KR20230101138A - Printed circuit board - Google Patents

Abstract

The present disclosure includes a printed circuit board comprising an insulating layer containing fiber tissue, and a cavity penetrating the insulating layer, and the fiber tissue protrudes by the cavity and on a plane, the protruding fiber tissue forms an acute or obtuse angle with the wall surface of the cavity. It is about.

Description

Printed circuit board {PRINTED CIRCUIT BOARD}

The present disclosure relates to printed circuit boards.

In order to cope with the recent trend of light weight and miniaturization of mobile devices, there is an increasing need to realize light, thin and small size in printed circuit boards mounted thereon. On the other hand, as mobile devices are becoming light, thin and compact, in response to the technological demands, technology for inserting electronic components such as ICs, active elements or passive elements into a board is required in terms of shortening the connection path between electronic parts and improving noise. Recently, research on technologies for embedding components in boards in various ways has been continued.

In particular, in order to insert various parts into the board, a substrate structure including a cavity is formed, and when forming the cavity, materials in the insulating layer protrude and act as an obstacle to inserting electronic components, so research to solve this problem continues. .

One of the various objects of the present disclosure is to provide a printed circuit board that is easy to manufacture.

Another object of the present disclosure is to provide a printed circuit board with less protruding fiber structure due to a cavity formed in an insulating layer.

Another object of the present disclosure is to provide a method for manufacturing a printed circuit board capable of improving reliability.

One of the various solutions proposed through the present disclosure includes an insulating layer containing a fibrous tissue, a cavity penetrating the insulating layer, and the fibrous tissue protrudes from the cavity, and on a plane, the protruding fibrous tissue extends through the cavity. To provide a printed circuit board forming an acute angle or an obtuse angle with the wall surface.

As one of the various effects of the present disclosure, it is possible to provide a printed circuit board that is easy to manufacture.

As another effect among the various effects of the present disclosure, it is possible to provide a printed circuit board with less protruding fiber structure due to a cavity formed in an insulating layer.

As another effect among various effects of the present disclosure, a method for manufacturing a printed circuit board capable of improving reliability can be provided.

1 is a block diagram schematically illustrating an example of an electronic device system.
2 is a perspective view schematically showing an example of an electronic device.
3 is a plan view showing a side surface of a printed circuit board according to an embodiment of the present invention.
FIG. 4 is a plan view schematically illustrating a top view of a printed circuit board according to the first embodiment based on area A of FIG. 3 .
FIG. 5 is a plan view schematically illustrating a top view of a printed circuit board according to the second embodiment based on area A of FIG. 3 .
6 is a plan view illustrating a side surface of a printed circuit board in which electronic components are embedded according to an embodiment of the present invention.
7 is a plan view illustrating a side surface of a printed circuit board in which electronic components are embedded according to another embodiment of the present invention.

Hereinafter, the present disclosure will be described with reference to the accompanying drawings. The shapes and sizes of elements in the drawings may be exaggerated or reduced for clearer description.

Electronics

1 is a block diagram schematically illustrating an example of an electronic device system.

Referring to the drawing, the electronic device 1000 accommodates the main board 1010. A chip-related component 1020, a network-related component 1030, and other components 1040 are physically and/or electrically connected to the main board 1010. These are combined with other electronic components to be described later to form various signal lines 1090 .

The chip-related component 1020 includes memory chips such as volatile memory (eg, DRAM), non-volatile memory (eg, ROM), and flash memory; Application processor chips such as central processors (eg, CPU), graphic processors (eg, GPUs), digital signal processors, encryption processors, microprocessors, and microcontrollers; Logic chips such as an analog-to-digital converter and an application-specific IC (ASIC) are included, but are not limited thereto, and other types of chip-related electronic components may be included as well. In addition, it goes without saying that these chip-related components 1020 may be combined with each other. The chip-related component 1020 may be in the form of a package including the aforementioned chip or electronic component.

