KR102229782B1 - Illuminating device - Google Patents

Abstract

In an embodiment, a substrate; A reflective sheet disposed on the substrate; A light source disposed on the substrate and passing through the reflective sheet; A resin layer disposed on the reflective sheet; And an optical plate disposed on the resin layer, wherein the light source includes a plurality of light emitting devices disposed in the resin layer and having a light emitting surface emitting light in a horizontal direction of the resin layer, wherein the optical plate A lighting device including an upper surface on which a plurality of unit lens patterns are disposed, each of the plurality of unit lens patterns including a curved surface, and spaced apart from each other by a predetermined interval is disclosed.

Description

Lighting device {ILLUMINATING DEVICE}

The present invention relates to the technical field of lighting devices.

LED (Light Emitted Diode) devices are devices that convert electrical signals into infrared or light using the characteristics of compound semiconductors. Unlike fluorescent lamps, they do not use harmful substances such as mercury, so there are fewer causes of environmental stigma, compared to conventional light sources. It has the advantage of long life. In addition, it consumes low power compared to a conventional light source, has excellent visibility due to a high color temperature, and has an advantage of less glare.

Therefore, the current lighting device is developing from a form using a conventional light source such as a conventional incandescent light bulb or a fluorescent lamp to a form using the above-described LED element as a light source, in particular, as disclosed in Korean Patent Publication No. 10-2012-0009209, By using a lighting device that performs a surface emitting function has been provided.

The above-described conventional lighting apparatus has a structure in which a flat light guide plate is disposed on a substrate, and a plurality of side-type LEDs are disposed in an array form on the side of the light guide plate. Here, the light guide plate is a type of plastic molded lens that performs the function of supplying uniform light to the light emitted from the LED. Therefore, although such a light guide plate is used as an essential component in a conventional lighting device. Due to the thickness of the light guide plate itself, there is a limit to reducing the thickness of the entire product, and it is difficult to apply to the curved part as the material of the light guide plate itself does not have flexibility. Accordingly, product design and design modification are not easy. Was connoted.

In addition, as some light is emitted to the side of the light guide plate, there is also a problem in that light loss occurs and light efficiency is lowered, and the characteristics of the LED (e.g., change in light intensity and wavelength) change according to the temperature of the LED during light emission. There were also problems.

Unexamined Patent Publication No. 10-2012-0009209

The present invention has been proposed to solve the above-described problems, and provides a lighting device capable of reducing the thickness, improving the degree of freedom in product design, improving heat dissipation efficiency, and suppressing wavelength shift and light intensity reduction. For that purpose.

In addition, the present invention can differentiate the design of the lighting device without adding a separate light source by implementing the indirect light emitting unit using lossy light. In particular, the haze of the optical plate disposed above the light source is reduced to 30% or less. Another object is to provide a lighting device that maximizes light efficiency by implementing a structure to be formed, while reducing the thickness of an optical plate.

A lighting device according to one aspect of the present invention includes a substrate; A reflective sheet disposed on the substrate; A light source disposed on the substrate and passing through the reflective sheet; A resin layer disposed on the reflective sheet; And an optical plate disposed on the resin layer, wherein the light source includes a plurality of light emitting devices disposed in the resin layer and having a light emitting surface emitting light in a horizontal direction of the resin layer, wherein the optical plate It includes an upper surface on which a plurality of unit lens patterns are disposed, and each of the plurality of unit lens patterns includes a curved surface and is spaced apart from each other by a predetermined interval.
A lighting device according to another aspect of the present invention includes: a substrate; A reflective sheet disposed on the substrate; A light source disposed on the substrate and passing through the reflective sheet; A resin layer disposed on the reflective sheet; And an optical plate disposed on the resin layer, wherein the light source includes a plurality of light emitting devices emitting light in a horizontal direction of the resin layer, and a plurality of unit lens patterns are disposed on an upper surface of the optical plate, , The cross-sectional shape of the unit lens pattern is a partial shape of a circle having a diameter-to-height ratio of greater than 0 and less than or equal to 0.5.
The lens pattern may have a height of 1 μm to 150 μm and a diameter of 1 μm to 300 μm.
It may include a plurality of reflective patterns formed on the reflective sheet.
The reflective pattern may include any one of TiO2, CaCO3, BaSO4, Al2O3, Silicon, and Polystyrene (PS).
The plurality of light-emitting elements may be arranged in two or more rows, and a spacing between three light-emitting elements among the plurality of light-emitting elements disposed in one of the two rows may be different from each other.
A lighting device according to another aspect of the present invention includes a substrate; A reflective sheet disposed on the substrate; A light source disposed on the substrate and passing through the reflective sheet; And a resin layer disposed on the reflective sheet, wherein the light source includes a plurality of light emitting devices disposed in two or more rows, and the resin layer includes a plurality of side surfaces having different shapes from each other.
At least one side of the plurality of side surfaces includes a plurality of planes, at least two of the plurality of planes are parallel to each other, at least one plane connects the at least two planes to each other, and the at least one plane May be disposed inclined with respect to the at least two planes.
At least one side of the plurality of side surfaces may include a plurality of planes and at least one curved surface, and the at least one curved surface may connect between the plurality of planes.
Including an optical pattern layer disposed on the resin layer, the optical pattern layer is a first optical sheet, a second optical sheet disposed to be spaced apart from the first optical sheet, and an optical pattern disposed on a lower surface of the second optical sheet And an adhesive layer disposed between the first optical sheet and the second optical sheet, and the optical pattern may be spaced apart from each other so as to have an air gap with the adhesive layer.

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According to the present invention, by providing an indirect light emitting unit including a light reflecting member, it is possible to realize various lighting effects using a flare phenomenon and an effect of implementing various designs of lighting.

In particular, it is possible to provide a lighting device that maximizes light efficiency by implementing a structure in which the haze of the optical plate disposed on the light source is less than 30%, while reducing the thickness of the optical plate.

In addition, according to the present invention, since the lighting effect is realized by using light emitted to the side of the resin layer, it has the advantage of implementing a double lighting effect without adding a separate light source.

In addition, according to the present invention, since the light guide plate is removed and the resin layer is used to guide light, the number of light emitting device packages can be reduced, and the overall thickness of the lighting device can be reduced.

In addition, according to the present invention, since the resin layer can be formed of a highly heat-resistant resin, it is possible to provide a lighting device with high reliability and an effect of realizing stable luminance despite heat generated from a light emitting device package.

In addition, according to the present invention, it is possible to secure flexibility by forming a lighting device using a flexible printed circuit board and a resin layer, thereby increasing the degree of freedom in product design.

And according to the present invention, by making the diffusion plate itself surround the side surface of the light source module, the diffusion plate itself can perform the housing function at the same time, so that the manufacturing process efficiency improvement effect and the product itself It has the effect of improving durability and reliability. In addition, according to the present invention, it is possible to improve the heat dissipation efficiency, and it is possible to suppress a wavelength shift and a decrease in light intensity.

1 shows a lighting device according to an embodiment of the present invention.
2A to 2D are views for explaining a first preferred embodiment according to the present invention.
3 to 17 show the second to sixteenth embodiments of the light source module shown in FIG. 1.
18 shows an embodiment of the reflection pattern shown in FIG. 4.
FIG. 19 is a plan view of the light source module shown in FIG. 1 according to a seventeenth embodiment.
FIG. 20 is a cross-sectional view of the light source module shown in FIG. 19 in the AA′ direction.
FIG. 21 is a cross-sectional view of the light source module shown in FIG. 19 in the BB′ direction.
22 is a cross-sectional view of the light source module shown in FIG. 19 in the CC' direction.
23 shows a headlamp for a vehicle according to an embodiment of the present invention.
24 is a perspective view of a light emitting device package according to an embodiment of the present invention.
25 is a top view of a light emitting device package according to an embodiment of the present invention.
26 is a front view of a light emitting device package according to an embodiment of the present invention.
27 is a side view of a light emitting device package according to an embodiment of the present invention.
28 is a perspective view illustrating a first lead frame and a second lead frame shown in FIG. 24.
FIG. 29 is a view for explaining the dimensions of each part of the first lead frame and the second lead frame shown in FIG. 28.
30 shows an enlarged view of the connecting portions shown in FIG. 29.
31 to 36 show modified embodiments of the first lead frame and the second lead frame.
37 is a perspective view of a light emitting device package according to another embodiment of the present invention.
38 shows a top view of the light emitting device package shown in FIG. 37.
39 is a front view of the light emitting device package shown in FIG. 37.
40 is a cross-sectional view of the light emitting device package shown in FIG. 37 in the cd direction.
41 illustrates a first lead frame and a second lead frame illustrated in FIG. 37.
42 illustrates a measurement temperature of a light emitting device package according to an embodiment of the present invention.
43 shows an embodiment of the light emitting chip shown in FIG. 24.
44 shows a lighting device according to another embodiment.
45 shows a general vehicle headlamp as a point light source.
46 shows a rear light for a vehicle according to an embodiment of the present invention.
47 shows a typical rear light for a vehicle.
48A and 48B illustrate spacing of light emitting device packages of a light source module used in a vehicle tail light according to an embodiment of the present invention.

Hereinafter, the configuration and operation according to the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same components are assigned the same reference regardless of the reference numerals, and redundant descriptions thereof will be omitted. Terms such as first and second may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another component.

The present invention relates to a lighting device, wherein the light guide plate is removed, and it is replaced with a resin layer, but by forming an indirect light emitting part on the side of the resin layer, various lighting effects are realized using the light leakage effect, and the total thickness of the lighting device is reduced. While innovatively reducing, the purpose is to provide a lighting device structure capable of securing flexibility and reducing the number of light sources. In particular, the aim is to maximize the light efficiency by implementing a structure in which the haze of the optical plate applied to the lighting device is less than 30%, while reducing the thickness of the optical plate.

In addition, the lighting device according to the present invention can be applied to various lamp devices that require lighting, such as vehicle lamps, home lighting devices, and industrial lighting devices. For example, when applied to vehicle lamps, it can also be applied to headlights, interior lighting, door scarves, and rear lights. Additionally, the lighting device of the present invention can be applied to the field of a backlight unit applied to a liquid crystal display device, and in addition, it will be said that it can be applied to all lighting-related fields that are currently developed and commercialized or that can be implemented according to future technological developments.

Hereinafter, the term “light source module” means collectively referring to components excluding an optical plate such as a diffusion plate and a light reflecting member.

1 shows a lighting device 1 according to an embodiment of the present invention. Referring to FIG. 1, the lighting device 1 includes a light source module 100 as a surface light source, and may further include a housing 150 accommodating the light source module 100. The light source module 100 includes at least one light source that generates light, and can implement a surface light source by diffusing and dispersing light generated from a light source, which is a point light source, and has flexibility and can be bent.

The housing 150 protects the light source module 100 from impact and may be made of a material (eg, acrylic) through which light irradiated from the light source module 100 can be transmitted. In addition, the housing 150 may include a curved portion in terms of design, and since the light source module 100 has flexibility, it may be easily accommodated in the curved housing 150. Of course, since the housing 150 itself has a certain flexibility, it is also possible that the assembly structure of the lighting device 1 itself has a certain flexibility.

2A is a conceptual diagram illustrating a structure of an optical plate applied to an embodiment of the present invention.

The optical plate 70 applied to the present embodiments implements a function of inducing and diffusing light irradiated from a light source, and applies not only a flat plate-shaped structure, but also an optical plate having a bent structure as shown in FIG. 2A. can do. In particular, the optical plate applied to all embodiments of the present invention is characterized in that the haze (haze) is 30% or less. In the embodiment of the present invention, haze is defined as the ratio (b) of diffused light out of the light that passes through the optical plate 70 from the total amount of incident light (A). That is, the total amount of light (A) incident on the optical plate is divided into reflected and absorbed light and light transmitted through the optical plate. Among them, it is divided into straight light and diffused light, which are light that passes through the optical plate, and the ratio (b/(a+b) of the diffused light that is charged among the transmitted light is defined as haze.

The optical plate 70 applied to the lighting device according to the embodiment of the present invention may be applied with a haze of 30% or less, which may include organic or inorganic beads inside the optical plate 70. Alternatively, it may be implemented by implementing a lens pattern on the surface of the optical plate 70.

2B to 2D show the structure of the lighting device according to the first embodiment 100-1 of the present invention, which is formed by reducing the haze of the optical plate described above in FIG. 2A to 30% or less. Is a cross-sectional view of the lighting device shown in FIG. 1 in the AB direction. In addition, the haze control method of the optical plate applied in FIGS. 2B to 2D can be applied to the optical plate applied to the embodiment of the overall lighting device of the present invention proposed after FIG. 3.

2B is a structure in which a bead is included in the optical plate 70 to have a haze of 30% or less, and FIG. 2C is a structure in which a lens pattern P-1 is formed on the surface of the optical plate 70 to form a haze ( haze) is 30% or less, and FIG. 2D is a structure in which a bead and a lens pattern (P-1) are simultaneously implemented on an optical plate, and a haze of 30% or less is implemented.

