KR20230096862A - Operation setting device, operation setting method and manufacturing method of electronic device - Google Patents

Abstract

Provided is a technology to improve the precision of substrate transfer to a deposition chamber. Provided is a motion setting device for setting the motion of a robot which has a hand on which the substrate is supported and transports the substrate to the deposition chamber, comprising: a jig supported by the hand instead of the substrate and equipped with measuring means; control means for controlling the robot so that the hand on which the jig is supported moves to a measurement position in the deposition chamber; and setting means for acquiring measurement results of the measurement means regarding the deposition chamber and setting an operation of the robot related to movement of the hand when transporting the substrate.

Description

Operation setting device, operation setting method, and electronic device manufacturing method

The present invention relates to a technique for setting an operation of a robot that transports a substrate.

In a system for transporting substrates by a robot, teaching work is performed to improve transport accuracy. The teaching operation is known by a method by visual confirmation by an operator, or by measuring a conveyance error using a sensor and correcting the control. Patent Documents 1 and 2 disclose examples of methods using sensors.

Patent Document 1: Japanese Patent Publication No. 2012-523682 Patent Document 2: Japanese Unexamined Patent Publication No. 2007-142269

In the manufacture of organic EL displays and the like, a deposition material is deposited on a substrate using a mask. If the conveyance accuracy of the substrate to the film formation chamber is low, the yield is reduced or it becomes a factor of error occurrence. For example, alignment of a mask and a substrate is generally performed as a preprocess for film formation in a film formation room. In alignment, the displacement of the substrate and the mask is detected, and the relative positions of the substrate and the mask are adjusted based on the detection result. In order to perform the alignment smoothly, it is necessary to accurately transport the substrate within the detection area of the substrate. However, if the substrate transport accuracy is low, the alignment cannot be performed smoothly.

An object of the present invention is to provide a technique for improving the precision of conveying a substrate to a film formation chamber.

According to the present invention,

An operation setting device for setting the operation of a robot carrying a substrate to a film formation chamber with a hand supporting a substrate, comprising:

a jig supported by the hand instead of the substrate and equipped with a measurement means;

control means for controlling the robot so that the hand supported by the jig moves to a measurement position with respect to the deposition chamber;

An operation setting device characterized by comprising a setting means for obtaining a measurement result of the measuring means for the film formation chamber and setting an operation of the robot in relation to movement of the hand during transport of the substrate. do.

ADVANTAGE OF THE INVENTION According to this invention, the technique of improving the conveyance precision of a board|substrate to a film formation room can be provided.

1 is a layout diagram of a processing system that is an application example of the present invention.
2 is a schematic diagram of the structure of a deposition chamber.
3 is a schematic diagram of the structure of a deposition chamber.
Fig. 4(A) is a side view of the transfer robot, and Fig. 4(B) is a plan view of the hand.
Fig. 5 (A) is a plan view of the jig T, and Fig. 5 (B) is a side view of the jig T.
Fig. 6(A) is a plan view of the jig T in a state of being mounted on a hand, and Fig. 6(B) is a side view of the jig T in a state of being mounted in a hand.
Fig. 7 is a diagram showing an example of characteristics of measured values (measured values) output from the measurement unit.
8 is a flowchart showing an example of processing executed by the control device.
Fig. 9(A) is an explanatory diagram of a measurement example by a measurement unit, and Fig. 9(B) is a diagram showing an example of a measurement result.
Fig. 10(A) is an explanatory diagram of a measurement example by the measurement unit, and Fig. 10(B) is an explanatory diagram of a detection example by the detection unit.
Fig. 11 (A) is a diagram showing an example in which the reference marks are shifted, and Fig. 11 (B) is a diagram showing an example in which the positions of the reference marks are appropriate.
12 is a flowchart showing an example of processing executed by the control device.
Fig. 13(A) is an explanatory diagram of a measurement example by a measurement unit, and Fig. 13(B) is a diagram showing an example of a measurement result.
It is explanatory drawing of the measurement example by the measurement unit of FIG.
15 is a flowchart showing an example of processing executed by the control device.
Fig. 16(A) is a diagram showing an example of a captured image under reduced pressure, and Fig. 16(B) is a diagram showing changes in pixel luminance of the captured image.
17 is a conceptual diagram of a method of setting a movement path using measurement results under various conditions.
18 is a schematic diagram showing an example of a measurement target of a measurement unit.
19(A) is an overall view of the organic EL display device, and (B) is a view showing a cross-sectional structure of one pixel.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment is described in detail with reference to an accompanying drawing. On the other hand, the following embodiment does not limit the invention concerning the claim. Although a plurality of features are described in the embodiment, not all of these plurality of features are essential to the invention, and a plurality of features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are attached to the same or similar structures, and overlapping descriptions are omitted.

<First Embodiment>

<Overview of the system>

1 is a layout diagram of a processing system 100 that is an application example of the present invention. The processing system 100 is an apparatus for forming a thin film (material layer) of a desired pattern on the surface of a substrate of a parallel flat plate by vacuum deposition. Any material such as glass, resin, metal, etc. can be selected as the material of the substrate, and any material such as organic material or inorganic material (metal, metal oxide, etc.) can be selected as the deposition material. The processing system 100 is applicable to, for example, manufacturing apparatuses such as electronic devices using organic thin films (for example, organic EL display devices and thin film solar cells) and optical members. More specifically, the processing system 100 is used for manufacturing a display panel of an organic EL display device for, for example, a smartphone. In the case of a display panel for a smartphone, for example, after forming an organic EL film on a substrate having a size of about 1800 mm x about 1500 mm and a thickness of about 0.5 mm, the substrate is diced to produce a plurality of small-sized panels.

The processing system 100 includes a film formation room 101, a transport room 102, a carrying-in room 103, a carrying-out room 104, a carrying robot 4, and a control device 1. . In the film formation chamber 101, a substrate holder 11 for mounting a substrate to be film formed is installed. In the transport room 102, a transport robot 4 that holds and transports the substrate W is installed.

