KR20230137763A - Elastic and electric contact terminal and Structure for mounting the same - Google Patents

Abstract

An electrical contact terminal soldered on a substrate and electrically connected to an electrically conductive object located below the substrate is disclosed. The core of the electrical contact terminal includes a body portion having a horizontal portion formed on the lower surface; and an insertion portion extending vertically downward from the body portion, wherein the body portion and the insertion portion are integrally formed, the core, the polymer film, and the metal layer have heat resistance corresponding to soldering, and the metal layer is capable of soldering. Possibly, the metal layer is formed over the horizontal portion of the body portion and the insertion portion and is electrically connected to each other.

Description

Elastic and electric contact terminal and Structure for mounting the same}

The present invention relates to an electrical contact terminal having elasticity, and particularly to an electrical contact terminal soldered on a substrate and electrically connected to an electrically conductive object located below the substrate.

This is an electrical contact terminal that is capable of reflow soldering and has an elastic, heat-resistant rubber core with holes made of rubber and is being applied to various electrical devices.

The electrical contact terminal of Domestic Patent No. 1591658 by the present applicant is electrically connected to an object located on the bottom of the circuit board through a through hole formed in the circuit board.

However, the electrical contact terminal of the above patent has a bottom surface that is concave toward the middle, so during soldering, it may be biased to the left or right depending on the degree of solder rise at both corners of the bottom surface. When soldered in this state, it contacts within the through hole. There is a disadvantage in that the protrusions are tilted and thus interfere with the through-hole when the electrical contact terminal is pressed by an object below.

In addition, there is a disadvantage that the soldering strength against the sharp parts of both corners is weak when pushed up by an object on the bottom of the circuit board.

In addition, since the corner of the contact protrusion bordering the lower surface of the core is rounded with a relatively large radius of curvature, and the through hole of the circuit board is formed vertically, it is necessary to install the electrical contact terminal by inserting the contact protrusion into the through hole. The corner portion has no choice but to contact the edge of the through-hole entrance of the circuit board, and as a result, the contact protrusion inside the through-hole may be tilted depending on the contact position, and the height of the contact protrusion protruding from the exit of the through-hole varies each time. there is a problem.

You can increase the diameter of the through hole to prevent the edge from contacting the edge of the through hole entrance of the circuit board, but as the through hole becomes larger, the gap that allows the contact protrusions of the electrical contact terminal to move left and right becomes too large, which is not good. Additionally, if the diameter of the through hole increases, the circuit board cannot be used efficiently. Therefore, there is a limit to increasing the diameter of the through hole of the circuit board.

Additionally, because the polymer film is adhered to a portion including the lower surface and both edges of the core, there is a problem in that the object located on the top and the bottom of the circuit board cannot be electrically connected.

The purpose of the present invention is to provide an electrical contact terminal that can be easily inserted into a through hole formed in a substrate.

Another object of the present invention is to provide an electrical contact terminal that is soldered evenly and with little movement on the molten solder during soldering.

Another object of the present invention is to provide an electrical contact terminal that can be vertical without being tilted within the through hole during soldering.

Another object of the present invention is to provide an electrical contact terminal that is easy to balance without being interfered with by a through hole when pressed from the bottom after soldering.

Another object of the present invention is to provide an electrical contact terminal that can have a constant height protruding from the through hole to the lower surface of the substrate after mounting.

Another object of the present invention is to provide an electrical contact terminal that can electrically connect an electrically conductive object on the top of a circuit board to an electrically conductive object on the bottom of the circuit board.

Another object of the present invention is to provide an electrical contact terminal that can be soldered and can absorb mechanical shock.

Another object of the present invention is to provide a structure in which the above-described electrical contact terminals are mounted on a circuit board.

According to one aspect of the present invention, an electrical contact terminal is physically fitted into a through hole of a substrate and has elasticity that is electrically connected to a conductive pattern formed on the substrate adjacent to the through hole, wherein the electrical contact terminal is , a core having elasticity and heat resistance, made of a heat-resistant polymer film bonded to the outer surface of the core in the longitudinal direction through an adhesive and having a metal layer formed on the outer surface, the core comprising: a body portion having a horizontal portion formed on the lower surface; and an insertion portion extending vertically downward from the body portion, wherein the body portion and the insertion portion are integrally formed, the core, the polymer film, and the metal layer have heat resistance corresponding to soldering, and the metal layer is capable of soldering. It is possible, and an electrical contact terminal is provided, wherein the metal layer is formed over the horizontal portion of the body portion and the insertion portion and electrically connected to each other.

Preferably, the metal layer extends from the lower surface of the body to the upper surface, and both ends may be spaced apart from the upper surface.

Preferably, a buffer hole may be formed in the insertion portion in the longitudinal direction.

