KR20230127826A - Display module and manufacturing method thereof - Google Patents

Abstract

A display module is disclosed. The display module includes a substrate on which a plurality of thin film transistors (TFTs) are arranged, and a plurality of pixels electrically connected to the plurality of TFTs, each pixel having a different size, a first light emitting diode, a second light emitting diode, and a third light emitting diode.

Description

Display module and its manufacturing method {DISPLAY MODULE AND MANUFACTURING METHOD THEREOF}

The present disclosure relates to a display module and a manufacturing method thereof.

The self-luminous display device displays an image without a color filter and a backlight, and may use an inorganic light emitting diode that emits light by itself.

The display module expresses various colors while being operated in units of pixels or sub-pixels made of inorganic light emitting devices. The operation of each pixel or sub-pixel is controlled by a plurality of thin film transistors (TFTs). A plurality of TFTs are arranged on a flexible substrate, a glass substrate or a plastic substrate, and a substrate having such a plurality of TFTs is called a TFT substrate.

An object of the present disclosure is to provide a display module having a high-yield and high-efficiency structure and a manufacturing method thereof.

According to various embodiments of the present disclosure, to achieve the above object, a substrate on which a plurality of thin film transistors (TFTs) are arranged, and a plurality of pixels electrically connected to the plurality of TFTs, each pixel having a different size. It provides a display module including a first light emitting diode, a second light emitting diode, and a third light emitting diode having a.

A size of the second inorganic light emitting diode may be larger than a size of the first light emitting diode, and a size of the third light emitting diode may be larger than a size of the second inorganic light emitting diode.

The first light emitting diode may emit light in a blue wavelength band, the second light emitting diode may emit light in a green wavelength band, and the third light emitting diode may emit light in a red wavelength band.

Each of the first light emitting diode, the second light emitting diode, and the third light emitting diode may have a trapezoidal light emitting surface.

Side surfaces of each of the first light emitting diode, the second light emitting diode, and the third light emitting diode may be inclined.

Each of the first light emitting diode, the second light emitting diode, and the third light emitting diode may have a cross section gradually narrowing from a light emitting surface to a surface opposite to the light emitting surface.

Each of the first light emitting diode, the second light emitting diode, and the third light emitting diode may have a cross section gradually widening from a light emitting surface to a surface opposite to the light emitting surface.

According to various embodiments of the present disclosure, in order to achieve the above object, a first mold in which a plurality of first insertion grooves having a first size into which a plurality of first light emitting diodes are inserted is lattice-arranged, the plurality of first sizes A second mold in which a plurality of second insertion grooves having a second size larger than the first size into which a plurality of second light emitting diodes are inserted are lattice-arranged, and a plurality of third light emitting diodes of the second size into which a plurality of light emitting diodes are inserted A third mold comprising a grid array of a plurality of third insertion grooves having a larger third size, wherein the second mold has a grid array of a plurality of additional first insertion grooves corresponding to the first size; 3 The mold provides a mold device for manufacturing a display module in which a plurality of additional second insertion grooves corresponding to the first size are arranged in a grid and a plurality of additional third insertion grooves corresponding to the second size are arranged in a grid do.

The plurality of additional first insertion grooves of the second mold are disposed at positions corresponding to the first insertion grooves of the first mold, and the plurality of additional second insertion grooves of the third mold are disposed in positions corresponding to the first insertion grooves of the first mold. The plurality of additional third insertion grooves of the third mold may be disposed at positions corresponding to the second insertion grooves of the second mold.

The first size is greater than or equal to the size of the plurality of first light emitting diodes, the second size is greater than or equal to the size of the plurality of second light emitting diodes, and the third size is greater than or equal to the size of the plurality of third light emitting diodes may be greater than or equal to the size of

The plurality of first insertion grooves, the plurality of second insertion grooves, the plurality of third insertion grooves, the plurality of additional first insertion grooves, the plurality of additional second insertion grooves, and the plurality of additional third insertion grooves The groove may be trapezoidal.

Each of the plurality of first insertion grooves, the plurality of second insertion grooves, and the plurality of third insertion grooves may have inclined side surfaces.

Each of the plurality of first insertion grooves, the plurality of second insertion grooves, and the plurality of third insertion grooves may have a cross section gradually narrowing from the opening side to the bottom side.

According to various embodiments of the present disclosure, arranging a plurality of first light emitting diodes in a first mold, arranging a plurality of second light emitting diodes in a second mold, and arranging a plurality of light emitting diodes in a third mold in order to achieve the above object. Arranging third light emitting diodes of the plurality of first light emitting diodes, the plurality of second light emitting diodes, and the plurality of light emitting diodes, respectively, on a relay substrate from the first mold, the second mold, and the third mold. Transferring third light emitting diodes, and sequentially transferring the plurality of first light emitting diodes, the plurality of second light emitting diodes, and the plurality of third light emitting diodes from the relay substrate to a thin film transistor (TFT) substrate. A plurality of first insertion grooves of the first mold, including the step of performing the first light emitting diode, the plurality of second light emitting diodes, and the plurality of light emitting diodes in a fluidic self-assembly manner; Provided is a method of manufacturing a display module that is inserted into a plurality of second insertion grooves of the second mold and a plurality of third insertion grooves of the third mold, respectively.

The manufacturing method of the display module may use the plurality of first light emitting diodes, the plurality of second light emitting diodes, and the plurality of third light emitting diodes having different sizes.

The manufacturing method of the display module may use the plurality of first light emitting diodes, the plurality of second light emitting diodes, and the plurality of third light emitting diodes having a trapezoidal shape.

According to various embodiments of the present disclosure, arranging a plurality of first light emitting diodes in a first mold, arranging a plurality of second light emitting diodes in a second mold, and arranging a plurality of light emitting diodes in a third mold in order to achieve the above object. arranging third light emitting diodes, and the plurality of first light emitting diodes and the plurality of second light emitting diodes on a thin film transistor (TFT) substrate from the first mold, the second mold, and the third mold and sequentially transferring the plurality of third light emitting diodes, wherein the first inorganic light emitting diodes, the second plurality of inorganic light emitting diodes, and the plurality of inorganic light emitting diodes are assembled by fluidic self-assembly. assembly) method of manufacturing a display module that is inserted into a plurality of first insertion grooves of the first mold, a plurality of second insertion grooves of the second mold, and a plurality of third insertion grooves of the third mold, respectively. can provide

