KR20230152524A - Display module - Google Patents

Abstract

A display module is disclosed. The disclosed display module includes a substrate with a plurality of electrode pads arranged on one surface, a plurality of first barriers disposed between adjacent electrode pads, and a plurality of inorganic light emitting diodes having device electrodes connected to the plurality of electrode pads, , a plurality of first barriers may be disposed between a pair of electrode pads, each corresponding to one inorganic light emitting diode.

Description

Display module{DISPLAY MODULE}

This disclosure relates to a display module.

The display panel includes a TFT substrate with a plurality of thin film transistors (TFTs) and a plurality of light emitting diodes mounted on the substrate.

Many of the light emitting diodes may be inorganic light emitting diodes that emit light on their own. Multiple light emitting diodes operate on a pixel or sub-pixel basis to express various colors. The operation of each pixel or subpixel is controlled by multiple TFTs. Each light emitting diode emits a different color, such as red, green, and blue.

A plurality of light emitting diodes may be transferred from a wafer or relay substrate to a TFT substrate by a pick and place transfer method, a stamping transfer method, or a laser transfer method.

The purpose of the present disclosure is to provide a display module that prevents short circuits between electrode pads of a TFT substrate due to conductive balls of anisotropic conductive film (ACF).

In order to achieve the above object, the present disclosure includes a substrate having a plurality of electrode pads arranged on one surface; A plurality of first barriers disposed between adjacent electrode pads; and a plurality of inorganic light emitting diodes having device electrodes connected to the plurality of electrode pads, wherein the plurality of first barriers are a display module disposed between a pair of electrode pads each corresponding to one inorganic light emitting diode. provides.

Each of the plurality of first barriers may have a height higher than the height of the plurality of electrode pads.

At least one of the plurality of first barriers may have an inclined surface formed on the top.

At least one of the plurality of first barriers may have a first inclined surface and a second inclined surface respectively inclined toward the pair of electrode pads.

At least one of the plurality of first barriers may have a first curved surface and a second curved surface respectively formed toward the pair of electrode pads.

At least one of the plurality of first barriers may have a curved top.

The plurality of first barriers may be made of an insulating material.

Each of the plurality of first barriers includes a body made of an organic material; and a first thin film made of an inorganic material and covering the body.

Each of the plurality of first barriers may further include a second thin film formed between the substrate and the body.

The display module according to an embodiment further includes at least one second barrier disposed between a pair of first electrode pads formed on the substrate and a pair of second electrode pads adjacent to the pair of first electrode pads. The at least one second barrier may have a height higher than the plurality of electrode pads.

The at least one second barrier may have a height that is less than or equal to the height of the first barrier.

The at least one second barrier may have an inclined or curved surface formed on its top.

The at least one second barrier may be made of an insulating material.

The display module according to an embodiment may further include a third barrier connected to the plurality of first barriers and the at least one second barrier and surrounding a plurality of electrode pads, wherein the third barrier is connected to the plurality of first barriers and the at least one second barrier. It can have a height higher than the electrode pad.

The first barrier, the second barrier, and the third barrier may have the same height.

The third barrier may have a height greater than or equal to the height of the first barrier or the second barrier.

The third barrier may have an inclined or curved surface formed on its top.

The third barrier may be made of an insulating material.

1 is a block diagram showing a display device according to an embodiment of the present disclosure.
Figure 2 is a plan view showing a display panel included in a display device according to an embodiment of the present disclosure.
FIG. 3 is a diagram illustrating an example of pixels provided in a display panel according to an embodiment of the present disclosure.
Figure 4 is a cross-sectional view taken along line A-A' shown in Figure 3.
Figure 5 is a diagram showing a first barrier disposed between electrode pads of a TFT substrate.
Figure 6 is a cross-sectional view taken along line B-B' shown in Figure 5.
7A to 7C are cross-sectional views showing various shapes of the first barrier disposed between electrode pads of the substrate.
Figures 8 and 9 are cross-sectional views showing examples in which the first barrier disposed between electrode pads of the substrate is formed using an inorganic material and an organic material.
FIG. 10 is a diagram illustrating another example of pixels provided in a display panel according to an embodiment of the present disclosure.
FIG. 11 is a cross-sectional view taken along line C-C' shown in FIG. 10.
12 and 13 are cross-sectional views showing various examples in which the first barrier and the second barrier disposed between electrode pads of the substrate are formed using inorganic materials and organic materials.
FIG. 14 is a diagram illustrating another example of pixels provided in a display panel according to an embodiment of the present disclosure.
FIG. 15 is a cross-sectional view taken along line D-D' shown in FIG. 14.
16 to 18 are cross-sectional views showing various examples in which the first barrier and the second barrier disposed between the electrode pads of the substrate and the third barrier surrounding the electrode pads of the substrate are formed using inorganic materials and organic materials.

Hereinafter, various embodiments will be described in more detail with reference to the attached drawings. The embodiments described herein may be modified in various ways. Specific embodiments may be depicted in the drawings and described in detail in the detailed description. However, the specific embodiments disclosed in the attached drawings are only intended to facilitate understanding of the various embodiments. Accordingly, the technical idea is not limited to the specific embodiments disclosed in the attached drawings, and should be understood to include all equivalents or substitutes included in the spirit and technical scope of the invention.

In the present disclosure, terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but these components are not limited by the above-described terms. The above-mentioned terms are used only for the purpose of distinguishing one component from another.

