KR20230094089A - Semiconductor package inspection apparatus and semiconductor package inspection method - Google Patents

Abstract

The present invention relates to an apparatus for inspecting a semiconductor package and a method for inspecting a semiconductor package using the same, wherein a position of a reflective module that reflects an image of a semiconductor package to a camera module is configured to be changeable, thereby providing a working distance of a camera module accompanying a change in size of a semiconductor package. Disclose techniques that can accommodate change.

Description

Semiconductor package inspection device and semiconductor package inspection method

The present invention relates to a semiconductor package inspection apparatus and a semiconductor package inspection method.

In general, semiconductor devices may be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor devices formed as described above may be formed into a plurality of semiconductor devices through a dicing process, a die bonding process, and a molding process. It can be made of a semiconductor strip made of packages.

The semiconductor strip manufactured as described above may be individualized into a plurality of semiconductor packages through a sawing and sorting process, and classified according to whether a good product or a defective product is determined. For example, the semiconductor strip may be loaded onto a vacuum chuck and then singulated into a plurality of semiconductor packages using a cutting blade, and the singulated semiconductor packages may be inspected by a vision module after being cleaned and dried. . In addition, the product may be classified into a good product and a defective product according to the inspection result by the vision module.

The apparatus for performing the cutting and sorting process may include a strip picker for transporting the semiconductor strip and a package picker for transporting the individualized semiconductor packages. After being picked up by the package picker, the semiconductor packages may be cleaned by a cleaning module and then moved onto a transfer table. An air blower for drying the semiconductor packages may be disposed above the transfer table, and the semiconductor packages may be dried on the transfer table and then inspected by an inspection camera.

While the semiconductor packages are being moved in order to classify and accommodate the semiconductor packages, exterior inspection of the side surfaces of the semiconductor packages may be performed. In a conventional device capable of inspecting the side of a semiconductor package, a semiconductor package picked up by a picker is placed inside a prism unit in which four prisms are installed, and a camera is placed under the semiconductor package to obtain an image of the side of the semiconductor package. can be obtained An illumination unit for irradiating light to the prism unit is provided to surround the prism unit, and when light from the illumination unit illuminates the side surface of the semiconductor package through the prism, the side surface of the semiconductor package can be imaged by being reflected by the prism to the camera. there is.

Since such a conventional semiconductor package inspection apparatus is configured such that the prism unit and the lighting unit surround the picker, the side of the semiconductor package can be imaged only when the picker that picks up the semiconductor package enters the inside of the prism unit. That is, the picker entry/exit operation in which the picker departs from the existing transfer path and descends into the prism unit must be necessarily performed. Accordingly, since the time required for transferring and inspecting the semiconductor packages increases, there is a problem in that overall package processing speed (UPH: Unit Per Hour) is lowered.

In addition, since the conventional semiconductor package inspection apparatus has a fixed prism, it is difficult to respond to changes in the size of the semiconductor package, and it is difficult to solve the camera's out-of-focus (focus distance deviation) problem that may occur due to the change in size of the semiconductor package. there is

The present invention is to solve the problems of the prior art as described above, and to provide a semiconductor inspection device and a semiconductor inspection method capable of performing a side inspection of a semiconductor package on a horizontal movement path of a picker transporting semiconductor packages. .

In addition, the present invention is intended to provide a semiconductor inspection method and a semiconductor inspection apparatus capable of responding to changes in the size of a semiconductor package to be inspected.

The object of the present invention is not limited to the above, and other objects and advantages of the present invention not mentioned can be understood by the following description.

According to an embodiment of the present invention, a transfer unit including a picker for picking up semiconductor packages and moving them in a horizontal direction; a camera module disposed below the transfer path of the semiconductor package and acquiring side images of the semiconductor package; and a reflective module configured to reflect side images of the semiconductor package from an upper portion of the camera module to the camera module and to be movable in a forward and backward direction with respect to the semiconductor package.