1 is a block diagram illustrating a display device according to an exemplary embodiment of the present disclosure.
2 is a plan view illustrating a display panel included in a display device according to an exemplary embodiment of the present disclosure.
FIG. 3 is an enlarged view of pixels of part III shown in FIG. 2 .
FIG. 4 is a cross-sectional view taken along the line IV-IV of FIG. 3 and showing an example in which the first light emitting diode is mounted on a TFT substrate.
5 is a flowchart illustrating a method of manufacturing a display device according to an embodiment of the present disclosure.
6 is a plan view illustrating a first mold according to an embodiment of the present disclosure.
7 is a cross-sectional view showing a first mold according to an embodiment of the present disclosure.
8 is a cross-sectional view illustrating an example in which a first light emitting diode is inserted into an insertion groove of a first mold according to an embodiment of the present disclosure.
9 is a plan view illustrating a second mold according to an embodiment of the present disclosure.
10 is a cross-sectional view showing a second mold according to an embodiment of the present disclosure.
11 is a cross-sectional view illustrating an example in which a second light emitting diode is inserted into an insertion groove of a second mold according to an embodiment of the present disclosure.
12 is a plan view illustrating a third mold according to an embodiment of the present disclosure.
13 is a cross-sectional view showing a third mold according to an embodiment of the present disclosure.
14 is a cross-sectional view illustrating an example in which a third light emitting diode is inserted into an insertion groove of a third mold according to an embodiment of the present disclosure.
15 is a diagram illustrating an example of aligning a first mold to a relay substrate according to an embodiment of the present disclosure.
16 is a diagram illustrating an example in which a first mold is brought into close contact with a relay substrate in order to transfer a plurality of first light emitting diodes from the first mold to the relay substrate according to an embodiment of the present disclosure.
17 is a diagram illustrating an example in which a plurality of first light emitting diodes are transferred to a relay substrate by a first mold according to an embodiment of the present disclosure.
18 is a view illustrating an example of aligning a second mold to a relay substrate according to an embodiment of the present disclosure.
19 is a view illustrating an example in which a second mold is brought into close contact with a relay substrate in order to transfer a plurality of second light emitting diodes from the second mold to the relay substrate according to an embodiment of the present disclosure.
20 is a diagram illustrating an example in which a plurality of second light emitting diodes are transferred to a relay substrate by a second mold according to an embodiment of the present disclosure.
21 is a view illustrating an example of aligning a third mold to a relay substrate according to an embodiment of the present disclosure.
22 is a diagram illustrating an example in which a third mold is brought into close contact with a relay substrate in order to transfer a plurality of third light emitting diodes from the third mold to the relay substrate according to an embodiment of the present disclosure.
23 is a diagram illustrating an example in which a plurality of third light emitting diodes are transferred to a relay substrate by a second mold according to an embodiment of the present disclosure.
24 is a diagram illustrating an example of aligning a relay substrate to a TFT substrate according to an embodiment of the present disclosure.
25 is a diagram illustrating an example of thermally compressing a relay substrate to a TFT substrate according to an embodiment of the present disclosure.
26 is a diagram illustrating an example in which a plurality of first to third light emitting diodes are transferred to a TFT substrate from a relay substrate according to an embodiment of the present disclosure.
27 is a cross-sectional view illustrating an example in which a first light emitting diode is mounted on a TFT substrate according to an embodiment of the present disclosure.
28 is a flowchart illustrating a method of manufacturing a display device according to an embodiment of the present disclosure.
29 is a cross-sectional view illustrating an example in which a first light emitting diode is inserted into an insertion groove of a first mold according to an embodiment of the present disclosure.
30 is a view showing an example of aligning a first mold to a TFT substrate according to an embodiment of the present disclosure.
31 is a diagram illustrating an example of thermally compressing a first mold to a TFT substrate according to an embodiment of the present disclosure.
32 is a diagram illustrating an example in which a plurality of first light emitting diodes are transferred to a TFT substrate by a first mold according to an embodiment of the present disclosure.
33 is a view showing an example of aligning a second mold to a TFT substrate according to an embodiment of the present disclosure.
34 is a diagram illustrating an example of thermally compressing a second mold to a TFT substrate according to an embodiment of the present disclosure.
35 is a view illustrating an example in which a plurality of third light emitting diodes are transferred to a TFT substrate by a third mold according to an embodiment of the present disclosure.

Hereinafter, various embodiments will be described in more detail with reference to the accompanying drawings. The embodiments described in this specification may be modified in various ways. Particular embodiments may be depicted in the drawings and described in detail in the detailed description. However, specific embodiments disclosed in the accompanying drawings are only intended to facilitate understanding of various embodiments. Therefore, the technical idea is not limited by the specific embodiments disclosed in the accompanying drawings, and it should be understood to include all equivalents or substitutes included in the spirit and technical scope of the invention.

In the present disclosure, terms including ordinal numbers such as first and second may be used to describe various elements, but these elements are not limited by the above-mentioned terms. The terminology described above is only used for the purpose of distinguishing one component from another.

In the present disclosure, terms such as “comprise” or “have” are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded. It is understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, but other elements may exist in the middle. It should be. On the other hand, when an element is referred to as “directly connected” or “directly connected” to another element, it should be understood that no other element exists in the middle.

In the present disclosure, the expression 'same' means not only completely matching, but also including a degree of difference considering a processing error range.

In addition, in describing the present disclosure, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present disclosure, the detailed description thereof will be abbreviated or omitted.

In the present disclosure, the display module may include a display panel having an inorganic light emitting diode for displaying an image. Here, the display panel may be a flat panel display panel or a curved display panel, and a plurality of inorganic light emitting diodes (eg, micro LEDs or mini LEDs) of 100 μm or less are mounted, compared to LCDs that require a backlight. It provides better contrast, response time and energy efficiency. In the present disclosure, 'inorganic light emitting diode' and 'inorganic light emitting device' may be used interchangeably.

The inorganic light emitting device applied to the present disclosure has higher brightness, luminous efficiency, and longer lifetime than OLED. The inorganic light emitting device may be a semiconductor chip capable of emitting light by itself when power is supplied. Micro LED, an inorganic light emitting device, has fast response speed, low power, and high luminance. For example, micro LEDs are more efficient at converting electricity into photons than conventional LCDs or OLEDs. That is, they have higher "brightness per watt" compared to conventional LCD or OLED displays. As a result, micro LEDs can produce the same brightness with about half the energy compared to conventional LEDs (width, length, and height each exceed 100 μm) or OLEDs. In addition, micro LED can realize high resolution, excellent color, contrast and brightness, so it can accurately express a wide range of colors, and it can implement a clear screen even in bright sunlight outdoors. In addition, micro LED is resistant to burn-in and generates little heat, guaranteeing a long lifespan without deformation. The micro LED may have a flip chip structure in which an anode and a cathode electrode are formed on the same first surface and a light emitting surface is formed on a second surface opposite to the first surface on which the electrodes are formed.

In the present disclosure, a substrate has a thin film transistor (TFT) layer formed thereon on the front surface, and a power supply circuit for supplying power to the TFT circuit, a data drive driver, and a gate drive on the rear surface. A timing controller controlling the driver and each driving driver may be disposed. A plurality of pixels arranged in a TFT layer can be driven by a TFT circuit.

In the present disclosure, the TFT provided in the display module may be a low-temperature polycrystalline silicon (LTPS) TFT, a low-temperature polycrystalline oxide (LTPO) TFT, or an oxide TFT.

In the present disclosure, the substrate is a glass substrate, a synthetic resin series having a flexible material (eg, PI (polyimide), PET (polyethylene terephthalate), PES (polyethersulfone), PEN (polyethylene naphthalate), PC (polycarbonate) etc.) or a ceramic substrate can be used.

In the present disclosure, a TFT layer having a TFT circuit is disposed on the front surface of the substrate, and no circuit may be disposed on the rear surface of the substrate. The TFT layer may be integrally formed on the substrate or made in the form of a separate film and attached to one surface of the glass substrate.

In the present disclosure, the front surface of the substrate may be divided into an active region and an inactive region. The active region may correspond to a region occupied by the TFT layer on the entire surface of the substrate, and the inactive region may be an area excluding the region occupied by the TFT layer on the entire surface of the substrate.

In the present disclosure, the edge region of the substrate may be the outermost region of the glass substrate. Also, the edge region of the substrate may be an area other than a region of the substrate where a circuit is formed. Also, the edge region of the substrate may include a portion of the front surface of the substrate adjacent to the side surface of the substrate and a portion of the rear surface of the substrate adjacent to the side surface of the substrate. The substrate may be formed in a quadrangle type. For example, the substrate may be formed in a rectangle or square. The edge region of the substrate may include at least one side of the four sides of the glass substrate.

In the present disclosure, the TFTs constituting the TFT layer (or backplane) are not limited to a specific structure or type. For example, the TFTs cited in the present disclosure include LTPS TFTs (Low-temperature polycrystalline silicon TFTs) and others. It can be implemented with oxide TFT, Si TFT (poly silicon, a-silicon), organic TFT, graphene TFT, etc., and only P-type (or N-type) MOSFET can be made and applied in the Si wafer CMOS process.

In the present disclosure, the substrate included in the display module is not limited to the TFT substrate. For example, the display module may be a substrate without a TFT layer on which a TFT circuit is formed. In this case, the display module may include a substrate on which the micro IC is separately mounted and only the wiring is patterned.

In the present disclosure, the pixel driving method of the display module may be an active matrix (AM) driving method or a passive matrix (PM) driving method. The display module may form a wiring pattern to which each micro LED is electrically connected according to an AM driving method or a PM driving method.