Preferably, the corner portion of the insertion portion bordering the lower surface of the body portion may form an angle adjacent to a right angle, and more preferably, the radius of curvature of the corner portion is formed by the thickness of the conductive pattern and solder cream. It may be smaller than the gap.

According to another aspect of the present invention, there is a mounting structure for mounting the electrical contact terminal on a substrate, wherein a through hole is formed in the substrate, a conductive pattern is formed on the upper surface of the substrate adjacent to the through hole, and the electrical contact terminal is mounted on a substrate. An electrical contact, characterized in that the insertion part of the contact terminal is inserted into the through hole, the horizontal part of the body part is soldered to the conductive pattern, and the end of the insertion part is electrically connected by elastic contact with an electrically conductive object located at the bottom of the substrate. A mounting structure for the terminal is provided.

Preferably, the inner end of the conductive pattern is positioned away from the through hole, and the soldering can be performed only on the horizontal portion.

Preferably, an unsoldered space is formed from the inner end of the conductive pattern, so that when the insertion part is lifted from bottom to top by the object, the unsoldered space is lifted and can absorb external force caused by the object. there is.

According to the present invention, the electrical contact terminal can be soldered to the substrate at a uniform height across the entire horizontal portion of the lower surface and over a large area.

In addition, when the insertion part is lifted from bottom to top after soldering, the body part receives a uniform force due to uniform soldering, so it is easy to maintain balance without tilting within the through hole.

Additionally, by soldering at a uniform height, the height of the insertion portion protruding from the outlet of the through hole can always be kept constant.

In addition, since soldering is performed only on the horizontal portion of the bottom of the electrical contact terminal, it does not tilt to one side during soldering, so the insertion portion after soldering can consistently penetrate vertically within the through hole.

Additionally, since the polymer film and metal layer are formed on the horizontal portion of the electrical contact terminal, material costs are low and manufacturing is easy.

In addition, because the lower surface of the electrical contact terminal is flat, the height of the body portion protruding from the upper surface of the substrate is low, resulting in minimizing the height of the electrical contact terminal as a gasket.

Additionally, if necessary, the metal layer is extended to the upper surface of the body, so that electrically conductive objects located on the upper and lower parts of the substrate can be electrically connected via electrical contact terminals.

In addition, the electrical contact terminal can be soldered, and the protruding part is easy to absorb mechanical shock from the object.

Figure 1 shows an electrical contact terminal according to an embodiment of the present invention.
Figures 2(a) and 2(b) schematically show the structure of mounting electrical contact terminals on a circuit board, respectively.
Figures 3(a) to 3(c) specifically show the structure of mounting electrical contact terminals on a circuit board.

It should be noted that the technical terms used in the present invention are only used to describe specific embodiments and are not intended to limit the present invention. In addition, the technical terms used in the present invention, unless specifically defined in a different sense in the present invention, should be interpreted as meanings generally understood by those skilled in the art in the technical field to which the present invention pertains, and are not overly comprehensive. It should not be construed in a literal or excessively reduced sense. Additionally, if the technical term used in the present invention is an incorrect technical term that does not accurately express the idea of the present invention, it should be replaced with a technical term that can be correctly understood by a person skilled in the art. In addition, general terms used in the present invention should be interpreted according to the definition in the dictionary or according to the context, and should not be interpreted in an excessively reduced sense.

Hereinafter, the present invention will be described in detail with reference to the attached drawings.

Figure 1 shows an electrical contact terminal according to an embodiment of the present invention, Figures 2(a) and 2(b) schematically show the structure of mounting the electrical contact terminal on a circuit board, respectively, and Figure 3(a) to 3(c) specifically show the structure of mounting the electrical contact terminal on the circuit board.

In this embodiment, the electrical contact terminal 100 is physically fitted into the through hole 12 of the substrate 10 and has a conductive pattern 30 formed on the upper surface of the substrate 10 adjacent to the through hole 12. is soldered to electrically connect the electrically conductive object 10 located below the substrate 10 and the conductive pattern 30.

Additionally, if necessary, electrically conductive objects located on the top and bottom of the substrate 10 can be electrically connected to each other.

Here, the substrate 10 may be a thin, semi-rigid, or hard PCB such as an FPCB, and may have a thickness of approximately 0.08 mm to 2 mm.

The electrical contact terminal 100 is composed of a core 110 having elasticity and heat resistance, and a heat-resistant polymer film 130 bonded to the lower surface of the core 110 in the longitudinal direction through an adhesive 120. As shown in the circle, a solderable metal layer 140 is formed on the outer surface, that is, the exposed surface, of the polymer film 130.

The core 110, polymer film 130, and metal layer 140 have heat resistance corresponding to soldering, and the metal layer 140 is capable of soldering.

Hereinafter, each configuration of the electrical contact terminal 100 will be described in detail.

