KR20230118645A - Rollers for Carrier Transport Assemblies, Substrate Processing Systems, Methods of Maintaining Substrate Processing Systems, and Methods of Manufacturing Devices - Google Patents

Abstract

A roller for a carrier transport assembly is described. The roller includes a roller body that is rotatable and has a substrate support surface; a roller casing surrounding at least a portion of the roller; and a trapping surface of the roller casing, the trapping surface having at least a first surface portion facing the roller.

Description

Rollers for Carrier Transport Assemblies, Substrate Processing Systems, Methods of Maintaining Substrate Processing Systems, and Methods of Manufacturing Devices

[0001] Embodiments relate to contamination reduction in substrate processing systems and/or substrate processing apparatuses. Embodiments further relate to trapping of contaminants and/or cleaning of a carrier in or within a vacuum processing system. Embodiments relate inter alia to particle capture devices, particle removal devices, transfer systems, load lock chambers and vacuum processing systems.

[0002] Often, substrates are coated at pressures within the range of 5*10 ^-4 hPa to 0.5 hPa under high vacuum conditions, for example in vacuum coating plants. Loadlocks and unloadlocks for substrates are used to increase plant productivity and avoid the need to evacuate the entire facility for each substrate, especially the high vacuum section.

[0003] For example, in flat panel display production, particles from both the mechanical components of the processing system and the process itself are a major contributor to yield loss. Therefore, the demand to reduce contamination during vacuum processes has increased in recent years. Particle contamination can occur, for example, when a transport system or components of a process system generate particles during processing, when a substrate to be processed introduces particles into an evacuated process system, and the like. For example during transport of the substrate carrier or the substrate respectively, for example mechanical friction may cause particle generation. During operation, the deposition system has a number of possible sources of contaminating particles that affect product quality.

[0004] Cleaning and replacement of components, as well as continuous vacuum pumping in the process system, are ways to reduce the risk of product contamination. As mentioned above, the process is advantageously performed in the fastest and most efficient manner possible. Cleaning and exchange procedures are time consuming for maintenance, which reduces production time.

[0005] For example, in a physical vapor deposition (PVD) system, a substrate may be transported by a moving substrate carrier. The substrate carrier may be in rolling contact with a number of support rollers. Frictional wear from the contact zone causes particle release and particle generation. Device yield loss can be caused when particles fall on the substrate, for example as an on-film defect. The reduction of particles that can negatively impact substrate processing results in improved yield and eventually commercial benefits.

[0006] Reducing the number of particles that affect substrate processing may be provided by a) reducing particle generation and b) capturing or collecting the particles generated so that they do not affect substrate processing. Capturing particles, such as transport particles, allows to reduce pre- and post-deposition particle adders on the substrate, as well as subsequent particle-induced defect formation and yield loss. The improvement of killer defects, particularly those due to metal conductive particles, has a great leverage, since a yield improvement of as much as 1%-point for one production system easily provides large revenue opportunities. Because you can.

[0007] In view of the above, it would be advantageous to provide a particle reduction device, an improved loadlock chamber, an improved vacuum processing system, and an improved method of transporting and/or cleaning carriers in a vacuum processing system.

[0008] According to the present invention, the roller for the carrier transport assembly according to claims 1 to 8, the substrate processing system according to claims 9 to 11, and the substrate processing system according to claims 12 and 13 are maintained. A method for maintaining and a method for manufacturing the device according to claim 14 are provided.

[0009] According to one embodiment, rollers are provided for a carrier transport assembly. The roller includes a roller body that is rotatable and has a substrate support surface; a roller casing surrounding at least a portion of the roller; and a trapping surface of the roller casing, the trapping surface having at least a first surface portion facing the roller.

[0010] According to one embodiment, a substrate processing system is provided. The substrate processing system includes a carrier transport assembly, the carrier transport assembly having a plurality of rollers arranged along a transport direction of the carrier transport assembly, each roller of the plurality of rollers being a roller according to embodiments of the present disclosure. .

[0011] According to one embodiment, a method of maintaining a substrate processing system is provided. The method includes removing a plurality of roller casings from a plurality of rollers of a carrier transport assembly; cleaning or removing the capture surface of each of the plurality of roller casings; and assembling the plurality of rollers by providing a roller casing to each of the rollers.

[0012] According to one embodiment, a method of manufacturing a device is provided. The method includes transporting a carrier supporting a substrate by a carrier transport assembly having a plurality of rollers, the transport including rotation of a roller body relative to each of the rollers; trapping the particles generated by the roller in a roller casing having a trapping surface; and processing or depositing one or more thin film layers of the device.

[0013] According to one embodiment, a carrier cleaning head is provided for cleaning a carrier moving along a transport direction. The carrier cleaning head includes a cleaning head body having a first conduit and a second conduit; two or more pairs of brushes - each pair of brushes having a first brush extending in a first direction and a second brush extending in a second direction opposite the first direction, the brushes of the pairs extending along a conveying direction; Arranged—; a first opening assembly in fluid communication with the first conduit and configured to provide a purge gas; and a second aperture assembly in fluid communication with the second conduit and configured for particle removal.

[0014] According to one embodiment, a substrate processing system is provided. The substrate processing system includes a first vacuum chamber having a first wall; and a carrier cleaning head according to embodiments of the present disclosure, the carrier cleaning head being arranged adjacent to the first wall, in particular outside the first vacuum chamber.

[0015] According to one embodiment, a method of maintaining a substrate processing system is provided. The method includes removing a plurality of brushes of two or more pairs of brushes from a cleaning head body of a carrier cleaning head; cleaning a plurality of brushes; and assembling the carrier cleaning head by providing clean brushes.

[0016] According to one embodiment, a method of manufacturing a device is provided. The method includes transferring a carrier supporting a substrate into a substrate processing system having a loadlock chamber; capturing particles adhering to the carrier using a carrier cleaning head according to embodiments of the present disclosure; and processing or depositing one or more thin film layers of the device.