The transport robot 4 transports the substrate to the film formation room 101 and also transports the substrate on which film formation has been completed from the film formation room 101 . The transport robot 4 of the present embodiment includes a hand 6 on which a substrate is supported, and an articulated robot arm 5 that moves the hand 6 three-dimensionally. Although the robot 4 for conveyance of this embodiment is equipped with two hands 6, the hand 6 may be one. The transfer robot 4 carries in/out of the board|substrate to each room. For example, a substrate is placed on the hand 6 in the carrying room 103, and the transport robot 4 transports it to the film forming room 101. Further, the substrate on which film formation has been completed in the film formation chamber 101 is placed on the hand 6 , and the transport robot 4 transports it to the carrying out chamber 104 . The board|substrate movement in the processing system 100 between each room can be performed freely via the robot 4 for conveyance.

Here, the coordinate axis of each room is defined. The Y-axis is taken in the horizontal direction toward the film formation chamber 101 as viewed from the transfer robot 4 . The X-axis is taken as the horizontal direction orthogonal to the Y-direction. The vertical direction orthogonal to the X-axis and the Y-axis is taken as the Z-axis. Let θ be the angle in the direction of rotation around the Z axis.

The structure of the film formation chamber 101 will be described with reference to FIGS. 2 and 3 . 2 is a schematic view of the structure of the film formation chamber 101 viewed in the X direction. 3 is a plan view of a part of the deposition chamber 101. As shown in FIG. The film formation chamber 101 is a chamber capable of airtightly maintaining its inside by its outer wall portion 101a. The film formation chamber 101 is depressurized and functions as a vacuum chamber when film formation processing is performed on the substrate W, and the chamber is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas.

A part of the outer wall portion 101a forms a partition that partitions between the film formation chamber 101 and the transfer chamber 102 . An opening OP is formed in this barrier rib. The gate valve 14 opens and closes the opening OP. The atmospheric pressure of the film formation chamber 101 and the transfer chamber 102 can be made different by the gate valve 14 . The hand 6 can enter the opening OP, and the transfer robot 4 carries the substrate W into the film formation chamber 101 through the opening OP, and also carries the substrate from the film formation chamber 101. (W) is exported.

Inside the deposition chamber 101, a substrate holder 11, a mask M, a deposition apparatus 8, and the like are installed. The substrate holder 11 is a member that holds the substrate W received from the transfer robot 4 . The mask M is a metal mask having an opening pattern corresponding to a thin film pattern formed on the substrate W, and is fixed on a frame-shaped mask stand (not shown). During film formation, the substrate W is placed on the mask M. A cooling plate may be installed on the substrate W. The cooling plate is a member that adheres to the surface of the substrate W on the opposite side to the surface facing the mask during film formation and suppresses the temperature rise of the substrate W, thereby suppressing deterioration or deterioration of the organic material. The cooling plate may also serve as a magnet plate. The magnet plate is a member that enhances adhesion between the substrate W and the mask M during film formation by attracting the mask with magnetic force.

The evaporation device 8 is composed of evaporation materials, a container (crucible) for accommodating the evaporation materials, a heater, a shutter, a drive mechanism of an evaporation device, an evaporation rate monitor, etc. form a tabernacle

In the film formation chamber 101, an alignment device 10 for positioning the substrate W and the mask M is installed. The alignment device 10 aligns the substrate W held by the substrate holder 11 and the mask M. The alignment device 10 moves a detection unit 12 that detects an alignment mark on a substrate W or a mask M, and a substrate holder 11 to determine the position of the substrate W relative to the mask M. A position adjustment mechanism 13 for adjustment is provided.

The detection unit 12 is a camera in this embodiment, and photographs the substrate W in the film formation chamber 101 through a transparent window provided in the outer wall portion 101a. The detection unit 12 is supported by the positioning unit 15, is movable by the positioning unit 15, and can adjust the focal length and the like. From the captured image of the detection unit 12, the alignment mark W1 on the substrate and the alignment mark on the mask M can be specified, and the XY positions of both and the relative displacement within the XY plane can be measured.

In order to align the substrate W with respect to the mask M in the horizontal and rotational directions, at least two detection units 12 are provided, but only one or three or more may be provided depending on the content of the alignment. . In addition, in order to realize high-precision alignment in a short time, it is better to perform alignment in two stages: first alignment (rough alignment) for rough alignment and second alignment (fine alignment) for high-precision alignment. desirable. In that case, you may provide two types of detection units in the detection unit for the 1st alignment of a low resolution but wide field of view, and the detection unit for 2nd alignment of high resolution although a narrow field of view.

The position adjustment mechanism 13 includes a plurality of actuators composed of, for example, a motor and a ball screw, a motor and a linear guide, and the like. For example, an actuator for moving the entire substrate holder 11 in the Z direction, an actuator for opening and closing the substrate holding/release mechanism of the substrate holder 11, and the substrate holder 11 in the X-Y direction and the θ direction and actuators that displace it. The position adjustment mechanism 13 of this embodiment performs position adjustment of the substrate W and the mask M by displacing the substrate holder 11, but the mask M may be displaced, and the substrate W and the mask ( M) Both sides may be displaced.

Fig. 4(A) is a side view of the transport robot 4, and Fig. 4(B) is a plan view of the hand 6. On the other hand, the configuration of the transfer robot (configuration of the robot arm and robot hand) described here is only an example, and is not limited to this configuration.

The transport robot 4 is roughly provided with a hand 6 for holding the substrate W and a robot arm 5 for freely moving the hand 6 to an arbitrary position on XYZ orthogonal coordinates. .