Referring to the first embodiment 100-1 of the light source module of the present invention with reference to FIGS. 2B to 2D, the light source module 100-1 includes a printed circuit board 10, a light source 20, and a light guide plate. It includes a resin layer 40 that performs the function of a guide plate). In addition, an indirect light emitting portion P is formed on at least one of one side and the other side of the resin layer 40, and an optical plate 70 is formed on the above-described light source module 100-1. In particular, a first air gap 80 and an indirect light emitting air gap 91 formed between the light source module and the light reflecting member are provided between the light source module and the upper surface of the optical plate, and the optical plate Haze may be composed of 30% or less.

In particular, in the structure of the lighting device according to the embodiment of the present invention, when light is emitted through the side surface of the resin layer 40, the emitted light is reflected to form reflected light (or indirect light), and accordingly, the lighting device The light lost in the light is reflected again by the light reflecting member 90 to cause a flare phenomenon in which the light spreads softly.

In order to maximize such a flare phenomenon, an indirect light emitting air gap 91 may be formed between the light reflecting member 90 and the resin layer 40, and accordingly, the light emitted to the side of the resin layer 40 may have a refractive index. Due to the difference, the indirect emission air gap 91 is scattered, and the scattered light is re-reflected by the light reflecting member 90 to maximize a flare phenomenon. The width of the indirect light emitting air gap 91 may be formed in a range of more than 0 and less than 20 mm, but is not limited thereto, and the design may be appropriately changed according to the specification of the lighting device and the degree of indirect light to be implemented.

In addition, due to the presence of the first air gap 80, a difference in refractive index from the resin layer 40 may be generated, and accordingly, the uniformity of the light supplied to the optical plate 70 may be increased. Uniformity of light diffused and emitted through the optical plate 70 may be improved.

The optical plate 70 may be a configuration that transmits light and simultaneously diffuses or uniformizes the light. In the present embodiment, it will be described as an example that it is applied as a diffusion plate.

The optical plate 70 may have a haze of 30% or less by including a plurality of optical beads (B) therein. Such an optical plate 70 may be generally formed of an acrylic resin, but is not limited thereto. In addition, polystyrene (PS), polymethyl methacrylate (PMMA), cyclic olefin copoly (COC), polyethylene terephthalate (PET) ), polycarbonate, and a highly transparent plastic such as resin, etc., and may be made of a material capable of performing a light diffusion function. The optical bead (B) may be formed of any one material selected from _{CaCO 3} , Ca ₃ (SO ₄ ) ₂ , BaSO ₄ , TiO ₂ , SiO _{2, and organic beads (Methacrylate Styrene).} In this case, the optical bead may be included in an amount of 5% or less based on the total weight of the resin constituting the optical plate, and it is possible to implement not only one type of optical bead, but also a combination of two or more types of optical beads. The optical bead may have a particle diameter of 50 μm or less.

In addition, as illustrated in FIG. 2C, it is possible to form a haze of 30% or less by forming a lens pattern P-1 on the surface of the optical plate 70. In this case, when considering the unit pattern, the lens pattern P-1 may be implemented as an embossed pattern having a height d1 of 1 to 150 μm and a diameter d2 of 1 to 300 μm. Of course, each unit pattern may be implemented to have a uniform size and arrangement density, but it is also possible to arrange in a different size and non-uniform arrangement structure. FIG. 2D shows a structure of a lighting device in which a bead and a lens pattern P-1 are simultaneously implemented on an optical plate, and a haze of 30% or less is realized.

The optical plate 70 may be disposed above the light source module 100-1, more specifically on the resin layer 40, and uniformly diffuses the light emitted through the resin layer 40 over the entire surface. Plays a role. The thickness of the optical plate 70 may be basically formed in the range of 0.5 to 5 mm, but is not limited thereto, and the design may be appropriately changed according to the specifications of the lighting device. .

In particular, the optical plate 70 of the present invention has a structure having an upper surface 71 and a side wall 73 integrally formed with the upper surface 71, as shown in FIGS. 2B to 2D. 73 surrounds the outer surface of the indirect light emitting part P.

The optical plate 70 may be generally formed of an acrylic resin, but is not limited thereto. In addition, polystyrene (PS), polymethyl methacrylate (PMMA), cyclic olefin copoly (COC), polyethylene terephthalate ( It may be made of a material capable of performing a light diffusion function, such as PET) and a highly transparent plastic such as resin.

In addition, a first air gap 80 may exist between the upper surface 71 of the optical plate 70 and the resin layer 40. Due to the presence of the first air gap 80, a difference in refractive index from the resin layer 40 may be generated, thereby increasing the uniformity of light supplied to the optical plate 70, and as a result, the optical plate ( 70), it is possible to improve the uniformity of light that is diffused and emitted. In this case, in order to minimize the deviation of light transmitted through the resin layer 40, the thickness of the first air gap 80 may be in a range of more than 0 and within 30 mm, but is not limited thereto, and the design may be changed as necessary.

The side wall 73 of the optical plate 70 surrounds the outer surface of the indirect light emitting part P, in particular, the outer surface of the light reflecting member 90, and this side wall 73 is a light reflecting member ( It serves as a supporting part supporting 90) and a housing protecting the light source module 100-1. That is, the optical plate 70 according to the present invention can function as the housing 150 shown in FIG. 1 as needed. According to this, the optical plate 70 itself covers not only the upper part of the light source module 100-1 but also the side part, so that the optical plate 70 itself can perform the housing function at the same time, so that a separate structure is not used. As a result, it has the effect of improving the manufacturing process efficiency and improving the durability and reliability of the product itself.

The structures of FIGS. 2B to 2D have the same structure except for the method of implementing the optical plate, and a configuration of another lighting device will be described with reference to this.

The printed circuit board 10 may be a printed circuit board using a flexible insulating board, that is, a flexible printed circuit board 10. For example, the flexible printed circuit board 10 may include a base member (eg, 5) and a circuit pattern (eg, 6, 7) disposed on at least one surface of the base member (eg, 5), and the base member (eg, The material of 5) may be a film having flexibility and insulation, such as polyimide or epoxy (eg, FR-4).

More specifically, the flexible printed circuit board 10 includes an insulating film 5 (for example, polyimide or FR-4), a first copper foil pattern 6, a second copper foil pattern 7, and a via contact. ) Can be included. The first copper foil pattern 6 is formed on one surface (eg, upper surface) of the insulating film 5, and the second copper foil pattern 7 is formed on the other surface (eg, lower surface) of the insulating film 5, and has an insulating property. The first copper foil pattern 6 and the second copper foil pattern 7 may be connected through the via contact 8 formed through the film 5.

Hereinafter, a case where the printed circuit board 10 is made of a flexible printed circuit board will be described as an example, but this is only an example, and it will be said that various types of substrates can be used as the printed circuit board 10 of the present invention. .

The light sources 20 are arranged in more than one number on the flexible printed circuit board 10 to emit light. For example, the light source 20 may be a side view type light emitting device package in which the emitted light proceeds in a direction 3 toward the side of the resin layer 40. In this case, the light emitting chip mounted on the light emitting device package may be a vertical light emitting chip, for example, a red light emitting chip shown in FIG. 43, but the embodiment is not limited thereto.

The resin layer 40 is disposed on the flexible printed circuit board 10 and the light source 20 to fill the light source 20, and is emitted from the light source 20 in the lateral direction 3 of the resin layer 40. Light may be diffused and guided in a direction toward one surface (eg, an upper surface) of the resin layer 40.

The resin layer 40 may be made of a resin of a material capable of diffusing light, and the refractive index thereof may be formed in the range of 1.4 to 1.8, but is not limited thereto.

For example, the resin layer 40 may be made of a highly heat-resistant UV-curable resin including an oligomer. In this case, the content of the oligomer may be 40 to 50 parts by weight. In addition, urethane acrylate may be used as the ultraviolet curing resin, but the present invention is not limited thereto, and in addition, epoxy acrylate, polyester acrylate, polyether acrylate, At least one of polybutadiene acrylate and silicon acrylate may be used.

In particular, when urethane acrylate is used as an oligomer, two types of urethane acrylate can be mixed and used to achieve different physical properties at the same time.

For example, in the process of synthesizing urethane acrylate, isocyanate is used, and the physical properties (yellowing, weather resistance, chemical resistance, etc.) of urethane acrylate are determined by isocyanate. At this time, implement any one type of urethane acrylate as Urethane Acrylate type-Isocyanate, but implement so that the NCO% of PDI (isophorone diisocyanate) or IPDI (isophorone diisocyanate) is 37% (hereinafter'first oligomer'). ), another type of urethane acrylate is implemented as Urethane Acrylate type-Isocyanate, but the NCO% of PDI (isophorone diisocyanate) or IPDI (isophorone diisocyanate) is 30-50% or 25-35%. Thus (hereinafter,'second oligomer') can form an oligomer according to the embodiment. Accordingly, the first oligomer and the second oligomer having different physical properties can be obtained according to the NCO% control, and the oligomer forming the resin layer 40 can be implemented by mixing them. In this case, the weight ratio of the first oligomer in the oligomer may be 15 to 20, and the weight ratio of the second oligomer may be in the range of 25 to 35.

Meanwhile, the resin layer 40 may further include at least one of a monomer and a photo initiator. At this time, the content of the monomer may be 65 to 90 parts by weight, more specifically IBOA (isobornyl Acrylate) 35 to 45 parts by weight, 2-HEMA (2-Hydroxyethyl Methacrylate) 10 to 15 parts by weight, 2-HBA (2-Hydroxybutyl) Acrylate) may be made of a mixture containing 15 to 20 parts by weight. In addition, in the case of a photoinitiator (for example, 1-hydroxycyclohexyl phenyl-ketone, Diphenyl), Diphwnyl (2,4,6-trimethylbenzoyl phosphine oxide, etc.), it may be composed of 0.5 to 1 part by weight.

In addition, the resin layer 40 may be made of a thermosetting resin having high heat resistance. Specifically, the resin layer 40 may be made of a thermosetting resin including at least one of a polyester polyol resin, an acrylic polyol resin, a hydrocarbon-based or/and an ester-based solvent. The thermosetting resin may further include a thermosetting agent to improve the strength of the coating film.

In the case of a polyester polyol resin, the content of the polyester polyol resin may be 9 to 30% based on the total weight of the thermosetting resin. In addition, in the case of an acrylic polyol resin, the content of the acrylic polyol may be 20 to 40% based on the total weight of the thermosetting resin.

In the case of a hydrocarbon-based or ester-based solvent, the content may be 30 to 70% based on the total weight of the thermosetting resin. In the case of the thermosetting agent, the content of the thermosetting resin may be 1 to 10% based on the total weight. When the resin layer 40 is formed of the above-described material, heat resistance is enhanced, so that even if it is used in a lighting device that emits high temperature heat, it is possible to minimize the decrease in luminance due to heat, so that a highly reliable lighting device can be provided. have.

In addition, according to the present invention, the thickness of the resin layer 40 can be innovatively reduced by using the above-described materials for realizing the surface light source, and thus the overall product can be made thinner. In addition, according to the present invention, a lighting device is formed using a flexible printed circuit board and a resin layer made of a flexible material, and it can be easily applied to a curved surface, thereby improving design freedom, and other flexible displays. There are advantages that can be applied and applied.

The resin layer 40 may include a diffusion material 41 having a hollow (or void) therein, and the diffusion material 41 may be mixed or diffused with a resin forming the resin layer 40, It can play a role of improving light reflection and diffusion characteristics.

For example, light emitted from the light source 20 to the resin layer 40 is reflected and transmitted by the hollow of the diffusing material 41, so that the light is diffused and condensed in the resin layer 40, and diffused and condensed. Light may be emitted to one surface (eg, an upper surface) of the resin layer 40. At this time, the reflectivity and the diffusivity of light are increased by the diffusing material 41, so that the amount and uniformity of the outgoing light supplied to the upper surface of the resin layer 40 are improved, and as a result, the luminance of the light source module 100-1 is improved. I can.

The content of the diffusion material 41 may be appropriately adjusted to obtain a desired light diffusion effect. Specifically, it may be adjusted in the range of 0.01 to 0.3% based on the total weight of the resin layer 40, but is not limited thereto. The diffusion material 41 may be composed of any one selected from silicon (sillicon), silica (silica), glass bubble, PMMA, urethane (urethane), Zn, Zr, Al2O3, and acrylic, The particle diameter of the diffusion material 41 may be 1 μm to 20 μm, but is not limited thereto.

An indirect light emitting portion P may be formed on at least one of one side and the other side of the resin layer 40. The indirect light emitting part P is a part that implements an additional light emitting part by using the loss light emitted to the side of the resin layer 40 among the light components irradiated from the light source 20. The configuration of the indirect light emitting part P is formed between the light reflecting member 90 formed on the side of the resin layer 40 and the light reflecting member 90 formed on the side of the resin layer 40, as shown in FIG. It comprises an indirect light emitting air gap 91.

When the light emitted from the light source 20 is emitted through the side surface of the resin layer 40, the light reflecting member 90 reflects the emitted light to form reflected light (or indirect light). Accordingly, the light lost from the lighting device is re-reflected by the light reflecting member 90, resulting in a flare phenomenon in which the light spreads softly, and by using this, it can be applied to indoor and outdoor interior and vehicle lighting without additional light sources. Various lighting effects can be implemented.

