KR20230133355A - Jig for manufacturing electronic components and method of manufacturing electronic components - Google Patents

Abstract

A jig is provided that can easily and appropriately store one workpiece in one chip storage section.
The workpiece before processing to be stored in the chip storage unit 8 is shaped like a rectangular parallelepiped with a length (L1), a width (W1), and a thickness (T1) (L1>W1≥T1). When a virtual rectangular parallelepiped with length (L2), width (W2), and thickness (T2) (W2 ≥ T2) is inserted into the chip storage portion 8, width (W2) The cuboid where is the maximum is called the maximum cutting surface cuboid (MR). When the maximum cutting surface rectangular parallelepiped MR is in contact with the bottom of the chip storage unit 8, the cross section in contact with the bottom of the maximum cutting surface rectangular parallelepiped MR is the maximum virtual bottom surface MS of the chip storage unit 8. Do it as The maximum virtual floor MS has a long side d1 and a short side d2 (maybe d1=d2). The maximum depth of the chip storage portion 8 is set to Zmax, and the minimum depth is set to Zmin. At this time, among the plurality of chip accommodating parts 8, all chip accommodating parts that satisfy Equations (1) and (2) are assumed to satisfy Equations (3) to (7).
W1<d1… (One)
T1<d2… (2)
d1<2W1… (3)
d2<2T1… (4)
1/2×L1<Zmin… (5)
Zmax<3/2×L1… (6)
d1<L1… (7)

Description

Jig for manufacturing electronic components and method of manufacturing electronic components

The present invention relates to a jig for manufacturing electronic components. Additionally, the present invention relates to a method of manufacturing electronic components using the jig for manufacturing electronic components of the present invention.

A conventional jig for manufacturing electronic components is disclosed in Japanese Patent Application Laid-Open No. 2008-177188 (Patent Document 1) and Japanese Patent No. 6259943 (Patent Document 2).

The jig described in Patent Document 1 includes a support member and a receiving member and is a jig used for processing chip-shaped electronic components. The support member is made of metal material. The support member has an overall planar shape and has a plurality of penetrating chip insertion holes in its surface. The receiving member is a reticulated body made up of metal meridians and metal pseudowires. The receiving member is joined to one surface of the supporting member, and at least one intersection exists within the opening surface of the chip insertion hole.

The jig described in Patent Document 2 is a ceramic lattice body and has a plurality of first line parts and a plurality of second line parts. Each of the plurality of first line parts is made of ceramics and extends in one direction. Each of the plurality of second stripes is made of ceramics and extends in a direction intersecting the first stripes. At the intersection of the first line and the second line, the second line is disposed on the first line at any intersection. At the intersection, the first line portion has a shape in which the cut surface is composed of a straight portion and a convex curved portion with both ends of the straight portion as ends. The second line part at the intersection has a circular or oval shape in its cut surface. When viewed from the longitudinal cross section of the intersection, the first and second stripes are in contact with only the top of the convex curved part of the first stripe and the circular or elliptical downwardly convex top of the second stripe.

Japanese Patent Publication No. 2008-177188 Japanese Patent No. 6259943

In a conventional jig, a plurality of works (objects stored in the chip storage section; for example, chip-shaped electronic components, unfinished products in the middle of the manufacturing process, etc.) are placed on the jig from the opening side of the plurality of chip storage sections. After scattering, shake the jig. Accordingly, the work is inserted into each of the plurality of chip storage portions. Any remaining work on the jig that does not all fit into the chip compartment is tilted and shaken off.

For this reason, in order to insert one work into one chip accommodating part of a plurality of chip accommodating parts, it is necessary to appropriately set the size of the chip accommodating part (depth dimension, opening area, bottom area, etc.). For example, if the opening area of the work is too small, it takes time to insert the work into the chip storage section. Additionally, if the opening area of the work is too large, two works enter one chip storage section. Accordingly, there is a risk that firing unevenness may occur when firing a work using a work jig. Additionally, if the depth dimension of the chip storage section is too small, there is a risk that the work stored in the chip storage section will also be shaken off when the remaining work is shaken off. Additionally, if the depth dimension of the chip storage portion is too large, when two works are inserted side by side in the depth direction, there is a risk that only the upper work piece cannot be shaken off.

The present invention has been made in light of the above problems, and its purpose is to provide a jig for manufacturing electronic components that can easily insert one work into one chip compartment.

The present invention has been made to solve the above-mentioned conventional problems, and as a means thereof, a jig for manufacturing electronic components according to an embodiment of the present invention has a vertical direction, a horizontal direction orthogonal to the vertical direction, and a vertical direction and a horizontal direction. It has orthogonal height directions and includes a plurality of chip accommodating parts that are open upward in the height direction, and each of the plurality of chip accommodating parts has a length (L1), a width (W1), and a thickness (T1) (L1>W1≥T1). A jig for manufacturing electronic components that assumes storing a rectangular parallelepiped-shaped workpiece before processing, machining the workpiece before processing, and machining the workpiece before processing into a workpiece after processing, comprising a group of a plurality of linear members stacked in the height direction. Each group of linear members includes a plurality of linear members arranged in parallel and spaced apart from each other, and when viewed in the height direction, the linear members of the group of linear members stacked on a predetermined layer and the linear members stacked on another adjacent layer. Line members of different linear member groups intersect each other, and the chip storage portions each have a bottom portion that supports the workpiece before processing from below in the height direction and a side wall portion that partitions other adjacent chip storage portions, and the bottom portion is one linear member. It is composed of one or more linear members belonging to a group, and the side wall portion is composed of one linear member belonging to one linear member group or two or more linear members each belonging to two or more linear member groups, and the chip storage portion is When a virtual rectangular parallelepiped of length (L2), width (W2), and thickness (T2) (W2≥T2) is inserted in the longitudinal direction, width (W2) The rectangular cuboid with the largest cutting surface is set as the rectangular cuboid with the largest cutting surface, and when the cuboid with the largest cutting surface is in contact with the bottom of the chip storage section, the cross section in contact with the bottom of the cuboid with the largest cutting surface is taken as the maximum virtual bottom surface of the chip storage section. , the maximum virtual floor has a long side (d1) and a short side (d2) (d1=d2 may be), the maximum virtual floor extends in the normal direction from the maximum virtual floor, and the first stacked line from the top. The dimension between the ceiling surfaces of the linear members belonging to the member group is set as the maximum depth of the chip storage section (Zmax), the maximum virtual floor extending in the normal direction from the maximum virtual floor, and the linear member group laminated second from the top. When the dimension between the ceiling surface of the linear member belonging to )~Equation (7) are also assumed to be satisfied.

W1<d1… (One)

T1<d2… (2)

d1<2W1… (3)

d2<2T1… (4)

1/2×L1<Zmin… (5)

Zmax<3/2×L1… (6)

d1<L1… (7)

According to the electronic component manufacturing jig of the present invention, one work can be easily and appropriately stored in one chip storage unit.

Figure 1 is a top view of the jig 100.
2(A) to 2(D) are cross-sectional views of the jig 100, respectively.
Figure 3(A) is a plan view of the main part of the jig 100. 3(B) and 3(C) are cross-sectional views of main parts of the jig 100, respectively.
Figure 4 (A) is a perspective view showing the work (AW) before processing, Figure 4 (B) is a rectangular parallelepiped (MR) with the maximum cross section, and Figure 4 (C) is a perspective view showing the work (BW) after processing.
5(A) to 5(C) are explanatory diagrams showing the maximum virtual floor surface (MS), respectively.
Figures 6(A) and (B) are explanatory diagrams showing the maximum virtual floor surface (MS), respectively.
Figure 7 is an explanatory diagram for explaining the conditions under which it is easy to accommodate the workpiece before processing in the chip storage section.
Figure 8 is a cross-sectional view of the multilayer ceramic condenser 1000.
9(A) and 9(B) are explanatory diagrams showing one process in an example of a manufacturing method for the multilayer ceramic capacitor 1000, respectively.
FIGS. 10(C) to 10(F) continue from FIG. 9(B) and are explanatory diagrams showing one step in an example of the method for manufacturing the multilayer ceramic capacitor 1000, or the multilayer ceramic capacitor being manufactured.
FIGS. 11(G) and (H) are continuations of FIG. 10(F) and are explanatory diagrams each showing one step in an example of the manufacturing method of the multilayer ceramic capacitor 1000.
FIGS. 12(I) and (J) are continuations of FIG. 11(H) and are explanatory diagrams showing a multilayer ceramic capacitor being manufactured in an example of the manufacturing method of the multilayer ceramic capacitor 1000, respectively.
Figures 13(A) and (B) are cross-sectional views showing the jig 200, respectively.
14(A) and 14(B) are explanatory diagrams showing the jig 400, respectively.
Figure 15 is a cross-sectional view showing the jig 500.