The robot arm 5 includes a base 510 fixed to the installation surface of the transfer room 102, and a first joint 520, a second joint 521, and a third joint 522 with respect to the base 510. It has a first arm 511, a second arm 512, and a third arm 513 sequentially connected through. The first arm 511 is rotatably connected to the base 510 via a first joint 520 about a rotation shaft extending in a direction (Z direction) perpendicular to the installation surface. The second arm 512 extends through the second joint 521 relative to the first arm 511 and through the third joint 522 relative to the third arm 513, respectively, in a direction perpendicular to the installation surface. It is rotatably connected around a rotational axis extending in (Z direction). Hands 6 are coupled to the tip (both ends) of the third arm 513 in pairs. The horizontal position (XY coordinates) of the hand 6 can be arbitrarily displaced by the rotational combination of the respective arms 511 to 513 .

Moreover, the 1st arm 511 is comprised so that lifting movement is possible with respect to the base 510 in the direction along the 1st joint 520 (Z direction). By raising and lowering the first arm 511, the second arm 512 and the third arm 513 also move up and down, so that the height of the hand 6 can be changed and the height of the substrate W can be changed (Z direction). Each joint of the robot arm 5 is provided with a motor and an encoder, respectively. The amount of movement of the hand 6 (movement amount of each arm) required can be calculated from the amount of rotation and height of each arm, or the three-dimensional coordinates obtained by converting these information.

The hand 6 includes a pair of spine rods 21 extending from the tip of the third arm 513 and a plurality of ribs extending outward from the side surfaces of the spine rods in a direction orthogonal to the spine rod 21, respectively. It has a rod (22). At the end of the rib rod 22, a pad 24 for supporting the lower surface of the substrate W is provided. The pad 24 is composed of an elastic member such as silicone rubber so as to support the surface of the substrate W without damaging it, and takes into consideration the sagging of the substrate W along the outer periphery of the substrate W in plurality. It is installed. On the other hand, a plurality of second rib rods 23 extending in parallel with the spine rod 21 are provided on the rib rod 22 disposed at both ends of the spine rod 21 in the extension direction, and their ends Edo pad 24 is provided.

The hand 6 is provided with a standard portion 7a and a standard portion 7b. The reference portion 7a and the reference portion 7b are engagement portions for determining the position of the jig T described later. In this embodiment, the reference part 7a and the reference part 7b are cylindrical holes.

The control device 1 controls the processing system 100 and also performs processing related to various settings. The control device 1 includes one or a plurality of processors, one or a plurality of storage devices, and an interface between an external device and the processor. The processor executes a program stored in the storage device, and controls the actual pressure of the film formation chamber 101, controls various actuators of the position adjustment mechanism 13, image processing of images captured by the detection unit 12, and alignment marks. Misalignment amount calculation, operation setting and control of the transfer robot 4, operation control of the evaporation device 8, and the like are performed. In addition, the operation setting of the transport robot 4 includes the setting of the movement path of the hand 6 . The storage device includes semiconductor memories such as RAM and ROM, and storage such as HDD.

The film formation process in the film formation chamber 101 will be described. The substrate W is carried into the film formation chamber 101 by the transfer robot 4, and the substrate W is transferred from the transfer robot 4 to the substrate holder 11. When the transfer robot 4 places the substrate W placed on the hand 6 on the substrate holder 11 in the film formation chamber 101, the alignment mark W1 of the substrate W moves in the horizontal direction. The hand 6 is moved to a position within the angle of view of the detection unit 12. The transfer robot 4 lowers the hand 6 to place the substrate on the substrate holder 11 .

Next, alignment of the relative positions of the substrate W and the mask M is performed by the alignment device 10 . After alignment, the substrate W and the mask M are overlapped. Thereafter, the deposition material is discharged from the deposition apparatus 8 onto the substrate W to form a film. When the film formation is completed, the transfer robot 4 receives the substrate W from the substrate holder 11 and carries it out of the film formation room 101 .

On the other hand, the configuration of the processing system 100 shown in Figs. 1 to 3 is an example only, and is not limited to such a configuration. For example, two or more film formation chambers 101 may be installed in one processing system 100 . In addition, a film formation room in which a sputtering device is installed may be provided. In addition, two or more substrate holders 11 may be installed in one film formation chamber 101 . A plurality of transport robots 4 may be installed in one processing system 100 .

<Movement setting of transfer robot>

The structure and procedure for setting the conveyance route (movement route of the hand 6) of the substrate W in the conveyance robot 4 will be described. The movement path of the hand 6 is set by holding the jig on the hand 6 instead of the substrate W to measure the film formation chamber 101 and based on the result of the measurement.

Fig. 5 (A) is a plan view of the jig T, and Fig. 5 (B) is a side view of the jig T. 6(A) is a plan view of the jig T in a state of being mounted on the hand 6, and FIG. 6(B) is a side view of the jig T in a state of being mounted in the hand 6. am.

The jig T is a plate-shaped member having a square shape. The jig T is provided with engagement portions 84a and 84b corresponding to the reference portions 7a and 7b of the hand 6 . In this embodiment, the engaging portions 84a and 84b are projections that fit into the reference portions 7a and 7b. The shapes of the reference portions 7a and 7b and the engaging portions 84a and 84b are not limited thereto. For example, positioning may be performed using separate members that engage the engagement part on the hand 6 side and the engagement part on the jig T side, respectively.

The jig T is provided with a reference mark T1. The reference mark T1 is provided at a position within the field of view and depth of field of the detection unit 12 when the hand 6 moves to the transfer position of the substrate W with respect to the substrate holder 11 . By photographing the fiducial mark T1 with the detection unit 12 and confirming the position of the fiducial mark T1 from the image, it is determined whether the hand 6 is moving to an appropriate position relative to the substrate holder 11. can judge

On the other hand, the reference mark T1 is designed in the horizontal direction with the alignment mark W1 of the substrate W when the hand 6 moves to the transfer position of the substrate W with respect to the substrate holder 11. It is preferable to install in the same position. In addition, the reference mark T1 is a cross-shaped mark in the present embodiment, but if it is a characteristic shape that can recognize the position with high accuracy by the operator or the image processing unit when imaged by the detection unit 12, the above Other shapes may be used.

