KR102281067B1 - Illuminating device - Google Patents

Abstract

The present invention relates to a lighting device, at least one light source disposed on a printed circuit board, a resin layer disposed on the printed circuit board to embed the light source, and a resin layer disposed between the printed circuit board and the resin layer, a light source module including a reflective unit having an air region; an indirect light emitting unit formed on at least one of one side and the other side of the light source module and reflecting the light irradiated from the light source; a diffusion plate having an upper surface formed on the light source module and a sidewall integrally formed with the upper surface and extending in a downward direction to closely contact an outer surface of the indirect light emitting part; Including, providing a lighting device having a structure in which a first air gap is formed between the light source module and the upper surface of the diffusion plate to secure the flexibility of the product itself, and to improve luminance while implementing indirect light emission using a flare effect will have an effect.

Description

lighting device {ILLUMINATING DEVICE}

The present invention relates to the field of lighting equipment.

LED (Light Emitting Diode) device is a device that converts an electric signal into infrared or light by using compound semiconductor characteristics. Unlike fluorescent lamps, it does not use harmful substances such as mercury, so there are fewer causes of environmental stigma and compared to conventional light sources. It has the advantage of long life. In addition, compared to the conventional light source, it consumes low power, has excellent visibility due to a high color temperature, and has less glare.

Therefore, the current lighting device is developing from a conventional light source such as an incandescent light bulb or a fluorescent lamp to a form using the above-described LED element as a light source, and in particular, as disclosed in Korean Patent Application Laid-Open No. 10-2012-0009209, a light guide plate A lighting device that performs a surface light emitting function is provided by using the .

The above-described conventional lighting device has a structure in which a flat light guide plate is disposed on a substrate, and a plurality of side-type LEDs are disposed in an array form on a side surface of the light guide plate. Here, the light guide plate is a kind of plastic molded lens that functions to supply uniform light to the light emitted from the LED. Therefore, although such a light guide plate is used as an essential component in a conventional lighting device. Due to the thickness of the light guide plate itself, there is a limit to reducing the thickness of the entire product, and since the material of the light guide plate itself does not have flexibility, it is difficult to apply it to the curved part. had contained

In addition, as some light is emitted to the side of the light guide plate, there is a problem that light efficiency is lowered due to light loss, and the characteristics of the LED (e.g., luminance and wavelength change) are changed according to the increase in the temperature of the LED during light emission. It also had problems.

Laid-Open Patent Publication No. 10-2012-0009209

The present invention has been proposed to solve the above problems, and it is possible to reduce the thickness, improve the degree of freedom in product design, improve heat dissipation efficiency, and provide a lighting device capable of suppressing wavelength shift and reduction in luminous intensity. for that purpose

Another object of the present invention is to maximize the luminance improvement of a lighting device without adding a light source by improving light reflectance by forming a reflection unit having an air region on a printed circuit board.

In addition, an object of the present invention is to differentiate the design of a lighting device without adding a separate light source by implementing an indirect light emitting unit using lossy light.

The lighting device of the present invention for solving the above-described problems includes at least one light source disposed on a printed circuit board and a resin layer disposed on the printed circuit board to embed the light source, and the printed circuit board and the resin layer a light source module formed between and including a reflective unit having an air region therein; an indirect light emitting unit formed on at least one of one side and the other side of the light source module and reflecting the light irradiated from the light source; a diffusion plate having an upper surface formed on the light source module and a sidewall integrally formed with the upper surface and extending in a downward direction to closely contact an outer surface of the indirect light emitting part; Including, a first air gap may be formed between the light source module and the upper surface of the diffusion plate.

In the lighting device of the present invention, the printed circuit board may be formed of a flexible printed circuit board.

In the lighting device of the present invention, the thickness of the first air gap may be formed in a range of greater than 0 and less than or equal to 30 mm.

In the lighting device of the present invention, the reflective unit includes: a first reflective sheet in close contact with the surface of the printed circuit board; a second reflective sheet of a transparent material spaced apart from the first reflective sheet to form the air region; may include.

In the lighting device of the present invention, the reflective unit may further include a spacer member formed between the first reflective sheet and the second reflective sheet to space the first reflective sheet and the second reflective sheet apart. there is.

In the lighting device of the present invention, the spacer member may include at least one unit spacer member having a cavity formed therein and made of an adhesive material forming the first air unit.

In the lighting device of the present invention, the spacer member may be formed of at least one of a thermosetting PSA, a thermosetting adhesive, and a UV curing PSA type material.

In the lighting device of the present invention, a plurality of unit spacer members may be disposed to be spaced apart from each other in the spacer member, and a second air unit may be formed in a space spaced apart from each other in the unit spacer member.

In the lighting device of the present invention, the first reflective sheet may include a first substrate laminated on the base substrate and a metal layer laminated on the first substrate.

In the lighting device of the present invention, the first reflective sheet may be made of white polyethylene terephthalate (PET) or Ag film.

In the lighting device of the present invention, the reflection unit may further include a reflection pattern formed on the surface of the second reflection sheet.

In the lighting device of the present invention, the reflection pattern may _{include any one of TiO 2} , CaCO ₃ , BaSO ₄ , Al ₂ O ₃ , Silicon, and PS (Polystyrene).

In the lighting device of the present invention, the indirect light emitting unit, a light reflection member formed on at least one of the light source module one side and the other side; an indirect light-emitting air gap formed between the light source module and the light reflecting member; may include.

In the lighting device of the present invention, the light reflection member may be formed on an inner surface of a side wall of the diffusion plate.

In the lighting device of the present invention, the thickness of the indirect light emitting air gap may be formed in a range greater than 0 and less than or equal to 20 mm.

In the lighting device of the present invention, the light reflection member may be formed to include a white pigment or a metal.

In the lighting device of the present invention, the resin layer is urethane acrylate, epoxy acrylate, polyester acrylate, polyether acrylate, polybutadiene acrylic It may be made of an ultraviolet curable resin including at least one of polybutadiene acrylate and silicone acrylate.

In the lighting device of the present invention, the resin layer may be made of a thermosetting resin including at least one of a polyester polyol resin, an acrylic polyol resin, a hydrocarbon-based solvent or an ester-based solvent. .

In the lighting device of the present invention, the resin layer is, silicon (silicon), silica (silica), glass bubble (glass bubble), PMMA, urethane (urethane), Zn, Zr, Al ₂ O ₃ , acryl (acryl) A diffusion material for diffusing light composed of at least one selected from among may be further included.

In the lighting device of the present invention, the refractive index of the resin layer may be formed in the range of 1.4 to 1.8.

In the lighting device of the present invention, the thickness of the diffusion plate may be formed in a range of 0.5 to 5 mm.

In the lighting device of the present invention, the light source module may further include a first optical sheet formed on the resin layer and dispersing light emitted from the resin layer.

In the lighting device of the present invention, the light source module may further include an optical pattern that is formed on the first optical sheet and blocks or reflects light emitted from the resin layer.

In the lighting device of the present invention, the light source module may further include a second optical sheet disposed on the first optical sheet.

In the lighting device of the present invention, the light source module may further include an adhesive layer formed between the first optical sheet and the second optical sheet, and an air gap may be further formed in the adhesive layer.

In the lighting device of the present invention, the light source may be formed of a side view type light emitting device package.

In the lighting device of the present invention, the light source comprises: a package body having a cavity; a first lead frame including one end exposed to the cavity and the other end penetrating through the package body and exposed to one surface of the package body; a second lead frame including one end exposed to one side of the one surface of the package body, the other end exposed to the other side of the one surface of the package body, and a middle portion exposed to the cavity; The light source package may include a first semiconductor layer, an active layer, a second semiconductor layer, and at least one light emitting chip disposed on the first lead frame.

In the lighting device of the present invention, the middle portion of the second lead frame may electrically connect the one end and the other end of the second lead frame to each other.

In the lighting device of the present invention, the first lead frame, the first upper surface portion exposed to the cavity; and a first side portion bent from a first side portion of the first upper surface portion and exposed to the one surface of the package body.

In the lighting device of the present invention, one or more first through holes may be formed in at least one of the first upper surface portion and the first side surface portion.

In the lighting device of the present invention, the first lead frame may include at least one first through hole formed adjacent to a boundary portion between the first upper surface portion and the first side portion.

In the lighting device of the present invention, a portion of the package body may be filled in the at least one first through hole.

In the lighting device of the present invention, the first lead frame includes connection parts connecting the first upper surface part and the first side part to each other, and the first through hole is located between the connection parts, and the connection part The length of at least one of them may be different from the others.

In the lighting device of the present invention, the at least one light emitting chip may be disposed on the first upper surface portion.

In the lighting device of the present invention, the length of the first connection portion aligned with the light emitting chip among the connection portions in the first direction is greater than the length of the second connection portion not aligned with the light emitting chip in the first direction, The first direction may be an x-axis direction in an xyz coordinate system.

In the lighting device of the present invention, a second through hole having a smaller diameter than the first through hole may be formed in at least one of the connection parts.

In the lighting device of the present invention, the second lead frame, disposed around at least one side of the first upper surface portion, the second upper surface portion exposed to the cavity of the package body; and a second side portion bent from the second upper surface portion and exposed to each of the one side and the other side of the one surface of the package body.

In the lighting device of the present invention, at least one groove portion may be provided on the second side portion of the first upper surface portion, and the first side portion and the second side portion of the first upper surface portion may be opposite sides.

In the lighting device of the present invention, at least one protrusion corresponding to the groove portion may be formed on the second upper surface portion.

In the lighting device of the present invention, the second upper surface portion may include first to third portions disposed corresponding to the remaining side portions except for the first side portion of the first upper surface portion.

In the lighting device of the present invention, the second side portion, the first portion bent from the first portion of the second upper surface portion; and a second portion bent from the third portion of the second upper surface portion, wherein the first portion and the second portion may be symmetrical with respect to the first side portion.

In the lighting device of the present invention, the first side portion may be divided into an upper end including the connection parts, and a lower end located below the upper end, and the lower end may protrude laterally from the upper end.

In the lighting device of the present invention, the ratio of the length of the second connection portion to the length of the first connection portion in the first direction may be 1: 1.2 to 1.8.

In the lighting device of the present invention, a ratio of a length of the first through hole in a first direction to a length of the upper end of the first side portion in the first direction is 1:3.8 to 6.3, and the first direction is in the xyz coordinate system. It may be in the x-axis direction.

In the lighting device of the present invention, the length of the first through hole in the second direction may be 0.19 mm to 0.29 mm.

In the lighting device of the present invention, the light emitting chip includes: a first electrode layer disposed on the first semiconductor layer; a reflective layer disposed under the second semiconductor layer; and a second electrode layer disposed under the reflective layer.

In the lighting device of the present invention, the light emitting chip may be a device that emits red light having a wavelength range of 600 nm to 690 nm.

In the lighting device of the present invention, the light source module is disposed on the flexible printed circuit board, and may further include at least one connector for electrical connection to the outside.

In the lighting device of the present invention, the flexible printed circuit board may further include a fastening fixing unit for fastening to the outside.

According to the present invention, by having an indirect light emitting unit including a light reflecting member, it is possible to implement various lighting effects using a flare phenomenon and to implement lighting of various designs.

In addition, according to the present invention, a lighting effect is implemented using the light emitted to the side of the resin layer, and there is an advantage that a double lighting effect can be implemented without adding a separate light source.

And according to the present invention, the reflective unit having an air region on the surface of the printed circuit board is provided to maximize the luminance improvement along with the improvement of the light reflectivity, and the effect of increasing the luminance without increasing the thickness of the lighting device or the number of light sources and the air Due to the pattern design of the spacer (spacer) forming the area, there is an effect of maximizing the light control and reflection effect.

In addition, according to the present invention, by removing the light guide plate and guiding light using the resin layer, the number of light emitting device packages can be reduced and the overall thickness of the lighting device can be reduced.

And, according to the present invention, the resin layer can be formed of a high heat-resistance resin, which has the effect of implementing stable luminance despite the heat generated from the light emitting device package and providing a reliable lighting device.

In addition, according to the present invention, it is possible to secure flexibility by forming the lighting device using the flexible printed circuit board and the resin layer, thereby increasing the degree of freedom in product design.

And according to the present invention, since the diffusion plate itself surrounds the side surface of the light source module, the diffusion plate itself can simultaneously perform the housing function, thereby improving the efficiency of the manufacturing process by not using a separate structure and improving the product itself. It has the effect of improving durability and reliability. In addition, according to the present invention, it is possible to improve the heat dissipation efficiency, it is possible to suppress the wavelength shift and the decrease in light intensity.

1 shows a lighting device according to an embodiment of the present invention.
FIG. 2 shows a first embodiment of the light source module shown in FIG. 1 .
3 and 4 show an embodiment of a spacer member constituting the reflective unit described above in FIG. 2 .
5 to 19 show second to sixteenth embodiments of the light source module shown in FIG. 1 .
FIG. 20 shows an embodiment of the reflection pattern shown in FIG. 1 .
21 is a plan view of a seventeenth embodiment of the light source module shown in FIG. 1 .
22 is a cross-sectional view taken along the AA′ direction of the light source module shown in FIG. 21 .
23 is a cross-sectional view of the light source module shown in FIG. 21 in the BB' direction.
24 is a cross-sectional view of the light source module shown in FIG. 21 in a direction CC'.
25 shows a vehicle head lamp according to an embodiment of the present invention.
26 is a perspective view of a light emitting device package according to an embodiment of the present invention.
27 is a top view of a light emitting device package according to an embodiment of the present invention.
28 is a front view of a light emitting device package according to an embodiment of the present invention.
29 is a side view of a light emitting device package according to an embodiment of the present invention.
30 is a perspective view of the first lead frame and the second lead frame shown in FIG. 26 .
31 is a view for explaining the dimensions of each part of the first lead frame and the second lead frame shown in FIG.
FIG. 32 shows an enlarged view of the connecting parts shown in FIG. 31 .
33 to 38 show modified examples of the first lead frame and the second lead frame.
39 is a perspective view of a light emitting device package according to another embodiment of the present invention.
FIG. 40 is a top view of the light emitting device package shown in FIG. 39 .
41 is a front view of the light emitting device package shown in FIG. 39 .
42 is a cross-sectional view in the cd direction of the light emitting device package shown in FIG. 39 .
FIG. 43 shows the first lead frame and the second lead frame shown in FIG. 39 .
44 shows a measurement temperature of a light emitting device package according to an embodiment of the present invention.
45 shows an embodiment of the light emitting chip shown in FIG. 26 .
46 shows a lighting device according to another embodiment.
47 shows a general vehicle head lamp as a point light source.
48 shows a tail light for a vehicle according to an embodiment of the present invention.
49 shows a typical vehicle tail light.
50a and 50b show the light emitting device package spacing of the light source module used in the vehicle tail light according to the embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, a preferred embodiment in which a person of ordinary skill in the art to which the present invention pertains can easily practice the present invention will be described in detail. However, it should be understood that the embodiments described in this specification and the configurations shown in the drawings are only a preferred embodiment of the present invention, and there may be various equivalents and modifications that can be substituted for them at the time of the present application. In addition, when it is determined that a detailed description of a related well-known function or configuration may unnecessarily obscure the gist of the present invention in describing the operating principle of the preferred embodiment of the present invention in detail, the detailed description thereof will be omitted. The terms described below are terms defined in consideration of functions in the present invention, and the meaning of each term should be interpreted based on the content throughout this specification. The same reference numerals are used throughout the drawings to refer to parts having similar functions and functions.

