KR20230102433A - In-line deposition system and substrate align method of in-line deposition system - Google Patents

Abstract

According to one aspect of the present invention, an inline deposition system in which a process for a substrate is performed while a substrate carrier on which a substrate is mounted continuously moves, wherein the substrate and a fine mask for forming subpixels of the substrate carrier are an align chamber module to be aligned; a deposition chamber module installed at a rear end of the align chamber module to perform deposition on the substrate; a mask separation chamber module installed at a rear end of the deposition chamber module to separate the substrate carrier from the fine mask; A mask return line for returning the separated fine mask to the align chamber module, wherein the align chamber module includes an offset detector for detecting an offset between the aligned substrate and the fine mask An in-line deposition system is provided.

Description

In-line deposition system and substrate align method of in-line deposition system

The present invention relates to an inline deposition system and a method for aligning a substrate of the inline deposition system. More particularly, it relates to an inline deposition system capable of calculating an offset value of an entire fine mask that cycles without performing deposition on a test substrate in the inline deposition system and a method for aligning a substrate of the inline deposition system.

Organic Luminescence Emitting Device (OLED) is a self-emitting device that emits light by itself using the electroluminescence phenomenon that emits light when a current flows through a fluorescent organic compound. Therefore, a lightweight and thin flat panel display device can be manufactured.

A flat panel display device using such an organic light emitting device has a fast response speed and a wide viewing angle, and is emerging as a next-generation display device.

In the organic electroluminescent device, the hole injection layer, the hole transport layer, the light emitting layer, the electron transport layer, and the electron injection layer, which are the remaining organic layers except for the anode and the cathode electrode, are made of organic thin films, and these organic thin films are formed on a substrate by a vacuum thermal evaporation method. will be deposited

A cluster-type deposition system or an in-line deposition system is applied as an equipment system for forming organic thin films or metal thin films by vacuum thermal evaporation. It is a method of depositing an organic thin film on a substrate, and the inline deposition system performs a deposition process while continuously transferring a plurality of substrates to a substrate carrier while arranging a plurality of process chamber modules in a row.

Meanwhile, when R, G, and B subpixels are formed by depositing R, G, and B light-emitting organic materials, fine metal masks corresponding to the R, G, and B subpixels are aligned on a substrate, In each deposition chamber module, deposition of a light emitting organic material corresponding to a corresponding sub-pixel is performed. At this time, before performing the deposition on the substrate in earnest, the deposition is performed after aligning the fine metal mask with respect to the test substrate, and each new fine metal mask is inspected through a PPA (Pixel Position Accuracy) tester installed at the end of the deposition system. Measure the offset value (offset) due to errors in manufacturing, expansion due to heat, etc.

When deposition on an actual substrate is performed, more precise sub-pixels can be formed by aligning the fine metal mask with respect to the substrate by reflecting the offset value of the fine metal mask obtained through the deposition of the test substrate.

However, in the case of the cluster type deposition system, the fine metal mask corresponding to each sub-pixel is installed in the aligner in the deposition chamber module, so the offset value of the fine metal mask can be calculated with only one test. However, in the case of the inline deposition system Since a large number of fine metal masks continuously circulate in the inline deposition system to perform deposition, in case of inspecting the PPA after performing deposition for all new fine metal masks in the inline deposition system, the number of test substrates equal to the number of fine metal masks There is a problem with this cost.

Republic of Korea Patent Publication No. 10-2016-0136481 (published on November 30, 2016)

An object of the present invention is to provide an inline deposition system capable of calculating an offset value of an entire circulating fine mask without performing deposition on a test substrate in the inline deposition system and a method for aligning a substrate of the inline deposition system.

According to one aspect of the present invention, an inline deposition system in which a process for a substrate is performed while a substrate carrier on which a substrate is mounted continuously moves, wherein the substrate and a fine mask for forming subpixels of the substrate carrier are an align chamber module to be aligned; a deposition chamber module installed at a rear end of the align chamber module to perform deposition on the substrate; a mask separation chamber module installed at a rear end of the deposition chamber module to separate the substrate carrier from the fine mask; A mask return line for returning the separated fine mask to the align chamber module, wherein the align chamber module includes an offset detector for detecting an offset between the aligned substrate and the fine mask An in-line deposition system is provided.

At least one fine mask may be cycled along the align chamber module, the deposition chamber module, and the mask return line, and in this case, the offset detector measures an offset value for each of the fine masks and An offset value that matches the ID of the fine mask can be stored.

The align chamber module includes an aligner for aligning the substrate and the fine mask of the substrate carrier, wherein the aligner reflects the stored offset value of the fine mask to be aligned to align the substrate and the fine mask. The fine mask can be aligned.

The in-line deposition system may include a substrate mounting chamber module installed in front of the align chamber module and in which the substrate is mounted on the substrate carrier; The substrate separation chamber module may further include a substrate separation chamber module installed at a rear end of the mask separation chamber module and separating the substrate from the substrate carrier.