In the present disclosure, a display module includes a glass substrate on which a plurality of LEDs are mounted and side wires are formed. Such a display module can be installed and applied to electronic products or electric vehicles that require wearable devices, portable devices, handheld devices, and various displays as a single unit, and can be applied as a matrix type. It can be applied to display devices such as monitors for personal computers (PCs), high-resolution TVs and signage (or digital signage), electronic displays, and the like through the assembly arrangement of .

The display module of the present disclosure may include a plurality of inorganic light emitting devices for image display arranged on a substrate having thin film transistors formed thereon. A plurality of inorganic light emitting devices may be sub-pixels constituting a single pixel. In the present disclosure, one 'light emitting element', one 'micro LED', and one 'sub-pixel' may be interchangeably used as the same meaning.

Hereinafter, with reference to the accompanying drawings, embodiments of the present disclosure will be described in detail so that those skilled in the art can easily carry out the present disclosure. However, the present disclosure may be implemented in many different forms and is not limited to the embodiments described herein. And in order to clearly describe the present disclosure in the drawings, parts irrelevant to the description are omitted, and similar reference numerals are attached to similar parts throughout the specification.

Furthermore, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings and the contents described in the accompanying drawings, but the present disclosure is not limited or limited by the embodiments.

Hereinafter, a display device according to various embodiments of the present disclosure will be described with reference to drawings.

1 is a block diagram illustrating a display device according to an exemplary embodiment of the present disclosure.

Referring to FIG. 1 , a display device 1 according to an embodiment of the present disclosure may include a display module 3 and a processor 5.

The display module 3 may be a touch screen combined with a touch sensor, a flexible display, a rollable display, and/or a 3D display. In addition, according to an embodiment, a large format display (eg, LFD, large format display) may be implemented by providing a plurality of display modules of the present disclosure and physically connecting the modules.

The display module 3 can display various images. Here, the image is a concept including still images and/or moving images. The display module 3 can display various images such as broadcast content and multimedia content. Also, the display module 3 may display a user interface and icons.

The display module 3 may include a display panel 10 and a display driver IC (DDI) 7 for controlling the display panel 10 .

The display driver IC 7 may include an interface module 7a, a memory 7b (eg, a buffer memory), an image processing module 7c, or a mapping module 7d. The display driver IC 7 transmits image information including, for example, image data or image control signals corresponding to commands for controlling the image data to other parts of the display device 1 through the interface module 7a. can be received from the component. For example, according to an embodiment, image information may be received from a processor 5 (eg, a main processor (eg, an application processor) or an auxiliary processor (eg, a graphic processing unit) that operates independently of the function of the main processor). can

The display driver IC 7 may communicate with a sensor module (not shown) through an interface module 7a. Also, the display driver IC 7 may store at least a portion of the received image information in the memory 7b, for example, in units of frames. The image processing module 7c may pre-process or post-process (eg, adjust resolution, brightness, or size) at least part of the image data based on at least the characteristics of the image data or the characteristics of the display panel 10 . ) can be performed. The mapping module 7d may generate a voltage value or current value corresponding to the image data pre-processed or post-processed through the image processing module 7c. According to an embodiment, the generation of the voltage value or the current value depends on, for example, the properties of the pixels of the display panel 10 (eg, the arrangement of pixels (RGB stripe or pentile structure) or the size of each sub-pixel). It can be performed based at least in part. At least some pixels of the display panel 10 are driven based, for example, at least in part on the voltage value or current value, so that visual information (eg text, image, or icon) corresponding to the image data is displayed on the display panel ( 10) can be displayed.

The display driver IC 7 may transmit a driving signal (eg, a driver driving signal, a gate driving signal, etc.) to the display based on image information received from the processor 5 .

The display driver IC 7 may display an image based on the image signal received from the processor 5 . For example, the display driver IC 7 generates a driving signal for a plurality of subpixels based on the image signal received from the processor 5, and displays an image by controlling light emission of the plurality of subpixels based on the driving signal. can do.

The display module 3 may further include a touch circuit (not shown). The touch circuit may include a touch sensor and a touch sensor IC for controlling the touch sensor. The touch sensor IC may control the touch sensor to detect, for example, a touch input or a hovering input to a designated position of the display panel 10 . For example, the touch sensor IC may detect a touch input or a hovering input by measuring a change in a signal (eg, voltage, light amount, resistance, or charge amount) for a designated position of the display panel 10 . The touch sensor IC may provide information (eg, location, area, pressure, or time) on the sensed touch input or hovering input to the processor 5 . According to an embodiment, at least a part of the touch circuit (eg, touch sensor IC) is a display driver IC 7, a part of the display panel 10, or another component disposed outside the display module 3 ( eg as part of a co-processor).

The processor 5 includes a digital signal processor (DSP), a microprocessor, a graphics processing unit (GPU), an artificial intelligence (AI) processor, a neural processing unit (NPU), and a TCON for processing digital image signals. (time controller), but is not limited to, central processing unit (CPU), micro controller unit (MCU), micro processing unit (MPU), controller, application It may include, or be defined in terms of, one or more of a processor (application processor (AP)), communication processor (communication processor (CP)), or ARM processor. In addition, the processor 50 has a built-in processing algorithm. It may be implemented in the form of a system on chip (SoC), large scale integration (LSI), application specific integrated circuit (ASIC), or field programmable gate array (FPGA).

The processor 5 may control hardware or software components connected to the processor 5 by driving an operating system or an application program, and may perform various data processing and operations. In addition, the processor 5 may load and process commands or data received from at least one of the other components into a volatile memory, and store various data in a non-volatile memory.

FIG. 2 is a plan view illustrating a display panel included in a display device according to an exemplary embodiment of the present disclosure, FIG. 3 is an enlarged view of pixels of a portion III shown in FIG. 2, and FIG. 4 is an enlarged view of pixels IV-IV shown in FIG. It is a cross-sectional view showing an example in which the first light emitting diode is mounted on a TFT substrate as a drawing along the line.

Referring to FIGS. 2 and 3 , the display panel 10 may include a plurality of pixels arranged on a TFT substrate 20 .

The display panel 10 includes an amorphous silicon (a-Si) TFT, a low temperature polycrystalline silicon (LTPS) TFT, a low temperature polycrystalline oxide (LTPO) TFT, a hybrid oxide and polycrystalline silicon (HOP) TFT, and a liquid crystalline polymer (LCP) TFT. , or a substrate that can be implemented in the form of an OTFT (organic TFT) or the like.

The display panel 10 may include a plurality of pixel areas arranged in a matrix form. One pixel may be disposed in each pixel area 30, and each pixel includes a first light emitting diode 31 emitting light of a blue wavelength band and a second light emitting diode 33 emitting light of a green wavelength band. ) and a third light emitting diode 35 emitting light in a red wavelength band.

In one pixel area 30, the first to third light emitting diodes 31, 33, and 35 are not occupied by the first light emitting diode 31, the second light emitting diode 33, and the third light emitting diode 35. ) may be disposed.

The first to third light emitting diodes 31, 33, and 35 may be arranged in a line at regular intervals, but are not limited thereto. For example, the first to third light emitting diodes 31, 33, and 35 may be arranged in an L shape or in a pentile RGBG method. The pentile RGBG method is a method of arranging the number of red, green, and blue light emitting diodes in a ratio of 1:1:2 (RGBG) by using the characteristic that humans distinguish blue less and green the best. The pen tile RGBG method is effective because it can increase yield, lower unit cost, and realize high resolution on small surfaces.

The light emitting surfaces 31a, 33a, and 35a of the first to third light emitting diodes 31, 33, and 35 may be substantially trapezoidal. The size of the second light emitting diode 33 may be larger than that of the first light emitting diode 31 . The size of the third light emitting diode 35 may be larger than that of the second light emitting diode 33 .

In the first light emitting diode 31, a pair of electrodes 32a and 32b may be disposed on opposite sides of the light emitting surface 31a. The pair of electrodes 32a and 32b may be respectively physically and electrically connected to a pair of first electrode pads 22a and 22b disposed on one surface of the TFT substrate 20 .

In the second light emitting diode 33, a pair of electrodes 34a and 34b may be disposed on opposite sides of the light emitting surface 33a. The pair of electrodes 34a and 34b may be physically and electrically connected to a pair of second electrode pads 24a and 24b disposed on one surface of the TFT substrate 20 , respectively.