[0017] In such a manner that the above-listed features of the present invention may be understood in detail, a more detailed description of the present invention briefly summarized above may be made with reference to the embodiments. The accompanying drawings relate to embodiments of the present invention and are described below:
1 shows a diagram of a transport system for transporting a carrier according to embodiments described herein;
[0019] Figure 2 shows a schematic cross-sectional view of a carrier transport system that can be used with embodiments described herein;
[0020] FIG. 3 shows a perspective view of a roller assembly of a transport system, eg the transport system shown in FIG. 1 or 2, including a particle reduction device according to embodiments of the present disclosure;
[0021] FIG. 4A shows a perspective view of a roller assembly of a transport system, eg, the transport system shown in FIG. 1 or 2, including a particle reduction device according to embodiments of the present disclosure;
[0022] FIG. 4B shows a perspective view of a roller assembly of a transport system, eg, the transport system shown in FIG. 1 or 2, including a particle reduction device according to embodiments of the present disclosure;
[0023] Figure 5 shows a schematic diagram of a particle reduction device, in particular a particle removal device, according to embodiments described herein, having a brush, gas nozzles and a suction port for cleaning of a carrier;
[0024] Figure 6 shows a schematic diagram of a particle reduction device, in particular a particle removal device, according to embodiments described herein, having a brush, gas nozzles and a suction port for cleaning of a carrier;
[0025] FIGS. 7A and 7B show enlarged views of a particle reduction device according to embodiments described herein and as shown, for example, in FIGS. 5 and/or 6;
[0026] Figure 8 shows a portion of a vacuum processing system that includes a particle trap according to embodiments described herein, wherein the particle trap includes rollers having a trapping surface in a roller casing and a carrier cleaning head. contains;
[0027] FIG. 9 shows a flow diagram illustrating methods of maintaining a substrate processing system, including replacing brushes of a carrier cleaning head and replacing carrier casings having a capture surface, in accordance with embodiments of the present disclosure. and;
[0028] FIG. 10 shows a flow diagram illustrating methods of fabricating a device that includes particle capture according to embodiments of the present disclosure to reduce the number of particles that affect substrate processing.
[0029] For ease of understanding, like reference numbers have been used where possible to designate like elements that are common to the drawings. It is contemplated that elements and features disclosed in one embodiment may be beneficially utilized on other embodiments without specific recitation.

[0030] Reference will now be made in detail to various embodiments, one or more examples of which are illustrated in the drawings. In general, only differences for individual embodiments are described. Additionally, features illustrated or described as part of one embodiment may be used on or in conjunction with other embodiments to yield a still further embodiment. The description is intended to cover such modifications and variations.

[0031] According to embodiments of the present disclosure, devices and methods are provided that enable reducing the number of particles that can affect substrate processing. According to some embodiments, the particles are captured after they are generated. Moreover, according to additional or alternative embodiments, the particles are removed from the carrier and captured after generation of the particles. Compared to other concepts aimed at reducing particle generation, embodiments of the present disclosure relate to the capture of particles after their generation.

[0032] According to some embodiments, a method and device for particle capture during substrate transfer in a PVD system is provided. Particles generated in the substrate transport system, for example rollers for supporting the carrier, are drawn to a predetermined position. Thus, particles can be prevented from falling onto a substrate, for example a glass substrate. A mechanical trapping mechanism may be provided in the rolling contact area.

[0033] According to some embodiments, methods and devices for in-situ cleaning and particle removal of particles from a carrier in a PVD system are provided. For example, particles attached to a carrier can be removed from the carrier and drawn to a predetermined location. Thus, particles can be prevented from falling onto a substrate, for example a glass substrate. For example, a cleaning device may be provided for particle removal from each moving carrier.

[0034] Thus, entrapment of the particles can reduce the number of particles that can negatively affect substrate processing. Moreover, additionally or alternatively, maintenance can be simplified, and thus product maintenance time can be reduced. Due to the capture of the particles at a predetermined location, cleaning procedures during product maintenance can be simplified.

[0035] 1 shows a carrier 10 supported by rollers 100 of a carrier transport assembly. The carrier 10 may include a frame 12 . For example, frame 12 may include one or more frame bars. Additionally, the carrier 10 may include a plurality of clamps 11 . The clamps 11 support the substrate 13 on the carrier 10 . According to some embodiments, which can be combined with other embodiments described herein, the carrier 10 can include a rod 14. Rod 14 may have a cylindrical cross section. According to some embodiments, which can be combined with other embodiments described herein, the carrier can also include a bar or rail, for example a flat rail. A rod, rail or bar is provided on one or more of the frame bars and is configured to contact one or more rollers 100 of the carrier transport assembly. In the example shown in FIG. 1 , a rod, rail or bar is attached to the frame, for example by way of one or more connecting elements such as connecting bridges.

[0036] The carrier transport assembly may include a plurality of rollers 100 . Two rollers are exemplarily shown in FIG. 1 . The rollers 100 may support the weight of the carrier 10 or at least a portion of the weight of the carrier 10 (see also FIG. 2). Additionally, the rollers 100 may be configured to convey the carrier along the conveying direction. For example, the rollers can be driven to rotate and/or move the carrier along the transport direction. Rollers 100 include a roller body 102 . The roller body 102 is rotatable about an axis. Additionally, the rollers include a substrate support surface 104 . According to some embodiments, the substrate support surface 104 can be a cylindrical surface. According to still other embodiments, which can be combined with other embodiments described herein, the substrate support surface can be shaped to be concave. The concave shaped substrate support surface 104 may correspond to the cylindrical shape of the rod 14 as exemplarily shown in FIG. 1 . A substrate support surface shaped to include a recess, for example a recess along the circumference of the roller body 102, can at least partially receive a rod or bar. Thus, the carrier 10 can be guided along the conveying direction by means of the contact surface.