Hereinafter, modes for carrying out the present invention will be described along with the drawings.

Meanwhile, each embodiment illustratively shows an embodiment of the present invention, and the present invention is not limited to the content of the embodiment. In addition, it is possible to combine and implement the contents described in other embodiments, and the implementation details in that case are also included in the present invention. In addition, the drawings are intended to aid understanding of the specification, and may be drawn schematically, and the drawn components or the ratio of dimensions between components may not match the ratio of their dimensions described in the specification. Additionally, there are cases where components described in the specification are omitted from the drawings or are drawn with their number omitted.

[First Embodiment]

(Jig for manufacturing electronic components (100))

A jig 100 for manufacturing electronic components is shown in Figs. 1, 2(A) to (D), and 3(A) to (C). However, Figure 1 is a top view of the jig 100. 2(A) to (D) are cross-sectional views of the jig 100, respectively. FIG. 2(A) shows the dashed-dotted arrow (S-S) portion of FIG. 1. FIG. 2(B) shows the dashed-dotted arrow (T-T) portion of FIG. 1. FIG. 2(C) shows the dashed-dotted arrow (U-U) portion of FIG. 1. FIG. 2(D) shows the dashed-dotted arrow (V-V) portion of FIG. 1. Figure 3(A) is a plan view of the main part of the jig 100. 3(B) and 3(C) are cross-sectional views of main parts of the jig 100, respectively. Meanwhile, FIG. 3(A) shows the upper right portion of the jig 100 in FIG. 1. FIG. 3(B) shows the dashed-dotted arrow (S-S) portion of FIG. 1. FIG. 3(C) shows the dashed-dotted arrow (U-U) portion of FIG. 1.

Meanwhile, the jig 100 has a vertical direction (X), a horizontal direction (Y) orthogonal to the vertical direction (X), and a height direction (Z) orthogonal to the vertical direction (X) and the horizontal direction (Y), respectively. , These directions may be referred to in the following description. Additionally, the plane including the vertical direction (X) and the horizontal direction (Y) may be called a reference plane, and may be referred to as a reference plane in the following description.

The jig 100 includes a first linear member group (1G), a second linear member group (2G), a third linear member group (3G), and a fourth linear member group (4G) stacked in order along the height direction (Z). ), the fifth linear member group (5G), the sixth linear member group (6G), and the seventh linear member group (7G). Meanwhile, for explanation purposes, the side in the height direction Z where the first linear member group 1G is located is referred to as downward, and the side where the seventh linear member group 7G is located is referred to as upward. However, the number of linear member groups is not limited to 7, and it is possible to increase or decrease the number from 7.

In this embodiment, the first linear member group 1G includes seven straight linear members 1 extending in the longitudinal direction (X). The seven linear members 1 are arranged parallel to each other at an arrangement pitch D. On the other hand, arrangement pitch refers to the distance between the centers of two adjacent linear members arranged apart from each other.

The second linear member group 2G includes seven straight linear members 2 extending in the horizontal direction (Y). The seven linear members 2 are arranged in parallel with each other at an arrangement pitch E. Meanwhile, the arrangement pitch (E) may be the same size as the arrangement pitch (D), or may be a different size from the arrangement pitch (D).

The third linear member group 3G includes eight straight linear members 3 extending in the longitudinal direction (X). The eight linear members 3 are arranged parallel to each other at an arrangement pitch D. The linear members 3 of the third linear member group 3G are the linear members 1 and 3 when viewed in the height direction (Z) with respect to the linear members 1 of the first linear member group 1G. ) are arranged so that the spacing is equal in all parts. On the other hand, in the plan view of FIG. 1, the linear members 3 of the third linear member group 3G are not visible because they are disposed immediately below the linear members 7 of the seventh linear member group 7G, which will be described later.

The fourth linear member group 4G includes eight straight linear members 4 extending in the horizontal direction (Y). The eight linear members 4 are arranged in parallel with each other at an arrangement pitch E. The linear members 4 of the fourth linear member group 4G are the linear members 2 and 4 when viewed in the height direction (Z) with respect to the linear members 2 of the second linear member group 2G. ) are arranged so that the spacing is equal in all parts. On the other hand, in the plan view of FIG. 1, the linear members 4 of the fourth linear member group 4G are not visible because they are disposed immediately below the linear members 6 of the sixth linear member group 6G, which will be described later.

The fifth linear member group 5G includes eight straight linear members 5 extending in the longitudinal direction (X). The eight linear members 5 are arranged parallel to each other at an arrangement pitch D. The linear members 5 of the fifth linear member group 5G are each arranged immediately above the linear members 3 of the third linear member group 3G. On the other hand, in the plan view of FIG. 1, the linear members 5 of the fifth linear member group 5G are not visible because they are disposed immediately below the linear members 7 of the seventh linear member group 7G, which will be described later.

The sixth linear member group 6G includes eight straight linear members 6 extending in the horizontal direction (Y). The eight linear members 6 are arranged in parallel with each other at an arrangement pitch E. The linear members 6 of the sixth linear member group 6G are each disposed immediately above the linear members 4 of the fourth linear member group 4G.

The seventh linear member group 7G includes eight straight linear members 7 extending in the longitudinal direction (X). The eight linear members 7 are arranged parallel to each other at an arrangement pitch D. The linear members 7 of the seventh linear member group 7G are each disposed immediately above the linear members 5 of the fifth linear member group 5G.

The number of linear members 1 to 7 is arbitrary and can be increased or decreased.

In this embodiment, the linear members 1, 3, 5, and 7 and the linear members 2, 4, and 6 are orthogonal to each other. That is, they intersect at an angle of 90°. However, the angle at which the linear members 1, 3, 5, 7 and the linear members 2, 4, and 6 intersect is not limited to 90° and can be increased or decreased from 90°.

In this embodiment, the linear members 1 to 7 each had a circular cutting surface and were used with the same area and diameter. However, the cut surface shape, area, diameter, etc. of the linear members 1 to 7 are arbitrary and can be freely selected. In addition, the cut surface shape, area, diameter, etc. of the linear members 1 to 7 may be different for each linear member.

In this embodiment, ceramic was used as the material (material) of the linear members 1 to 7. As ceramics, for example, SiC, zirconia, yttria-stabilized zirconia, alumina, mullite, etc. can be used. However, the material of the linear members 1 to 7 is arbitrary, and instead of ceramic, metal such as nickel, aluminum, Inconel (registered trademark), SUS, polytetrafluoroethylene (PTFE), polypropylene (PP), etc. Resin materials such as polypropylene, acrylic resin, ABS (Acrylonitrile butadiene styrene) like resin, and other heat-resistant resins, carbon, or composite materials made of metal and ceramic may be used.

The surfaces of the linear members 1 to 7 may be additionally coated with ceramics such as SiC, zirconia, yttria-stabilized zirconia, alumina, and mullite, or metals such as nickel.

The jig 100 can be manufactured, for example, by manufacturing a structure having the above configuration using a linear member containing a ceramic precursor, heating (firing) the structure, and synthesizing ceramic from the ceramic precursor.

The jig 100 having the above configuration includes a plurality of chip storage portions 8. The chip storage portion 8 has an opening 8a. The chip storage portion 8 is for storing the workpiece before processing.

