KR20230004211A - Inorganic light emitting diode, display module and manufacturing method thereof - Google Patents

Abstract

An inorganic light emitting device, a display module, and a method of manufacturing the display module are disclosed. The disclosed inorganic light emitting device includes: a first semiconductor layer; a second semiconductor layer having a light emitting surface composed of four sides; an active layer disposed between the first and second semiconductor layers; a first electrode connected to the first semiconductor layer; and a second electrode connected to the second semiconductor layer. The light emitting surface may be formed in a trapezoidal shape in which both sides facing each other are asymmetrical.

Description

Inorganic light emitting device, display module and manufacturing method thereof {INORGANIC LIGHT emitting diode, DISPLAY MODULE AND MANUFACTURING METHOD THEREOF}

The present disclosure relates to an inorganic light emitting device, a display module, and a manufacturing method thereof.

The self-luminous display device displays an image without a color filter and a backlight, and may use an inorganic light-emitting device that emits light by itself.

The display module expresses various colors while being operated in units of pixels or sub-pixels made of inorganic light emitting devices. The operation of each pixel or sub-pixel is controlled by a plurality of thin film transistors (TFTs). A plurality of TFTs are arranged on a flexible substrate, a glass substrate or a plastic substrate. A substrate having a plurality of TFTs in this way is referred to as a TFT substrate.

Recently, a display module that transfers a subminiature light emitting device such as a micro LED to a TFT substrate has been developed. Among various transfer methods, a fluidic self-assembly transfer technology requires a micro LED having a smooth GaN layer surface, but the surface of the micro LED has a problem in that efficiency is lowered.

An object of the present disclosure is to provide an inorganic light emitting device having a high-yield and high-efficiency structure, a display module, and a manufacturing method thereof.

According to various embodiments of the present disclosure, the first semiconductor layer to achieve the above object; a second semiconductor layer having a 4-sided light emitting surface; an active layer disposed between the first semiconductor layer and the second semiconductor layer; a first electrode connected to the first semiconductor layer; and a second electrode connected to the second semiconductor layer, wherein the light emitting surface has a trapezoid shape in which both sides facing each other are asymmetrical.

The light emitting surface may include a first side; a second side disposed parallel to the first side and having a length different from that of the first side; A third side; and a fourth side facing the third side, wherein the third side and the fourth side may be asymmetrically disposed.

The third side may be disposed at a first angle with respect to the first side, and the fourth side may be disposed with a second angle different from the first angle with respect to the first side.

Both the first angle and the second angle may be acute angles.

One of the first angle and the second angle may be an acute angle, and the other may be a right angle or an obtuse angle.

When viewed from the side, the inorganic light emitting device may have an inverted tetrahedral shape.

When the inorganic light emitting device is viewed from a side direction, left and right sides may be asymmetrical or left and right sides may be symmetrical.

Further, according to various embodiments of the present disclosure, a plurality of inorganic light emitting elements having a light emitting surface and having a first electrode and a second electrode disposed on opposite surfaces of the light emitting surface; and a substrate on which the plurality of inorganic light emitting elements are mounted, and the light emitting surface is formed of a trapezoidal shape with left and right asymmetrical. The above object can be achieved by providing a display module.

The substrate may be provided with a plurality of mounting grooves into which the plurality of inorganic light emitting elements are inserted and having shapes corresponding to the light emitting surfaces of the plurality of inorganic light emitting elements.

The plurality of positive grooves may have a size larger than that of the plurality of inorganic light emitting elements.

The inorganic light emitting device includes a bottom surface on which the first electrode and the second electrode are disposed and positioned opposite to the light emitting surface, and the size of the light emitting surface may be larger than the size of the bottom surface.

When viewed from the side, the inorganic light emitting device may have an inverted tetrahedral shape.

A mounting surface of the substrate on which the plurality of inorganic light emitting devices are mounted may be flat.

The plurality of inorganic light emitting elements are aligned in a mounting position by a plurality of guide grooves provided in a guide member coupled to the mounting surface, and the plurality of guide grooves have a shape corresponding to the shape of the light emitting surface of the inorganic light emitting element. can

The plurality of guide grooves may have a size larger than a size of a light emitting surface of the inorganic light emitting device.

In addition, according to various embodiments of the present disclosure, a method of manufacturing a display module in which a plurality of inorganic light emitting elements are mounted on a substrate may be provided. The method of manufacturing a display module may include coupling a guide member provided with a plurality of guide holes having a shape corresponding to a light emitting surface of the plurality of inorganic light emitting elements to a mounting surface of the substrate; charging the substrate coupled to the guide member into a liquid; injecting a plurality of inorganic light emitting elements having a light emitting surface formed of an asymmetric trapezoid into the liquid; arranging the plurality of inorganic light emitting devices on the substrate through the plurality of guide holes; a pre-bonding step of fixing the plurality of inorganic light emitting devices to the substrate; and separating the substrate from the guide device.

The coupling of the guide member to the mounting surface of the substrate may include applying an adhesive to the mounting surface of the substrate; and aligning the plurality of guide holes to correspond to respective pixel areas on a mounting surface of the substrate.

The manufacturing method of the display module according to the present disclosure may further include chemically removing the guide member from the mounting surface of the substrate.

For the chemical removal, a solvent containing a component capable of dissolving the guide member may be used.

According to the present disclosure, by providing an inorganic light emitting device having a left-right symmetrical trapezoidal shape and accurately aligning electrodes of the inorganic light emitting device and connection pads of a substrate during fluid self-assembly, a high-yield display module can be provided.