The substrate carrier return line may further include a substrate carrier return line connecting the substrate separation chamber module and the substrate mounting chamber module and returning the substrate carrier from which the substrate is separated to the substrate mounting chamber module.

The offset detector may include a vision unit that acquires an image by photographing the lower surface of the fine mask aligned with the substrate; a position controller for controlling the position of the vision unit to scan the lower surface of the fine mask; an offset calculation unit that calculates an offset value of a fine mask through the image; A storage unit may be included to store an offset value matched with a corresponding ID of the fine mask.

The vision unit may include a camera for capturing the image; An ATM box having a view port corresponding to the lens of the camera and enclosing the camera to maintain the inside at atmospheric pressure may be included.

The position control unit may include an X-Y stage for controlling the position of the vision unit in the X-Y direction; A Z-axis driving unit for controlling the position of the X-Y stage in the Z direction may be included.

The X-Y stage includes an LM guide disposed along the X-axis direction; a moving unit mounted on the moving block of the LM guide in the Y-axis direction and moving along the LM guide; The vision unit is coupled to the pinion and may include a rack-pinion gear installed along the longitudinal direction of the moving unit.

The vision unit may include a camera for capturing the image; An ATM box having a view port corresponding to the lens of the camera and enclosing the camera to maintain the inside at atmospheric pressure. In this case, the X-Y stage comprises the ATM box. Located inside the, may further include a Y-axis driving motor coupled to the shaft to the pinion.

The Z-axis driving unit may include a Z-axis driving rod that passes through the align chamber module from the outside to the inside and moves up and down, and is coupled to an X-Y stage; a bellows tube that surrounds the Z-axis driving rod inside the align chamber module and communicates with the through portion of the align chamber module; A Z-axis driving motor coupled to the Z-axis driving rod may be included outside the align chamber module.

According to another aspect of the present invention, an in-line deposition method in which a process for a substrate is performed while a substrate carrier on which a substrate is mounted continuously moves, comprising the steps of: carrying a test substrate into an in-line deposition system; mounting the test substrate to the substrate carrier; aligning the test substrate of the substrate carrier with a fine mask for forming subpixels; detecting an offset value between the aligned test substrate and the fine mask, and storing an offset value matched with an ID of the corresponding fine mask; When the substrate and the fine mask are aligned, a substrate aligning method of an inline deposition system includes aligning the substrate and the corresponding fine mask by applying a stored offset value of the corresponding fine mask.

At least one fine mask is circulated along the inline deposition system, and the step of storing the offset value includes measuring an offset value for each fine mask and storing an offset value matching an ID of the corresponding fine mask. steps may be included.

According to an embodiment of the present invention, in an inline deposition system, an offset value of an entire fine mask that circulates without performing deposition on a test substrate is calculated, and the offset value is reflected to precisely align the fine mask with the substrate of the substrate carrier. can be done

1 is a diagram for explaining the configuration of an inline deposition system according to an embodiment of the present invention;
2 is a diagram illustrating an align chamber module of an inline deposition system according to an embodiment of the present invention.
3 is a view showing a position control unit of an offset detector according to an embodiment of the present invention.
4 is a view showing a vision unit of an offset detector according to an embodiment of the present invention.
5 is a diagram illustrating an alignment state of a substrate and a fine mask in an inline deposition system according to an embodiment of the present invention.
6 is a detailed view of part A of FIG. 5;
7 is a flowchart of a method for aligning a substrate of an inline deposition system according to another embodiment of the present invention.

Since the present invention can apply various transformations and have various embodiments, specific embodiments will be illustrated in the drawings and described in detail in the detailed description. However, it should be understood that this is not intended to limit the present invention to specific embodiments, and includes all transformations, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the present invention, if it is determined that a detailed description of related known technologies may obscure the gist of the present invention, the detailed description will be omitted.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. These terms are only used for the purpose of distinguishing one component from another.

Terms used in this application are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, terms such as "comprise" or "have" are intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.

Hereinafter, an embodiment of an inline deposition system according to the present invention and a method for aligning a substrate of the inline deposition system will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same or corresponding components are the same. Reference numbers are given and overlapping descriptions thereof will be omitted.

1 is a diagram for explaining the configuration of an inline deposition system according to an embodiment of the present invention. 2 is a view showing an align chamber module of an inline deposition system according to an embodiment of the present invention, and FIG. 3 is a view showing a position control unit of an offset detector according to an embodiment of the present invention. 4 is a diagram showing a vision unit of an offset detector according to an embodiment of the present invention. Further, FIG. 5 is a view showing an alignment state of a substrate and a fine mask in an inline deposition system according to an embodiment of the present invention, and FIG. 6 is a view showing part A of FIG. 5 in detail.