The light reflecting member 90 may be made of a material having excellent light reflectance, such as a white resist, and additionally made of a synthetic resin containing a white pigment dispersed therein, or a synthetic resin in which metal particles having excellent light reflecting characteristics are dispersed. May be. At this time, titanium oxide, aluminum oxide, zinc oxide, lead carbonate, barium sulfate, calcium carbonate, and the like may be used as the white pigment, and Ag powder having excellent reflectance may be included when a metal powder is included. In addition, it will be said that it is possible to further include a separate optical brightener. That is, the light reflecting member 90 of the present invention may be formed using any material having excellent light reflectance, which is currently developed or can be implemented according to future technological developments. On the other hand, the light reflecting member 90 is directly molded and bonded to the inside of the side wall 73 of the optical plate 70, or attached through a separate adhesive material (eg, adhesive tape or thermosetting PSA), or the side wall ( 73) It can be combined with the optical plate 70 by being printed directly on the inside.

In addition, although the drawing shows that the light reflecting member 90 is formed over the entire inner side of the side wall 73 of the optical plate 70, this is only an example, and there is no limitation in the formation range of the light reflecting member 90. I would say no.

Meanwhile, in order to maximize the above-described flare phenomenon, an indirect light emitting air gap 91 may be formed between the light reflecting member 90 and the resin layer 40, and accordingly, light emitted to the side of the resin layer 40 may be Due to the difference in refractive index, the indirect light emission is scattered in the air gap 91, and the scattered light is re-reflected by the light reflecting member 90, thereby maximizing a flare phenomenon. The width of the indirect light emitting air gap 91 may be formed in a range of more than 0 and less than 20 mm, but is not limited thereto, and the design may be appropriately changed according to the specification of the lighting device and the degree of indirect light to be implemented.

3 shows a second embodiment 100-2 of the light source module shown in FIG. 1. The same reference numerals as in FIG. 2 denote the same configuration, and contents overlapping with those described above will be omitted or briefly described.

Referring to FIG. 3, in order to improve heat dissipation efficiency, the second exemplary embodiment may further include a heat dissipating member 110 in the first exemplary embodiment 100-1.

The heat dissipation member 110 is disposed on the lower surface of the flexible printed circuit board 10 and serves to dissipate heat generated from the light source 20 to the outside. That is, the heat dissipation member 110 may improve the efficiency of discharging heat generated from the light source 20 as a heat source to the outside.

For example, the heat dissipation member 110 may be disposed on a portion of the lower surface of the flexible printed circuit board 10. The heat dissipation member 110 may include a plurality of heat dissipation layers (eg, 110-1 and 110-2) spaced apart from each other. At least a portion of the heat dissipation layers 110-1 and 110-2 may overlap the light source 20 in a vertical direction in order to improve the heat dissipation effect. Here, the vertical direction may be a direction from the flexible printed circuit board 10 to the resin layer 40.

The heat dissipation member 110 may be a material having high thermal conductivity, such as aluminum, aluminum alloy, copper, or copper alloy. Alternatively, the heat dissipation member 110 may be a metal core printed circuit board (MCPCB). The heat dissipation member 110 may be attached to the lower surface of the flexible printed circuit board 10 by an acrylic adhesive (not shown).

In general, when the temperature of the light-emitting element increases due to heat generated from the light-emitting element, the luminous intensity of the light-emitting element decreases, and a wavelength shift of the generated light may occur. In particular, when the light emitting device is a red light emitting diode, the degree of wavelength shift and light intensity decrease is severe.

However, the light source module 100-2 has a heat dissipation member 110 on the lower surface of the flexible printed circuit board 10 to efficiently dissipate heat generated from the light source 20 to the outside, thereby suppressing an increase in the temperature of the light source. As a result, the light intensity of the light source module 100-2 may be reduced, or a wavelength shift of the light source module 100-2 may be suppressed from occurring.

4 shows a third embodiment 100-3 of the light source module shown in FIG. 1. The same reference numerals as in FIG. 3 denote the same configuration, and contents overlapping with those described above will be omitted or briefly described.

Referring to FIG. 4, the light source module 100-3 may have a structure in which a reflective sheet 30, a reflective pattern 31, and a first optical sheet 52 are added to the second embodiment.

The reflective sheet 30 is disposed between the flexible printed circuit board 10 and the resin layer 40, and may have a structure through which the light source 20 passes. For example, the reflective sheet 30 may be positioned on the remaining areas except for one area of the flexible printed circuit board 10 where the light source 20 is located.

The reflective sheet 30 may be made of a material having high reflective efficiency. The reflective sheet 30 reflects the light irradiated from the light source 20 to one surface (eg, the upper surface) of the resin layer 40 and prevents light from leaking to the other surface (eg, the lower surface) of the resin layer 40. This can reduce optical loss. The reflective sheet 30 may be formed in the form of a film, and may include a synthetic resin containing a white pigment dispersed in order to realize a property of promoting reflection and dispersion of light.

For example, titanium oxide, aluminum oxide, zinc oxide, lead carbonate, barium sulfate, calcium carbonate, etc. may be used as white pigments, and as synthetic resins, polyethylene terephthalate, polyethylene naphthalate, acrylic resin, colicarbonate, polystyrene, polyolefin , Cellulose acetate, weather-resistant vinyl chloride, and the like may be used, but are not limited thereto.

The reflective pattern 31 is disposed on the surface of the reflective sheet 30 and may serve to scatter and disperse incident light. The reflective pattern 31 may be formed by printing a reflective ink containing any one of TiO2, CaCo3, BaSo4, Al2O3, silicon, and polystyrene (PS) on the surface of the reflective sheet 30, but is not limited thereto.

In addition, the structure of the reflective pattern 31 may be a plurality of protruding patterns, and may be regular or irregular. The reflective pattern 31 may be formed in a prism shape, a lenticular shape, a lens shape, or a combination thereof in order to increase the scattering effect of light, but is not limited thereto. In addition, the cross-sectional shape of the reflection pattern 31 in FIG. 4 may be formed in a structure having various shapes such as a triangle, a polygon such as a square, a semicircle, and a sine wave, and a polygon having a shape viewed from above (for example, Hexagonal), circular, elliptical, or semicircular.

18 shows an embodiment of the reflection pattern shown in FIG. 4. Referring to FIG. 18, the reflective pattern 31 may have different diameters according to a distance from the light source 20.

For example, the reflection pattern 31 may have a larger diameter as it is closer to the light source 20. Specifically, the first reflective pattern 71, the second reflective pattern 72, the third reflective pattern 73, and the fourth reflective pattern 74 may have a larger diameter in that order. However, the embodiment is not limited thereto.

The first optical sheet 52 is disposed on the resin layer 40 and transmits light emitted from one surface (eg, the upper surface) of the resin layer 40. The first optical sheet 52 may be formed of a material having excellent light transmittance, and for example, polyethylene telephthalate (PET) may be used.

Meanwhile, when the first optical sheet 52 is formed, the first air gap 80 described above in the description of FIG. 2 is the upper surface 71 and the first optical sheet 52 of the optical plate 70. ) Can be formed between. Due to the presence of the first air gap 80, the uniformity of the light supplied to the optical plate 70 can be increased, and as a result, the uniformity of the light diffused and emitted through the optical plate 70 can be improved. Yes is as described above in the description of FIG. 2.

In addition, although the drawing shows that the light reflecting member 90 is formed over the entire inner side of the side wall 73 of the optical plate 70, this is only an example, and there is no limitation in the formation range of the light reflecting member 90. None is as described above in the description of FIG. 2.

5 shows a fourth embodiment 100-4 of the light source module shown in FIG. 1.

Referring to FIG. 5, the light source module 100-4 includes a second optical sheet 52, an adhesive layer 56, a light blocking pattern 60, and a second optical sheet 54 in the third embodiment 100-3. ) May be added.

The second optical sheet 54 is disposed on the first optical sheet 52. The second optical sheet 54 may be formed of a material having excellent light transmittance, and PET may be used as an example.

In addition, the adhesive layer 56 is disposed between the first optical sheet 52 and the second optical sheet 54 to attach the first optical sheet 52 and the second optical sheet 54 to each other.

The optical pattern 60 may be disposed on at least one of an upper surface of the first optical sheet 52 or a lower surface of the second optical sheet 54. The optical pattern 60 may be attached to at least one of the upper surface of the first optical sheet 52 or the lower surface of the second optical sheet 54 by the adhesive layer 56. Another embodiment may further include one or more optical sheets (not shown) in addition to the second optical sheet 56. In this case, a structure including the first optical sheet 52, the second optical sheet 54, the adhesive layer 56, and the optical pattern 60 may be defined as the optical pattern layer 50-1.

The optical pattern 60 may be a light blocking pattern for preventing concentration of light emitted from the light source 20. The optical pattern 60 is aligned with the light source 20 and may be adhered to the first optical sheet 52 and the second optical sheet 54 by the adhesive layer 56.

The first optical sheet 52 and the second optical sheet 54 may be formed of a material having excellent light transmittance, and PET may be used as an example.

The optical pattern 60 basically functions to prevent the light emitted from the light source 20 from being concentrated. That is, in addition to the above-described reflection pattern 31, the optical pattern 60 may implement uniform surface light emission.

The optical pattern 60 may be a blocking pattern that blocks part of the light emitted from the light source 20, and the optical characteristic is deteriorated or yellowish light is prevented due to excessively strong light intensity. For example, the optical pattern 60 may prevent the light from being concentrated in a region adjacent to the light source 20 and may serve to disperse the light.

The optical pattern 60 may be formed by performing a printing process on the upper surface of the first optical sheet 52 or the lower surface of the second optical sheet 54 using light-shielding ink. The optical pattern 60 may not completely block light, but may control the degree of light blocking or diffusivity by adjusting the density and/or size of the optical pattern so as to perform a function of partially blocking and diffusing light. For example, in order to improve light efficiency, the optical pattern 60 may be adjusted so that the density of the optical pattern decreases as the distance from the light source 20 decreases, but the present invention is not limited thereto.

Specifically, the optical pattern 60 may be implemented as an overlapping printing structure of a complex pattern. The structure of superimposed printing refers to a structure in which one pattern is formed and another pattern shape is printed on the top of the pattern.

For example, the optical pattern 60 may include a diffusion pattern and a light blocking pattern, and may have a structure in which the diffusion pattern and the light blocking pattern overlap. For example, a diffusion pattern is formed on the lower surface of the polymer film (for example, the second optical sheet 54) in the direction of light emission using a light-shielding ink containing at least one material selected from TiO2, CaCO3, BaSO4, Al2O3, and Silicon. I can. In addition, a light-shielding pattern may be formed on the surface of the polymer film using a light-shielding ink containing Al or a mixed material of Al and TiO2.

That is, it is possible to form a diffusion pattern on the surface of the polymer film by white printing, and then to form a light-shielding pattern thereon, or to form a double structure in the reverse order. Of course, it is obvious that the pattern formation design can be modified in various ways in consideration of light efficiency, intensity, and shading rate.

Alternatively, in another embodiment, the optical pattern 60 may have a triple structure including a first diffusion pattern, a second diffusion pattern, and a light blocking pattern disposed therebetween. In such a triple structure, it is possible to select and implement the above-described materials. As an example, the first diffusion pattern may _{include TiO 2} having excellent refractive index, the second diffusion pattern may _{include CaCO 3} and TiO ₂ having excellent light stability and color, and the shading pattern includes Al having excellent concealment. can do. The embodiment can secure light efficiency and uniformity through the optical pattern of such a triple structure. In particular, CaCO ₃ functions to realize white light through the function of subtracting the exposure of yellow light, so that more stable light can be realized. _{In addition to CaCO 3 , BaSO 4} and Al ₂ are diffusing materials used in the diffusion pattern. Inorganic materials having a large particle size and similar structure, such as O _{3 and Silicon, can be used.}

The adhesive layer 56 may surround the periphery of the optical pattern 60 and fix the optical pattern 60 to the first optical sheet 52 or/and the second optical sheet 54. At this time, the adhesive layer 56 may use a thermosetting PSA, a thermosetting adhesive, or a UV-curing PSA type material, but is not limited thereto.

Meanwhile, when the second optical sheet 54 is formed on the first optical sheet 52, the first air gap 80 described above in the description of FIG. 2 is the upper surface of the optical plate 70 ( 71) and the first optical sheet 52 may be formed. In this case, the thickness of the first air gap 80 and a description of its function are the same as those described above in the description of FIG. 2, and thus will be omitted.

In addition, as long as the range including the side surface of the resin layer 40, there is no limitation on the formation range of the light reflecting member 90 as described above in the description of FIG. 2.

6 shows a fifth embodiment 100-5 of the light source module shown in FIG. 1.

Referring to FIG. 6, the light source module 100-5 may have a structure in which a second air gap 81 is added to the fourth embodiment 100-4. That is, the fifth embodiment 100-5 may include a second air gap 81 between the first optical sheet 52 and the second optical sheet 54.

For example, a second air gap 81 may be formed in the adhesive layer 56. The adhesive layer 56 forms a space (second air gap 81) around the optical pattern 60, and an adhesive material is applied to the other portions of the first optical sheet 52 and the second optical sheet ( 54) can be implemented in a structure that bonds to each other.