It is preferable that the jig T has the same weight and the same central position as the substrate W. That is, it is preferable that the jig T be configured so that the same weight balance as when the substrate W is actually mounted on the hand 6 can be reproduced. On the other hand, as long as the weight balance can be reproduced, the shape of the jig T is not limited to a specific shape.

Measurement units 84X to 84Z are mounted on the jig T. In the case of this embodiment, all of the measurement units 84X to 84Z are laser displacement meters. However, the measurement units 84X to 84Z only need to be capable of measuring the distance to the object to be measured, and may be, for example, a camera. The measurement units 83X to 83X are connected to the control device 1 so as to be communicable, and the control device 1 can acquire measurement results of the measurement units 83X to 83Z.

The measurement unit 83X, the measurement unit 83Z, and the measurement unit 83Y each measure the distance to the measurement object existing in the X direction, Z direction, and Y direction with respect to the jig T. Fig. 7 shows examples of characteristics of measured values (measured values) output from the measurement units 83X to 83Z. Fig. 7 is a graph in which the gap (distance) between each measurement unit 83X to 83Z and the object to be measured is plotted on the horizontal axis, and the measured values are plotted on the vertical axis. The measurement units 83X to 83Z have a predetermined detection range, and a measured value is returned within the detection range, but a signal that cannot be detected is returned in the other range. The measured value is a characteristic linear to Gap.

When the hand 6 is moved, the position of the object to be measured relative to the hand 6 can be specified from the position of the hand 6 and the measurement results of the measurement units 83X to 83X. More specifically, for example, when the hand 6 is brought into the deposition chamber 101, the relative positional relationship between the hand 6 and the outer wall portion 101a of the deposition chamber 101 can be specified. In addition, the position of the hand 6 in the deposition chamber 101 can be specified from the detection result of the reference mark T1 of the jig T by the detection unit 12 . Using these measurement results and detection results, it is possible to set the operation of the transport robot 4 in relation to the movement path of the hand 6 .

<Example of moving path setting 1>

In order for the transfer robot 4 to transfer the substrate W to the substrate holder 11 in the film formation chamber 101, the substrate W or the transfer robot ( 4), it is necessary for the substrate W and the hand 6 to pass through the opening OP without interference. By using the jig T and the measurement units 83X to 83Z to measure the outer wall portion 101a around the opening OP in advance, the conveyance accuracy of the substrate W to the film formation chamber 101 is improved. can make it

Fig. 8 is a flowchart showing an example of processing executed by the processor of the control device 1, and in particular, a flowchart showing an example of processing for setting the operation of the transfer robot 4 at the time of transporting a substrate. The movement path of the hand 6 and the operation of the transport robot 4 realizing the movement path are first tentatively set based on design information of the processing system 100 and the like. Specifically, the movement path Zth1 of the hand 6 from the home position in the transfer chamber 102 to the substrate holder 11 in the film formation chamber 101 and the operation of the transfer robot 4 for this process are processed. It is tentatively set based on design information of the system 100 and the like. Then, the movement path Zth1 is corrected by the processing of FIG. 8 to set the final movement path and operation. Here, correction in the Z direction of the movement path is mainly explained.

In S1, the hand 6 holding the jig T is moved to a predetermined measurement position with respect to the film formation chamber 101. Fig. 9(A) shows an example thereof. 9(A) exemplifies a state in which the hand 6 is moved to a position (inside the transfer chamber 102) opposite to the outer wall portion 101a adjacent to the opening portion OP among the outer wall portions 101a. are doing The hand 6 is moved to a position where the surface of the outer wall portion 101a is included in the measurement range Ms of the measurement unit 83Y mounted on the jig T. On the other hand, the processing example of FIG. 8 assumes that the film formation chamber 101 and the transfer chamber 102 are performed under atmospheric pressure.

In S2 of Fig. 8, distance measurement is performed while continuously moving the hand 6 along the outer wall portion 101a. In the example of FIG. 9(A), the distance measurement is performed by the measurement unit 83Y while the hand 6 is moved (raised) in the Z direction. The distance in the Y direction from the hand 6 to the outer wall portion 101a (more precisely, the distance in the Y direction from the measurement unit 83Y to the outer wall portion 101a) is measured by the measurement unit 83Y.

In S3 of FIG. 8, the positions of the edges of the opening OP in the Z direction (upper edge OP-U and lower edge OP-D shown in FIG. 9A) are identified from the measurement result of S2. do. 9(B) shows an example of the measurement result of the measurement unit 83Y. When the measuring unit 83Y faces the opening OP, since the outer wall surface 101a does not exist in the measuring range Ms, the measuring unit 83Y returns a measurement impossible signal. Positions of the lower edge OP-D and the upper edge OP-U of the opening OP may be detected in the region where the measurable signal is present.

In S4 of FIG. 8 , the entry height of the hand 6 into the opening OP is set. Based on the relationship between the positions of the lower edge OP-D and the upper edge OP-U, the height passing through the opening OP is corrected with respect to the temporarily set movement path Zth1, and the movement path Zth2 is temporarily set. . Then, the hand 6 is moved to the height of the movement path Zth2.

In S5 of FIG. 8 , the hand 6 is moved to the next measurement position with respect to the deposition chamber 101 . In this embodiment, the next measurement position is inside the opening OP. The hand 6 is moved in the Y direction along the moving path Zth2, and the hand 6 and the jig T are entered into the opening OP as shown in FIG. 10(A). The hand 6 is moved to a position where the measurement unit 83Z opposes the ceiling surface of the opening OP. At this time, the ceiling surface of the opening OP is included in the measurement range Ms of the measurement unit 83Z.

In S6 of Fig. 8, a range measurement is performed by the measurement unit 83Z. The distance in the Z direction from the hand 6 to the ceiling surface of the opening OP (more precisely, the distance in the Z direction from the measurement unit 83Z to the ceiling surface) is measured by the measurement unit 83Z. In S7 of FIG. 8 , the temporarily set movement path Zth2 is corrected as necessary based on the ranging result of S6. The movement path after correction or uncorrected set in this step is referred to as the movement path Zth3.