The present invention relates to a lighting device, wherein the light guide plate is removed, and the resin layer is replaced with a resin layer, but by forming an indirect light emitting part on the side of the resin layer, various lighting effects are realized using the light leakage effect, and the overall thickness of the lighting device is reduced. An object of the present invention is to provide a lighting device structure capable of innovatively reducing, securing flexibility, and reducing the number of light sources.

In addition, the lighting device according to the present invention can be applied to various lamp devices required for lighting, such as a vehicle lamp, a home lighting device, and an industrial lighting device. For example, when applied to a vehicle lamp, it can be applied to a headlight, a vehicle interior lighting, a door scarf, a rear light, etc. Additionally, the lighting device of the present invention can be applied to the backlight unit field applied to the liquid crystal display, and in addition, it will be applicable to all lighting-related fields that have been developed and commercialized or that can be implemented according to future technological development.

Hereinafter, the light source module refers to the components excluding the diffuser plate and the indirect light emitting unit collectively referred to as one.

1 shows a lighting device 1 according to an embodiment of the present invention. Referring to FIG. 1 , the lighting device 1 includes a light source module 100 that is a surface light source, and may further include a housing 150 accommodating the light source module 100 .

The light source module 100 includes at least one light source 20 that generates light, and the light source 20 may be formed of a light emitting device package including a light emitting chip. The light source module 100 may implement a planar light source by diffusing and dispersing light generated from the light source 20, which is a point light source, and has flexibility and thus may be bent.

The housing 150 protects the light source module 100 from impact, and may be made of a material (eg, acrylic) through which light irradiated from the light source module 100 can be transmitted. In addition, the housing 150 may include a curved portion in terms of design, and since the light source module 100 has flexibility, it may be easily accommodated in the curved housing 150 . Of course, since the housing 150 itself has a certain flexibility, it is also possible that the assembly structure of the lighting device 1 as a whole has a certain flexibility.

FIG. 2 is a view showing a first embodiment 100-1 of the light source module shown in FIG. 1 , and more specifically, a cross-sectional view in the AB direction of the lighting device shown in FIG. 1 . 2, the light source module 100-1 is a flexible printed circuit board (Flexible Printed Circuit Board, 10), a light source 20, and a resin layer 40 performing the functions of a light guide plate (Light Guide Plate), A reflective unit 30 formed between the printed circuit board 10 and the resin layer 40 and penetrated by the light source 20 is included. In addition, an indirect light emitting part P is formed on at least one of one side and the other side of the resin layer 40 , and a diffusion plate 70 is formed on the above-described light source module 100 - 1 .

The printed circuit board 10 may be a printed circuit board using a flexible insulating substrate, that is, a flexible printed circuit board (10).

For example, the flexible printed circuit board 10 may include a base member (eg, 5) and circuit patterns (eg, 6, 7) disposed on at least one surface of the base member (eg, 5), and the base member (eg, , 5) may be a film having flexibility and insulation, for example, polyimide or epoxy (eg, FR-4).

More specifically, the flexible printed circuit board 10 includes an insulating film 5 (eg, polyimide or FR-4), a first copper foil pattern 6 , a second copper foil pattern 7 , and a via contact 8 . ) may be included. The first copper foil pattern 6 is formed on one surface (eg, the upper surface) of the insulating film 5 , and the second copper foil pattern 7 is formed on the other surface (eg, the lower surface) of the insulating film 5 , The first copper foil pattern 6 and the second copper foil pattern 7 may be connected through the via contact 8 formed through the film 5 .

Hereinafter, a case in which the printed circuit board 10 is made of the above-described flexible printed circuit board will be described as an example, and the terms printed circuit board and flexible printed circuit board are used interchangeably, but this is only an example, and in addition to various types of It will be said that the substrate can be used as the printed circuit board 10 of the present invention.

The light source 20 is arranged in one or more numbers on the flexible printed circuit board 10, and emits light. For example, the light source 20 may be a side view type light emitting device package arranged so that the emitted light travels in the direction 3 toward the side of the resin layer 40 . In this case, the light emitting chip mounted on the light emitting device package may be a vertical light emitting chip, for example, the red light emitting chip shown in FIG. 45 , but the embodiment is not limited thereto.

The resin layer 40 is disposed on the flexible printed circuit board 10 and the light source 20 so as to bury the light source 20 , and is emitted from the light source 20 in the lateral direction 3 of the resin layer 40 . Light may be diffused and guided in a direction toward one surface (eg, an upper surface) of the resin layer 40 .

The resin layer 40 may be made of a material capable of diffusing light, and the refractive index thereof may be formed in the range of 1.4 to 1.8, but is not limited thereto.

For example, the resin layer 40 may be made of a high heat-resistant UV-curing resin including an oligomer. In this case, the content of the oligomer may be 40 to 50 parts by weight. In addition, the UV curing resin may be urethane acrylate, but is not limited thereto. In addition, epoxy acrylate, polyester acrylate, polyether acrylate, At least one of polybutadiene acrylate and silicone acrylate may be used.

In particular, when using urethane acrylate as an oligomer, different physical properties can be simultaneously implemented by mixing and using two types of urethane acrylate.

For example, isocyanate is used in the process of synthesizing urethane acrylate, and the physical properties (yellowing property, weather resistance, chemical resistance, etc.) of urethane acrylate are determined by isocyanate. At this time, one type of urethane acrylate is implemented as Urethane Acrylate type-Isocyanate, and the NCO% of PDI (isophorone diisocyanate) or IPDI (isophorone diisocyanate) is realized to be 37% (hereafter 'first oligomer') ), another type of urethane acrylate is implemented as Urethane Acrylate type-Isocyanate, but the NCO% of PDI (isophorone diisocyanate) or IPDI (isophorone diisocyanate) is 30-50% or 25-35% Thus (hereinafter, 'second oligomer') may form an oligomer according to the embodiment. According to this, the first oligomer and the second oligomer having different physical properties can be obtained according to the NCO% control, and the oligomer constituting the resin layer 40 can be realized by mixing them. In this case, the weight ratio of the first oligomer in the oligomer may be in the range of 15 to 20, and the weight ratio of the second oligomer in the range of 25 to 35.

Meanwhile, the resin layer 40 may further include at least one of a monomer and a photo initiator. At this time, the content of the monomer may consist of 65 to 90 parts by weight, and more specifically, 35 to 45 parts by weight of isobornyl acrylate (IBOA), 10 to 15 parts by weight of 2-HEMA (2-Hydroxyethyl Methacrylate), and 2-Hydroxybutyl (2-HBA). Acrylate) may be composed of a mixture containing 15 to 20 parts by weight. In addition, in the case of a photoinitiator (eg, 1-hydroxycyclohexyl phenyl-ketone, Diphenyl), Diphwnyl (2,4,6-trimethylbenzoyl phosphine oxide, etc.) may be composed of 0.5 to 1 parts by weight.

In addition, the resin layer 40 may be made of a thermosetting resin having high heat resistance. Specifically, the resin layer 40 may be made of a thermosetting resin including at least one of a polyester polyol resin, an acrylic polyol resin, and a hydrocarbon-based and/or ester-based solvent. The thermosetting resin may further include a thermosetting agent to improve the strength of the coating film.

In the case of a polyester polyol resin, the content of the polyester polyol resin may be 9 to 30% based on the total weight of the thermosetting resin. In addition, in the case of an acrylic polyol (Acryl Polyol) resin, the content of the acrylic polyol may be 20 to 40% based on the total weight of the thermosetting resin.

In the case of a hydrocarbon-based or ester-based solvent, the content may be 30 to 70% based on the total weight of the thermosetting resin. In the case of the thermosetting agent, the content of the thermosetting resin may be 1 to 10% based on the total weight. When the resin layer 40 is formed of the material as described above, heat resistance is strengthened, and even when used in a lighting device that emits high-temperature heat, it is possible to minimize a decrease in luminance due to heat, thereby providing a highly reliable lighting device. there is.

In addition, according to the present invention, the thickness of the resin layer 40 can be innovatively reduced by using the material as described above for realizing the surface light source, and thus the overall product can be reduced in thickness. And, according to the present invention, the lighting device is formed using a flexible printed circuit board and a resin layer made of a flexible material, and it can be easily applied to a curved surface, thereby improving the degree of freedom in design, and also for other flexible displays. There are advantages to being able to apply and adapt.

The resin layer 40 may include a diffusion material 41 having a hollow (or void) formed therein, and the diffusion material 41 may be mixed or diffused with a resin constituting the resin layer 40, It may serve to improve the reflection and diffusion properties of light.

For example, light emitted from the light source 20 into the resin layer 40 is reflected and transmitted by the hollow of the diffusion material 41 so that the light is diffused and condensed in the resin layer 40, and the light is diffused and condensed. Light may be emitted to one surface (eg, an upper surface) of the resin layer 40 . At this time, the reflectance and diffusion rate of light are increased by the diffusing material 41, so that the amount and uniformity of the emitted light supplied to the upper surface of the resin layer 40 is improved, and as a result, the luminance of the light source module 100-1 is improved. can

The content of the diffusing material 41 may be appropriately adjusted to obtain a desired light diffusing effect. Specifically, it may be adjusted in the range of 0.01 to 0.3% based on the total weight of the resin layer 40, but is not limited thereto. The diffusion material 41 may be composed of any one selected from silicon, silica, glass bubble, PMMA, urethane, Zn, Zr, Al2O3, acryl, The particle diameter of the diffusion material 41 may be 1 μm to 20 μm, but is not limited thereto.

A reflective unit 30 is formed between the flexible printed circuit board 10 and the resin layer 40 , and a reflective pattern 31 may be further formed on the reflective unit 30 . The reflective unit 30 and the reflective pattern 31 serve to improve the reflectance of the light emitted from the light source 20 , and more detailed details will be described later with reference to FIGS. 3 and 4 .

An indirect light emitting part P may be formed on at least one of one side and the other side of the resin layer 40 . The indirect light emitting part P is a part that implements an additional light emitting part by using the loss light emitted to the side of the resin layer 40 among the light components irradiated from the light source 20 . As shown in FIG. 2 , the configuration of the indirect light emitting part P is formed between the light reflecting member 90 and the resin layer 40 side and the light reflecting member 90 formed on the side surface of the resin layer 40 . and an indirect light-emitting air gap 91 .

When the light emitted from the light source 20 is emitted through the side surface of the resin layer 40 , the light reflection member 90 reflects the emitted light to form reflected light (or indirect light). Accordingly, the light lost in the lighting device is re-reflected by the light reflecting member 90, causing a flare phenomenon or light spreading phenomenon in which the light is spread softly, and by using this, indoor and outdoor interiors and vehicles without additional light sources Various lighting effects applicable to lighting can be implemented.

The light reflecting member 90 may be made of a material having excellent light reflectance, for example, white resist, and additionally made of a synthetic resin containing a dispersed white pigment or a synthetic resin in which metal particles having excellent light reflection properties are dispersed. may be In this case, as the white pigment, titanium oxide, aluminum oxide, zinc oxide, lead carbonate, barium sulfate, calcium carbonate, etc. may be used, and when a metal powder is included, Ag powder having excellent reflectance may be included. In addition, it will be said that it is possible to further include a separate optical brightener. That is, the light reflection member 90 of the present invention may be formed using any material having excellent light reflectivity that is currently developed or can be implemented according to future technological development. On the other hand, the light reflective member 90 is directly molded and coupled to the inside of the sidewall 73 of the diffusion plate 70, attached through a separate adhesive material (eg, adhesive tape or thermosetting PSA), or the sidewall ( 73) It may be combined with the diffusion plate 70 by being directly printed on the inside.

In addition, although it is shown in the drawings that the light reflecting member 90 is formed over the entire inner surface of the sidewall 73 of the diffuser plate 70 , this is only an example and the formation range of the light reflecting member 90 is not limited. will say no

On the other hand, in order to maximize the flare phenomenon described above, an indirect light emitting air gap 91 may be formed between the light reflection member 90 and the resin layer 40, so that the light emitted to the side of the resin layer 40 is The indirect light emission is scattered in the air gap 91 due to the difference in refractive index, and the scattered light is re-reflected by the light reflection member 90 to maximize the flare phenomenon. The width of the indirect light-emitting air gap 91 may be formed in a range of greater than 0 and less than or equal to 20 mm, but is not limited thereto, and the design may be appropriately changed according to the specifications of the lighting device and the degree of indirect light to be implemented.

The diffusion plate 70 may be disposed on the upper portion of the light source module 100-1, more specifically, on the resin layer 40, and serves to uniformly diffuse the light emitted through the resin layer 40 over the entire surface. do The thickness of the diffuser plate 70 may be basically formed in the range of 0.5 to 5 mm, but is not limited thereto, and the design may be appropriately changed according to the specifications of the lighting device. In particular, the diffusion plate 70 of the present invention has a structure including an upper surface 71 and a side wall 73 integrally formed with the upper surface 71 as shown in FIG. 2 , wherein the side wall 73 is It surrounds the outer surface of the indirect light emitting part (P). The diffusion plate 70 may generally be formed of an acrylic resin, but is not limited thereto. In addition, polystyrene (PS), polymethyl methacrylate (PMMA), cyclic olefin copoly (COC), and polyethylene terephthalate (PET) ), a high-transmittance plastic such as resin, etc., may be made of a material capable of performing a light diffusion function.