As the network related parts 1030, Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM , GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G, and any other wireless and wired protocols designated thereafter, including, but not limited to, many other wireless or wired protocols. Any of the standards or protocols may be included. In addition, it goes without saying that the network-related components 1030 and the chip-related components 1020 may be combined with each other.

The other parts 1040 include high-frequency inductors, ferrite inductors, power inductors, ferrite beads, LTCC (low Temperature Co-Firing Ceramics), EMI (Electro Magnetic Interference) filters, MLCC (Multi-Layer Ceramic Condenser), and the like. . However, it is not limited thereto, and in addition to this, passive elements in the form of chip components used for various other purposes may be included. In addition, it goes without saying that the other component 1040 may be combined with the chip-related component 1020 and/or the network-related component 1030.

Depending on the type of electronic device 1000 , the electronic device 1000 may include other electronic components that may or may not be physically and/or electrically connected to the main board 1010 . Examples of other electronic components include a camera module 1050, an antenna module 1060, a display 1070, and a battery 1080. However, it is not limited thereto, and audio codecs, video codecs, power amplifiers, compasses, accelerometers, gyroscopes, speakers, mass storage devices (eg, hard disk drives), CDs (compact disks), DVDs (digital versatile disks), etc. may be In addition to this, it goes without saying that other electronic components used for various purposes may be included depending on the type of the electronic device 1000 .

The electronic device 1000 includes a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, a computer ( computer, monitor, tablet, laptop, netbook, television, video game, smart watch, automotive, and the like. However, it is not limited thereto, and may be any other electronic device that processes data in addition to these.

2 is a perspective view schematically showing an example of an electronic device.

Referring to the drawing, the electronic device may be, for example, a smart phone 1100. A motherboard 1110 is accommodated inside the smart phone 1100, and various parts 1120 are physically and/or electrically connected to the motherboard 1110. In addition, other components that may or may not be physically and/or electrically connected to the motherboard 1110, such as the camera module 1130 and/or the speaker 1140, are accommodated therein. Some of the components 1120 may be the aforementioned chip-related components, for example, the component package 1121, but is not limited thereto. The component package 1121 may be in the form of a printed circuit board on which electronic components including active components and/or passive components are surface mounted. Alternatively, the component package 1121 may be in the form of a printed circuit board in which active components and/or passive components are embedded. On the other hand, the electronic device is not necessarily limited to the smart phone 1100, and may be other electronic devices as described above, of course.

printed circuit board

In the present disclosure, the meaning of "on a plane" means a planar shape when looking at the printed circuit board from the top in the thickness direction of the printed circuit board, that is, a planar shape when viewed from the top-view or bottom-view of the printed circuit board. can do.

In the present disclosure, the meaning of “substantially” may include process errors, positional deviations, errors in measurement, and the like that occur in the manufacturing process. For example, the fact that the outer surface of the insulation layer and the fiber structure included in the insulation layer are substantially parallel or perpendicular on a plane means that the fiber structure is approximately parallel or perpendicular to the outer surface of the insulation layer when viewed from the top-view of the printed circuit board. Having one shape, the angle formed by the fiber structure and the outer surface of the insulating layer may be 0 °, 90 °, or 180 °, and may mean having an angle difference of ± 10 ° or less.

In the present disclosure, the meaning of “extended surface” may refer to all surfaces that may be formed by extending each edge of one surface. For example, if the extending surface of the cavity and the outer surface of the insulating layer are substantially parallel or perpendicular, one surface of the cavity may not meet the outer surface of the insulating layer, but the surface that can be made by extending the edge of one surface of the cavity is the insulating layer. It may mean forming a substantially parallel or perpendicular to the outer surface of.

3 is a plan view showing a side surface of a printed circuit board according to an embodiment of the present invention.

Referring to the drawings, the printed circuit board 100 according to an example includes a first insulating layer 10 including a fiber structure 11, a cavity C penetrating the first insulating layer 10, and fibers Tissue 11 may protrude through cavity C.