1 to 6, an inline deposition system 10, a substrate 11, a load lock chamber module 12, fine masks 13 and 13', a substrate mounting chamber module 14, and an align chamber module 16 ), R deposition chamber module 18, mask separation chamber module 20, mask return line 22, G deposition chamber module 24, B deposition chamber module 26, substrate separation chamber module 28, substrate A carrier return line 30, an aligner 32, a substrate carrier 34, a substrate carrier transfer unit 36, an offset detector 38, a vision unit 40, a position control unit 42, a control PC 44, Camera 46, objective lens 48, viewport 50, ATM box 52, feedthrough 54, control cable 56, X-Y stage 58, Z-axis drive unit 60 , LM guide (62), ball screw (64), motor box (66), moving part (68), rack gear (70), pinion (72), Y-axis drive motor (74) , a Z-axis driving rod 76, a Z-axis driving motor 77, a bellows tube 78, an electrode 80, and a sub-pixel pattern 82 are shown.

The inline deposition system 10 according to the present embodiment is an inline deposition system 10 in which a process for the substrate 11 is performed while the substrate carrier 34 on which the substrate 11 is mounted is continuously moved. an align chamber module 16 in which the substrate 11 of (34) and a fine mask 13 for forming subpixels are aligned; deposition chamber modules 18, 24, 26 installed at the rear end of the align chamber module 16 to perform deposition on the substrate 11; a mask separation chamber module 20 installed at a rear end of the deposition chamber modules 18, 24 and 26 to separate the substrate carrier 34 and the fine mask 13; It includes a mask return line 22 for returning the separated fine mask 13 to the align chamber module 16, and the align chamber module 16 includes the aligned substrate 11 and the fine mask 13 and an offset detector 38 that detects an offset value of

In this embodiment, chamber modules such as the align chamber module 16, the deposition chamber modules 18, 24, and 26, and the substrate mounting chamber module 14 have a high vacuum inside during process processing on the substrate 11. It means a module in the form of a chamber that performs a process on the substrate 11, including a chamber made of and various instruments mounted inside the chamber for the process of the substrate 11.

The inline deposition system 10 according to the present embodiment includes a plurality of chamber modules disposed in communication with each other while performing an individual process on a substrate 11, and a plurality of chamber modules disposed in the plurality of chamber modules to transfer a substrate carrier 34. and a substrate carrier transfer unit 36 . The inside of the inline deposition system 10 in which a plurality of chamber modules are connected to each other is maintained in a high vacuum state.

Referring to FIG. 1 , each chamber module of the inline deposition system 10 according to the present embodiment will be described in detail.

The load lock chamber module 12 is a chamber module for entering the substrate 11 located at atmospheric pressure outside the inline deposition system 10 into the inline deposition system 10 maintained in a high vacuum state. With respect to (10), the load lock chamber module 12 is airflow-disconnected, the substrate 11 is introduced into the atmospheric pressure state, sealed, and then made into a high vacuum state again to bring the substrate 11 into the inside of the inline deposition system 10. ) to enter.

The substrate loading chamber module 14 is a chamber module for loading the substrate 11 entering the inline deposition system 10 onto the substrate carrier 34, and the substrate carrier 34 on which the substrate 11 is mounted is the substrate carrier. Depositing is performed on the substrate 11 while moving inside the inline deposition system 10 along the transfer unit 36 .

The substrate loading chamber module 14 is installed in front of the align chamber module 16 to be described later, and the substrate carrier 34 on which the substrate 11 is mounted in the substrate loading chamber module 14 is the align chamber module at the rear end. After entering into (16) and aligned with the fine mask 13, alignment is achieved by bonding.

In the alignment chamber module 16, the substrate 11 of the substrate carrier 34 and the fine mask 13 for forming subpixels are aligned. The substrate carrier 34 on which the substrate 11 is mounted in the substrate mounting chamber module 14 enters the alignment chamber module 16 at the rear end, and the substrate of the substrate carrier 34 in the alignment chamber module 16 ( 11) and the fine mask 13 for subpixel formation are aligned.

The fine mask 13 for subpixel formation is a mask that contrasts with an open mask having an open front surface, and a pattern for subpixels corresponding to each subpixel to form R, G, and B subpixels constituting one pixel ( 82) is formed.

The fine mask 13 is a fine mask for R sub-pixels on which a pattern is formed corresponding to the position of the R sub-pixel to form an R sub-pixel, and a pattern is formed corresponding to the position of a G sub-pixel to form a G sub-pixel. It includes a fine mask for R sub-pixels and a fine mask for R sub-pixels on which a pattern is formed corresponding to the location of the R sub-pixels to form R sub-pixels, and the deposition chamber modules 18, 24, and 26 of each sub-pixel are included. While the fine mask 13 for the corresponding sub-pixel circulates through the mask return line 22 to the center, the corresponding sub-pixel is deposited on the new substrate 11 .

According to this embodiment, the offset detector 38 is built into the align chamber module 16 to detect an offset between the aligned substrate 11 and the fine mask 13 .

In the alignment chamber module 16, the substrate 11 mounted on the substrate carrier 34 and the fine mask 13 are aligned. As shown in FIGS. 5 and 6, the test substrate 11 and the fine mask 13 are aligned. In the state where the sub-pixel fine mask 13' is aligned and attached, the offset detector 38 measures the offset value of the fine mask 13' and matches the ID of the fine mask 13'. The offset value is saved.