A first air gap 80 may exist between the upper surface 71 of the diffusion plate 70 and the resin layer 40 . Due to the presence of the first air gap 80, a difference in refractive index with the resin layer 40 can be generated, and accordingly, the uniformity of the light supplied to the diffusion plate 70 can be increased, and as a result, the diffusion plate ( 70), it is possible to improve the uniformity (uniformity) of the light that is diffused and emitted. At this time, in order to minimize the deviation of the light passing through the resin layer 40 , the thickness of the first air gap 80 may be in the range of greater than 0 and within 30 mm, but is not limited thereto, and the design may be changed as necessary.

The sidewall 73 of the diffuser plate 70 surrounds the outer surface of the indirect light emitting part P, in particular, the outer surface of the light reflecting member 90, and the sidewall 73 is the light reflecting member 90 as described above. ) and serves as a support for supporting the light source module 100-1 and serves as a housing for protecting the light source module (100-1). That is, the diffusion plate 70 according to the present invention can serve as the housing 150 shown in FIG. 1 if necessary. According to this, the diffuser plate 70 itself covers not only the upper part of the light source module 100-1 but also the side part, so that the diffuser plate 70 itself can simultaneously perform the housing function, so that a separate structure is not used. Accordingly, it has the effect of improving the manufacturing process efficiency and the durability and reliability of the product itself.

3 shows an embodiment of the configuration of the reflective unit 30 and the spacer member constituting the reflective unit 30 among the lighting devices of the present invention described above in the description of FIG. 2 .

2 to 3 (a), the reflective unit 30 formed on the flexible printed circuit board (10 in FIG. 2) is provided with an air (air) area 36 therein, the air area ( 26) serves to maximize the luminance by enhancing the reflection efficiency of the light emitted from the light source (20 in FIG. 2).

In particular, the reflective unit 30 is spaced apart from the first reflective sheet 33 in close contact with the surface of the flexible printed circuit board (10 in FIG. 2 ) and the first reflective sheet 33 to form an air region 36 . It may be configured to include a second reflective sheet 35 of a transparent material. The first and second reflective sheets 33 and 35 are stacked on a flexible printed circuit board (10 in FIG. 2), and a light source (20 in FIG. 2) passes through a hole formed on the reflective unit 30 to the outside. will come out

The formation of the air region 36 may be formed by integrally pressing the first and second reflective sheets 33 and 35 without using a separate adhesive or the like, and furthermore, as shown in the drawing, It is also possible to implement an air region 36 in which air is accommodated through a spacer 37 such as a separate adhesive member between the first reflective sheet 33 and the second reflective sheet 35 .

The first reflective sheet 33 may be formed using a reflective material that reflects light, for example, a film in which a metal layer such as Ag is formed on a base substrate. Alternatively, it is also possible to implement the first reflective sheet 33 by using a synthetic resin dispersedly containing a white pigment, for example, white polyethylene terephthalate (PET), in order to realize the characteristics of promoting reflection and dispersion of light. At this time, as the white pigment, titanium oxide, aluminum oxide, zinc oxide, lead carbonate, barium sulfate, calcium carbonate, etc. can be used, and as the synthetic resin, polyethylene terephthalate, polyethylene naphthalate, acrylic resin, colicarbonate, polystyrene, polyolefin , cellulose acetate, weather-resistant vinyl chloride, etc. may be used, but is not limited thereto.

The second reflective sheet 35 may be implemented as a film of a transparent material, such as PET, so that the light emitted from the light source ( 20 in FIG. 2 ) is transmitted to the surface of the first reflective sheet 33 and reflected again.

Meanwhile, a reflective pattern 31 may be further formed on the second reflective sheet 33 to further promote the dispersion of light to improve luminance. The reflective pattern 31 is a configuration serving to scatter and disperse incident light, and a reflective ink including any one of TiO2, CaCo3, BaSo4, Al2O3, Silicon, and PS (Polystyrene) is applied to the second reflective sheet 35 . The above-described reflective pattern 31 may be formed by printing on the surface, but the present invention is not limited thereto.

The structure of the reflective pattern 31 may be a plurality of protruding patterns, and may be regular or irregular. The reflection pattern 31 may have a prism shape, a lenticular shape, a lens shape, or a combination shape thereof in order to increase the scattering effect of light, but is not limited thereto. In addition, although it is shown that the cross-sectional shape of the reflective pattern 31 is made of a quadrangle in FIGS. 2 and 3 (a), this is only an example, and in addition, the cross-sectional shape of the reflective pattern 31 is a triangle, a pentagon, etc. may be formed of a structure having various shapes, such as a polygonal, semicircular, and sine wave shape, and the shape viewed from the top of the reflection pattern 31 may be a polygonal (eg, hexagonal), circular, oval, or semicircular shape.

20 shows an embodiment of the reflective pattern 31 shown in FIGS. 2 and 3 (a). Referring to FIG. 20 , the reflective pattern 31 may have different diameters depending on the separation distance from the light source 20 . For example, the reflective pattern 31 may have a larger diameter as it is closer to the light source 20 . Specifically, the first reflective pattern 71 , the second reflective pattern 72 , the third reflective pattern 73 , and the fourth reflective pattern 74 may have a larger diameter in that order. However, the embodiment is not limited thereto, and it will be said that the reflection pattern 31 of the present invention can be formed in various configurations, such as a configuration that changes the density according to the distance from the light source, a configuration that changes both the size and the density, etc. .

Figure 3 (b) shows an embodiment of the spacer member constituting the reflection unit 30 described above in Figure 3 (a). The spacer member 37 according to the present invention performs only a general spacer function such as a spacer member for simply separating the first reflective sheet 33 and the second reflective sheet 35 or a spacer member having adhesive properties to form an air region 36 . It is also possible to implement, but more preferably, in order to increase the efficiency of the arrangement of the air region and the adhesion efficiency at the same time, the patterning structure shown in Fig. 3 (b) is uniformly and randomly formed in implementing the spacer member. can do.

The spacer member 37 shown in Fig. 3 (b) has a plurality of unit spacer members 37a in which a cavity portion is implemented, and has an empty structure inside the unit spacer member 37a. It can be implemented as a two-dimensional or three-dimensional structure in which the air unit 37b is implemented. In this case, the cross section of the unit spacing member 37a may be implemented in various shapes such as polygons, circles, ellipses, and the like. In particular, as shown, in addition to the structure in which a plurality of each unit spacer member 37a is arranged in close contact with each other, the first air part 37b inside the unit spacer member 37a is arranged in an irregular structure with each other. In addition, it is also possible to further form a second air portion (37c) consisting of an empty space between each unit spacer member (37a). According to this, the lighting device of the present invention including the above-described reflection unit 30 is provided with the reflection unit 30 having an air region to maximize the luminance improvement and the reflectivity of light, and the thickness of the lighting device or the number of light sources. Due to the effect of increasing the luminance without increase and the pattern design of the spacer (spacer) forming the air region, it has the effect of maximizing the light control and reflection effect.

FIG. 4 shows a specific embodiment of the reflection unit described above in FIG. 3 .

As described above, the reflection unit 30 according to the present invention includes a first reflective sheet 33 in close contact with the surface of the flexible printed circuit board, and a second reflective sheet spaced apart from the first reflective sheet 33 to face the second reflective sheet ( 35).

In particular, the second reflective sheet 35 may include a film made of a transparent material such as PET, and has a spacer 37 for separating the first and second reflective sheets 33 and 35 by patterning an adhesive material. Thus, an air region is formed.

In particular, in order to maximize the reflective efficiency, the first reflective sheet 33 includes a film 331 to which the metal reflective layer 38 is adhered through an adhesive (primer), and the film 331 is also on the release film 335. It may be implemented in a structure in which an adhesive material (PSA; 333) is laminated to the substrate. However, this is only an example, and the fact that the first reflective sheet 33 of the present invention can be implemented with white PET or the like is as described above in the description of FIG. 3 .

5 shows a second embodiment 100-2 of the light source module shown in FIG. The same reference numerals as in FIG. 2 denote the same configuration, and the content overlapping with the previously described content will be omitted or briefly described.

Referring to FIG. 5 , in order to improve heat dissipation efficiency, the second embodiment may have a structure further including the heat dissipation member 110 in the first embodiment 100 - 1 .

The heat dissipation member 110 is disposed on the lower surface of the flexible printed circuit board 10 , and serves to radiate heat generated from the light source 20 to the outside. That is, the heat dissipation member 110 may improve the efficiency of dissipating heat generated from the light source 20 , which is a heat source, to the outside.

For example, the heat dissipation member 110 may be disposed on a portion of the lower surface of the flexible printed circuit board 10 . The heat dissipation member 110 may include a plurality of heat dissipation layers (eg, 110 - 1 and 110 - 2 ) spaced apart from each other. At least a portion of the heat dissipation layers 110 - 1 and 110 - 2 may overlap the light source 20 in a vertical direction in order to improve a heat dissipation effect. Here, the vertical direction may be a direction from the flexible printed circuit board 10 to the resin layer 40 .

The heat dissipation member 110 may be made of a material having high thermal conductivity, for example, aluminum, an aluminum alloy, copper, or a copper alloy. Alternatively, the heat dissipation member 110 may be a Metal Core Printed Circuit Board (MCPCB). The heat dissipation member 110 may be attached to the lower surface of the flexible printed circuit board 10 by an acrylic adhesive (not shown).

In general, when the temperature of the light emitting device increases due to heat generated from the light emitting device, the luminous intensity of the light emitting device may decrease, and a wavelength shift of the generated light may occur. In particular, when the light emitting device is a red light emitting diode, the degree of wavelength shift and luminance decrease is severe.

However, the light source module 100-2 is provided with a heat dissipation member 110 on the lower surface of the flexible printed circuit board 10 to efficiently dissipate heat generated from the light source 20 to the outside, thereby suppressing the temperature rise of the light source and , thereby reducing the luminous intensity of the light source module 100 - 2 or suppressing the wavelength shift of the light source module 100 - 2 from occurring.

FIG. 6 shows a third embodiment 100-3 of the light source module shown in FIG. 1 . The same reference numerals as in FIG. 5 indicate the same configuration, and the content overlapping with the previously described content will be omitted or briefly described.

Referring to FIG. 6 , the light source module 100 - 3 may have a structure in which the first optical sheet 52 is added to the second embodiment.

The first optical sheet 52 is disposed on the resin layer 40 , and transmits light emitted from one surface (eg, an upper surface) of the resin layer 40 . The first optical sheet 52 may be formed using a material having excellent light transmittance, and for example, polyethylene telephthalate (PET) may be used.

On the other hand, when the first optical sheet 52 is formed, the first air gap 80 described above in the description of FIG. 2 is the upper surface 71 of the diffusion plate 70 and the first optical sheet 52 . ) can be formed between Due to the presence of the first air gap 80 , the uniformity of light supplied to the diffusion plate 70 can be increased, and as a result, the uniformity of light that is diffused and emitted through the diffusion plate 70 can be improved. It is the same as described above in the description of FIG. 2 .

In addition, although it is shown in the drawings that the light reflecting member 90 is formed over the entire inner surface of the sidewall 73 of the diffuser plate 70 , this is only an example and the formation range of the light reflecting member 90 is not limited. None is the same as described above in the description of FIG. 2 .

FIG. 7 shows a fourth embodiment 100-4 of the light source module shown in FIG. 1 .

Referring to FIG. 7 , the light source module 100 - 4 may have a structure in which an adhesive layer 56 , a light blocking pattern 60 , and a second optical sheet 54 are added to the third embodiment 100 - 3 . .

The second optical sheet 54 is disposed on the first optical sheet 52 . The second optical sheet 54 may be formed using a material having excellent light transmittance, and PET may be used as an example.

The adhesive layer 56 is disposed between the first optical sheet 52 and the second optical sheet 54 to attach the first optical sheet 52 and the second optical sheet 54 .

The optical pattern 60 may be disposed on at least one of an upper surface of the first optical sheet 52 or a lower surface of the second optical sheet 54 . The optical pattern 60 may be attached to at least one of the upper surface of the first optical sheet 52 or the lower surface of the second optical sheet 54 by the adhesive layer 56 . Another embodiment may further include one or more optical sheets (not shown) on the second optical sheet 56 . In this case, a structure including the first optical sheet 52 , the second optical sheet 54 , the adhesive layer 56 , and the optical pattern 60 may be defined as the optical pattern layer 50 .

The optical pattern 60 may be a light blocking pattern for preventing the concentration of light emitted from the light source 20 . The optical pattern 60 may be formed in such a way that it is aligned with the light source 20 and adhered to the first optical sheet 52 and the second optical sheet 54 by an adhesive layer 56 , or At least one of the first optical sheet 52 and the second optical sheet 54 may be formed by directly printing on the surface.

The first optical sheet 52 and the second optical sheet 54 may be formed using a material having excellent light transmittance, and PET may be used as an example.

The optical pattern 60 basically functions to prevent the light emitted from the light source 20 from being concentrated. That is, the optical pattern 60 together with the above-described reflective pattern 31 serves to implement uniform surface light emission.

The optical pattern 60 may be a blocking pattern that blocks a part of the light emitted from the light source 20 , and the light intensity is excessively strong, thereby preventing deterioration of optical properties or yellowish emission. For example, the optical pattern 60 may serve to prevent light from being concentrated in a region adjacent to the light source 20 and to disperse the light.

The optical pattern 60 may be formed by performing a printing process on the upper surface of the first optical sheet 52 or the lower surface of the second optical sheet 54 using light blocking ink. The optical pattern 60 may not have a function of completely blocking light, but may adjust the light blocking degree or diffusivity of light by adjusting the density and/or the size of the optical pattern so as to perform a function of partial light blocking and diffusion of light. For example, in order to improve light efficiency, the optical pattern 60 may be adjusted to decrease the density of the optical pattern as it moves away from the light source 20 , but is not limited thereto.

Specifically, the optical pattern 60 may be implemented as an overlapping printing structure of a complex pattern. The structure of overprinting refers to a structure implemented by forming one pattern and printing another pattern shape on the top.

For example, the optical pattern 60 may include a diffusion pattern and a light blocking pattern, and may have a structure in which the diffusion pattern and the light blocking pattern overlap. For example, TiO ₂ , CaCO _{3 ,} BaSO ₄ , Al ₂ O ₃ , Silicon, a polymer film (eg, a second optical sheet ( 54)), a diffusion pattern may be formed on the lower surface. In addition, a light blocking pattern may be formed on the surface of the polymer film by using a light blocking ink containing Al or a mixture of Al and TiO _{2 .}

That is, after forming a diffusion pattern by white printing on the surface of the polymer film, it is also possible to form a light-shielding pattern thereon, or to form a double structure in the reverse order. Of course, it will be obvious that the design of such a pattern can be variously modified in consideration of light efficiency, intensity, and light blocking rate.

