KR20230128184A - How to manufacture micro connectors using solder, and the products thereof and the manufacturing devices for them - Google Patents
How to manufacture micro connectors using solder, and the products thereof and the manufacturing devices for them Download PDFInfo
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- KR20230128184A KR20230128184A KR1020220025232A KR20220025232A KR20230128184A KR 20230128184 A KR20230128184 A KR 20230128184A KR 1020220025232 A KR1020220025232 A KR 1020220025232A KR 20220025232 A KR20220025232 A KR 20220025232A KR 20230128184 A KR20230128184 A KR 20230128184A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 title description 12
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 230000005611 electricity Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 11
- 238000000576 coating method Methods 0.000 abstract description 8
- 239000006071 cream Substances 0.000 abstract description 6
- 238000007747 plating Methods 0.000 abstract description 5
- 238000001179 sorption measurement Methods 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract description 4
- 239000004020 conductor Substances 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 238000005553 drilling Methods 0.000 abstract 1
- 238000012216 screening Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 5
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/707—Soldering or welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
본 발명은 비전도성 기판에 드릴 및 레이저를 사용하여 관통홀(Via)을 뚫는 단계, 그 관통홀 (Via) 내부 안쪽을 전도성 물질로 코팅 또는 금속을 이용한 도금 처리하는 단계, 관통홀(Via) 내부에 솔더 크림을 스크린(인쇄) 후 별도의 '가압 + 진공 흡착 + 가열 + 시간 설정의 변경 등' 이 용이한 설비를 개발하여 작업하는 것으로 관통홀 내부에 솔더 충진을 진행하는 단계, 이 단계에서 프레스와 흡착 기능을 접목한 장치를 개발하는 단계. 이로 인해 직경 수십 ~ 수백㎛급에 일정한 높이를 갖는 마이크로 커넥터 제품 및 공정 장치에 대하여 제시한다. The present invention includes the steps of drilling a through hole (Via) in a non-conductive substrate using a drill and a laser, coating the inside of the through hole (Via) with a conductive material or plating using a metal, and the inside of the through hole (Via). After screening (printing) the solder cream on the screen (printing), a separate 'pressurization + vacuum adsorption + heating + change of time setting' is developed and worked to process solder filling inside the through-hole. Step of developing a device that incorporates adsorption and adsorption functions. As a result, micro connector products and process devices having a constant height in the range of tens to hundreds of μm in diameter are presented.
Description
본 발명은 솔더볼을 이용한 마이크로 커넥터 제조 방법과 이에 의한 마이크로 커넥터 및 이를 위한 제조 장치에 관한 것이다.The present invention relates to a micro connector manufacturing method using a solder ball, a micro connector using the same, and a manufacturing apparatus therefor.
전자부품은 일반적으로 플럭스와 솔더볼을 사용하여 실장하는 방법과 솔더 크림을 사용하여 인쇄 후 SMT(표면실장)하는 방법으로 기판에 실장될 수 있다. 최근 전자기기, 특히 모바일 기기의 소형화 요구에 따른 다양한 패키지 기술 도입 필요에 따라 SMT실장 시에도 기판간 적층이 필요해지는 공정(PoP : Package on Package 또는 SiP : System in Package라고 칭함)이 있고, 일반적으로 솔더볼을 사용하여 상,하 기판 간의 간격 유지 및 전기 도통을 도모하고 있다. 뿐 아니라 반도체IC의 연결 구성을 위해 RDL(배선재배치)를 통한 차세대 반도체 패키지인 WLP(Wafer level Package), PLP(Panel Level Package)에도 점차 미세한 솔더 범프의 채용이 늘어나는 추세이다. 다만 이럴 경우, 일반적인 솔더볼은 SMT 후 Reflow 시 고온 환경에서 녹게 되면서 미세 간격시 솔더 볼간 흐름에 따른 쇼트 불량이 발생하게 되며, 솔더 볼 직경 관리도 곤란하게 되며, 고온 Melting 시 솔더가 물러지고, 상부에 있는 기판이 주저 않으면 단차 발생, 제품의 위치 틀어짐(Tilt), 이로 인해 솔더 범프간의 브릿지(흘러 붙음) 현상에 따른 Short 불량, Void 발생, Crack 등 다양한 문제가 발생하게 된다. 최근엔 이를 해결하고자 Cu Core ball이라는 새로운 형태의 Solder ball을 사용하기도 하지만, 기존 Solder ball 대비 단가가 10배 이상 비싸고, 아직은 다양한 사이즈 대응이 어려워 특정 제품에만 적용이 되고 있다. Cu Core ball 적용 시 기판의 Tilt에 의한 불량 발생을 방지 할 수 있어 기판 적층형 SiP에는 매우 유용하고, 기존 솔더볼 실장 장비를 사용할 수 있는 장점이 있다. 하지만, Cu Core ball 역시 둥근 형태로 제작이 되어 높이와 피치(전극간 간격)가 1:1로 배치되어야 한다. 