A plurality of chip storage portions 8 are formed in a regular manner on the jig 100. In this embodiment, the plurality of chip storage portions 8 are formed in a matrix shape (checkerboard eye shape) on the main surface of the jig 100. However, the arrangement of the chip storage portion 8 is not limited to a matrix shape.

The chip storage portion 8 has a bottom portion 8b that supports the workpiece before processing from below, and a side wall portion that partitions the adjacent chip storage portion 8, which is opened upward by an opening 8a. We have (8c). In this embodiment, one chip storage portion 8 has one bottom portion 8b and four side wall portions 8c. However, the number of side wall portions 8c is not limited to four and can be increased or decreased from four.

The chip storage unit 8 accommodates the workpiece before processing without restraining it.

As shown in Fig. 3(A), the bottom portion 8b of the chip storage portion 8 is formed by the top surface (ridge) of the linear member 2. The bottom portion 8b has a bottom passage hole 8d configured by a gap between two adjacent linear members 2 and communicating with the rear surface of the bottom portion 8b.

3(B) and (C), the side wall portion 8c of the chip storage portion 8 is formed by the linear members 4 and 6 or the linear members 3, 5, and 7. . The side wall portion 8c has a gap between the linear member 4 and the linear member 6, a gap between the linear member 3 and the linear member 5, and a gap between the linear member 5 and the linear member 7. On the back, it has a side wall passage hole 8e that communicates with another adjacent chip storage section 8.

(About the dimensions of the chip storage portion 8 in the jig 100 for manufacturing electronic components)

The dimensions of the electronic component manufacturing jig 100 are designed so that one work is stored in one chip storage portion 8. More specifically, it is assumed that one rectangular parallelepiped-shaped work is stored in one chip storage section 8 in a standing state. Storing in an upright position means storing the workpiece by aligning its longitudinal direction with the depth direction of the chip storage unit 8 (the longitudinal direction of the maximum cutting surface of the rectangular parallelepiped (MR), which will be described later, ideally coinciding with the height direction (Z)). It means to do.

Storing the work into the chip storage unit 8 can be done by, for example, placing a plurality of works on the jig 100 in irregular positions and directions and then applying vibration to the jig 100 or tilting the jig 100. This can be carried out by dropping the work mounted on the jig 100 into the chip storage section 8, for example.

After storing the work in the chip storage section 8, for example, by vibrating the jig 100 or tilting the jig 100, the remaining work or improperly stored work (e.g. For example, two works stored in one chip storage section (8) are removed.

When the following requirements (a) to (e) are satisfied, the work is properly stored in the chip storage section 8.

(a) One workpiece can be accommodated in the chip storage section 8 in an upright position.

(b) Two or more works cannot be accommodated side by side in the chip storage section 8.

(c) The work properly stored in the chip storage section 8 does not easily pop out by applying vibration, etc.

(d) In the case where two or more works are placed in the chip storage section 8 and stacked vertically, the upper works can be easily removed by applying vibration, etc.

(e) A workpiece cannot be accommodated in a lying state in the chip storage section 8.

First, the work stored in the chip storage unit 8 is defined. Since the purpose of the jig 100 is to store a work in the chip storage section 8 and perform processing on the work, the work to be stored in the chip storage section 8 is herein referred to as the work before processing (AW). I call.

The shape of the work (AW) before processing is a rectangular parallelepiped shape, which is a shape widely adopted in electronic components. The workpiece (AW) before processing has the following dimensions: length (L1), width (W1), and thickness (T1). However, it is assumed that L1>W1≥T1 is satisfied. That is, the length L1 is larger than the width W1 and the thickness T1, but the width W1 may be larger than the thickness T1 or may be the same. Figure 4(A) shows the work (AW) before processing.

Before defining the dimensions of the chip accommodating portion 8, the maximum cut surface rectangular parallelepiped (MR) that can be accommodated in the chip accommodating portion 8, the maximum virtual bottom surface (MS) of the chip accommodating portion 8, and the chip accommodating portion 8 are defined. The maximum depth (Zmax) of (8) and the minimum depth (Zmin) of the chip storage portion (8) are specified.

The maximum cutting surface cuboid (MR) is a virtual cuboid that has the following dimensions: length (L2), width (W2), and thickness (T2) and satisfies W2 ≥ T2. Here, the length (L2) of the maximum cutting surface of the rectangular parallelepiped (MR) does not matter (there is no need to consider it). The width W2 may be greater than the thickness T2 or may be the same.

The maximum cutting surface rectangular parallelepiped (MR) refers to a rectangular parallelepiped that can contact the bottom of the chip storage portion 8 and has the maximum width (W2) x thickness (T2). The maximum sectional rectangular parallelepiped (MR) is shown in Figure 4(B).

A rectangular parallelepiped (MR) with the largest cutting surface is stored in the chip storage unit 8, and when the rectangular parallelepiped with the largest cutting surface MR is in contact with the bottom of the chip storage unit 8, the maximum cutting surface MR is in contact with the bottom of the cuboid MR. Let the cross section be the maximum virtual bottom surface MS of the chip storage portion 8. On the other hand, the reason why it is called a virtual bottom surface is because in reality, there are cases where the bottom surface does not exist due to the presence of the bottom passing hole 8d.

The maximum virtual floor MS has a long side d1 and a short side d2. Meanwhile, d1=d2 may be sufficient. Additionally, the long side d1 and the short side d2 may each follow the vertical direction (X), the horizontal direction (Y), or other directions of the jig 100. Figures 5(A) to (C) show the maximum virtual floor surface (MS). On the other hand, as shown in FIGS. 6(A) and 6(B), when the chip storage portion 8 is tilted with respect to the height direction Z, the maximum virtual bottom surface MS is also tilted (vertical direction ( not parallel to the reference plane, which is the plane containing the X) and transverse directions (Y). In addition, since the depth direction of the above-described chip storage portion 8 points to the longitudinal direction of the maximum sectional rectangular parallelepiped MR, in this case, it is inclined with respect to the height direction Z.

If the size of the width (W1) and thickness (T1) of the work (AW) before machining and the size of the maximum virtual bottom surface (MS) of the chip storage portion (8) are antagonistic, the work before machining (AW) is the work before machining. The width (W1) side of (AW) is set to the long side (d1) side of the maximum virtual floor (MS), and the thickness (T1) side of the work (AW) before processing is set to the short side (d1) of the maximum virtual floor (MS). On the d2) side, it is stored in the chip storage unit 8.

The depth of the chip storage portion 8 is not uniform. That is, due to the fact that the chip storage portion 8 is formed of a plurality of stacked linear members 1 to 7 belonging to the first to seventh linear member groups 1G to 7G, the number of chips Payment (8) has a maximum depth (Zmax) and a minimum depth (Zmin).

The maximum depth (Zmax) of the chip storage unit 8 belongs to the maximum virtual bottom surface (MS) extending in the normal direction from the maximum virtual bottom surface (MS) and the seventh linear member group 7G stacked first from above. This is the dimension between the ceiling surfaces of the linear members 7. Fig. 5(B) shows the maximum depth (Zmax) of the chip storage portion 8.

The minimum depth (Zmin) of the chip storage portion 8 is the maximum virtual bottom surface (MS) extending in the normal direction from the maximum virtual bottom surface (MS) and the sixth linear member group 6G stacked second from the top. It is the dimension between the ceiling surfaces of the belonging linear members 6. Fig. 5(C) shows the minimum depth (Zmin) of the chip storage portion 8.

In order to accommodate one unmachined workpiece (AW) in an upright position in the chip storage section 8, the width (W1) and thickness (T1) (W1≥T1) of the workpiece (AW) before machining (W1≥T1), and the maximum virtual floor The long side (d1) and short side (d2) of the surface MS (d1=d2 may be sufficient) must satisfy the following equations (1) and (2).