Alternatively, in another embodiment, the optical pattern 60 may have a triple structure including a first diffusion pattern, a second diffusion pattern, and a light blocking pattern disposed therebetween. In such a triple structure, it is possible to select and implement the above-described materials. As an example, the first diffusion pattern may _{include TiO 2 having excellent refractive index, the second diffusion pattern may include CaCO 3} and TiO ₂ having excellent photostability and color, and the light blocking pattern includes Al having excellent hiding can do. Through the optical pattern of the triple structure, the embodiment can secure light efficiency and uniformity. In particular, CaCO ₃ can implement a function of finally realizing white light through a function of subtracting exposure to yellow light, so that light with more stable efficiency can be realized. _{In addition to CaCO 3} , diffusion materials used in diffusion patterns include BaSO ₄ , Al ₂ Inorganic materials having a large particle size and a similar structure, such as O _{3 and Silicon, may be used.}

The adhesive layer 56 may surround the periphery of the optical pattern 60 , and may fix the optical pattern 60 to at least one of the first optical sheet 52 and the second optical sheet 54 . In this case, the adhesive layer 56 may use a thermosetting PSA, a thermosetting adhesive, or a UV curing PSA type material, but is not limited thereto.

On the other hand, when the second optical sheet 54 is formed on the first optical sheet 52 , the first air gap 80 described above in the description of FIG. 2 is the upper surface ( 71 ) and the first optical sheet 52 . In this case, a description of the thickness of the first air gap 80 and its function is the same as described above in the description of FIG.

In addition, if the range including the side surface of the resin layer 40, the formation range of the light reflective member 90 is not limited as described above in the description of FIG. 2 .

FIG. 8 shows a fifth embodiment 100-5 of the light source module shown in FIG. 1 .

* Referring to FIG. 8 , the light source module 100 - 5 may have a structure in which a second air gap 81 is added to the fourth embodiment 100 - 4 . That is, the fifth embodiment 100 - 5 may include a second air gap 81 between the first optical sheet 52 and the second optical sheet 54 .

For example, the second air gap 81 may be formed in the adhesive layer 56 . The adhesive layer 56 forms a space (second air gap 81) around the optical pattern 60, and an adhesive material is applied to the other portions to form the first optical sheet 52 and the second optical sheet ( 54) can be implemented in a structure that mutually adheres.

The adhesive layer 56 may have a structure in which the second air gap 81 is positioned at the periphery of the optical pattern 60 . Alternatively, the adhesive layer 56 may have a structure in which the periphery of the optical pattern 60 is surrounded and the second air gap 81 is located in a portion other than the periphery. The adhesive structure of the first optical sheet 52 and the second optical sheet 54 may also implement a function of fixing the printed optical pattern 60 . A structure including the first optical sheet 52 , the second optical sheet 54 , the second air gap 81 , the adhesive layer 56 , and the optical pattern 60 may be defined as the optical pattern layer 50 . there is.

Since the second air gap 81 and the adhesive layer 56 have different refractive indices from each other, the second air gap 81 is formed for the diffusion of light traveling from the first optical sheet 52 to the second optical sheet 56 and dispersion can be improved. And because of this, the embodiment can implement a uniform surface light source.

9 shows a sixth embodiment 100-6 of the light source module shown in FIG. Referring to FIG. 9 , the light source module 100 - 6 may have a structure in which via holes 212 and 214 for improving heat dissipation are provided in the flexible printed circuit board 10 of the first embodiment.

The via holes 212 and 214 may pass through the flexible printed circuit board 110 and expose a portion of the light source 20 or a portion of the resin layer 40 . For example, the via holes 212 and 214 may include a first via hole 212 exposing a portion of the light source 20 and a second via hole 214 exposing a portion of a lower surface of the resin layer 40 .

Heat generated from the light source 20 , which is a heat source, may be directly radiated to the outside through the first via hole 212 , and the heat conducted from the light source 20 to the resin layer 40 may be transferred to the second via hole 214 . It can be emitted directly to the outside through The sixth embodiment may improve heat dissipation efficiency because heat generated from the light source 20 is radiated to the outside through the via holes 212 and 214 . The shapes of the first via hole 212 and the second via hole 214 may be various shapes such as polygonal, circular, and oval shapes.

FIG. 10 shows a seventh embodiment 100-7 of the light source module shown in FIG. 1 . Referring to FIG. 10 , the light source module 100 - 7 may have a structure in which the first optical sheet 52 is added to the sixth embodiment. In the seventh embodiment 100 - 7 , heat dissipation efficiency may be improved by the first and second via holes 212 and 214 . Descriptions of the components 30 , 31 , and 52 added in the present embodiment are the same as those described above in FIG. 6 , and thus will be omitted.

11 shows an eighth embodiment 100-8 of the light source module shown in FIG. Referring to FIG. 11 , the light source module 100 - 8 has a structure in which a second optical sheet 52 , an adhesive layer 56 , a light blocking pattern 60 , and a second optical sheet 54 are added to the seventh embodiment. can have Components 52, 54, 56, and 60 added in this embodiment are the same as those described above in FIG. 7, and thus will be omitted.

12 shows a ninth embodiment 100-9 of the light source module shown in FIG. 12 , the light source module 100 - 9 includes a second optical sheet 52 , an adhesive layer 56 , a light blocking pattern 60 , a second optical sheet 54 , and a second air in the seventh embodiment. It may have a structure in which a gap 81 is added. A second air gap 81 may exist between the first optical sheet 52 and the second optical sheet 54 of the tenth embodiment 100-10, and the second air gap 81 is shown in FIG. 8 . It may be the same as described.

FIG. 13 shows a tenth embodiment 100-10 of the light source module shown in FIG. 1 . The same reference numerals as in FIG. 1 indicate the same configuration, and the content overlapping with the previously described content will be omitted or briefly described.

Referring to FIG. 13 , unlike the heat dissipating member 110 of the second embodiment 100-2, the heat dissipating member 310 of the light source module 100-10 is disposed on the lower surface of the flexible printed circuit board 10 . The lower heat dissipation layer 310-1, and a portion of the lower heat dissipation layer 310-1 may have a penetrating portion 310-1 that penetrates the flexible printed circuit board 10 and contacts the light source 20.

For example, the through part 310-1 may contact the first side part 714 of the first lead frames 620 and 620' of the light emitting device packages 200-1 and 200-2 to be described later.

According to the tenth embodiment, since heat generated from the light source 20 is directly transferred to the heat dissipation member 310 by the through portion 310-1 and is discharged to the outside, heat dissipation efficiency may be improved.

FIG. 14 shows an eleventh embodiment 100-11 of the light source module shown in FIG. 1 . Referring to FIG. 14 , the light source module 100-11 may have a structure in which the first optical sheet 52 is added to the tenth embodiment, and the additional components 30 , 31 , and 52 are described with reference to FIG. 6 . It may be the same as the bar.

15 shows a twelfth embodiment 100-12 of the light source module shown in FIG. 1 . Referring to FIG. 13 , the light source module 100 - 12 includes a second optical sheet 52 , an adhesive layer 56 , a light blocking pattern 60 , and a second optical sheet 54 in the eleventh embodiment 100 - 11 . ) may be added. The added components 52 , 54 , 56 and 60 may be the same as described with reference to FIG. 7 .

FIG. 16 shows a thirteenth embodiment 100-13 of the light source module shown in FIG. 1 . Referring to FIG. 16 , the light source module 100-13 may have a structure in which a second air gap 81 is added to the twelfth embodiment 100-12. That is, a second air gap 81 may exist between the first optical sheet 52 and the second optical sheet 54 of the thirteenth embodiment 100-13, and the second air gap 81 is shown in FIG. 8 . may be the same as described above.

17 shows a fourteenth embodiment of the light source module shown in FIG. 1 , FIG. 18 shows a fifteenth embodiment of the light source module shown in FIG. 1 , and FIG. 19 shows a sixteenth embodiment of the light source module shown in FIG. 1 . shows an example.

The reflection unit 30-1, the second optical sheet 54-1, and the diffusion plate 70-1 shown in FIGS. 17 to 19 are the reflection units shown in FIGS. 8, 12, and 16 ( 30 ), the second optical sheet 54 , and the diffusion plate 70 may be modified examples.

Concavities and convexities R1 , R2 , and R3 may be formed on one or both surfaces of at least one of the reflection unit 30 - 1 , the second optical sheet 54 - 1 , and the diffusion plate 70 - 1 . The irregularities R1, R2, and R3 serve to reflect and diffuse the incident light so that the light emitted to the outside forms a geometric pattern.

For example, a first unevenness R1 may be formed on one surface (eg, an upper surface) of the reflection unit 30-1, and a second unevenness R2 may be formed on one surface (eg, an upper surface) of the second optical sheet 54-1. ) may be formed, and third irregularities R3 may be formed on one surface (eg, the lower surface) of the diffusion plate 70. These irregularities R1, R2, and R3 have a plurality of regular or irregular patterns. and a prism shape, a lenticular shape, a concave lens shape, a convex lens shape, or a combination shape thereof in order to increase light reflection and diffusion effects, but is not limited thereto.

In addition, the cross-sectional shape of the irregularities R1 , R2 , and R3 may have a structure having various shapes such as a triangle, a square, a semicircle, and a sine wave. In addition, the size or density of each pattern may be changed according to a distance from the light source 20 .

The irregularities R1, R2, and R3 may be formed by directly processing the reflection unit 30-1, the second optical sheet 54-1, and the diffusion plate 70, but there is no limitation thereto and a predetermined pattern is formed. It can be formed in any way that has been developed and commercialized, such as a method of attaching a film, or can be implemented according to future technological development.

In the embodiment, a geometric light pattern may be easily implemented through a combination of the patterns of the first to third irregularities R1, R2, and R3. In another embodiment, irregularities may be formed on one or both surfaces of the second optical sheet 52 .

However, the embodiment in which the unevenness R1, R2, or R3 is formed is not limited to FIGS. 17 to 19, and the reflection unit 30, the first optical sheet 52, and the second optical are included in other embodiments. At least one surface or both surfaces of the sheet 54 and the diffusion plate 70 may be provided with irregularities to increase the effect of reflecting and diffusing light.

21 is a plan view of a seventeenth embodiment 100-17 of the light source module shown in FIG. 1 , and FIG. 22 is a cross-sectional view taken in the AA′ direction of the light source module 100-17 shown in FIG. 23 is a cross-sectional view of the light source module 100-17 shown in FIG. 19 in the BB′ direction, and FIG. 24 is a cross-sectional view taken in the CC′ direction of the light source module 100-17 shown in FIG. 19 .

21 to 24 , the light source module 100-17 includes a plurality of sub-light source modules (101-1 to 101-n, where n>1 is a natural number), and a plurality of The sub light source modules 101-1 to 101-n may be separated from or combined with each other. Also, a plurality of combined sub light source modules 101-1 to 101-n may be electrically connected to each other. At this time, the diffusion plate 70 and the light reflection member 90 are formed by coupling the respective sub light source modules 101-1 to 101-n with each other and then the light reflection member 90 is formed on the side wall ( 73) It can be achieved by coupling the diffusion plate 70 formed inside.

Each of the sub light source modules 101-1 to 101-n includes at least one connector (eg, 510 , 520 , 530 ) that can be connected to the outside. For example, the first sub light source module 101-1 may include a first connector 510 including at least one terminal (eg, S1 and S2). The second sub light source module 101-2 includes a first connector 520 and a second connector 530 for connecting to the outside, respectively, and the first connector 520 includes at least one terminal (eg, P1, P1, P2), and the second connector 530 may include at least one terminal (eg, Q1 and Q2). In this case, the first terminals S1, P1, and Q1 may be positive (+) terminals, and the second terminals S2, P2, Q2 may be negative (-) terminals. 23 illustrates that each connector (eg, 510 , 520 , 530 ) includes two terminals, but the number of terminals is not limited thereto.

22 to 24 illustrate a structure in which a connector 510 , 520 , or 530 is added to the fifth embodiment 100-5, but is not limited thereto, and the sub light source modules 101-1 to 101- n) each of a connector (eg, 510, 520, or 530) and a connection fixing part (eg, 410-1, 420-1) to the light source module 100-1 to 100-20 according to any one of the above embodiments , 410-2) may be added.

22 and 23 , each of the sub light source modules 101-1 to 101-n includes a flexible printed circuit board 10 , a light source 20 , a reflection unit 30 , a reflection pattern 31 , and a resin. layer 40 , first optical sheet 52 , second optical sheet 54 , adhesive layer 56 , optical pattern 60 , heat dissipation member 110 , at least one connector 510 , 520 , or 530), and at least one connection fixing part 410, and 420. The same reference numerals as in FIG. 1 indicate the same configuration, and the content overlapping with the previously described content will be omitted or briefly described. Compared with other embodiments, each of the sub light source modules 101-1 to 101-n of the seventeenth embodiment may have a difference in size or the number of light sources, but the configuration is the same except for the connector and the connection fixing part. may be the same.

The first sub light source module 101-1 is electrically connected to the light source 20 and may include a first connector 510 provided on the flexible printed circuit board 10 for electrical connection to the outside. For example, the first connector 510 may be implemented in a patterned form on the flexible printed circuit board 10 .

In addition, the second sub light source module 101 - 2 may include a first connector 520 and a second connector 530 electrically connected to the light source 20 . The first connector 520 is provided on one side of the flexible printed circuit board 10 to electrically connect with the outside (eg, the first connector 510 of the first sub light source module 101-1), The second connector 530 may be provided on the other side of the flexible printed circuit board 10 in order to be electrically connected to another external (eg, a connector (not shown) of the third sub light source module 101-3 ).

The connection fixing units (eg, 410-1, 420-1, 410-2) are coupled to other external sub light source modules and serve to fix the two combined sub light source modules to each other. The connection fixing parts (eg, 410-1, 420-1, 410-2) are protrusions in which a part of the side surface of the resin layer 40 protrudes, or a groove in which a part of the side surface of the resin layer 40 is recessed. can be negative

Referring to FIG. 24 , the first sub light source module 101-1 may include a first connection fixing part 410-1 having a structure in which a part of the side surface of the resin layer 40 protrudes. In addition, the second sub light source module 101-2 has a structure in which the first connection fixing part 420-1 of a structure in which a part of the side of the resin layer 40 is recessed and the other part of the side of the resin layer 40 protrude. A second connection fixing part 410 - 2 may be included.