In the present disclosure, terms such as “comprise” or “have” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are not intended to indicate the presence of one or more other features. It should be understood that this does not exclude in advance the possibility of the existence or addition of elements, numbers, steps, operations, components, parts, or combinations thereof. When a component is said to be "connected" or "connected" to another component, it is understood that it may be directly connected to or connected to the other component, but that other components may exist in between. It should be. On the other hand, when it is mentioned that a component is “directly connected” or “directly connected” to another component, it should be understood that there are no other components in between.

In the present disclosure, the expression 'same' means not only complete matching but also including a degree of difference taking into account the processing error range.

In addition, when describing the present disclosure, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the gist of the present disclosure, the detailed description thereof is abbreviated or omitted.

In the present disclosure, the display module may include a display panel equipped with an inorganic light emitting diode for displaying images. Here, the display panel may be a flat display panel or a curved display panel, and is equipped with a plurality of inorganic light emitting diodes (e.g., micro LED or mini LED) of 100㎛ or less, providing better contrast compared to LCD that requires a backlight. , response time and energy efficiency.

The inorganic light emitting diode applied to the present disclosure has longer brightness, luminous efficiency, and lifetime than OLED (organic light emitting diode). An inorganic light-emitting device may be a semiconductor chip that can emit light on its own when power is supplied. Micro LED, an inorganic light emitting diode, has fast response speed, low power, and high brightness. For example, micro LEDs are more efficient at converting electricity into photons than LCDs or OLEDs. That is, it has higher “brightness per watt” compared to LCD or OLED displays. Accordingly, micro LED can produce the same brightness with about half the energy compared to LED or OLED that exceeds 100㎛. In addition, micro LED is capable of realizing high resolution, excellent color, contrast, and brightness, so it can accurately express a wide range of colors and produce a clear screen even outdoors in bright sunlight. In addition, micro LED is resistant to burn-in and generates less heat, ensuring a long lifespan without deformation. Micro LED may have a flip chip structure in which an anode and a cathode electrode are formed on the same first side and a light emitting surface is formed on a second side located on an opposite side of the first side on which the electrodes are formed.

In the present disclosure, the target substrate has a TFT layer on which a TFT (Thin Film Transistor) circuit is formed on the front surface, and a power supply circuit that supplies power to the TFT circuit, a data drive driver, and a gate on the rear surface. A driving driver and a timing controller that controls each driving driver may be disposed. Multiple pixels arranged in the TFT layer can be driven by a TFT circuit.

In the present disclosure, the TFT provided in the display module may be a low-temperature polycrystalline silicon (LTPS) TFT, a low-temperature polycrystalline oxide (LTPO) TFT, or an oxide TFT.

In the present disclosure, the target substrate is a glass substrate, a synthetic resin series having flexibility (e.g., polyimide (PI), polyethylene terephthalate (PET), polyethersulfone (PES), polyethylene naphthalate (PEN), and polycarbonate (PC). ), etc.) substrates or ceramic substrates can be used.

In the present disclosure, a TFT layer with a TFT circuit formed may be disposed on the front surface of the target substrate, and no circuit may be disposed on the rear surface of the target substrate. The TFT layer may be formed integrally on the target substrate or may be produced as a separate film and attached to one side of the glass substrate.

In the present disclosure, the front surface of the target substrate may be divided into an active area and an inactive area. The active area may correspond to an area occupied by the TFT layer on the front surface of the target substrate, and the inactive area may correspond to an area excluding the area occupied by the TFT layer on the front surface of the target substrate.

In the present disclosure, the edge area of the target substrate may be the outermost area of the glass substrate. Additionally, the edge area of the target substrate may be the remaining area excluding the area where the circuit of the target substrate is formed. Additionally, the edge area of the target substrate may include a portion of the front surface of the target substrate adjacent to the side surface of the target substrate and a portion of the rear surface of the target substrate adjacent to the side surface of the target substrate. The target substrate may be formed in a quadrangle type. For example, the target substrate may be formed in a rectangle or square. The edge area of the target substrate may include at least one side of the four sides of the glass substrate.

In the present disclosure, the TFTs constituting the TFT layer (or backplane) are not limited to a specific structure or type. For example, the TFTs cited in the present disclosure include low-temperature polycrystalline silicon TFT (LTPS TFT) and others. It can be implemented with oxide TFT, Si TFT (poly silicon, a-silicon), organic TFT, graphene TFT, etc., and only P-type (or N-type) MOSFET can be made and applied in the Si wafer CMOS process.

In the present disclosure, the target substrate included in the display module is not limited to the TFT substrate. For example, the target substrate may be a substrate without a TFT layer on which a TFT circuit is formed. In this case, the display module may include a substrate on which the micro IC is separately mounted and only the wiring is patterned.

In the present disclosure, the pixel driving method of the display module may be an active matrix (AM) driving method or a passive matrix (PM) driving method. The display module can form a wiring pattern in which each micro LED is electrically connected depending on the AM driving method or the PM driving method.

In the present disclosure, the display module is a single unit that can be installed and applied to wearable devices, portable devices, handheld devices, and electronic products or battlefields that require various displays, and is a matrix type. It can be applied to display devices such as personal computer (PC) monitors, high-resolution TVs, signage (or digital signage), and electronic displays through multiple assembly arrangements.

The display module of the present disclosure may include a plurality of inorganic light-emitting devices for image display arranged on a target substrate on which a thin film transistor is formed on one surface. The plurality of inorganic light emitting devices may be subpixels forming a single pixel. In the present disclosure, one 'light emitting device', one 'micro LED', and one 'subpixel' can be used interchangeably with the same meaning.

Below, with reference to the attached drawings, embodiments of the present disclosure will be described in detail so that those skilled in the art can easily practice them. However, the present disclosure may be implemented in many different forms and is not limited to the embodiments described herein. In order to clearly explain the present disclosure in the drawings, parts that are not related to the description are omitted, and similar parts are given similar reference numerals throughout the specification.