In S8 of Fig. 8, the hand 6 is moved in the Y direction along the movement path Zth3. Here, as shown in FIG. 10(B), the hand 6 is moved to the transfer position of the substrate to the substrate holder 11 (a position within the detection range of the detection unit 12) as the next measurement position. And in S9, the reference mark T1 of the jig T is detected by the detection unit 12, and the position is confirmed. When the reference mark T1 is not detected, when it is detected but the position of the reference mark T1 is not appropriate, the movement path Zth3 is corrected.

11(A) shows an example of a captured image of the detection unit 12, and shows an example in which the reference mark T1 is displaced from the reference position C. In this case, the movement path Zth3 is corrected. Fig. 11(B) shows an example of a captured image of the detection unit 12, and shows an example in which the reference mark T1 is at the reference position C. In this case, it is not necessary to correct the movement path Zth3.

The above correction is performed as necessary, and the final movement path of the hand 6 and the operation of the transport robot 4 for this are determined in S10 of FIG. 8 .

By passing through the above procedure, the hand 6 can be conveyed automatically to the angle of view of the detection unit 12 with high accuracy. In particular, since the area of the opening OP of the deposition chamber 101 can be measured without the hand 6 entering the opening OP of the deposition chamber 101 at the first stage, the hand 6 and the deposition chamber 101 It is possible to suppress the risk of mutual damage or failure due to interference.

In addition, since the hand 6 and the jig T can be conveyed within the angle of view of the detection unit 12 with higher accuracy by further correcting the conveyance height even inside the opening OP, the reference mark T1 is detected. It becomes possible to carry at an optimum height on the depth of focus of the unit 12. Therefore, the measurement error of the reference mark T1 by the detection unit 12 becomes small. In addition, by automating a series of tasks, it leads to reduction of work time.

<Example of moving path setting 2>

In the above setting example 1, the hand 6 is moved in the Z direction when detecting the upper and lower edges of the opening OP, but it is also possible to move the hand 6 in the X direction to detect the opening OP and correct the movement trajectory. .

Fig. 12 is a flowchart showing an example of a process executed by the processor of the control device 1, and in particular, a flowchart showing an example of a process for setting the operation of the transfer robot 4 at the time of transporting a substrate. Here, the X direction of the movement path and the direction correction of the hand 6 will be mainly explained.

In S11, the hand 6 holding the jig T is moved to a predetermined measurement position with respect to the film formation chamber 101. Fig. 13(A) shows an example thereof. Fig. 13(A) exemplifies a state in which the hand 6 is moved to a position (within the transfer chamber 102) facing the outer wall portion 101a adjacent to the opening portion OP among the outer wall portions 101a. are doing The hand 6 is moved to a position where the surface of the outer wall portion 101a is included in the measurement range Ms of the measurement unit 83Y mounted on the jig T. On the other hand, the processing example of FIG. 12 assumes that the film formation chamber 101 and the transfer chamber 102 are performed under atmospheric pressure.

As illustrated in FIG. 13(A), in the stage of the temporarily set movement path Zth1, since it is a movement path based on design information, the X axis of the hand 6 and the outer wall surface 101a of the deposition chamber 101 ) is not necessarily parallel. Since some substrates W for film formation have a long side exceeding 2 m, even a small angular deviation in the θ direction can cause collision between the substrate W and the outer wall portion 101a of the film formation chamber 101. can In addition, since the opening OP is as small as possible, it is easier in terms of device design, so there is a margin in the gap between the hand 6 and the substrate W and the opening OP of the film formation chamber 101. does not exist.

In S12 of Fig. 12, distance measurement is performed while continuously moving the hand 6 along the outer wall portion 101a. In the example of FIG. 13(A), the distance measurement is performed by the measuring unit 83Y while moving the hand 6 in the X direction. The distance in the Y direction from the hand 6 to the outer wall portion 101a (more precisely, the distance in the Y direction from the measurement unit 83Y to the outer wall portion 101a) is measured by the measurement unit 83Y.

In S13 of FIG. 12, the positions of the edges of the opening OP in the X direction (the right edge OP-R and the left edge OP-L shown in FIG. 13(A)) are specified from the measurement result of S12. do. 13(B) shows an example of the measurement result of the measurement unit 83Y. When the measuring unit 83Y faces the opening OP, since the outer wall surface 101a does not exist in the measuring range Ms, the measuring unit 83Y returns a measurement impossible signal. The positions of the right edge OP-R and the left edge OP-L of the opening OP can be detected in the area where the measurement impossible signal exists. Furthermore, the inclination θ of the hand 6 with respect to the outer wall surface 101a can be calculated from the change in the distance of each ranging point.

In S14 of FIG. 12 , the entry position and direction of the hand 6 into the opening OP in the X and Y directions are set. As for the direction, the movement path Zth1 is corrected so that the inclination θ becomes zero. Then, the entry position is corrected so that the hand 6 can pass through the center of the opening OP in the X direction, and the corrected moving path Zth2 is tentatively set.

In S15 of FIG. 12 , the hand 6 is moved to the next measurement position with respect to the deposition chamber 101 . In this embodiment, the next measurement position is inside the opening OP. The hand 6 is moved in the Y direction along the moving path Zth2, and the hand 6 and the jig T are entered into the opening OP as shown in FIG. 14 . The hand 6 is moved to a position where the measurement unit 83X faces the side of the opening OP. At this time, the side surface of the opening OP is included in the measurement range Ms of the measurement unit 83X.

In S16 of Fig. 12, a distance measurement is performed by the measuring unit 83X. The distance in the X direction from the hand 6 to the side surface of the opening OP (more precisely, the distance in the X direction from the measurement unit 83X to the side surface) is measured by the measurement unit 83X. In S17 of FIG. 12, the tentatively set movement path Zth2 is corrected as necessary based on the ranging result in S16. The movement path after correction or uncorrected set in this step is referred to as the movement path Zth3.