The first connection fixing part 410-1 of the first sub light source module 101-1 and the first connection fixing part 420-1 of the second sub light source module 101-2 are to be fixed by male and female coupling with each other. can

Although the embodiment shows that the connection fixing units (eg, 410-1, 420-1, 410-2) are implemented as a part of the resin layer 40, the present invention is not limited thereto, and a separate connection fixing unit may be provided. And, the connection fixing part is deformable in another form that can be connected.

The shape of the sub light source modules 101-1 to 101-n, where n>1 is a natural number, may have a shape in which a certain part protrudes, but is not limited thereto, and may be implemented in various shapes. For example, the shape of the sub light source modules 101-1 to 101-n, where n>1 is a natural number, viewed from above may be circular, elliptical, or polygonal, and some of them may protrude laterally.

For example, one end of the first sub light source module 101-1 may include a protrusion 540 in the center, and a first connector 510 may be provided on the flexible printed circuit board 10 corresponding to the protrusion 540 , , a first connection fixing part 410 - 1 may be provided on the resin layer 40 of the remaining portion of one end of the first sub light source module 101-1 other than the protrusion 540 .

In addition, one end of the second sub light source module 101-2 has a groove portion 545 in the center, and a first connector 520 may be provided on the flexible printed circuit board 10 corresponding to the groove portion 545, and the groove portion A first connection fixing part 420-1 may be provided on the resin layer 40 of the remaining part of one end of the second sub light source module 101-2 other than 545. And the other end of the second sub light source module 101-2 may include a protrusion 560 in the center, and a second connector 530 may be provided on the flexible printed circuit board 10 corresponding to the protrusion 560, A second connection fixing part 410 - 2 may be provided on the resin layer 40 of the remaining portion of one end of the second sub light source module 101 - 2 other than the protrusion 560 .

Each of the sub light source modules 101-1 to 101-n can be an independent light source by itself, can be variously deformed in shape, and two or more sub light source modules are assembled with each other by a connection fixing unit to become independent Since it can be used as a phosphorus light source, the embodiment can improve the degree of freedom in product design. Also, in the embodiment, when some of the assembled sub light source modules are damaged or damaged, only the damaged sub light source module can be replaced and used.

The above-described light source module may be used in a display device, an indicator device, and a lighting system requiring a surface light source. In particular, although lighting is required, the light source module according to the embodiment can be easily installed even in places where installation of lighting is not easy (eg, a curved ceiling or floor, etc.) because the part where the lighting is to be mounted has a curve. There is an advantage. For example, the lighting system may include a lamp or a street lamp, and the lamp may be a vehicle head lamp, but is not limited thereto.

25 shows a vehicle head lamp 900 - 1 according to an embodiment, and FIG. 47 shows a general vehicle head lamp that is a point light source. Referring to FIG. 25 , the vehicle head lamp 900 - 1 includes a light source module 910 and a light housing 920 .

The light source module 910 may be the above-described embodiments 100-1 to 100-17. The light housing 920 accommodates the light source module 910 and may be made of a light-transmitting material. The vehicle light housing 920 may include a curvature according to a vehicle part and design on which it is mounted. Meanwhile, as described above, the diffuser plate itself may serve as the vehicle light housing 920, and a separate vehicle light housing 920 may be provided in addition to the diffuser plate. Since the light source module 910 uses the flexible printed circuit board 10 and the resin layer 40, it can be easily mounted on the vehicle housing 920 having a curve because it has flexibility. In addition, since the light source modules 100-1 to 100-21 have a structure with improved heat dissipation efficiency, the vehicle head lamp 900-1 according to the embodiment can prevent a wavelength shift and a decrease in luminous intensity. In addition, as described above, since a separate light reflection member is formed on the side of the resin layer, there is an effect of reducing light loss and improving luminance compared to the same power.

Since the general vehicle head lamp shown in FIG. 47 is a point light source, a partial spot 930 may appear on the light emitting surface when light is emitted, but the vehicle head lamp 900 - 1 according to the embodiment is a surface light source. It is possible to realize uniform luminance and illuminance over the entire light emitting surface without generating spots.

26 is a perspective view of the light emitting device package 200-1 according to the first embodiment, FIG. 27 is a top view of the light emitting device package 200-1 according to the first embodiment, and FIG. 28 is the first A front view of the light emitting device package 200-1 according to the embodiment is shown, and FIG. 29 is a side view of the light emitting device package 200-1 according to the first embodiment.

The light emitting device package 200-1 shown in FIG. 26 may be a light emitting device package included in the light source modules 100-1 to 100-17 according to the above-described embodiments, but is not limited thereto.

26 to 29 , the light emitting device package 200 - 1 includes a package body 610 , a first lead frame 620 , a second lead frame 630 , a light emitting chip 640 , and a Zener diode 645 . ), and a wire 650-1.

The package body 610 may be formed of a substrate having good insulation or thermal conductivity, such as a silicon-based wafer level package, a silicon substrate, silicon carbide (SiC), aluminum nitride (AlN), etc., It may have a structure in which a plurality of substrates are stacked. However, the embodiment is not limited to the material, structure, and shape of the body described above.

For example, the length X1 of the package body 610 in the first direction (eg, the X-axis direction) is 5.95 mm to 6.05 mm, and the length Y1 in the second direction (eg, the Y-axis direction) is 1.35 mm to It can be 1.45mm. The length Y2 of the package body 610 in the third direction (eg, the Z-axis direction) may be 1.6 mm to 1.7 mm. For example, the first direction may be a direction parallel to the long side of the package body 610 .

The package body 610 has an open top and may have a cavity 601 composed of a sidewall 602 and a bottom 603 . The cavity 601 may be formed in a cup shape, a concave container shape, or the like, and the sidewall 602 of the cavity 601 may be perpendicular or inclined with respect to the bottom 603 . The shape of the cavity 601 viewed from above may be a circle, an ellipse, or a polygon (eg, a quadrangle). A corner portion of the polygonal cavity 601 may be curved. For example, the length X3 of the cavity 601 in the first direction (eg, the X-axis direction) is 4.15 mm to 4.25 mm, and the length X4 in the second direction (eg, the Y-axis direction) is 0.64 mm to 0.9 mm, and a depth (eg, a length in the Z-axis direction, Y3) of the cavity 601 may be 0.33 mm to 0.53 mm.

The first lead frame 620 and the second lead frame 630 may be disposed on the surface of the package body 610 to be electrically separated from each other in consideration of heat dissipation or mounting of the light emitting chip 640 . The light emitting chip 640 is electrically connected to the first lead frame 620 and the second lead frame 630 . The number of light emitting chips 640 may be one or more.

A reflective member (not shown) for reflecting the light emitted from the light emitting chip 640 in a predetermined direction may be provided on the sidewall of the cavity of the package body 610 .

The first lead frame 620 and the second lead frame 630 may be disposed to be spaced apart from each other in the upper surface of the package body 610 . A portion of the package body 610 (eg, the bottom 603 of the cavity 601) may be positioned between the first lead frame 620 and the second lead frame 630) to electrically separate the two.

The first lead frame 620 may include one end (eg, 712 ) exposed to the cavity 601 and the other end (eg, 714 ) penetrating through the package body 610 and exposed to one surface of the package body 610 . there is. In addition, the second lead frame 630 has one end (eg, 744-1) exposed to one side of one surface of the package body 610 and the other end (eg, 744-) exposed to the other side of one surface of the package body 610 . 2) and a middle portion (eg, 742-2) exposed to the cavity 601 .

The separation distance X2 between the first lead frame 620 and the second lead frame 630 may be 0.1 mm to 0.2 mm. The upper surface of the first lead frame 620 and the upper surface of the second lead frame 630 may be located on the same plane as the cavity 601, the bottom 603.

30 is a perspective view of the first lead frame 620 and the second lead frame 630 shown in FIG. 26, and FIG. 31 is an angle of the first lead frame 620 and the second lead frame shown in FIG. It is a view for explaining the dimensions of the part, and FIG. 32 is a connection of the first lead frame 620 adjacent to the boundary part 801 of the first upper surface part 712 and the first side part 714 shown in FIG. 31 . Shown are enlarged views of parts 732 , 734 , and 736 .

30 to 32 , the first lead frame 620 includes a first upper surface portion 712 and a first side portion 714 bent from the first side portion of the first upper surface portion 712 .

The first upper surface portion 712 is located on the same plane as the bottom of the cavity 601 , is exposed by the cavity 601 , and light emitting chips 642 and 644 may be disposed.

31 , both ends of the first upper surface portion 712 may have portions S3 protruding in the first direction (x-axis direction) with respect to the first side portion 714 . The protruding portion S3 of the first upper surface portion 712 may be a portion supporting the first lead frame in a lead frame array. A length of the protruding portion S3 of the first upper surface portion 712 in the first direction may be 0.4 mm to 0.5 mm. The length K of the first upper surface portion 712 in the first direction may be 3.45 mm to 3.55 mm, and the length J1 in the second direction may be 0.6 mm to 0.7 mm. The first direction may be an x-axis direction in the xyz coordinate system, and the second direction may be a y-axis direction.

The second side of the first upper surface portion 712 may have at least one groove portion 701 . In this case, the second side portion of the first upper surface portion 712 may face the first side portion of the first upper surface portion 712 . For example, the second side portion of the first upper surface portion 712 may have one groove portion 701 in the middle, but is not limited thereto, and the number of groove portions formed on the second side portion may be two or more. The groove portion 701 may have a shape corresponding to the protrusion portion 702 provided in the second lead frame 630 to be described later.

The groove 701 shown in FIG. 31 has a trapezoidal shape, but is not limited thereto, and may be implemented in various shapes such as a circle, a polygon, and an oval. The length S2 of the groove portion 701 in the first direction may be 1.15 mm to 1.25 mm, and the length S1 of the groove portion 701 in the second direction may be 0.4 mm to 0.5 mm.

Also, the angle θ1 between the bottom 701-1 and the side surface 701-2 of the groove 701 may be greater than or equal to 90° and less than 180°. The light emitting chips 642 and 644 may be disposed on the first upper surface portion 712 on both sides of the groove portion 701 .

The first side portion 714 may be bent at a predetermined angle downward from the first side portion of the first upper surface portion 712 , and the first side portion 714 may be exposed from one side of the package body 610 . . For example, an angle between the first upper surface portion 712 and the first side surface portion 714 may be greater than or equal to 90° and less than 180°.

The first lead frame 620 may have one or more through holes 720 in at least one of the first upper surface portion 712 and the first side portion 714 . For example, the first lead frame 620 may have one or more through-holes 720 adjacent to a boundary portion between the first upper surface portion 712 and the first side portion 714 . 28 shows two through-holes 722 and 724 spaced apart from each other adjacent to the boundary portion between the first upper surface portion 712 and the first side surface portion 714, but the embodiment is not limited thereto.

One or more through holes 720 may be formed in one region of each of the first upper surface portion 712 and the first side portion 714 adjacent to the boundary portion between the first upper surface portion 712 and the first side portion 714. there is. In this case, the through-hole (eg, 722-1) formed in one region of the first upper surface part 712 and the through-hole (eg, 722-2) formed in one region of the first side part 714 may be connected to each other. .

A portion of the package body 610 is filled in the through hole 720 , thereby improving the degree of coupling between the first lead frame 620 and the package body. Also, the through hole 720 serves to easily form a bend between the first upper surface portion 712 and the first side surface portion 714 . However, if the size of the through hole 720 is too large or the number of through holes 720 is too large, the first upper surface portion 712 and the first side portion 714 may be cut when the first lead frame 620 is bent. Therefore, the size and number of the through-holes 720 should be appropriately adjusted. In addition, since the size of the through hole 720 is also related to the size of the connection parts 732 , 734 , 736 to be described later, it is also related to heat dissipation of the light emitting device package.

An embodiment according to the size of each of the first lead frame 620 and the second lead frame 630 having a through-hole to be described below may provide optimal heat dissipation efficiency in consideration of the degree of coupling and ease of bending.

In order to improve coupling with the package body 610, to facilitate bending of the first lead frame 620, and to prevent damage during bending, the embodiment provides a first through hole 722 and a second through hole 724. ), the length D11 in the first direction of the first through hole 722 and the length D12 in the first direction of the second through hole 724 may be 0.58 mm to 0.68 mm, The length D2 in the second direction may be 0.19 mm to 0.29 mm. The area of the first through hole 722 may be the same as the area of the second through hole 724 , but is not limited thereto, and both may be different from each other.

32, the first lead frame 620 is located adjacent to the boundary portion 801 of the first upper surface portion 712 and the first side portion 714, spaced apart from each other by the through hole 720, Connection parts 732 , 734 , and 736 connecting the first upper surface part 712 and the first side part 714 to each other may be provided. For example, the connecting portions 732 , 734 , and 736 are the first portion 732-1 , 734-1 , or 736-1 corresponding to a portion of the first upper surface portion 712 , respectively, and the first side portion 714 . The second portion 732-2, 734-2, or 736-2 corresponding to a portion may be formed. A through hole 720 may be positioned between the respective connection parts 732 , 734 , and 736 .

The first lead frame 620 may have at least one connection portion positioned corresponding to or aligned with the light emitting chip 642 or 644 .

Specifically, the first lead frame 620 may include first to third connection portions 732 , 734 , and 736 . The first connecting portion 732 may be positioned corresponding to or aligned with the first light emitting chip 642 , and the second connecting portion 734 may be positioned correspondingly with or aligned with the second light emitting chip 644 . there is. And the third connection portion 736 may be located between the first connection portion 732 and the second connection portion 734, the first light emitting chip 642 or the second light emitting chip 644 is not aligned can be part For example, the third connection portion 736 may be positioned to correspond to or aligned with the groove portion 701 of the first lead frame 620 , but is not limited thereto.

The length C11 in the first direction of the first connection portion 732 and the length C2 in the first direction of the second connection portion 734 are the length E of the third connection portion 736 in the first direction can be larger For example, the length C11 in the first direction of the first connection portion 732 and the length C2 in the first direction of the second connection portion 734 may be 0.45 mm to 0.55 mm, and the third connection portion ( 736) may have a length E in the first direction of 0.3 mm to 0.4 mm. The reason for locating the third connecting portion 736 between the first through hole 722 and the second through hole 724 is to prevent breakage between the first upper surface portion 712 and the first side portion 714 during bending. it is for

A ratio of the length E in the first direction of the third connection portion 736 to the length C11 in the first direction of the first connection portion 732 may be 1:1.2 to 1.8. A ratio of the length D11 or D12 of the through hole 722 in the first direction to the length B1 of the upper end 714-1 of the first side part 714 in the first direction may be 1:3.8 to 6.3. .