Furthermore, embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings and the contents described in the accompanying drawings, but the present disclosure is not limited or limited by the embodiments.

Hereinafter, a display device according to various embodiments of the present disclosure will be described with reference to the drawings.

1 is a block diagram showing a display device according to an embodiment of the present disclosure.

Referring to FIG. 1, a display device 1 according to an embodiment of the present disclosure may include a display module 3 and a processor 5.

The display module 3 according to an embodiment of the present disclosure can display various images. Here, video is a concept that includes still images and/or moving images. The display module 3 can display various images such as broadcast content, multimedia content, etc. Additionally, the display module 3 may display a user interface and icons.

The display module 3 may include a display panel 10 and a display driver IC (DDI) 7 for controlling the display panel 10.

The display driver IC 7 may include an interface module 7a, a memory 7b (eg, buffer memory), an image processing module 7c, or a mapping module 7d. The display driver IC 7, for example, transmits image information including image data or an image control signal corresponding to a command for controlling the image data to another device of the display device 1 through the interface module 7a. Can be received from components. For example, according to one embodiment, the image information may be received from the processor 5 (e.g., a main processor (e.g., an application processor) or an auxiliary processor (e.g., a graphics processing unit) that operates independently of the functions of the main processor. You can.

The display driver IC 7 may store at least some of the received image information in the memory 7b, for example, on a frame basis. For example, the image processing module 7c pre-processes or post-processes at least a portion of the image data (e.g., adjusts resolution, brightness, or size) based on the characteristics of the image data or the characteristics of the display panel 10. can be performed. The mapping module 7d may generate a voltage value or current value corresponding to the image data pre- or post-processed through the image processing module 7c. According to one embodiment, the generation of a voltage value or a current value is based on, for example, the properties of the pixels of the display panel 10 (e.g., an array of pixels (RGB stripe structure or RGB pentile structure), or the size of each subpixel). ) can be performed based at least in part on At least some pixels of the display panel 10 are, for example, driven based at least in part on the voltage value or current value to display visual information (e.g., text, image, or icon) corresponding to the image data on the display panel ( 10) can be displayed.

The display driver IC 7 may transmit a driving signal (eg, a driver driving signal, a gate driving signal, etc.) to the display based on the image information received from the processor 5.

The display driver IC 7 can display an image based on the image signal received from the processor 5. As an example, the display driver IC 7 generates a driving signal for a plurality of subpixels based on an image signal received from the processor 5 and displays an image by controlling the emission of the plurality of subpixels based on the driving signal. can do.

The display module 3 may further include a touch circuit (not shown). The touch circuit may include a touch sensor and a touch sensor IC for controlling the touch sensor. For example, the touch sensor IC may control the touch sensor to detect a touch input or hovering input for a designated location on the display panel 10. For example, the touch sensor IC can detect a touch input or hovering input by measuring a change in a signal (eg, voltage, light amount, resistance, or charge amount) for a designated location on the display panel 10. The touch sensor IC may provide information (e.g., location, area, pressure, or time) regarding the detected touch input or hovering input to the processor 5. According to one embodiment, at least a portion of the touch circuit (e.g., touch sensor IC) is part of the display driver IC 7, or the display panel 10, or another component disposed outside the display module 3 ( e.g. co-processor).

The processor 5 is a digital signal processor (DSP), microprocessor, graphics processing unit (GPU), artificial intelligence (AI) processor, neural processing unit (NPU), and TCON that processes digital image signals. (time controller), but is not limited to this, and may be implemented as a central processing unit (CPU), micro controller unit (MCU), micro processing unit (MPU), controller, or application. It may include one or more of an application processor (AP), a communication processor (CP), or an ARM processor, or may be defined by these terms. In addition, the processor 5 has a built-in processing algorithm. It may be implemented as a system on chip (SoC) or large scale integration (LSI), or as an application specific integrated circuit (ASIC) or field programmable gate array (FPGA).

The processor 5 can control hardware or software components connected to the processor 5 by running an operating system or application program, and can perform various data processing and calculations. Additionally, the processor 5 may load and process commands or data received from at least one of the other components into volatile memory and store various data in non-volatile memory.

FIG. 2 is a plan view illustrating a display panel included in a display device according to an embodiment of the present disclosure, FIG. 3 is an enlarged view of pixels of portion A shown in FIG. 2, and FIG. 4 is a line A-A shown in FIG. 3. 'It is a cross-sectional view shown along a line.

Referring to FIG. 2 , the display panel 10 may include a thin film transistor (TFT) substrate 50 and a plurality of pixels mounted on one surface of the TFT substrate 50. Each pixel 100 may include at least three subpixels arranged within the corresponding pixel area.

Referring to FIG. 3, one pixel 100 includes a first subpixel 310 that emits light in a red wavelength band, a second subpixel 320 that emits light in a green wavelength band, and light in a blue wavelength band. It may include a third subpixel 330 that emits .

In the present disclosure, the subpixel may be a micro LED or mini LED, which is an inorganic light emitting diode with a size of less than 100 ㎛. Hereinafter, for convenience, the subpixel is referred to as micro LED.

One pixel 100 includes first to third subpixels 310, 320, and 330 in an area not occupied by the first micro LED 310, the second micro LED 320, and the third micro LED 330. It may include a plurality of TFTs for driving.