이러한 설계에 대한 문제점은 기존 솔더볼과 마찬가지이며, 기판간 전극 배치 및 적층 Gap(상, 하 기판간의 간격)에 한계가 있고, 이런 문제점 극복을 위한 새로운 연결 방식의 커넥터 개발이 필요해지게 되었다.In general, electronic components may be mounted on a board by a method of mounting using flux and solder balls or a method of surface mounting (SMT) after printing using solder cream. Recently, there is a process (referred to as PoP: Package on Package or SiP: System in Package) that requires stacking between boards even during SMT mounting, according to the need to introduce various package technologies according to the demand for miniaturization of electronic devices, especially mobile devices. A solder ball is used to maintain the gap between the upper and lower boards and promote electrical conduction. In addition, the adoption of fine solder bumps is gradually increasing in WLP (Wafer level Package) and PLP (Panel Level Package), which are next-generation semiconductor packages through RDL (Wiring Relocation) for the connection configuration of semiconductor ICs. However, in this case, general solder balls melt in a high-temperature environment during reflow after SMT, and short-circuit defects occur due to the flow between solder balls at minute intervals, and it is difficult to manage the diameter of the solder balls. If the board is not hesitant, various problems such as level difference, displacement of the product (tilt), short defect, void, and crack due to the bridging (sticking) phenomenon between solder bumps occur. Recently, a new type of solder ball called Cu Core ball is used to solve this problem, but the unit price is more than 10 times higher than the existing solder ball, and it is still applied to specific products because it is difficult to respond to various sizes. When applying Cu core ball, it is very useful for board stacked SiP as it can prevent defects caused by board tilt, and has the advantage of being able to use existing solder ball mounting equipment. However, the Cu Core ball is also manufactured in a round shape, so the height and pitch (interelectrode spacing) must be arranged in a 1:1 ratio. The problems with this design are the same as with the existing solder balls, and there are limitations in electrode arrangement between boards and stacking gap (interval between upper and lower boards), and it is necessary to develop a new connection type connector to overcome these problems.
통상적으로 구형 상태로 제작되는 기존 솔더볼 방식은 측면에서 제약이 발생하여 기판 간 전극 배치 및 적층 Gap (상, 하 기판 간의 간격) 에 한계가 있고, 예를 들어 소형 전자 기기용 SIP 제품에 대해 최소 피치 200㎛에 대응이 되면서 높이 500㎛ 급의 전기 도통이 필요한 기둥 형태의 커넥터 제품의 필요성이 생기고 있다. 이를 해결하여 미세 피치 급의 본딩에 적합하도록 현 제작 단계에 적용이 가능한 마이크로 커넥터 제조 방법과 이에 의한 마이크로 커넥터 및 이를 위한 제조 장치를 제공하는 것을 목적으로 한다.The conventional solder ball method, which is normally manufactured in a spherical state, has limitations in electrode placement between boards and stacking gap (interval between upper and lower boards) due to side restrictions, and for example, the minimum pitch for SIP products for small electronic devices As it corresponds to 200㎛, there is a need for a column-shaped connector product that requires electrical conduction with a height of 500㎛. It is an object of the present invention to solve this problem and to provide a micro connector manufacturing method applicable to the current manufacturing stage to be suitable for fine pitch class bonding, a micro connector thereby, and a manufacturing apparatus therefor.
상기 목적을 달성하기 위한 본 발명 마이크로 커넥터는 별도의 비전도성기판(예를 들어 FR-4, FPCB, 세라믹, 필름 형태 등)에 드릴 및 레이저를 사용하여 관통 홀(Via)을 뚫고, 그 관통 홀의 내부 안쪽을 전도성 물질로 코팅 또는 금속을 이용한 도금 처리를 행하여 준비한다. 이후 솔더 크림을 스크린(인쇄)한 후 별도로 `가압 + 진공흡착 + 가열 + 시간 설정의 변경 등`이 용이한 설비를 개발하여 작업을 행하는 것으로 관통홀 내부에 솔더 충진을 진행하는 방법으로 압력(프레스)와 흡착기능을 접목한 장치 방식이 된다. 이로 인해 지름 수십 ~ 수백㎛ 급에 일정한 높이(기판두께와 비례)를 갖는 마이크로 커넥터 및 공정 장치 개발로 해결하게 된다.In the micro connector of the present invention to achieve the above object, a through hole (Via) is drilled in a separate non-conductive substrate (eg, FR-4, FPCB, ceramic, film form, etc.) using a drill and a laser, and the through hole is The inner side is prepared by coating with a conductive material or plating using a metal. Thereafter, after screen (printing) the solder cream, separately develop equipment that facilitates 'pressurization + vacuum adsorption + heating + change of time setting, etc.' ) and an adsorption function. This will be solved by developing micro connectors and process devices with a constant height (proportional to the substrate thickness) in the range of tens to hundreds of μm in diameter.