Since the size of the second light emitting diode 33 is larger than the size of the first light emitting diode 31, the distance between the pair of electrodes 34a and 34b of the second light emitting diode 33 is may be greater than the distance between the pair of electrodes 32a and 32b. Accordingly, the distance between the pair of second electrode pads 24a and 24b may be greater than the distance between the pair of first electrode pads 22a and 22b. The size of the pair of second electrode pads 24a and 24b may be larger than the size of the pair of first electrode pads 22a and 22b.

In the third light emitting diode 35, a pair of electrodes 36a and 36b may be disposed on opposite sides of the light emitting surface 35a. The pair of electrodes 36a and 36b may be respectively physically and electrically connected to a pair of third electrode pads 26a and 26b disposed on one surface of the TFT substrate 20 .

Since the size of the third light emitting diode 35 is larger than the size of the second light emitting diode 33, the distance between the pair of electrodes 36a and 36b of the third light emitting diode 35 is may be larger than the distance between the pair of electrodes 34a and 34b. Accordingly, the distance between the pair of third electrode pads 26a and 26b may be greater than the distance between the pair of second electrode pads 24a and 24b. Also, the size of the pair of third electrode pads 26a and 26b may be larger than the size of the pair of second electrode pads 24a and 24b.

The light emitting surfaces 31a, 33a, and 35a of the first to third light emitting diodes 31, 33, and 35 may be formed in a flat shape, and may have a trapezoid shape with left and right symmetrical outlines. The shape of the light emitting surfaces 31a, 33a, and 35a of the first to third light emitting diodes 31, 33, and 35 is not limited thereto, and may be a trapezoid with left and right asymmetrical shapes.

The first to third light emitting diodes 31 , 33 , and 35 may be micro light emitting diodes (LEDs) having a size of about 50 μm or less. The first to third light emitting diodes 31, 33, and 35 are flip chips in which a pair of electrodes 32a, 32b, 34a, 34b, 36a, and 36b are disposed on opposite surfaces of the light emitting surfaces 31a, 33a, and 33b. (flip chip) type structure. However, it is not limited thereto, and the first to third light emitting diodes 31, 33, and 35 may be of a lateral chip type or a vertical chip type.

Since the first to third light emitting diodes 31, 33, and 35 have different sizes but have substantially the same structure, only the structure of the first light emitting diode 31 will be described below with reference to the drawings.

Referring to FIG. 4 , the first light emitting diode 31 includes a first semiconductor layer S1, a second semiconductor layer S2, a first semiconductor layer S1 and a second semiconductor layer grown on an epitaxial substrate (not shown). It may include an active layer (active layer) (A) disposed between (S2).

The first semiconductor layer S1 may include, for example, a p-type semiconductor layer (anode, oxide electrode). The p-type semiconductor layer may be selected from, for example, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, and AlInN, and may be doped with a p-type dopant such as Mg, Zn, Ca, Sr, and Ba.

The second semiconductor layer S2 may include, for example, an n-type semiconductor layer (cathode, reduction electrode). The n-type semiconductor layer may be selected from, for example, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, and the like, and may be doped with an n-type dopant such as Si, Ge, or Sn.

The epitaxially grown portion of the first light emitting diode 31 is not limited to the above configuration, and for example, the first semiconductor layer S1 includes an n-type semiconductor layer and the second semiconductor layer S2 includes a p-type semiconductor layer. A semiconductor layer may also be included. The active layer is a region in which electrons and holes are recombinated, and as the electrons and holes recombine, the active layer transitions to a lower energy level and can generate light having a wavelength corresponding thereto.

The active layer (A) may include a semiconductor material, for example, amorphous silicon or polycrystalline silicon. However, the present embodiment is not limited thereto, and may contain an organic semiconductor material or the like, and may have a single quantum well (SQW) structure or a multi quantum well (MQW) structure.

A pair of electrodes 32a and 32b may be disposed on a surface opposite to the light emitting surface 31a of the first light emitting diode 31 . When one electrode 32a is an anode electrode, the other electrode 32b may be a cathode electrode. The pair of electrodes 32a and 32b may be made of an alloy containing Ag or Au, but is not limited thereto.

The first light emitting diode 31 has a first side surface 31b, a second side surface 31c, and a third side surface 31d between the light emitting surface 31a and the surface opposite to the light emitting surface (hereinafter referred to as 'bottom surface'). and a fourth side surface 31e.

When the size of the bottom surface of the first light emitting diode 31 is smaller than the size of the light emitting surface 31a, the first to fourth side surfaces 31b, 31c, 31d, and 31e may be inclined.

For example, the first and second side surfaces 31b and 31c of the first light emitting diode 31 may be inclined from the upper side to the lower side of the first light emitting diode 31 as shown in FIG. 4 . The first side surface 31b of the first light emitting diode 31 is inclined at a first angle B1 with respect to the light emitting surface 31a, and the second side surface 31c of the first light emitting diode 31 is the light emitting surface ( It may be inclined at a second angle B2 with respect to 31a). In this case, both the first angle B1 and the second angle B2 are acute angles, and may be substantially the same angle. Accordingly, the cross section of the first light emitting diode 31 may be an inverted trapezoidal symmetrical shape. The third and fourth side surfaces 31d and 31e of the first light emitting diode 31 may form an acute angle with respect to the light emitting surface 31a similarly to the first and second side surfaces 31b and 31c.

The bottom surface of the first light emitting diode 31 may have a rectangular shape in plan, but is not limited thereto. For example, the bottom surface of the inorganic light emitting element 31 may be formed in various shapes such as a square shape or a trapezoidal shape. A pair of electrodes 32a and 32b may be spaced apart from each other on the lower surface of the first light emitting diode 31 .

The side surfaces of the second light emitting diode 33 and the side surfaces of the third light emitting diode 35 may be inclined similarly to the side surfaces 31b, 31c, 31d, and 31e of the first light emitting diode 31 .

Hereinafter, a method of manufacturing a display device according to an embodiment of the present disclosure will be described with reference to the drawings.

5 is a flowchart illustrating a method of manufacturing a display device according to an embodiment of the present disclosure, FIG. 6 is a plan view illustrating a first mold according to an embodiment of the present disclosure, and FIG. 8 is a cross-sectional view showing an example in which a first light emitting diode is inserted into an insertion groove of the first mold according to an embodiment of the present disclosure.

A manufacturing method of a display device according to an embodiment of the present disclosure may go through the following schematic processes. For example, a plurality of light emitting diodes may be respectively arranged in a mold for each color (blue, green, red) in a fluid self-assembly method. A plurality of light emitting diodes may be sequentially transferred from the molds for each color to the relay substrate. A plurality of light emitting diodes of different colors arranged on the relay substrate may be transferred to the TFT substrate.

Hereinafter, processes constituting a manufacturing method of a display device according to an embodiment of the present disclosure will be described in detail.

In the present disclosure, a plurality of first light emitting diodes 31 emitting blue wavelength light may be arranged in the first mold 100 in a fluid self-assembly method (501 in FIG. 5).

Referring to FIG. 6 , a plurality of first insertion grooves 110 into which the first light emitting diodes 31 are respectively inserted may be formed on one surface of the first mold 100 . The plurality of first insertion grooves 110 may be arranged at regular intervals G1 in a row direction and at regular intervals G2 in a column direction. These intervals G1 and G2 may be based on the pitch between pixels transferred to the TFT substrate 20 (see FIG. 26).

The first insertion groove 110 of the first mold 100 may have an opening substantially corresponding to the shape of the light emitting surface 31a of the first light emitting diode 31 when viewed from a plane. For example, the opening of the first insertion groove 110 of the first mold 100 may be trapezoidal.

The size of the opening of the first insertion groove 110 of the first mold 100 is such that the first light emitting diode 31 can be easily inserted into the first insertion groove 110 of the first mold 100 during fluid self-assembly. It may be formed slightly larger than the size of the first light emitting diode 31 so that it can be formed.

Referring to FIG. 7 , side surfaces 111 and 113 of the first insertion groove 110 of the first mold 100 may be inclined. In this case, the cross section of the first insertion groove 110 of the first mold 100 may gradually become narrower from the opening side to the bottom side.