The first to third micro LEDs 310, 320, and 330 may be arranged in a row at regular intervals, but are not limited to this. For example, the first to third micro LEDs 310, 320, and 330 may be arranged in an L shape or in a pentile RGBG manner. The Pentile RGBG method is a method of arranging the number of red, green, and blue subpixels in a ratio of 1:1:2 (RGBG), using the characteristic that humans distinguish blue less and green best. The Pentile RGBG method is effective in increasing yield, lowering unit cost, and enabling high resolution on a small screen.

The display module 3 may be a touch screen combined with a touch sensor, a flexible display, a rollable display, and/or a 3D display. Additionally, according to one embodiment, a plurality of display modules of the present disclosure may be provided and these modules may be physically connected to implement a large format display (eg, LFD, large format display).

The TFT substrate 50 is an amorphous silicon (a-Si) TFT, a low temperature polycrystalline silicon (LTPS) TFT, a low temperature polycrystalline oxide (LTPO) TFT, a hybrid oxide and polycrystalline silicon (HOP) TFT, and a liquid crystalline polymer (LCP) TFT. , or it may be a substrate that can be implemented in a form such as OTFT (organic TFT).

Referring to FIG. 3, a plurality of electrode pads may be arranged on the TFT substrate 50. For example, one pixel 100 includes a pair of first electrode pads 101 and 102 to which the first to third micro LEDs 310, 320, and 330 are electrically connected, respectively, and a pair of second electrodes. Pads 103 and 104 and a pair of third electrode pads 105 and 106 may be disposed.

A pair of first electrode pads 101 and 102 may be electrically connected to a pair of first element electrodes 311 and 312 provided on one side of the first micro LED 310, respectively. The first micro LED 310 is a flip chip type light emitting diode, and the light emitting surface may be on the opposite side of the surface on which the pair of first device electrodes 311 and 312 are disposed.

A pair of second electrode pads 103 and 104 may be electrically connected to a pair of second element electrodes 321 and 322 provided on one side of the second micro LED 320, respectively. A pair of third electrode pads 105 and 106 may be electrically connected to a pair of third element electrodes 331 and 332 provided on one side of the third micro LED 330, respectively. Like the first micro LED 310, the second micro LED 320 and the third micro LED 330 may be flip chip type light emitting diodes.

Referring to FIG. 4 , the first micro LED 310 may be connected to the TFT substrate 50 through an anisotropic conductive film (ACF) 400 that covers one surface of the TFT substrate 50 .

The ACF (400) includes a resin (410) made of a thermosetting material (e.g., epoxy resin, polyurethane, or acrylic resin), and a plurality of conductive conductive balls (421, 423, 425) may be included. The plurality of challenge balls 421, 423, and 425 may occupy approximately 0.5% to 5% of the total volume of the ACF 400. The plurality of conductive balls 421, 423, and 425 may be made of polymer particles and an electrically conductive metal film (eg, gold (Au), nickel (Ni), or lead (Pd)) coated on the outer peripheral surface of the polymer particles.

The first micro LED 310 may be transferred from the relay substrate (not shown) to the TFT substrate 50. In this case, the pair of first device electrodes 311 and 312 of the first micro LED 310 are seated on the ACF 400 covering the TFT substrate 50, and the pair of first device electrodes 311 and 312 of the first micro LED 310 are seated on the ACF 400 covering the TFT substrate 50. 1 It may be placed at a position corresponding to the electrode pads 101 and 102.

In this state, the first micro LED 310 is pressed toward the TFT substrate 50 at a preset pressure through a thermal compression process. At this time, high temperature heat may be transferred to the ACF (400). Accordingly, the resin 410 of the ACF 400 has fluidity and moves to both sides of the first barrier 200.

Due to this resin flow, the plurality of conductive balls 425 located on the upper side of the first barrier 200 move to both sides of the first barrier 200 together with the flowing resin 410. The first barrier 200 is disposed between a pair of first electrode pads 101 and 102 and may be formed of an insulating material.

Accordingly, between one first electrode pad 101 and the corresponding first device electrode 311, and between the remaining first electrode pad 102 and the remaining first device electrode 312 corresponding thereto. A plurality of challenge balls 423 and 425 are located, respectively.

Accordingly, the pair of first device electrodes 311 and 312 of the first micro LED 310 are connected to the pair of first electrode pads 101 and 102 of the TFT substrate 50 through the plurality of conductive balls 425. can be electrically connected to.

At this time, the pair of first device electrodes 311 and 312 of the first micro LED 310 are not shorted to each other by the first barrier 200, and the pair of first electrode pads 101, 102) Also, the first barrier 200 is not short-circuited.

Hereinafter, the structure of the first barrier 200 according to the present disclosure will be described in detail with reference to the drawings.

FIG. 5 is a diagram showing a first barrier disposed between electrode pads of a TFT substrate, and FIG. 6 is a cross-sectional view taken along line B-B' shown in FIG. 5.

Referring to FIG. 5, the first barrier 200 is formed on one side of the TFT substrate 50 and may be disposed between a pair of first electrode pads 101 and 102. The first barrier 200 may be disposed with its left side 200a and right side 200b in close contact with a pair of first electrode pads 101 and 102, as shown in FIG. 5 .

However, the present invention is not limited to this, and the first barrier 200 may be in close contact with one of the pair of first electrode pads 101 and 102 on only one side of the left side 200a and the right side 200b. Additionally, the first barrier 200 may be spaced apart from a pair of first electrode pads 101 and 102 on both the left side 200a and the right side 200b, respectively.

The length L1 of the first barrier 200 is such that the pair of first device electrodes 311 and 312 are not short-circuited by the plurality of conductive balls of the ACF 400 and the pair of first electrode pads 101 and 312 are not shorted to each other. 102) can be made to a length that prevents them from short-circuiting each other.