Meanwhile, the align chamber module 16 includes an aligner 32 for aligning the substrate 11 of the substrate carrier 34 and the fine mask 13, and the test substrate 11 is When the offset value of the fine mask 13 is measured through the above, the stored offset value of the fine mask 13 to be aligned is applied to align the substrate 11 on which actual deposition is performed and the corresponding fine mask 13 to obtain more precise The substrate 11 and the corresponding fine mask 13 are aligned.

Referring to FIG. 1 , an align chamber module 16 for aligning the substrate 11 of the substrate carrier 34 and the corresponding fine mask 13 is disposed at the front end of each deposition chamber module for sub-pixel deposition. do.

In this embodiment, after aligning the substrate 11 mounted on the substrate carrier 34 and the fine mask 13 and attaching the fine mask 13 to the substrate carrier 34, the substrate 11 and the fine mask 13 ) is presented, but the substrate carrier is mounted on the mask carrier in a state where the substrate and the fine mask are aligned on the mask carrier (not shown) on which the fine mask is mounted. It is also possible to configure deposition to be performed while the mask carrier on which is mounted is transported.

The deposition chamber modules 18, 24, and 26 are installed at the rear end of the align chamber module 16 to perform deposition on the substrate 11, and when the deposition on the pixels is completed, they are installed at the rear end of the deposition chamber module. The substrate carrier 34 and the fine mask 13 are separated in the mask separation chamber module 20 .

In this embodiment, the deposition chamber module is configured to perform deposition on each sub-pixel. Referring to FIG. 1, the R deposition chamber module 18 performs deposition on the R sub-pixel and deposition on the G sub-pixel. A G deposition chamber module 24 for performing deposition and a B deposition chamber module 26 for performing deposition on B sub-pixels are arranged in a linear shape, and the substrate 11 of the substrate carrier 34 is disposed at the front end of each deposition chamber module. Align chamber modules 16 for aligning the fine mask 13 corresponding to the corresponding sub-pixel are respectively disposed. In addition, a mask separation chamber module 20 is installed at the rear end of each deposition chamber module to separate the fine mask 13 from the substrate carrier 34 on which the deposition of each sub-pixel is completed. The separated fine mask 13 is returned to the align chamber module 16 through the mask return line 22 .

Referring to FIG. 1 , the mask return line 22 connects the mask separation chamber module 20 and the align chamber module 16, and the fine mask 13 separated from the mask separation chamber module 20 is sheared. It is returned to the alignment chamber module 16 and aligned again with the new substrate carrier 34 to cycle the fine mask 13.

By arranging the mask return line 22 connecting the mask separation chamber module 20 and the align chamber module 16, at least one fine mask 13 is formed by the alignment chamber module 16, the deposition chamber module and the mask. It circulates along the return line 22 and is aligned with the substrate 11 of the continuously supplied substrate carrier 34 to proceed with the deposition process on the substrate 11 .

Before the deposition process on the substrate 11 is performed in earnest, the offset detector 38 of each alignment chamber module 16 aligns the test substrate 11 and the fine mask 13 to detect fine Measure the offset value for the mask 13, store the offset value matching the ID of the fine mask 13, and perform deposition on the actual substrate 11, the corresponding fine aligned with the substrate 11 By reflecting the offset value of the mask 13 and aligning the substrate 11 and the corresponding fine mask 13, more precise deposition of sub-pixels can be performed.

Referring to FIG. 1 , at the rear end of the mask separation chamber module 20 installed at the rear end of the deposition chamber module 26 at the last stage, a substrate separation chamber module 28 for separating the substrate 11 from the substrate carrier 34 is provided. can be installed.

In the substrate mounting chamber module 14, the substrate carrier 34 on which the substrate 11 is mounted passes through the alignment chamber module 16 and the deposition chamber modules 18, 24, and 26 for each sub-pixel, respectively. 11), the R, G, and B sub-pixels are deposited, and the substrate 11 on which the R, G, and B sub-pixels are deposited is separated from the substrate separation chamber module 28 and transferred to a subsequent process.

The substrate carrier 34 from which the substrate 11 is separated is returned to the substrate mounting chamber module 14 through the substrate carrier return line 30 connecting the substrate separation chamber module 28 and the substrate mounting chamber module 14. do. The substrate carrier 34 returned to the substrate mounting chamber module 14 loads a new substrate 11 entered into the load lock chamber module 12 and continuously performs the above-described process.

2 shows the align chamber module 16 of the inline deposition system 10 according to this embodiment, and FIG. 3 shows the position controller 42 of the offset detector 38 according to this embodiment. 4 shows the vision unit 40 of the offset detector 38 according to the present embodiment.

Hereinafter, the offset detector 38 installed inside the align chamber module 16 will be described in detail with reference to FIGS. 2 to 4 .