In S18 of Fig. 12, the hand 6 is moved in the Y direction along the movement path Zth3. Here, as in the example shown in FIG. 10(B), the hand 6 is moved to the transfer position of the substrate to the substrate holder 11 (a position within the detection range of the detection unit 12). And the reference mark T1 of the jig T is detected by the detection unit 12 in S19, and the position is confirmed. If the reference mark T1 is not detected, but it is detected but the position of the reference mark T1 is not appropriate, the movement path Zth3 is corrected, and the final movement path and the transport robot 4 for this are corrected in S20. confirm the action of

By passing through the above procedure, the hand 6 can be automatically conveyed to the angle of view of the detection unit 12 with high accuracy, and the route information can be corrected and taught. In particular, error is small because it can be transported to the position of the detection unit 12 while correcting the path in the horizontal plane using the outer wall portion 101a of the film formation chamber 101 as a reference. In addition, by automating a series of tasks, it leads to reduction of work time.

<Second Embodiment>

After setting the movement path of the hand 6 and the operation of the transport robot 4 for this by mounting the jig T on the hand 6 by the processing of FIG. 8 or 12, further, the jig T Alternatively, the substrate W may be mounted on the hand 6 and the hand 6 may be moved along a set movement path. Then, when the hand 6 is moved to the transfer position of the substrate to the substrate holder 11 (a position within the detection range of the detection unit 12), the alignment mark W1 of the substrate W is moved by the detection unit 12 ) is detected. The detection result of the reference mark T1 of the jig T and the detection result of the alignment mark W1 may be compared to further correct the movement path of the hand 6 and the motion of the transport robot 4 for this purpose.

Since the jig T and the substrate W have different masses and the like, it is common that the conveying position of the hand 6 is also different. Therefore, apart from the measurement using the jig T, measurement by the detection unit 12 is performed using the substrate W, and the movement path of the hand 6 and the transport robot 4 for this are measured according to the difference. ) to further correct the operation of As a result, the conveyance accuracy of the substrate W can be further improved.

<Third Embodiment>

In the first and second embodiments, the measurement was performed in an atmospheric pressure environment to set the movement path of the hand 6, but after the measurement was performed in an atmospheric pressure environment, under a reduced pressure environment (under a vacuum environment) similar to that at the time of film formation. ), the movement path of the hand 6 may be set. 15 is a flowchart showing an example of processing executed by the processor of the control device 1. As shown in FIG.

In S21, measurement/movement paths under atmospheric pressure are set. This is the same as the processing in FIG. 8 or FIG. 12. In S22, preparations for measurement in a reduced pressure environment are made. Here, the film formation chamber 101 and the transfer chamber 102 are depressurized and vacuumed. On the other hand, the measurement units 83X to 83Z are separated from the jig T by the operator's work before that. Most commercially available measurement units use members that generate outgas in vacuum, such as resin parts and adhesives, or their operation in vacuum is not guaranteed in some cases. In this embodiment, it is assumed that the measurement units 83X to 83Z are separated from the jig T and not used for measurement.

In S23, the hand 6 is moved to the measuring position along the currently set movement path Zth3. In the case of this embodiment, the hand 6 is moved to the transfer position of the substrate to the substrate holder 11 (a position within the detection range of the detection unit 12) as the measurement position. In S24, the reference mark T is detected by the detection unit 12, and the change in position of the hand 6 is measured from the captured image. 16(A) shows an example of a captured image, and shows an example in which the reference mark T is displaced from the reference position C. This positional displacement becomes the positional displacement of the hand 6 under atmospheric pressure and under reduced pressure.

In addition to the position shift in the X and Y directions, the position shift in the Z direction can also be measured by the following method. This is done by comparing the captured images while changing the position of the detection unit 12 in the Z direction by the position adjusting unit 15 .

16(B) shows an example of a change in pixel luminance when shooting is performed while changing the position of the detection unit 12 in the Z direction on the line A-A' of FIG. 16(A). The illustrated example schematically describes a case where the distance between the detection unit 12 and the reference mark T1 is best focused (solid line) and defocused (broken line). If the position in the Z direction where the image of the reference mark T1 under reduced pressure looks like the image under atmospheric pressure is specified, the positional difference in the Z direction becomes the amount of change in height of the hand 6 under reduced pressure.

On the other hand, in order to measure the positional change of the hand 6 in the Z direction under such reduced pressure, a rangefinder such as a laser displacement meter may be used in addition to the detection unit 12. The range finder may be arranged outside the outer wall portion 101a like the detection unit 12 and measure the reference mark T1 or jig T through a window provided in the outer wall portion 101a. Correction in the X and Y directions may be performed using the captured image of the detection unit 12, and correction in the Z direction may be performed according to the measurement result of the range finder.

<Fourth Embodiment>

The movement path of the hand 6 and the operation of the transport robot 4 for this may be set by measuring the combination of the transfer speed of the jig, the substrate, and the substrate under atmospheric pressure and reduced pressure. 17 is a conceptual diagram thereof. In the measurement using the jig T, the measurement result in the air and the measurement result in the vacuum are compared and calculated to calculate the difference between the air and the vacuum.

In the measurement using the substrate W, the dependence of the measurement result in the air and the measurement result in the vacuum, and the transport speed at that time, the dependence on the difference between the atmosphere and the vacuum atmosphere in the substrate transport, and the dependence on the transport speed Phosphorus, air-vacuum-substrate transport speed dependence is calculated.

In particular, in conveying using the substrate W, the conveying speed of the hand 6, the type of pad 24 used, or the type of substrate used may cause a difference in the effect of friction, and the conveying position in the horizontal direction may vary. may be affected. And, from these, the movement path of the hand 6 and the operation of the transport robot 4 for this are set.