Referring to FIG. 8 , as the shape of the first insertion groove 110 of the first mold 100 is formed to be similar to that of the first light emitting diode 31, the first light emitting diode 31 during fluid self-assembly Can be easily inserted into the first insertion groove 110 of the first mold 100 in a certain direction.

9 is a plan view showing a second mold according to an embodiment of the present disclosure, FIG. 10 is a cross-sectional view showing a second mold according to an embodiment of the present disclosure, and FIG. 11 is a second mold according to an embodiment of the present disclosure. 2 It is a cross-sectional view showing an example in which the second light emitting diode is inserted into the insertion groove of the mold.

In the present disclosure, a plurality of second light emitting diodes 33 emitting green wavelength light may be arranged in the second mold 200 in a fluid self-assembly method (502 in FIG. 5).

Referring to FIG. 9 , a plurality of second insertion grooves 220 into which the second light emitting diodes 33 are respectively inserted may be formed on one surface of the second mold 200 . The plurality of second insertion grooves 220 may be arranged at regular intervals G3 in a row direction and at regular intervals G4 in a column direction. These intervals G3 and G4 may be based on a pitch between pixels transferred to the TFT substrate 20 (see FIG. 26).

The opening of the second insertion groove 220 of the second mold 200 may have a shape substantially corresponding to the shape of the light emitting surface 33a of the second light emitting diode 33 when viewed from a plane. For example, the opening of the second insertion groove 220 of the second mold 200 may be trapezoidal.

The size of the opening of the second insertion groove 220 of the second mold 200 is such that the second light emitting diode 33 can be easily inserted into the second insertion groove 220 of the second mold 200 during fluid self-assembly. It may be formed slightly larger than the size of the second light emitting diode 33 so that it can be formed.

Referring to FIG. 10 , side surfaces 221 and 223 of the second insertion groove 220 of the second mold 200 may be inclined. In this case, the cross section of the second insertion groove 220 of the second mold 200 may gradually become narrower from the opening side to the bottom side.

Referring to FIG. 11, as the shape of the second insertion groove 220 of the second mold 200 is formed to be similar to the shape of the second light emitting diode 33, the second light emitting diode 33 during fluid self-assembly can be easily inserted into the second insertion groove 220 of the second mold 200 in a certain direction.

The second mold 200 may have a plurality of first auxiliary insertion grooves 210 formed therein. A plurality of first auxiliary insertion grooves 210 may be disposed at regular intervals (G11) on the left side of the plurality of second insertion grooves 220, respectively. The plurality of first auxiliary insertion grooves 210 of the second mold 200 may have substantially the same shape, row-direction spacing, and column-direction spacing of the plurality of first insertion grooves 110 of the first mold 100. there is.

The plurality of second light emitting diodes 33 are inserted into the plurality of second insertion grooves 220 during fluid self-assembly, but the size of the second light emitting diodes 33 is larger than the size of the plurality of first auxiliary insertion grooves 210. Because of their size, the plurality of second light emitting diodes 33 are not inserted into the plurality of first auxiliary insertion grooves 210 of the second mold 200 .

12 is a plan view showing a third mold according to an embodiment of the present disclosure, FIG. 13 is a cross-sectional view showing a third mold according to an embodiment of the present disclosure, and FIG. 14 is a third mold according to an embodiment of the present disclosure. 3 It is a cross-sectional view showing an example in which the third light emitting diode is inserted into the insertion groove of the mold.

In the present disclosure, a plurality of third light emitting diodes 35 emitting red wavelength light may be arranged in the third mold 300 in a fluid self-assembly method (503 in FIG. 5).

Referring to FIG. 12 , a plurality of third insertion grooves 330 into which third light emitting diodes 35 are respectively inserted may be formed on one surface of the third mold 300 . The plurality of third insertion grooves 330 may be arranged at regular intervals G5 in a row direction and at regular intervals G6 in a column direction. These intervals G5 and G6 may be based on a pitch between pixels transferred to the TFT substrate 20 (see FIG. 26).

When viewed from a plane, the opening of the third insertion groove 330 of the third mold 300 may have a shape substantially corresponding to the shape of the light emitting surface 35a of the third light emitting diode 35 . For example, the opening of the third insertion groove 330 of the third mold 300 may be trapezoidal.

The size of the opening of the third insertion groove 330 of the third mold 300 is such that the third light emitting diode 35 can be easily inserted into the third insertion groove 330 of the third mold 300 during fluid self-assembly. It may be formed slightly larger than the size of the third light emitting diode 35 so that it can be formed.

Referring to FIG. 13 , side surfaces 331 and 333 of the third insertion groove 330 of the third mold 300 may be inclined. In this case, the cross section of the third insertion groove 330 of the third mold 300 may gradually become narrower from the opening side to the bottom side.

Referring to FIG. 14, as the shape of the third insertion groove 330 of the third mold 300 is similar to that of the third light emitting diode 35, the third light emitting diode 35 during fluid self-assembly may be inserted into the third insertion groove 330 of the third mold 300 in a certain direction.

The third mold 300 may be formed with a plurality of second auxiliary insertion grooves 310 and a plurality of third auxiliary insertion grooves 320 . A plurality of third auxiliary insertion grooves 320 may be disposed at regular intervals (G12) on the left side of the plurality of third insertion grooves 330, respectively. A plurality of second auxiliary insertion grooves 310 may be disposed at regular intervals (G11) on the left side of the plurality of third auxiliary insertion grooves 320, respectively.

The plurality of second auxiliary insertion grooves 310 of the third mold 300 may have substantially the same shape, row-direction spacing, and column-direction spacing of the plurality of first insertion grooves 110 of the first mold 100. there is.

The plurality of third auxiliary insertion grooves 320 of the third mold 300 may be substantially the same as the shapes, rows, and columns of the plurality of second insertion grooves 220 of the second mold 300 . there is.

The plurality of third light emitting diodes 35 are inserted into the plurality of third insertion grooves 330 during fluid self-assembly, but the size of the third light emitting diodes 35 is different from the plurality of second auxiliary insertion grooves 310 and the plurality of third light emitting diodes 35. Since the size of the third auxiliary insertion groove 320 is larger than the plurality of second auxiliary insertion grooves 310 and the plurality of third auxiliary insertion grooves 320 of the third mold 300, a plurality of third light emitting diodes 35 ) is not inserted.

15 is a view showing an example in which a first mold is aligned on a relay board according to an embodiment of the present disclosure, and FIG. 16 is a view showing a plurality of first light emitting diodes from the first mold according to an embodiment of the present disclosure. FIG. 17 shows an example in which a plurality of first light emitting diodes are transferred to the relay substrate by the first mold according to an embodiment of the present disclosure. it is a drawing

In the present disclosure, a plurality of first light emitting diodes 31 arranged in a first mold 100, a plurality of second light emitting diodes 33 arranged in a second mold 200, and a third mold 300 A plurality of arranged third light emitting diodes 35 may be sequentially transferred to the relay substrate 400 (504 in FIG. 5).

Referring to FIG. 15 , the first mold 100 is disposed above the relay substrate 400 at intervals in order to transfer the plurality of first light emitting diodes 31 to a preset position on the relay substrate 400. It may be aligned with the relay board 400 . In this case, the plurality of first light emitting diodes 31 arranged in the first mold 100 may have light emitting surfaces 31a facing the relay substrate 400 .

A predetermined adhesive layer may be formed in the plurality of first insertion grooves 110 of the first mold 100 . Accordingly, a pair of electrodes 32a and 32b disposed on the bottom surface of the plurality of first light emitting diodes 31 inserted into the plurality of first insertion grooves 110 may be attached to the adhesive layer. The plurality of first light emitting diodes 31 inserted into the plurality of first insertion grooves 110 are not separated from the first mold 100 while being aligned toward the relay board 400 when transferred to the relay board 400 . may not be

Referring to FIG. 16 , the first mold 100 may be bonded to one surface of the relay substrate 400 . In this case, the first mold 100 may be pressed toward the relay substrate 400 with a constant pressure.