The offset detector 38 according to the present embodiment includes a vision unit 40 that acquires an image by photographing the lower surface of the fine mask 13 aligned with the substrate 11; a position controller 42 for controlling the position of the vision unit 40 to scan the lower surface of the fine mask 13; an offset calculator (not shown) that calculates an offset value of the fine mask 13 through the image; A storage unit (not shown) is included to store an offset value matched with a corresponding ID of the fine mask 13 .

The offset detector 38 according to the present embodiment is installed below the alignment chamber module 16 and obtains an image of the fine mask 13 aligned with the substrate 11 located on the top, thereby forming the fine mask 13. Calculate the offset value of

The vision unit 40 is for obtaining an image of the fine mask 13 aligned with the substrate 11, and corresponds to a camera 46 for capturing an image and an objective lens 48 of the camera 46. It includes an ATM box 52 having a view port 50 and enclosing the camera 46 to maintain the interior at atmospheric pressure.

The inside of the inline deposition system 10 is in a high vacuum state, and the inside of the align chamber module 16 is also maintained in a high vacuum state. In the embodiment, as shown in FIG. 4, the camera 46 is configured to be enclosed in an ATM box 52, the interior of which is maintained at atmospheric pressure. A view port 50 made of a transparent material is provided on one side of the ATM box 52, and a camera 46 can capture an image through the view port 50.

The control cable 56 of the camera 46 inside the ATM box 52 is formed on the wall of the ATM box 52 feed-through 54 for cutting air flow and the feed-through formed on the wall of the alignment chamber module 16 It can be connected to the control PC 44 via 54.

The position control unit 42 is for controlling the position of the vision unit 40 so as to scan the lower surface of the fine mask 13, and the vision unit 40 corresponds to the wide substrate through the position control unit 42. In (13), the entire lower surface can be photographed.

Looking at the position control unit 42 according to this embodiment in more detail, the position control unit 42, as shown in Figure 2, X-Y stage 58 for controlling the position of the vision unit 40 in the X-Y direction; A Z-axis driving unit 60 for controlling the position of the X-Y stage 58 in the Z direction may be included.

The X-Y stage 58 is for controlling the position of the vision unit 40 in parallel with the lower surface of the fine mask 13, and the Z-axis driving unit 60 adjusts the height of the X-Y stage 58, X-Y Through the operation of the stage 58, if the fine mask 13 is scanned, the entire image can be acquired by adjusting the focus of the camera 46 through the operation of the Z-axis drive unit 60, and if the fine mask 13 is done. there is.

3 shows an X-Y stage 58, and the X-Y stage 58 according to this embodiment includes an LM guide 62 disposed along the X-axis direction; a moving unit 68 mounted on the moving block of the LM guide 62 in the Y-axis direction and moving along the LM guide 62; The vision unit 40 is coupled to the pinion 72, and includes rack-pinion gears 70 and 72 installed along the longitudinal direction of the moving unit 68.

Referring to FIG. 3, the LM guide 62 is disposed elongated along the X-axis direction, and the moving part 68 is mounted on the moving block of the LM guide 62 in the Y-axis direction to move along the LM guide 62 is configured to In this embodiment, the two LM guides 62 are arranged in parallel to each other, and both ends of the movable part 68 are fixed to the movable blocks of the two LM guides 62 to move the two movable blocks simultaneously to move the movable part 68 ) was configured to move along the X-axis. In this embodiment, the X-axis direction means the width direction or length direction of the substrate 11, and the Y-axis direction means a direction perpendicular to the X-axis.

For the movement of the movable block, a ball screw 64 screwed to the movable block may be disposed in each LM guide 62, and the movable block moves linearly according to the rotation of the ball screw 64.

A drive motor (not shown) for rotation of the ball screw 64 is built into a motor box 66 installed at one end of the LM guide 62 and maintained at atmospheric pressure to ensure normal operation.

The rack gear 70 is disposed in the moving part 68 along the longitudinal direction, and the vision part 40 is coupled to the pinion 72 meshed with the rack gear 70 so as to rotate the vision part according to the rotation of the pinion 72. (40) is configured to move linearly along the rack gear 70 (Y direction). The Y-axis driving motor 74 that provides rotation to the pinion 72 is placed inside the ATM box 52 of the vision unit 40 where the inside is maintained at atmospheric pressure to ensure normal operation.

The Z-axis driving unit 60 that controls the height of the X-Y stage 58 passes through the align chamber module 16 from the outside to the inside and moves up and down, and the Z-axis driving rod is coupled to the X-Y stage 58. (76) and; A bellows tube 78 that surrounds the Z-axis drive rod 76 inside the align chamber module 16 and communicates with the penetrating portion of the Z-axis drive rod 76; A Z-axis driving motor 77 coupled to the Z-axis driving rod 76 outside the align chamber module 16 may be included.

As shown in FIG. 2, the Z-axis driving rod 76 passes through the align chamber module 16 from the outside to the inside and is coupled to the X-Y stage 58, and is connected to the operation of the Z-axis driving motor 77. along the Z-axis direction to move the X-Y stage 58 in the vertical direction.