*본 발명인 마이크로 커넥터 제조 방법과 이에 의한 마이크로 커넥터 및 이를 위한 제조 장치는 미세 피치의 본딩과 미세 전극 연결이 필요한 제품에 적용할 수 있으며 100㎛ 이하 마이크로 솔더 적용이 되고 있는 반도체 패키지 공정(FC-CSP, FC-BGA)의 대체 방법으로도 활용할 수 있다. 또한, 솔더볼 및 CCSB(Cu-Core Solder Ball)를 적용하고 있는 제품에도 활용할 수 있다. 그 외 WLP(Wafer Level Package), PLP(Panel Level Package)와 같이 표면 열팽창 계수에 따른 제품 관리가 곤란한 제품에도 유용하게 활용이 가능하다. * The present invention micro connector manufacturing method, micro connector and manufacturing apparatus therefor can be applied to products requiring fine pitch bonding and fine electrode connection, and the semiconductor package process (FC-CSP) where micro solder is applied under 100㎛ , FC-BGA) can also be used as an alternative method. In addition, it can be used for products to which solder balls and CCSB (Cu-Core Solder Ball) are applied. In addition, it can be usefully used for products such as WLP (Wafer Level Package) and PLP (Panel Level Package), which are difficult to manage according to the surface thermal expansion coefficient.
본 발명된 마이크로 커넥터는 전자부품 간 일정한 높이 유지가 가능한 제품을 제작할 수 있다. The micro connector of the present invention can manufacture a product capable of maintaining a constant height between electronic components.
본 발명된 마이크로 커넥터는 원하는 사이즈 및 간격별로 가공이 용이하게 할 수 있다.The micro connector according to the present invention can be easily processed for each desired size and spacing.
본 발명된 마이크로 커넥터용 기판 표면 처리 정도에 따라 별도의 Under-Fill이 불필요 함으로 제품 제작 공정의 단축 및 신뢰성 확보가 가능하다. Depending on the degree of substrate surface treatment for micro connectors according to the present invention, a separate under-fill is not required, so it is possible to shorten the manufacturing process and secure reliability.
본 발명된 마이크로 커넥터는 기존 마이크로 솔더 대비 제작이 용이함과 CCSB(Cu-Core Solder Ball) 채용에 필요했던 적층 시 높이 유지의 장점이 있어 향후 초소형 전자부품의 실장 시장에 확대 적용성이 높게 된다.The micro connector of the present invention has the advantage of being easier to manufacture compared to the existing micro solder and maintaining the height during lamination, which was necessary for adopting CCSB (Cu-Core Solder Ball), so that it has high applicability to the future microelectronic component mounting market.
도 1은 비전도성기판(FR-4, FPCB, 세라믹, 필름 형태 등)을 준비한 것으로 주요 구성은 비전도성기판 (1) 과 상하면에 구성된 Release Layer(2, 3)을 준비한다.
이때, Release layer (2, 3) 은 필름 형태나 인쇄 방식의 코팅 형태로도 준비할 수 있다.
도 2는 비전도성기판 (1) 에 원하는 피치에 맞게 홀 사이즈 및 기판의 높이를 설정하여, 드릴(4) 및 레이저(5)로 관통홀 (7) 을 가공한 도면이다.
도 3은 관통홀 (7) 의 내부 안쪽을 전도성 물질 코팅(6) 또는 금속을 이용한 도금 처리 (6) 를 행한 도면이다.
도 4은 관통 홀 (7) 내부에 솔더크림 (8) 을 충진 된 도면이다.
도 5는 필요에 따라 Release layer (2, 3) 을 제거한 것으로 2 또는 3을 같이 제거하거나, 한쪽만 제거할 수도 있다.
Release layer가 필름인 경우에는 Detach 하면 되며, 필요에 따라 UV 경화반응 형태로 쉽게 박리할 수 있으며, 코팅 방식인 경우 적합한 약품으로 이용하여 제거할 수 있다.
