , To be formed of Si ₃ N ₄ , or Al ₂ O ₃ You can. The passivation layer 1850 may be disposed on at least a portion of the upper surface of the first semiconductor layer 1848.

The first electrode layer 1860 may be disposed on the first semiconductor layer 1848 and may have a predetermined pattern. The first electrode layer 1860 may be a single layer or multiple layers. For example, the first electrode layer 1860 may include a first layer 1862, a second layer 1864, and a third layer 1866 that are sequentially stacked. The first layer 1862 is in ohmic contact with the first semiconductor layer 1848 and may be formed of GaAs. The second layer 1864 may be formed of an AuGe/Ni/Au alloy. The third layer 1866 may be formed of Ti/Au alloy.

As shown in FIGS. 26 and 39 , the first electrode layer 860 may be electrically bonded to the second lead frame 630 or 630' by wires 652, 654, 653, or 655.

Generally, when the temperature of a light emitting chip increases, a wavelength shift occurs and the luminous intensity decreases. However, compared to the blue light-emitting chip (Blue LED) that generates blue light and the light-emitting chip (Amber LED) that generates yellow light, the red light-emitting chip (Red LED) that generates red light has a degree of wavelength shift and luminous intensity decrease as temperature increases. is more severe. Therefore, it is very important for light emitting device packages and light source modules using red light emitting chips to have heat dissipation measures to suppress the temperature increase of the light emitting chip.

However, the light source modules 100-1 to 100-21 and the light emitting device packages 200-1 to 200-2 included in the lighting device 1 according to the embodiment can improve heat dissipation efficiency as described above. Therefore, even if a red light-emitting chip is used, an increase in the temperature of the light-emitting chip can be suppressed, thereby suppressing wavelength shift and a decrease in luminous intensity.

Figure 46 shows a lighting device 2 according to another embodiment. Referring to FIG. 46, the lighting device 2 includes a housing 1310, a light source module 1320, a diffusion plate 1330, and a micro lens array 1340.

The housing 1310 accommodates the light source module 1320, the diffusion plate 1330, and the micro lens array 1340, and may be made of a light-transmitting material.

The light source module 1320 may be any one of the above-described embodiments (100-1 to 100-17).

The diffusion plate 1330 may serve to uniformly diffuse the light emitted through the light source module 1320 over the entire surface. The diffusion plate 1330 may be made of the same material as the diffusion plate 70 described above, but is not limited thereto. In other embodiments, the diffusion plate 1330 may be omitted.

The micro lens array 1340 may have a structure in which a plurality of micro lenses 1344 are disposed on the base film 1342. Each micro lens 1344 may be spaced apart from each other by a preset distance. The space between each micro lens 1344 may be flat, and each micro lens 1344 may be spaced apart from each other with a pitch of 50 to 500 micrometers.

In Figure 46, the diffuser plate 1330 and the micro lens array 1340 are made of separate components, but in other embodiments, the diffuser plate 1330 and the micro lens array 1340 may be formed as one piece.

Figure 48 shows a tail light (tail light, 900-2) for a vehicle according to an embodiment, and Figure 49 shows a typical tail light for a vehicle.

Referring to FIG. 48, the vehicle taillight 900-2 may include a first light source module 952, a second light source module 954, a third light source module 956, and a housing 970.

The first light source module 952 may be a light source for the role of a turn signal, the second light source module 954 may be a light source for the role of a sidelight, and the third light source module 956 may be a light source for the role of a stop light. It may be a light source, but is not limited to this, and its roles may be interchanged.

The housing 970 accommodates the first to third light source modules 952, 954, and 956, and may be made of a light-transmitting material. The housing 970 may have a curve depending on the design of the vehicle body. At least one of the first to third light source modules 952, 954, and 956 may be implemented as one of the above-described embodiments 100-1 to 100-17.

In the case of tail lights, the light intensity when stopping must be over 110 candela (cd) to be visible from a distance, and a light intensity of at least 30% of this is usually required. In order to achieve a light output of more than 30%, the number of light emitting device packages applied to the light source module (e.g., 952,954 or 956) must be increased by more than 25% to 35%, or the output of each light emitting device package must be increased by 25% to 35%. .