1 is a block diagram illustrating a display device according to an exemplary embodiment of the present disclosure.
2 is a plan view illustrating a display panel included in a display device according to an exemplary embodiment of the present disclosure.
FIG. 3 is an enlarged view of pixels of part III shown in FIG. 2 .
FIG. 4 is a schematic cross-sectional view taken along line IV-IV in FIG. 3 .
5 is a plan view illustrating an inorganic light emitting device according to an exemplary embodiment of the present disclosure.
6 is a bottom view illustrating an inorganic light emitting device according to an exemplary embodiment of the present disclosure.
7 is a perspective view illustrating a thin film guide member for guiding a plurality of inorganic light emitting devices to a transfer position of a substrate according to another embodiment of the present disclosure.
8 is a flowchart illustrating a method of transferring a plurality of inorganic light emitting devices to a substrate through a fluidic self-assembly method.
9 is a cross-sectional view showing an example in which an inorganic light emitting element is guided by a thin film guide member and transferred to a substrate.
10 is a view showing an example in which the thin film guide member is removed from the substrate.
11 is a plan view illustrating an example in which inorganic light emitting elements having different shapes are disposed in respective receiving grooves having shapes corresponding to a substrate.
12 is a plan view illustrating an inorganic light emitting device according to another embodiment of the present disclosure.
FIG. 13 is a side view of the inorganic light emitting device viewed from the XIII direction shown in FIG. 12 .
14 is a bottom view illustrating an inorganic light emitting device according to another embodiment of the present disclosure.
15 is a view showing inorganic light emitting devices according to another embodiment of the present disclosure, and is a plan view illustrating an example in which inorganic light emitting devices having different shapes are disposed in respective receiving grooves having shapes corresponding to a substrate.
16 is a plan view illustrating an inorganic light emitting device according to another exemplary embodiment of the present disclosure.

Hereinafter, various embodiments will be described in more detail with reference to the accompanying drawings. The embodiments described in this specification may be modified in various ways. Particular embodiments may be depicted in the drawings and described in detail in the detailed description. However, specific embodiments disclosed in the accompanying drawings are only intended to facilitate understanding of various embodiments. Therefore, the technical idea is not limited by the specific embodiments disclosed in the accompanying drawings, and it should be understood to include all equivalents or substitutes included in the spirit and technical scope of the invention.

In the present disclosure, terms including ordinal numbers such as first and second may be used to describe various elements, but these elements are not limited by the above-mentioned terms. The terminology described above is only used for the purpose of distinguishing one component from another.

In the present disclosure, terms such as “comprise” or “have” are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded. It is understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, but other elements may exist in the middle. It should be. On the other hand, when an element is referred to as “directly connected” or “directly connected” to another element, it should be understood that no other element exists in the middle.

In the present disclosure, the expression 'same' means not only completely matching, but also including a degree of difference considering a processing error range.

In addition, in describing the present disclosure, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present disclosure, the detailed description thereof will be abbreviated or omitted.

In the present disclosure, the display module may include a display panel having an inorganic light emitting diode for displaying an image. Here, the display panel may be a flat panel display panel or a curved display panel, and a plurality of inorganic light emitting diodes (eg, micro LEDs or mini LEDs) of 100 μm or less are mounted, compared to LCDs that require a backlight. It provides better contrast, response time and energy efficiency. In the present disclosure, 'inorganic light emitting diode' and 'inorganic light emitting device' may be used interchangeably.

The inorganic light emitting device applied to the present disclosure has higher brightness, luminous efficiency, and longer lifetime than OLED. The inorganic light emitting device may be a semiconductor chip capable of emitting light by itself when power is supplied. Micro LED, an inorganic light emitting device, has fast response speed, low power, and high luminance. For example, micro LEDs are more efficient at converting electricity into photons than conventional LCDs or OLEDs. That is, they have higher "brightness per watt" compared to conventional LCD or OLED displays. As a result, micro LEDs can produce the same brightness with about half the energy compared to conventional LEDs (width, length, and height each exceed 100 μm) or OLEDs. In addition, micro LED can realize high resolution, excellent color, contrast and brightness, so it can accurately express a wide range of colors, and it can implement a clear screen even in bright sunlight outdoors. In addition, micro LED is resistant to burn-in and generates little heat, guaranteeing a long lifespan without deformation. The micro LED may have a flip chip structure in which an anode and a cathode electrode are formed on the same first surface and a light emitting surface is formed on a second surface opposite to the first surface on which the electrodes are formed.

In the present disclosure, a substrate has a thin film transistor (TFT) layer formed thereon on the front surface, and a power supply circuit for supplying power to the TFT circuit, a data drive driver, and a gate drive on the rear surface. A timing controller controlling the driver and each driving driver may be disposed. A plurality of pixels arranged in a TFT layer can be driven by a TFT circuit.

In the present disclosure, the TFT provided in the display module may be a low-temperature polycrystalline silicon (LTPS) TFT, a low-temperature polycrystalline oxide (LTPO) TFT, or an oxide TFT.

In the present disclosure, the substrate is a glass substrate, a synthetic resin series having a flexible material (eg, PI (polyimide), PET (polyethylene terephthalate), PES (polyethersulfone), PEN (polyethylene naphthalate), PC (polycarbonate) etc.) or a ceramic substrate can be used.

In the present disclosure, a TFT layer having a TFT circuit is disposed on the front surface of the substrate, and no circuit may be disposed on the rear surface of the substrate. The TFT layer may be integrally formed on the substrate or made in the form of a separate film and attached to one surface of the glass substrate.

In the present disclosure, the front surface of the substrate may be divided into an active region and an inactive region. The active region may correspond to a region occupied by the TFT layer on the entire surface of the substrate, and the inactive region may be an area excluding the region occupied by the TFT layer on the entire surface of the substrate.

In the present disclosure, the edge region of the substrate may be the outermost region of the glass substrate. Also, the edge region of the substrate may be an area other than a region of the substrate where a circuit is formed. Also, the edge region of the substrate may include a portion of the front surface of the substrate adjacent to the side surface of the substrate and a portion of the rear surface of the substrate adjacent to the side surface of the substrate. The substrate may be formed in a quadrangle type. For example, the substrate may be formed in a rectangle or square. The edge region of the substrate may include at least one side of the four sides of the glass substrate.

In the present disclosure, the TFTs constituting the TFT layer (or backplane) are not limited to a specific structure or type. For example, the TFTs cited in the present disclosure include LTPS TFTs (Low-temperature polycrystalline silicon TFTs) and others. It can be implemented with oxide TFT, Si TFT (poly silicon, a-silicon), organic TFT, graphene TFT, etc., and only P-type (or N-type) MOSFET can be made and applied in the Si wafer CMOS process.

In the present disclosure, the substrate included in the display module is not limited to the TFT substrate. For example, the display module may be a substrate without a TFT layer on which a TFT circuit is formed. In this case, the display module may include a substrate on which the micro IC is separately mounted and only the wiring is patterned.

In the present disclosure, the pixel driving method of the display module may be an active matrix (AM) driving method or a passive matrix (PM) driving method. The display module may form a wiring pattern to which each micro LED is electrically connected according to an AM driving method or a PM driving method.