<Fifth Embodiment>

The measurement target of the measurement units 83X to 83X is not limited to the outer wall portion 101a, and a configuration disposed inside the film formation chamber 101 may be used as the measurement target. Fig. 18 is a schematic diagram showing an example thereof. In the illustrated example, the substrate holder 11 is used as a measurement target. The distance in the Z direction between the hand 6 and the substrate holder 11 is measured by the measurement unit 83Z. The distance in the Y direction between the hand 6 and the substrate holder 11 is measured by the measurement unit 83Y. A movement path of the hand 6 may be set based on the position of the substrate holder 11 .

<Sixth Embodiment>

Next, an example of a manufacturing method of an electronic device will be described. Hereinafter, the configuration and manufacturing method of an organic EL display device as an example of an electronic device will be illustrated. Here, a case where film formation is sequentially performed by a plurality of film formation chambers 101 is assumed.

First, an organic EL display device to be manufactured will be described. Fig. 19(A) is an overall view of the organic EL display device 50, and Fig. 19(B) is a diagram showing a cross-sectional structure of one pixel.

As shown in FIG. 19(A) , in the display area 51 of the organic EL display device 50, a plurality of pixels 52 having a plurality of light emitting elements are arranged in a matrix form. Although details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes.

On the other hand, the term "pixel" as used herein refers to a minimum unit capable of displaying a desired color in the display area 51 . In the case of a color organic EL display device, a pixel 52 is formed by a combination of a plurality of subpixels of the first light emitting element 52R, the second light emitting element 52G, and the third light emitting element 52B emitting different light. Consists of. The pixel 52 is often composed of a combination of three types of sub-pixels: a red (R) light emitting element, a green (G) light emitting element, and a blue (B) light emitting element, but is not limited thereto. The pixel 52 just needs to include at least one type of subpixel, preferably includes two or more types of subpixels, and more preferably includes three or more types of subpixels. As the sub-pixels constituting the pixel 52, for example, a combination of four types of sub-pixels: a red (R) light emitting element, a green (G) light emitting element, a blue (B) light emitting element, and a yellow (Y) light emitting element. may be continued

Fig. 19(B) is a partial cross-sectional schematic diagram taken along line A-B of Fig. 19(A). The pixel 52 includes, on the substrate 53, the first electrode (anode) 54, the hole transport layer 55, and any one of the red layer 56R, the green layer 56G, and the blue layer 56B. It has a plurality of sub-pixels composed of one organic EL element including an electron transport layer 57 and a second electrode (cathode) 58. Among these, the hole transport layer 55, the red layer 56R, the green layer 56G, the blue layer 56B, and the electron transport layer 57 correspond to organic layers. The red layer 56R, the green layer 56G, and the blue layer 56B are each formed in a pattern corresponding to a light emitting element emitting red, green, and blue (sometimes described as an organic EL element).

Also, the first electrode 54 is formed separately for each light emitting element. The hole transport layer 55, the electron transport layer 57, and the second electrode 58 may be formed commonly over a plurality of light emitting elements 52R, 52G, and 52B, or may be formed for each light emitting element. That is, as shown in FIG. 19(B), the red layer 56R, the green layer 56G, and the blue layer 56B are formed on the hole transport layer 55 as a common layer over a plurality of sub-pixel regions. It may be formed separately for each pixel region, and furthermore, the electron transport layer 57 and the second electrode 58 may be formed as a common layer over a plurality of sub-pixel regions.

On the other hand, in order to prevent a short circuit between adjacent first electrodes 54, an insulating layer 59 is provided between the first electrodes 54. Furthermore, since the organic EL layer is deteriorated by moisture or oxygen, a protective layer 60 is provided to protect the organic EL element from moisture or oxygen.

Although the hole transport layer 55 and the electron transport layer 57 are shown as one layer in FIG. 19(B), depending on the structure of the organic EL display element, it may be formed of a plurality of layers having a hole blocking layer or an electron blocking layer. do. In addition, a hole injection layer having an energy band structure between the first electrode 54 and the hole transport layer 55 allows holes to be smoothly injected from the first electrode 54 into the hole transport layer 55. may form Similarly, an electron injection layer may also be formed between the second electrode 58 and the electron transport layer 57 .

Each of the red layer 56R, the green layer 56G, and the blue layer 56B may be formed as a single light-emitting layer or may be formed by laminating a plurality of layers. For example, the red layer 56R may be composed of two layers, the upper layer being a red light emitting layer, and the lower layer being a hole transporting layer or an electron blocking layer. Alternatively, the lower layer may be formed of a red light emitting layer, and the upper layer may be formed of an electron transport layer or a hole blocking layer. In this way, by providing the layer below or above the light emitting layer, there is an effect of improving the color purity of the light emitting element by adjusting the light emitting position in the light emitting layer and adjusting the optical path length.

In addition, although the example of the red layer 56R was shown here, the same structure may be employed also in the green layer 56G or the blue layer 56B. In addition, the number of layers may be two or more. Furthermore, layers of different materials may be laminated, such as a light emitting layer and an electron blocking layer, or layers of the same material may be laminated, for example, two or more light emitting layers may be laminated.

Next, an example of a method for manufacturing an organic EL display device will be described in detail. Here, it is assumed that the red layer 56R is composed of two layers, a lower layer 56R1 and an upper layer 56R2, and the green layer 56G and the blue layer 56B are composed of a single light emitting layer.

First, a circuit (not shown) for driving an organic EL display device and a substrate 53 on which a first electrode 54 is formed are prepared. On the other hand, the material of the substrate 53 is not particularly limited, and may be made of glass, plastic, metal, or the like. In this embodiment, as the board|substrate 53, the board|substrate in which the film of polyimide was laminated|stacked on the glass substrate is used.

On the substrate 53 on which the first electrode 54 is formed, a resin layer such as acrylic or polyimide is coated by bar coating or spin coating, and the resin layer is applied to the portion where the first electrode 54 is formed by a lithography method. An insulating layer 59 is formed by patterning to form an opening. This opening corresponds to a light emitting region in which the light emitting element actually emits light.