[0037] The roller 100 includes a roller casing 110 . The roller casing 110 encloses at least a portion of the roller, in particular the substrate supporting surface 104 of the roller 100 . The roller casing includes a catch surface (112). 1 shows two capture surfaces 112 . At least one catch surface of the roller casing 110 faces the roller, in particular the substrate supporting surface of the roller. The capture surface 112 can capture particles released from the roller. For example, particles may be trapped by magnetic forces, adhesives, mechanical labyrinth and/or electrostatic forces.

[0038] 2 is a schematic cross-sectional view of a carrier transport system 200 that includes a track assembly 210 according to embodiments described herein. 2 shows a schematic front view of a carrier transport assembly and carrier according to embodiments described herein. Carrier transport system 200 is configured for transport of carriers 10 . The carrier may support a substrate or mask in the transport direction in the vacuum chamber. The transport direction T is perpendicular to the paper plane of FIG. 1 . The carrier 10 has an essentially homeotropic orientation V (eg, homeotropic orientation ±10°) during transport.

[0039] Some embodiments described herein include the concept that carriers are transported in a "vertical or nearly vertical orientation" or essentially vertical orientation. Vertical orientation of the carrier 10 in the context of the present disclosure refers to the carrier 10 being aligned to extend in a direction substantially parallel to the direction in which gravity is oriented, ie substantially parallel to the vertical direction Y. do. A near-vertical orientation is defined as an orientation that deviates from the exact vertical position (the latter defined by gravity) by an angle of up to 15 degrees. In a vertical or near vertical orientation, the carrier can support a substrate in a vertical or near vertical orientation. Similarly, an essentially horizontal orientation can have a deviation of up to 15 degrees from horizontal.

[0040] According to the embodiments described herein, the track assembly 210 includes a first passive magnetic unit 220 extending in the transport direction T. As shown in Figure 2, the first passive magnetic unit is configured to be on top of the carrier. The first passive magnetic unit 220 has a first magnetic pole and a second magnetic pole. According to embodiments described herein, an apparatus for vacuum processing of a substrate may include a carrier 10 configured to support a substrate or mask. The carrier 10 may include a first passive magnetic unit 20 on top of the carrier as shown in FIG. 2 . The first passive magnetic unit 20 may have a first magnetic pole and a second magnetic pole. The magnetic poles of the carrier and track assembly may be all vertically arranged or all horizontally arranged. Thus, lateral stabilization can be provided. The first passive magnetic unit 20 of the carrier is configured to magnetically couple with the first passive magnetic unit 220 of the track assembly. For example, the north pole of the first passive magnetic unit of the track assembly may face the south pole of the first passive magnetic unit of the carrier, and vice versa.

[0041] According to the embodiments described herein, the track assembly 210 includes a second passive magnetic unit 222 extending in the transport direction T. The second passive magnetic unit 222 has a third magnetic pole and a fourth magnetic pole. The carrier 10 further includes a second passive magnetic unit 22 having a third magnetic pole and a fourth magnetic pole. The second passive magnetic unit 22 of the carrier is configured to magnetically couple with the second passive magnetic unit 222 of the track assembly. The third and fourth magnetic poles of the carrier are opposite magnetic poles to the third and fourth magnetic poles of the track assembly. Thus, the magnetic force between the second passive magnetic unit of the carrier and the second passive magnetic unit of the track assembly is an attraction in the opposite direction of gravity.

[0042] As shown in FIG. 2 , the second passive magnetic unit 222 of the track assembly may be configured to be on the side of the carrier 10 that engages the second passive magnetic unit 22 of the carrier 10 . The second passive magnetic unit 222 of the track assembly offsets at least 60% of the weight of the carrier and is configured to partially levitate the substrate carrier.

[0043] According to the embodiments described herein, the first passive magnetic unit of the track assembly and the second passive magnetic unit of the track assembly are configured to offset at least the weight of the carrier. The magnetic levitation provided by combining the first passive magnetic unit of the track assembly and the first passive magnetic unit of the carrier is combined with the magnetic levitation provided by combining the second passive magnetic unit of the track assembly and the second passive magnetic unit of the carrier. , at least 70%, in particular at least 90%, more particularly 100% or more of the weight of the carrier.

[0044] According to an embodiment of the present disclosure, the weight of a carrier, in particular an essentially vertically oriented carrier, is oriented towards the first passive magnetic unit at the top of the carrier, toward the bottom of the carrier, ie vertically down the first passive magnetic unit. supported by a second magnetic unit and rollers. The downward pulling force of the drive assembly is further counteracted by the first passive magnetic unit at the top of the carrier, the second magnetic unit oriented towards the bottom of the carrier, ie vertically below the first passive magnetic unit, and the rollers. .

[0045] During processing of the substrate, the carrier may be heated. Thus, there is thermal expansion. Thermal expansion can be significant, especially for vertically oriented or essentially vertically oriented substrates, ie large area substrates where the substrates can have a vertical height of more than 1 m or even up to several meters. Therefore, it is beneficial for the second passive magnetic unit, i.e., the passive magnetic unit below the first passive magnetic unit at the top of the carrier, to offset most of the weight of the carrier. An amount of thermal expansion at the position of the second passive magnetic unit is smaller than an amount of thermal expansion adjacent to the first passive magnetic unit. Therefore, the bearing forces of the passive magnetic units are less affected by thermal expansion in the position of the second passive magnetic unit.

[0046] Figure 2 shows the second passive magnetic unit in a vertical position between the rollers and the first passive magnetic unit. According to some embodiments, which may be combined with other embodiments described herein, a second passive magnetic unit may also be provided vertically below the rollers. The second passive magnetic unit and the rollers may be vertically close to each other to reduce the effect of thermal expansion. For example, the second passive magnetic unit and the rollers may have a vertical distance that is less than or equal to 20% of the vertical carrier dimension, in particular less than or equal to 10% of the vertical carrier dimension, more particularly less than or equal to 5% of the vertical carrier dimension.