In the present disclosure, a display module includes a glass substrate on which a plurality of LEDs are mounted and side wires are formed. Such a display module can be installed and applied to electronic products or electric vehicles that require wearable devices, portable devices, handheld devices, and various displays as a single unit, and can be applied as a matrix type. It can be applied to display devices such as monitors for personal computers (PCs), high-resolution TVs and signage (or digital signage), electronic displays, and the like through the assembly arrangement of .

The display module of the present disclosure may include a plurality of inorganic light emitting devices for image display arranged on a substrate having thin film transistors formed thereon. A plurality of inorganic light emitting devices may be sub-pixels constituting a single pixel. In the present disclosure, one 'light emitting element', one 'micro LED', and one 'sub-pixel' may be interchangeably used as the same meaning.

Hereinafter, with reference to the accompanying drawings, embodiments of the present disclosure will be described in detail so that those skilled in the art can easily carry out the present disclosure. However, the present disclosure may be implemented in many different forms and is not limited to the embodiments described herein. And in order to clearly describe the present disclosure in the drawings, parts irrelevant to the description are omitted, and similar reference numerals are attached to similar parts throughout the specification.

Furthermore, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings and the contents described in the accompanying drawings, but the present disclosure is not limited or limited by the embodiments.

Hereinafter, a display device according to various embodiments of the present disclosure will be described with reference to drawings.

1 is a block diagram illustrating a display device according to an exemplary embodiment of the present disclosure.

Referring to FIG. 1 , a display device 1 according to an embodiment of the present disclosure may include a display module 3 and a processor 5.

The display module 3 according to an embodiment of the present disclosure may display various images. Here, the image is a concept including still images and/or moving images. The display module 3 can display various images such as broadcast content and multimedia content. Also, the display module 3 may display a user interface and icons.

The display module 3 may include a display panel 10 and a display driver IC (DDI) 7 for controlling the display panel 10 .

The display driver IC 7 may include an interface module 7a, a memory 7b (eg, a buffer memory), an image processing module 7c, or a mapping module 7d. The display driver IC 7 transmits image information including, for example, image data or image control signals corresponding to commands for controlling the image data to other parts of the display device 1 through the interface module 7a. can be received from the component. For example, according to an embodiment, image information may be received from a processor 5 (eg, a main processor (eg, an application processor) or an auxiliary processor (eg, a graphic processing unit) that operates independently of the function of the main processor). can

The display driver IC 7 may communicate with a sensor module (not shown) through an interface module 7a. Also, the display driver IC 7 may store at least a portion of the received image information in the memory 7b, for example, in units of frames. The image processing module 7c may pre-process or post-process (eg, adjust resolution, brightness, or size) at least part of the image data based on at least the characteristics of the image data or the characteristics of the display panel 10 . ) can be performed. The mapping module 7d may generate a voltage value or current value corresponding to the image data pre-processed or post-processed through the image processing module 7c. According to an embodiment, the generation of the voltage value or the current value depends on, for example, the properties of the pixels of the display panel 10 (eg, the arrangement of pixels (RGB stripe or pentile structure) or the size of each sub-pixel). It can be performed based at least in part. At least some pixels of the display panel 10 are driven based, for example, at least in part on the voltage value or current value, so that visual information (eg text, image, or icon) corresponding to the image data is displayed on the display panel ( 10) can be displayed.

The display driver IC 7 may transmit a driving signal (eg, a driver driving signal, a gate driving signal, etc.) to the display based on image information received from the processor 5 .

The display driver IC 7 may display an image based on the image signal received from the processor 5 . For example, the display driver IC 7 generates a driving signal for a plurality of subpixels based on the image signal received from the processor 5, and displays an image by controlling light emission of the plurality of subpixels based on the driving signal. can do.

The display module 3 may further include a touch circuit (not shown). The touch circuit may include a touch sensor and a touch sensor IC for controlling the touch sensor. The touch sensor IC may control the touch sensor to detect, for example, a touch input or a hovering input to a designated position of the display panel 10 . For example, the touch sensor IC may detect a touch input or a hovering input by measuring a change in a signal (eg, voltage, light amount, resistance, or charge amount) for a designated position of the display panel 10 . The touch sensor IC may provide information (eg, location, area, pressure, or time) on the sensed touch input or hovering input to the processor 5 . According to an embodiment, at least a part of the touch circuit (eg, touch sensor IC) is a display driver IC 7, a part of the display panel 10, or another component disposed outside the display module 3 ( eg as part of a co-processor).

The processor 5 includes a digital signal processor (DSP), a microprocessor, a graphics processing unit (GPU), an artificial intelligence (AI) processor, a neural processing unit (NPU), and a TCON for processing digital image signals. (time controller), but is not limited to, central processing unit (CPU), micro controller unit (MCU), micro processing unit (MPU), controller, application It may include, or be defined in terms of, one or more of a processor (application processor (AP)), communication processor (communication processor (CP)), or ARM processor. In addition, the processor 50 has a built-in processing algorithm. It may be implemented in the form of a system on chip (SoC), large scale integration (LSI), application specific integrated circuit (ASIC), or field programmable gate array (FPGA).

The processor 5 may control hardware or software components connected to the processor 5 by driving an operating system or an application program, and may perform various data processing and operations. In addition, the processor 5 may load and process commands or data received from at least one of the other components into a volatile memory, and store various data in a non-volatile memory.

FIG. 2 is a plan view illustrating a display panel included in a display device according to an exemplary embodiment of the present disclosure, and FIG. 3 is an enlarged view of pixels of a portion III shown in FIG. 2 .

Referring to FIGS. 2 and 3 , the display panel 10 may include a plurality of pixels 30 arranged on a substrate 20 .

The display panel 10 may include a plurality of pixel areas 40 arranged in a matrix form. In each pixel area 40, one pixel 30 may be disposed, and one pixel 30 includes a first sub-pixel 31 emitting light in a red wavelength band and a light emitting light in a green wavelength band. It may include a second sub-pixel 33 and a third sub-pixel 35 emitting light in a blue wavelength band.

In one pixel area 40, the first to third subpixels 31, 33, and 35 are provided in areas not occupied by the first subpixel 31, the second subpixel 33, and the third subpixel 35. ) may be disposed.