The first insulating layer 10 may be CCL (Copper Clad Laminate), but is not limited thereto, and various other insulating layers may be used without particular limitation. In addition, the material for forming the insulating layer 10 is a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a resin in which these resins are impregnated in a core material such as glass cloth (glass fabric) together with an inorganic filler, For example, it may include prepreg, ABF (Ajinomoto Build-up Film), FR-4, BT (Bismaleimide Triazine), etc., but is not particularly limited thereto.

In addition, glass fiber has a low coefficient of thermal expansion and a high modulus, so it serves to increase the strength of the printed circuit board. Accordingly, an insulating layer impregnated with glass fibers is used for the innermost layer of a typical printed circuit board. Here, the glass fiber 11 of the first insulating layer 10 may include E-glass, D-glass, T-glass, or NE-glass, but is not particularly limited thereto.

In the glass fiber 11, a plurality of fiber strands may be substantially parallel or perpendicular to each other on a plane. The plurality of fiber strands may cross each other substantially parallel or perpendicular to each other on a plane to form a fiber bundle, and the glass fibers 11 may have a fabric structure woven in a weave such that these fiber bundles are substantially parallel or perpendicular to each other. , but is not particularly limited thereto. That is, the glass fibers 11 may include a plurality of fiber bundles substantially parallel or perpendicular to each other on a plane.

In addition, the plurality of fiber bundles constituting the glass fibers may have a substantially mesh shape on a plane. Here, the mesh structure is a structure similar to a mesh, and includes a plurality of first straight lines disposed substantially parallel along a first direction on a plane and a plurality of first straight lines extending generally in parallel along a second direction intersecting the first direction on a plane. It may be a structure formed by crossing two straight lines. A distance between adjacent first straight lines may be substantially the same, but is not limited thereto. The distance between adjacent second straight lines may be substantially the same, but is not limited thereto. The distance between the adjacent first straight lines may be substantially the same as the distance between the adjacent second straight lines, but is not limited thereto.

As described above, the glass fiber 11 may be a glass woven fabric obtained by weaving a glass fiber bundle having excellent heat resistance, dimensional stability, and electrical properties, and any material known in the art as a substrate for a printed wiring board may be used without particular limitation. . For example, there are unidirectional glass fiber fabrics, glass fiber fabrics having a one-sided combination structure, and double weave glass fiber fabrics, but are not particularly limited thereto.

The cavity C according to an embodiment of the present invention may be formed to pass through the first insulating layer 10 . The cavity C is formed in an area where the electronic component 50 will be disposed later, and may pass through only a portion of the first insulating layer 10 or through the entirety of the first insulating layer 10. It may be a generally known shape. That is, it may be in the form of a through cavity, a blind cavity, or a buried cavity, and other types of cavities that can be used by a person skilled in the art may be included.

In addition, the cavity (C) may be formed using a laser drill or mechanical drilling, but the method of forming the cavity (C) is not particularly limited thereto, any method used in the field may be applied.

On the other hand, the fibrous tissue 11 may protrude through the cavity (C). In the process of forming the cavity (C), it is preferable that the fibrous tissue 11 does not protrude and is removed along with the first insulating layer 10 so that the wall surface of the cavity (C) is uniform, but the other side of the first insulating layer 10 Since the components and the fiber structure 11 have different strengths, the fiber structure 11 may protrude during the formation of the cavity (C).

On the other hand, the printed circuit board 100 according to an example may further include the first circuit pattern 12 and the first through via 13 in addition to the above-described configuration, and a multilayer printed circuit board further including a plurality of insulating layers It could be. That is, a configuration that can be used by those skilled in the art may be further included.

FIG. 4 is a plan view schematically illustrating a top view of a printed circuit board according to the first embodiment based on area A of FIG. 3 .

In the printed circuit board 100 according to one example, the protruding fibrous tissue 11 may form an acute angle or an obtuse angle on a plane with the wall surface of the cavity C.