For example, the length L1 of the first barrier 200 may be longer than the length L2 of the pair of first electrode pads 101 and 102. In this case, as shown in FIG. 5, the front end 200c of the first barrier 200 protrudes further than the front ends 101c and 102c of the pair of first electrode pads 101 and 102, and the rear end 200d is It may protrude further than the rear ends 101d and 102d of the pair of first electrode pads 101 and 102.

However, it is not limited to this, and the tip 200c of the first barrier 200 may be at a position corresponding to the tips 101c and 102c of the pair of first electrode pads 101 and 102. Alternatively, the rear end 200d of the first barrier 200 may be in a position corresponding to the rear ends 101d and 102d of the pair of first electrode pads 101 and 102. Alternatively, the front end 200c and the rear end 200d of the first barrier 200 correspond to the front ends 101c and 102c and the rear ends 101d and 102d of the pair of first electrode pads 101 and 102, respectively. may be in

Referring to FIG. 6, the first barrier 200 has an upper end 201 formed in a substantially flat shape, a first inclined surface 203 and a second inclined surface ( 205) may be included.

The first inclined surface 203 and the second inclined surface 205 are used to apply the resin 410 of the ACF 400 and a plurality of conductive balls contained in the resin 410 to the left and right sides of the first barrier 200 during the heat compression process. We can guide you so that it flows smoothly.

The first inclined surface 203 or the second inclined surface 205 can guide one of the pair of first electrode elements of the first micro LED 310, which is pressed toward the TFT substrate 50 during heat compression, to the connection position. . This means that the pair of first electrode elements 311 and 312 of the first micro LED 310 are not aligned with the pair of first electrode pads 101 and 102 of the TFT substrate 50 and are slightly tilted to the left or right. This may apply to shifted cases.

The height H1 from the top surface of the TFT substrate 50 to the top of the first barrier 200 is the height H2 from the top surface of the TFT substrate 50 to the top of the pair of first electrode pads 101 and 102. ) can be formed higher than that. The height H1 of the first barrier 200 may be high enough to allow the plurality of conductive balls 425 disposed on the left and right sides of the first barrier 200 to be isolated without being connected to each other.

In addition, as the height H1 of the first barrier 200 is formed higher than the height H2 of the pair of first electrode pads 101 and 102, the pair of first electrode pads 101 and 102 The first barrier 200 can be protected from external impacts such as scratches.

The first barrier 200 is provided in plurality, as shown in FIG. 3, between a pair of first electrode pads 101 and 102, between a pair of second electrode pads 103 and 104, and between a pair of first electrode pads 101 and 102. It may be disposed between the third electrode pads 105 and 106.

The cross-sectional shape of the first barrier 200 is not limited to the shape shown in FIG. 6 and may have various shapes. Hereinafter, examples of various cross-sectional shapes of the first barrier 200 will be described with reference to FIGS. 7A to 7C. Most of the first barriers shown in FIGS. 7A to 7C are substantially the same as the above-described first barrier 200 and may have different cross-sectional shapes.

FIGS. 7A to 7C are cross-sectional views showing various shapes of the first barrier disposed between electrode pads of the substrate.

Referring to FIG. 7A, the first barrier 200a according to an embodiment has an upper end 201a in the form of a corner and a first inclined surface 203a extending obliquely to the left and right at a predetermined angle from the upper end 201a. and a second inclined surface 205a.

Referring to FIG. 7B, the upper portion 201b of the first barrier 200b according to one embodiment may be formed as a curved surface having a predetermined curvature. Here, the upper portion 201b of the first barrier 200b may include left and right sides extending a predetermined length from the top of the first barrier 200b to the left and right.

Referring to FIG. 7C, the first barrier 200c according to one embodiment has an upper end 201c that is substantially flat and a first inclined surface 203c extending in a curved shape to the left and right, respectively, from the upper end 201c. It may include a second inclined surface 205c.

The first barriers (200a, 200b, 200c) having this cross-sectional shape are formed so that the resin 410 and the plurality of conductive balls 425 are disposed on the left and right sides of the first barriers (200a, 200b, 200c) during the heat compression process. You can guide it to flow smoothly.

Figures 8 and 9 are cross-sectional views showing examples in which the first barrier disposed between electrode pads of the substrate is formed using an inorganic material and an organic material.

The material of the first barrier 200 according to one embodiment may be made of organic or inorganic materials having insulating properties. Additionally, the material of the first barrier 200 may have a black color capable of absorbing light. Accordingly, the first barrier 200 can absorb light incident on the display panel 10 and contribute to improving the light efficiency and color reproducibility of the display device.

Referring to FIG. 8, the first barrier 210a according to one embodiment may include a body 211 made of an organic material and a first thin film 213 made of an inorganic material.

The overall shape of the first barrier 210a may be determined by the shape of the body 211 of the first barrier 210a. The body 211 of the first barrier 210a may form a step between the first barrier 210a and the pair of first electrode pads 101 and 102 of the TFT substrate 50. Due to this step, the height of the first barrier 210a is relatively higher than the height of the pair of first electrode pads 101 and 102, so that the pair of first electrode pads 101 and 102 of the TFT substrate 50 are protected from external shocks such as scratches. The electrode pads 101 and 102 can be protected.

The first thin film 213 of the first barrier 210a may cover the exposed portion of the body 211 of the first barrier 210a. Since the first thin film 213 of the first barrier 210a is made of an inorganic material, it can protect the body 211 of the first barrier 210a from moisture.

Referring to FIG. 9, the first barrier 210b according to one embodiment includes a body 211 and a first thin film 213, like the above-described first barrier 210a. The first barrier 210b may further include a second thin film 215, different from the above-described first barrier 210a.