As shown in FIG. 3 , the first to third sub-pixels 31 , 33 , and 35 may be arranged in a row at regular intervals, but are not limited thereto. For example, the first to third subpixels 31, 33, and 35 may be arranged in an L shape or in a pentile RGBG method. The pentile RGBG method is a method of arranging the number of red, green, and blue subpixels in a ratio of 1:1:2 (RGBG) by using the characteristic that humans discriminate blue less and green the best. The pen tile RGBG method is effective because it can increase yield, lower unit cost, and realize high resolution on a small surface.

According to various embodiments, the display module 3 may be a touch screen combined with a touch sensor, a flexible display, a rollable display, and/or a 3D display. In addition, according to an embodiment, a large format display (eg, LFD, large format display) may be implemented by providing a plurality of display modules of the present disclosure and physically connecting the modules.

According to various embodiments, the display panel 10 may include a-Si (amorphous silicon) TFT, LTPS (low temperature polycrystalline silicon) TFT, LTPO (low temperature polycrystalline oxide) TFT, HOP (hybrid oxide and polycrystalline silicon) TFT, LCP It may include a substrate that can be implemented in the form of a (liquid crystalline polymer) TFT or an organic TFT (OTFT).

Hereinafter, the structure of an inorganic light emitting device according to an embodiment of the present disclosure will be described.

4 is a schematic cross-sectional view taken along line IV-IV in FIG. 3, FIG. 5 is a plan view illustrating an inorganic light emitting device according to an embodiment of the present disclosure, and FIG. 6 is an inorganic light emitting device according to an embodiment of the present disclosure. It is a bottom view showing the element. In the present disclosure, since a subpixel and an inorganic light emitting element are used interchangeably, '31' is assigned to the inorganic light emitting element, which is the same as that of the subpixel.

In the description of the inorganic light emitting device in the present disclosure, for convenience, the portion where the light emitting surface 31a of the inorganic light emitting device 31 is formed is referred to as the upper portion of the inorganic light emitting device 31, and the light emitting surface 31a of the inorganic light emitting device 31 The opposite side of may be referred to as a lower portion of the inorganic light emitting element 31, but is not necessarily limited thereto.

Referring to FIG. 4 , the inorganic light emitting device 31 according to an embodiment of the present disclosure may be a micro light emitting diode (LED) having a size of about 50 μm or less. The inorganic light emitting element 31 may be of a flip chip type in which both the first electrode 32a and the second electrode 32b are disposed on a bottom surface 31b positioned opposite to the light emitting surface 31a. However, it is not limited thereto, and the inorganic light emitting element 31 may be a lateral chip type or a vertical chip type.

The inorganic light emitting element 31 is disposed between a first semiconductor layer S1 and a second semiconductor layer S2 grown on an epitaxial substrate (not shown), and between the first semiconductor layer S1 and the second semiconductor layer S2. An active layer (A) may be included.

The first semiconductor layer S1 may include, for example, a p-type semiconductor layer (anode, oxide electrode). The p-type semiconductor layer may be selected from, for example, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, and AlInN, and may be doped with a p-type dopant such as Mg, Zn, Ca, Sr, and Ba.

The second semiconductor layer S2 may include, for example, an n-type semiconductor layer (cathode, reduction electrode). The n-type semiconductor layer may be selected from, for example, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, and the like, and may be doped with an n-type dopant such as Si, Ge, or Sn.

On the other hand, the epitaxially grown portion of the inorganic light emitting element 31 is not limited to the above configuration, and for example, the first semiconductor layer S1 includes an n-type semiconductor layer and the second semiconductor layer S2 includes a p A type semiconductor layer may be included. The active layer is a region in which electrons and holes are recombinated, and as the electrons and holes recombine, the active layer transitions to a lower energy level and can generate light having a wavelength corresponding thereto.

The active layer (A) may include a semiconductor material, for example, amorphous silicon or polycrystalline silicon. However, the present embodiment is not limited thereto, and may contain an organic semiconductor material or the like, and may have a single quantum well (SQW) structure or a multi quantum well (MQW) structure.

In the inorganic light emitting device 31, a first electrode 32a and a second electrode 32b may be disposed on a surface opposite to the light emitting surface 31a. If the first electrode 32a is an anode electrode, the second electrode 32b may be a cathode electrode. The first and second electrodes 32a and 32b may be made of an alloy containing Ag or Au, but are not limited thereto.

As shown in FIG. 3 , a plurality of mounting grooves 23a, 23b, and 23c into which a plurality of inorganic light emitting devices 31, 33, and 35 are respectively inserted may be formed on one surface of the substrate 20. According to various embodiments of the present disclosure, the plurality of inorganic light emitting devices 31 , 33 , and 35 may be transferred to the substrate 20 in a fluidic self-assembly method.

Each of the mounting grooves 23a, 23b, and 23c may be formed to have a shape similar to or substantially the same as the shape of the light emitting surface 31a of the inorganic light emitting device when viewing the substrate 20 from the upper side of the substrate 20. . In this case, as shown in FIG. 3, each of the mounting grooves 23a, 23b, and 23c has a plurality of inorganic light emitting devices 31, 33, and 35 to be inserted into the corresponding mounting grooves 23a, 23b, and 23c. It may be formed in a size larger than the size of the inorganic light emitting elements 31, 33, and 35.

In this way, when the shape of each mounting groove 23a, 23b, and 23c is substantially identical to that of the inorganic light emitting devices 31, 33, and 35, the inorganic light emitting device 31 as shown in FIG. 4 during fluid self-assembly. ) may be guided so that the first electrode 32a and the second electrode 32b are aligned in the mounting groove 23a of the substrate 20 .

Referring to FIG. 5 , the light emitting surface 31a of the inorganic light emitting device 31 may be substantially flat, and has a first side 311, a second side 312, a third side 313, and a fourth side. Its shape can be defined by (314).

For example, the first side 311 and the second side 312 facing each other may be substantially parallel to each other with an interval therebetween. The center of the first side 311 and the center of the second side 312 may be located on the first center line C1, respectively. A first length L1 of the first side 311 may be shorter than a second length L2 of the second side 312 .

The third side 313 may connect one end of the first side 311 and one end of the second side 312 and may be inclined from the first side 311 by a first angle α1. Here, the first angle α1 may be an acute angle. In FIG. 5 , the third length L3 of the third side 313 is longer than the second length L2 , but is not limited thereto. For example, the third length L3 may be shorter than or equal to the first length L1. Alternatively, the third length L3 may be shorter than or equal to the second length L2.