[0047] According to embodiments described herein, the carrier 10 is a first rail, such as a top rail, configured to contact an upwardly oriented portion of a substrate supporting surface of at least one of the plurality of rollers 100 . (204). The carrier 10 further includes a second rail, for example a bottom rail 206 . The second rail may be configured to contact a downwardly oriented portion of the substrate supporting surface of at least one of the plurality of rollers 100 . According to some embodiments, which may be combined with other embodiments described herein, a gap may be provided between the second rail and the bottom of the rollers. For example, the gap may be 1 mm or less, such as 0.5 mm or less, or even less than 0.3 mm. The distance between the first rail and the second rail is slightly larger than the diameter of the rollers, for example by less than 1 mm, such as less than 0.5 mm or even less than 0.3 mm.

[0048] According to embodiments described herein, the resultant force of weight, magnetic levitation force, and downward pulling force generated by drive assembly 230 and third passive magnetic unit is 30% or less of the weight of the carrier, for example 20% or less, for example, 10% or less. The resultant force is supported by at least one of the plurality of rollers 100 . An uppermost portion of at least one of the plurality of rollers is configured to contact the first rail so as to be able to compensate the resultant force. At least one of the plurality of rollers 100 supports the resultant force and overcomes the instability of the magnet pairs in the vertical direction. The minimization of the contact surface between the carrier and the track assembly, as well as the minimization of the weight on the rollers, significantly lowers particle generation due to transport. For example, when an upward force occurs during some operating conditions, the carrier may contact a second rail, for example the bottom rail 206 . The roller casing 110 is shown as a broken line in FIG. 2 . The roller casing may be provided before and/or in front of the roller body 102 in the conveying direction, and is thus illustrated by broken lines.

[0049] Embodiments of the present disclosure having a roller casing with a trapping surface provide a particle trap function that allows in-situ particle trapping to a predetermined location, i.e. to the trapping surface. The catch surface is provided on a roller casing or roller housing. Thus, when replacing a roller casing or roller housing during product maintenance, particles can be removed from the substrate processing system. Experiments can show that more than 80% of the particles generated in the roller can be trapped in the roller casing. Additionally, particle capture at the roller may be provided during atmospheric conditions and under vacuum conditions. According to some embodiments, which may be combined with other embodiments described herein, capture concepts may include magnetic capture, eg, adhesive capture by adhesive, and mechanical labyrinth capture, wherein mechanical labyrinth capture prevents the escape of particles. Thus, particles that can affect substrate processing can be reduced. Moreover, the predetermined location at which the particles are captured in the roller casing results in less effort during product maintenance.

[0050] 3 shows the roller 100 . The roller 100 has a roller body 102 having a substrate support surface 104 . The roller casing 110 surrounds at least a portion of the roller and provides a trap for the particles. For example, particles may be generated during contact of the substrate support surface 104 of the roller body 102 with the rails of the carrier. Some embodiments of the present disclosure provide a magnetic trap for ferromagnetic particles, as exemplarily shown in FIG. 3 . Roller casing 110 includes one or more capture surfaces 112 . At least the first surface portion faces the roller body 102 . The roller casing may include, for example, a magnetic housing having a plurality of openings 312 and 314. A magnet 320 is provided in the magnet housing. For example, magnet 320 can be a permanent magnet with a magnetic surface.

[0051] According to some embodiments, which may be combined with other embodiments described herein, the magnet housing may be made of a magnetic material, particularly a ferromagnetic material. Thus, magnet 320 is fixed relative to magnet housing 315 . Thus, vibration during operation of the carrier transport assembly does not cause movement of the magnets 320 within the magnet housing 315. Particles are not released from the particle trap due to unwanted movement.

[0052] Particles released during contact between the substrate support surface 104 and the rails or rods of the carrier are trapped by the magnets and magnet housings. In particular, ferromagnetic particles can be attracted by the attractive force of a permanent magnet. According to some embodiments, which can be combined with other embodiments described herein, the roller casing comprises a first magnet housing and a first magnet on a first side of the roller in the transport direction T, and a transport direction and a second magnet housing and a second magnet on the second side of the roller at (T). The upper and lower faces of the rollers are not surrounded by roller casings to allow substrate support surfaces for the top and bottom rails of the carrier.

[0053] The magnet housings 315 shown in FIG. 3 include first and second surfaces facing in the transport direction T. Openings 312 may be provided on the first side and the second side. In particular, openings 312 are provided on the side of each magnet housing facing the roller body 102 . The first face and the second face may be vertical faces of the magnet casing. According to some embodiments, which may be combined with other embodiments described herein, the magnet housing may be provided with additional openings 314 in the third and fourth faces of the magnet housing. A third surface may be provided between the first and second surfaces. A fourth surface may be provided between the first and second surfaces. The third and fourth faces of the individual magnet housings may be horizontal faces.

[0054] According to some embodiments, which can be combined with other embodiments described herein, the capture surface can include a magnet surface of magnet 320 and can include a surface of a magnet housing. Particularly in the case of ferromagnetic magnet housings, the magnetic attractive forces generated by the magnet 320 are also provided by the surface of the magnet housing. Apertures 312 and additional apertures 314 allow for the capture of particles ejected from the roller during rotation of the roller due to the centripetal force of the particles present on the roller during rotation of the roller. Tests of duration equal to one and a half years of operation of the carrier conveying assembly using a roller casing with a trapping surface demonstrate efficient particle trapping, especially when trapping ferromagnetic particles by magnetic attraction. For example, an amount of about 80% of the particles may be captured during testing of a roller casing according to embodiments of the present disclosure.