The adhesive layer 56 may have a structure in which the second air gap 81 is positioned at the periphery of the optical pattern 60. Alternatively, the adhesive layer 56 may have a structure that surrounds the periphery of the optical pattern 60 and the second air gap 81 is positioned at a portion other than the periphery. The bonding structure of the first optical sheet 52 and the second optical sheet 54 may also implement a function of fixing the printed optical pattern 60. The structure including the first optical sheet 52, the second optical sheet 54, the second air gap 81, the adhesive layer 56, and the optical pattern 60 is defined as the optical pattern layer 50-2. can do.

Since the second air gap 81 and the adhesive layer 56 have different refractive indices, the second air gap 81 diffuses light traveling from the first optical sheet 52 to the second optical sheet 56 and Dispersion can be improved. And because of this, the embodiment can implement a uniform surface light source.

7 shows a sixth embodiment 100-6 of the light source module shown in FIG. 1. Referring to FIG. 7, the light source module 100-6 may have a structure in which via holes 212 and 214 for improving heat dissipation are provided in the flexible printed circuit board 10 of the first embodiment.

The via holes 212 and 214 may pass through the flexible printed circuit board 110 and may expose a part of the light source 20 or a part of the resin layer 40. For example, the via holes 212 and 214 may include a first via hole 212 exposing a portion of the light source 20 and a second via hole 214 exposing a portion of a lower surface of the resin layer 40.

Heat generated from the light source 20 as a heat source may be directly discharged to the outside through the first via hole 212, and the heat conducted from the light source 20 to the resin layer 40 is the second via hole 214 It can be directly discharged to the outside through. In the sixth embodiment, since heat generated from the light source 20 is emitted to the outside through the via holes 212 and 214, heat dissipation efficiency may be improved. The first via hole 212 and the second via hole 214 may have various shapes such as polygonal, circular, and elliptical shape.

8 shows a seventh embodiment 100-7 of the light source module shown in FIG. 1. Referring to FIG. 9, the light source module 100-7 may have a structure in which a reflective sheet 30, a reflective pattern 31, and a first optical sheet 52 are added to the sixth embodiment. In the seventh embodiment 100-7, heat dissipation efficiency may be improved by the first and second via holes 212 and 214. Descriptions of the components 30, 31, and 52 added in the present embodiment are the same as those described above in FIG. 4, and thus will be omitted.

9 shows an eighth embodiment 100-8 of the light source module shown in FIG. 1. Referring to FIG. 9, the light source module 100-8 has a structure in which a second optical sheet 52, an adhesive layer 56, a light shielding pattern 60, and a second optical sheet 54 are added to the seventh embodiment. Can have. Components 52, 54, 56, and 60 added in the present embodiment are the same as those described above in FIG. 5, and thus will be omitted.

10 shows a ninth embodiment (100-9) of the light source module shown in FIG. 1. Referring to FIG. 10, the light source module 100-9 is a second optical sheet 52, an adhesive layer 56, a light blocking pattern 60, a second optical sheet 54, and a second air according to the seventh embodiment. The gap 81 may have an added structure. A second air gap 81 may exist between the first optical sheet 52 and the second optical sheet 54 of the tenth embodiment (100-10), and the second air gap 81 is shown in FIG. 6. It may be the same as described.

11 shows a tenth embodiment (100-10) of the light source module shown in FIG. 1. The same reference numerals as in FIG. 1 denote the same configuration, and contents overlapping with those described above will be omitted or briefly described.

Referring to FIG. 11, unlike the heat dissipation member 110 of the second embodiment 100-2, the heat dissipation member 310 of the light source module 100-10 is disposed on the lower surface of the flexible printed circuit board 10. The lower heat dissipation layer 310-1 and a portion of the lower heat dissipation layer 310-1 may pass through the flexible printed circuit board 10 and have a through part 310-1 contacting the light source 20.

For example, the through part 310-1 may contact the first side part 714 of the first lead frames 620 and 620 ′ of the light emitting device packages 200-1 and 200-2 to be described later.

According to the tenth embodiment, since heat generated from the light source 20 by the through part 310-1 is directly transferred to the heat dissipating member 310 and radiated to the outside, heat dissipation efficiency may be improved.

12 shows an eleventh embodiment (100-11) of the light source module shown in FIG. 1. Referring to FIG. 12, the light source module 100-11 may have a structure in which a reflective sheet 30, a reflective pattern 31, and a first optical sheet 52 are added to the tenth embodiment, and an added configuration They 30, 31 and 52 may be the same as described in FIG. 4.

13 shows a twelfth embodiment 100-12 of the light source module shown in FIG. 1. Referring to FIG. 13, the light source module 100-12 includes a second optical sheet 52, an adhesive layer 56, a light blocking pattern 60, and a second optical sheet 54 in the eleventh embodiment 100-11. ) May be added. The added components 52, 54, 56, and 60 may be the same as described in FIG. 5.

14 shows a thirteenth embodiment 100-13 of the light source module shown in FIG. 1. Referring to FIG. 14, the light source modules 100-13 may have a structure in which a second air gap 81 is added to the twelfth embodiment 100-12. That is, a second air gap 81 may exist between the first optical sheet 52 and the second optical sheet 54 of the thirteenth embodiment (100-13), and the second air gap 81 is shown in FIG. 6. It may be the same as described in.

15 shows a fourteenth embodiment of the light source module shown in FIG. 1, FIG. 16 shows a fifteenth embodiment of the light source module shown in FIG. 1, and FIG. 17 is a sixteenth embodiment of the light source module shown in FIG. Shows an example.

The reflective sheet 30-1, the second optical sheet 54-1, and the diffusion plate 70-1 shown in FIGS. 15 to 17 are the reflective sheets shown in FIGS. 6, 10, and 14 ( 30), the second optical sheet 54, and the optical plate 70 may be modified examples.

Unevenness R1, R2, and R3 may be formed on at least one or both surfaces of the reflective sheet 30-1, the second optical sheet 54-1, and the diffusion plate 70-1. The irregularities R1, R2, and R3 serve to reflect and diffuse the incident light so that the light emitted to the outside forms a geometric pattern.

For example, a first unevenness R1 may be formed on one surface (eg, an upper surface) of the reflective sheet 30-1, and one surface of the second optical sheet 54-1 (eg, a second unevenness R2 on the upper surface). ) May be formed, and a third unevenness (R3) may be formed on one surface (eg, lower surface) of the optical plate 70. These irregularities (R1, R2, R3) are provided with a plurality of regular or irregular patterns. In order to increase the reflection and diffusion effect of light, it may have a prism shape, a lenticular shape, a concave lens shape, a convex lens shape, or a combination thereof, but is not limited thereto.

In addition, the cross-sectional shape of the irregularities R1, R2, and R3 may have a structure having various shapes such as a triangle, a square, a semicircle, and a sine wave. In addition, the size or density of each pattern may be changed according to the distance from the light source 20.

The unevenness (R1, R2, R3) can be formed by directly processing the reflective sheet 54-1, the second optical sheet 54-1, and the optical plate 70, but there is no limitation, and a certain pattern is formed. It can be formed in any way that is currently developed and commercialized, such as a method of attaching a film, or can be implemented according to future technological developments.

In the embodiment, a geometric light pattern may be easily implemented through a combination of patterns of the first to third irregularities R1, R2, and R3. In another embodiment, irregularities may be formed on one or both surfaces of the second optical sheet 52.

However, the embodiment in which the irregularities R1, R2, or R3 are formed is not limited to FIGS. 15 to 17, and the reflective sheet 54, the first optical sheet 52, and the second optical sheet included in other embodiments At least one surface or both surfaces of the sheet 54 and the optical plate 70 may be formed with irregularities to increase light reflection and diffusion effects.

FIG. 19 is a plan view of a seventeenth embodiment 100-17 of the light source module shown in FIG. 1, and FIG. 20 is a cross-sectional view of the light source module 100-17 shown in FIG. 19 in the AA′ direction, and FIG. 21 is a cross-sectional view of the light source module 100-17 shown in FIG. 19 in the BB' direction, and FIG. 22 is a cross-sectional view of the light source module 100-17 shown in FIG. 19 in the CC' direction.

19 to 22, the light source module 100-17 includes a plurality of sub-light source modules (101-1 to 101-n, a natural number of n>1), and a plurality of The sub light source modules 101-1 to 101-n can be separated or combined with each other. In addition, the combined sub light source modules 101-1 to 101-n may be electrically connected to each other. At this time, the formation of the optical plate 70 and the light reflecting member 90 is performed by coupling the sub light source modules 101-1 to 101-n to each other, and then the light reflecting member 90 on the entire coupling structure. 73) It can be achieved by combining the optical plate 70 formed inside.

Each of the sub light source modules 101-1 to 101-n includes at least one connector (eg, 510, 520, 530) that can be connected to the outside. For example, the first sub light source module 101-1 may include a first connector 510 including at least one terminal (eg, S1, S2). The second sub light source module 101-2 includes a first connector 520 and a second connector 530 to be connected to the outside, respectively, and the first connector 520 includes at least one terminal (eg, P1, P2), and the second connector 530 may include at least one terminal (eg, Q1, Q2). At this time, the first terminals S1, P1, and Q1 may be positive (+) terminals, and the second terminals S2, P2, and Q2 may be negative (-) terminals. 21 illustrates that each connector (eg, 510, 520, 530) includes two terminals, but the number of terminals is not limited thereto.

20 to 22 illustrate a structure in which the connector 510, 520, or 530 is added to the fifth embodiment 100-5, but is not limited thereto, and the sub light source modules 101-1 to 101- n) Each is a connector (eg, 510, 520, or 530) and a connection fixing unit (eg, 410-1, 420-1) to the light source modules 100-1 to 100-20 according to any one of the above-described embodiments. , 410-2) may be added.

20 and 21, each of the sub light source modules 101-1 to 101-n is a flexible printed circuit board 10, a light source 20, a reflective sheet 30, a reflective pattern 31, and a resin The layer 40, the first optical sheet 52, the second optical sheet 54, the adhesive layer 56, the optical pattern 60, the heat dissipation member 110, at least one connector 510, 520, or 530), and at least one connection fixing part 410 and 420. The same reference numerals as in FIG. 1 denote the same configuration, and contents overlapping with those described above will be omitted or briefly described. Compared with other embodiments, each of the sub light source modules 101-1 to 101-n of the seventeenth embodiment may have a difference in size or number of light sources, but the configuration thereof is different except for the connector and the connection fixing part. It can be the same.

The first sub light source module 101-1 is electrically connected to the light source 20 and may include a first connector 510 provided on the flexible printed circuit board 10 for electrical connection with the outside. For example, the first connector 510 may be implemented in a patterned form on the flexible printed circuit board 10.

In addition, the second sub light source module 101-2 may include a first connector 520 and a second connector 530 electrically connected to the light source 20. The first connector 520 is provided on one side of the flexible printed circuit board 10 in order to electrically connect to the outside (eg, the first connector 510 of the first sub light source module 101-1 ). 2 The connector 530 may be provided on the other side of the flexible printed circuit board 10 in order to electrically connect to another external (for example, a connector (not shown) of the third sub light source module 101-3).

The connection fixing parts (eg, 410-1, 420-1, 410-2) are coupled to other external sub light source modules and serve to fix the combined two sub light source modules to each other. The connection fixing part (for example, 410-1, 420-1, 410-2) is a protrusion in which a part of the side of the resin layer 40 protrudes, or a groove in which a part of the side of the resin layer 40 is recessed. It can be wealth.

Referring to FIG. 22, the first sub light source module 101-1 may include a first connection fixing part 410-1 having a structure in which a portion of the side surface of the resin layer 40 protrudes. In addition, the second sub light source module 101-2 has a structure in which a part of the side of the resin layer 40 is recessed and the other part of the side of the resin layer 40 protrudes. It may include a second connection fixing part (410-2).

The first connection fixing part 410-1 of the first sub light source module 101-1 and the first connection fixing part 420-1 of the second sub light source module 101-2 are male and female to be fixed to each other. I can.

The embodiment illustrates that the connection fixing parts (eg, 410-1, 420-1, 410-2) are implemented as a part of the resin layer 40, but are not limited thereto, and a separate connection fixing part may be provided. In addition, the connection fixing part can be transformed into another connectionable form.

The shape of the sub light source modules 101-1 to 101-n, n>1 may have a shape in which a certain portion protrudes, but is not limited thereto, and may be implemented in various shapes. For example, the shape of the sub light source modules 101-1 to 101-n viewed from above, a natural number n>1 may be circular, elliptical, or polygonal, and some may protrude in the lateral direction.

For example, one end of the first sub light source module 101-1 includes a protrusion 540 in the center, and a first connector 510 may be provided on the flexible printed circuit board 10 corresponding to the protrusion 540. , The first connection fixing part 410-1 may be provided on the resin layer 40 of the remaining part of one end of the first sub light source module 101-1 other than the protrusion 540.

In addition, one end of the second sub light source module 101-2 has a groove portion 545 in the center, and a first connector 520 may be provided on the flexible printed circuit board 10 corresponding to the groove portion 545, and the groove portion A first connection fixing part 420-1 may be provided in the resin layer 40 of the remaining portion of one end of the second sub light source module 101-2 other than 545. In addition, the other end of the second sub light source module 101-2 includes a protrusion 560 in the center, and a second connector 530 may be provided on the flexible printed circuit board 10 corresponding to the protrusion 560, A second connection fixing part 410-2 may be provided on the resin layer 40 of the remaining portion of one end of the second sub light source module 101-2 other than the protrusion 560.