When increasing the number of light emitting device packages, manufacturing may be difficult due to limitations in placement space, so by increasing the output of individual light emitting device packages mounted on the light source module, the desired light intensity (e.g., 110 candela or more) can be achieved even with a small number of light emitting device packages. ) can be obtained. Since the total output of the light source module is usually the product of the output (W) of the light emitting device package and its number (N), the appropriate output and number of light emitting device packages can be determined according to the area of the light source module to obtain the desired light intensity. there is.

For example, in the case of a light emitting device package with a power consumption of 0.2 watts and an output of 13 lumens (lm), a light intensity of about 100 candela can be produced by arranging 37 to 42 units in a certain area. However, in the case of a light emitting device package with a power consumption of 0.5 watts and a luminous flux of 30 lumens (lm), light of similar intensity can be obtained by placing only 13 to 15 units in the same area. In order to obtain a constant output, the number of light emitting device packages that must be placed in a light source module having a certain area can be determined depending on the arrangement spacing (pitch), the content of the light diffusion material in the resin layer, and the pattern shape of the reflective layer. Here, the gap may be the distance from one midpoint of two neighboring light emitting device packages to the other midpoint.

When placing light-emitting device packages within a light source module, they are placed at regular intervals. In the case of high-output light-emitting device packages, the number of devices can be relatively reduced and space can be used efficiently because they can be placed at wide intervals. Additionally, when high-output light emitting device packages are placed at narrow intervals, higher light intensity can be produced than when they are placed at wide intervals.

Figures 50a and 50b show the spacing of light emitting device packages of a light source module used in a vehicle taillight according to an embodiment. For example, Figure 50A may be the first light source module 952 shown in Figure 48, and Figure 50B may be the second light source module 954 shown in Figure 48.

Referring to FIGS. 50A and 50B, the light emitting device packages 99-1 to 99-n, or 98-1 to 98-m, may be arranged to be spaced apart from each other on the substrate 10-1 or 10-2. there is. It can be a natural number with n>1, and it can be a natural number with m>1.

The spacing (eg, ph1, ph2, ph3 or pc1, pc2, pc3) between two neighboring light emitting device packages may be different, but the appropriate spacing range is 8 to 30 mm.

This is because there may be changes depending on the power consumption of the light emitting device package (99-1 to 99-n, or 98-1 to 98-m), but the arrangement interval (e.g., ph1, ph2, ph3 or pc1, pc2, pc3) This is because, in the case of less than 8 mm, light from neighboring light emitting device packages (eg, 99-3 to 99-4) may interfere with each other to generate perceptible bright spots. Additionally, if the arrangement spacing (eg, ph1, ph2, ph3 or pc1, pc2, pc3) is more than 30 mm, dark areas may be generated due to areas where light does not reach.

As described above, the light source modules 100-1 to 100-17 are flexible and can be easily mounted on the curved housing 970, so the vehicle tail light 900-2 according to the embodiment is designed by Design. The degree of freedom can be improved.

In addition, since the light source modules 100-1 to 100-17 have a structure that improves heat dissipation efficiency, the vehicle tail light 900-2 according to the embodiment can prevent the occurrence of wavelength shift and a decrease in luminous intensity.

Since the general vehicle tail light shown in FIG. 49 is a point light source, partial spots 962 and 964 may appear on the light emitting surface when emitting light, but since the vehicle tail light 900-2 according to the embodiment is a surface light source, the light emitting surface Uniform luminance and illumination can be achieved throughout.

Although the preferred embodiments have been described and illustrated above to illustrate the technical idea of the present invention, the present invention is not limited to the configuration and operation as shown and described, and does not deviate from the scope of the technical idea. Those skilled in the art will be able to understand that many appropriate variations and modifications can be made to the present invention. Accordingly, all such appropriate variations, modifications and equivalents should be considered to fall within the scope of the present invention.

10: printed circuit board 20: light source
30: Reflection unit 31: Reflection pattern
33: first reflecting sheet 35: second reflecting sheet
36: Air area 37: Separation member
40: Resin layer 50: Optical pattern layer
52: first optical sheet 54: second optical sheet
56: Adhesive layer 60: Optical pattern
70: diffusion plate
80: first air gap 81: second air gap
90: Light reflection member 91: Indirect light emitting air gap
110: Heat dissipation member 101-1 to 101-n: Sub light source module
410-1, 420-1, 410-2: Connection fixture 510, 520, 530, 540: Connector
610: Package body 620: First lead frame
630: second lead frame 640: light emitting chip
645: Zener diode 650: Wire
712: first top portion 714: first side portion
722,724: Through hole 742: Second upper surface portion
744: second side portion 801: second electrode layer
810: electrode material layer 815: support layer
820: Bonding layer 825: Reflective layer
830: Ohmic region 840: Light-emitting structure
850: passivation layer 860: first electrode layer
900: Vehicle light 910: Light source module
920: Light housing