In this embodiment, two Z-axis drive rods 76 are arranged, and the two Z-axis drive rods are operated according to the operation of the Z-axis drive motor 77 located outside the align chamber module 16. The X-Y stage 58 is moved in the vertical direction while the 76 is simultaneously raised and lowered.

Since the outside of the align chamber module 16 is in an atmospheric pressure state and the inside of the align chamber module 16 is in a high vacuum state, the Z-axis driving rod 76 that goes up and down through the align chamber module 16 is It is necessary to be disconnected from the inside of the align chamber module 16 in terms of air flow.

The bellows pipe 78 surrounds the Z-axis drive rod 76 inside the align chamber module 16 and communicates with the through portion of the align chamber module 16, thereby providing Z-axis operation even when the Z-axis drive rod 76 operates. The shaft drive rod 76 may be disconnected from the align chamber module 16 through air flow. The Z-axis drive motor 77 is installed in an atmospheric pressure outside the align chamber module 16, so normal operation is guaranteed.

An offset calculation unit (not shown) calculates an offset value of the fine mask 13 through the image. The offset calculation unit may be implemented in the control PC 44 provided outside the align chamber module 16, and the image acquired by the vision unit 40 is fed through 54 for cutting off the air flow of the align chamber module 16. ) is transmitted to the external control PC 44, and the offset value of the fine mask 13 is calculated by the offset calculation unit using the transmitted image. The calculated offset value and the ID of the corresponding fine mask may be stored in a storage unit in the control PC 44 .

FIG. 5 shows an alignment state of the substrate 11 of the substrate carrier 34 and the fine mask 13, and FIG. 6 shows part A of FIG. 5 in detail.

FIG. 6 is a diagram briefly showing a part of an image acquired by the vision unit 40, and the electrode of the test substrate 11 through the G sub-pixel pattern 82 of the G sub-pixel fine mask 13'. 80 is shown in an exposed state, the offset value of the fine mask 13 can be calculated by measuring the degree of misalignment between the exposed electrode 80 of the corresponding sub-pixel and the pattern 82 for the corresponding sub-pixel. there is.

A storage unit (not shown) stores an offset value matched with a corresponding ID of the fine mask 13 . A unique ID is given to each fine mask 13, and when the offset value is measured through the above process, the ID of the mask and the offset value matching it are stored in the storage unit. As the storage unit, a storage memory of the control PC 44 provided outside the inline deposition chamber 10 may be used.

Hereinafter, referring to FIG. 1 , an operating method and an align method of the inline deposition system 10 according to the present embodiment will be described.

When the novel fine mask 13 is placed in the in-line deposition system 10, the offset value for each fine mask 13 is detected by carrying in the test substrate 11 before performing deposition on the actual substrate 11 Needs to be. In the case of this embodiment, since deposition on the test substrate 11 is not performed, the test substrate 11 can be recovered and recycled as a substrate 11 for deposition.

First, the test substrate 11 carried in through the load lock chamber module 12 is mounted on the substrate carrier 34 in the substrate mounting chamber module 14 . The substrate carrier 34 on which the test substrate 11 is mounted enters the alignment chamber module 16 disposed in front of the R deposition chamber module 18 and is aligned with the fine mask 13 for the R sub-pixel. When the fine mask 13 for the R sub-pixel is aligned, the offset detector 38 at the bottom detects the offset value of the fine mask 10 and stores the ID and offset value of the fine mask 10. When the offset value of the fine mask 13 is calculated, the substrate carrier 34 moves to the mask separation chamber module 20 at the rear end of the R deposition chamber module 18, and the substrate carrier 34 moves to the fine mask 13 ) is separated. The separated fine mask 13 moves through the mask return line 22 back to the alignment chamber module 16 at the front end and waits for alignment with the new test substrate 11 .

The substrate carrier 34 from which the fine mask 13 is separated enters the alignment chamber module 16 disposed in front of the G deposition chamber module 24 and is aligned with the fine mask 13 for the G sub-pixel. . When the fine mask 13 for the G sub-pixel is aligned, the offset detector 38 at the bottom detects the offset value of the fine mask 13 and stores the ID and offset value of the fine mask 13. When the offset value of the fine mask 13 is calculated, the fine mask 13 is separated from the substrate carrier 34 in the mask separation chamber module 20 at the rear of the G deposition chamber module 24, and the separated fine mask (13) moves back to the alignment chamber module 16 at the front end through the mask return line 22 and waits for alignment with the test substrate 11.

The substrate carrier 34 from which the fine mask 13 is separated enters the alignment chamber module 16 disposed in front of the B deposition chamber module 26 and is aligned with the fine mask 13 for the B sub-pixel. . When the fine mask 13 for the B sub-pixel is aligned, the offset detector 38 at the bottom detects the offset value of the mask and stores the ID and offset value of the fine mask 13. When the offset value of the fine mask 13 is calculated, the fine mask 13 is separated from the mask separation chamber module 20 at the rear end of the B deposition chamber module 26 in the substrate carrier 34, and the separated fine mask (13) moves to the previous alignment chamber module 16 again through the mask return line 22 and waits for alignment with the new test substrate 11.