In one embodiment, the reflective module may include a plurality of reflective members configured to reflect side images of the semiconductor package to the camera module; and a moving member for horizontally moving the reflective members.

In one embodiment, the reflective members may be provided to be movable in a first direction approaching the semiconductor package and in a second direction spaced apart from the semiconductor package by the moving member.

In one embodiment, the moving member may further include a position fixing member for fixing the position of each of the reflective members.

In one embodiment, by controlling the operation of the transfer unit and the camera module to acquire images of each side of the semiconductor package while moving the semiconductor package in a horizontal direction, and analyzing the acquired side images. A control unit inspecting the semiconductor package may be further included.

In one embodiment, the control unit may control horizontal positions of the reflective members according to the size of the semiconductor package by controlling the moving member.

In one embodiment, the camera module may include an imaging unit acquiring a side image of the semiconductor package from the reflective module; A lighting unit for radiating light to a side surface of the semiconductor package may be included.

In one embodiment, the camera module may further include an auxiliary reflective member for forming a path of light emitted from the lighting unit.

In an embodiment, the auxiliary reflective member may be provided on an upper surface of the imaging unit, and the lighting unit may be provided on one side of the auxiliary reflective member at the same height as the auxiliary reflective member.

In one embodiment, the auxiliary reflective member may reflect the light of the lighting unit toward the reflective module.

According to an embodiment of the present invention, a semiconductor package inspection apparatus including a camera module for obtaining a side image of a semiconductor package and a reflection module disposed on the camera module and reflecting the side image of the semiconductor package to the camera module. A semiconductor package inspection method using may be provided. The semiconductor package inspection method may include an inspection device adjusting step of adjusting a position of the reflective module; a transfer step of picking up the semiconductor package and moving it in a horizontal direction; an imaging step of acquiring a side image of the semiconductor package on the transfer path of the semiconductor package; A semiconductor package inspection method may include an inspection step of inspecting a side surface of the semiconductor package based on an image acquired in the imaging step.

In an example embodiment, the adjusting of the inspection device may include changing horizontal positions of reflective members included in the reflective module based on a size of the semiconductor package.

In an embodiment, the adjusting of the inspection device may include adjusting a horizontal distance between the semiconductor package and the reflective members based on a size of the semiconductor package.

In an embodiment, the adjusting of the inspection device may include adjusting the focal length of the camera module by changing horizontal positions of the reflective members.

In one embodiment, the imaging step may be included in the transferring step, and may be performed while a picker transferring the semiconductor package horizontally moves an upper portion of the camera module.

According to the present invention, the focus of the camera module can be adjusted in response to a change in the size of the semiconductor package to be inspected, so that even if the size of the semiconductor package is changed, the semiconductor package can be inspected without replacing the inspection device. It can save time and inspection cost.

In addition, since the semiconductor package can be inspected without vertical movement while the picker is horizontally transporting the semiconductor package, overall package processing speed per unit time (UPH) can be improved.

The effects of the present invention are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

1 and 2 show a schematic configuration diagram of a semiconductor package cutting and sorting facility to which the present invention can be applied.
3 shows an example of a semiconductor package inspection apparatus according to the present invention.
FIG. 4 shows a top view of the semiconductor package inspection apparatus of FIG. 3 .
5 and 6 show a flow chart of one embodiment of a semiconductor package inspection method according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or limited by the embodiments.

In order to explain the present invention and the operational advantages of the present invention and the objects achieved by the practice of the present invention, the following describes a preferred embodiment of the present invention and references it.

First, the terms used in this application are used only to describe specific embodiments, and are not intended to limit the present invention, and singular expressions may include plural expressions unless the context clearly dictates otherwise. In addition, in this application, terms such as "comprise" or "have" are intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other It should be understood that the presence or addition of features, numbers, steps, operations, components, parts, or combinations thereof is not precluded.

In describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description will be omitted.