The core 110 is made of an elastic material, has heat resistance and insulation, and is functionally composed of a body portion 112 and an insert portion 115, which are formed as one piece.

In this embodiment, the core 110 has a T-shape in cross-section, and in particular, the body 112 has a rectangular or rectangular cross-section so that the lower surface of the body 112 is horizontal.

The material of the core 110 may be non-foamed heat-resistant elastomeric rubber, for example, silicone rubber, which has heat resistance and elasticity for reflow soldering, and may have a hardness of Shore A 40 to 70 for appropriate mechanical strength and elasticity. .

The body portion 112 and the insertion portion 115 constituting the core 110 have the same length along the longitudinal direction of the core 110 and can be manufactured simultaneously by extruding and curing silicone gum.

As will be described later, the electrical contact terminal 100 is inserted into the through hole 12 of the base material 10 by hand or SMT, and has a horizontally flat pickup surface on the upper surface of the body portion 112 for vacuum pickup during surface mounting. This is formed.

In this embodiment, the polymer film 130 and the metal layer 140 are formed from the lower surface of the body portion 112 to the entire insert portion 115.

Here, as shown in FIG. 1, 'lower surface' refers to the horizontal portion 113 of the lower surface of the electrical contact terminal 100, excluding both corner portions.

In this embodiment, the electrical contact terminal 100 is soldered to the substrate 10 at a uniform height over a large area of the entire horizontal portion 113.

Therefore, when the insertion portion 115 is lifted upward from the bottom after soldering, the body portion 112 receives force uniformly, so it is easy to maintain balance without tilting within the through hole 12.

Additionally, the height of the insertion portion 115 protruding from the outlet of the through hole 12 can always be kept constant.

In addition, since soldering is performed only on the horizontal portion 113, it does not tilt to one side during soldering, so the insertion portion 115 can consistently penetrate vertically within the through hole 12 after soldering.

Meanwhile, since the polymer film 130 and the metal layer 140 are formed on the horizontal portion 113 of the electrical contact terminal 100, material costs are low and manufacturing is easy.

In addition, since the lower surface of the body portion 112 is flat compared to the above patent, the height of the body portion 112 protruding from the upper surface of the substrate 10 is low, resulting in a lower height of the electrical contact terminal 100 as a gasket. can be minimized.

1 and 2, the insertion portion 115 is formed to protrude vertically downward from the lower surface of the body 112, and the insertion portion 115 has a corner portion 114 bordering the lower surface of the body 112. This should form approximately a right angle.

In other words, by setting the radius of curvature of the corner portion 114 to a value close to 0, it can be made close to a right angle even if it is not exactly a right angle.

As a result, as shown in FIG. 2(b), the corner portion 114 hardly comes into contact with the edge of the entrance of the through hole 12 of the substrate 10.

In particular, since the gap t is formed by the thickness of the conductive pattern 30 and the solder cream 32 on the upper surface of the substrate 10, when the radius of curvature of the corner portion is made smaller than the gap t, it penetrates the insertion portion 115. Even if the distance d between the side walls of the hole 12 is small, the corner portion 114 hardly contacts the edge of the entrance of the through hole 12 of the substrate 10.

In this way, the corner portion 114 where the insertion portion 115 borders the lower surface of the body portion 112 does not contact the edge of the entrance of the through hole 12 of the base material 10, so that during soldering, the insertion portion ( 115) is not tilted inside the through hole 12 due to contact with the edge.

In addition, when the inner end of the conductive pattern 30 is located away from the through hole 12, only the horizontal portion 114 of the electrical contact terminal 100 is soldered, and the inner end of the conductive pattern 30 is soldered. Because the unsoldered space is formed, when the soldered space is lifted upward from underneath the through hole 12, the unsoldered space is lifted and absorbs external force.

Referring to FIG. 1, a buffer hole 116 penetrating in the longitudinal direction may be formed inside the insertion portion 115, which saves raw materials and reduces weight, and allows the electrical contact terminal 100 to be inserted through the through hole 12. It has the advantage of being easy to insert.

A buffer hole may be formed in the body portion 112 constituting the core 110, and in this case, it may function as a gasket while protruding from the upper surface of the substrate 10.

Hereinafter, it will be described how the electrical contact terminal of the present invention is mounted on a circuit board to form various electrical connections.

Referring to FIG. 3(a), a through hole 12 is formed in the substrate 10, and a conductive pattern 30 is formed on the upper surface of the substrate 10 adjacent to the through hole 12.

The conductive pattern 30 is a general term for patterns that constitute a conductive path through which electricity (including signals) flows, and becomes a ground pattern when forming a ground circuit.

The electrically conductive object 20 is located below the substrate 10 and is in physical and electrical contact with the end of the insertion portion 115.