Meanwhile, the substrate carrier 34 from which the B sub-pixel fine mask 13 is separated moves to the substrate separation chamber module 28 at the rear, and the test substrate 11 is separated from the substrate separation chamber module 28, The substrate carrier 34 from which the test substrate 11 is separated is returned to the substrate mounting chamber module 14 through the substrate carrier return line 30 . The separated test substrate 11 is taken out of the inline deposition system 10 .

For one test substrate 11, offset values for three fine masks 13, such as an R sub-pixel fine mask, a G sub-pixel fine mask, and a G sub-pixel fine mask, can be detected. The above process is repeated to store offset values for each of the entire fine masks 13 disposed inside the inline deposition system 10 .

An offset value of each fine mask 13 circulating inside the inline deposition system 10 through the test substrate 11 is derived, and deposition on the actual substrate 11 is performed.

When depositing on the actual substrate 11, the deposition substrate 11 and the corresponding fine mask 13 are aligned by reflecting the offset value of the fine mask 13 obtained through the above process, and deposition is performed.

7 is a flowchart of a method for aligning the substrate 11 of the inline deposition system 10 according to another embodiment of the present invention.

In the method of aligning the substrate 11 of the inline deposition system 10 according to the present embodiment, a process for the substrate 11 is performed while the substrate carrier 34 on which the substrate 11 is mounted is continuously moved. A method comprising: loading a test substrate (11) into an inline deposition system (10); mounting the test substrate 11 on the substrate carrier 34; aligning the test substrate 11 of the substrate carrier 34 with a fine mask 13 for forming subpixels; detecting an offset between the aligned test substrate 11 and the fine mask 13 and storing the offset value matched with the ID of the corresponding fine mask 13; When the deposition substrate 11 and the fine mask 13 are aligned, a step of aligning the substrate 11 and the corresponding fine mask 13 by applying the stored offset value of the corresponding fine mask 13 is included.

Referring to FIG. 1 , a method of aligning the substrate 11 of the inline deposition system 10 according to the present embodiment will be described.

First, the test substrate 11 is carried into the inline deposition system 10 (S100).

When the novel fine mask 13 is placed in the in-line deposition system 10, the offset value for each fine mask 13 is detected by carrying in the test substrate 11 before performing deposition on the actual substrate 11 Needs to be. The test substrate 11 is loaded into the inline deposition system 10 through the load lock chamber of the inline deposition system 10 .

Next, the test substrate 11 is mounted on the substrate carrier 34 (S200).

The test substrate 11 entering the inline deposition system 10 is mounted on the substrate carrier 34 in the substrate mounting chamber module 14 . An offset value of the fine mask 13 is calculated while the substrate carrier 34 on which the test substrate 11 is mounted moves inside the inline deposition system 10 .

Next, the test substrate 11 of the substrate carrier 34 and the fine mask 13 for forming subpixels are aligned (S300). The substrate carrier 34 on which the test substrate 11 is mounted enters the alignment chamber module 16 disposed in front of the deposition chamber module and is aligned with the fine mask 13 for forming subpixels.

Next, an offset value of the aligned test substrate 11 and the fine mask 13 is detected, and the offset value matched with the ID of the fine mask 13 is stored (S400). When the fine mask 13 is aligned in the alignment chamber module 16, the offset detector 38 at the bottom detects the offset value of the fine mask 13 and stores the ID and offset value of the fine mask 13 do.

At least one fine mask 13 may be cycled along the inline deposition system 10. In this case, in this step, an offset value is measured for each fine mask 13 and the ID of the fine mask 13 is determined. Saves the offset value matching with .

In the inline deposition system 10, an R deposition chamber module 18, a G deposition chamber module 24, and a B deposition chamber module 26 for forming R, G, and B sub-pixels may be linearly arranged, respectively. In the alignment chamber module 16 disposed in front of the deposition chamber module, an offset value is set for each of the fine mask 13 for the R sub-pixel, the fine mask 13 for the G sub-pixel, and the fine mask 13 for the B sub-pixel. It can be calculated and the ID and offset value of the corresponding fine mask 13 can be stored.

Next, when the substrate 11 and the fine mask 13 are aligned, the substrate 11 and the fine mask 13 are aligned by reflecting the stored offset value of the corresponding fine mask 13 (S500) . When the offset value for each of the entire fine masks 13 disposed inside the inline deposition system 10 is stored according to the above method, during deposition on the substrate 11 for actual deposition, the fine mask 13 obtained through the process Reflecting the offset value of , the deposition substrate 11 and the corresponding fine mask 13 are aligned and deposition is performed.

Although the above has been described with reference to specific embodiments of the present invention, those skilled in the art can make various modifications to the present invention within the scope not departing from the spirit and scope of the present invention described in the claims below. It will be understood that it can be modified and changed accordingly.

Many embodiments other than those described above are within the scope of the claims of the present invention.