1 and 2 show a schematic configuration diagram of a semiconductor package cutting and sorting facility to which the present invention can be applied.

The semiconductor package cutting and sorting facility 10 cuts a semiconductor strip 1 composed of a plurality of semiconductor packages 2 to individualize the semiconductor packages 2, inspects the individualized semiconductor packages 2, and then It can be used to classify according to the result.

The semiconductor package cutting and sorting facility 10 inspects the semiconductor packages 2 and the cutting module 20 for cutting semiconductor strips 1 into individual semiconductor packages 2, and semiconductor packages according to the inspection results. (2) may include a classification module 30 for classifying.

A magazine 15 in which a plurality of semiconductor strips are stored may be disposed on one side of the semiconductor package cutting and sorting facility 10 .

In addition, although not shown in detail, a gripper (not shown) for withdrawing the semiconductor strip 1 from the magazine 15 may be provided, and the semiconductor strip 1 drawn from the magazine 15 is moved by a guide rail. can be guided.

The semiconductor strip 1 may be picked up by the strip picker 25 and then transferred onto the vacuum chuck 40 . The strip picker 25 may be rotatably configured to adjust the disposition direction of the semiconductor strip 1 . For example, the strip picker 25 may rotate the semiconductor strip 1 after picking up the semiconductor strip 1 drawn from the magazine 15, and then place the rotated semiconductor strip 1 in the vacuum chuck 40. ) can be transferred to

The vacuum chuck 40 may be supported by the chuck table 41 , and the chuck table 41 may move the semiconductor strip 1 to the cutting module 20 . The cutting module 20 may include a cutting spindle 22 for cutting the semiconductor strip 1, and the chuck table 41 cuts the semiconductor strip 1 by a separate driving unit (not shown). 22) can be moved down.

The semiconductor packages 2 individualized by the cutting module 20 may be picked up and transported by the package picker 55 . The semiconductor package cutting and sorting facility 10 may include a package transfer unit 50 for moving the package picker 55, and the package transfer unit 50 may include a package picker holder for holding the package picker 55. (52) may be included. For example, the package transfer unit 50 may include a Cartesian coordinate robot for moving the package picker holder 52 horizontally and vertically.

The semiconductor package cutting and sorting facility 10 may include a cleaning unit 60 for cleaning the individualized semiconductor packages 2 . The package transfer unit 50 may move the package picker 55 to the top of the cleaning unit 60 after the semiconductor packages 2 are picked up by the package picker 55, and the cleaning unit 60 may brush Foreign substances may be removed from the semiconductor packages 2 using the cleaning solution and the cleaning solution. Also, the cleaning unit 60 may dry the semiconductor packages 2 by spraying air to the semiconductor packages 2 .

After cleaning and drying the semiconductor packages 2 are completed, the package transfer unit 50 may transfer the semiconductor packages 2 to the classification module 30 . For example, the sorting module 30 may include a pallet table 31 for supporting the semiconductor packages 2, and the package transfer unit 50 transfers the semiconductor packages 2 to the pallet table 31. can be transported to the top.

The sorting module 30 is disposed above the transport path of the table transfer unit 32 and the pallet table 31 for moving the pallet table 31 in the horizontal direction and moves the semiconductor packages 2 on the pallet table 31. It may include a vision unit 35 for inspection.

The classification module 30 includes a tray 71 for accommodating the semiconductor packages 2 determined to be good products by the vision unit 35 and a container 75 for accommodating the semiconductor packages 2 determined to be defective products. can include Also, the sorting module 30 may include a tray transfer unit 72 for moving the tray 71 .

The table transfer unit 32 and the tray transfer unit 72 may move the pallet table 31 and the tray 71 to a sorting area, and the sorting module 30 may move the semiconductor packages 2 to the tray 71. and a chip picker 85 for accommodating in the container 75 and a chip picker transfer unit 80 for moving the chip picker 85 . Additionally, the sorting module 30 may include a tray supply unit 70 for supplying trays 71 .