[0055] According to one embodiment, rollers are provided for a carrier transport assembly. The roller includes a roller body that is rotatable and has a substrate supporting surface and a roller casing surrounding at least a portion of the roller. The roller further includes a catching surface of the roller casing, the catching surface having at least a first surface portion facing the roller. For example, the capture surface includes a magnet housing. The magnet housing may be configured to accommodate magnets, particularly permanent magnets. According to some embodiments, which can be combined with other embodiments described herein, the magnet housing can include a plurality of apertures, and/or the magnet housing can be made of a magnetic material, particularly a ferromagnetic material.

[0056] Moreover, additionally or alternatively, the capture surface may comprise a magnet surface of a permanent magnet. According to some embodiments, which can be combined with other embodiments described herein, the roller casing comprises a first magnetic capture portion at a first radial orientation of the roller and a second magnetic capture portion at a second radial orientation of the roller. It may include a catch portion, wherein the second radial orientation is different than the first radial orientation. The roller casing encloses at least part of the roller, for example by having two or more magnetic traps on different faces of the roller and/or by having a trapping surface that partially surrounds the substrate supporting surface of the roller body.

[0057] According to some embodiments, which can be combined with other embodiments described herein, additionally or alternatively, the capture surface includes an adhesive, an electrostatic surface, and/or a mechanical labyrinth to capture particles in the roller casing. can do. 4 shows a roller 100 with a roller casing 110 . The roller body has a substrate support surface (104). A portion of the roller casing is provided with a catch surface comprising an adhesive. According to some embodiments, which may be combined with other embodiments described herein, the adhesive may be an adhesive mat, i.e., a sticky mat, adhesive tape, or other adhesive. According to embodiments of the present disclosure, the capture surface may have an area of 50 cm 2 or greater for one roller of the carrier transport assembly. For example, with 5 to 15 rollers in contact with a carrier configured to support a substrate, a capture surface of 250 cm 2 to 750 cm 2 may be provided.

[0058] According to some embodiments, which can be combined with other embodiments described herein, a vacuum compatible grease can be provided as the catch surface of the roller casing. The use of a vacuum compatible grease allows for good release properties for substrate processing under vacuum conditions.

[0059] FIG. 4A shows a roller with a roller casing that can advantageously be used in a carrier transport assembly as illustrated in FIG. 1 . For a carrier transport assembly as illustrated in FIG. 2, a roller 100 as shown in FIG. 4B may be used. The roller casing includes a first portion on a first side of the roller body 102 and a second portion on the opposite side of the roller body 102 . Upper and lower portions of the roller body 102 are provided with substrate support surfaces 104 for contacting the upper and lower rails of the carrier. A capture surface 112 with an adhesive such as, for example, vacuum compatible grease may be provided on the portion of the capture surface facing the roller body 102 .

[0060] Embodiments of the present disclosure relate to the capture of particles at a predetermined position for a substrate processing system. Entrapment of the particles reduces the number of particles affecting substrate processing. Additionally or alternatively, trapping the particles at a predetermined location reduces maintenance effort because the particles can be removed by cleaning the trapping location. Some embodiments of the present disclosure relate to a roller having a roller casing with a capture surface. In particular, particles generated at the contact surface of the roller and the carrier can be captured by the roller casing. According to additional or alternative embodiments, particles attached to the carrier may be captured. For example, particles can be trapped before the carrier enters the vacuum processing system, ie, when the carrier is transferred into a loadlock chamber of the substrate processing system.

[0061] According to one embodiment, a carrier cleaning head is provided for cleaning a carrier moving along a transport direction. The carrier cleaning head includes a cleaning head body having a first conduit and a second conduit, and two or more pairs of brushes, each pair of brushes having a first brush extending in a first direction, and a first brush extending in a first direction. It has a second brush extending in an opposite second direction, and the pairs of brushes are arranged along the conveying direction. The carrier cleaning head includes a first opening assembly in fluid communication with the first conduit and configured to provide a purge gas, and a second opening assembly in fluid communication with the second conduit and configured for particle removal.

[0062] FIG. 5 shows a carrier cleaning head 500 , in particular a carrier cleaning head for a carrier as exemplarily illustrated in FIG. 2 . The carrier 10 includes a top rail 204 and a bottom rail 206 . A portion 504 of the carrier body is provided between the top rail 204 and the bottom rail 206, in particular between the rails in the vertical direction. Particles that may adhere to the carrier, particularly the rails of the carrier, may be removed from the carrier by the carrier cleaning head 500 . Carrier cleaning is provided while the carrier is transported past the carrier cleaning head.

[0063] According to embodiments of the carrier cleaning head, a combination of brushing, purging and suction for particle removal is combined. For example, purging may be provided as purging with clean dry air (CDA), ie as a CDA purge. According to some embodiments, which may be combined with other embodiments described herein, a cascade cleaning concept for multiple brushes, particularly multiple pairs of brushes, may be provided. The pair of brushes may include a first brush or first brush pad for the top rail 204 and a second brush or second brush pad for the bottom rail 206 . A cascade arrangement of carrier cleaning heads provides two or more brushes or pairs of brushes along the transport direction of the carrier. According to some embodiments, which can be combined with other embodiments described herein, four, six or eight flat bushes are arranged in two rows, for example a top row and a bottom row. can be provided as a row. One or more openings for particle removal, for example through a suction port, allow entrapment of the particles. The number of particles affecting substrate processing can be reduced, and the effort for product maintenance can be reduced.

[0064] 5 shows a carrier cleaning head 500 , which includes a cleaning head body 510 . The cleaning head body 510 supports the first brush 522 and the second brush 524 . The first brush and the second brush form a pair of brushes 520 . The first brush is directed to clean the top rail 204 . The second brush 524 is directed to clean the bottom rail 206 . The cleaning head body 510 includes a first conduit 512 . A first conduit 512 is connected to a gas line 518 for providing purge gas. The purge gas may be, for example, a CDA purge gas. The cleaning head body further includes a second conduit 514 . A second conduit 514 is configured for particle removal and is connected to the suction port 519 . For example, suction port 519 can be connected to a pump.