또는 해당 Release layer는 열에 의해 경화 반응을 일으키는 점착성 또는 접착성분을 지닌 재료로 선택적으로 적용할 수 있다.
도 6은 도5 후 Reflow 작업을 진행한 모습이다.
도 7은 마이크로 컨넥터의 기술로 만들 수 있는 일정한 비율의 모양이다.
도 8은 마이크로 컨넥터의 기술로 만들 수 있는 랜덤 크기 배열의 모양이다.
도 9는 마이크로 컨넥터의 기술로 만들 수 있는 지그재그 배열의 모양이다.
도 10은 마이크로 컨넥터의 기술로 만들 수 있는 Cavity 배열의 모양이다.Figure 1 shows that a non-conductive substrate (FR-4, FPCB, ceramic, film type, etc.) is prepared, and the main configuration is to prepare a non-conductive substrate (1) and release layers (2, 3) composed of the upper and lower surfaces.
At this time, the release layer (2, 3) can be prepared in the form of a film or a coating method of printing.
FIG. 2 is a view of processing through holes 7 with a drill 4 and a laser 5 by setting the hole size and the height of the substrate according to a desired pitch in the non-conductive substrate 1 .
FIG. 3 is a view in which the inside of the through hole 7 is subjected to plating treatment 6 using a conductive material coating 6 or metal.
4 is a view of filling the through hole 7 with solder cream 8.
5 shows that release layers (2 and 3) are removed as needed, and 2 or 3 may be removed together or only one side may be removed.
If the release layer is a film, it can be detached, and if necessary, it can be easily peeled off in the form of a UV curing reaction, and in the case of a coating method, it can be removed using a suitable chemical.
Alternatively, the corresponding release layer can be selectively applied as a material with an adhesive or adhesive component that causes a curing reaction by heat.
Figure 6 is a state of progressing the reflow work after Figure 5.
7 is a shape of a constant ratio that can be made with micro connector technology.
8 is a shape of a random size array that can be made with micro connector technology.
9 is a shape of a zigzag arrangement that can be made with micro connector technology.
10 is a shape of a cavity array that can be made with micro connector technology.
비전도성 기판 및 필름 형태에 관통홀을 뚫고 내부에 도전성을 지니게Through-holes are made in the form of non-conductive substrates and films to have conductivity inside.
내부 도금을 행한 후 솔더크림으로 충진하여 제작한 상하 연결용 전기Electricity for vertical connection made by filling with solder cream after internal plating
부품인 커넥터의 일종 형태가 되겠다. It will be a type of connector, which is a part.
1 : 비전도성 기판 (FR-4, FPCB, 세라믹, Film형태의 제품)
2 : Release layer (코팅 방식, Film방식 등)
3 : Release layser (코팅 방식, Film방식 등)
4 : Drill 작업 (관통홀 작업)
5 : Laser 작업 (관통홀 작업)
6 : 전도성 물질 코팅, 금속 도금 처리
7 : 4,5번의 작업 후 관통홀(Via)
8 : 7번 공간에 솔더크림 충진 작업1: Non-conductive substrate (FR-4, FPCB, ceramic, film type product)
2: Release layer (coating method, film method, etc.)
3 : Release laser (coating method, film method, etc.)
4 : Drill work (through hole work)
5 : Laser work (through hole work)
6: Conductive material coating, metal plating treatment
7 : Through hole (Via) after working 4,5 times
8 : Filling solder cream in space No. 7
Claims (4)
An electronic component module and package product to which the product according to claim 1 is applied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020220025232A KR20230128184A (en) | 2022-02-25 | 2022-02-25 | How to manufacture micro connectors using solder, and the products thereof and the manufacturing devices for them |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020220025232A KR20230128184A (en) | 2022-02-25 | 2022-02-25 | How to manufacture micro connectors using solder, and the products thereof and the manufacturing devices for them |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20230128184A true KR20230128184A (en) | 2023-09-04 |
Family
ID=88018527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020220025232A KR20230128184A (en) | 2022-02-25 | 2022-02-25 | How to manufacture micro connectors using solder, and the products thereof and the manufacturing devices for them |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20230128184A (en) |
-
2022
- 2022-02-25 KR KR1020220025232A patent/KR20230128184A/en not_active Application Discontinuation
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| Date | Code | Title | Description |
|---|---|---|---|
| E902 | Notification of reason for refusal | ||
| E902 | Notification of reason for refusal | ||
| E601 | Decision to refuse application | ||
| E601 | Decision to refuse application |