On the other hand, unlike the printed circuit board according to one example, when the textile tissue 11 is parallel or perpendicular to the wall surface of the cavity (C), the cavity (C) in the process of protruding the textile tissue 11 by the cavity (C) ), fiber strands parallel to one wall surface may protrude in single strands. In this case, the fiber strands may protrude long into the cavity (C), and in some cases may be broken inside the cavity (C), move on the inner surface of the cavity (C), and act as impurities in the cavity (C). In addition, the protruding fiber strands 11 generate smear along with the insulating resin, which is another component of the insulating layer 10, by the heat generated when the cavity C is formed, and the smear is formed on the inner wall of the cavity C. It is attached to cause a problem of deteriorating the quality of the printed circuit board when mounting the electronic component 50 or forming a circuit pattern.

In the printed circuit board according to one example, the protruding fibrous tissue 11 forms an acute angle or an obtuse angle on the wall surface of the cavity (C) and a plane, so that some strands of the fibrous tissue 11 are all exposed as described above, or Long protrusion of fiber strands is prevented, and protrusion of the fibrous tissue 11 can be minimized.

In the printed circuit board 100 according to an example, by minimizing the protruding fibrous tissue 11, the desmear process, which is a cleaning process for removing the protruding fibrous tissue 11 and smear, can be simplified, which This has the effect of improving quality and reducing cost. In particular, there is an effect of reducing abnormalities in the surface structure or discoloration of the substrate occurring in the desmear process.

In addition, the printed circuit board 100 according to an example mounts the electronic component 50 in the cavity C, such as separation, connection problems, twisting and cracking of the electronic component 50, by minimizing the protruding fiber structure 11. It is possible to improve problems that may occur when doing it, and it is possible to prevent substrate contamination due to the residue of the fiber structure (11).

In addition, in the printed circuit board 100 according to one example, the outer surface of the first insulating layer 10 and the fiber structure 11 included in the insulating layer 10 are substantially parallel or perpendicular to each other on a plane, and the insulating layer 10 The outer surface of and the extension surface of the wall of the cavity (C) form an acute or obtuse angle with each other, so that the fibrous tissue 11 protruding on the plane forms an acute or obtuse angle with the wall of the cavity (C).

In this case, when forming a cavity with respect to the printed circuit board in unit units from the insulating layer 10 containing the fiber tissue 11, the direction of the cavity is adjusted obliquely so that the fiber tissue protrudes by the cavity C (11) forms an acute or obtuse angle with the wall surface of the cavity (C). However, it is not limited thereto, and in addition, all cases in which the extension surface of the wall surface of the cavity C is disposed obliquely with the outer surface of the first insulating layer 10 to form an acute angle or an obtuse angle with each other may be included.

FIG. 5 is a plan view schematically illustrating a top view of a printed circuit board according to the second embodiment based on area A of FIG. 3 .

In the printed circuit board 100 according to an example, the outer surface of the first insulating layer 10 and the fiber structure 11 included in the insulating layer 10 form a substantially acute or obtuse angle on a plane, and the The outer surface and the extended surface of the wall of the cavity (C) are parallel or perpendicular to each other, so that the fibrous tissue 11 protruding on the plane forms an acute or obtuse angle with the wall of the cavity (C).

In this case, when preparing the unit-based printed circuit board from the insulating layer 10 including the fiber tissue 11, the unit unit is adjusted obliquely so that the fiber tissue 11 protrudes by the cavity C It forms an acute or obtuse angle with the wall surface of the cavity (C). However, it is not limited thereto, and in addition, the fibrous tissue 11 included in the first insulating layer 10 is disposed obliquely with respect to the outer surface of the first insulating layer 10 to form an acute angle or an obtuse angle. can

6 is a plan view illustrating a side surface of a printed circuit board in which electronic components are embedded according to an embodiment of the present invention.