Accordingly, the plurality of first light emitting diodes 31 arranged in the first mold 100 may have a light emitting surface 31a attached to the adhesive layer 410 formed on one surface of the relay substrate 400 .

Referring to FIG. 17 , the first mold 100 may be separated from the relay substrate 400 .

The adhesive layer 410 of the relay substrate 400 may have stronger adhesive force than the adhesive layer formed in the plurality of first insertion grooves 110 of the first mold 100 . Accordingly, the plurality of first light emitting diodes 31 may be transferred from the first mold 100 to the relay substrate 400 .

18 is a diagram illustrating an example of arranging a second mold according to an embodiment of the present disclosure on a relay board, and FIG. 19 is a view showing a plurality of second light emitting diodes from the second mold according to an embodiment of the present disclosure. 20 shows an example in which a plurality of second light emitting diodes are transferred to the relay substrate by the second mold according to an embodiment of the present disclosure. it is a drawing

Referring to FIG. 18 , the second mold 200 is disposed above the relay substrate 400 at intervals in order to transfer the plurality of second light emitting diodes 33 to a preset position on the relay substrate 400. It may be aligned with the relay board 400 . In this case, the plurality of second light emitting diodes 33 arranged in the second mold 200 may have light emitting surfaces 33a facing the relay substrate 400 .

A predetermined adhesive layer may be formed in the plurality of second insertion grooves 220 of the second mold 200 . Accordingly, a pair of electrodes 34a and 34b disposed on the bottom surface of the plurality of second light emitting diodes 33 inserted into the plurality of second insertion grooves 220 may be attached to the adhesive layer. The plurality of second light emitting diodes 33 inserted into the plurality of second insertion grooves 220 are not separated from the second mold 200 while being aligned toward the relay board 400 when transferred to the relay board 400. may not be

Referring to FIG. 19 , the second mold 200 may be bonded to one surface of the relay substrate 400 .

The plurality of first light emitting diodes 31 first transferred to the relay substrate 400 may be inserted into the plurality of first auxiliary insertion grooves 210 of the second mold 200 . Accordingly, when the plurality of second light emitting diodes 33 arranged in the second mold 200 are transferred to the relay substrate 400, the plurality of first light emitting diodes 31 first transferred to the relay substrate 400 2 may not interfere with the mold 200 .

The second mold 200 may be pressed toward the relay substrate 400 with a constant pressure. Accordingly, the plurality of second light emitting diodes 33 arranged in the second mold 200 may be attached to the adhesive layer 410 having the light emitting surface 33a formed on one surface of the relay substrate 400 .

Referring to FIG. 20 , the second mold 200 may be separated from the relay substrate 400 .

The adhesive layer 410 of the relay substrate 400 may have stronger adhesive force than the adhesive layer formed in the plurality of second insertion grooves 220 of the second mold 200 . Accordingly, the plurality of second light emitting diodes 33 may be transferred from the second mold 200 to the relay substrate 400 .

Accordingly, the plurality of first light emitting diodes 31 and the plurality of second light emitting diodes 33 may be lattice-arranged on the relay substrate 400 .

21 is a view showing an example in which a third mold according to an embodiment of the present disclosure is aligned on a relay board, and FIG. 22 is a view showing a plurality of third light emitting diodes from the third mold according to an embodiment of the present disclosure. 23 shows an example in which a plurality of third light emitting diodes are transferred to the relay substrate by the second mold according to an embodiment of the present disclosure. it is a drawing

Referring to FIG. 21 , the third mold 300 is disposed above the relay substrate 400 at intervals in order to transfer the plurality of third light emitting diodes 35 to a preset position on the relay substrate 400. It may be aligned with the relay board 400 . In this case, the plurality of third light emitting diodes 35 arranged in the third mold 300 may have light emitting surfaces 35a facing the relay substrate 400 .

A predetermined adhesive layer may be formed in the plurality of third insertion grooves 330 of the third mold 300 . Accordingly, a pair of electrodes 36a and 36b disposed on the bottom surface of the plurality of third light emitting diodes 35 inserted into the plurality of third insertion grooves 330 may be attached to the adhesive layer. The plurality of third light emitting diodes 35 inserted into the plurality of third insertion grooves 330 are not separated from the third mold 300 while being aligned toward the relay board 400 when transferred to the relay board 400 . may not be

Referring to FIG. 22 , the third mold 300 may be bonded to one surface of the relay substrate 400 .

The plurality of first light emitting diodes 31 first transferred to the relay substrate 400 may be inserted into the plurality of second auxiliary insertion grooves 310 of the third mold 200, and the plurality of second light emitting diodes 33 ) may be inserted into a plurality of third auxiliary insertion grooves 320 of the third mold 200 . Accordingly, when transferring the plurality of third light emitting diodes 35 arranged in the third mold 300 to the relay substrate 400, the plurality of first light emitting diodes 31 and the plurality of first light emitting diodes 31 first transferred to the relay substrate 400 The second light emitting diode 33 of may not interfere with the third mold 300 .

The third mold 300 may be pressed toward the relay substrate 400 with a constant pressure. Accordingly, the plurality of third light emitting diodes 35 arranged in the third mold 300 may be attached to the adhesive layer 410 having the light emitting surface 35a formed on one surface of the relay substrate 400 .

Referring to FIG. 22 , the third mold 300 may be separated from the relay substrate 400 .

The adhesive layer 410 of the relay substrate 400 may have stronger adhesive strength than the adhesive layer formed in the plurality of third insertion grooves 330 of the third mold 300 . Accordingly, the plurality of third light emitting diodes 35 may be transferred from the third mold 300 to the relay substrate 400 .

Accordingly, a plurality of first light emitting diodes 31 , a plurality of second light emitting diodes 33 , and a plurality of third light emitting diodes 35 may be arranged in a lattice arrangement on the relay substrate 400 .

24 is a diagram showing an example of aligning a relay substrate to a TFT substrate according to an embodiment of the present disclosure, and FIG. 25 is a diagram illustrating an example of thermally compressing a relay substrate to a TFT substrate according to an embodiment of the present disclosure. 26 is a diagram illustrating an example in which a plurality of first to third light emitting diodes are transferred to a TFT substrate from a relay substrate according to an embodiment of the present disclosure, and FIG. 27 is a view showing a first light emitting diode according to an embodiment of the present disclosure. It is a cross-sectional view showing an example in which a diode is mounted on a TFT substrate.

In the present disclosure, the plurality of first light emitting diodes 31, the plurality of second light emitting diodes 33, and the plurality of third light emitting diodes 35 arranged on the relay substrate 400 are transferred to the TFT substrate 20. Yes (505 in FIG. 5).

Referring to FIG. 24 , the relay substrate 400 is provided on the upper side of the TFT substrate 20 to transfer the plurality of first to third light emitting diodes 31 , 33 , and 35 to a preset position on the TFT substrate 20 . may be arranged at intervals and aligned with the TFT substrate 20 . At this time, the light emitting surfaces 31a, 33a, and 35a of the plurality of first to third light emitting diodes 31, 33, and 35 arranged on the relay substrate 400 may face the TFT substrate 20.

On one surface of the TFT substrate 20 facing the relay substrate 400, electrodes 32a, 32b, 34a, 34b, 36a, and 36b of the plurality of first to third light emitting diodes 31, 33, and 35 are provided. Electrode pads 22a, 22b, 24a, 24b, 26a, 26b may be arranged.

On one surface of the relay substrate 400, an adhesive layer (eg, ACF (anisotropic conductive film), ACP (anisotropic conductive paste) so that the plurality of first to third light emitting diodes 31, 33, and 35 can be firmly mounted. , NCF (non-conductive film), NCP0 (non-conductive paste), etc.) may be laminated. In this case, the electrode pads 22a, 22b, 24a, 24b, 26a, and 26b may be covered with an adhesive layer.

Referring to FIG. 25 , the relay substrate 400 may be thermally compressed to the TFT substrate 20 by a pressing member.

The electrodes 32a, 32b, 34a, 34b, 36a, and 36b of the plurality of first to third light emitting diodes 31, 33, and 35 have corresponding electrode pads 22a, 22b, 24a, 24b, 26a, 26b).