Each of the sub light source modules 101-1 to 101-n can be an independent light source by itself, can be variously modified in shape, and two or more sub light source modules are assembled to each other by a connection fixing unit to be independent. Since it can be used as a phosphorus light source, the embodiment can improve the degree of freedom in product design. In addition, in the embodiment, when some of the assembled sub light source modules are damaged or damaged, only the damaged sub light source module may be replaced and used.

The above-described light source module can be used in a display device, an indication device, and a lighting system requiring a surface light source. In particular, although lighting is required, the light source module according to the embodiment can be easily mounted even in a place where lighting is not easy to install (eg, a curved ceiling or floor, etc.) because the part to be mounted has a curvature. There is an advantage. For example, the lighting system may include a lamp or a street light, and the lamp may be a vehicle head lamp, but is not limited thereto.

23 illustrates a vehicle headlamp 900-1 according to an embodiment, and FIG. 45 illustrates a general vehicle headlamp as a point light source. Referring to FIG. 23, a vehicle headlamp 900-1 includes a light source module 910 and a light housing 920.

The light source module 910 may be the above-described embodiments 100-1 to 100-17. The light housing 920 accommodates the light source module 910 and may be made of a light-transmitting material. The vehicle light housing 920 may include a curvature according to a vehicle part to be mounted and a design. Meanwhile, as described above, the diffusion plate itself may serve as the vehicle light housing 920, and a separate vehicle light housing 920 may be provided in addition to the diffusion plate as described above. Since the light source module 910 uses the flexible printed circuit board 10 and the resin layer 40, the light source module 910 may be easily mounted on the curved vehicle housing 920 because it itself has flexibility. In addition, since the light source modules 100-1 to 100-21 have a structure in which heat dissipation efficiency is improved, the vehicle headlamp 900-1 according to the embodiment may prevent the occurrence of wavelength shift and decrease in light intensity. In addition, as described above, since a separate light reflecting member is formed on the side of the resin layer, there is an effect of reducing light loss and improving luminance compared to the same power.

Since the general vehicle headlamp shown in FIG. 45 is a point light source, a partial spot 930 may appear on the light emitting surface during light emission, but the vehicle headlamp 900-1 according to the embodiment is a surface light source. There is no spot, and uniform luminance and illuminance can be realized over the entire light emitting surface.

24 is a perspective view of a light emitting device package 200-1 according to the first embodiment, FIG. 25 is a top view of the light emitting device package 200-1 according to the first embodiment, and FIG. 26 is a first A front view of the light emitting device package 200-1 according to the embodiment is shown, and FIG. 27 is a side view of the light emitting device package 200-1 according to the first embodiment.

The light emitting device package 200-1 illustrated in FIG. 24 may be a light emitting device package included in the light source modules 100-1 to 100-17 according to the above-described embodiments, but is not limited thereto.

24 to 27, the light emitting device package 200-1 includes a package body 610, a first lead frame 620, a second lead frame 630, a light emitting chip 640, and a Zener diode 645. ), and a wire 650-1.

The package body 610 may be formed of a substrate having good insulation or thermal conductivity, such as a silicon-based wafer level package, a silicon substrate, silicon carbide (SiC), aluminum nitride (AlN), etc., It may be a structure in which a plurality of substrates are stacked. However, the embodiment is not limited to the above-described material, structure, and shape of the body.

For example, the length X1 of the package body 610 in the first direction (eg, the X-axis direction) is 5.95mm to 6.05mm, and the length (Y1) in the second direction (eg, the Y-axis direction) is 1.35mm to It can be 1.45mm. The length Y2 of the package body 610 in the third direction (eg, the Z-axis direction) may be 1.6 mm to 1.7 mm. For example, the first direction may be a direction parallel to the long side of the package body 610.

The package body 610 may have a cavity 601 having an open top and a side wall 602 and a bottom 603. The cavity 601 may be formed in a cup shape, a concave container shape, or the like, and the sidewall 602 of the cavity 601 may be perpendicular or inclined with respect to the bottom 603. The shape of the cavity 601 viewed from above may be a circle, an ellipse, or a polygon (eg, a square). The corner portion of the polygonal cavity 601 may be curved. For example, the length (X3) of the cavity 601 in the first direction (eg, the X-axis direction) is 4.15mm to 4.25mm, and the length (X4) of the second direction (eg, the Y-axis direction) is 0.64mm to 0.9 mm, and the depth of the cavity 601 (eg, length in the Z-axis direction, Y3) may be 0.33mm to 0.53mm.

The first lead frame 620 and the second lead frame 630 may be disposed on the surface of the package body 610 to be electrically separated from each other in consideration of heat dissipation or mounting of the light emitting chip 640. The light emitting chip 640 is electrically connected to the first lead frame 620 and the second lead frame 630. The number of light emitting chips 640 may be one or more.

A reflective member (not shown) may be provided on the sidewall of the cavity of the package body 610 to reflect light emitted from the light emitting chip 640 to direct it in a predetermined direction.

The first lead frame 620 and the second lead frame 630 may be disposed in the upper surface of the package body 610 to be spaced apart from each other. A portion of the package body 610 (eg, the bottom 603 of the cavity 601) is positioned between the first lead frame 620 and the second lead frame 630 to electrically separate them.

The first lead frame 620 may include one end (e.g., 712) exposed to the cavity 601 and the other end (e.g., 714) exposed to one surface of the package body 610 through the package body 610. have. In addition, the second lead frame 630 has one end exposed to one side of one side of the package body 610 (eg, 744-1), and the other end exposed to the other side of one side of the package body 610 (eg, 744- 2), and an intermediate portion (eg, 742-2) exposed to the cavity 601 may be included.

The separation distance X2 between the first lead frame 620 and the second lead frame 630 may be 0.1 mm to 0.2 mm. The top surface of the first lead frame 620 and the top surface of the second lead frame 630 may be positioned on the same plane as the bottom 603 of the cavity 601.

FIG. 28 is a perspective view of a first lead frame 620 and a second lead frame 630 shown in FIG. 24, and FIG. 29 is a diagram illustrating each of the first lead frame 620 and the second lead frame shown in FIG. It is a diagram for explaining the dimensions of the part, and FIG. 30 is a connection of the first lead frame 620 adjacent to the boundary portion 801 of the first upper surface portion 712 and the first side portion 714 shown in FIG. 29 An enlarged view of portions 732,734, and 736 is shown.

28 to 30, the first lead frame 620 includes a first upper surface portion 712 and a first side portion 714 that is bent from a first side portion of the first upper surface portion 712.

The first upper surface portion 712 is located on the same plane as the bottom of the cavity 601, is exposed by the cavity 601, and light emitting chips 642 and 644 may be disposed.

As shown in FIG. 29, both ends of the first upper surface portion 712 may have a portion S3 protruding in a first direction (x-axis direction) with respect to the first side portion 714. The protruding portion S3 of the first upper surface portion 712 may be a portion supporting the first lead frame in the lead frame array. The length of the protruding portion S3 of the first upper surface portion 712 in the first direction may be 0.4mm to 0.5mm. The length K of the first upper surface portion 712 in the first direction may be 3.45 mm to 3.55 mm, and the length J1 in the second direction may be 0.6 mm to 0.7 mm. The first direction may be an x-axis direction in the xyz coordinate system, and the second direction may be a y-axis direction.

The second side portion of the first upper surface portion 712 may have at least one groove portion 701. In this case, the second side portion of the first upper surface portion 712 may face each other with the first side portion of the first upper surface portion 712. For example, the second side portion of the first upper surface portion 712 may have one groove portion 701 in the center, but is not limited thereto, and the number of groove portions formed on the second side portion may be two or more. The groove 701 may have a shape corresponding to the protrusion 702 provided in the second lead frame 630 to be described later.

The groove 701 illustrated in FIG. 29 is a trapezoidal shape, but is not limited thereto, and may be implemented in various shapes such as a circle, a polygon, and an ellipse. The length S2 of the groove portion 701 in the first direction may be 1.15 mm to 1.25 mm, and the length S1 of the groove portion 701 in the second direction may be 0.4 mm to 0.5 mm.

In addition, the angle θ1 formed by the bottom 701-1 and the side surface 701-2 of the groove 701 may be greater than or equal to 90° and less than 180°. The light emitting chips 642 and 644 may be disposed on the first upper surface 712 on both sides of the groove 701.

The first side portion 714 may be bent at a certain angle downward from the first side portion of the first upper surface portion 712, and the first side portion 714 may be exposed from one side of the package body 610. . For example, an angle formed by the first upper surface portion 712 and the first side portion 714 may be greater than or equal to 90° and less than 180°.

The first lead frame 620 may have one or more through holes 720 in at least one of the first upper surface portion 712 and the first side portion 714. For example, the first lead frame 620 may have one or more through holes 720 adjacent to a boundary portion between the first upper surface portion 712 and the first side portion 714. In FIG. 26, two through holes 722 and 724 that are adjacent to the boundary portion between the first upper surface portion 712 and the first side portion 714 and are spaced apart from each other are illustrated, but the exemplary embodiment is not limited thereto.

One or more through holes 720 may be formed in a region of each of the first upper surface portion 712 and the first side portion 714 adjacent to the boundary portion between the first upper surface portion 712 and the first side portion 714. have. In this case, a through hole (eg, 722-1) formed in one region of the first upper surface portion 712 and a through hole (eg, 722-2) formed in one region of the first side portion 714 may be connected to each other. .

A part of the package body 610 is filled in the through hole 720, so that a degree of coupling between the first lead frame 620 and the package body may be improved. In addition, the through hole 720 serves to easily form a bend between the first upper surface portion 712 and the first side portion 714. However, if the size of the through-hole 720 is too large or the number of through-holes 720 is too large, the first upper surface portion 712 and the first side portion 714 may be cut when the first lead frame 620 is bent. Therefore, the size and number of the through holes 720 must be appropriately adjusted. In addition, since the size of the through hole 720 is related to the size of the connection portions 732, 734, and 736 to be described later, it is also related to the heat dissipation of the light emitting device package.

An embodiment according to the size of each of the first lead frame 620 and the second lead frame 630 having through holes to be described below can achieve optimum heat dissipation efficiency in consideration of the degree of coupling and ease of bending.

In order to improve the degree of coupling with the package body 610, facilitate bending of the first lead frame 620, and prevent damage during bending, the embodiment includes a first through hole 722 and a second through hole 724. ), and the length D11 of the first through hole 722 in the first direction and the length D12 of the second through hole 724 in the first direction may be 0.58mm to 0.68mm, The length D2 in the second direction may be 0.19mm to 0.29mm. The area of the first through hole 722 may be the same as the area of the second through hole 724, but is not limited thereto, and both may be different from each other.

Referring to FIG. 30, the first lead frame 620 is located adjacent to the boundary portion 801 of the first upper surface portion 712 and the first side portion 714, and is spaced apart from each other by a through hole 720, Connection portions 732, 734, and 736 connecting the first upper surface portion 712 and the first side portion 714 to each other may be provided. For example, the connection portions 732, 734, and 736 are each of the first portion 732-1, 734-1, or 736-1 and the first side portion 714 corresponding to a part of the first upper surface portion 712. The second portion 732-2, 734-2, or 736-2 corresponding to a part may be formed. A through hole 720 may be positioned between each of the connecting portions 732, 734, and 736.

The first lead frame 620 may have at least one connection portion corresponding to or aligned with the light emitting chip 642 or 644.

Specifically, the first lead frame 620 may include first to third connection portions 732, 734, and 736. The first connection portion 732 may be positioned corresponding to or aligned with the first light emitting chip 642, and the second connection portion 734 may be positioned corresponding to or aligned with the second light emitting chip 644. have. In addition, the third connection portion 736 may be positioned between the first connection portion 732 and the second connection portion 734, and is unaligned with the first light emitting chip 642 or the second light emitting chip 644. It can be part. For example, the third connection portion 736 may be positioned corresponding to or aligned with the groove portion 701 of the first lead frame 620, but is not limited thereto.

The length C11 of the first connection portion 732 in the first direction and the length C2 of the second connection portion 734 in the first direction are the length E of the third connection portion 736 in the first direction Can be greater than For example, the length C11 of the first connection part 732 in the first direction and the length C2 of the second connection part 734 in the first direction may be 0.45mm to 0.55mm, and the third connection part ( The length E of the 736 in the first direction may be 0.3 mm to 0.4 mm. The reason for positioning the third connection portion 736 between the first through hole 722 and the second through hole 724 is to prevent breakage between the first upper surface portion 712 and the first side portion 714 when bending. It is for sake.

A ratio of the length E of the third connection portion 736 in the first direction and the length C11 of the first connection portion 732 in the first direction may be 1: 1.2 to 1.8. The ratio of the length (D11 or D12) of the through hole 722 in the first direction and the length (B1) of the upper end portion 714-1 of the first side portion 714 in the first direction may be 1: 3.8 to 6.3. .

Since the first connection portion 732 is aligned with the first light emitting chip 642 and the second connection portion 734 is aligned with the second light emitting chip 644, heat generated from the first light emitting chip 642 is It is mainly radiated to the outside through the first connection part 732, and heat generated from the second light emitting chip 644 may be mainly discharged to the outside through the second connection part 734.