The semiconductor package inspection apparatus and the semiconductor package inspection method using the same proposed in the present invention can be applied to the semiconductor package cutting and sorting equipment as described above.

As an example, as shown in FIG. 1 , semiconductor packages whose quality is determined by applying the present invention in the process of transferring semiconductor packages 2 determined to be good or defective through the inspection of the vision unit 35 ( 2) can be used for side inspection. Alternatively, as shown in FIG. 2 , the vision unit 35 for determining good products and defective products through vision inspection of the semiconductor packages 2 on the pallet table 31 on the classification module 30 described above is used. The present invention can be applied to replace.

Hereinafter, the present invention will be reviewed with reference to embodiments according to the present invention.

3 and 4 show an embodiment of a semiconductor package inspection apparatus according to the present invention. 3 schematically illustrates a side view of a semiconductor package inspection apparatus according to the present invention, and FIG. 4 schematically illustrates a top view of FIG. 3 .

A semiconductor package inspection apparatus 100 according to an embodiment of the present invention includes a transfer unit 110 for picking up a semiconductor package 2 and moving it in a horizontal direction, and a semiconductor package 2 moved by the transfer unit 110. It may include a camera module 120 for obtaining a side image of the camera module 120 and a reflection module 130 provided on the top of the camera module 120 and reflecting the side image of the semiconductor package 2 to the camera module 120. .

The transfer unit 110 may include a picker 112 for picking up the semiconductor package 2 and moving it in a horizontal direction, and the picker 112 may be configured to rotate the picked-up semiconductor package 2. there is. As shown in FIG. 4 , the transfer unit 110 may move the picker 112 forward or backward with respect to the transfer direction of the semiconductor package 2 .

The camera module 120 may be disposed below the movement path of the picker 112 . That is, the camera module 120 may be disposed below the transfer path of the semiconductor package 2 . The camera module 120 may obtain side images of the semiconductor packages 2 while the semiconductor packages 2 are horizontally moved by the transfer unit 110 .

The camera module 120 may include an imaging unit 122 and a lighting unit 124 . The imaging unit 122 may face the lower surface of the semiconductor package 2 and acquire a side image of the semiconductor package 2 reflected by the reflection module 130 .

The position of the imaging unit 122 may be adjusted and arranged so that a photographed image or video can be obtained by photographing the semiconductor package 2 being transported by the picker 112 within a field of vision (FOV). . Various cameras such as a general camera or an infrared camera may be applied to the imaging unit 122 according to circumstances.

The lighting unit 124 may emit light toward the reflection module 130 provided above the camera module 120 . Light emitted to the reflection module 130 may be reflected by the reflection module 130 and irradiated to the side of the semiconductor package 2 . The lighting unit 124 may be disposed on one side of the upper portion of the imaging unit 122 and may emit light toward the reflective members 132 of the reflective module 130 . The lighting unit 124 may emit various lights such as monochromatic light such as laser light, tricolor light such as RGB, and white light according to the type of vision inspection, and various light sources such as LED devices may be used. However, when the lighting unit 124 is provided with monochromatic light, a lens for dispersing light may be provided between the lighting unit 124 and the reflective module 130 . The position of the lighting unit 124 is not limited to one upper side of the imaging unit 122 and various arrangements may be possible depending on the configuration of the reflection module 130 .

The imaging unit 122 and the lighting unit 124 may be separately configured or configured as one integral unit. For example, as shown in FIG. 3 , the lighting unit 124 may be provided above the imaging unit 122 and configured to inject light into the reflection module 130 . The camera module 120 may further include an auxiliary reflective member 126 for forming a path of light emitted from the lighting unit 124 . For example, the auxiliary reflective member 126 may be provided on an upper surface of the imaging unit 122 . The lighting unit 124 may be disposed on one side of the auxiliary reflective member 126 at the same height as the auxiliary reflective member 126 to emit light toward the auxiliary reflective member 126 . For example, the auxiliary reflective member 126 may vertically reflect light emitted from the lighting unit 124 toward the reflective module 130 . For example, a half mirror may be used as the auxiliary reflection member 126 . The light of the lighting unit 124 reflected by the auxiliary reflective member 126 to the reflective module 130 is reflected once more by the reflective member 132 of the reflective module 130 and provided to each side of the semiconductor package 2. It can be.