Unlike this embodiment, an electrically conductive object may be located on top of the substrate 10 and be in physical and electrical contact with the body portion 112. In this case, the polymer film 130 and the metal layer 140 are formed on the body portion ( 112) and may extend to the top surface.

Accordingly, the electrical contact terminal 100 has a metal layer 140 extending to the upper surface of the body 112, and the upper surface of the body 112 is pressed against an object opposing it to function as a gasket.

The electrical contact terminal 100 is supplied reel taped to a tape carrier and vacuum picked up by a pickup device, or the insertion portion 115 is inserted into the through hole 12 of the base material 10 by hand and the body portion 112 is inserted into the electrical contact terminal 100. The metal layer 140 formed on the horizontal portion 114 of is placed on the solder cream 32 applied on the conductive pattern 30.

As shown in FIG. 3(b), the metal layer 140 on the bottom of the body 112 of the electrical contact terminal 100 is reflow soldered while placed on the applied solder cream 32, and the conductive pattern 30 is formed by soldering. ) - Metal layer 140 - Since the electrical path leading to the electrically conductive object 20 is determined, there is an advantage that the electrical resistance does not increase or change.

Thereafter, as shown in FIG. 3(c), the end of the insertion portion 115 is pressed by the pressure of the electrically conductive object 20 at the bottom of the substrate 10 and is physically and electrically connected.

According to this mounting structure of the electrical contact terminal, the conductive pattern 30 on the upper surface of the base material 10 can be electrically connected to the electrically conductive object 20 on the lower part of the base material 10.

Meanwhile, as described above, when the polymer film 130 and the metal layer 140 in the electrical contact terminal 100 have a structure extending from the side of the body 112 to the top, the following connection is possible. .

1) The conductive pattern 30 on the upper surface of the substrate 10 is electrically connected to the electrically conductive object 20 on the upper or lower surface of the substrate 10.

2) Electrically conductive objects on the top and bottom of the base material 10 are electrically connected to each other.

The electrical contact terminal of the present invention has good mechanical and electrical reliability, so it is easy to apply to automobiles, relatively large computers, and industrial electronic devices subject to vibration and shock.

Although the above description focuses on embodiments of the present invention, various changes and modifications can be made at the level of those skilled in the art. These changes and modifications can be said to belong to the present invention as long as they do not depart from the scope of the present invention. The scope of rights of the present invention should be determined by the claims stated below.

100: Electrical contact terminal
110: core
112: body part
115: Insertion part
116: contact part
120: adhesive
130: polymer film
140: metal layer

Claims (8)

An electrical contact terminal that is physically fitted into a through hole of a substrate and has elasticity that is electrically connected to a conductive pattern formed on the substrate adjacent to the through hole,
The electrical contact terminal consists of a core having elasticity and heat resistance, a heat-resistant polymer film bonded to the outer surface of the core in the longitudinal direction through an adhesive, and a metal layer formed on the outer surface,
The core is,
A body portion having a horizontal portion formed on the lower surface; and
It consists of an insertion portion extending vertically downward from the body portion,
The body portion and the insertion portion are formed integrally,
The core, the polymer film, and the metal layer have heat resistance corresponding to soldering, and the metal layer is capable of soldering,
The metal layer is formed over the horizontal portion of the body portion and the insertion portion and is electrically connected to each other. In claim 1,
An electrical contact terminal, wherein the metal layer extends from the lower surface of the body to the upper surface, and both ends are spaced apart from the upper surface. In claim 1,
An electrical contact terminal, characterized in that a buffer hole is formed in the insertion portion in the longitudinal direction. In claim 1,
An electrical contact terminal, wherein an edge of the insertion portion bordering the lower surface of the body forms an angle adjacent to a right angle. In claim 4,
An electrical contact terminal, characterized in that the radius of curvature of the corner portion is smaller than the gap formed by the thickness of the conductive pattern and solder cream. It is a mounting structure for mounting the electrical contact terminal of claim 1 on a substrate,
A through hole is formed in the substrate, and a conductive pattern is formed on the upper surface of the substrate adjacent to the through hole,
The insertion part of the electrical contact terminal of claim 1 is inserted into the through hole, the horizontal part of the body part is soldered to the conductive pattern, and the end of the insertion part is electrically connected by elastic contact with an electrically conductive object located at the lower part of the substrate. Characteristic mounting structure of electrical contact terminal. In claim 6,
The inner end of the conductive pattern is positioned spaced apart from the through hole,
A mounting structure for an electrical contact terminal, wherein the soldering is performed only on the horizontal portion. In claim 7,
An unsoldered space is formed from the inner end of the conductive pattern, so that when the insertion part is lifted from bottom to top by the object, the unsoldered space is lifted and absorbs external force caused by the object. Mounting structure of electrical contact terminals.

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