In the embodiment, since the lengths C11 and C2 of each of the first connection portion 732 and the second connection portion 734 in the first direction are larger than the length E of the third connection portion 736 in the first direction , Areas of the first connection portion 732 and the second connection portion 734 are larger than the area of the third connection portion 736. Therefore, by increasing the area of the connection portions 732 and 734 disposed adjacent to the light source 20, the embodiment improves the efficiency of discharging heat generated from the first light emitting chip 642 and the second light emitting chip 644 to the outside. Can be improved.

The first side portion 714 may be divided into an upper end portion 714-1 connected to the first upper surface portion 712 and a lower end portion 714-2 connected to the upper end portion 714-1. That is, the upper part 714-1 may include some of the first to third connection parts 732, 734, and 736, and the lower part 714-2 may be located below the upper part 714-1.

The length F1 of the upper part 714-1 in the third direction may be 0.6 mm to 0.7 mm, and the length F2 of the lower part 714-2 in the third direction may be 0.4 mm to 0.5 mm. The third direction may be a z-axis direction in the xyz coordinate system.

In order to improve the degree of coupling with the package body 620 and airtightness for preventing moisture penetration, the side surface of the upper end portion 714-1 and the side surface of the lower end portion 714-2 may have a step difference. For example, both side ends of the lower end 714-2 may have a shape protruding laterally with respect to the side surface of the upper end 714-1. The length B1 of the upper part 714-1 in the first direction may be 2.56 mm to 2.66 mm, and the length B2 of the lower part 714-2 in the first direction may be 2.7 mm to 3.7 mm. The thickness t1 of the first lead frame 620 may be 0.1mm to 0.2mm.

The second lead frame 630 may be disposed to surround at least one side of the first lead frame 620. For example, the second lead frame 630 may be disposed around the remaining side portions of the first lead frame 630 except for the first side portion 714.

The second lead frame 630 may include a second upper surface portion 742 and a second side portion 744. The second upper surface portion 742 may be disposed to surround the other side portions except for the first side portion of the first upper surface portion 712. 24 and 28, the second upper surface portion 742 is located on the same plane as the bottom of the cavity 601 and the first upper surface portion 712, and may be exposed by the cavity 601. The thickness t2 of the second lead frame 630 may be 0.1 mm to 0.2 mm.

The second upper surface portion 742 is a first portion 742-1, a second portion 742-2, and a third portion 742-3 according to a position surrounding the first upper surface portion 712. It can be classified as The second portion 742-2 of the second upper surface portion 742 may correspond to or face the second side portion of the first upper surface portion 712. The first portion 742-1 of the second upper surface portion 742 is connected to one end of the second portion 742-2 and corresponds to or faces any one of the remaining side portions of the first upper surface portion 712. I can. The third portion 742-3 of the second upper surface portion 742 is connected to the other end of the second portion 742-2, and corresponds to or faces any one of the remaining side portions of the first upper surface portion 712. can see.

The length H1 of the first part 742-1 and the third part 742-3 in the second direction may be 0.65mm to 0.75mm, and the length H2 in the first direction is 0.78mm to 0.88mm Can be The length I of the second portion 742-2 in the first direction may be 4.8 mm to 4.9 mm.

The second portion 742-2 of the second upper surface portion 742 may have a protrusion 702 corresponding to the groove portion 701 of the first upper surface portion 712. For example, the shape of the protrusion 702 may match the shape of the groove 701, and the protrusion 702 may be positioned to be aligned with the groove 701. The protrusion 702 may be located in the groove 701. The number of protrusions 702 may be the same as the number of grooves 701. The protrusion 702 and the groove 701 are spaced apart from each other, and a part of the package body 610 may be positioned therebetween. The protrusion 702 is a region for wire bonding with the first light emitting chip 642 and the second light emitting chip 644, and is aligned and positioned between the first light emitting chip 642 and the second light emitting chip 644. Wire bonding can be facilitated.

The length S5 of the protrusion 702 in the first direction may be 0.85 mm to 0.95 mm, the length S4 in the second direction may be 0.3 mm to 0.4 mm, and the protrusion 702 is the second part ( The angle θ2 formed with 742-2) may be greater than or equal to 90° and less than 180°.

The second side portion 744 may be bent from at least one side portion of the second upper surface portion 742. The second side portion 744 may be bent at a certain angle (eg, 90°) downward from the second upper surface portion 742.

For example, the second side portion 744 is a third portion of the first portion 744-1 and the second top portion 742 bent at one side of the first portion 742-1 of the second upper surface portion 742. It may include a second portion 744-2 that is bent at one side of the portion 742-3.

The first part 744-1 and the second part 744-2 of the second side part 744 may be bent so as to be positioned on the same side of the second lead frame 630. The first portion 744-1 of the second side portion 744 may be spaced apart from the first side portion 714 and may be positioned on one side (eg, left side) of the first side portion 714. The second portion 744-2 of the second side portion 744 may be spaced apart from the first side portion 714 and may be located on the other side (eg, right side) of the first side portion 714. The first side portion 714 and the second side portion 744 may be positioned on the same plane. As a result, as shown in FIG. 24, the first side portion 714 and the second side portion 744 may be exposed to the same side of the package body 610. The length A of the second side portion 744 in the first direction may be 0.4mm to 0.5mm, and the length G in the third direction may be 1.05mm to 1.15mm.

One side of the first portion 742-1 and the third portion 742-3 of the second upper surface portion 742 may have a bent step g1. For example, the bent step g1 is a portion where one side of the first portion 742-1 of the second upper surface portion 742 and one side of the first portion 744-1 of the second side portion 744 meet. It can be located adjacent to Since the area of the first upper surface portion 712 and the first side portion 714 positioned corresponding to the bent step g1 can be designed to be wide, the heat generating area may increase in the embodiment, thereby improving the heat generation efficiency. . This is because the area of the first lead frame 620 is related to the heat dissipation of the light emitting chips 642 and 644.

The other side surfaces of the first portion 742-1 and the third portion 742-3 of the second upper surface portion 742 may have a bent step g2. The reason for forming the bent step (g2) is to make it easy to observe the bonding material (eg, solder) with the naked eye when bonding the light emitting device package 200-1 to the flexible printed circuit board 10 to be.

The first side portion 714 of the first lead frame 620 and the second side portion 744 of the second lead frame 630 are flexible printed circuits of the light source modules 100-1 to 100-21 according to the embodiment. The light emitting chip 640 may be mounted to be in contact with the substrate 10, and thus the light emitting chip 640 may irradiate light in a direction 3 facing the side of the resin layer 40. That is, the light emitting device package 200-1 may have a side view type structure.

The Zener diode 645 may be disposed on the second lead frame 630 to improve the withstand voltage of the light emitting device package 200-1. For example, the Zener diode 645 may be disposed on the second upper surface 742 of the second lead frame 630.

The first light emitting chip 642 may be electrically connected to the second lead frame 630 by a first wire 652, and the second light emitting chip 644 is a second lead following the second wire 654. The frame 630 may be electrically connected, and the Zener diode 645 may be electrically connected to the first lead frame 620 by a third wire 656.

For example, one end of the first wire 652 may be connected to the first light emitting chip 642 and the other end may be connected to the protrusion 702. In addition, one end of the second wire 654 may be connected to the second light emitting chip 644 and the other end may be connected to the protrusion 702.

The light emitting device package 200-1 may further include a resin layer (not shown) filled in the cavity 601 to surround the light emitting chip. The resin layer may be made of a colorless transparent polymer resin material such as epoxy or silicone.

The light emitting device package 200-1 may implement red light by using only a red light emitting chip without using a phosphor, but the embodiment is not limited thereto. The resin layer may include a phosphor to change the wavelength of light emitted from the light emitting chip 640. For example, even if a light emitting chip of a color other than red is used, a light emitting device package that emits light of a desired color by changing a wavelength of light using a phosphor may be implemented.

31 illustrates a first lead frame 620-1 and a second lead frame 630 according to another exemplary embodiment. The same reference numerals as in FIG. 28 denote the same configuration, and contents overlapping with those described above will be omitted or briefly described.

Referring to FIG. 31, a first lead frame 620-1 has a structure in which the third connection part 736 is removed from the first lead frame 620 shown in FIG. 28. That is, the first lead frame 620-1 may have one through hole 720-1 adjacent to the boundary portion between the first upper surface portion 712 and the first side portion 714 ′. In addition, a first connection part 732 may be located on one side of the through hole 720-1, and a second connection part 734 may be located on the other side of the through hole 720-1.

32 illustrates a first lead frame 620-2 and a second lead frame 630-1 according to another exemplary embodiment. The same reference numerals as in FIG. 28 denote the same configuration, and contents overlapping with those described above will be omitted or briefly described.

Referring to FIG. 32, the first upper surface portion 712' of the first lead frame 620-2 is a groove portion 701 in the first upper surface portion 712 of the first lead frame 620 shown in FIG. May be omitted. In addition, the second portion 742-2 ′ of the second upper surface 742 ′ of the second lead frame 630-1 is a second upper surface 742 ′ of the second lead frame 630 illustrated in FIG. 32. The protrusion 702 may be omitted from the second part 742-2 of FIG. Other components may be the same as described in FIG. 28.

33 illustrates a first lead frame 620-3 and a second lead frame 630 according to another exemplary embodiment. The same reference numerals as in FIG. 28 denote the same configuration, and contents overlapping with those described above will be omitted or briefly described.

Referring to FIG. 33, a first lead frame 620-3 is formed in at least one of the connecting portions 732, 734, and 736 of the first lead frame 620 shown in FIG. 28. It may be a structure in which through holes h1, h2, and h3 are formed.

At least one of the connection portions 732-1, 734-1, and 736-1 of the first lead frame 620-3 is a fine through hole formed at a boundary between the first upper surface portion 712 and the first side portion 714 ( h1, h2, h3). In this case, the diameters of the fine through holes h1, h2, and h3 may be smaller than the lengths D11 and D12 of the through holes 722 and 724 in the first direction or the length D2 in the second direction. In addition, the number of fine through holes h1 and h2 formed in the first connection portion 732-1 and the second connection portion 734-1 is the number of fine through holes formed in the third connection portion 736-1 ( It may be more than the number of h3), but is not limited thereto. In addition, the shape of the fine through holes h1, h2, h3 may be circular, elliptical, or polygonal. The fine through-holes h1, h2, and h3 may facilitate bending of the first lead frame 620-3 and may improve a bonding force between the first lead frame 620-3 and the package body 610.

34 illustrates a first lead frame 620-4 and a second lead frame 630 according to another embodiment. The same reference numerals as in FIG. 28 denote the same configuration, and contents overlapping with those described above will be omitted or briefly described.

Referring to FIG. 34, the first lead frame 620-4 includes a first upper surface portion 712" and a first side portion 714". The first upper surface part 712" and the first side part 714" are modified examples of the first upper surface part 712 and the first side part 714 shown in FIG. 32. That is, in the first lead frame 620-4, through holes 722 and 724 are omitted from the first upper surface portion 712 and the first side portion 714 of the first lead frame 620 shown in FIG. A structure in which a plurality of fine through-holes h4 spaced apart from each other are provided in a region Q2 of the boundary portion Q between the first upper surface portion 712" and the first side portion 714" from which 722 and 724 are omitted to be.

The boundary portion Q of the first upper surface portion 712" and the first side portion 714" can be divided into a first boundary region Q1, a second boundary region Q2, and a third boundary region Q3. I can. The first boundary region Q1 may be a region corresponding to or aligned with the first light emitting chip 642, and the second boundary region Q2 may be a region corresponding to or aligned with the first light emitting chip 642. In addition, the third boundary region Q3 may be a region between the first boundary region Q1 and the second boundary region Q2. For example, the first boundary area Q1 may be an area corresponding to the first connection portion 732 shown in FIG. 28, and the second boundary area Q2 is the second connection portion 734 shown in FIG. 28. It may be an area corresponding to.

The first boundary region Q1 and the second boundary region Q2 serve as a passage for transferring heat generated from the first light emitting chip 642 and the second light emitting chip 644, and a plurality of fine through holes h4 ) May serve to facilitate bending between the first upper surface part 712" and the first side part 714". In FIG. 32, the diameters of the plurality of fine through-holes h4 are the same, and the separation distance is the same, but the embodiment is not limited thereto, and in another embodiment, at least one of the plurality of fine through-holes h4 has a different diameter. Can be, or the separation distance can be different.

35 illustrates a first lead frame 620 and a second lead frame 630-2 according to another exemplary embodiment. The second lead frame 630-2 of FIG. 35 may be a modified example of the second lead frame 630 of FIG. 26. The same reference numerals as in FIG. 28 denote the same configuration, and contents overlapping with those described above will be omitted or briefly described.

Referring to FIG. 35, unlike the second portion 742-2 of the second upper surface portion 742 illustrated in FIG. 28, the second portion 742-of the second upper surface portion 742 ″ illustrated in FIG. 35. 2") has a broken structure and does not connect the first part 742-1 and the third part 742-3.

The second upper surface portion 742" of the second lead frame 630-2 may include a first portion 742-1, a second portion 742-2", and a third portion 742-3. I can. Each of the first to third parts 742-1, 742-2 ″ and 742-3 may be positioned around any one of the sides of the first upper surface 712 of the first lead frame 620. I can.