Claims (46)

Board;
a heat dissipation member disposed below the substrate;
a plurality of light sources disposed on the substrate;
a resin layer disposed on the substrate and covering the plurality of light sources;
An optical pattern layer disposed on the resin layer; and
It includes an indirect light emitting part disposed on one side of the resin layer,
The plurality of light sources are side light-emitting devices that emit red light toward the side of the resin layer,
The optical pattern layer includes a first optical sheet disposed on the resin layer, a second optical sheet disposed on the first optical sheet, and a plurality of optical patterns disposed between the first optical sheet and the second optical sheet. and an adhesive layer,
A lighting device for a vehicle taillight including an area where two neighboring light sources among the plurality of light sources have different intervals. According to paragraph 1,
A lighting device for a vehicle taillight, wherein the distance between the plurality of light sources is 8mm to 30mm. According to paragraph 1,
A lighting device for a vehicle taillight, wherein, among the plurality of light sources, an interval between two neighboring light sources disposed on the outermost side in the longitudinal direction of the substrate is smaller than an interval between two neighboring light sources disposed at the center of the substrate. According to any one of claims 1 to 3,
The indirect light emitting unit is a lighting device for a vehicle tail light including a light reflection member disposed on a side of the resin layer. According to paragraph 4,
The light reflection member is a lighting device for a vehicle taillight that reflects light emitted from the resin layer. According to paragraph 4,
The light reflection member is a lighting device for a vehicle tail light that re-reflects light emitted from the resin layer. According to paragraph 4,
The light reflection member is a lighting device for a vehicle tail light that reflects or re-reflects light emitted from the plurality of light sources. According to paragraph 4,
A lighting device for a vehicle taillight including an indirect light-emitting air gap formed between a side of the resin layer and the light reflection member. According to clause 8,
A lighting device for a vehicle taillight wherein the thickness of the indirect light-emitting air gap is greater than 0 and less than or equal to 20 mm. According to paragraph 4,
A lighting device for a vehicle taillight, wherein the light reflection member is larger than the height of the resin layer. According to paragraph 4,
A lighting device for a vehicle taillight, wherein the light reflection member is disposed to face a side of the substrate. According to any one of claims 1 to 3,
A lighting device for a vehicle taillight further comprising a reflection unit disposed between the resin layer and the substrate. According to any one of claims 1 to 3,
A lighting device for a vehicle taillight, wherein the plurality of optical patterns include a light-shielding pattern that blocks a portion of light emitted from the plurality of light sources. According to any one of claims 1 to 3,
A lighting device for a vehicle taillight, wherein the plurality of optical patterns include areas where density decreases as the distance from the light source increases. According to any one of claims 1 to 3,
A lighting device for a vehicle taillight, wherein the plurality of optical patterns include a plurality of patterns overlapped in the thickness direction of the resin layer. According to clause 15,
A lighting device for a vehicle taillight, wherein the plurality of overlapping patterns include a diffusion pattern and a light blocking pattern. According to clause 15,
The plurality of overlapping patterns include a first diffusion pattern, a second diffusion pattern, and a light-shielding pattern disposed between the first diffusion pattern and the second diffusion pattern. According to any one of claims 1 to 3,
A lighting device for a vehicle taillight, wherein the plurality of optical patterns include light-shielding ink. According to any one of claims 1 to 3,
The adhesive layer is a lighting device for a vehicle tail light including a first region disposed between the plurality of optical patterns and the first optical sheet. According to clause 19,
A lighting device for a vehicle tail light in which the thickness of the plurality of optical patterns is greater than the thickness of the first region of the adhesive layer. According to clause 19,
The adhesive layer includes a second region that does not overlap the plurality of optical patterns in the thickness direction of the resin layer,
A lighting device for a vehicle tail light, wherein the thickness of the first region of the adhesive layer is different from the thickness of the second region. According to any one of claims 1 to 3,
A lighting device for a vehicle taillight including an air gap disposed around the plurality of optical patterns to separate the adhesive layer from the optical patterns. According to clause 22,
A lighting device for a vehicle tail light, wherein the air gap is plural, and at least one of the plurality of air gaps has a different size. According to any one of claims 1 to 3,