The fourth side 314 may connect the other end of the first side 311 and the other end of the second side 312 and may be inclined from the first side 311 by a second angle α2. In this case, the first angle α1 and the second angle α2 may be substantially the same angle. A length L4 of the fourth side 314 may be substantially equal to a length L3 of the third side 314 .

As such, the shape of the inorganic light emitting element 31 may be defined by the first to fourth sides L1, L2, L3, and L4. Referring to FIG. 5 , the light emitting surface 31a viewed from above of the inorganic light emitting device 31 may have a substantially trapezoidal shape. In this case, the light emitting surface 31a may have a trapezoidal shape substantially symmetrical with respect to the first central line C1 passing through the center of the inorganic light emitting element 31 .

Referring to FIG. 6 , the inorganic light emitting element 31 has a first side surface 31c, a second side surface 31d, a third side surface 31e, and a fourth side surface between the light emitting surface 31a and the bottom surface 31b ( 31f) may be included.

When the size of the bottom surface 31b of the inorganic light emitting element 31 is smaller than the size of the light emitting surface 31a, the first to fourth side surfaces 31c, 31d, 31e, and 31f may be inclined.

For example, referring to FIG. 4 , the first and second side surfaces 31c and 31d may be inclined from the upper side to the lower side of the inorganic light emitting device 31 as shown in FIG. 4 . In this case, the inner wall 24 of the mounting groove 23a may be inclined in a direction substantially similar to that of the first and second side surfaces 31c and 31d, respectively. Due to the inclined inner wall 24 of the mounting groove 23a, the upper opening of the mounting groove 23a (for example, the entrance of the mounting groove 23a for the inorganic light emitting element 31) is formed in the mounting groove 23a. It can be formed wider than the bottom of.

The first side surface 31c of the inorganic light emitting element 31 is inclined at a third angle α3 with respect to the light emitting surface 31a, and the second side surface 31d of the inorganic light emitting element 31 is inclined at the light emitting surface 31a. It may be inclined at a fourth angle α4 with respect to . In this case, both the third angle α3 and the fourth angle α4 are acute angles, and may be substantially the same angle. Therefore, when looking at the side of the inorganic light emitting element 31, it may be an inverted trapezoid with approximately left-right symmetry.

Referring to FIG. 6 , the bottom surface 31b of the inorganic light emitting element 31 has a substantially rectangular shape, but is not limited thereto. For example, the bottom surface 31b of the inorganic light emitting element 31 may be formed in various shapes such as a square shape or a trapezoidal shape.

8 is a flow chart showing a method of transferring a plurality of inorganic light emitting elements to a substrate through a fluid self-assembly method, and FIG. 9 is a cross-sectional view showing an example in which inorganic light emitting elements are guided by a thin film guide member and transferred to a substrate. 10 is a view showing an example in which the thin film guide member is removed from the substrate.

Referring to FIG. 8 , the guide member 60 is coupled to the mounting surface 20a-1 of the substrate 20-1 (801).

Referring to FIG. 9 , a pair of connection pads may be disposed on the mounting surface 20a - 1 of the substrate 20 - 1 for each pixel area 40 (see FIG. 3 ). For example, as shown in FIG. 9 , a pair of connection pads include a first connection pad 25-1 connected to the first electrode 32a of the inorganic light emitting element 31, and a first connection pad 25-1 of the inorganic light emitting element 31. It may be the second connection pad 27-1 connected to the second electrode 32b.

The mounting surface 20a-1 of the substrate 20-1 may be substantially flat without mounting grooves for guiding the mounting position of the inorganic light emitting device.

The guide member 60 may have a plurality of guide holes 61 corresponding to each pixel area of the substrate 20-1. The guide member 60 is coupled to the mounting surface 20a-1 of the substrate 20-1 so that the plurality of guide holes 61 are aligned to correspond to each pixel area of the substrate 20-1.

The plurality of guide holes 61 may have substantially the same shape as the trapezoidal shape of the light emitting surface of the inorganic light emitting device 31 . In this case, the size of the plurality of guide holes 61 may be formed to be slightly larger than the size of the inorganic light emitting device 31 so that the inorganic light emitting device 31 can be easily inserted.

Referring to FIG. 8 , a narrow portion of each guide hole 61 may be disposed toward the first connection pad 25-1 and a wide portion may be disposed toward the second connection pad 27-1. . As for the arrangement direction of each guide hole 61 as described above, the first electrode 32a of the inorganic light emitting element 31 in a liquid during fluid self-assembly is the first connection pad of the substrate 20-1 ( 25-1) of the inorganic light emitting element 31 so that the second electrode 32b of the inorganic light emitting element 31 can be connected to the second connection pad 27-1 of the substrate 20-1. Mounting direction can be guided.

Referring to FIG. 9 , the inner wall 61a of each guide hole 61 may be inclined. Due to the inclined inner wall 61a, an upper opening of the guide hole 61 (eg, an entrance into which an inorganic light emitting element is inserted) may be formed wider than a lower opening.

The guide member 60 is placed on the mounting surface 20a-1 of the substrate 20-1 so that the guide member 60 is not separated from the substrate 20-1 during the transfer process. An adhesive for attachment to 20a-1) may be applied.

Meanwhile, before coupling the substrate 20-1 and the guide member 60, a hydrophilic surface treatment may be applied to the substrate 20-1 and each inorganic light emitting element 31, respectively. For example, a hydrophilic surface treatment may be applied to the first connection pads 25-1 or the second connection pads 27-1 of the substrate 20-1. In addition, a hydrophilic surface treatment may be applied to the first electrode 32a or the second electrode 32b of each inorganic light emitting element 31 . For example, when hydrophilic treatment is applied to the first connection pads 25-1 of the substrate 20-1, the first electrode 32a of the inorganic light emitting element 31 may be subjected to hydrophilic treatment. The hydrophilic surface treatment for modifying the substrate 20 - 1 and each inorganic light emitting device 31 to be hydrophilic may be, for example, a chemical treatment method, an ultraviolet irradiation method, an oxygen plasma treatment method, or the like.

Referring to FIG. 8 , after the substrate 20-1 combined with the guide member 60 is loaded into a tank (not shown) containing a liquid for fluid self-assembly (802), a plurality of inorganic light emitting devices (31) is put into the tank containing the liquid (803).