The second portion 742-2 ″ of the second upper surface portion 742 ″ is connected to the first region 704 and the third part 742-3, and is The first area 704 and the second area 705 spaced apart from each other may be formed. Since the package body 610 is filled in the space 706 spaced apart between the first region 704 and the second region 705, the bonding force between the package body 610 and the second lead frame 630-2 is reduced. Can be improved. The second lead frame 630-2 shown in FIG. 34 may be divided into a first sub-frame 744-1, 742-1, and 704, and a second sub-frame 744-2, 742-3, and 705. And both can be electrically separated from each other.

36 illustrates a first lead frame 810 and a second lead frame 820 according to another embodiment.

Referring to FIG. 36, the first lead frame 810 includes a first upper surface portion 812 and a first side portion 814 and a second side portion 816 bent from the first side portion of the first upper surface portion 812. Can include. Light emitting chips 642 and 644 may be disposed on the first upper surface 812.

The second side portion of the first upper surface portion 812 may have one or more first groove portions 803 and 804 and a first protrusion portion 805. In this case, the second side portion of the first upper surface portion 812 may be a side portion facing the first side portion of the first upper surface portion 812. For example, the second side portion of the first upper surface portion 812 may have two first grooves 803 and 804 and one first protrusion 805 positioned between the first grooves 803 and 804, but is limited thereto. It does not become. The first grooves 803 and 804 have a shape corresponding to the second protrusions 813 and 814 provided in the second lead frame 820 to be described later, and the first protrusion 805 is provided in the second lead frame 820. It may have a shape corresponding to the second groove part 815. The first grooves 803 and 804 and the first protrusions 805 shown in FIG. 34 have a rectangular shape, but are not limited thereto, and may be implemented in various shapes such as a circle, a polygon, and an ellipse. The light emitting chips 642 and 644 may be disposed on the first upper surface 812 on both sides of the first grooves 803 and 804.

The first side portion 814 is connected to one region of the first side of the first upper surface portion 712, and the second side portion 816 is connected to another region of the first side of the first upper surface portion 712, The first side portion 814 and the second side portion 816 may be spaced apart from each other. The first side portion 814 and the second side portion 816 may be exposed from the same side of the package body 610.

The first lead frame 610 may have one or more through holes 820 in at least one of the first upper surface portion 812 and the first side portion 814. For example, the first lead frame 810 may have one or more through holes 840 adjacent to a boundary portion between the first upper surface portion 812 and the first side portion 814. The through hole 820 may have the same structure as described in FIGS. 28 and 30, and may have the same function.

The first lead frame 810 is located adjacent to the boundary portion 801 of the first upper surface portion 812 and the first side portion 814, is spaced apart from each other by the through hole 720, and the first upper surface portion 712 ) And the first side portion 714 may have connection portions 852, 854, and 856 that connect to each other. The structure and function of the connection portions 852, 854, and 856 may be the same as those described in FIGS. 28 and 30. The first lead frame 810 may have at least one connection portion corresponding to or adjacent to the light emitting chip 642 or 644.

The length in the first direction of the connection portions (e.g., 852, 854) corresponding to or adjacent to the light emitting chips 642 and 644 is the first of the connection portions (e.g., 856) that do not correspond to or are not adjacent to the light emitting chips 642 It can be larger than the length of the direction.

In order to improve the degree of coupling with the package body 620 and airtightness for preventing moisture penetration, the lower side portion of the second side portion 814 may have a structure protruding in the lateral direction.

The second lead frame 820 may be disposed around at least one side of the first lead frame 810. The second lead frame 820 may include a second upper surface portion 822 and a third side portion 824. The second upper surface portion 822 may be divided into a first portion 832 and a second portion 834 according to a position disposed around the first upper surface portion 812.

The second portion 834 of the second upper surface portion 822 may correspond to or face the second side portion of the first upper surface portion 812. The first portion 832 of the second upper surface portion 822 is connected to one end of the second portion 834 and may correspond to or face a third side portion of the first upper surface portion 712. The third side may be a first side or a side perpendicular to the second side.

The second portion 834 of the second upper surface 822 may have second protrusions 813 and 814 corresponding to the first grooves 803 and 804 of the first upper surface 812. The second protrusions 813 and 814 are regions for wire bonding with the first light emitting chip 642 and the second light emitting chip 644, and between the first light emitting chip 642 and the second light emitting chip 644 Positioning can facilitate wire bonding.

The third side portion 824 may be bent at a certain angle (eg, 90°) downward from the second upper surface portion 822. For example, the third side portion 824 may be bent at one side of the first portion 832 of the second upper surface portion 822. The second side portion 816 and the third side portion 824 may have a left-right symmetric shape based on the first side portion 814. In order to improve the degree of coupling with the package body 620 and airtightness for preventing moisture penetration, the lower side portion of the third side portion 824 may have a structure protruding in the lateral direction. The first side portion 814, the second side portion 816, and the third side portion 824 may be exposed to the same side of the package body 610.

37 is a perspective view of a light emitting device package 200-2 according to another embodiment, FIG. 38 is a top view of the light emitting device package 200-2 shown in FIG. 37, and FIG. 39 is shown in FIG. 37 A front view of the light emitting device package 200-2 is shown, FIG. 40 is a cross-sectional view of the light emitting device package 200-2 shown in FIG. 37 in the cd direction, and FIG. 41 is a first lead frame shown in FIG. It shows 620' and a second lead frame 630'. The same reference numerals as those of FIGS. 24 to 28 denote the same configuration, and contents overlapping with those described above will be omitted or briefly described.

37 to 41, the first lead frame 620 ′ of the light emitting device package 200-2 may include a first upper surface portion 932 and a first side portion 934. Unlike the first upper surface portion 712 illustrated in FIG. 28, the first upper surface portion 932 illustrated in FIG. 41 does not have a groove portion formed thereon. In addition, the second upper surface portion 942 of the second lead frame 630 ′ may be similar to a structure in which the second portion 742-2 of the second upper surface portion 742 illustrated in FIG. 32 is omitted.

The first side portion 934 may have the same structure as the first side portion 714 shown in FIG. 32. The length P1 of the first upper surface portion 932 in the first direction may be smaller than the length of the first upper surface portion 712 shown in FIG. 28, and the length of the first upper surface portion 932 in the second direction ( J2) may be greater than the length J1 of the first upper surface portion 712 in the second direction. For example, the length P1 of the first upper surface portion 932 in the first direction may be 4.8 mm to 4.9 mm, and the length J2 in the second direction may be 0.67 mm to 0.77 mm. Therefore, since the area of the first upper surface portion 932 illustrated in FIG. 37 is larger than the area of the first upper surface portion 712 illustrated in FIG. 32, the embodiment of FIG. 37 can mount a light emitting chip having a larger size. have. The sizes of the first side portion 944, the through holes 722 and 724, and the connection portions may be the same as described in FIG. 29.

The second lead frame 630 ′ may include a second upper surface portion 942 and a second side portion 944. The second upper surface portion 942 may include a first portion 942-1 disposed around a third side of the first upper surface portion 932 and a second portion 942-2 disposed around the fourth side portion. I can. The third side of the first upper surface 932 is a side perpendicular to the first side of the first upper surface 932, and the fourth side of the first upper surface 932 is the third side of the first upper surface 932. 3 may be a side facing the side.

The first portion 942-1 and the second portion 942-2 of the second upper surface portion 942 may be positioned to be spaced apart from each other, and may be electrically separated from each other.

The second side portion 944 includes a first portion 942-1 connected to the first portion 942-1 of the second top portion 942 and a second portion 942-2 of the second top portion 942. ) May include a second part 944-2 connected to it. However, the length P2 in the first direction of the first portion 942-1 and the second portion 942-2 of the second upper surface portion 942 is the second upper surface portion 742 shown in FIG. It may be greater than the length H2 of the first portion 742-1 and the third portion 742-3 in the first direction.

For example, the length P2 of the first portion 942-1 and the second portion 942-2 of the second upper surface portion 942 in the first direction is 1.04mm to 1.14mm, and the length in the second direction ( P3) may range from 0.45mm to 0.55mm.

The length in the first direction of the protruding portion S22 of the first upper surface portion 932 protruding to support the first lead frame 620 ′ in the lead frame array may be 0.14 mm to 0.24 mm.

The first light emitting chip 642 may be electrically connected to the first portion 942-1 of the second upper surface 942 by a first wire 653, and the second light emitting chip 644 may be a second wire It may be electrically connected to the first portion 942-2 of the second upper surface portion 942 by 655.

Both the first light emitting chip 642 and the second light emitting chip 644 may emit light having the same wavelength. For example, the first light emitting chip 642 and the second light emitting chip 644 may be red light emitting chips that generate red light.

In addition, the first light emitting chip 642 may generate light having different wavelengths. For example, the first light emitting chip 642 may be a red light emitting chip, and the second light emitting chip 644 may be a yellow light emitting chip. 642 and the second light emitting chip 644 may operate separately.

A first power (eg, negative (-) power) is supplied to the first lead frame 620 ′, and a second power (eg, positive (+) power) may be supplied to the second lead frame 630 ′. have. Since the second lead frame 630' is divided into two electrically separated parts 942-1 and 944-1, and 942-2 and 944-2, the first lead frame 620' is common By using as an electrode and separately supplying second power to the first portion 942-1 and the second portion 942-2 of the second upper surface portion 942 of the second lead frame 630', the first The light emitting chip 642 and the second light emitting chip 644 may be operated separately.

Therefore, when the light emitting device package 200-2 shown in FIG. 37 is mounted on the light source modules 100-1 to 100-21 according to the embodiment, the light source modules 100-1 to 100-21 have various colors. Can cause the surface light source. For example, when only the first light emitting chip 642 is operated, the embodiment may generate a red surface light source, and when the second light emitting chip 644 is operated, the embodiment may generate a yellow surface light source.

42 shows measurement temperatures of the light emitting device packages 200-1 and 200-2 according to the embodiment. The measurement temperature shown in FIG. 42 represents the temperature of the light emitting chip when the light emitting device package emits light.

Case 1 represents the measurement temperature of the light emitting chip when the length of the first portion and the second portion of the side portion of the first lead frame in the first direction is the same as the length of the third portion, and case 2 ) Represents the measurement temperature of the light emitting chip shown in FIG. 24, and Case 3 represents the measurement temperature of the light emitting chip shown in FIG. 35.

Referring to FIG. 42, the measurement temperature t1 of Case 1 is 44.54°C, the measurement temperature t2 of Case 2 is 43.66°C, and the measurement temperature t3 of Case 3 is 43.58°C.

Accordingly, by changing the design of the connection portions 732, 734, and 736 of the first side portion 714 of the first lead frame 620, the embodiment can improve the heat dissipation effect, and thus, the light emitting device packages 200-1 and 200 Since the temperature rise of the light emitting chip 640 mounted in -2) can be alleviated, the light intensity can be reduced and the occurrence of wavelength shift can be prevented.

43 shows an embodiment of the light emitting chip 640 shown in FIG. 24. The light emitting chip 640 illustrated in FIG. 43 may be, for example, a vertical chip that emits red light having a wavelength range of 600 nm to 690 nm.

Referring to FIG. 43, the light emitting chip 640 includes a second electrode layer 1801, a reflective layer 1825, a light emitting structure 1840, a passivation layer 1850, and a first electrode layer 1860.

The second electrode layer 1801 provides power to the light emitting structure 1840 together with the first electrode layer 1860. The second electrode layer 1801 may include an electrode material layer 1810 for current injection, a support layer 1815 disposed on the electrode material layer 1810, and a bonding layer 1820 disposed on the support layer 1815. have. The second electrode layer 1801 may be bonded to the first lead frame 620 of the light emitting device package 200-1 illustrated in FIG. 28, for example, the first upper surface portion 712.

The electrode material layer 1810 may be Ti/Au, and the support layer 1815 may be a metal or semiconductor material. In addition, the support layer 1815 may be a material having high electrical conductivity and thermal conductivity. For example, the support layer 1815 is a metal including at least one of copper (Cu), copper alloy, gold (Au), nickel (Ni), molybdenum (Mo), and copper-tungsten (Cu-W). It may be a material, or a semiconductor including at least one of Si, Ge, GaAs, ZnO, and SiC.

The bonding layer 1820 is disposed between the support layer 1815 and the reflective layer 1825, and the bonding layer 1820 serves to bond the support layer 1815 to the reflective layer 1825. The bonding layer 1820 may include a bonding metal material, for example, at least one of In, Sn, Ag, Nb, Pd, Ni, Au, and Cu. Since the bonding layer 1820 is formed to bond the support layer 815 through a bonding method, the bonding layer 1820 may be omitted when the support layer 1815 is formed by plating or deposition.

The reflective layer 1825 is disposed on the bonding layer 820. The reflective layer 1825 reflects light incident from the light emitting structure 1840, thereby improving light extraction efficiency. The reflective layer 825 may be formed of a reflective metal material, such as a metal or alloy including at least one of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, and Hf.