Referring to FIG. 26 , the relay substrate 400 may be separated from the TFT substrate 20 .

The electrodes 32a, 32b, 34a, 34b, 36a, and 36b of the plurality of first to third light emitting diodes 31, 33, and 35 have corresponding electrode pads 22a, 22b, 24a, 24b, 26a, and 26b), the plurality of first to third light emitting diodes 31, 33, and 35 can be easily separated from the relay substrate 400.

Through this process, the plurality of first to third light emitting diodes 31 , 33 , and 35 may be transferred from the relay substrate 400 to the TFT substrate 20 .

Meanwhile, as described above, cross sections of the first to third light emitting diodes 31, 33, and 35 transferred to the TFT substrate 20 may have an inverted trapezoidal shape, but are not limited thereto. For example, cross sections of the first to third light emitting diodes 31, 33, and 35 may be trapezoidal. As such, when the cross sections of the first to third light emitting diodes 31, 33, and 35 are trapezoidal, the manufacturing method of the display module can omit the process of using the relay substrate 400, which will be described in detail below. .

27 is a cross-sectional view illustrating an example in which a first light emitting diode is mounted on a TFT substrate according to an embodiment of the present disclosure.

Referring to FIG. 27, the first light emitting diode 31' mounted on the TFT substrate 20' has a shape similar to that of the light emitting surface 31a' of the first light emitting diode 31 described above. can be similar For example, the light emitting surface 31a' of the first light emitting diode 31' may be a trapezoid in which left and right sides are symmetrical or a trapezoid in which left and right sides are asymmetrical.

When the size of the light emitting surface 31a' of the first light emitting diode 31' is smaller than the size of the bottom surface, the four side surfaces of the first light emitting diode 31' may be inclined.

For example, the first and second side surfaces 31b' and 31c' of the first light emitting diode 31' may be inclined from the upper side to the lower side of the first light emitting diode 31'. The first side surface 31b' of the first light emitting diode 31' is inclined at a third angle B3 with respect to the light emitting surface 31a', and the second side surface 31c' of the first light emitting diode 31' ) may be inclined at a fourth angle B4 with respect to the light emitting surface 31a'. In this case, both the third angle B1 and the fourth angle B2 are obtuse angles, and may be substantially the same angle.

Although not shown in the drawings, the third and fourth side surfaces of the first light emitting diode 31' may form an obtuse angle with respect to the light emitting surface 31a' similar to the first and second side surfaces 31b' and 31c'. there is.

The bottom surface of the first light emitting diode 31' may have a rectangular shape in plan, but is not limited thereto. For example, the bottom surface of the inorganic light emitting element 31' may be formed in various shapes such as a square shape or a trapezoidal shape.

The bottom surface of the first light emitting diode 31' may be wider than the light emitting surface 31a'. Accordingly, the cross section of the first light emitting diode 31' may be trapezoidal.

A pair of electrodes 32a' and 32b' may be spaced apart from each other on the lower surface of the first light emitting diode 31'. The pair of electrodes 32a' and 32b' may be respectively connected to the pair of first electrode pads 22a' and 22b' of the TFT substrate 20'.

The first light emitting diode 31' includes a first semiconductor layer S1', a second semiconductor layer S2', a first semiconductor layer S1', and a second semiconductor layer S2 grown on an epitaxial substrate (not shown). ') may include an active layer (A') disposed between them.

The second light emitting diode 33' and the third light emitting diode 35' may have structures similar to those of the first light emitting diode 31'. The side surfaces of the second light emitting diode 33' and the side surfaces of the third light emitting diode 35' may be inclined similarly to the side surfaces of the first light emitting diode 31'.

Hereinafter, a method of manufacturing a display device using the first to third light emitting diodes 31', 33', and 35' having trapezoidal cross sections will be described.

A manufacturing method of a display device according to an embodiment of the present disclosure may go through the following schematic processes. For example, a plurality of light emitting diodes may be respectively arranged in a mold for each color (blue, green, red) in a fluid self-assembly method. A plurality of light emitting diodes may be sequentially transferred from the molds for each color to the TFT substrate. In this case, the process of using a relay substrate can be omitted.

28 is a flowchart illustrating a method of manufacturing a display device according to an embodiment of the present disclosure, and FIG. 29 is a cross-sectional view illustrating an example in which a first light emitting diode is inserted into an insertion groove of a first mold according to an embodiment of the present disclosure. am.

In the present disclosure, a plurality of first light emitting diodes 31 emitting blue wavelength light may be arranged in the first mold 100 in a fluid self-assembly method ( 2801 in FIG. 28 ).

Referring to FIG. 29 , the first mold 100' may have substantially the same structure as the first mold 100 (see FIGS. 6 and 7) described above. For example, the side surfaces 111' and 113' of the first insertion groove 110' of the first mold 100' may be inclined. In this case, the cross section of the first insertion groove 110' of the first mold 100' may gradually become narrower from the opening side to the bottom side.

As the shape of the first insertion groove 110' of the first mold 100' is formed to be similar to that of the first light emitting diode 31', the first light emitting diode 31' is constant during fluid self-assembly. direction, it can be easily inserted into the first insertion groove 110' of the first mold 100'. In this case, the light emitting surface 31a' of the first light emitting diode 31' may be seated on the bottom of the first insertion groove 110' of the first mold 100'.

In the present disclosure, a plurality of second light emitting diodes emitting green wavelength light may be arranged in the second mold in a fluid self-assembly method ( 2802 in FIG. 28 ).

In the present disclosure, a plurality of third light emitting diodes emitting light of a red wavelength series may be arranged in a third mold in a fluid self-assembly method ( 2803 in FIG. 28 ).

30 is a view showing an example of aligning a first mold to a TFT substrate according to an embodiment of the present disclosure, and FIG. 31 illustrates an example of thermally compressing the first mold to a TFT substrate according to an embodiment of the present disclosure. FIG. 32 is a diagram illustrating an example in which a plurality of first light emitting diodes are transferred to a TFT substrate by a first mold according to an embodiment of the present disclosure.

In this case, the plurality of first to third light emitting diodes 31', 33', and 35' arranged in the first to third molds are sequentially transferred to the TFT substrate 20' (2804 in FIG. 28). ).

Referring to FIG. 30 , the first mold 100' is spaced on the upper side of the TFT substrate 20' to transfer the plurality of first light emitting diodes 31' to a preset position on the TFT substrate 20'. , and may be aligned with the TFT substrate 20'. In this case, electrodes 32a' of the plurality of first light emitting diodes 31' arranged in the first mold 100' may face the TFT substrate 20'.

Referring to FIG. 31 , the first mold 100' may be thermally compressed to the TFT substrate 20' by a pressing member. Accordingly, the electrodes 32a' of the plurality of first light emitting diodes 31' may be bonded to corresponding electrode pads 22a' of the TFT substrate 20', respectively. The electrodes of the first light emitting diode 31' may include a pair (anode electrode and cathode electrode).

Referring to FIG. 32 , the first mold 100' may be separated from the TFT substrate 20'.

As the electrodes of the plurality of first light emitting diodes 31' are bonded to the corresponding electrode pads of the TFT substrate 20', the plurality of first light emitting diodes 31' are easily removed from the first mold 100'. can be separated.

Through this process, the plurality of first light emitting diodes 31' can be transferred from the first mold 100' to the TFT substrate 20'.

33 is a view showing an example of aligning a second mold to a TFT substrate according to an embodiment of the present disclosure, and FIG. 34 illustrates an example of thermally compressing a second mold to a TFT substrate according to an embodiment of the present disclosure. it is a drawing

Referring to FIG. 33, a second mold 200' is spaced on the upper side of the TFT substrate 20' to transfer a plurality of second light emitting diodes 33' to a preset position on the TFT substrate 20'. , and may be aligned with the TFT substrate 20'. In this case, electrodes 34a' of the plurality of second light emitting diodes 33' arranged in the second mold 200' may face the TFT substrate 20'.