After that, when the liquid 181 in the tank is forcedly circulated, the plurality of inorganic light emitting elements 31 dispersed in the liquid flow inside the tank, and then each guide hole 61 of the guide member 60 as shown in FIG. 9 ) can be inserted into Forced circulation of the liquid in the tank may be applied by, for example, a method of injecting compressed air into the liquid in the tank, but is not limited thereto.

Meanwhile, each inorganic light emitting element 31 may be provided with a post (not shown) protruding to a predetermined height from the light emitting surface 31a. The post is to insert the inorganic light emitting element 31 upside down into the guide hole 61 during fluid self-assembly (for example, the light emitting surface 31a of the inorganic light emitting element 31 faces the mounting surface 20a-1). being inserted into the guide hole 61 in this state) can be prevented.

Referring to FIG. 8 , each inorganic light emitting element 31 may be arranged at each position of the substrate 20-1 while being inserted into the guide hole 61 of the guide member 60 (804).

The substrate 20-1 in a state where a plurality of inorganic light emitting elements 31 are arranged is taken out from the tank.

Referring to FIG. 8 , pre-bonding may be performed before separating the guide member 60 from the substrate 20-1 (805).

For example, in the pre-bonding, a plurality of inorganic light emitting elements 31 are bonded to the substrate 20-1 by thermally compressing the plurality of inorganic light emitting elements 31 toward the substrate 20-1 with a pressing member (not shown). It can be bonded to scene 20a-1. In this case, the first and second electrodes 32a and 32b of the plurality of inorganic light emitting devices 31 are connected to the first and second electrodes arranged on the corresponding mounting surface 20a-1 of the substrate 20-1. It may be bonded to the pads 25-1 and 27-1. The bonding between the first electrode 32a and the corresponding first connection pad 25-1 and the bonding between the second electrode 32b and the corresponding second connection pad 27-1 is to connect the guide member 60 to the substrate ( 20-1) means that the inorganic light emitting element 31 transferred to the substrate 20-1 has a bonding force that is not separated from the substrate 20-2 together with the guide member 60. can

The guide member 60 may be made of synthetic resin or metal material having heat resistance so that deformation does not occur during the thermal compression process.

Meanwhile, when the post is provided on the light emitting surface 31a of each inorganic light emitting element 31, it may be removed before separating the guide member 60 from the substrate 20-1. According to another example, the post may not be removed from the light emitting surface 31a of the inorganic light emitting element 31 even after the guide member 60 is separated from the substrate 20-1.

8 and 10, the guide member 60 is separated from the substrate 20-1 (806).

For example, the guide member 60 attached to the substrate 20-1 may be removed by a chemical method. In this case, the guide member 60 may be formed of a material that can be dissolved by a solvent that does not dissolve various components formed on the substrate 20-1. For example, when the guide member 60 is made of resin, the solvent may have a component capable of dissolving the resin.

Referring to FIG. 8 , a plurality of inorganic light emitting devices 31 may be firmly bonded to the mounting surface 20a-1 of the substrate 20-1 through main bonding (807).

Main bonding may be performed through a thermal compression process similar to pre-bonding. In this case, the first and second electrodes 32a and 32b of the inorganic light emitting element 31 are arranged on the mounting surface 20a-1 of the substrate 20-1 corresponding to the first and second connection pads ( 25-1 and 27-1), for example, may be eutectic bonding. Here, in eutectic bonding, when the constituent metals of the alloy constituting each of the electrodes 32a and 32b and each of the connection pads 25-1 and 27-1 have a certain ratio, the metal to be heated forms an intermediate state between a solid and a liquid. It may mean changing directly into a liquid state at the lowest melting point without passing through.

As described above, when the fluid self-assembly method is performed by coupling the guide member 60 to the substrate 20-1, the substrate 20-1 does not have a separate mounting groove on the mounting surface 20a-1. You don't have to. Accordingly, a separate process for forming mounting grooves in the substrate 20-1 can be omitted, thereby reducing manufacturing costs and fundamentally preventing damage to the substrate 20-1 in the process of forming the mounting grooves. can be blocked with In addition, since large-area transfer is possible using a general-purpose board having no mounting groove and a substantially flat mounting surface, manufacturing efficiency of the display module can be improved.

11 is a plan view illustrating an example in which inorganic light emitting devices having different shapes are disposed in respective receiving grooves having shapes corresponding to a substrate.

According to various embodiments of the present disclosure, the first sub-pixel 31-1, the second sub-pixel 33-1, and the third sub-pixel 35-1 constituting one pixel 30-1 are all Although trapezoidal, the light emitting surfaces of each of the subpixels 31-1, 33-1, and 35-1 need not all have the same shape and size.

For example, as shown in FIG. 11 , the Y-direction length of the second subpixel 33-1 may be longer than that of the first subpixel 31-1, and the third subpixel 35-1 may have a width in the X direction that is wider than that of the first subpixel 31-1.

In this case, in one pixel area 40-1, the first mounting groove into which the first sub-pixel 31-1, the second sub-pixel 33-1, and the third sub-pixel 35-1 are respectively inserted (23a-1), the second mounting groove (23b-1) and the third mounting groove (23c-1) have substantially the same shape as the corresponding sub-pixels (31-1, 33-1, 35-1), respectively. It may be formed identically, and may be formed slightly larger than the size of the corresponding subpixels 31-1, 33-1, and 35-1.

Accordingly, when the first to third sub-pixels 31-1, 33-1, and 35-1 are mounted on the substrate by the fluidic self-assembly method, they are put into the tank containing the liquid all at once and placed in each mounting groove of the substrate. (23a-1, 23b-1, 23c-1) can be arranged. Therefore, since there is no need to sequentially put the sub-pixels into the tank for each emission color, the manufacturing time required for fluid self-assembly can be reduced.

The aforementioned inorganic light emitting devices 31, 33, 35, 31-1, 33-1, and 35-1 are described as having a trapezoidal symmetrical light emitting surface 31a, but are not limited thereto. Hereinafter, an inorganic light emitting device having a trapezoidal shape with a left-right asymmetric light-emitting surface will be described with reference to the drawings.

12 is a plan view illustrating an inorganic light emitting device according to another embodiment of the present disclosure, FIG. 13 is a side view of the inorganic light emitting device viewed from the XIII direction shown in FIG. 12, and FIG. 14 is an inorganic light emitting device according to another embodiment of the present disclosure. It is a bottom view showing the element.