The substrate 53 on which the insulating layer 59 is patterned is carried into the first film formation chamber 101, and the hole transport layer 55 is formed as a common layer on the first electrode 54 in the display area. The hole transport layer 55 is formed into a film using a mask in which openings are formed for each of the display regions 51 that will finally become a panel portion of each organic EL display device.

Next, the substrate 53 on which the hole transport layer 55 is formed is carried into the second film formation chamber 101 . The substrate 53 and the mask are aligned, the substrate is placed on the mask, and the portion of the substrate 53 on the hole transport layer 55 where a red-emitting element is disposed (region for forming red sub-pixels) Then, a red layer 56R is formed. Here, the mask used in the second film formation chamber 101 is a very detailed mask in which openings are formed only in a plurality of regions serving as red subpixels among a plurality of regions on the substrate 53 serving as subpixels of the organic EL display device. (fixed tax) It is a mask. As a result, the red layer 56R including the red light emitting layer is formed only in the region to be the red sub-pixel among the regions to be the plurality of sub-pixels on the substrate 53 . In other words, the red layer 56R is not formed in a region to be a blue sub-pixel or a region to be a green sub-pixel among the regions to be a plurality of sub-pixels on the substrate 53, but to be a region to be a red sub-pixel. is selectively formed on

Similar to the film formation of the red layer 56R, the green layer 56G is formed in the third film formation chamber 101, and the blue layer 56B is further formed in the fourth film formation chamber 101. After the film formation of the red layer 56R, the green layer 56G, and the blue layer 56B is completed, the electron transport layer 57 is formed over the entire display area 51 in the fifth film formation chamber 101 . The electron transport layer 57 is formed as a layer common to the three color layers 56R, 56G, and 56B.

The substrate on which up to the electron transport layer 57 is formed is moved to the sixth film formation chamber 101, and the second electrode 58 is formed. In this embodiment, in the first film formation chamber 101 to the sixth film formation chamber 101, film formation of each layer is performed by vacuum deposition. However, the present invention is not limited to this, and for example, the second electrode 58 in the sixth film formation chamber 101 may be formed by sputtering. Thereafter, the substrate on which up to the second electrode 58 is formed is moved to a sealing device, and the protective layer 60 is formed by plasma CVD (sealing step), and the organic EL display device 50 is completed. On the other hand, although it was assumed that the protective layer 60 is formed by the CVD method here, it is not limited to this, You may form by ALD method or an inkjet method.

Here, film formation in the first film formation chamber 101 to the sixth film formation chamber 101 is performed using a mask having openings corresponding to patterns of respective layers to be formed. In film formation, after relative position adjustment (alignment) of the substrate 53 and the mask is performed, the substrate 53 is placed on the mask to form the film.

<Other Embodiments>

In the present invention, a program for realizing one or more functions of the above-described embodiments is supplied to a system or device via a network or a storage medium, and one or more processors in a computer of the system or device reads and executes the program. processing is also feasible. Also, it can be realized by a circuit (for example, an ASIC) that realizes one or more functions.

The invention is not limited to the above embodiments, and various changes and modifications are possible without departing from the spirit and scope of the invention. Accordingly, the claims are appended to disclose the scope of the invention.

1: control unit
4: transport robot
6: hand
101: Tabernacle
T: jig
83X to 83Z: measurement unit

Claims (9)

An operation setting device for setting the operation of a robot carrying a substrate to a film formation chamber with a hand supporting a substrate, comprising:
a jig supported by the hand instead of the substrate and equipped with a measurement means;
control means for controlling the robot so that the hand supported by the jig moves to a measurement position with respect to the deposition chamber;
and setting means for obtaining a measurement result of the measuring means for the film formation chamber and setting an operation of the robot in relation to movement of the hand during transport of the substrate. According to claim 1,
a detecting means for detecting a position of the substrate is provided in the film forming chamber;
The control means controls the robot so that the jig is located in the detection range of the detection means,
The operation setting device according to claim 1, wherein the setting means acquires a detection result of the detection means relating to the jig, and sets an operation of the robot related to the movement of the hand based on the measurement result and the detection result. According to claim 2,
The measurement of the measuring means in the film formation chamber is performed under atmospheric pressure;
The operation setting device characterized in that the detection of the jig by the detection means is performed under the same reduced pressure as during film formation. According to claim 1,
The film formation chamber has an outer wall portion having an opening through which the hand can enter,
The operation setting device according to claim 1 , wherein the control means controls the robot so that the hand moves to a position where the outer wall portion can be measured by the measuring means, as the measurement position. According to claim 4,
The operation setting device according to claim 1 , wherein the control means controls the robot so that the hand continuously moves a position along the outer wall portion as the measurement position. According to claim 1,
The operation of the robot includes an operation related to the direction of the hand. According to claim 1,
wherein the control means controls the robot so that the hand moves to a position where the measuring means can measure a predetermined configuration disposed inside the deposition chamber as the measurement position. An operation setting method for setting the operation of a robot carrying a substrate to a film formation chamber with a hand supporting a substrate, the method comprising the steps of:
A step of supporting the jig on which the measuring means is mounted by the hand;
a control step of controlling the robot so that the hand supported by the jig moves to a measurement position with respect to the deposition chamber;
and a setting step of obtaining a measurement result of the measurement means in the film formation chamber and setting an operation of the robot in relation to movement of the hand during transport of the substrate. an operation setting step of setting an operation of a robot carrying a substrate to a film formation chamber with a hand supporting the substrate;
a step of conveying a substrate to the film formation chamber by controlling the robot based on the motion set in the motion setting step;
A method for manufacturing an electronic device comprising a step of forming a film on the substrate in the film formation chamber,
In the operation setting process,
A step of supporting the jig on which the measuring means is mounted on the hand;
a control step of controlling the robot so that the hand supported by the jig moves to a measurement position with respect to the deposition chamber;
and a setting step of obtaining a measurement result of the measuring means in the film formation chamber and setting an operation of the robot in relation to movement of the hand during transport of the substrate.

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