W1<d1… (One)

T1<d2… (2)

In order for two or more unmachined works (AW) not to be accommodated side by side in the chip storage section 8, the width (W1) and thickness (T1) (W1 ≥ T1) of the unmachined work (AW) and the maximum virtual The long side (d1) and short side (d2) of the bottom surface (MS) (d1=d2 may be sufficient) need to satisfy the following equations (3) and (4).

d1<2W1… (3)

d2<2T1… (4)

In order to prevent the unmachined workpiece (AW) properly stored in the chip storage unit 8 from easily popping out due to vibration, etc., the length (L1) and minimum depth (Zmin) of the unmachined workpiece (AW) are as follows. Equation (5) needs to be satisfied. In other words, if the length of half the length L1 of the workpiece AW before machining is smaller than the minimum depth Zmin, the workpiece AW before machining that is properly stored does not easily pop out even if vibration is applied.

1/2×L1<Zmin… (5)

When two or more unmachined works (AW) are placed in the chip storage section 8 and stacked vertically, the length (L1) and maximum depth (Zmax) of the unmachined works (AW) are expressed in the following equation (6). If is satisfied, the upper unprocessed work (AW) can be easily removed by applying vibration, etc. That is, if the maximum depth Zmax is less than 1.5 times the length L1 of the work AW before processing, the upper work AW before processing can be easily removed by applying vibration, etc.

Zmax<3/2×L1… (6)

In order for a workpiece not to be accommodated in a lying state in the chip storage unit 8, the length (L1) of the workpiece (AW) before processing and the long side (d1) of the maximum virtual bottom surface (MS) are calculated using the following equation (7): ) needs to be satisfied.

d1<L1… (7)

From the above, the jig 100 is designed so that the dimensions of the chip accommodating portion 8 satisfy all of equations (3) to (7) in all chip accommodating portions that satisfy equations (1) and (2), there is.

W1<d1… (One)

T1<d2… (2)

d1<2W1… (3)

d2<2T1… (4)

1/2×L1<Zmin… (5)

Zmax<3/2×L1… (6)

d1<L1… (7)

The jig 100 satisfies all of equations (1) to (7), so not only is the workpiece stored in the chip storage unit 8, but also the process of storing the workpiece before machining to the process of removing the workpiece after machining. It is a jig that can be used appropriately and efficiently.

In addition, in order to make it easier for the workpiece (AW) before processing to enter the chip accommodating part 8, the dimensions of the chip accommodating part 8 of the jig 100 must be adjusted to all chip accommodating parts that satisfy Equations (1) and (2). In (8), the length (L1) and width (W1) of the workpiece (AW) before processing (L1>W1), the long side (d1) of the maximum virtual bottom surface (MS), and the first stacked line from above. It belongs to the member group (seventh linear member group 7G), and the minimum diameter (R1min) of the linear member (linear member 7) constituting the side wall portion 8c satisfies the following equation (8). It is desirable. The reason is explained below.

(W1 ² +(1/4)×L1 ² ) ^1/2 -R1min<d1… (8)

Meanwhile, here, the size of the diameter of the linear member (linear member 7) that belongs to the first linear member group (seventh linear member group 7G) newly stacked from above and constitutes the side wall portion 8c See . The linear member shall have a circular cutting surface. In addition, the diameter of the cutting surface of the linear member is generally uniform, but considering that the diameter may vary due to non-uniformity or intentionally, here, the minimum diameter (R1min), which is the smallest diameter, is considered.

In FIG. 7, before the workpiece AW enters the chip storage unit 8 before processing, the direction of the length L1 of the workpiece AW before processing is vertical (height direction Z of the jig 100). It indicates a state that is tilted 45° from (hereinafter, it may simply be referred to as “inclined 45°”).

In order to make it easier for the unmachined work (AW) to enter the chip storage section (8), when the unmachined work (AW) is tilted at 45°, the unmachined work (AW) belongs to the group of linear members laminated first from the top. It is important not to get caught in absence (7). If the work AW before processing is tilted at 45° and the work AW before processing is caught on the linear member 7, it is difficult for the work AW before processing to enter the chip storage section 8. On the other hand, when the work AW before processing is tilted at 45°, if the work AW before processing is not caught by the linear member 7, the work AW before processing is likely to enter the chip storage portion 8.

As shown in FIG. 7, the horizontal length including one ridge P on the lower side of the workpiece AW before processing, which is inclined at 45°, is set to L4. If L4 is expressed as the length (L1) and width (W1) of the workpiece (AW) before processing, the following equation is obtained from the Pythagorean theorem.

L4=(W1 ² +(1/4)L1 ² ) ^1/2

The distance between the centers of two adjacent linear members 7 is set to L5. L5 is the long side (d1) of the maximum virtual floor surface (MS) plus the minimum radius (1/2R1min) of one linear member 7 and the minimum radius (1/2R1min) of the other linear member 7. Therefore, the following equation holds.

L5=d1+1/2R1min+1/2R1min=d1+R1min

If the horizontal length (L4) of the workpiece (AW) before machining inclined at 45° is smaller than the distance (L5) between the centers of the two linear members 7, the workpiece (AW) before machining inclined at 45° is the linear member. It becomes difficult to get caught in (7), and it becomes easier to enter the chip storage section (8). That is, if L4<L5, the workpiece AW before processing is likely to enter the chip storage portion 8. Equation (8) is established by substituting the above expressions of L4 and L5 into L4<L5.

(W1 ² +(1/4)×L1 ² ) ^1/2 -R1min<d1… (8)

In order to make it easier for the workpiece (AW) before processing to enter the chip receiving portion (8), the jig (100) satisfies equation (8) in all chip receiving portions (8) that satisfy equations (1) and (2). It is desirable.

On the other hand, if the following equation is satisfied, the workpiece AW before processing becomes easier to enter the chip storage section 8.

(W1 ² +(1/4)×L1 ² ) ^1/2 <d1

Next, the requirements for making it easy to remove the work BW from the chip storage section 8 after processing in the chip storage section 8 of the jig 100 will be described. On the other hand, the reason why it is described as a work after machining (BW) rather than as a work before machining (AW) is when the dimensions of the work after machining (BW) change (for example, become smaller) from the work before machining (AW) after finishing machining. Because there is.

After processing, the workpiece (BW) has a rectangular parallelepiped shape with length (L3), width (W3), and thickness (T3) (L3>W3≥T3). Figure 4(C) shows the workpiece (BW) after processing.

In order to make it easy to remove the workpiece (BW) from the chip storage section 8 after processing, the length (L3) of the workpiece (BW) after processing, the maximum depth (Zmax) of the chip storage section 8, and the first stack from the top. The minimum diameter (R1min) of the linear member (linear member 7) belonging to the linear member group (seventh linear member group 7G) satisfies equations (1) and (2). ), it is desirable to satisfy the following equation (9):

(Zmax-L3)<1/2×R1min… (9)

If equation (9) is satisfied, when the workpiece BW after processing is taken out from the chip storage unit 8, the upper end of the workpiece BW after processing is equal to the diameter of the linear member belonging to the first stacked linear member group from above. This is because it is located above the center and does not catch on the linear member belonging to the first laminated linear member group on the upper edge of the workpiece BW after processing.

(Features of jig (100))

The jig 100 includes the following features because the dimensions of the chip storage portion 8 satisfy all of the equations (1) to (7) shown above. First, one work can be accommodated in the chip storage section 8 in an upright state. Additionally, two or more works cannot be accommodated side by side in the chip storage section 8. A work properly stored in the chip storage portion 8 does not easily jump out due to vibration or the like. When two or more works are placed in the chip storage section 8 and placed overlapping each other, the upper works can be easily removed by applying vibration, etc. A workpiece cannot be accommodated lying down in the chip storage section 8.

Therefore, when the jig 100 is used in the machining process in the manufacturing process of electronic components, machining can be performed with each workpiece independently stored in the chip storage section 8 before machining, so that machining conditions for each workpiece can be adjusted. Non-uniformity can be reduced. Accordingly, variations in quality (characteristics, shape, etc.) of electronic components manufactured using the jig 100 are suppressed.

Additionally, when the jig 100 is used, the works do not come into contact with each other during the machining process, so it is difficult for the works to adhere to each other after machining even if the machining involves heat such as a synthesis process or a firing process. Additionally, even if the workpieces are weak, they are unlikely to collide with each other and be damaged. Therefore, by using the jig 100, the defective product rate of electronic components can be reduced.