Referring to FIG. 12 , the light emitting surface 31a-2 of the inorganic light emitting device 31-2 may be substantially flat, and has a first side 311-2, a second side 312-2, and a third side 311-2. The shape may be defined by the side 313-2 and the fourth side 314-2.

For example, the first side 311-2 and the second side 312-2 facing each other may be substantially parallel to each other with an interval therebetween. Each of the first side 311-2 and the second side 312-2 may be disposed substantially perpendicular to the second center line C2. In this case, the first length L21 of the first side 311-2 may be shorter than the second length L22 of the second side 312-2.

The third side 313-2 may connect one end of the first side 311-2 and one end of the second side 312-2, and form a first angle α21 from the first side 311-2. can be inclined as much as Here, the first angle α21 may be an acute angle. The third length L23 of the third side 313-2 is longer than the second length L22, but is not limited thereto. For example, the third length L23 may be shorter than or equal to the first length L21. Alternatively, the third length L23 may be shorter than or equal to the second length L22.

The fourth side 314-2 may connect the other end of the first side 311-2 and the other end of the second side 312-2, and form a second angle α22 from the first side 311-2. can be inclined as much as In this case, the first angle α21 and the second angle α22 may be different angles. For example, as shown in FIG. 12 , the first angle α21 may be greater than the second angle α22. Alternatively, the first angle α21 may be smaller than the second angle α22.

A length L24 of the fourth side 314-2 may be different from a length L23 of the third side 313-3. For example, as shown in FIG. 12 , the length L24 of the fourth side 314-2 may be greater than the length L23 of the third side 313-3. Alternatively, the length L24 of the fourth side 314-2 may be smaller than the length L23 of the third side 313-3.

As such, the shape of the inorganic light emitting element 31 - 2 may be defined by the first to fourth sides L1 , L2 , L3 , and L4 . Referring to FIG. 12 , the light emitting surface 31a - 2 viewed from the upper side of the inorganic light emitting device 31 - 2 may have a substantially trapezoidal shape. For example, the light emitting surface 31a-2 of the inorganic light emitting element 31-2 is orthogonal to the first and second sides 311-2 and 312-2 of the inorganic light emitting element 31-2. It may be a trapezoid that is substantially asymmetrical left and right with respect to the center line C2. In this case, the second center line C2 passes through the center of the second side 312-2.

In FIG. 12, both the first angle α21 and the second angle α22 are illustrated as acute angles, but are not limited thereto. For example, one of the first angle α21 and the second angle α22 may be an acute angle, and the other may be a right angle or an obtuse angle.

Referring to FIG. 14, the inorganic light emitting device 31-2 has a first side surface 31c-2 and a second side surface 31d- between the light emitting surface 31a-2 (see FIG. 12) and the bottom surface 31b-2. 2), the third side surface 31e-2 and the fourth side surface 31f-2 may be included.

When the size of the bottom surface 31b-2 of the inorganic light emitting element 31-2 is smaller than the size of the light emitting surface 31a-2, the first to fourth side surfaces 31c-2, 31d-2, 31e-2, 31f-2) may be inclined.

For example, as shown in FIG. 13 , the first and second side surfaces 31c - 2 and 31d - 2 may be inclined from the upper side to the lower side of the inorganic light emitting device 31 - 2 . In this case, the inner wall of the mounting groove into which the inorganic light emitting element 31-2 is inserted may be inclined in a direction substantially similar to that of the first and second side surfaces 31c-2 and 31d-2, respectively. The first side surface 31c-2 is inclined at a third angle α23 with respect to the light emitting surface 31a-2, and the second side surface 31d-2 is inclined at a fourth angle with respect to the light emitting surface 31a-2 ( α24) can be inclined. In this case, both the third angle α23 and the fourth angle α24 are acute angles, and may be different angles. Therefore, when looking at the side of the inorganic light emitting element 31-2, it may be an inverted trapezoid with left and right asymmetrical shape.

Referring to FIG. 14 , the bottom surface 31b-2 of the inorganic light emitting element 31-2 has a substantially rectangular shape, but is not limited thereto. For example, the bottom surface 31b-2 of the inorganic light emitting element 31-2 may be formed in various shapes such as a square shape or a trapezoidal shape.

15 is a view showing inorganic light emitting devices according to another embodiment of the present disclosure, and is a plan view illustrating an example in which inorganic light emitting devices having different shapes are disposed in respective receiving grooves having shapes corresponding to a substrate.

According to various embodiments of the present disclosure, the first sub-pixel 31-2, the second sub-pixel 33-2, and the third sub-pixel 35-2 constituting one pixel 30-2 are all Although trapezoidal, the light emitting surfaces of the subpixels 31-2, 33-2, and 35-2 do not all have to have the same shape and size.

For example, as shown in FIG. 15, the Y-direction length of the second sub-pixel 33-2 may be shorter than that of the first sub-pixel 31-2, and the third sub-pixel 35-2 The Y-direction length of may be shorter than that of the first sub-pixel 31-2 and longer than that of the second sub-pixel 33-2. Alternatively, the first to third sub-pixels 31-2, 33-2, and 35-2 may have different sizes.

In this case, in one pixel area 40-2, the first mounting groove into which the first sub-pixel 31-2, the second sub-pixel 33-2, and the third sub-pixel 35-2 are respectively inserted (23a-2), the second mounting groove (23b-2) and the third mounting groove (23c-2) have substantially the same shape as the corresponding sub-pixels (31-2, 33-2, 35-2), respectively. It may be formed identically, and may be formed slightly larger than the size of the corresponding subpixels 31-2, 33-2, and 35-2.

Accordingly, when the first to third sub-pixels 31-2, 33-2, and 35-2 are mounted on the substrate by the fluidic self-assembly method, they are put into the tank containing the liquid all at once and placed in each mounting groove of the substrate. (23a-2, 23b-2, 23c-2) can be arranged. Therefore, since there is no need to sequentially put the sub-pixels into the tank for each emission color, the manufacturing time required for fluid self-assembly can be reduced.

16 is a plan view illustrating an inorganic light emitting device according to another exemplary embodiment of the present disclosure.