Since the first connecting portion 732 is aligned with the first light emitting chip 642 and the second connecting portion 734 is aligned with the second light emitting chip 644 , the heat generated from the first light emitting chip 642 is The heat generated from the second light emitting chip 644 may be mainly emitted to the outside through the first connection portion 732 , and may be mainly discharged to the outside through the second connection portion 734 .

In the embodiment, since lengths C11 and C2 in the first direction of each of the first connection portion 732 and the second connection portion 734 are greater than the length E in the first direction of the third connection portion 736 , , an area of the first connecting portion 732 and the second connecting portion 734 is greater than an area of the third connecting portion 736 . Therefore, by making the area of the connection parts 732 and 734 disposed adjacent to the light source 20 wider, the embodiment increases the efficiency of dissipating heat generated from the first light emitting chip 642 and the second light emitting chip 644 to the outside. can be improved

The first side part 714 may be divided into an upper part 714-1 connected to the first upper surface part 712 and a lower part 714-2 connected to the upper part 714-1. That is, the upper end 714 - 1 may include a portion of the first to third connecting portions 732 , 734 , and 736 , and the lower end 714 - 2 may be located below the upper end 714 - 1 .

A length F1 of the upper end 714-1 in the third direction may be 0.6 mm to 0.7 mm, and a length F2 of the lower end 714-2 in the third direction may be 0.4 mm to 0.5 mm. The third direction may be a z-axis direction in the xyz coordinate system.

In order to improve the coupling with the package body 620 and airtightness for preventing moisture penetration, the side surface of the upper end 714-1 and the side surface of the lower end 714-2 may have a step difference. For example, both side ends of the lower end 714-2 may be protruded laterally with respect to the side of the upper end 714-1. The length B1 of the upper end part 714-1 in the first direction may be 2.56 mm to 2.66 mm, and the length B2 of the lower end part 714-2 in the first direction may be 2.7 mm to 3.7 mm. The thickness t1 of the first lead frame 620 may be 0.1 mm to 0.2 mm.

The second lead frame 630 may be disposed to wrap around at least one side of the first lead frame 620 . For example, the second lead frame 630 may be disposed around the other side portions other than the first side portion 714 of the first lead frame 630 .

The second lead frame 630 may include a second upper surface portion 742 and a second side portion 744 . The second upper surface portion 742 may be disposed to surround the periphery of the remaining side portions except for the first side portion of the first upper surface portion 712 . 26 and 30 , the second upper surface portion 742 may be positioned on the same plane as the bottom of the cavity 601 and the first upper surface portion 712 , and may be exposed by the cavity 601 . The thickness t2 of the second lead frame 630 may be 0.1 mm to 0.2 mm.

The second upper surface portion 742 includes a first portion 742-1, a second portion 742-2, and a third portion 742-3 according to a position surrounding the periphery of the first upper surface portion 712 . can be divided into The second portion 742 - 2 of the second upper surface portion 742 may correspond to or face the second side portion of the first upper surface portion 712 . The first portion 742-1 of the second upper surface portion 742 is connected to one end of the second portion 742-2, and may correspond to or face any one of the remaining side portions of the first upper surface portion 712 . can The third portion 742 - 3 of the second upper surface portion 742 is connected to the other end of the second portion 742 - 2 , and corresponds to or faces the other one of the remaining sides of the first upper surface portion 712 . can see.

The length H1 in the second direction of the first part 742-1 and the third part 742-3 may be 0.65 mm to 0.75 mm, and the length H2 in the first direction is 0.78 mm to 0.88 mm. can be A length I of the second portion 742 - 2 in the first direction may be 4.8 mm to 4.9 mm.

The second portion 742 - 2 of the second upper surface portion 742 may have a protrusion 702 corresponding to the groove portion 701 of the first upper surface portion 712 . For example, the shape of the protrusion 702 may match the shape of the groove 701 , and the protrusion 702 may be positioned to be aligned with the groove 701 . The protrusion 702 may be located in the groove 701 . The number of protrusions 702 may be the same as the number of grooves 701 . The protrusion 702 and the groove 701 are spaced apart from each other, and a portion of the package body 610 may be positioned therebetween. The protrusion 702 is an area for wire bonding with the first light emitting chip 642 and the second light emitting chip 644 , and is positioned between the first light emitting chip 642 and the second light emitting chip 644 . Wire bonding can be facilitated.

The length S5 in the first direction of the protrusion 702 may be 0.85 mm to 0.95 mm, the length S4 in the second direction may be 0.3 mm to 0.4 mm, and the protrusion 702 is formed by the second part ( 742-2) and the angle θ2 may be greater than or equal to 90° and less than 180°.

The second side portion 744 may be bent from at least one side of the second upper surface portion 742 . The second side portion 744 may be bent at a predetermined angle (eg, 90°) downward from the second upper surface portion 742 .

For example, the second side portion 744 may include a first portion 744-1 bent from one side of the first portion 742-1 of the second upper surface portion 742 and a third portion of the second upper surface portion 742 . A second portion 744-2 bent at one side of the portion 742-3 may be included.

The first portion 744 - 1 and the second portion 744 - 2 of the second side portion 744 may be bent to be positioned on the same side of the second lead frame 630 . The first part 744 - 1 of the second side part 744 may be spaced apart from the first side part 714 and may be located on one side (eg, the left side) of the first side part 714 . The second part 744 - 2 of the second side part 744 may be spaced apart from the first side part 714 and located on the other side (eg, the right side) of the first side part 714 . The first side part 714 and the second side part 744 may be positioned on the same plane. As a result, as shown in FIG. 26 , the first side part 714 and the second side part 744 may be exposed to the same side of the package body 610 . The length A of the second side portion 744 in the first direction may be 0.4 mm to 0.5 mm, and the length G in the third direction may be 1.05 mm to 1.15 mm.

One side of the first portion 742-1 and the third portion 742-3 of the second upper surface portion 742 may have a bent step g1. For example, the bent step g1 is a portion where one side of the first portion 742-1 of the second upper surface portion 742 and one side of the first portion 744-1 of the second side portion 744 meet. may be located adjacent to Since the area of the first upper surface portion 712 and the first side portion 714 positioned correspondingly to the bent step g1 can be designed to be wide, the embodiment can increase the heat generation area to improve heat generation efficiency. . This is because the area of the first lead frame 620 is related to the heat dissipation of the light emitting chips 642 and 644 .

The other side surfaces of the first portion 742-1 and the third portion 742-3 of the second upper surface portion 742 may have a bent step g2. The reason for forming the bent step g2 is to allow the bonding material (eg, solder) to be easily observed with the naked eye when the light emitting device package 200 - 1 is bonded to the flexible printed circuit board 10 . am.

The first side part 714 of the first lead frame 620 and the second side part 744 of the second lead frame 630 are flexible printed circuits of the light source modules 100-1 to 100-21 according to the embodiment. It may be mounted in contact with the substrate 10 , whereby the light emitting chip 640 may irradiate light in the direction 3 toward the side surface of the resin layer 40 . That is, the light emitting device package 200 - 1 may have a side view type structure.

The Zener diode 645 may be disposed on the second lead frame 630 to improve the withstand voltage of the light emitting device package 200 - 1 . For example, the Zener diode 645 may be disposed on the second upper surface portion 742 of the second lead frame 630 .

The first light emitting chip 642 may be electrically connected to the second lead frame 630 by a first wire 652 , and the second light emitting chip 644 is a second lead under the second wire 654 . It may be electrically connected to the frame 630 , and the Zener diode 645 may be electrically connected to the first lead frame 620 by a third wire 656 .

For example, one end of the first wire 652 may be connected to the first light emitting chip 642 , and the other end may be connected to the protrusion 702 . In addition, one end of the second wire 654 may be connected to the second light emitting chip 644 , and the other end may be connected to the protrusion 702 .

The light emitting device package 200 - 1 may further include a resin layer (not shown) filled in the cavity 601 to surround the light emitting chip. The resin layer may be made of a colorless and transparent polymer resin material such as epoxy or silicone.

The light emitting device package 200 - 1 may implement red light using only a red light emitting chip without using a phosphor, but the embodiment is not limited thereto. The resin layer may include a phosphor to change the wavelength of light emitted from the light emitting chip 640 . For example, even if a light emitting chip of a color other than red is used, a light emitting device package that emits light of a desired color by changing the wavelength of light using a phosphor may be implemented.

33 illustrates a first lead frame 620 - 1 and a second lead frame 630 according to another exemplary embodiment. The same reference numerals as in FIG. 28 indicate the same configuration, and the content overlapping with the previously described content will be omitted or briefly described.

Referring to FIG. 33 , the first lead frame 620 - 1 has a structure in which the third connection part 736 is removed from the first lead frame 620 shown in FIG. 30 . That is, the first lead frame 620-1 may have one through-hole 720-1 adjacent to the boundary portion between the first upper surface portion 712 and the first side surface portion 714'. In addition, the first connection part 732 may be positioned on one side of the through hole 720-1, and the second connection part 734 may be positioned on the other side of the through hole 720-1.

34 illustrates a first lead frame 620-2 and a second lead frame 630-1 according to another exemplary embodiment. The same reference numerals as in FIG. 30 denote the same configuration, and the content overlapping with the previously described content will be omitted or briefly described.

Referring to FIG. 34 , the first upper surface portion 712 ′ of the first lead frame 620-2 is a groove portion 701 in the first upper surface portion 712 of the first lead frame 620 shown in FIG. 30 . may be an omitted structure. And the second portion 742-2' of the second upper surface portion 742' of the second lead frame 630-1 is the second upper surface portion 742 of the second lead frame 630 shown in FIG. It may have a structure in which the protrusion 702 is omitted from the second portion 742-2 of the . Other than that, the remaining components may be the same as those described with reference to FIG. 28 .

35 illustrates a first lead frame 620 - 3 and a second lead frame 630 according to another exemplary embodiment. The same reference numerals as in FIG. 30 denote the same configuration, and the content overlapping with the previously described content will be omitted or briefly described.

Referring to FIG. 35 , the first lead frame 620-3 has a microscopic structure passing through the first lead frame 620 in at least one of the connecting portions 732, 734, and 736 of the first lead frame 620 shown in FIG. It may have a structure in which through holes h1, h2, and h3 are formed.

At least one of the connection parts 732-1, 734-1, and 736-1 of the first lead frame 620-3 has a fine through hole formed at the boundary between the first upper surface part 712 and the first side part 714 ( h1, h2, h3). In this case, the diameters of the fine through holes h1 , h2 , and h3 may be smaller than the lengths D11 and D12 in the first direction or the lengths D2 in the second direction of the through holes 722 and 724 . In addition, the number of fine through-holes h1 and h2 formed in the first connection part 732-1 and the second connection part 734-1 is determined by the number of fine through-holes (h1, h2) formed in the third connection part 736-1. h3) may be greater than the number, but is not limited thereto. In addition, the shape of the fine through-holes h1 , h2 , and h3 may be circular, elliptical, or polygonal. The fine through-holes h1 , h2 , and h3 may not only facilitate bending of the first lead frame 620 - 3 , but may also improve coupling force between the first lead frame 620 - 3 and the package body 610 .

36 illustrates a first lead frame 620 - 4 and a second lead frame 630 according to another exemplary embodiment. The same reference numerals as in FIG. 30 denote the same configuration, and the content overlapping with the previously described content will be omitted or briefly described.

Referring to FIG. 36 , the first lead frame 620 - 4 includes a first upper surface portion 712 ″ and a first side portion 714 ″. The first upper surface portion 712 ″ and the first side surface portion 714 ″ are modified examples of the first upper surface portion 712 and the first side surface portion 714 illustrated in FIG. 32 . That is, in the first lead frame 620-4, the through holes 722 and 724 are omitted in the first upper surface portion 712 and the first side portion 714 of the first lead frame 620 shown in FIG. 26, and the through holes are omitted. A structure in which a plurality of fine through-holes h4 spaced apart from each other are provided in one region Q2 of the boundary portion Q between the first upper surface portion 712 ″ and the first side surface portion 714 ″, in which 722 and 724 are omitted. am.

The boundary portion Q of the first upper surface portion 712 ″ and the first side portion 714 ″ may be divided into a first boundary region Q1 , a second boundary region Q2 , and a third boundary region Q3 . can The first boundary region Q1 may be a region corresponding to or aligned with the first light emitting chip 642 , and the second boundary region Q2 may be a region corresponding to or aligned with the first light emitting chip 642 . In addition, the third boundary area Q3 may be an area between the first boundary area Q1 and the second boundary area Q2 . For example, the first boundary area Q1 may correspond to the first connection portion 732 illustrated in FIG. 30 , and the second boundary area Q2 may be the second connection portion 734 illustrated in FIG. 30 . may be an area corresponding to .

The first boundary area Q1 and the second boundary area Q2 serve as passages for transferring heat generated from the first light emitting chip 642 and the second light emitting chip 644 , and include a plurality of fine through holes h4 . ) may serve to facilitate bending between the first upper surface portion 712 ″ and the first side surface portion 714 ″. Although it is illustrated in FIG. 36 that the plurality of fine through-holes h4 have the same diameter and the same separation distance, the embodiment is not limited thereto, and in another embodiment, at least one of the plurality of fine through-holes h4 is The diameter may be different, or the separation distance may be different from each other.

37 illustrates a first lead frame 620 and a second lead frame 630 - 2 according to another exemplary embodiment. The second lead frame 630 - 2 of FIG. 37 may be a modified example of the second lead frame 630 shown in FIG. 30 . The same reference numerals as in FIG. 30 denote the same configuration, and the content overlapping with the previously described content will be omitted or briefly described.

Referring to FIG. 37 , unlike the second part 742-2 of the second upper surface portion 742 illustrated in FIG. 30 , the second portion 742 - of the second upper surface portion 742 ″ illustrated in FIG. 37 . 2") has a broken structure, and does not connect the first part 742-1 and the third part 742-3.

The second upper surface portion 742″ of the second lead frame 630-2 may include a first portion 742-1, a second portion 742-2″, and a third portion 742-3. can Each of the first to third portions 742-1, 742-2″, 742-3 may be positioned around a corresponding one of the sides of the first upper surface portion 712 of the first lead frame 620 . can

The second portion 742-2″ of the second upper surface portion 742″ is connected to the first region 704 connected to the first portion 742-1, and the third portion 742-3 connected to the second portion 742-2”. The first region 704 may be formed of a second region 705 spaced apart from each other. Since the package body 610 is filled in the space 706 between the first region 704 and the second region 705, the coupling force between the package body 610 and the second lead frame 630-2 is increased. can be improved The second lead frame 630-2 shown in FIG. 37 is divided into first sub-frames 744-1, 742-1, 704, and second sub-frames 744-2, 742-3, and 705. and both may be electrically isolated from each other.