Additionally, when the jig 100 is used, the workpiece before processing can be easily stored in the chip storage section 8 in a short time, so electronic components can be manufactured with high productivity.

In addition, because the jig 100 uses ceramic as a material, it has higher heat resistance compared to other materials, and even if the processing process involves heating such as a firing process or a synthesis process, the jig 100 may not be damaged or damaged. Deformation can be suppressed. Additionally, since the material of the jig 100 is ceramic, it is possible to reduce the need to pay attention to the firing atmosphere or synthesis atmosphere. For example, if the jig 100 is made of nickel, there is a risk of absorbing oxygen in the atmosphere and changing the atmosphere, but if the jig 100 is made of ceramic, such a problem is unlikely to occur. Additionally, if the jig 100 is made of ceramic, it is possible to reduce the need to pay attention to reaction with the work. For example, if the material of the jig 100 is iron, there is a risk of reaction with the work, but if the material of the jig 100 is ceramic, such a problem is unlikely to occur.

Additionally, the jig 100 is strong against physical shock because the linear members 1 to 7 are substantially straight and have no bends. Additionally, it is difficult to break even if stress is applied due to temperature changes. Therefore, the jig 100 is unlikely to be damaged even if a material that is weak against shock, such as ceramic, is used.

In order to manufacture ceramic electronic components with high productivity, there are cases where a plurality of jigs containing work pieces are stacked in multiple stages and used in a processing process such as a synthesis process or a firing process. However, the conventional jig had a problem that the ventilation of the storage portion deteriorated when stacked in multiple stages and used in an overlapping manner.

On the other hand, in the jig 100, in addition to the opening 8a provided above the chip storage portion 8, a side wall passage hole 8e is formed in the side wall portion 8c, and a bottom passage hole 8e is formed in the bottom portion 8b. A hole 8d is formed. The jig 100 has good ventilation because it includes a side wall passage hole 8e and a bottom passage hole 8d through which gas can pass. Therefore, by using the jig 100, processing defects due to poor ventilation can be suppressed.

(Example of manufacturing method of electronic components using jig 100)

In the first embodiment, a multilayer ceramic capacitor 1000 (electronic component) is manufactured using the jig 100. However, the electronic components manufactured are not limited to multilayer ceramic capacitors, but other multilayer electronic components such as multilayer ceramic inductors, multilayer ceramic thermistors, multilayer ceramic LC components, and multilayer ceramic substrates, as well as ceramic resonators, ceramic filters, ceramic resistors, and ceramic substrates. It may be a non-laminated electronic component such as a thermistor or ceramic substrate.

Figure 8 shows a multilayer ceramic capacitor 1000 manufactured in the first embodiment. However, Figure 8 is a cross-sectional view of the multilayer ceramic condenser 1000.

The multilayer ceramic capacitor 1000 includes a multilayer ceramic body 11 in the shape of a rectangular parallelepiped. The multilayer ceramic body 11 includes a plurality of non-conductor layers 11a, a plurality of first internal electrode layers 12, and a plurality of second internal electrode layers 13 stacked.

The multilayer ceramic body 11 has the following dimensions: length (L3), width (W3), and thickness (T3) (L3>W3≥T3).

The material of the multilayer ceramic body 11 (non-conductor layer 11a) is arbitrary; for example, a dielectric ceramic containing BaTiO ₃ as a main component can be used. However, instead of BaTiO ₃ , dielectric ceramics containing other materials as main components, such as CaTiO ₃ , SrTiO ₃ , and CaZrO ₃ , may be used.

The thickness of the non-conductor layer 11a is arbitrary. For example, it can be about 0.3 μm to 2.0 μm in the effective region of capacitance formation where the first internal electrode layer 12 and the second internal electrode layer 13 are formed.

The number of layers of the non-conductor layer 11a is arbitrary; for example, it can be about 1 to 6000 layers in the effective area of capacitance formation in which the first internal electrode layer 12 and the second internal electrode layer 13 are formed.

The first internal electrode layer 12 and the second internal electrode layer 13 are not formed at both ends of the multilayer ceramic body 11 in the stacking direction, and an outer layer (protective layer) consisting only of the non-conductive layer 11a is provided. The thickness of the non-conductor layer 11a in the outer layer region may be different from the thickness of the non-conductor layer 11a in the effective area of capacitance formation where the first internal electrode layer 12 and the second internal electrode layer 13 are formed. Additionally, the material of the non-conductor layer 11a in the outer layer region may be different from the material of the non-conductor layer 11a in the effective region.

The first internal electrode layer 12 is extended on one end surface (an arbitrary outer surface perpendicular to the stacking direction) of the multilayer ceramic body 11. The second internal electrode layer 13 is extended to the other end surface of the multilayer ceramic body 11 (the outer surface facing back to one end surface). Meanwhile, the first internal electrode layer 12 and the second internal electrode layer 13 are, in principle, alternately stacked.

The material of the main component (metal component) of the first internal electrode layer 12 and the second internal electrode layer 13 is arbitrary, and for example, Ni, Cu, Ag, Pd, Au, etc. can be used. Additionally, Ni, Cu, Ag, Pd, Au, etc. may be alloyed with other metals. The first internal electrode layer 12 and the second internal electrode layer 13 may contain other components such as ceramics in addition to the metal component.

The thickness of the first internal electrode layer 12 and the second internal electrode layer 13 is arbitrary, but can be, for example, about 0.3 μm to 1.5 μm.

A first external electrode 14 is formed on one end surface of the multilayer ceramic body 11. A second external electrode 15 is formed on the other end surface of the multilayer ceramic body 11. The first internal electrode layer 12 is electrically connected to the first external electrode 14. The second internal electrode layer 13 is electrically connected to the second external electrode 15.

The structures of the first external electrode 14 and the second external electrode 15 are arbitrary. It is also preferable to form one or multiple plating electrode layers on the outer surfaces of the first external electrode 14 and the second external electrode 15. However, in Figure 8, the plating electrode layer is omitted.

The material of the main component (metal component) of the lower electrode layer is arbitrary, and for example, Ni, Cu, Ag, Pd, Au, etc. can be used. Additionally, Ni, Cu, Ag, Pd, Au, etc. may be alloyed with other metals. The lower electrode layer may contain other components such as ceramics in addition to the metal component.

The type and number of plating electrode layers are arbitrary, and for example, a Cu plating electrode layer, a Ni plating electrode layer, or a Sn plating electrode layer can be formed.

Below, with reference to FIGS. 9(A) to 12(J), a method for manufacturing the multilayer ceramic capacitor 1000 according to this embodiment will be described.

(1) Production of ceramic slurry (one of the work preparation processes before processing)

Although not shown, dielectric ceramic powder, binder resin, solvent, etc. are prepared and wet mixed to produce a ceramic slurry.

(2) Production of ceramic green sheets (one of the work preparation processes before processing)

A ceramic green sheet 21a for producing the non-conductive layer 11a shown in FIG. 9(A) is produced. The ceramic green sheet 21a is preferably prepared as a mother ceramic green sheet in order to manufacture a plurality of ceramic electronic components in batches. Meanwhile, in the drawing, the mother ceramic green sheet is shown, and the ceramic green sheet 21a, which becomes one ceramic electronic component, is shown divided by a dashed-dotted line.

First, prepare a carrier film (not shown). Next, the ceramic slurry is applied on the carrier film in a sheet shape using, for example, a die coater, gravure coater, micro gravure coater, etc. and dried to produce a ceramic green sheet 21a. The produced ceramic green sheet 21a is peeled off from the carrier film as appropriate in a later process.

Meanwhile, the ceramic green sheet 21a contains a ceramic precursor.

(3) Production of paste for internal electrodes (one of the work preparation processes before processing) / Production of paste for external electrodes

Although not shown, metal powder, binder resin, solvent, etc. are prepared and wet mixed to produce a paste for internal electrodes and a paste for external electrodes. The paste for internal electrodes and the paste for external electrodes may have different materials, material ratios, and viscosity.