The second thin film 215 of the first barrier 210b may be made of an inorganic material. The thin film 215 of the first barrier 210b may be formed on the TFT substrate 50 before forming the body 211. In this case, the second thin film 215 of the first barrier 210b formed on the TFT substrate 50 may be formed not to cover the upper surface of the pair of first electrode pads 101 and 102.

The second thin film 215 of the first barrier 210b is located between the body 211 of the first barrier 210b and the surface of the TFT substrate 50. The body 211 of the first barrier 210b may be formed on the second thin film 215 formed between the pair of first electrode pads 101 and 102.

The bonding force between the body 211 of the first barrier 210b and the second thin film 215 of the first barrier 210b is greater than the bonding force between the body 211 of the first barrier 210b and the surface of the TFT substrate 50. It could be bigger. Accordingly, the body 211 of the first barrier 210b can be firmly coupled to the surface of the TFT substrate 50 indirectly through the second thin film 215 of the first barrier 210b.

FIG. 10 is a diagram showing another example of pixels provided in a display panel according to an embodiment of the present disclosure, and FIG. 11 is a cross-sectional view taken along line C-C' shown in FIG. 10.

Referring to FIG. 10 , a plurality of first barriers 200 and a plurality of second barriers 230 may be disposed in a pixel 100a provided in a display panel according to an embodiment of the present disclosure.

The plurality of first barriers 200 are respectively between a pair of first electrode pads 101 and 102, between a pair of second electrode pads 103 and 104, and between a pair of third electrode pads 105 and 106. ) can be placed between.

The length and height of the plurality of first barriers 200 disposed in the pixel 100a according to one embodiment are the length and height of the plurality of first barriers 200 disposed in the pixel 100 (see FIG. 3) described above. may be substantially the same. The cross-sectional shape of the plurality of first barriers 200 disposed in the pixel 100a according to one embodiment is substantially different from the cross-sectional shape of the plurality of first barriers 200 disposed in the pixel 100 (see FIG. 3) described above. can be the same.

The plurality of second barriers 230 are between a pair of first electrode pads 101 and 102 and a pair of second electrode pads 103 and 104, and between a pair of second electrode pads 103 and 104. It may be disposed between a pair of third electrode pads 105 and 106. Specifically, one of the plurality of second barriers 230 is between the electrode pad 102 and the electrode pad 103 adjacent thereto, and the other of the plurality of second barriers 230 is between the electrode pad 104 and the electrode adjacent thereto. It may be placed between the pads 105.

The length and height of the second plurality of barriers 230 may be substantially the same as the length and/or height of the first plurality of barriers 200 . The width of the second plurality of barriers 230 may be wider than the width of the first plurality of barriers 200 .

Referring to FIG. 11, a plurality of first barriers 200 isolate a plurality of conductive balls 425 to the left and right, respectively. Therefore, due to the plurality of conductive balls 425, a short circuit between a pair of first electrode substrates 101 and 102, a short circuit between a pair of second electrode substrates 103 and 104, and a pair of third electrode substrates ( 105, 106) Liver short circuit can be prevented. In addition, due to the plurality of conductive balls 425, a short circuit between the pair of second device electrodes 321 and 322 of the second micro LED 320 and the pair of third device electrodes of the third micro LED 330 (331, 332) Liver short circuits can be prevented.

The plurality of second barriers 230 may prevent short circuits between adjacent electrode pads 102 and 103 and short circuits between adjacent electrode pads 104 and 105 due to the plurality of conductive balls.

Each of the plurality of second barriers 230 may have a flat top 231a and a first inclined surface 233a and a second inclined surface 235a formed on the left and right sides. During the thermal compression process, the resin 410 of the ACF 400 has fluidity due to the high temperature heat transferred to the ACF 400 and forms the first and second inclined surfaces 233a and 235a of the plurality of second barriers 200. Accordingly, it can move to the left and right of the second barrier 230. At this time, some conductive balls, along with the resin 410, may be moved toward the electrode pads 102, 103, 104, and 105 on the first and second inclined surfaces 233a and 235a of the plurality of second barriers 230.

The plurality of second barriers 230 is not limited to a cross-sectional shape having first and second inclined surfaces 233a and 235a at the top, and has a cross-section in which the upper left and right sides of the plurality of second barriers 230 are curved. It can have a shape.

A pair of first to third electrode elements 311, 312, 321, 322, 331, 323 of the first to third micro LEDs 310, 320, and 330 each correspond to a pair of TFT substrates 50. When not aligned with the first to third electrode pads 101, 102, 103, 104, 105, 106 and slightly shifted to the left or right, the first inclined surface 233a of the second barrier 230 and/or The second inclined surface 235a is a pair of first to third electrode elements 311, 312, 321 of the first to third micro LEDs 310, 320, and 330 that are pressed toward the TFT substrate 50 during heat compression. 322, 331, 323). Accordingly, the connection positions of the first to third micro LEDs 310, 320, and 330 can be adjusted.

12 and 13 are cross-sectional views showing various examples in which the first barrier and the second barrier disposed between electrode pads of the substrate are formed using inorganic materials and organic materials.

The materials of the plurality of first barriers 200 and second barriers 230 according to one embodiment may be made of organic and inorganic materials having insulating properties. Additionally, the material of the first barrier 200 and the second barrier 230 may have a black color capable of absorbing light. Accordingly, the first and second barriers 210 and 230 may absorb light incident on the display panel 10 and contribute to improving the light efficiency and color reproducibility of the display device.

Referring to FIG. 12, the plurality of first barriers 210a according to an embodiment may include a body 211 made of an organic material and a first thin film 213 made of an inorganic material. The first thin film 213 of the first barrier 210a may cover the exposed portion of the body 211 of the first barrier 210a.