The reflection module 130 may be configured to adjust the focal length of the camera module 120 . The reflective module 130 may include a plurality of reflective members 132 and a movable member 134 for horizontally moving the reflective members 132 in the forward and backward directions. The reflection module 130 may be disposed at a location that does not interfere with the movement path of the picker 112 .

A plurality of reflective members 132 may be provided to simultaneously reflect multiple side images of the semiconductor package 2 to the camera module 120 . For example, the reflective member 132 may be provided to correspond to each of the four sides of the semiconductor package 2 , and accordingly, the four sides of the semiconductor package 2 may be created as one image. Each of the reflective members 132 may be disposed to reflect images of each side of the semiconductor package 2 to the camera module 120 . While the picker 112 that picks up the semiconductor package 2 horizontally moves the top of the camera module 120, the semiconductor package 2 is moved by the plurality of reflective members 132 provided on the top of the camera module 120. Side images of the semiconductor package 2 may be obtained by reflecting images of the four sides of the camera module 120 . For example, a half mirror may be used as the reflective member 132 . Although not shown in detail, the plurality of reflective members 132 may be provided in a form supported by a frame.

The moving member 134 can change the position (disposition) of the reflecting member 132 by moving the reflecting member 132 in a horizontal direction. It is connected to each of the plurality of reflective members 132 and can simultaneously move the plurality of reflective members 132 . The moving member 134 may move the reflective members 132 in a first direction to approach (advance) toward the semiconductor package 2 and in a second direction to be separated from (backward) from the semiconductor package 2 . When the reflective members 132 are moved in the first direction by the moving member 134 , a horizontal gap between each of the reflective members 132 and a corresponding side surface of the semiconductor package 2 may be narrowed. When the reflective members 132 are moved in the second direction by the moving member 134 , a horizontal gap between each of the reflective members 132 and the corresponding side surface of the semiconductor package 2 may be widened. For example, the moving member 134 may be provided in the form of a screw or the like.

Meanwhile, the moving member 134 may further include a plurality of fixing members (not shown) for fixing the position of the reflective member 132 . For example, the fixing member (not shown) may be a nut for fixing the moving member 134 in the form of a screw. The reflective member 132 moved by the moving member 134 may be fixed in position by a fixing member (not shown).

It may be appropriately selected according to the size of the semiconductor package 2 . In other words, the interval between the two reflective members 132 having an opposing relationship in the reflective module 130 may be appropriately selected according to the size of the semiconductor package 2 .

Specifically, the horizontal spacing between each side of the semiconductor package 2 and each reflective member 132 corresponding to each side of the semiconductor package 2 may be changed according to the size of the semiconductor package 2 . The horizontal distance between the semiconductor package 2 and the reflective module 130 can be changed by changing the horizontal position of the reflective member 132 and the focal length of the camera module 120 can be adjusted accordingly. Accordingly, an out-of-focus phenomenon of the imaging unit 122 occurring as the size of the semiconductor package is changed may be prevented.

A position of the reflective member 132 may be changed by the moving member 134 . The moving member 134 may change the horizontal position of the reflective member 132 . The horizontal position of the reflective member 132 according to the size of the semiconductor package 2 is the position where the side image of the semiconductor package 2 reflected by the reflective member 132 is most accurately captured by the imaging unit 122, and experimentally can be determined by The positions of the reflective members 132 whose horizontal positions are adjusted according to the size of the semiconductor package 2 may be fixed by the fixing member 136 . In this case, an angle of the reflective surface of the auxiliary reflective member 126 may be adjusted based on the changed position of the reflective member 132 . For example, the angle of the reflective surface of the auxiliary reflective member 126 that reflects light from the lighting unit 124 to the reflective member 132 reflects the light from the lighting unit 124 to the reflective member 132 whose position is changed to reflect the semiconductor semiconductor. It can be adjusted to an angle that can be incident on the side of the package (2).