The substrate includes a plurality of holes,
A lighting device for a vehicle taillight, wherein the heat dissipation member covers the plurality of holes. According to clause 24,
The plurality of holes include a second hole exposing the resin layer,
A lighting device for a vehicle taillight, wherein the shape of the second hole includes at least one of polygonal, circular, and oval shapes. Board;
a heat dissipation member disposed below the substrate;
a plurality of light sources disposed on the substrate;
a resin layer disposed on the substrate and covering the plurality of light sources;
An optical pattern layer disposed on the resin layer;
A diffusion plate including an upper surface portion disposed on the optical pattern layer; and
It includes an indirect light emitting part disposed on one side of the resin layer,
The plurality of light sources are side light-emitting devices that emit red light toward the side of the resin layer,
The optical pattern layer includes a first optical sheet disposed on the resin layer, a second optical sheet disposed on the first optical sheet, and a plurality of optical patterns disposed between the first optical sheet and the second optical sheet. and an adhesive layer,
Includes an area where the spacing between two neighboring light sources among the plurality of light sources is different,
It includes a first air gap disposed between the upper surface of the diffusion plate and the resin layer,
A rear light for a vehicle including an uneven pattern formed on one or both sides of the diffusion plate. According to clause 26,
A rear light for a vehicle wherein the thickness of the first air gap is greater than 0 and less than or equal to 30 mm. According to clause 26,
A rear light for a vehicle wherein the distance between the plurality of light sources is 8mm to 30mm. According to clause 26,
Among the plurality of light sources, an interval between two neighboring light sources disposed on the outermost side in the longitudinal direction of the substrate is smaller than an interval between two neighboring light sources disposed at the center of the substrate. According to any one of claims 26 to 29,
The indirect light emitting unit is a rear light for a vehicle including a light reflection member disposed on a side of the resin layer. According to clause 30,
It includes an indirect light-emitting air gap formed between the side of the resin layer and the light reflecting member,
A rear light for a vehicle in which the thickness of the indirect light-emitting air gap is greater than 0 and less than or equal to 20 mm. According to clause 30,
The light reflection member is a rear light for a vehicle whose height is greater than the height of the resin layer. According to clause 30,
The light reflection member is a rear light for a vehicle disposed to face a side of the substrate. According to any one of claims 26 to 29,
A rear light for a vehicle further comprising a reflection unit disposed between the resin layer and the substrate. According to any one of claims 26 to 29,
The plurality of optical patterns include a light-shielding pattern that blocks a portion of light emitted from the plurality of light sources. According to any one of claims 26 to 29,
The plurality of optical patterns include areas where density decreases as the distance from the light source increases. According to any one of claims 26 to 29,
The plurality of optical patterns include a plurality of patterns overlapped in the thickness direction of the resin layer. According to clause 37,
A rear light for a vehicle wherein the plurality of overlapping patterns include a diffusion pattern and a light blocking pattern. According to clause 37,
The plurality of overlapping patterns include a first diffusion pattern, a second diffusion pattern, and a light-shielding pattern disposed between the first diffusion pattern and the second diffusion pattern. According to any one of claims 26 to 29,
A rear light for a vehicle wherein the plurality of optical patterns include light-shielding ink. According to any one of claims 26 to 29,
The adhesive layer includes a first region disposed between the plurality of optical patterns and the first optical sheet. According to clause 31,
A rear light for a vehicle in which the thickness of the plurality of optical patterns is greater than the thickness of the first region of the adhesive layer. According to clause 41,
The adhesive layer includes a second region that does not overlap the plurality of optical patterns in the thickness direction of the resin layer,
A rear light for a vehicle wherein the thickness of the first region of the adhesive layer is different from the thickness of the second region. According to any one of claims 26 to 29,
A rear light for a vehicle including an air gap disposed around the plurality of optical patterns to separate the adhesive layer from the optical patterns. According to any one of claims 26 to 29,
A rear light for a vehicle including an air gap disposed around the plurality of optical patterns to separate the adhesive layer from the optical patterns. According to clause 45,
A rear light for a vehicle having a plurality of air gaps, and at least one of the plurality of air gaps having a different size.