10: in-line deposition system 11: substrate
12: load lock chamber module 13, 13 ': fine mask
14: substrate mounting chamber module 16: align chamber module
18, 24, 26: deposition chamber module 20: mask separation chamber module
22: mask return line 28: substrate separation chamber module
30: substrate carrier return line 32: aligner
34: substrate carrier 36: substrate carrier transfer unit
38: offset detector 40: vision unit
42: position controller 44: control PC
46: camera 48: objective lens
50: view port 52: ATM box
54; feedthrough 56: control cable
58: XY stage 60: Z-axis drive unit
62: LM guide 64: ball screw
66: motor box 68: moving part
70: rack gear 72: pinion
74: Y-axis drive motor 76: Z-axis drive rod
77: Z-axis drive motor 78: bellows tube
80: electrode 82: pattern for subpixels

Claims (13)

An in-line deposition system in which a process for a substrate is performed while a substrate carrier on which a substrate is mounted continuously moves,
an align chamber module in which the substrate of the substrate carrier and a fine mask for forming subpixels are aligned;
a deposition chamber module installed at a rear end of the align chamber module to perform deposition on the substrate;
a mask separation chamber module installed at a rear end of the deposition chamber module to separate the substrate carrier from the fine mask;
A mask return line for returning the separated fine mask to the align chamber module,
The align chamber module may include an offset detector that detects an offset between the aligned substrate and the fine mask.
According to claim 1,
At least one fine mask is circulated along the align chamber module, the deposition chamber module, and the mask return line;
The inline deposition system of claim 1 , wherein the offset detector measures an offset value for each of the fine masks and stores an offset value matched with an ID of the corresponding fine mask.
According to claim 2,
The align chamber module,
an aligner for aligning the substrate and the fine mask of the substrate carrier;
The aligner,
The inline deposition system characterized in that the substrate and the corresponding fine mask are aligned by reflecting the stored offset value of the fine mask to be aligned.
According to claim 1,
a substrate mounting chamber module installed in front of the align chamber module and in which the substrate is mounted on the substrate carrier;
The inline deposition system further comprises a substrate separation chamber module installed at a rear end of the mask separation chamber module and separating the substrate from the substrate carrier.
According to claim 4,
and a substrate carrier return line connecting the substrate separation chamber module and the substrate mounting chamber module and returning the substrate carrier from which the substrate is separated to the substrate mounting chamber module.
According to claim 1,
The offset detector,
a vision unit that acquires an image by photographing the lower surface of the fine mask aligned with the substrate;
a position controller for controlling the position of the vision unit to scan the lower surface of the fine mask;
an offset calculation unit that calculates an offset value of a fine mask through the image;
and a storage unit for storing an offset value matched with a corresponding ID of the fine mask.
According to claim 6,
The vision part,
a camera for capturing the image;
An inline deposition system comprising: an ATM box having a view port corresponding to a lens of the camera and enclosing the camera to maintain an interior at atmospheric pressure.
According to claim 6,
The position control unit,
an XY stage for controlling the position of the vision unit in the XY direction;
Characterized in that it comprises a Z-axis driving unit for controlling the position of the XY stage in the Z direction, the in-line deposition system.
According to claim 8,
The XY stage,
an LM guide disposed along the X-axis direction;
a moving unit mounted on the moving block of the LM guide in the Y-axis direction and moving along the LM guide;
The in-line deposition system characterized in that it comprises a rack-pinion gear coupled to the vision unit to the pinion and installed along the longitudinal direction of the moving unit.
According to claim 9,
The vision part,
a camera for capturing the image;
An ATM box having a view port corresponding to the lens of the camera and enclosing the camera to maintain the inside at atmospheric pressure,
The XY stage,
The in-line deposition system further comprises a Y-axis drive motor located inside the ATM box and having a shaft coupled to the pinion.
According to claim 8,
The Z-axis drive unit,
a Z-axis driving rod that penetrates the align chamber module from the outside to the inside and moves up and down in a vertical direction and is coupled to an XY stage;
a bellows tube that surrounds the Z-axis driving rod inside the align chamber module and communicates with the through portion of the align chamber module;
And a Z-axis driving motor coupled to the Z-axis driving rod outside the align chamber module.
An in-line deposition method in which a process for a substrate is performed while a substrate carrier on which a substrate is mounted is continuously moved,
loading the test substrate into the inline deposition system;
mounting the test substrate to the substrate carrier;
aligning the test substrate of the substrate carrier with a fine mask for forming subpixels;
detecting an offset value between the aligned test substrate and the fine mask, and storing an offset value matched with an ID of the corresponding fine mask;
and aligning the substrate and the corresponding fine mask by applying a stored offset value of the corresponding fine mask when the substrate and the fine mask are aligned.
According to claim 12,
At least one fine mask is circulated along the inline deposition system;
In the step of storing the offset value,
The method of aligning a substrate of an inline deposition system comprising measuring an offset value for each of the fine masks and storing an offset value matched with an ID of the corresponding fine mask.

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