Operations of the transport unit 110 and the camera module 120 may be controlled by the controller 140 . The control unit 140 may control the operation of the camera module 120 to acquire a side image of the semiconductor package 2 while the semiconductor package 2 is horizontally moved by the transfer unit 110, and the obtained The side image may be transmitted to the controller 140 . The controller 140 may analyze the received side images to inspect the state of the side of the semiconductor package 2 .

Also, the controller 140 may control the reflection module 130 . In detail, the controller 140 may control the horizontal position of the reflective member 132 that reflects the side image of the semiconductor package 2 to the camera module 120 according to the size of the semiconductor package 2 . A distance (interval) between the semiconductor package 2 and the reflective member 132 according to the size of the semiconductor package 2 may be controlled by controlling the horizontal position of the reflective member 132 . The horizontal position of the reflective member 132 corresponding to the size of each semiconductor package 2 may be previously stored in the controller 140 . For example, the controller 140 determines the size of the semiconductor package 2 based on the image of the lower surface of the semiconductor package 2 acquired by the vision unit 210, and the size of the reflective member 132 corresponding thereto. The moving member 134 may be controlled to move the reflective member 132 to a horizontal position. Alternatively, the size of the semiconductor package 2 may be input by an operator, and the controller 140 may control the moving member 134 based on the input value. As the horizontal position of the reflective member 132 is changed by the moving member 134 , a distance between the semiconductor package 2 and the reflective module 130 may be changed. Accordingly, since the focal length of the imaging unit 122 is adjusted, the imaging unit 122 may be accurately focused on the semiconductor package 2 whose size is changed. That is, it is possible to prevent an out-of-focus (focus distance departure) problem of the imaging unit 122 due to a change in the size of the semiconductor package 2 .

Meanwhile, in the present embodiment, one picker 112 is shown as acquiring a side image of the semiconductor package 2 in the process of transferring the semiconductor package 2, but the transfer unit 110 is a plurality of semiconductor packages ( 2) may include a plurality of pickers 112 for each pick-up, and each picker 112 may be arranged in a line along the moving path of the semiconductor package 2 .

In addition, in the present invention, a method of inspecting a semiconductor package through the semiconductor package inspection apparatus according to the present invention described above is presented. Hereinafter, the semiconductor package inspection method according to the present invention will be described through examples.

Since the semiconductor package inspection method according to the present invention is implemented through the semiconductor package inspection apparatus according to the present invention described above, hereinafter, the embodiment of the semiconductor package inspection apparatus according to the present invention will be referred to together.

5 and 6 are flowcharts illustrating a method of inspecting a semiconductor package according to an exemplary embodiment of the present invention.

A semiconductor package inspection method according to an embodiment of the present invention includes a transfer step (S100) of picking up the semiconductor package 2 and moving it in a horizontal direction, and a side image of the semiconductor package 2 on the transfer path of the semiconductor package 2. It may include an imaging step (S200) of acquiring , and an inspection step (S300) of inspecting the side surface of the semiconductor package 2 based on the side image obtained by the first imaging step (S200).

The transfer step ( S100 ) is a step in which the picker 112 that picks up the semiconductor package 2 transfers the semiconductor package 2 , and may include entering an inspection area. The inspection area is not separately provided and may be included in the transfer area of the semiconductor package 2 . The picker 112 may pass the top of the camera module 120 installed in the inspection area.