Referring to FIG. 6 , in the printed circuit board 100A according to an example, a cavity C passes through the first insulating layer 10 . A second insulating layer 20 including a second circuit pattern 22 and a second through via 23 is disposed on the lower surface of the first insulating layer 10 to mount the electronic component 50 on the printed circuit board. And, the electronic component 50 may be mounted on the upper surface of the second insulating layer, but is not particularly limited thereto. Even in this case, the protruding fibrous tissue 11 acts as an obstacle when the electronic component 50 is mounted, and the protruding fibrous tissue 11 is less due to the cavity C formed in the first insulating layer 10. The fact that it is advantageous to mount the electronic component 50 is as described above.

Meanwhile, in addition to the configuration of the printed circuit board 100A according to the example, other configurations of the printed circuit board, such as other insulating layers, circuit patterns, and through-vias, may be further included. That is, a configuration that can be used by those skilled in the art may be further included.

7 is a plan view illustrating a side surface of a printed circuit board in which electronic components are embedded according to another embodiment of the present invention.

Referring to FIG. 7 , in the printed circuit board 100B according to one example, the cavity C penetrates only a portion of the first insulating layer 10 . The electronic component 50 is mounted on the bottom surface of the cavity C of the first insulating layer 10 . The depth of the cavity (C) formed in the first insulating layer may be the same as the thickness of the electronic component 50, but the depth of the cavity (C) to bury the electronic component 50 in the first insulating layer is the electronic component ( 50) may be deeper. Conversely, it may be buried in the third insulating layer (not shown), and the upper surface of the electronic component may be exposed by the cavity, so the depth of the cavity (C) may be shallower than the thickness of the electronic component 50 . That is, the depth of the cavity C formed in the first insulating layer is not particularly limited.

Even in this case, the protruding fibrous tissue 11 acts as an obstacle when the electronic component 50 is mounted, and the protruding fibrous tissue 11 is less due to the cavity C formed in the first insulating layer 10. The fact that it is advantageous to mount the electronic component 50 is as described above.

Meanwhile, in addition to the configuration of the printed circuit board 100B according to the example, other configurations of the printed circuit board, such as other insulating layers, circuit patterns, and through-vias, may be further included. That is, a configuration that can be used by those skilled in the art may be further included.

100, 100A, 100B: printed circuit board
10: first insulating layer 11: fiber structure
12: first circuit pattern 13: first through via
20: second insulating layer
22: second circuit pattern 23: second through via
50: electronic parts
C: Cavity
1000: electronic device 1010: main board
1020: chip related parts 1030: network related parts
1040: other parts 1050: camera module
1060: antenna module 1070: display
1080: battery 1090: signal line
1100: smartphone 1110: smartphone internal main board
1120: electronic components inside the smartphone
1121: smartphone internal antenna module
1130: smartphone internal camera module
1140: smartphone internal speaker

Claims (8)

An insulating layer containing glass fibers; and
a cavity penetrating the insulating layer; including,
At least a portion of the glass fiber protrudes from the wall surface of the cavity,
On a plane, at least some of the protruding glass fibers form an acute or obtuse angle with the wall surface of the cavity,
printed circuit board. According to claim 1,
On a plane, the outer surface of the insulating layer and the glass fibers are substantially parallel or perpendicular to each other,
The outer surface of the insulating layer and the extension surface of the wall of the cavity form an acute or obtuse angle with each other,
printed circuit board. According to claim 1,
On a plane, the outer surface of the insulating layer and the glass fibers form a substantially acute or obtuse angle,
The outer surface of the insulating layer and the extending surface of the wall of the cavity are substantially parallel or perpendicular to each other,
printed circuit board. According to claim 1,
The glass fibers include a plurality of fiber bundles substantially parallel or perpendicular to each other on a plane,
printed circuit board. According to claim 4,
In the glass fiber, the plurality of fiber bundles have a substantially mesh structure on a plane,
printed circuit board. According to claim 1,
The cavity penetrates a portion of the insulating layer,
printed circuit board. According to claim 1,
The cavity completely penetrates the insulating layer,
printed circuit board. According to claim 1,
An electronic component is disposed in the cavity,
printed circuit board.

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