(4) Application of paste for internal electrodes (one of the work preparation processes before processing)

As shown in FIG. 9(B), an internal electrode paste 22 for forming a first internal electrode layer 12 and a second internal electrode layer 13 are formed on the main surface of a predetermined ceramic green sheet 21a. The paste 23 for internal electrodes is applied in a desired pattern shape. Meanwhile, the internal electrode paste is not applied to the ceramic green sheet 21a, which becomes the outer layer. The application of the paste for internal electrodes can be performed, for example, by screen printing, inkjet printing, intaglio printing, or relief printing. After coating the internal electrode pastes 22 and 23, drying is performed.

(5) Production of mother ceramic green sheet laminate (one of the work preparation processes before processing)

First, the mother ceramic green sheets 31a shown in Fig. 9(B) are stacked in a predetermined order. The mother ceramic green sheet 31a includes a ceramic green sheet 21a on which the internal electrode paste 22 is applied, a ceramic green sheet 21a on which the internal electrode paste 23 is applied, and no internal electrode paste is applied on the mother ceramic green sheet 31a. A ceramic green sheet (21a) is included. Meanwhile, at this point, the ceramic green sheet 21a is separated from the carrier film.

Next, as shown in FIG. 10(C), a plurality of stacked mother ceramic green sheets 31a are pressed and integrated to produce a mother ceramic green sheet laminate 31. The mother ceramic green sheet laminate 31 includes a plurality of unfired multilayer ceramic bodies 21.

(6) Cutting of mother ceramic green sheet laminate (one of the work preparation processes before processing)

As shown in FIG. 10(D), the mother ceramic green sheet laminate 31 is cut using, for example, a cutting blade 50, and as shown in FIG. 10(E), a plurality of unfired laminated ceramics are formed. Obtain corpuscles (21).

(7)Barrel polishing (one of the work preparation processes before machining)

If necessary, the unfired multilayer ceramic body 21 is subjected to barrel polishing to form a round shape (R) at the corners or ridges of the unfired multilayer ceramic body 21, as shown in FIG. 10(F). The polished uncooked multilayer ceramic body 21 also corresponds to the work before processing.

(8)Jig preparation process

Prepare the jig 100 described above.

(9) Work storage process before processing

Next, as shown in FIG. 11(G), a plurality of unfired multilayer ceramic bodies 21, which are works before processing, are placed on the upper surface of the jig 100 in irregular positions and directions. Then, vibration is applied to the jig 100, and as shown in FIG. 11(H), the unfired multilayer ceramic bodies 21 are stored one by one in each chip storage portion 8 of the jig 100.

After storage is completed, the excess unfired multilayer ceramic body 21 is removed from the jig 100 by a method such as tilting the jig 100 and applying additional vibration.

In this embodiment, since the above-described jig 100 is used, the unfired multilayer ceramic body 21, which is a work before processing, can be appropriately stored in the chip storage portion 8 of the jig 100.

(10) Work processing process (firing process)

As shown in FIG. 11(H), the unfired multilayer ceramic body 21, which is a work before processing, is stored in the jig 100 one by one in each chip storage portion 8 and heated together with the jig 100. and fire it. On the other hand, when the ceramic green sheet 21a contains a resin component, a degreasing process to reduce or remove the resin component by heating or the like may be performed prior to the firing process.

Firing is done at the desired temperature profile. At this time, the ceramic green sheet 21a becomes the non-conductor layer 11a, the internal electrode paste 22 becomes the first internal electrode layer 12, and the internal electrode paste 23 becomes the second internal electrode layer ( 13). Then, the unfired multilayer ceramic body 21 becomes the walk-in fired multilayer ceramic body 11 after processing.

(11) Work removal process after processing

As shown in FIG. 12(I), the work-in multilayer ceramic body 11 after processing is taken out from the chip storage portion 8 of the jig 100.

Since the above-described jig 100 is used in this embodiment, the work-in multilayer ceramic body 11 after processing can be easily taken out from the chip storage portion 8 of the jig 100.

(12) Formation of external electrode (post-process)

As shown in FIG. 13(J), a first external electrode 14 is formed on one end of the work-in multilayer ceramic body 11 after processing, and a second external electrode 15 is formed on the other end.

First, paste for external electrodes is applied to both ends of the multilayer ceramic body 11. Next, the multilayer ceramic body 11 to which the external electrode paste is applied is heated, and the external electrode paste is baked on the surface of the multilayer ceramic body 11 to form the first external electrode 14 and the second external electrode 15. ) to form the lower electrode layer. Next, electroplating, for example, is performed on the surface of the lower electrode layer to form a plating layer consisting of one layer or multiple layers, thereby forming the first external electrode 14 and the second external electrode 15.

(13) Plating (post-process)

Next, electrolytic plating, for example, is applied to the outer surfaces of the first external electrode 14 and the second external electrode 15 to form a plating layer consisting of one layer or multiple layers.

From the above, the multilayer ceramic capacitor 1000 is completed.

In the manufacturing method of the multilayer ceramic capacitor 1000 described above, the unbaked multilayer ceramic body 21 is fired, and after obtaining the fired multilayer ceramic body 11, the paste for external electrodes is applied to both ends of the multilayer ceramic body 11. and baked to form the first external electrode 14 and the second external electrode 15. You can change this method.

Specifically, for example, first, as a work preparation step before processing, paste for external electrodes is applied to both ends of the unfired multilayer ceramic body 21. Then, in the processing process, the external electrode paste is baked to form the first external electrode 14 and the second external electrode 15 at both ends of the multilayer ceramic body 11, respectively.

In this way, the method of forming the first external electrode 14 and the second external electrode 15 may be changed.

[Second Embodiment]

13(A) and 13(B) show a jig 200 for manufacturing electronic components according to the second embodiment. However, Figures 13(A) and 13(B) are cross-sectional views of the jig 200, respectively.

The jig 200 of the second embodiment has a part of the structure of the jig 100 of the first embodiment changed. That is, in the jig 100, a plurality of linear members 3 extending in the vertical direction (X) were arranged in parallel in the horizontal direction (Y) at an arrangement pitch (D). A plurality of linear members 4 extending in the horizontal direction (Y) were arranged in parallel in the vertical direction (X) at an arrangement pitch (E). A plurality of linear members 5 extending in the vertical direction (X) were arranged in parallel in the horizontal direction (Y) at an arrangement pitch (D). A plurality of linear members 6 extending in the horizontal direction (Y) were arranged in parallel in the vertical direction (X) at an arrangement pitch (E). A plurality of linear members 7 extending in the vertical direction (X) were arranged in parallel in the horizontal direction (Y) at an arrangement pitch (D). And the chip storage portion 8 was formed in a matrix shape on the entire main surface of the jig 100.

The jig 200 changed this and made the arrangement pitch, which is the distance between the centers of two adjacent linear members arranged apart from the linear members 3, 4, 5, 6, and 7, partially different. Specifically, for the linear members 3, 5, and 7, a large arrangement pitch (DB) and a small arrangement pitch (DS) were alternately repeated. Additionally, for the linear members 4 and 6, the large arrangement pitch (EB) and the small arrangement pitch (ES) were alternately repeated. Meanwhile, in order to improve breathability as described below, it is preferable that the size of the large batch pitch (DB) is 120% or more of the small batch pitch (DS). Additionally, the size of the large batch pitch (EB) is preferably 120% or more of the small batch pitch (ES).

As a result, a chip accommodating portion 8 that can accommodate the work and a non-chip accommodating portion 28 that cannot accommodate the work are formed on the main surface of the jig 200.

If the chip storage portion 8 is formed on the entire main surface of the jig, ventilation may be reduced due to the accommodated work. On the other hand, in the jig 200 of the second embodiment, the non-chip storage portion 28 that cannot accommodate the work is provided, and thus the ventilation is improved.

[Third Embodiment]

The jig 300 according to the third embodiment also has a part of the structure of the jig 100 according to the first embodiment changed. Meanwhile, drawings are not used in the description of the third embodiment.

In a factory that manufactures multiple types of electronic components or a factory that manufactures multiple products of different sizes, etc. even for the same type of electronic components, for example, multiple types of jigs with different sizes and shapes of the chip storage portion 8 are used. There are cases where it becomes necessary to include and use .