In addition, the reflective layer 1825 is a conductive oxide layer, such as indium zinc oxide (IZO), indium zinc tin oxide (IZTO), indium aluminum zinc oxide (IAZO), indium gallium zinc oxide (IGZO), and indium gallium tin oxide (IGTO). , AZO (aluminum zinc oxide), ATO (antimony tin oxide) can be used to form a single layer or a multi-layer. In addition, the reflective layer 825 may be formed of multiple layers of metal and conductive oxides such as IZO/Ni, AZO/Ag, IZO/Ag/Ni, and AZO/Ag/Ni.

An ohmic region 1830 may be positioned between the reflective layer 1825 and the light emitting structure 1840. The ohmic region 1830 is a region in ohmic contact with the light emitting structure 1840 and serves to smoothly supply power to the light emitting structure 1840.

The light-emitting structure 1840 and a material in ohmic contact, for example, Be, Au, Ag, Ni, Cr, Ti, Pd, Ir, Sn, Ru, Pt, a material including at least any one of Hf light-emitting structure 1840 The ohmic region 1830 may be formed by making ohmic contact with the. For example, the material forming the ohmic region 1830 may include AuBe and may be in the form of a dot.

The light emitting structure 1840 may include a window layer 1842, a second semiconductor layer 1844, an active layer 1846, and a first semiconductor layer 1848. The window layer 1842 is a semiconductor layer disposed on the reflective layer 1825 and may have a composition of GaP.

The second semiconductor layer 1844 is disposed on the window layer 1842. The second semiconductor layer 1844 may be implemented as a compound semiconductor such as Group 3-5, Group 2-6, or the like, and may be doped with a second conductivity type dopant. For example, the first semiconductor layer 1844 may include any one of AlGaInP, GaInP, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, and a p-type dopant (for example, Mg, Zn, Ca, Sr, Ba) may be doped.

The active layer 1846 is disposed between the second semiconductor layer 1844 and the first semiconductor layer 848, and electrons and holes provided from the second semiconductor layer 1844 and the first semiconductor layer 1848 hole) can generate light by energy generated in the process of recombination.

The active layer 1846 may be a compound semiconductor of Group 3-5, Group 2-6, and has a single well structure, a multiple well structure, a quantum-wire structure, or a quantum dot structure. Can be formed.

For example, the active layer 1846 may have a single or multiple quantum well structure having a well layer and a barrier layer. The well layer may be a material having a band gap lower than the energy band gap of the barrier layer. For example, the active layer 1846 may be AlGaInP or GaInP.

The first semiconductor layer 1848 may be formed of a semiconductor compound. The first semiconductor layer 1848 may be implemented as a compound semiconductor such as Group 3-5 and Group 2-6, and may be doped with a first conductivity type dopant. For example, the first semiconductor layer 1848 may include any one of AlGaInP, GaInP, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, and an n-type dopant (for example: Si, Ge, Sn, etc.) may be doped.

The light emitting structure 1840 may generate red light having a wavelength range of 600 nm to 690 nm, and the first semiconductor layer 1848, the active layer 1846, and the second semiconductor layer 1844 may have a composition capable of generating red light. have. In order to increase light extraction efficiency, a roughness 1870 may be formed on the top surface of the first semiconductor layer 848.

The passivation layer 1850 is disposed on the side of the light emitting structure 1840. The passivation layer 1850 serves to electrically protect the light emitting structure 1840. The passivation layer 1850 is an insulating material such as SiO ₂ , SiO _x , SiO _x N _y , Si ₃ N ₄ , or Al ₂ O ₃ to be formed I can. The passivation layer 1850 may be disposed on at least a portion of an upper surface of the first semiconductor layer 1848.

The first electrode layer 1860 may be disposed on the first semiconductor layer 1848 and may have a predetermined pattern. The first electrode layer 1860 may be a single layer or a plurality of layers. For example, the first electrode layer 1860 may include a first layer 1862, a second layer 1864, and a third layer 1866 that are sequentially stacked. The first layer 1862 is in ohmic contact with the first semiconductor layer 1848 and may be formed of GaAs. The second layer 1864 may be formed of an AuGe/Ni/Au alloy. The third layer 1866 may be formed of a Ti/Au alloy.

24 and 37, the first electrode layer 860 may be electrically bonded to the second lead frame 630 or 630 ′ by wires 652, 654, 653, or 655.

In general, as the temperature of the light emitting chip increases, a wavelength shift occurs and the luminous intensity decreases. However, compared to the blue light emitting chip (Blue LED) that generates blue light and the light emitting chip (Amber LED) that generates yellow light, the red light emitting chip (Red LED) that generates red light has the degree of wavelength shift and light intensity decrease according to the increase in temperature. Is more severe. Therefore, for a light emitting device package and a light source module using a red light emitting chip, heat dissipation measures to suppress an increase in temperature of the light emitting chip are very important.

However, the light source modules 100-1 to 100-21 and the light emitting device packages 200-1 to 200-2 included in the lighting device 1 according to the embodiment can improve heat dissipation efficiency as described above. Therefore, even if a red light-emitting chip is used, it is possible to suppress an increase in temperature of the light-emitting chip, thereby suppressing a wavelength shift and a decrease in light intensity.

44 shows a lighting device 2 according to another embodiment. Referring to FIG. 48, the lighting device 2 includes a housing 1310, a light source module 1320, a diffusion plate 1330, and a micro lens array 1340.

The housing 1310 accommodates the light source module 1320, the diffusion plate 1330, and the micro lens array 1340, and may be made of a light-transmitting material.

The light source module 1320 may be any one of the above-described embodiments 100-1 to 100-17.

The diffusion plate 1330 may serve to uniformly diffuse the light emitted through the light source module 1320 over the entire surface. The diffusion plate 1330 may be made of the same material as the optical plate 70 described above, but is not limited thereto. In another embodiment, the diffusion plate 1330 may be omitted.

The micro lens array 1340 may have a structure in which a plurality of micro lenses 1344 are disposed on the base film 1342. Each of the micro lenses 1344 may be spaced apart from each other by a predetermined interval. Each microlens 1344 may be flat, and each microlens 1344 may be spaced apart from each other with a pitch of 50 to 500 micrometers.

In FIG. 44, the diffusion plate 1330 and the micro lens array 1340 are formed as separate components, but in another embodiment, the diffusion plate 1330 and the micro lens array 1340 may be integrally formed.

46 illustrates a vehicle tail light 900-2 according to an embodiment, and FIG. 47 illustrates a general vehicle tail light according to an embodiment.

Referring to FIG. 46, the vehicle tail light 900-2 may include a first light source module 952, a second light source module 954, a third light source module 956, and a housing 970.

The first light source module 952 may be a light source for the role of a direction indicator, the second light source module 954 may be a light source for the role of a vehicle width light, and the third light source module 956 may be used as a stop light. It may be a light source, but is not limited thereto, and roles thereof may be changed.

The housing 970 accommodates the first to third light source modules 952, 954, 956, and may be made of a light-transmitting material. The housing 970 may have a bend according to the design of the vehicle body. At least one of the first to third light source modules 952, 954, 956 may be implemented in any one of the above-described embodiments 100-1 to 100-17.

In the case of taillights, when the vehicle is stopped, the intensity of light must be 110 candelas (cd) or more to enable visual recognition from a distance, and usually requires 30% or more of the light intensity. In addition, for light output of 30% or more, the number of light emitting device packages applied to the light source module (for example, 952, 954 or 956) must be increased by 25% to 35% or more, or the output of individual light emitting device packages must be increased by 25% to 35%. .

If the number of light emitting device packages is increased, it may be difficult to manufacture due to the limitation of the arrangement space. Therefore, by increasing the output of individual light emitting device packages mounted on the light source module, the desired light intensity (e.g., 110 candelas or more) ) Can be obtained. In general, since the product of the output (W) and the number (N) of the light emitting device package is the total output of the light source module, it is possible to determine the appropriate output and number of the light emitting device packages according to the area of the light source module in order to obtain the desired light intensity. have.

For example, in the case of a light emitting device package having a power consumption of 0.2 watt and an output of 13 lumens (lm), 37 to 42 units may be arranged in a certain area to produce a light intensity of about 100 candelas. However, in the case of a light emitting device package having a power consumption of 0.5 watts and a luminous flux of 30 lumens (lm), light of similar intensity can be obtained even if only 13 to 15 units are arranged in the same area. The number of light emitting device packages to be disposed in a light source module having a certain area in order to obtain a constant output may be determined according to an arrangement pitch, a content of a light diffusion material in the resin layer, and a pattern shape of the reflective layer. Here, the interval may be a distance from an intermediate point of one of the two adjacent light emitting device packages to the other intermediate point.

When the light-emitting device packages are disposed in the light source module, they are disposed at regular intervals. In the case of the high-power light-emitting device package, the number of arrangements can be relatively reduced, and since they can be arranged at wide intervals, space can be efficiently used. In addition, when the high-power light emitting device packages are arranged at narrow intervals, higher light intensity may be produced than when arranged at wide intervals.

48A and 48B illustrate spacing of light emitting device packages of a light source module used in a rear light for a vehicle according to an embodiment. For example, FIG. 48A may be the first light source module 952 shown in FIG. 46, and FIG. 48B may be the second light source module 954 shown in FIG. 46.

48A and 48B, the light emitting device packages 99-1 to 99-n, or 98-1 to 98-m may be spaced apart on the substrate 10-1 or 10-2. have. It is a natural number with n>1 and may be a natural number with m>1.

The spacing between two adjacent light emitting device packages (eg, ph1, ph2, ph3 or pc1, pc2, pc3) may be different from each other, but the range of the spacing is preferably 8 to 30 mm.

Because there may be a change depending on the power consumption of the light emitting device package (99-1 to 99-n, or 98-1 to 98-m), but the arrangement interval (e.g., ph1, ph2, ph3 or pc1, pc2, pc3) This is because if the thickness is less than 8 mm, light from neighboring light emitting device packages (eg, 99-3 to 99-4) interfere with each other to generate a recognizable bright area. In addition, when the arrangement interval (eg, ph1, ph2, ph3 or pc1, pc2, pc3) is 30 mm or more, dark portions may be generated due to an area where light does not reach.

As described above, since the light source modules 100-1 to 100-17 themselves have flexibility, they can be easily mounted on the housing 970 having a curve. Therefore, the rear light 900-2 for a vehicle according to the embodiment The degree of freedom can be improved.

In addition, since the light source modules 100-1 to 100-17 have a structure in which heat dissipation efficiency is improved, the vehicle tail light 900-2 according to the embodiment may prevent the occurrence of wavelength shift and decrease in light intensity.

Since the general vehicle tail light shown in FIG. 47 is a point light source, partial spots 962 and 964 may appear on the light emitting surface during light emission. However, since the vehicle tail light 900-2 according to the embodiment is a surface light source, the light emitting surface Uniform luminance and illuminance can be implemented throughout.

As described above and shown in connection with a preferred embodiment for illustrating the technical idea of the present invention, the present invention is not limited to the configuration and operation as shown and described as described above, without departing from the scope of the technical idea It will be well understood by those of ordinary skill in the art that a number of suitable modifications and variations are possible for the present invention. Therefore, all such suitable modifications, modifications and equivalents should be considered to be within the scope of the present invention.

10: printed circuit board 20: light source
30: reflective sheet 31: reflective pattern
40: resin layer 52: first optical sheet
54: second optical sheet 56: adhesive layer
60: optical pattern 70: optical plate
80: first air gap 81: second air gap
90: light reflecting member 91: indirect light emitting air gap
110: heat dissipation member 101-1 to 101-n: sub light source module
410-1, 420-1, 410-2: connection fixing part 510, 520, 530, 540: connector
610: package body 620: first lead frame
630: second lead frame 640: light emitting chip
645: Zener diode 650: wire
712: first upper surface portion 714: first side portion
722,724: through hole 742: second upper surface portion
744: second side portion 801: second electrode layer
810: electrode material layer 815: support layer
820: bonding layer 825: reflective layer
830: ohmic region 840: light emitting structure
850: passivation layer 860: first electrode layer
900: vehicle light 910: light source module
920: light housing

Claims (10)

delete delete delete delete delete delete Board;
A reflective sheet disposed on the substrate;
A light source disposed on the substrate and passing through the reflective sheet; And
Including a resin layer disposed on the reflective sheet,
The light source includes a plurality of light-emitting elements arranged in two or more rows,
The resin layer includes a plurality of side surfaces having different shapes from each other,
At least one of the plurality of side surfaces has a curved surface or an inclined surface,
A lighting device having a different spacing between three light-emitting elements among a plurality of light-emitting elements arranged in one of the two rows.
The method of claim 7,
At least one side of the plurality of side surfaces includes a plurality of planes,
At least two of the plurality of planes are parallel to each other, at least one plane connects the at least two planes to each other,
The at least one plane is arranged to be inclined with respect to the at least two planes.
The method of claim 7,
At least one side of the plurality of side surfaces includes a plurality of planes and at least one curved surface,
The at least one curved surface is a lighting device connecting the plurality of planes.
The method according to any one of claims 7 to 9,
Including an optical pattern layer disposed on the resin layer,
The optical pattern layer includes a first optical sheet, a second optical sheet disposed to be spaced apart from the first optical sheet, an optical pattern disposed on a lower surface of the second optical sheet, and between the first optical sheet and the second optical sheet. Including an adhesive layer to be disposed,
The optical pattern is arranged to be spaced apart from each other so as to have the adhesive layer and the air gap.

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