[0065] The carrier cleaning head provides an in-situ method for cleaning the carrier, in particular for the removal of particles adhering to the carrier. In-situ cleaning for moving carriers is provided. particles are captured. The cleaning head body 510 can be provided in the system and can be provided in the existing system without affecting the production process.

[0066] According to some embodiments, which can be combined with other embodiments described herein, the carrier cleaning head provides multiple pairs of brushes. For example, 2 pairs, 3 pairs, 4 pairs or 5 pairs of brushes may be provided along the transport direction of the carrier. Pairs of brushes are provided in a cascade arrangement.

[0067] 6 shows a detailed view of a portion of the carrier cleaning head. The cleaning head body 510 is spaced apart from the top rail 204 of the carrier by a gap G1. Similarly (not shown in FIG. 6 ), the cleaning head body 510 is spaced from the bottom rail 206 by a gap. According to some embodiments, which can be combined with other embodiments described herein, the cleaning head body is further spaced from the portion 504 of the carrier arranged between the top and bottom rails of the carrier. 6 shows a gap G2 illustrating the space between the cleaning head body 510 and the portion 504 of the carrier. According to some embodiments, one or more additional openings 622 may be provided in the cleaning head body. One or more additional openings 622 face portion 504 of the carrier and are in fluid communication with the second conduit for particle removal.

[0068] The spokes 620 or bristles of the brush are angled for vertical and horizontal orientations. This inclination is illustrated as angle α in FIG. 6 . For example, the angle α may be between 30° and 75°. The length of the spokes 620 is longer than the gap G1, especially along the direction of the spokes. The spokes thus provide a pressing force to the carrier rail. According to some embodiments, which can be combined with other embodiments described herein, the brush and/or spokes of the brush are compressed. The length of the spokes providing an overlapping depth without deformation of the spokes allows the overlapping depth to be greater than 2 mm. The inclination of the spokes further provides for cleaning of the carrier rail in the region of the gap G2 between the cleaning head body 510 and the portion 504 of the carrier. For example, portion 504 of the carrier may extend perpendicularly and/or parallel to the substrate supporting surface of the carrier. Due to the inclination of the spokes of the brush, for example in part 504 of the carrier, the corner between the rail of the carrier and the body of the carrier can be reached by the brush for particle removal. According to some implementations, which may be combined with embodiments of the present disclosure, gap G1 and gap G2 may be between 3 mm and 6 mm.

[0069] According to some embodiments, the spokes of the pair of brushes or the bristles of the pair of brushes may be inclined with respect to the conveying direction and are inclined with respect to a direction perpendicular to the conveying direction. Additionally, additionally or alternatively, a first brush of the pair of brushes is arranged on a first face, for example a top face, of the cleaning head body and facing the top rail of the carrier. A second brush of the pair of brushes is arranged on a second surface of the cleaning head body, for example, on a lowermost surface opposite to the first surface, that is, on the second surface, and facing the lowermost rail of the carrier. The cleaning head body may further include a third opening assembly having one or more third openings (ie, one or more additional openings 622) arranged on a third side of the carrier head body, the third side comprising: It is arranged between the first side and the second side.

[0070] According to still other implementations, which can be combined with other embodiments described herein, the brush can be made of or coated with a conductive material. The brush can include a brush pad and spokes attached to the brush pad. By having a conductive material or conductive coating, electrostatic discharge (ESD) during brushing may be reduced or avoided. The spokes, i.e. the bristles of the brush, have antistatic properties. According to some implementations, the brush pad can include a conductive material, such as aluminum.

[0071] 7A and 7B show a portion of the cleaning head body 510 . A plurality of brushes 522 are arranged along the transport direction T. Thus, upon movement of the carrier along the carrier cleaning head, a part of the rail, bar or rod of the carrier is subsequently cleaned by the brushes. The brush includes a brush pad 722 and spokes 724 . For example, two rows of spokes may be attached to the brush pad. Spokes in adjacent rows of spokes may be offset relative to each other. The entire surface of the rail can be cleaned.

[0072] The carrier cleaning head includes a first aperture assembly having apertures 710 . The openings 710 are in fluid communication with the first conduit and provide purge gas in the direction of the brushing area. A first aperture assembly may be provided between the first brush 522 and the second brush 524, particularly along the conveying direction. 7A shows a top view of the carrier cleaning head. The lowermost surface of the cleaning head body 510 is provided with corresponding brushes and corresponding openings 710 . A brush on the top side and a corresponding brush on the bottom side form a pair of brushes according to an embodiment of the present disclosure.

[0073] The carrier cleaning head includes a second aperture assembly having apertures 712 . Apertures 712 are in fluid communication with the second conduit. A second conduit may be connected to the suction port for removal of particles during cleaning of the carrier. The apertures 712 of the second aperture assembly may be arranged between the brushes along the conveying direction. Additionally, additionally or alternatively, apertures 712 may be arranged between the rows of spokes in one brush 522 . As exemplarily shown in FIG. 6 , one or more third openings, for example as vertical slits, to remove particles adhering to the vertical plane of the carrier, ie the portion of the carrier between the top and bottom rails. Fields 622 may be provided.

[0074] As illustrated in FIG. 7B , the brush 522 may be removed from the cleaning head body 510 . The brush pad 722 of the brush 522 may be connected to the cleaning head body 510 by a clamping mechanism, which may be based on screws, for example. During maintenance, a carrier cleaning head with 3 pairs of brushes can be maintained by removing 6 brushes and replacing 6 brushes with cleaned or new brushes.