Referring to FIG. 16, the inorganic light emitting element 31-3 has a light emitting surface 31a-3 having a first side 311-3, a second side 312-3, a third side 313-3 and The shape may be defined by the fourth side 314-3.

The first side 311-3 and the second side 312-3 of the inorganic light emitting device 31-3 facing each other may be disposed at different angles at intervals. For example, the first side 311-3 and the second side 312-3 may be disposed not in parallel. In this case, the first side 311-3 and the second side 312-3 may intersect the third center line C3.

The third side 313-3 may connect one end of the first side 311-3 and one end of the second side 312-3, and form a first angle α31 from the first side 311-3. can be inclined as much as Here, the first angle α31 may be an acute angle.

The fourth side 314-3 may connect the other end of the first side 311-3 and the other end of the second side 312-3, and form a second angle α32 from the first side 311-3. can be inclined as much as In this case, the first angle α31 and the second angle α32 may be different angles. For example, as shown in FIG. 16 , the first angle α31 may be smaller than the second angle α32. Alternatively, the first angle α31 may be greater than the second angle α32. Also, the second side 312-3 may be disposed at a third angle α33 with a line parallel to the first side 311-3. In this case, the third angle α33 may be an acute angle.

All of the first to fourth sides 311-3, 312-3, 313-3, and 314-3 may have different lengths. Alternatively, two of the first to fourth sides 311-3, 312-3, 313-3, and 314-3 may have substantially the same length.

As such, the shape of the inorganic light emitting element 31-3 may be defined by the first to fourth sides 311-3, 312-3, 313-3, and 314-3. As shown in FIG. 16 , the light emitting surface 31a - 3 of the inorganic light emitting device 31 - 3 may have a quadrilateral shape with left and right asymmetric and top and bottom asymmetric.

In the above, various embodiments of the present disclosure have been individually described, but each embodiment is not necessarily implemented alone, and the configuration and operation of each embodiment may be implemented in combination with at least one other embodiment. .

Although the above has been shown and described with respect to preferred embodiments of the present disclosure, the present disclosure is not limited to the specific embodiments described above, and is commonly used in the technical field belonging to the present disclosure without departing from the gist of the present disclosure claimed in the claims. Of course, various modifications and implementations are possible by those with knowledge of, and these modifications should not be individually understood from the technical spirit or perspective of the present disclosure.

1: display device
3: display module
10: display panel
20: substrate
23a, 23b, 23c: mounting groove
30: pixel
31, 33, 35: sub pixels
40: pixel area
60: guide member

Claims (20)

a first semiconductor layer;
a second semiconductor layer having a 4-sided light emitting surface;
an active layer disposed between the first semiconductor layer and the second semiconductor layer;
a first electrode connected to the first semiconductor layer; and
A second electrode connected to the second semiconductor layer; includes,
The light emitting surface is composed of a trapezoid in which both sides facing each other are asymmetrical, an inorganic light emitting device. According to claim 1,
The light emitting surface,
first side;
a second side disposed parallel to the first side and having a length different from that of the first side;
third side; and
Including; a fourth side facing the third side,
The third side and the fourth side are disposed asymmetrically, inorganic light emitting element. According to claim 2,
The third side is disposed at a first angle with respect to the first side,
The fourth side is disposed at a second angle different from the first angle with respect to the first side, the inorganic light emitting element. According to claim 3,
Both the first angle and the second angle are acute angles, an inorganic light emitting device. According to claim 3,
Of the first angle and the second angle
one is acute,
The rest are right angles or obtuse angles, inorganic light emitting elements. According to claim 1,
The inorganic light emitting element includes a bottom surface on which the first electrode and the second electrode are disposed and positioned opposite to the light emitting surface,
The size of the light emitting surface is larger than the size of the bottom surface, inorganic light emitting element. According to claim 6,
The inorganic light emitting device is an inorganic light emitting device having an inverted tetrahedral shape when viewed from the side. According to claim 7,
The inorganic light emitting element is an inorganic light emitting element, the left and right are asymmetric when viewed from the side. According to claim 7,
The inorganic light emitting element is symmetrical, inorganic light emitting element when viewed from the side direction. a plurality of inorganic light emitting devices having a light emitting surface and having first electrodes and second electrodes disposed on surfaces opposite to the light emitting surface; and
Including; a substrate on which the plurality of inorganic light emitting elements are mounted,
The light emitting surface is made of a trapezoid with left and right asymmetrical display modules. According to claim 10,
The substrate is inserted into the plurality of inorganic light emitting elements, having a shape corresponding to the light emitting surface of the plurality of inorganic light emitting elements, the display module. According to claim 11,
The plurality of actual grooves have a size larger than the size of the plurality of inorganic light emitting elements, the display module. According to claim 12,
The inorganic light emitting element is an inverted quadrilateral when viewed from the side, a display module. According to claim 10,
The mounting surface of the substrate on which the plurality of inorganic light emitting elements are mounted is a flat, display module. According to claim 14,
The plurality of inorganic light emitting elements are aligned in a mounting position by a plurality of guide grooves provided in a guide member coupled to the mounting surface,
The plurality of guide grooves have a shape corresponding to the shape of the light emitting surface of the inorganic light emitting element, the display module. According to claim 15,
The plurality of guide grooves have a size larger than the size of the light emitting surface of the inorganic light emitting element, the display module. In the manufacturing method of a display module mounting a plurality of inorganic light emitting elements on a substrate,
coupling a guide member having a plurality of guide holes having shapes corresponding to the light emitting surfaces of the plurality of inorganic light emitting elements to a mounting surface of the substrate;
charging the substrate coupled to the guide member into a liquid;
injecting a plurality of inorganic light emitting elements having a light emitting surface formed of an asymmetric trapezoid into the liquid;
arranging the plurality of inorganic light emitting devices on the substrate through the plurality of guide holes;
a pre-bonding step of fixing the plurality of inorganic light emitting devices to the substrate; and
Separating the substrate from the guide device; including, the manufacturing method of the display module. According to claim 17,
The step of coupling the guide member to the mounting surface of the board,
applying an adhesive to the mounting surface of the substrate; and
and aligning the plurality of guide holes to correspond to respective pixel areas on the mounting surface of the substrate. According to claim 18,
Chemically removing the guide member from the mounting surface of the substrate; further comprising a display module manufacturing method. According to claim 19,
The chemical removal
A method of manufacturing a display module using a solvent containing a component capable of dissolving the guide member.

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