38 shows a first lead frame 810 and a second lead frame 820 according to another embodiment.

Referring to FIG. 38 , the first lead frame 810 includes a first upper surface portion 812 and a first side portion 814 and a second side portion 816 bent from the first side portion of the first upper surface portion 812 . may include Light emitting chips 642 and 644 may be disposed on the first upper surface portion 812 .

The second side of the first upper surface portion 812 may have one or more first groove portions 803 , 804 and a first protrusion portion 805 . In this case, the second side of the first upper surface portion 812 may be a side facing the first side of the first upper surface portion 812 . For example, the second side of the first upper surface portion 812 may have two first groove portions 803 and 804 and one first projection 805 positioned between the first groove portions 803 and 804, but is limited thereto. it's not going to be The first grooves 803 and 804 have a shape corresponding to the second protrusions 813 and 814 provided in the second lead frame 820 to be described later, and the first protrusions 805 are provided in the second lead frame 820 . It may have a shape corresponding to that of the second groove portion 815 . The first groove portions 803 and 804 and the first protrusion portion 805 illustrated in FIG. 38 have a rectangular shape, but are not limited thereto, and may be implemented in various shapes such as a circle, a polygon, and an oval. The light emitting chips 642 and 644 may be disposed on the first upper surface portion 812 on both sides of the first groove portions 803 and 804 .

The first side portion 814 is connected to one region of the first side of the first upper surface portion 712, and the second side portion 816 is connected to another region of the first side of the first upper surface portion 712, The first side portion 814 and the second side portion 816 may be spaced apart from each other. The first side part 814 and the second side part 816 may be exposed from the same one side of the package body 610 .

The first lead frame 610 may have one or more through-holes 820 in at least one of the first upper surface portion 812 and the first side portion 814 . For example, the first lead frame 810 may have one or more through-holes 840 adjacent to a boundary portion between the first upper surface portion 812 and the first side portion 814 . The through hole 820 may have the same structure as described with reference to FIGS. 30 and 32 , and may have the same function.

The first lead frame 810 is located adjacent to the boundary portion 801 of the first upper surface portion 812 and the first side portion 814, is spaced apart from each other by the through hole 720, the first upper surface portion 712 ) and the first side portion 714 may have connecting portions 852 , 854 , and 856 connecting each other. The structures and functions of the connecting portions 852 , 854 , and 856 may be the same as those described with reference to FIGS. 30 and 32 . The first lead frame 810 may have at least one connection portion corresponding to or adjacent to the light emitting chip 642 or 644 .

The length in the first direction of the connecting portion (eg, 852 , 854 ) positioned corresponding to or adjacent to the light emitting chip ( 642 , 644 ) is the first of the connecting portion (eg, 856 ) that does not correspond to or adjacent to the light emitting chip ( 642 , 644 ) It may be greater than the length of the direction.

In order to improve the degree of coupling with the package body 620 and airtightness for preventing moisture penetration, the lower side of the second side portion 814 may have a structure in which it protrudes laterally.

The second lead frame 820 may be disposed around at least one side of the first lead frame 810 . The second lead frame 820 may include a second upper surface portion 822 and a third side surface portion 824 . The second upper surface portion 822 may be divided into a first portion 832 and a second portion 834 according to a position disposed around the first upper surface portion 812 .

The second portion 834 of the second upper surface portion 822 may be a portion corresponding to or facing the second side portion of the first upper surface portion 812 . The first portion 832 of the second upper surface portion 822 may be connected to one end of the second portion 834 , and may correspond to or face the third side portion of the first upper surface portion 712 . The third side may be a side perpendicular to the first side or the second side.

The second portion 834 of the second upper surface portion 822 may have second protrusions 813 and 814 corresponding to the first groove portions 803 and 804 of the first upper surface portion 812 . The second protrusions 813 and 814 are regions for wire bonding with the first light emitting chip 642 and the second light emitting chip 644 , and are disposed between the first light emitting chip 642 and the second light emitting chip 644 . Positioning can facilitate wire bonding.

The third side portion 824 may be bent at a predetermined angle (eg, 90°) downward from the second upper surface portion 822 . For example, the third side portion 824 may be bent at one side of the first portion 832 of the second upper surface portion 822 . The second side part 816 and the third side part 824 may have a symmetrical shape with respect to the first side part 814 . In order to improve the coupling with the package body 620 and airtightness for preventing moisture penetration, the lower side of the third side part 824 may have a structure in which it protrudes in the lateral direction. The first side part 814 , the second side part 816 , and the third side part 824 may be exposed to the same side surface of the package body 610 .

39 is a perspective view of a light emitting device package 200 - 2 according to another embodiment, FIG. 40 is a top view of the light emitting device package 200 - 2 shown in FIG. 39 , and FIG. 41 is shown in FIG. 39 . shows a front view of the light emitting device package 200-2, FIG. 42 is a cross-sectional view in the cd direction of the light emitting device package 200-2 shown in FIG. 39, and FIG. 43 is the first lead frame shown in FIG. 620' and a second lead frame 630' are shown. The same reference numerals as those of FIGS. 26 to 30 indicate the same configuration, and the content overlapping with the previously described content will be omitted or briefly described.

39 to 43 , the first lead frame 620 ′ of the light emitting device package 200 - 2 may include a first upper surface portion 932 and a first side portion 934 . Unlike the first upper surface portion 712 illustrated in FIG. 30 , the first upper surface portion 932 illustrated in FIG. 43 does not include a groove portion. Also, the second upper surface portion 942 of the second lead frame 630 ′ may be similar to a structure in which the second portion 742-2 of the second upper surface portion 742 illustrated in FIG. 34 is omitted.

The structure of the first side part 934 may be the same as that of the first side part 714 illustrated in FIG. 34 . The length P1 of the first upper surface portion 932 in the first direction may be smaller than the length of the first upper surface portion 712 shown in FIG. 30 , and the length P1 of the first upper surface portion 932 in the second direction ( J2) may be greater than the length J1 of the first upper surface portion 712 in the second direction. For example, the length P1 in the first direction of the first upper surface portion 932 may be 4.8 mm to 4.9 mm, and the length J2 in the second direction may be 0.67 mm to 0.77 mm. Therefore, since the area of the first upper surface portion 932 illustrated in FIG. 39 is larger than the area of the first upper surface portion 712 illustrated in FIG. 34 , the embodiment of FIG. 39 can mount a light emitting chip of a larger size. there is. The sizes of the first side part 944 , the through holes 722 and 724 , and the connection parts may be the same as those described with reference to FIG. 31 .

The second lead frame 630 ′ may include a second upper surface portion 942 and a second side portion 944 . The second top portion 942 may include a first portion 942-1 disposed around the third side of the first top portion 932 and a second portion 942-2 disposed around the fourth side. can The third side of the first upper surface portion 932 is a side perpendicular to the first side of the first upper surface portion 932 , and the fourth side of the first upper surface portion 932 is the first side of the first upper surface portion 932 . It may be a side facing the 3 side.

The first portion 942-1 and the second portion 942-2 of the second upper surface portion 942 may be spaced apart from each other and may be electrically separated from each other.

The second side portion 944 includes a first portion 944 - 1 connected to the first portion 942-1 of the second upper surface portion 942 and a second portion 942 - 2 of the second upper surface portion 942 . ) may include a second portion 944-2 connected to. However, the length P2 in the first direction of the first portion 942-1 and the second portion 942-2 of the second upper surface portion 942 is the second portion of the second upper surface portion 742 shown in FIG. 34 . The length H2 of the first portion 742-1 and the third portion 742-3 in the first direction may be greater than that of the first portion 742-1 and the third portion 742-3.

For example, the length P2 in the first direction of the first portion 942-1 and the second portion 942-2 of the second upper surface portion 942 is 1.04 mm to 1.14 mm, and the length in the second direction ( P3) may be 0.45 mm to 0.55 mm.

The length in the first direction of the protruding portion S22 of the first upper surface portion 932 protruding to support the first lead frame 620 ′ in the lead frame array may be 0.14 mm to 0.24 mm.

The first light emitting chip 642 may be electrically connected to the first portion 942-1 of the second upper surface portion 942 by a first wire 653 , and the second light emitting chip 644 may be connected to a second wire A reference numeral 655 may be electrically connected to the first portion 942 - 2 of the second upper surface portion 942 .

Both the first light emitting chip 642 and the second light emitting chip 644 may emit light of the same wavelength. For example, the first light emitting chip 642 and the second light emitting chip 644 may be red light emitting chips emitting red light.

Also, the first light emitting chip 642 may generate light of different wavelengths. For example, the first light emitting chip 642 may be a red light emitting chip, the second light emitting chip 644 may be a yellow light emitting chip, and the first light emitting chip ( 642 and the second light emitting chip 644 may operate separately.

A first power (eg, negative (-) power) is supplied to the first lead frame 620 ′, and a second power (eg, positive (+) power) may be supplied to the second lead frame 630 ′. there is. Since the second lead frame 630' is divided into two electrically separated parts 942-1 and 944-1, and 942-2 and 944-2, the first lead frame 620' has a common By using as an electrode and separately supplying a second power to the first portion 942-1 and the second portion 942-2 of the second upper surface portion 942 of the second lead frame 630', the first The light emitting chip 642 and the second light emitting chip 644 may be operated separately.

Therefore, when the light emitting device package 200-2 shown in FIG. 39 is mounted on the light source modules 100-1 to 100-21 according to the embodiment, the light source modules 100-1 to 100-21 have various colors. of surface light source can be generated. For example, when only the first light emitting chip 642 is operated, the embodiment may generate a red surface light source, and when operating the second light emitting chip 644 , the embodiment may generate a yellow surface light source.

44 shows the measurement temperature of the light emitting device packages 200 - 1 and 200 - 2 according to the embodiment. The measurement temperature shown in FIG. 44 represents the temperature of the light emitting chip when the light emitting device package emits light.

Case 1 represents the measurement temperature of the light emitting chip when the lengths of the first part and the second part of the side part of the first lead frame in the first direction are the same as the length of the third part, and case 2 (case2) ) represents the measured temperature of the light emitting chip shown in FIG. 26 , and case 3 represents the measured temperature of the light emitting chip shown in FIG. 37 .

Referring to FIG. 44 , the measurement temperature t1 of Case 1 is 44.54°C, the measurement temperature t2 of Case 2 is 43.66°C, and the measurement temperature t3 of Case 3 is 43.58°C.

Therefore, by changing the design of the connecting portions 732, 734, 736 of the first side portion 714 of the first lead frame 620, the embodiment can improve the heat dissipation effect, light-emitting device packages 200-1, 200 when light-emitting -2), since the temperature rise of the light emitting chip 640 mounted on the chip 640 can be alleviated, reduction in luminous intensity and occurrence of wavelength shift can be prevented.

45 shows an embodiment of the light emitting chip 640 shown in FIG. The light emitting chip 640 illustrated in FIG. 45 may be, for example, a vertical chip emitting red light having a wavelength range of 600 nm to 690 nm.

Referring to FIG. 45 , the light emitting chip 640 includes a second electrode layer 1801 , a reflective layer 1825 , a light emitting structure 1840 , a passivation layer 1850 , and a first electrode layer 1860 .

The second electrode layer 1801 provides power to the light emitting structure 1840 together with the first electrode layer 1860 . The second electrode layer 1801 may include an electrode material layer 1810 for current injection, a support layer 1815 positioned on the electrode material layer 1810 , and a bonding layer 1820 positioned on the support layer 1815 . there is. The second electrode layer 1801 may be bonded to the first lead frame 620 of the light emitting device package 200 - 1 shown in FIG. 30 , for example, the first upper surface portion 712 .

The electrode material layer 1810 may be Ti/Au, and the support layer 1815 may be a metal or semiconductor material. Also, the support layer 1815 may be made of a material having high electrical conductivity and thermal conductivity. For example, the support layer 1815 is a metal including at least one of copper (Cu), a copper alloy (Cu alloy), gold (Au), nickel (Ni), molybdenum (Mo), and copper-tungsten (Cu-W). It may be a material or a semiconductor including at least one of Si, Ge, GaAs, ZnO, and SiC.

The bonding layer 1820 is disposed between the support layer 1815 and the reflective layer 1825 , and the bonding layer 1820 serves to bond the support layer 1815 to the reflective layer 1825 . The bonding layer 1820 may include a bonding metal material, for example, at least one of In, Sn, Ag, Nb, Pd, Ni, Au, and Cu. Since the bonding layer 1820 is formed to bond the supporting layer 815 by a bonding method, when the supporting layer 1815 is formed by plating or deposition, the bonding layer 1820 may be omitted.

The reflective layer 1825 is disposed on the bonding layer 820 . The reflective layer 1825 reflects light incident from the light emitting structure 1840 , thereby improving light extraction efficiency. The reflective layer 825 may be formed of a reflective metal material, for example, a metal or alloy including at least one of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, and Hf.

In addition, the reflective layer 1825 is a conductive oxide layer, for example, indium zinc oxide (IZO), indium zinc tin oxide (IZTO), indium aluminum zinc oxide (IAZO), indium gallium zinc oxide (IGZO), or indium gallium tin oxide (IGTO). , aluminum zinc oxide (AZO), antimony tin oxide (ATO), etc. may be used to form a single layer or multiple layers. In addition, the reflective layer 825 may be formed by forming a multi-layered metal and conductive oxide such as IZO/Ni, AZO/Ag, IZO/Ag/Ni, and AZO/Ag/Ni.

An ohmic region 1830 may be positioned between the reflective layer 1825 and the light emitting structure 1840 . The ohmic region 1830 is a region in ohmic contact with the light emitting structure 1840 and serves to smoothly supply power to the light emitting structure 1840 .

A material in ohmic contact with the light emitting structure 1840, for example, a material including at least one of Be, Au, Ag, Ni, Cr, Ti, Pd, Ir, Sn, Ru, Pt, and Hf, is used in the light emitting structure 1840 . The ohmic region 1830 may be formed by ohmic contact with the ? For example, the material constituting the ohmic region 1830 may include AuBe and may have a dot shape.

The light emitting structure 1840 may include a window layer 1842 , a second semiconductor layer 1844 , an active layer 1846 , and a first semiconductor layer 1848 . The window layer 1842 is a semiconductor layer disposed on the reflective layer 1825 and may have a composition of GaP.