In this case, it is important to be able to easily distinguish the type of jig. This is because if time is required to identify (select) the jig, the productivity of electronic components decreases. Additionally, if the wrong type of jig is used, there is a risk of defects in the characteristics or shape of the manufactured electronic components. For example, this is the case when a small workpiece is processed using a jig including a large chip storage portion 8, or a large workpiece is processed using a jig including a small chip storage portion 8.

Therefore, in order to easily distinguish the type of jig, some parts of the jig 300 (not shown) according to the third embodiment are given unique characteristics that are different from other parts. Different distinctive characteristics are, for example, color. When a color different from other parts is given to a part of the jig 300, it is considered appropriate because it is considered that the ventilation, heat resistance, resistance to physical shock, etc. of the jig 300 will not be reduced. However, the different unique features are not limited to color, and may include changing the shape of the jig 300 or adding a member that serves as a marker.

The jig 100 described above was composed of linear members 1 to 7, and in the jig 300, one type of linear member was colored differently from the other linear members. For example, the color of the linear member 1 is set to be a color selected from a red color, a blue color, a green color, etc., and the color of the other linear members 2 to 7 is gray, etc. made in different colors.

By having such a configuration, in the jig 300 according to the present embodiment, the color of the linear member 1 of the jig 300 with the large chip accommodating portion 8 is a red color, and the chip accommodating portion 8 is a red color. The color of the linear member 1 of the jig 300 with a medium size is a blue color, and the color of the linear member 1 of the jig 300 with a small chip storage portion 8 is a green color. It is possible to have characteristics for identification for each type of jig 300, such as color.

On the other hand, as a method of changing the color of the linear member, for example, there is a method of adding heat-resistant ink, colored zirconia, etc. to the material of the linear member 1. This method is suitable because it does not reduce the heat resistance of the jig 300, especially when the material of the jig 300 includes ceramic.

On the other hand, in the method of changing the color of a linear member, it is more preferable to color the linear member 1 belonging to the first linear member group 1G. Since the linear member 1 belonging to the first linear member group 1G does not come into contact with the work accommodated in the chip storage section 8, it is believed that the influence on the work due to coloring can be eliminated or minimized. Because it becomes.

In the jig 300 according to the third embodiment, it is easy to distinguish between types of jigs.

[Fourth Embodiment]

A jig 400 according to the fourth embodiment is shown in FIGS. 14A and 14B. However, Figures 14(A) and 14(B) are illustrations of the jig 400, respectively.

The jig 400 according to the fourth embodiment also has a part of the structure of the jig 100 according to the first embodiment changed. Specifically, in the jig 400, the jig is composed of a lower part (400A) and an upper part (400B), and both can be separated in the height direction (Z).

The lower portion 400A is formed of linear members 1 to 5. The upper portion 400B is formed of linear members 6 and 7.

The lower portion 400A includes a lower chip storage portion 8f having a lower wall portion 8ca. The upper portion 400B includes an upper chip receiving portion 8g having an upper wall portion 8cb. When the lower portion 400A and the upper portion 400B are combined, the chip accommodating portion 8 is composed of a lower chip accommodating portion 8f and an upper chip accommodating portion 8g. Additionally, the side wall portion 8c is composed of a lower wall portion 8ca and an upper wall portion 8cb. Below, the reason for this configuration will be explained.

In the case of the jig, there are cases where it is better for the head of the work W stored in the chip storage unit 8 to protrude out of the chip storage unit 8 through the opening 8a, and there are cases where it is better for the head not to protrude out of the chip storage unit 8.

For example, when taking out the work W from the chip storage unit 8, it is generally better for the head of the work W to be outside the chip storage unit 8. This is because the smaller the depth of the chip storage portion 8, the easier it is to take out the work W.

On the other hand, when storing the work W in the chip storage section 8, it is generally better for the head of the work W not to protrude outside the chip storage section 8. If the head of the work (W) sticks out of the chip storage section (8), the work (W) that was previously stored in the chip storage section (8) will be moved to another work (W) that has not yet been stored in the chip storage section (8). ) This is because there is a risk of preventing it from being stored in.

The jig 400 according to the fourth embodiment is used by combining the lower portion 400A and the upper portion 400B when storing the work W in the chip storage portion 8, for example. When taking out the work W from (8), the lower part 400A and the upper part 400B can be separated, and only the lower part 400A can be used.

On the other hand, the jig 400 is a jig 400 that combines the lower part 400A and the upper part 400B, and at least one of the lower part 400A is sufficient as long as it satisfies the above equations (1) to (7). . Alternatively, the jig 400 combining the lower part 400A and the upper part 400B and the lower part 400A may complement each other to satisfy the above equations (1) to (7).

[Fifth Embodiment]

A jig 500 according to the fifth embodiment is shown in FIG. 15 . However, Figure 15 is a cross-sectional view of the jig 500.

The jig 500 according to the fifth embodiment also has a part of the structure of the jig 100 according to the first embodiment changed. Specifically, in the jig 100, the size of the opening of the chip storage portion 8 was uniform from the bottom (bottom 8b side) to the top (opening 8a side). In the jig 500, this was changed, and the opening size of the chip storage portion 8 was increased from the lower side (bottom 8b side) to the upper side (opening 8a side).

Specifically, the jig 500 is: diameter of linear member 1 = diameter of linear member 2 = diameter of linear member 3 > diameter of linear member 4 = diameter of linear member 5 > linear member By setting the diameter of (6) to the diameter of the linear member 7, the size of the opening of the chip storage portion 8 was increased from the bottom to the top.

In the jig 500, the size of the opening of the chip storage portion 8 increases from the lower side (bottom 8b side) to the upper side (opening 8a side), making it easier to store and take out the work.

Above, the jigs 100, 200, 300, 400, and 500 for manufacturing electronic components according to the first to fifth embodiments have been described. Additionally, a method for manufacturing an electronic component (multilayer ceramic capacitor) according to the first embodiment using the jig 100 was explained. However, the present invention is not limited to the above-described content and various changes can be made depending on the purpose of the invention.

For example, in the above embodiment, a multilayer ceramic capacitor was manufactured as an electronic component, but the ceramic electronic component manufactured is not limited to a multilayer ceramic capacitor, and instead includes a multilayer ceramic inductor, a multilayer ceramic thermistor, a multilayer ceramic LC component, and a multilayer ceramic capacitor. It may be a stacked electronic component such as a ceramic substrate, or a non-laminated electronic component such as a ceramic resonator, a ceramic filter, a ceramic resistor, a ceramic thermistor, or a ceramic substrate.

In addition, in the electronic component manufacturing method according to the embodiment, the work processing process is a firing process, but the work processing process is not limited to the firing process. Work processing processes include, for example, synthesis process, degreasing process, firing process, cleaning process, drying process, external electrode formation process (paste application, plating, vacuum film formation such as sputtering or vapor deposition), and external shape processing process (edge ) rounding of the part, exposure of the end of the internal electrode, machining, mechanical polishing, sandblasting, chemical etching by liquid or gas phase, processing by laser or plasma, etc.), annealing process, aging process, It may be a polarization process, characteristic selection process, appearance selection process, environmental testing process (may include stress application), etc. In particular, for processes involving heating, using a jig containing ceramic as the material is suitable because it has high heat resistance. In addition, in the process of exposing the work to gas or liquid, it is suitable to use a jig having a through hole in at least one of the bottom and side walls of the chip storage section because it has high air permeability and liquid permeability.

The jig for manufacturing electronic components according to an embodiment of the present invention is as described in the “Means for solving the problem” section.

In this jig, when the cut surface of at least some of the linear members constituting the side wall part belonging to the group of linear members stacked first from the top is circular and the size of the smallest diameter of the cut surface is set to the minimum diameter (R1min), the equation ( It is also desirable that the following equation (8) is satisfied in all chip storage units that satisfy equations (1) and (2).

(W1 ² +(1/4)×L1 ² ) ^1/2 -R1min<d1… (8)

In this case, the workpiece before processing can be easily stored in the chip storage part of the jig.