[0075] As noted above, the carrier cleaning head includes a first opening assembly in fluid communication with the first conduit and configured to provide a purge gas, and a second opening assembly in fluid communication with the second conduit and configured for particle removal. According to some embodiments, the first aperture assembly and the second aperture assembly may be arranged between two brushes along the conveying direction. The first aperture assembly may be oriented to direct purge gas to at least one of the two or more pairs of brushes. The pair of brushes may include two brush pads removably coupled to the cleaning head body. Additionally or alternatively, each brush of the pair of brushes includes rows of spokes, the rows of spokes being offset from each other in a direction perpendicular to the conveying direction.

[0076] A carrier cleaning head according to embodiments of the present disclosure provides a small distance of the apertures of the first aperture assembly to the workpiece to be cleaned. Thus, the ratio of the flow rate of purge gas at the nozzle or aperture to the distance can be high even for relatively low flow rates. For example, the distance of the apertures of the first aperture assembly to the workpiece may be 15 mm or less. Thus, the ratio of flow rate to distance can be greater than 330 [1/s] at relatively low flow rates. Consumption of purge gas, eg CDA, can be reduced. Furthermore, the ratio between purge gas flow and intake capacity can be improved. Having a higher suction capacity relative to the purge gas flow increases the cleaning effect. For example, the intake capacity may be between 200 m 3 /h and 300 m 3 /h. According to some implementations, which can be combined with the embodiments described herein, the suction capacity can be at least twice the purge gas flow, in particular at least three times.

[0077] A carrier cleaning head according to embodiments of the present disclosure combines brushing, purging and suction to remove particles from the rail surface of a rail of a carrier. Purging, for example in conjunction with CDA and suction, enables continuous particle removal and may further enable brush cooling.

[0078] 8 shows a substrate processing system 800 . The substrate processing system 800 includes a front end module 802 . The front end module provides carriers and substrates, respectively, within one or more vacuum chambers of the substrate processing system. 8 shows a first vacuum chamber 804 that is a load lock chamber. Additionally, a second vacuum chamber 806, either a production chamber or a processing chamber, is provided. One or more carriers are removed from the front end module 802 into the load lock chamber. One carrier 10 is exemplarily shown in FIG. 8 . Additionally, a substrate processing station 850 or substrate processing tool is illustratively shown in FIG. 8 . For example, the processing modules may be deposition sources, eg PVD sources such as rotatable sputter cathodes. According to other implementations, the substrate processing station 850 may include CVD sources, heaters, etch tools or other processing tools.

[0079] The carrier rail has areas that are exposed in the horizontal direction and present a risk of aggregation of scattered particles. A carrier cleaning head 500 is shown exiting the front end module 802 . The carrier cleaning head 500 may be adjacent to an inlet into the loadlock chamber, ie the first vacuum chamber 804 . The carrier cleaning head may be provided under atmospheric conditions, ie outside the first vacuum chamber 804 . The carrier, in particular one or more carrier rails, rods or bars, is cleaned by the carrier cleaning head 500 before the carrier enters the vacuum chambers of the substrate processing system 800 . The carrier may be cleaned in-situ, that is, it may be cleaned while in the substrate processing system. According to some embodiments, the position of the carrier cleaning head may be adjusted relative to the transport assembly of the vacuum processing system. For example, this position can be adjusted both vertically and horizontally, ie perpendicular to the conveying direction T.

[0080] According to one embodiment, a substrate processing system is provided. A substrate processing system includes a first vacuum chamber having a first wall. A carrier cleaning head according to embodiments of the present disclosure is arranged adjacent to the first wall of the first vacuum chamber, in particular outside the vacuum chamber. For example, a carrier transport assembly may be provided, which is configured to transport a carrier having a top rail and a bottom rail along a transport direction. The cleaning head body is spaced from the top rail in a vertical direction and from the bottom rail in a vertical direction, and the cleaning head body is spaced from the carrier in a horizontal direction different from the transport direction.

[0081] The substrate processing system can further include a pump 820 in fluid communication with the second conduit of the carrier cleaning head. Additionally, a gas source 822, for example for a CDA, may be provided in fluid communication with the first conduit of the carrier cleaning head. The gas source may be a gas tank or gas line in a factory for substrate processing.

[0082] 8 shows a carrier transport assembly that includes a plurality of rollers 100 in a first vacuum chamber 804 and a second vacuum chamber 806 . Illustratively, the rollers 100 in the first vacuum chamber include a roller casing with a capture surface. A carrier transport assembly may include rollers according to embodiments of the present disclosure. 8 illustratively shows the roller casing 110 within the first vacuum chamber 804 . Rollers according to embodiments of the present disclosure may be provided in each of the vacuum chambers of the substrate processing system.

[0083] 8 illustrates a substrate processing system 800 that includes a carrier cleaning head according to embodiments of the present disclosure and a carrier transport assembly having rollers according to the present disclosure. According to some embodiments, which can be combined with other embodiments described herein, particle capture by the carrier cleaning head and particle capture by the capture surface of the roller casing can be provided separately from each other or in combination with each other.

[0084] According to one embodiment, a substrate processing system including a carrier transport assembly is provided. The carrier transport assembly includes a plurality of rollers arranged along a transport direction. Each of the plurality of rollers may be a roller according to embodiments of the present disclosure. The substrate processing system may include a vacuum chamber, and a plurality of rollers are provided within the vacuum chamber. Moreover, the substrate processing system may include one or more substrate processing stations 850 .

[0085] According to some implementations, in a physical vapor deposition (PVD) tool, such as Applied Materials Inc.'s AKT Pivot and NewAristo, substrate carriers move on a carrier transport assembly, and a rod or rail of the carrier moves on a roller arrangement. During system operation, particles may be generated due to friction between the roller arrangement and the carrier. Particles can accumulate on the rod of the substrate carrier or deteriorate substrate processing in the vacuum chamber. Particles accumulated on the carrier are transported through the system and can circulate within the system. Eventually, particles may reach the flat substrate due to air flow patterns during pumping and venting of a vacuum chamber, such as a load lock chamber, for example, or due to static and/or dynamic influences.