The plurality of second barriers 230a according to one embodiment may include a body 231 made of an organic material and a first thin film 233 made of an inorganic material. The first thin film 233 of the second barrier 230a may cover the exposed portion of the body 231 of the second barrier 230a.

The bodies 211 of the first plurality of barriers 210a and the bodies 231 of the second plurality of barriers 230a may be formed on the TFT substrate 50 in the same process. The first thin film 213 of the plurality of first barriers 210a and the first thin film 233 of the plurality of second barriers 230a are combined with the body 211 of the first barrier 210a and the plurality of first thin films 233 in the same process. 2 It may be formed on the body 231 of the barrier 230a.

The height H11 of the first plurality of barriers 210a and the height H13 of the second plurality of barriers 230a may be substantially the same. In this case, the heights H11 and H13 of the first and second barriers 210a and 230a may be higher than the heights of the electrode pads 101, 102, 103, 104, 105, and 106. Accordingly, a step may be formed between the plurality of first and second barriers 210a and 230a and the electrode pads 101, 102, 103, 104, 105, and 106. Due to these steps, the plurality of first and second barriers 210a and 230a can protect the electrode pads 101, 102, 103, 104, 105, and 106 of the TFT substrate 50 from external impacts such as scratches. there is.

Referring to FIG. 13, a plurality of first barriers 210b according to an embodiment include a body 211 and a first thin film 213, like the above-described first barrier 210a. The plurality of first barriers 210b may further include a second thin film 215, differently from the plurality of first barriers 210a described above.

The thin films 215 of the plurality of first barriers 210b may be made of an inorganic material. The second thin film 215 of the plurality of first barriers 210b may be formed on the TFT substrate 50 before forming the body 211 of the plurality of first barriers 210b. In this case, the second thin film 215 of the plurality of first barriers 210b formed on the TFT substrate 50 is between a pair of first electrode pads 101 and 102 and a pair of second electrode pads 103. , 104) and between a pair of third electrode pads 105 and 106.

The plurality of second barriers 230b according to one embodiment includes a body 231 and a first thin film 233, like the plurality of second barriers 230a described above. The second barrier 230b may further include a second thin film 235, different from the above-described second barrier 230a.

The second thin films 235 of the plurality of second barriers 230b may be made of an inorganic material. The second thin film 235 of the plurality of second barriers 230b may be formed on the TFT substrate 50 before forming the body 211 of the plurality of second barriers 230b. In this case, the second thin film 235 of the plurality of second barriers 230b formed on the TFT substrate 50 is between adjacent electrode pads 102 and 103 and between other adjacent electrode pads 104 and 105. It can be placed in between.

The second thin film 211 of the plurality of first barriers 210b and the second thin film 231 of the plurality of second barriers 230b may be formed on the TFT substrate 50 in the same process.

FIG. 14 is a diagram illustrating another example of pixels provided in a display panel according to an embodiment of the present disclosure, and FIG. 15 is a cross-sectional view taken along line D-D' indicated in FIG. 14.

Referring to FIG. 14, a third barrier 250c may be disposed in a pixel 100b provided in a display panel according to an embodiment of the present disclosure along with a plurality of first and second barriers 210c and 230c. .

Since the configuration of the plurality of first and second barriers 210c and 230c disposed in the pixel 100b is substantially the same as that of the plurality of first and second barriers 200 and 230 (see FIG. 10) described above, description thereof is omitted. do.

The third barrier 250c may be formed on the TFT substrate 50 to surround a pair of first to third electrode pads 101, 102, 103, 104, 105, and 106 within one pixel area. .

The third barrier 250c may be connected to a plurality of first barriers 210c and a plurality of second barriers 230c. In this case, the TFT substrate 50 may be covered by the first to third barriers 210c, 230c, and 250c with a plurality of electrode pads exposed.

Referring to FIG. 15, the third barrier 250c may have inclined surfaces 253a formed from the flat top 251a to the side where the first micro LED 310 and the third micro LED 330 are disposed. there is.

The connection positions of the first and third micro LEDs 310 and 330 may be adjusted by the inclined surfaces 253a of the third barrier 250c.

For example, a pair of first and third electrode elements 311, 312, 331, and 323 of the first and third micro LEDs 310 and 330 respectively correspond to a pair of first and third electrode elements 311, 312, 331, and 323 of the corresponding TFT substrate 50. When not aligned with the first and third electrode pads 101, 102, 105, and 106 and slightly shifted to the left or right, the inclined surfaces 253a of the third barrier 250 are moved toward the TFT substrate 50 during heat compression. A pair of first and third electrode elements 311, 312, 331, and 323 of the first and third micro LEDs 310 and 330 can be guided. Accordingly, the connection positions of the first to third micro LEDs 310, 320, and 330 can be adjusted.

The first to third barriers 210c, 230c, and 250c according to one embodiment may be made of organic or inorganic materials having insulating properties. Additionally, the material of the first to third barriers 210c, 230c, and 250c may have a black color capable of absorbing light. Accordingly, the first to third barriers 210c, 230c, and 250c can absorb light incident on the display panel 10 and contribute to improving the light efficiency and color reproducibility of the display device.

16 to 18 are cross-sectional views showing various examples in which the first barrier and the second barrier disposed between the electrode pads of the substrate and the third barrier surrounding the electrode pads of the substrate are formed using inorganic materials and organic materials.

Referring to FIG. 16, a plurality of first barriers 210d and second barriers 230d according to an embodiment are substantially the same as the structures of the above-described first and second barriers 210a and 230a (see FIG. 12). Therefore, the explanation is omitted.