Referring to FIG. 34 , the second mold 200' may be thermally compressed to the TFT substrate 20' by a pressing member. The plurality of first light emitting diodes 31' first transferred to the TFT substrate 20' may be inserted into the plurality of first auxiliary insertion grooves 210' of the second mold 200'. Accordingly, when transferring the plurality of second light emitting diodes 33' arranged in the second mold 200' to the TFT substrate 20', the plurality of first light emitting diodes first transferred to the TFT substrate 20' ( 31') may not interfere with the second mold 200'.

The electrodes 34a' of the plurality of second light emitting diodes 33' may be bonded to the corresponding electrode pads 24a' of the TFT substrate 20' by thermal compression. The second light emitting diode 33' may have a pair of electrodes (anode electrode and cathode electrode).

After the second molding 200' is separated from the TFT substrate 20', a plurality of third light emitting diodes 35' arranged on the third molding may be transferred to the TFT substrate 20'. A description of the process of transferring the plurality of third light emitting diodes 35' from the third molding to the TFT substrate 20' will be omitted.

35 is a diagram illustrating an example in which a plurality of third light emitting diodes are transferred to a TFT substrate by a third mold according to an embodiment of the present disclosure.

Referring to FIG. 35, a plurality of first to third light emitting diodes 31' sequentially transferred from the first molding 100', the second molding 200', and the third molding are formed on the TFT substrate 20'. 33', 35') may be arranged.

As such, in the method of manufacturing a display module according to an embodiment of the present disclosure, when the first to third light emitting diodes 31', 33', and 35' having trapezoidal cross sections are applied, the first to third light emitting diodes 31', 33', and 35' are applied without using an intermediate substrate. The first to third light emitting diodes 31', 33', and 35' may be directly transferred from the to third molds to the TFT substrate 20'.

Although the above has been shown and described with respect to preferred embodiments of the present disclosure, the present disclosure is not limited to the specific embodiments described above, and is commonly used in the technical field belonging to the present disclosure without departing from the gist of the present disclosure claimed in the claims. Of course, various modifications and implementations are possible by those with knowledge of, and these modifications should not be individually understood from the technical spirit or prospect of the present disclosure.

20: TFT panel
31, 33, 35: light emitting diode
100: first mold
110: first insertion groove
200: second mold
210: first auxiliary insertion groove
220: second insertion groove
300: third mold
310: second auxiliary insertion groove
320: third auxiliary insertion groove
330: third insertion groove
400: relay board

Claims (19)

In the display module,
a substrate on which a plurality of thin film transistors (TFTs) are arranged; and
A plurality of pixels electrically connected to the plurality of TFTs;
Each pixel includes a first light emitting diode, a second light emitting diode, and a third light emitting diode having different sizes. According to claim 1,
The size of the second inorganic foot and the diode is larger than the size of the first light emitting diode,
The size of the third light emitting diode is larger than the size of the second inorganic light emitting diode display module. According to claim 2,
The first light emitting diode emits light in a blue wavelength band,
The second light emitting diode emits light in a green wavelength band,
The third light emitting diode is a display module that emits light in a red wavelength band. According to claim 1,
The display module of claim 1 , wherein each of the first light emitting diode, the second light emitting diode, and the third light emitting diode has a trapezoidal light emitting surface. According to claim 4,
The display module of claim 1 , wherein side surfaces of each of the first light emitting diode, the second light emitting diode, and the third light emitting diode are formed to be inclined. According to claim 5,
The display module of claim 1 , wherein each of the first light emitting diode, the second light emitting diode, and the third light emitting diode has a cross section gradually narrowing from a light emitting surface to a surface opposite to the light emitting surface. According to claim 5,
The display module of claim 1 , wherein each of the first light emitting diode, the second light emitting diode, and the third light emitting diode has a cross section gradually widening from a light emitting surface to a surface opposite to the light emitting surface. In the mold apparatus for manufacturing a display module,
A first mold in which a plurality of first insertion grooves having a first size into which a plurality of first light emitting diodes are inserted are arranged in a grid;
a second mold in which a plurality of second insertion grooves having a second size larger than the first size into which a plurality of second light emitting diodes corresponding to the plurality of first sizes are inserted are arranged in a grid; and
A third mold in which a plurality of third insertion grooves having a third size larger than the second size into which a plurality of third light emitting diodes are inserted are arranged in a grid,
In the second mold, a plurality of additional first insertion grooves corresponding to the first size are arranged in a grid,
The third mold has a plurality of additional second insertion grooves corresponding to the first size in a grid arrangement, and a plurality of additional third insertion grooves corresponding to the second size in a grid arrangement. According to claim 8,
The plurality of additional first insertion grooves of the second mold are disposed at positions corresponding to the first insertion grooves of the first mold;
The plurality of additional second insertion grooves of the third mold are disposed at positions corresponding to the first insertion grooves of the first mold;
The plurality of additional third insertion grooves of the third mold are disposed at positions corresponding to the second insertion grooves of the second mold. According to claim 8,
The first size is greater than or equal to the size of the plurality of first light emitting diodes,
The second size is greater than or equal to the size of the plurality of second light emitting diodes,
The third size is greater than or equal to the size of the plurality of third light emitting diodes. According to claim 8,
The plurality of first insertion grooves, the plurality of second insertion grooves, the plurality of third insertion grooves, the plurality of additional first insertion grooves, the plurality of additional second insertion grooves, and the plurality of additional third insertion grooves A molded device in which the groove is trapezoidal. According to claim 11,
Wherein each of the plurality of first insertion grooves, the plurality of second insertion grooves, and the plurality of third insertion grooves has inclined side surfaces. According to claim 12,
The plurality of first insertion grooves, the plurality of second insertion grooves, and the plurality of third insertion grooves, each of which has a cross section gradually narrowing from the opening side to the bottom side. In the display manufacturing method,
arranging a plurality of first light emitting diodes in a first mold;
arranging a plurality of second light emitting diodes in a second mold;
arranging a plurality of third light emitting diodes in a third mold;
transferring the plurality of first light emitting diodes, the plurality of second light emitting diodes, and the plurality of third light emitting diodes, respectively, from the first mold, the second mold, and the third mold to a relay substrate; and
Sequentially transferring the plurality of first light emitting diodes, the plurality of second light emitting diodes, and the plurality of third light emitting diodes from the relay substrate to a thin film transistor (TFT) substrate,
The first light emitting diodes, the plurality of second light emitting diodes, and the plurality of light emitting diodes are assembled into a plurality of first insertion grooves of the first mold and a plurality of second molds in a fluidic self-assembly method. A method of manufacturing a display module that is inserted into the second insertion groove of the second insertion groove and the plurality of third insertion grooves of the third mold, respectively. According to claim 14,
A method of manufacturing a display module using the plurality of first light emitting diodes, the plurality of second light emitting diodes, and the plurality of third light emitting diodes having different sizes. According to claim 15,
A method of manufacturing a display module using the plurality of first light emitting diodes, the plurality of second light emitting diodes, and the plurality of third light emitting diodes having a trapezoidal shape. In the display manufacturing method,
arranging a plurality of first light emitting diodes in a first mold;
arranging a plurality of second light emitting diodes in a second mold;
arranging a plurality of third light emitting diodes in a third mold; and
The plurality of first light emitting diodes, the plurality of second light emitting diodes, and the plurality of third light emitting diodes are sequentially applied to a thin film transistor (TFT) substrate from the first mold, the second mold, and the third mold. Including; transcribing to
The first light emitting diodes, the plurality of second light emitting diodes, and the plurality of light emitting diodes are assembled into a plurality of first insertion grooves of the first mold and a plurality of second molds in a fluidic self-assembly method. A method of manufacturing a display module that is inserted into the second insertion groove of the second insertion groove and the plurality of third insertion grooves of the third mold, respectively. According to claim 17,
Using the plurality of second light emitting diodes having a size larger than the size of the plurality of first light emitting diodes,
A method of manufacturing a display module using the plurality of third light emitting diodes having a size larger than the size of the plurality of second light emitting diodes. According to claim 17,
A method of manufacturing a display module using the plurality of first light emitting diodes, the plurality of second light emitting diodes, and the plurality of third light emitting diodes having a trapezoidal shape.

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