The second semiconductor layer 1844 is disposed on the window layer 1842 . The second semiconductor layer 1844 may be implemented as a compound semiconductor such as Group III-5 or Group II-6, and may be doped with a second conductivity type dopant. For example, the first semiconductor layer 1844 may include any one of AlGaInP, GaInP, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, and GaAsP, and a p-type dopant (eg, Mg, Zn, Ca, Sr, Ba) may be doped.

The active layer 1846 is disposed between the second semiconductor layer 1844 and the first semiconductor layer 848 , and electrons and holes provided from the second semiconductor layer 1844 and the first semiconductor layer 1848 are formed. Light can be generated by energy generated in the process of recombination of holes.

The active layer 1846 may be a group 3-5 or group 2-6 compound semiconductor, and may have a single well structure, a multi-well structure, a quantum-wire structure, a quantum dot structure, or the like. can be formed.

For example, the active layer 1846 may have a single or multiple quantum well structure having a well layer and a barrier layer. The well layer may be a material having a band gap lower than the energy band gap of the barrier layer. For example, the active layer 1846 may be AlGaInP or GaInP.

The first semiconductor layer 1848 may be formed of a semiconductor compound. The first semiconductor layer 1848 may be implemented with a compound semiconductor such as Group III-5, Group II-6, or the like, and may be doped with a first conductivity type dopant. For example, the first semiconductor layer 1848 may include any one of AlGaInP, GaInP, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, and GaAsP, and an n-type dopant (eg, Si, Ge, Sn, etc.) may be doped.

The light emitting structure 1840 may emit red light having a wavelength range of 600 nm to 690 nm, and the first semiconductor layer 1848, the active layer 1846, and the second semiconductor layer 1844 may have a composition capable of generating red light. there is. In order to increase light extraction efficiency, a roughness 1870 may be formed on the upper surface of the first semiconductor layer 848 .

The passivation layer 1850 is disposed on a side surface of the light emitting structure 1840 . The passivation layer 1850 serves to electrically protect the light emitting structure 1840 . The passivation layer 1850 is an insulating material, for example, SiO ₂ , SiO _x , SiO _x N _y , Si ₃ N ₄ , or Al ₂ O ₃ to be formed can The passivation layer 1850 may be disposed on at least a portion of the upper surface of the first semiconductor layer 1848 .

The first electrode layer 1860 may be disposed on the first semiconductor layer 1848 and may have a predetermined pattern. The first electrode layer 1860 may be a single layer or a plurality of layers. For example, the first electrode layer 1860 may include a first layer 1862 , a second layer 1864 , and a third layer 1866 that are sequentially stacked. The first layer 1862 is in ohmic contact with the first semiconductor layer 1848 and may be formed of GaAs. The second layer 1864 may be formed of an AuGe/Ni/Au alloy. The third layer 1866 may be formed of a Ti/Au alloy.

26 and 39 , the first electrode layer 860 may be electrically bonded to the second lead frame 630 or 630 ′ by wires 652 , 654 , 653 , or 655 .

In general, when the temperature of the light emitting chip increases, a wavelength shift occurs and the luminous intensity decreases. However, compared to the blue light emitting chip (Blue LED) which emits blue light and the light emitting chip (Amber LED) which emits yellow light, the red light emitting chip (Red LED) which emits red light shows a degree of wavelength shift and luminous intensity decrease according to the increase in temperature. is worse Therefore, in the light emitting device package and the light source module using the red light emitting chip, heat dissipation measures to suppress the temperature increase of the light emitting chip are very important.

However, the light source modules 100-1 to 100-21 and the light emitting device packages 200-1 to 200-2 included in the lighting device 1 according to the embodiment can improve heat dissipation efficiency as described above. Therefore, even when the red light emitting chip is used, the increase in the temperature of the light emitting chip can be suppressed to suppress the wavelength shift and the decrease in luminous intensity.

46 shows a lighting device 2 according to another embodiment. Referring to FIG. 46 , the lighting device 2 includes a housing 1310 , a light source module 1320 , a diffusion plate 1330 , and a micro lens array 1340 .

The housing 1310 accommodates the light source module 1320 , the diffusion plate 1330 , and the micro lens array 1340 , and may be made of a light-transmitting material.

The light source module 1320 may be any one of the above-described embodiments 100-1 to 100-17.

The diffusion plate 1330 may serve to uniformly diffuse the light emitted through the light source module 1320 over the entire surface. The diffusion plate 1330 may be made of the same material as the diffusion plate 70 described above, but is not limited thereto. In another embodiment, the diffusion plate 1330 may be omitted.

The micro lens array 1340 may have a structure in which a plurality of micro lenses 1344 are disposed on a base film 1342 . Each micro lens 1344 may be spaced apart from each other by a predetermined distance. Each micro lens 1344 may be a flat surface, and each micro lens 1344 may be spaced apart from each other with a pitch of 50 to 500 micrometers.

In FIG. 46 , the diffusion plate 1330 and the micro lens array 1340 are formed as separate components, but in another embodiment, the diffusion plate 1330 and the micro lens array 1340 may be formed integrally.

FIG. 48 shows a tail light 900-2 for a vehicle according to an embodiment, and FIG. 49 shows a general tail light for a vehicle.

Referring to FIG. 48 , the vehicle tail light 900 - 2 may include a first light source module 952 , a second light source module 954 , a third light source module 956 , and a housing 970 .

The first light source module 952 may be a light source for the role of a turn indicator, the second light source module 954 may be a light source for the role of a side light, and the third light source module 956 may serve as a stop light. It may be a light source, but is not limited thereto, and its roles may be interchanged.

The housing 970 accommodates the first to third light source modules 952 , 954 , and 956 , and may be made of a light-transmitting material. The housing 970 may have a curve according to the design of the vehicle body. At least one of the first to third light source modules 952, 954, and 956 may be implemented as any one of the above-described embodiments 100-1 to 100-17.

In the case of the tail light, the light intensity must be 110 candela (cd) or higher when the vehicle is stopped, so that it can be viewed from a distance and usually requires a light intensity of 30% or higher. And for the light output of 30% or more, the number of light emitting device packages applied to the light source module (eg, 952,954 or 956) must be increased by 25% to 35% or more, or the output of individual light emitting device packages must be increased by 25% to 35% .

When increasing the number of light emitting device packages, there may be difficulties in manufacturing due to the limitation of the arrangement space. Therefore, by increasing the output of individual light emitting device packages mounted on the light source module, the desired light intensity (for example, 110 candela or more) ) can be obtained. In general, since the value obtained by multiplying the output (W) of the light emitting device package by the number (N) becomes the total output of the light source module, the appropriate output and number of the light emitting device packages can be determined according to the area of the light source module to obtain the desired light intensity there is.

For example, in the case of a light emitting device package having a power consumption of 0.2 watts and an output of 13 lumens (lm), a light intensity of about 100 candela can be generated by disposing 37 to 42 pieces in a predetermined area. However, in the case of a light emitting device package that consumes 0.5 watts and has a luminous flux of 30 lumens (lm), it is possible to obtain light of similar intensity even if only 13 to 15 are arranged in the same area. The number of light emitting device packages to be disposed in a light source module having a constant area in order to obtain a constant output may be determined according to an arrangement pitch, a content of a light-diffusion material in the resin layer, and a pattern shape of the reflective layer. Here, the interval may be a distance from a midpoint of one of the two neighboring light emitting device packages to a midpoint of the other.

When disposing the light emitting device packages in the light source module, they are arranged at regular intervals. In the case of high output light emitting device packages, the number of arrangement can be relatively reduced, and space can be efficiently used because they can be arranged at wide intervals. In addition, when the high-power light emitting device packages are arranged at narrow intervals, higher light intensity can be produced than when the light emitting device packages are arranged at wide intervals.

50A and 50B show intervals between light emitting device packages of a light source module used in a vehicle tail light according to an embodiment. For example, FIG. 50A may be the first light source module 952 illustrated in FIG. 48 , and FIG. 50B may be the second light source module 954 illustrated in FIG. 48 .

50A and 50B , the light emitting device packages 99-1 to 99-n, or 98-1 to 98-m may be spaced apart from each other on the substrate 10-1 or 10-2. there is. It may be a natural number such that n>1, or a natural number such that m>1.

The distance (eg, ph1, ph2, ph3, or pc1, pc2, pc3) between the two neighboring light emitting device packages may be different, but the range of the distance is preferably 8 to 30 mm.

Because there may be changes depending on the power consumption of the light emitting device package (99-1 to 99-n, or 98-1 to 98-m), the arrangement interval (eg, ph1, ph2, ph3 or pc1, pc2, pc3) This is because, when the thickness is less than 8 mm, light from neighboring light emitting device packages (eg, 99-3 to 99-4) may interfere with each other to generate a recognizable bright spot. In addition, when the arrangement interval (eg, ph1, ph2, ph3, or pc1, pc2, pc3) is 30 mm or more, a dark part may be generated due to an area to which light does not reach.

As described above, since the light source modules 100-1 to 100-17 themselves have flexibility, they can be easily mounted on the housing 970 having a curve. The degree of freedom can be improved.

In addition, since the light source modules 100-1 to 100-17 have a structure in which heat dissipation efficiency is improved, the vehicle tail lamp 900-2 according to the embodiment can prevent the occurrence of a wavelength shift and decrease in luminous intensity.

Since the general vehicle tail light shown in FIG. 49 is a point light source, partial spots 962 and 964 may appear on the light emitting surface when emitting light, but the vehicle tail light 900 - 2 according to the embodiment is a surface light source, so the light emitting surface Uniform luminance and illuminance can be implemented throughout.

Although described and illustrated in relation to the preferred embodiment for illustrating the technical idea of the present invention above, the present invention is not limited to the configuration and operation as shown and described as such, and without departing from the scope of the technical idea. It will be appreciated by those skilled in the art that many suitable variations and modifications of the present invention are possible. Accordingly, all such suitable variations and modifications and equivalents are to be considered as falling within the scope of the present invention.

10: printed circuit board 20: light source
30: reflection unit 31: reflection pattern
33: first reflective sheet 35: second reflective sheet
36: air area 37: spacer member
40: resin layer 50: optical pattern layer
52: first optical sheet 54: second optical sheet
56: adhesive layer 60: optical pattern
70: diffuser plate
80: first air gap 81: second air gap
90: light reflective member 91: indirect light emitting air gap
110: heat dissipation member 101-1 to 101-n: sub light source module
410-1, 420-1, 410-2: connection fixing part 510, 520, 530, 540: connector
610: package body 620: first lead frame
630: second lead frame 640: light emitting chip
645: zener diode 650: wire
712: first upper surface portion 714: first side portion
722,724: through hole 742: second upper surface portion
744: second side portion 801: second electrode layer
810: electrode material layer 815: support layer
820: bonding layer 825: reflective layer
830: ohmic region 840: light emitting structure
850: passivation layer 860: first electrode layer
900: vehicle light 910: light source module
920: light housing

Claims (14)

Board;
a plurality of light sources disposed on the substrate;
a resin layer disposed on the substrate and covering the plurality of light sources;
a reflection unit disposed between the substrate and the resin layer; and
and a light reflection member disposed on a side surface of the resin layer,
The reflective unit includes a reflective sheet disposed on the substrate, a transparent sheet disposed on the reflective sheet, and a plurality of spatial regions disposed between the reflective sheet and the transparent sheet and spaced apart from each other,
The plurality of light sources pass through the reflective sheet and the transparent sheet,
The light reflecting member surrounds at least three side surfaces of the resin layer.
According to claim 1,
and a diffusion member spaced apart from each other by a predetermined distance on the resin layer.
Board;
a plurality of light sources disposed on the substrate;
a resin layer disposed on the substrate and covering the plurality of light sources;
a reflection unit disposed between the substrate and the resin layer;
a light reflection member disposed on a side surface of the resin layer; and
a diffusion member disposed on the resin layer spaced apart from each other by a predetermined distance;
The reflective unit includes a reflective sheet disposed on the substrate, a transparent sheet disposed on the reflective sheet, and a plurality of spatial regions disposed between the reflective sheet and the transparent sheet and having a polygonal shape,
The plurality of light sources pass through the reflective sheet and the transparent sheet,
The light reflective member is disposed on two sides facing each other among the side surfaces of the resin layer.
Board;
a plurality of light sources disposed on the substrate;
a resin layer disposed on the substrate and covering the plurality of light sources;
a reflection unit disposed between the substrate and the resin layer;
a light reflection member disposed on a side surface of the resin layer; and
a diffusion member disposed on the resin layer spaced apart from each other by a predetermined distance;
The reflective unit includes a reflective sheet disposed on the substrate, a transparent sheet disposed on the reflective sheet, and a plurality of spatial regions disposed between the reflective sheet and the transparent sheet and having a polygonal shape,
The plurality of light sources pass through the reflective sheet and the transparent sheet,
The diffusion member is a lighting device disposed above the uppermost surface of the light reflection member.
5. The method according to any one of claims 1 to 4,
The reflective unit includes a plurality of unit spacing members disposed between the reflective sheet and the transparent sheet,
The unit spacing member is a lighting device having a polygonal cross-section.
6. The method of claim 5,
The space region is a lighting device disposed within the unit spacer.
7. The method of claim 6,
A cross section of the space region or the unit spacer has a hexagonal shape.
8. The method of claim 7,
The plurality of unit spacer members are connected to each other to form a honeycomb shape.
5. The method of claim 3 or 4,
The plurality of spatial regions are spaced apart from each other at regular intervals.
5. The method according to any one of claims 1 to 4,
An optical pattern layer disposed on the resin layer,
The optical pattern layer includes a first optical sheet disposed on the upper surface of the resin layer, a second optical sheet disposed on the first optical sheet, and a plurality of optical sheets disposed between the first optical sheet and the second optical sheet. A lighting device comprising a pattern.
11. The method of claim 10,
Each of the plurality of optical patterns overlaps each of the plurality of light sources in a vertical direction.
12. The method of claim 11,
The optical pattern layer includes an adhesive layer disposed between the first optical sheet and the second optical sheet, and an air gap disposed around each of the plurality of optical patterns to space the adhesive layer and the optical pattern apart.
5. The method according to any one of claims 1 to 4,
The light reflection member is a lighting device for reflecting a portion of the light emitted from the plurality of light sources and leaked to the side of the resin layer.
14. The method of claim 13,
The light reflecting member and the resin layer are arranged to be spaced apart from each other by a predetermined distance.

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