The imaging step (S200) may be included in the transfer step (S100). In the imaging step (S200), an image of the side of the semiconductor package 2 is obtained by the camera module 120 disposed below the movement path of the picker 112, and the camera module in the process of performing the transfer step (S100) It can be performed while horizontally moving the top of 120. In the imaging step (S200), the reflection module 130, which is provided on the upper part of the camera module 120 and reflects images of each side of the semiconductor package 2 to the camera module 120, is connected to the moving path of the picker 112. It can be performed without vertical movement of the picker 112 by being installed in a position where there is no interference. That is, a process of vertically moving the picker 112 into the imaging area to inspect the side of the semiconductor package 2 may be omitted.

The inspection step ( S300 ) may be performed by the control unit 140 . The side images of the semiconductor package 2 acquired in the imaging step ( S200 ) may be transmitted to the controller 140 and then analyzed by the controller 140 . In the inspection step ( S300 ), the control unit 140 may analyze four side images of the semiconductor package 2 to determine whether or not the semiconductor package 2 is defective.

The method for inspecting a semiconductor package according to an embodiment of the present invention may further include an inspection apparatus adjusting step ( S50 ) that may correspond to a change in size of a semiconductor package to be inspected.

The inspection device adjustment step ( S50 ) may be performed prior to the transfer step ( S100 ). The inspection device adjustment step ( S50 ) is a step of controlling the reflection module 130 based on the size of the semiconductor package 2 . The semiconductor package 2 and the reflective module 130 are arranged at regular intervals so that the imaging unit 122 that acquires a side image of the semiconductor package 2 reflected by the reflective module 130 can acquire an accurate image. do.

The inspection device adjusting step ( S50 ) is a step of adjusting the distance between the semiconductor package 2 and the reflective module 130 by adjusting the location of the reflective module 130 based on the size of the semiconductor package 2 . Adjusting the inspection device ( S50 ) may include changing horizontal positions of the reflective members 132 included in the reflective module 130 . Adjusting the inspection device ( S50 ) adjusts the horizontal distance (interval) between the semiconductor package 2 and the reflective module 130 by changing the horizontal positions of the reflective members 132 based on the size of the semiconductor package 2 . can That is, the horizontal position of the reflective member 132 may be adjusted based on the size of the semiconductor package 2 in the step of adjusting the inspection device ( S50 ). For example, the horizontal position of the reflective member 132 may be adjusted to a height at which the imaging unit 122 can most accurately capture a side image of the semiconductor package 2 . The horizontal position of the reflective member 132 may be changed by the movable member 134 , and the operation of the movable member 134 may be controlled by the controller 140 . For example, the horizontal position of the reflective member 132 corresponding to the size of the semiconductor package 2 may be previously input to the controller 140 .

The focal length of the camera module 120 with respect to the semiconductor package 2 whose size has been changed may be adjusted in the inspection device adjustment step ( S50 ). Accordingly, an out-focusing (focus distance departure) phenomenon due to a change in size of the semiconductor package 2 to be inspected may be prevented. The adjusting of the inspection device ( S50 ) may further include adjusting an angle of the reflective surface of the auxiliary reflective member 126 based on the horizontal position of the reflective member 132 .

As described above, the present invention configures the reflective members 132 of the reflective module 130 that reflect the side image of the semiconductor package 2 to the camera module 120 to be movable in the horizontal direction, thereby enabling semiconductor packages of various sizes ( 2) can be tested. Specifically, the horizontal distance between the semiconductor package 2 and the reflective member 132 can be adjusted by changing the horizontal position of the reflective members 132 according to the size of the semiconductor package 2 to be inspected. Accordingly, the focal length of the imaging unit 122 can be adjusted in response to a change in the size of the semiconductor package 2 . Accordingly, since a process of replacing an inspection device due to a size change of the semiconductor package 2 is omitted, time and cost can be saved.