In addition, the processed workpiece stored in the chip storage unit has a rectangular parallelepiped shape with length (L3), width (W3), and thickness (T3) (L3>W3≥T3), and Equations (1) and (2) are It is also desirable that the following equation (9) is satisfied in all chip storage portions.

(Zmax-L3)<1/2×R1min… (9)

In this case, the workpiece can be easily removed from the chip storage part of the jig after processing.

It is also preferable that the arrangement pitch, which is the distance between the centers of the two adjacent linear members arranged apart from each other in the group of at least one linear member, is partially different. In this case, a non-chip storage portion that cannot accommodate the workpiece can be provided in addition to the chip storage portion, and the ventilation of the jig is improved. In this case, it is also desirable that the size of the largest batch pitch is 120% or more of the smallest batch pitch. In this case, the jig's ventilation is further improved.

It can be separated into a plurality of parts (for example, a lower part and an upper part) in the height direction, and it is also preferable that the parts each include linear members belonging to two or more linear member groups. In this case, it is possible to use the lower part and the upper part by combining them when storing the work in the chip storage part, and to separate the lower part and the upper part and use only the lower part when taking the work out of the chip storing part. Because. This is because both storage of the work into the chip storage section and removal of the work from the chip storage section can be facilitated.

It is also desirable for some of the linear members to include unique features that make them different from other parts or all of the other members. Different distinctive characteristics are, for example, color. In this case, identification (selection) of the jig type becomes easier.

A method of manufacturing an electronic component according to an embodiment of the present invention includes a pre-processing work preparation process of preparing a plurality of pre-processing works, and a processing of storing the pre-processing work in the chip storage portion of the electronic component manufacturing jig of the present invention described above. It includes a pre-work storage process, a work machining process in which the pre-machined work stored in the chip storage part of the jig is machined to produce a post-machined work, and a post-machined work removal process in which the processed work is taken out from the chip storage part of the jig. Let's do it. In this case, unevenness in the characteristics or shape of the manufactured electronic components can be suppressed.

In this case, the pre-machining work storage process is performed by placing a plurality of pre-machined workpieces on a jig in irregular positions and directions, applying vibration to the jig, and/or tilting the jig. It is also desirable to store the work in the chip storage unit. In this case, the workpiece before processing can be easily stored in the chip storage portion.

It is also preferable that the work processing process is a firing process in which the work is fired before processing. In this case, it is possible to prevent the work pieces from adhering to each other after processing.

1~7: Linear members
1G: First line member group
2G: Second line member group
3G: Third line member group
4G: 4th line member group
5G: Fifth Line Member Group
6G: 6th Line Member Group
7G: 7th Line Member Group
8: Chip storage unit
8a: opening
8b: bottom part
8c: side wall portion
8d: bottom through hole
8e: Side wall through hole
11: Multilayer ceramic body
11a: non-conductive layer
12: first internal electrode layer
13: second internal electrode layer
14: first external electrode
15: Second external electrode
21: Unfired multilayer ceramic body
21a: Ceramic green sheet
22, 23: Paste for internal electrodes
100: Multilayer ceramic condenser (ceramic electronic components)

Claims (11)

It has a vertical direction, a horizontal direction orthogonal to the vertical direction, and a height direction orthogonal to the vertical direction and the horizontal direction,
It includes a plurality of chip storage portions open upward in the height direction,
After storing a rectangular parallelepiped-shaped workpiece with a length (L1), a width (W1), and a thickness (T1) (L1>W1≥T1) in each of the plurality of chip storage units, processing is performed on the workpiece before processing, A jig for manufacturing electronic components assuming that the workpiece before processing is processed into a workpiece after processing,
It has a plurality of linear member groups stacked in the height direction,
The linear member group each includes a plurality of linear members arranged in parallel and spaced apart from each other,
When viewed in the height direction, the linear members of the linear member group laminated on a predetermined layer and the linear members of another linear member group laminated on another adjacent layer intersect each other,
Each of the chip storage units has a bottom portion that supports the workpiece before processing from below in the height direction, and a side wall portion that partitions another adjacent chip storage portion,
The bottom portion is composed of one or more linear members belonging to one linear member group,
The side wall portion is composed of one linear member belonging to one linear member group or two or more linear members each belonging to two or more linear member groups,
When a virtual rectangular parallelepiped with length (L2), width (W2), and thickness (T2) (W2 ≥ T2) is inserted into the chip storage unit in the longitudinal direction, the width (W2) × thickness ( The cuboid with the maximum T2) is considered the maximum cutting surface cuboid,
When the maximum cross-section rectangular cuboid is in contact with the bottom of the chip accommodating section, and the cross section in contact with the bottom of the maximum cross-section cuboid is taken as the maximum virtual bottom surface of the chip accommodating section, the maximum The virtual floor surface has a long side (d1) and a short side (d2) (d1=d2 may be optional),
The dimension between the maximum virtual floor extending in the normal direction from the maximum virtual floor and the ceiling surface of the linear member belonging to the linear member group first stacked from above is defined as the maximum depth of the chip storage portion (Zmax) ),
The minimum depth of the chip storage portion (Zmin) is the dimension between the maximum virtual floor extending in the normal direction from the maximum virtual floor and the ceiling surface of the linear member belonging to the linear member group stacked second from the top. When ,
A jig for manufacturing electronic components, wherein all of the chip accommodating parts that satisfy Equations (1) and (2) among the plurality of chip accommodating parts satisfy all of Equations (3) to (7).
W1<d1… (One)
T1<d2… (2)
d1<2W1… (3)
d2<2T1… (4)
1/2×L1<Zmin… (5)
Zmax<3/2×L1… (6)
d1<L1… (7) According to paragraph 1,
When the cut surface of at least some of the linear members constituting the side wall and belonging to the linear member group first stacked from above is circular and the size of the smallest diameter of the cut surface is set to the minimum diameter (R1min),
A jig for manufacturing electronic components that satisfies the following equation (8) in all chip storage parts that satisfy equations (1) and (2).
(W1 ² +(1/4)×L1 ² ) ^1/2 -R1min<d1… (8) According to claim 1 or 2,
The processed workpiece stored in the chip storage unit has a rectangular parallelepiped shape with a length (L3), a width (W3), and a thickness (T3) (L3>W3≥T3),
A jig for manufacturing electronic components that satisfies the following equation (9) in all chip storage parts that satisfy equations (1) and (2).
(Zmax-L3)<1/2×R1min… (9) According to any one of claims 1 to 3,
In at least one group of linear members,
A jig for manufacturing electronic components in which the arrangement pitch, which is the distance between the centers of the two adjacent linear members arranged apart from each other, is partially different. According to paragraph 4,
A jig for manufacturing electronic components, wherein the size of the largest batch pitch is 120% or more of the smallest batch pitch. According to any one of claims 1 to 5,
Can be separated into a plurality of parts in the height direction,
A jig for manufacturing electronic components, wherein the portion includes two or more linear members belonging to the linear member group. According to any one of claims 1 to 6,
A jig for manufacturing electronic components, wherein some of the linear members include unique features that are different from those of some or all of the other linear members. In clause 7,
The above different and unique features are indicative of the jig for manufacturing electronic components. A pre-processing work preparation process for preparing a pre-processing work as set forth in claim 1;
A pre-processing work storage step of storing the pre-processing work in the chip storage portion of the electronic component manufacturing jig according to any one of claims 1 to 8;
A work machining process of processing each of the pre-machined works stored in the chip storage portion of the jig to obtain a after-machined work,
A method of manufacturing an electronic component, including a post-processed work removal process of removing the processed work from the chip storage portion of the jig. According to clause 9,
The work storage process before the above processing,
Holding a plurality of the pre-processed works on the jig without restricting their positions and directions,
A method of manufacturing an electronic component, wherein the plurality of unprocessed works mounted on the jig are stored in the chip storage unit by vibrating the jig and/or tilting the jig. According to claim 9 or 10,
A method of manufacturing an electronic component, wherein the work processing step is a firing step of heating the work before processing with the jig and firing the work before processing.