The third barrier 250d may include a body 251 made of an organic material and a first thin film 253 made of an inorganic material. The first thin film 253 of the third barrier 250d may cover the exposed portion of the body 251 of the third barrier 250d.

The height H21 of the first plurality of barriers 210d, the height H23 of the second plurality of barriers 230d, and the height H25 of the third barrier 250d may be substantially the same. In this case, the heights H21 and H23 of the first and second barriers 210a and 230a and the height H25 of the third barrier 250d are the electrode pads 101, 102, 103, 104, 105, It can be formed higher than the height of 106). Accordingly, a step may be formed between the plurality of first and second barriers 210a, 230a and third barrier 250d and the electrode pads 101, 102, 103, 104, 105, and 106. Due to this step, the plurality of first and second barriers 210a, 230a and the third barrier 250d protect the electrode pads 101, 102, 103, 104, and 105 of the TFT substrate 50 from external impacts such as scratches. , 106) can be protected.

Referring to FIG. 17, a plurality of first barriers 210e and second barriers 230e according to an embodiment are substantially the same as the structures of the above-described first and second barriers 210a and 230a (see FIG. 12). Therefore, the explanation is omitted.

The third barrier 250e according to one embodiment includes a body 251 and a first thin film 253, like the third barrier 250d described above. The third barrier 250e may further include a second thin film 255, different from the above-described third barrier 250d.

The second thin film 255 of the third barrier 250e may be made of an inorganic material. The second thin film 255 of the third barrier 250e may be formed on the TFT substrate 50 before forming the body 251 of the third barrier 250e.

The second thin film 255 of the third barrier 250e is formed in the same process together with the second thin film 211 of the plurality of first barriers 210e and the second thin film 231 of the plurality of second barriers 230e. It may be formed on the TFT substrate 50.

Referring to FIG. 18, the height H26 of the third barrier 250f may be higher than the height H21 of the first barrier 210f and the height H23 of the second barrier 230f.

In this case, the height H21 of the first barrier 210f and the height H23 of the second barrier 230f may be substantially the same. Without being limited thereto, the height H23 of the second barrier 230f may be formed to be somewhat lower than the height H21 of the first barrier 210f.

The structures of the first barrier 210f, the second barrier 230f, and the third barrier 250f are respectively those of the first barrier 210d, the second barrier 230d, and the third barrier 250d shown in FIG. 16. Since the structure is substantially the same, description is omitted.

In the above, preferred embodiments of the present disclosure have been shown and described, but the present disclosure is not limited to the specific embodiments described above, and may be used in the technical field belonging to the present disclosure without departing from the gist of the present disclosure as claimed in the claims. Of course, various modifications can be made by those skilled in the art, and these modifications should not be understood individually from the technical ideas or perspectives of the present disclosure.

50: TFT substrate
100: pixel
101, 102, 103, 104, 105, 106: electrode pad
200: first barrier
230: second barrier
250: Third barrier
310, 320, 330: Micro LED
311, 312, 321, 322, 331, 332: element electrode
400:ACF
410: Resin
421, 432, 425: Challenge Ball

Claims (20)

In the display module,
A substrate with a plurality of electrode pads arranged on one side;
A plurality of first barriers disposed between adjacent electrode pads; and
A plurality of inorganic light emitting diodes having element electrodes connected to the plurality of electrode pads,
A display module wherein the plurality of first barriers are disposed between a pair of electrode pads, each corresponding to one inorganic light emitting diode. According to paragraph 1,
A display module wherein each of the plurality of first barriers has a height higher than the height of the plurality of electrode pads. According to paragraph 2,
A display module wherein at least one of the plurality of first barriers has an inclined surface formed on an upper portion. According to paragraph 2,
A display module wherein at least one of the plurality of first barriers has a first inclined surface and a second inclined surface respectively inclined toward the pair of electrode pads. According to paragraph 2,
At least one of the plurality of first barriers has a first curved surface and a second curved surface respectively formed toward the pair of electrode pads. According to paragraph 2,
A display module wherein at least one of the plurality of first barriers has a curved upper portion. According to paragraph 1,
A display module wherein the plurality of first barriers are made of an insulating material. In clause 7,
Each of the plurality of first barriers,
A body made of organic material; and
A display module comprising: a first thin film made of an inorganic material and covering the body. According to clause 8,
Each of the plurality of first barriers,
A display module further comprising a second thin film formed between the substrate and the body. According to paragraph 1,
Further comprising at least one second barrier disposed between a pair of first electrode pads formed on the substrate and a pair of second electrode pads adjacent to the pair of first electrode pads,
The display module wherein the at least one second barrier has a height higher than the plurality of electrode pads. According to clause 10,
The at least one second barrier is
A display module having a height less than or equal to the height of the first barrier. According to clause 11,
A display module wherein the at least one second barrier has an inclined surface formed on an upper portion. According to clause 11,
A display module wherein the at least one second barrier has a curved upper portion. According to clause 10,
A display module wherein the at least one second barrier is made of an insulating material. According to clause 10,
Further comprising a third barrier connected to the plurality of first barriers and the at least one second barrier and surrounding a plurality of electrode pads,
The third barrier is a display module having a height higher than the plurality of electrode pads. According to clause 15,
The first barrier, the second barrier, and the third barrier have the same height. According to clause 15,
The display module wherein the third barrier has a height greater than or equal to the height of the first barrier or the height of the second barrier. According to clause 17,
The third barrier is a display module with an inclined surface formed at the top. According to clause 17,
The third barrier is a display module with a curved surface formed on the top. According to clause 15,
The third barrier is a display module made of an insulating material.

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