In addition, by disposing the reflection module 130 at a position that does not interfere with the movement path of the picker 112 transporting the semiconductor package 2, the picker 112 for side inspection of the semiconductor package 2 moves vertically (up and down). movement) may be omitted. Therefore, since the inspection time for the semiconductor package 2 can be shortened, the overall package processing speed per unit time (UPH) can be improved.

The above description is merely an example of the technical idea of the present invention, and various modifications and variations can be made to those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments described in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the technical spirit of the present invention is not limited by these embodiments. The protection scope of the present invention should be construed by the following claims, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

100: semiconductor package inspection device
110: transfer unit
112 Picker
120: camera module
122: imaging unit
124: lighting unit
126: auxiliary reflective member
130: reflection module
132: reflective member
134: moving member
140: control unit

Claims (15)

a transfer unit including a picker for picking up semiconductor packages and moving them in a horizontal direction;
a camera module disposed below the transfer path of the semiconductor package and acquiring side images of the semiconductor package; and
A semiconductor package inspection apparatus comprising a reflection module configured to reflect side images of the semiconductor package from an upper portion of the camera module to the camera module and to be movable in a forward and backward direction with respect to the semiconductor package.
According to claim 1,
The reflective module,
a plurality of reflection members for reflecting side images of the semiconductor package to the camera module; and
A semiconductor package inspection apparatus comprising a moving member for horizontally moving the reflective members.
According to claim 2,
The reflective members are
The semiconductor package inspection apparatus according to claim 1 , wherein the movable member is movable in a first direction approaching the semiconductor package and in a second direction spaced apart from the semiconductor package.
According to claim 3,
The moving member,
The semiconductor package inspection apparatus further comprises a position fixing member for fixing a position of each of the reflective members.
According to claim 4,
Inspecting the semiconductor package by controlling operations of the transport unit and the camera module to obtain images of each side of the semiconductor package while moving the semiconductor package in a horizontal direction, and analyzing the acquired side images. A semiconductor package inspection apparatus further comprising a control unit.
According to claim 5,
The control unit
A semiconductor package inspection apparatus according to claim 1 , wherein horizontal positions of the reflective members according to the size of the semiconductor package are controlled by controlling the moving member.
According to claim 1,
The camera module,
an imaging unit acquiring a side image of the semiconductor package from the reflective module;
A semiconductor package inspection apparatus including a lighting unit for radiating light to a side surface of the semiconductor package.
According to claim 7,
The camera module further includes an auxiliary reflective member for forming a path of light emitted from the lighting unit.
According to claim 8,
The auxiliary reflective member is provided on an upper surface of the imaging unit
The illumination unit is provided on one side of the auxiliary reflective member at the same height as the auxiliary reflective member.
According to claim 9,
The auxiliary reflective member
A semiconductor package inspection device for reflecting light from the lighting unit toward the reflective module.
A semiconductor package inspection method using a semiconductor package inspection apparatus including a camera module for obtaining a side image of a semiconductor package and a reflection module disposed on the camera module and reflecting the side image of the semiconductor package to the camera module,
an inspection device adjustment step of adjusting a position of the reflection module;
a transfer step of picking up the semiconductor package and moving it in a horizontal direction;
an imaging step of acquiring a side image of the semiconductor package on the transfer path of the semiconductor package;
and an inspection step of inspecting a side surface of the semiconductor package based on an image obtained in the imaging step.
According to claim 11,
The step of adjusting the inspection device is
and changing horizontal positions of reflective members included in the reflective module based on the size of the semiconductor package.
According to claim 12,
In the step of adjusting the inspection device,
A semiconductor package inspection method comprising adjusting a horizontal distance between the semiconductor package and the reflective members.
According to claim 13,
By the inspection device adjustment step,
A semiconductor package inspection method, characterized in that the focal length of the camera module is adjusted.
According to claim 11,
The imaging step is included in the transfer step,
The semiconductor package inspection method, characterized in that performed while the picker for transferring the semiconductor package horizontally moves the top of the camera module.

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