[0086] 9 shows a method of maintaining a substrate processing system. At operation 902, maintenance is initiated. In operation 912, a plurality of brush pads or a plurality of brushes of two or more pairs of brushes are each removed from the cleaning head body of the carrier cleaning head. A plurality of brushes may be cleaned, or brushes may be replaced with new brushes, for example clean brushes. In operation 914, the carrier cleaning head is assembled by providing cleaned brushes to the carrier cleaning head. In an additional or alternative maintenance process, as shown in operation 922, the plurality of roller casings may be removed from the plurality of rollers of the carrier transport assembly. For each of the plurality of roller casings, the catch surface of the roller casings may be cleaned or removed. In operation 924, the plurality of rollers are assembled by providing a roller casing to each of the rollers. For example, a clean roller casing may be provided, ie a new roller casing or a previously cleaned roller casing.

[0087] 9 shows pressure replacement and roller casing replacement as separate maintenance processes. The two maintenance processes may be provided separately from each other, or both maintenance processes may be provided.

[0088] 10 shows a method of fabricating a device in a substrate processing system. For example, a device may be a display. The display can be fabricated on generation GEN 4.5 or higher area substrates, especially in a PVD substrate processing system. At operation 950, a carrier supporting a substrate is transferred into a substrate processing system having a loadlock chamber. Particles adhering to the carrier may be captured using a carrier cleaning head according to embodiments of the present disclosure. This is illustrated by operation 952. A substrate processing system includes a carrier transport assembly having a plurality of rollers. Feeding involves rotation of the roller body relative to each of the rollers. In operation 954, particles generated from the roller are trapped in a roller casing having a trapping surface. At operation 956, one or more thin film layers of the device may be processed or deposited in a substrate processing system. Figure 10 shows the entrapment of particles attached to the carrier and the entrapment of particles generated during transport of the carrier. The two capture mechanisms may be provided separately from each other or in combination according to embodiments of the present disclosure.

[0089] According to embodiments, in-situ removal of particles enables reducing pre- and post-deposition particles that may adhere to production sheets or substrates, as well as subsequent particle-induced defect formation and yield loss. .

[0090] Embodiments of the present disclosure provide one or more of the following advantages. Particles generated in the substrate processing system or potentially transferred into the vacuum processing system are captured. Thus, the number of particles that can negatively affect substrate processing is reduced. Additionally, particle capture can be provided at predetermined locations to allow maintenance of the product to be simplified, since particles can be removed from the predetermined locations during product maintenance. Cleaning efficiency is improved by providing an improved ratio of purge gas flow and nozzle distance of purge gas openings to cleaning position. The purge gas flow rate can be reduced, which further affects the ratio between the amount of purge gas and the suction capacity to improve the cleaning efficiency. Capture surfaces provided on the roller casing, ie, capture surfaces adjacent to particle generation, can reduce the distribution of particles in the substrate processing system.

[0091] While the foregoing relates to embodiments of the present invention, other and additional embodiments of the present invention may be devised without departing from the basic scope of the present disclosure, which scope is set forth in the following claims. determined by

Claims (14)

As a roller for a carrier transport assembly,
a roller body rotatable and having a substrate support surface;
a roller casing surrounding at least a portion of the roller; and
a trapping surface of the roller casing;
the capture surface having at least a first surface portion facing the roller;
Rollers for carrier transport assemblies. According to claim 1,
further comprising a magnet housing comprising the capture surface;
Rollers for carrier transport assemblies. According to claim 2,
The magnet housing includes a plurality of openings,
Rollers for carrier transport assemblies. According to claim 2 or 3,
the magnet housing is made of a magnetic material;
Rollers for carrier transport assemblies. According to claim 1 or 4,
wherein the capture surface comprises a magnet surface of a permanent magnet;
Rollers for carrier transport assemblies. According to any one of claims 2 to 5,
The roller casing,
a first magnetic trap in a first radial orientation of the roller; and
a second magnetic capture portion in a second radial orientation of the roller;
the second radial orientation is different from the first radial orientation, and the magnet housing is included in the first magnetic trapping portion or the second magnetic trapping portion;
Rollers for carrier transport assemblies. According to claim 1,
wherein the capture surface comprises an adhesive, mechanical labyrinth, or electrostatic surface;
Rollers for carrier transport assemblies. According to claim 7,
The adhesive is an adhesive mat provided on the surface of the roller casing,
Rollers for carrier transport assemblies. As a substrate processing system,
a carrier transport assembly;
The carrier transport assembly,
a plurality of rollers arranged along the conveying direction of the carrier conveying assembly;
Each roller of the plurality of rollers is a roller according to any one of claims 1 to 8,
Substrate processing system. According to claim 9,
a vacuum chamber, wherein the plurality of rollers are provided in the vacuum chamber; and
Further comprising a substrate processing station for processing a substrate,
Substrate processing system. According to claim 9 or 10,
load lock chamber; and
Further comprising a carrier rail cleaner adjacent to the load lock chamber.
Substrate processing system. A method of maintaining a substrate processing system comprising:
removing the plurality of roller casings from the plurality of rollers of the carrier transport assembly;
cleaning or removing the capture surface of each of the plurality of roller casings; and
Assembling the plurality of rollers by providing a roller casing for each of the rollers.
How to maintain a substrate processing system. According to claim 12,
further comprising removing a plurality of brush pads from the carrier cleaning head.
How to maintain a substrate processing system. As a method of manufacturing a device,
using a carrier transport assembly having a plurality of rollers, transporting the carrier supporting the substrate, the transport including rotation of the roller body relative to each of the rollers;
trapping the particles generated by the roller in a roller casing having a trapping surface; and
processing or depositing one or more thin film layers of the device.
How to make a device.